JP6381340B2 - Heat dissipation structure and electronic device equipped with the same - Google Patents

Description

  The present invention relates to a heat-dissipating structure for a heat-generating element using a heat-dissipating sheet member (hereinafter referred to as a heat-dissipating sheet) made of a material having good heat conduction, and an electronic device including the heat-dissipating structure.

2. Description of the Related Art Conventionally, a heat dissipation structure is known in which a heat dissipation sheet is disposed between a highly heat generating electronic component and a heat dissipation member to dissipate heat from the electronic component to the heat dissipation member.
For example, in the heat dissipation structure of an electronic device described in Patent Document 1, a high heat generation electronic component is brought into contact with one of the upper and lower sheet surfaces of the heat dissipation sheet, and a metal base substrate (heat dissipation member) is brought into contact with the other. Yes. Thereby, the heat from the electronic component is transferred to the heat radiating member through the path in the thickness direction of the heat radiating sheet.

JP 2006-135202 A

  In recent years, electronic components such as integrated circuit (IC) chips whose degree of integration has been improved due to higher functionality of electronic devices have been used, and the electronic components have become denser in a small space within the device as electronic devices have become smaller. Has been placed. In this case, each electronic component generates high heat and is easily affected by heat between the electronic components, and further improvement in heat dissipation efficiency is required even in a heat dissipation structure using a heat dissipation sheet.

  The present invention has been made to solve the above-described problems, and an object thereof is to obtain a heat dissipation structure capable of improving the heat dissipation efficiency and an electronic apparatus including the heat dissipation structure.

In the heat dissipation structure according to the present invention, one sheet surface of the heat dissipating sheet member is brought into contact with the electronic component, and the other sheet surface is brought into contact with the heat dissipating member so that the heat dissipating sheet is interposed between the electronic component and the heat dissipating member. In the heat dissipation structure that disposes the heat from the electronic component to the heat dissipation member through the heat dissipation sheet member, the side surface of the heat dissipation sheet member provided between the electronic component and the heat dissipation member is provided in the heat dissipation member. Provided with a heat radiation assisting part that contacts the entire circumference or part thereof , the heat radiation assisting part is a rib protruding from the surface on which the heat radiation sheet member of the heat radiation member is disposed, and the rib is an outer surface that does not contact the heat radiation sheet member An uneven portion is formed on the surface .

  According to the present invention, there is an effect that heat dissipation efficiency can be improved.

It is a perspective view which shows the electronic device provided with the thermal radiation structure which concerns on Embodiment 1 of this invention. It is a disassembled perspective view of the electronic device of FIG. FIG. 2 is a cross-sectional arrow view taken along line AA in FIG. 1. It is an enlarged view of the part B of FIG. It is a figure which shows the outline | summary of arrangement | positioning of the thermal radiation sheet in the thermal radiation structure which concerns on Embodiment 1. FIG. It is a figure which shows the dimension of the height direction of each structure in the thermal radiation structure which concerns on Embodiment 1. FIG. It is a figure which shows the dimension (area) of the surface where each structure in the thermal radiation structure which concerns on Embodiment 1 opposes. FIG. 8 is a diagram showing a modification of the rib in the first embodiment. FIG. 3 is a diagram showing a recess in the first embodiment.

Embodiment 1 FIG.
1 is a perspective view showing an electronic apparatus provided with a heat dissipation structure according to Embodiment 1 of the present invention. FIG. 2 is an exploded perspective view of the electronic device of FIG. FIG. 3 is a cross-sectional arrow view taken along line AA in FIG. FIG. 4 is an enlarged view of a portion B in FIG.
In FIG. 1, an electronic device 1 is an electronic device such as an in-vehicle navigation device. In FIG. 1, an electronic device 1 configured by combining a top cover 3 and a bottom cover 4 above and below the center frame 2 is illustrated. Further, as shown in FIG. 2, a substrate 5 on which various electronic components are mounted is accommodated in the electronic device 1.

