TW201416837A - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
TW201416837A
TW201416837A TW101139792A TW101139792A TW201416837A TW 201416837 A TW201416837 A TW 201416837A TW 101139792 A TW101139792 A TW 101139792A TW 101139792 A TW101139792 A TW 101139792A TW 201416837 A TW201416837 A TW 201416837A
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TW
Taiwan
Prior art keywords
heat sink
base
bracket
circuit board
sink assembly
Prior art date
Application number
TW101139792A
Other languages
Chinese (zh)
Inventor
chun-sheng Yu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW101139792A priority Critical patent/TW201416837A/en
Priority to US13/928,355 priority patent/US20140116671A1/en
Publication of TW201416837A publication Critical patent/TW201416837A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/22—Fastening; Joining by using magnetic effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)

Abstract

A heat sink assembly includes a heat sink. The heat sink includes a base. The base defines a sealed space. The base includes panel body for contacting a heat generating element and a plurality of magnetic posts extending from the panel body. The magnetic posts are located in the sealed space. The base is absorbed to a metal object via the magnetic posts.

Description

散熱器組合Radiator combination

本發明涉及一種散熱器組合，尤指一種具有均熱底座的散熱器組合。The present invention relates to a heat sink assembly, and more particularly to a heat sink assembly having a soaking base.

隨著電腦技術的不斷發展，電腦功能越來越多，相應地電腦元件也越來越多，為了提高電腦工作的穩定性，電腦內部使用了許多散熱裝置，當前電腦內使用的散熱器主要用於晶片的散熱，如何將散熱器固定在電路板上，則顯得非常重要。業界也推出將散熱器直接藉由螺絲鎖固在發熱元件上，這樣裝配散熱器比較費時。With the continuous development of computer technology, more and more computer functions, and more and more computer components, in order to improve the stability of computer work, the computer uses a lot of heat sinks, the current use of radiators in computers mainly used For heat dissipation from the wafer, it is important to fix the heat sink on the board. The industry has also introduced that the heat sink is directly locked to the heating element by screws, so that it is time consuming to assemble the heat sink.

鑒於以上內容，有必要提供一種安裝方便的散熱器組合。In view of the above, it is necessary to provide a heat sink assembly that is easy to install.

一種散熱器組合，包括一散熱器，所述散熱器包括一底座，所述底座設有一密閉空間，所述底座包括一用於接觸一發熱元件的板體及多個自所述板體延伸形成的磁力柱，所述磁力柱位於所述密閉空間中，所述底座藉由所述磁力柱能吸附在一金屬材質的物體上。A heat sink assembly includes a heat sink, the heat sink includes a base, the base is provided with a sealed space, the base includes a plate body for contacting a heat generating component, and a plurality of extending from the plate body The magnetic column is located in the sealed space, and the base can be adsorbed on a metal object by the magnetic column.

與習知技術相比，在上述散熱器組合中，所述散熱器的底座包括多個磁力柱，所述磁力柱可以吸附在金屬材質上，這樣在組裝散熱器時簡單方便。Compared with the prior art, in the above heat sink assembly, the base of the heat sink includes a plurality of magnetic columns, and the magnetic columns can be adsorbed on the metal material, which is simple and convenient when assembling the heat sink.

請參閱圖1和圖2，一散熱器組合包括一電路板10、一支架30及一散熱器50。Referring to FIGS. 1 and 2 , a heat sink assembly includes a circuit board 10 , a bracket 30 , and a heat sink 50 .

所述電路板10包括一電路板本體11及一裝設在所述電路板本體11上的發熱元件13。所述電路板本體11設有多個固定孔15。The circuit board 10 includes a circuit board body 11 and a heat generating component 13 mounted on the circuit board body 11. The circuit board body 11 is provided with a plurality of fixing holes 15 .

所述支架30為金屬材質，所述支架包括一支架本體31及多個自所述支架本體31延伸形成的固定部33。所述支架本體31設有一開口310。