As shown in FIGS. 2 and 3, the center frame 2 is formed with a raised portion 8 raised from one surface, and the heat radiating sheet 7 is disposed on the end surface 8 a of the raised portion 8.
The substrate 5 is a substrate on which various components such as the electronic component 6 are mounted, and is supported by being fixed to the support portion 2 a provided in the center frame 2 by screwing or the like. When the substrate 5 is supported by the center frame 2, the electronic component 6 mounted on the substrate 5 comes into contact with the heat dissipation sheet 7 on the end surface 8 a of the raised portion 8. The electronic component 6 is a highly heat generating electronic component such as an IC chip.

  The center frame 2 supports the substrate 5 as described above, and also has a role as a heat radiating member that radiates heat conducted from the heat radiating sheet 7. For example, it is made of a metal material (magnesium alloy, aluminum alloy, etc.) that achieves rigidity as a frame member and has high thermal conductivity.

The heat dissipating sheet 7 is a heat dissipating sheet member disposed between the electronic component 6 and the raised portion 8 with the electronic component 6 in contact with one facing sheet surface and the raised portion 8 in contact with the other sheet surface. is there.
The heat radiating sheet 7 is made of a material having high thermal conductivity and elasticity. For example, silicon rubber may be used.
Further, in the present invention, heat conduction is performed through the side surface of the heat radiating sheet 7 as will be described later with reference to FIG. 4. Therefore, the heat radiating sheet 7 has a thickness (for example, about 3 mm) that can be expected to radiate heat from the side surface. It is more effective to have it.

As shown in FIG. 4, the rib 9 is formed integrally with the raised portion 8 so as to protrude from the end surface 8 a of the raised portion 8, and is formed on the side surface of the heat radiation sheet 7 disposed between the electronic component 6 and the raised portion 8. In contact. For example, it is formed by die casting or cutting.
In the heat dissipation structure according to the present invention, the heat generated in the electronic component 6 is conducted to the raised portion 8 through the opposing sheet surface of the heat dissipation sheet 7 and further conducted from the side surface of the sheet surface of the heat dissipation sheet 7 to the rib 9. . The rib 9 conducts heat from the side surface of the heat radiating sheet 7 and radiates heat from the outer surface not in contact with the heat radiating sheet 7, and further conducts heat to the raised portion 8 to radiate heat from the center frame 2. That is, the rib 9 functions as a heat radiation auxiliary part that newly forms a heat conduction path via the side surface of the heat radiation sheet 7 and assists heat radiation.
Thus, since a new heat conduction path is added by the rib 9, the heat dissipation efficiency of the heat dissipation structure using the heat dissipation sheet 7 can be improved.

Further, the rib 9 may be used for positioning the heat dissipation sheet 7.
FIG. 5 is a diagram showing an outline of the disposition of the heat dissipating sheet in the heat dissipating structure according to the first embodiment, and shows a case where a rectangular heat dissipating sheet 7 is disposed. The arrangement part of the heat radiation sheet 7 on the end surface 8a of the raised portion 8 is determined in advance so that the electronic component 6 comes into precise contact with the sheet surface of the heat radiation sheet 7 when the substrate 5 is fixed to the center frame 2. .

  Conventionally, a solid line or a groove line along the outer shape of the heat radiation sheet 7 at the arrangement site is applied to the end face 8a as a marker indicating the arrangement site, and the heat radiation sheet 7 is arranged according to the marker. In the case of this configuration, since the heat radiating sheet 7 can move over the marker, there is a problem that the heat radiating sheet 7 is likely to be displaced.

  Therefore, in the present invention, for example, as shown in FIG. 5A, ribs 9 are provided along two adjacent sides of the heat radiation sheet 7 in the above-described arrangement site. The heat radiating sheet 7 is arranged on the end face 8a so that the corners of the heat radiating sheet 7 are aligned with the corners of the rib 9 and the heat radiating sheet 7 is pressed against the rib 9 in the direction of the arrow in FIG. Thereby, the heat-radiation sheet 7 can be easily arrange | positioned in the predetermined arrangement | positioning site | part on the end surface 8a of the protruding part 8. FIG. At this time, as shown in FIG. 5B, the ribs 9 are in contact with the side surfaces of the two adjacent sides of the heat dissipation sheet 7, and the movement of the heat dissipation sheet 7 on the end surface 8a is restricted. Therefore, it is possible to reduce the occurrence of displacement of the heat dissipation sheet 7.

  In addition, although the case where the external shape of the heat-radiation sheet 7 was a square was shown in FIG. 5, it is not limited to this. For example, even if the outer shape of the heat radiating sheet 7 is a triangle other than a quadrangle or a polygon that is a pentagon or more, a rib is provided along two adjacent sides of the outer shape of the heat radiating sheet 7 on the end surface 8a. Such positioning can be performed.

Next, the relationship among the dimensions of the electronic component 6, the heat dissipation sheet 7, and the rib 9 will be described.
FIG. 6 is a diagram showing dimensions in the height direction of each component in the heat dissipation structure according to the first embodiment. In FIG. 6, the height HA of the electronic component 6 and the thickness HB of the heat dissipation sheet 7 are values determined in advance according to product standards and cannot be changed, but the height HC of the rib 9 serving as a heat dissipation auxiliary portion can be changed. is there.

  FIG. 7 is a diagram showing dimensions (areas) of opposing surfaces of each component in the heat dissipation structure according to the first embodiment. In FIG. 7, the outer area SA of the electronic component 6 facing the heat radiating sheet 7 (the area of the electronic component 6 in contact with the heat radiating sheet 7) and the area SB of the sheet surface of the heat radiating sheet 7 are determined in advance according to product specifications. Value and cannot be changed. On the other hand, the area SC of the part (arrangement part mentioned above) which arrange | positions the thermal radiation sheet 7 in the end surface 8a of the protruding part 8 is changeable.

In the heat dissipation structure according to the present invention, the electronic component 6 mounted on the substrate 5 and the raised portion 8 of the center frame 2 face each other with the heat dissipation sheet 7 interposed therebetween. For this reason, depending on the height HC of the rib 9, there is a possibility that the contact between the heat radiation sheet 7, the electronic component 6, and the end face 8a of the raised portion 8 is insufficient.
Therefore, in the present invention, the electronic component 6, the heat dissipation sheet 7, and the rib 9 are, for example, set to the following dimensional relationship a or dimensional relationship b. Thereby, the thermal radiation sheet 7, the electronic component 6, and the end surface 8a of the raised part 8 can be made to contact reliably.

  First, as the dimensional relationship a, the height HC of the rib 9 is formed lower than the thickness HB of the heat dissipation sheet 7. By doing in this way, when the heat radiating sheet 7 is arrange | positioned in the arrangement | positioning site | part of the end surface 8a, it will be in the state which the heat radiating sheet 7 protruded rather than the rib 9 to the electronic component 6 side. Therefore, the rib 9 does not hit the substrate 5 until the electronic component 6 comes into contact with the sheet surface of the heat radiating sheet 7, so that the heat radiating sheet 7 and the electronic component 6 and the end surface 8 a of the raised portion 8 are in reliable contact.

In the dimension relationship b, the height HC of the rib 9 is higher than the thickness HB of the heat dissipation sheet 7 and is equal to or less than the value obtained by adding the height of the heat dissipation sheet 7 to the height HA of the electronic component 6 (HC ≦ HA + HB). To. At this time, the area SC of the portion where the heat dissipation sheet 7 is arranged is formed wider than the outer area SA of the electronic component 6 so that the rib 9 does not contact the substrate 5 or the electronic component 6.
With this configuration, the height HA of the electronic component 6 is equal to or greater than the difference between the height HC of the rib 9 and the thickness HB of the heat dissipation sheet 7 (HA ≧ HC−HB). For this reason, when the board | substrate 5 is fixed to the center frame 2, it will be in the state which the electronic component 6 contacted the heat radiating sheet 7, or the state which pressed the heat radiating sheet 7. FIG.

In the case where the heat radiating sheet 7 has elasticity, when the electronic component 6 presses the heat radiating sheet 7 as described above, the heat radiating sheet 7 is elastically expanded and is in close contact with the rib 9. Thereby, the heat dissipation efficiency of the heat conduction path through the side surface of the heat dissipation sheet 7 and the rib 9 can be improved.
Moreover, if comprised as mentioned above, even if the position shift | offset | difference which leaves | separates from the rib 9 a little generate | occur | produces, when the thermal radiation sheet 7 is arrange | positioned, the elastically expanded thermal radiation sheet 7 will contact the rib 9. FIG.

Next, a modified example of the heat radiation assisting part in the present invention will be described.
FIG. 8 is a diagram showing a modification of the rib in the first embodiment, and shows a case where the heat radiation assisting portion is a rib. Moreover, FIG. 9 is a figure which shows the recessed part in Embodiment 1, Comprising: The case where a heat dissipation auxiliary | assistance part is an inner wall of a recessed part is shown.

The rib 9A shown in FIG. 8A is formed along one side of the outer shape of the heat-dissipating sheet 7 at the arrangement site of the end face 8a. The heat radiation sheet 7 is disposed on the end surface 8a so as to be pressed against the rib 9A. Even if comprised in this way, the thermal radiation sheet 7 can be easily arrange | positioned in the predetermined arrangement | positioning site | part on the end surface 8a of the protruding part 8. FIG.
Further, the heat generated in the electronic component 6 is conducted to the raised portion 8 through the opposing sheet surface of the heat radiating sheet 7 and further conducted from the side surface of the one side of the heat radiating sheet 7 to the rib 9A. Thereby, the thermal radiation efficiency of the thermal radiation structure using the thermal radiation sheet 7 can be improved rather than the structure without the rib 9A.

The ribs 9B shown in FIG. 8B are formed along two opposing sides of the outer shape of the heat radiation sheet 7 at the arrangement site of the end face 8a. The heat dissipation sheet 7 is disposed between the opposing ribs 9B. Even if comprised in this way, the thermal radiation sheet 7 can be easily arrange | positioned in the predetermined arrangement | positioning site | part on the end surface 8a of the protruding part 8. FIG.
Further, the heat generated in the electronic component 6 is conducted to the raised portion 8 through the facing sheet surface of the heat radiating sheet 7, and further conducted from each of the two sides of the heat radiating sheet 7 to the rib 9 </ b> B.
Thereby, since the heat conduction path is increased as compared with the structure of FIG. 8A, the heat radiation efficiency can be further improved.

The rib 9C shown in FIG. 8C is formed along three sides (three consecutive sides) excluding one side of the outer shape of the heat dissipation sheet 7 in the arrangement portion of the end face 8a.
The heat radiating sheet 7 is disposed by being inserted from an open portion without the rib 9C into a portion surrounded by the rib 9C. Even if comprised in this way, the thermal radiation sheet 7 can be easily arrange | positioned in the predetermined arrangement | positioning site | part on the end surface 8a of the protruding part 8. FIG.
Further, the heat generated in the electronic component 6 is conducted to the raised portion 8 through the facing sheet surface of the heat radiating sheet 7, and further conducted from each of the three sides of the heat radiating sheet 7 to the rib 9 </ b> C.
Thereby, since the heat conduction path is increased as compared with the structure of FIG. 8B, the heat radiation efficiency can be further improved.

The rib 9D shown in FIG. 8D is formed along all sides of the outer shape of the heat dissipation sheet 7 in the arrangement portion of the end face 8a. The heat radiating sheet 7 is disposed on the end surface 8a by fitting into a portion surrounded by the rib 9D. Even if comprised in this way, the thermal radiation sheet 7 can be easily arrange | positioned in the predetermined arrangement | positioning site | part on the end surface 8a of the protruding part 8. FIG.
Further, the heat generated in the electronic component 6 is conducted to the raised portion 8 through the facing sheet surface of the heat radiating sheet 7, and further conducted from each of the four sides of the heat radiating sheet 7 to the rib 9 </ b> C. This increases the heat conduction path as compared with the structure of FIG. 8C, so that the heat dissipation efficiency can be further improved.
Note that, as described above, when the heat dissipation sheet 7 is elastically expanded, the heat dissipation sheet 7 may be disposed in the rib 9D with a gap. That is, when the heat dissipation sheet 7 has elasticity and the heat dissipation sheet 7 is pressed from the electronic component 6 when the substrate 5 is fixed to the center frame 2, the heat dissipation sheet 7 is elastically expanded to contact the rib 9D. .

The rib 9E shown in FIG. 8 (e) is formed along two adjacent sides of the outer shape of the heat dissipation sheet 7 in the arrangement portion of the end surface 8a, and further has an uneven portion 9E-1 on the outer surface that does not come into contact with the heat dissipation sheet 7. Is formed.
The heat radiating sheet 7 is disposed on the end surface 8a so that the corner of the heat radiating sheet 7 is aligned with the corner of the rib 9E and pressed against the rib 9E as in FIG.
Further, the heat generated in the electronic component 6 is conducted to the raised portion 8 through the opposing sheet surface of the heat radiating sheet 7 and further conducted to the rib 9E from each of the two side surfaces of the heat radiating sheet 7.
The outer surface of the rib 9E has an increased surface area due to the uneven portion 9E-1, and can dissipate heat more efficiently than the configuration of FIG.
In addition, the uneven | corrugated | grooved part mentioned above is on the outer surface which does not contact the heat dissipation sheet 7 of rib 9A-9D shown to FIG.8 (a) from FIG.8 (d), or rib 9F shown in FIG.8 (f) mentioned later. Even if formed, the same effect can be obtained.

The rib 9F shown in FIG. 8 (f) is formed along the outer shape of a circular heat radiating sheet 7A (shown by a broken line in the figure) at the arrangement site of the end face 8a. The heat radiating sheet 7A is disposed on the end face 8a so as to be pressed against the rib 9F. Even if comprised in this way, the thermal radiation sheet | seat 7A can be easily arrange | positioned in the predetermined arrangement | positioning site | part on the end surface 8a of the protruding part 8. FIG.
Further, the heat generated in the electronic component 6 is conducted to the raised portion 8 through the facing sheet surface of the heat radiating sheet 7A, and is further conducted from the side surface of the heat radiating sheet 7A to the rib 9F. Thereby, the thermal radiation efficiency of the thermal radiation structure using the thermal radiation sheet 7 can be improved rather than the structure without the rib 9F.
In addition, although illustration was abbreviate | omitted, you may form the rib 9F along the perimeter of the external shape of the thermal radiation sheet | seat 7A. In this case, since the heat conduction path is increased as compared with the structure of FIG. 8F, the heat radiation efficiency can be further improved.

In the above description, the case where the heat radiation assisting portion is a rib is shown, but the heat radiation assisting portion of the present invention may be an inner wall 10a of the recess 10 as shown in FIG.
The heat dissipating sheet 7 is fitted in the recess 10 and disposed on the bottom surface 10 b of the recess 10.
Further, the heat generated in the electronic component 6 is conducted to the bottom surface 10b of the recess 10 through the opposing sheet surface of the heat radiation sheet 7, and further conducted from the side surface of the heat radiation sheet 7 to the inner wall 10a.
Heat is conducted from the side surface of the heat dissipation sheet 7 to the raised portion 8 through the inner wall 10 a of the recess 10, and is radiated from the center frame 2. Thus, the entire side surface of the heat dissipation sheet 7 is added as a heat conduction path through the inner wall 10a, and the heat dissipation efficiency of the heat dissipation structure using the heat dissipation sheet 7 can be improved.

Even when the heat radiation assisting portion is the inner wall 10a of the recess 10, the dimensional relationship a or the dimensional relationship b shown in FIGS. 6 and 7 can be used.
That is, the height of the inner wall 10a is HC, and the height HC is formed lower than the thickness HB of the heat dissipation sheet 7 (dimensional relationship a).
By doing in this way, when the thermal radiation sheet 7 is arrange | positioned in the recessed part 10, the thermal radiation sheet 7 will be in the state protruded to the electronic component 6 side. Therefore, the end surface 8a does not hit the substrate 5 until the electronic component 6 comes into contact with the sheet surface of the heat radiating sheet 7, and the heat radiating sheet 7, the electronic component 6 and the bottom surface 10b of the recess 10 are surely in contact.

  In the dimension relationship b, the height HC of the inner wall 10a is set to be higher than the thickness HB of the heat radiating sheet 7, and not more than the value obtained by adding the thickness HB of the heat radiating sheet 7 to the height HA of the electronic component 6, and the area of the bottom surface 10b. The SC is formed wider than the outer area SA of the electronic component 6. Thereby, when the board | substrate 5 is fixed to the center frame 2, the electronic component 6 will be in the state which contacted the heat dissipation sheet 7, or pressed the heat dissipation sheet 7, and the bottom face 10b of the heat dissipation sheet 7, the electronic component 6, and the recessed part 10 will become. Contact securely.

  When the heat radiating sheet 7 has elasticity, the heat radiating sheet 7 is elastically expanded by the pressing of the electronic component 6 and is in close contact with the inner wall 10a. Thereby, the thermal radiation efficiency of the heat conduction path | route via the side surface and the inner wall 10a of the thermal radiation sheet 7 can be improved. Further, even when a position shift slightly away from the inner wall 10a occurs when the heat radiating sheet 7 is disposed, the heat radiating sheet 7 can be brought into contact with the inner wall 10a by elastic expansion.

As described above, according to the first embodiment, it is provided on the end surface 8a of the raised portion 8 of the center frame 2, and between the electronic component 6 and the end surface 8a of the raised portion 8 (or the bottom surface 10b of the recess 10). A heat radiation auxiliary part (rib 9, 9A to 9F or inner wall 10a of the concave part 10) that contacts the entire circumference or a part of the side surface of the arranged heat radiation sheet 7 is provided.
With this configuration, heat generated in the electronic component 6 is conducted to the raised portion 8 through the facing sheet surface of the heat radiating sheet 7 and further conducted from the side surface of the heat radiating sheet 7 to the heat radiating auxiliary portion. Thereby, the thermal radiation efficiency of the thermal radiation structure using the thermal radiation sheet 7 can be improved.

  Moreover, according to this Embodiment 1, the rib 9 contacts each side surface of two adjacent sides of the polygonal heat radiation sheet 7. With this configuration, heat generated in the electronic component 6 is conducted to the raised portion 8 through the opposing sheet surface of the heat radiating sheet 7, and further conducted to the rib 9 from the side surfaces of the two sides of the heat radiating sheet 7. To do. Thereby, the thermal radiation efficiency of the thermal radiation structure using the thermal radiation sheet 7 can be improved. Moreover, the heat radiating sheet 7 can be easily disposed at an appropriate position of the raised portion 8 by simply matching the corner of the heat radiating sheet 7 with the corner of the rib 9. Furthermore, since the movement of the heat radiating sheet 7 on the end surface 8a is regulated by the rib 9, the occurrence of the positional deviation of the heat radiating sheet 7 can be reduced.

  Furthermore, according to this Embodiment 1, the rib 9E formed the uneven | corrugated | grooved part 9E-1 in the outer surface which does not contact the heat radiating sheet 7. FIG. By comprising in this way, the surface area of the outer surface which does not contact the heat radiating sheet 7 of the rib 9E increases, and it can thermally radiate efficiently.

  Furthermore, according to the first embodiment, the height HC of the heat radiation assisting portion (the inner wall of the rib or the recess) is lower than the thickness HB of the heat radiation sheet 7. By comprising in this way, when the thermal radiation sheet 7 is arrange | positioned, the thermal radiation sheet 7 will be in the state protruded to the electronic component 6 side. Therefore, the movement of the substrate 5 is not restricted until the electronic component 6 comes into contact with the sheet surface of the heat radiating sheet 7, and the heat radiating sheet 7, the electronic component 6, and the raised portion 8 can be reliably brought into contact with each other.

Furthermore, according to the first embodiment, the height HC of the heat radiation assisting portion (the inner wall of the rib or the recess) is equal to or greater than the thickness HB of the heat radiation sheet 7 and the height HA of the electronic component 6 is the thickness of the heat radiation sheet 7. The height SC is equal to or less than the value obtained by adding HB, and the area SC of the portion where the radiating sheet 7 is arranged in the raised portion 8 is larger than the outer area SA of the electronic component 6 facing the radiating sheet 7.
With this configuration, when the substrate 5 is fixed to the center frame 2, the electronic component 6 comes into contact with the heat radiating sheet 7 or presses the heat radiating sheet 7. The part 8 can be reliably brought into contact.

  Furthermore, according to this Embodiment 1, the heat radiating sheet 7 has elasticity, and the heat radiating auxiliary portion is in contact with the side surface of the heat radiating sheet 7 which is pressed from the electronic component 6 and elastically expanded. By comprising in this way, the thermal radiation sheet 7 elastically expands by the press of the electronic component 6, and it adheres to a thermal radiation auxiliary | assistant part. Thereby, the thermal radiation efficiency of the heat conduction path | route via the side surface of the thermal radiation sheet 7 and the thermal radiation auxiliary | assistant part can be improved. Moreover, even if the position shift | offset | difference which leaves | separates a little from the heat dissipation auxiliary | assistance part generate | occur | produces when the heat radiating sheet 7 is arrange | positioned, it can be made to contact a heat radiating auxiliary | assistance part by elastically expanding the heat radiating sheet 7. FIG.

Furthermore, according to this Embodiment 1, since the electronic device 1 is provided with the heat dissipation structure mentioned above, the heat which generate | occur | produced in the internal electronic component 6 can be thermally radiated efficiently.
Thereby, since the malfunction resulting from the heat | fever from the electronic component 6 reduces, the reliability of the electronic device 1 can be improved.

  In the present invention, any component of the embodiment can be modified or any component of the embodiment can be omitted within the scope of the invention.

  DESCRIPTION OF SYMBOLS 1 Electronic device, 2 Center frame, 3 Top cover, 4 Bottom cover, 5 Substrate, 6 Electronic component, 7, 7A Heat radiation sheet, 8 Raised part, 8a End surface, 9, 9A-9F Rib, 9E-1 Uneven part, 10 Recess, 10a inner wall, 10b bottom surface.

Claims (10)

One sheet surface of the heat radiating sheet member is in contact with the electronic component, the other sheet surface is in contact with the heat radiating member, and the heat radiating sheet member is disposed between the electronic component and the heat radiating member, In a heat dissipation structure that dissipates heat from the electronic component to the heat dissipation member through the heat dissipation sheet member,
Provided in the heat radiating member, and provided with a heat radiating auxiliary portion that contacts the entire circumference or a part of the side surface of the heat radiating sheet member disposed between the electronic component and the heat radiating member , A heat radiating structure, wherein the heat radiating member is a rib protruding from a surface on which the heat radiating sheet member is disposed, and the rib has an uneven portion formed on an outer surface that does not contact the heat radiating sheet member . The ribs, heat dissipation structure of claim 1, wherein the contact on each side of two sides adjacent polygons of the heat dissipation sheet member. The heat radiating auxiliary unit, the heat radiation structure according to claim 1 or claim 2, wherein said is lower than the thickness height of the heat dissipation sheet member. One sheet surface of the heat radiating sheet member is in contact with the electronic component, the other sheet surface is in contact with the heat radiating member, and the heat radiating sheet member is disposed between the electronic component and the heat radiating member, In a heat dissipation structure that dissipates heat from the electronic component to the heat dissipation member through the heat dissipation sheet member,
Provided in the heat radiating member, and provided with a heat radiating auxiliary portion that contacts the entire circumference or a part of the side surface of the heat radiating sheet member disposed between the electronic component and the heat radiating member ,
The heat radiation assisting portion has a height equal to or higher than the thickness of the heat radiating sheet member and equal to or lower than the value obtained by adding the thickness of the heat radiating sheet member to the height of the electronic component.
The area of the portion for disposing the heat radiating sheet member with the heat radiating member, the electronic component thermostructural release you wherein a wider than the outer area of which facing the heat radiation sheet member. The heat dissipation structure according to claim 4 , wherein the heat dissipation auxiliary portion is a rib protruding from a surface of the heat dissipation member on which the heat dissipation sheet member is disposed. The heat dissipation structure according to claim 4 , wherein the heat dissipation auxiliary portion is an inner wall of a recess in which the heat dissipation sheet member is disposed. The heat dissipation structure according to claim 5 , wherein the rib contacts each side surface of two adjacent sides of the polygonal heat dissipation sheet member. The ribs, radiating structure according to claim 5 or claim 7, wherein the forming the concavo-convex portion on an outer surface that is not in contact with the heat radiating sheet member. The heat dissipation sheet member has elasticity,
The heat dissipation structure according to any one of claims 4 to 8, wherein the heat dissipation auxiliary portion is in contact with the side surface of the heat dissipation sheet member that is elastically expanded by being pressed from the electronic component. . An electronic device comprising the heat dissipation structure according to any one of claims 1 to 9 .

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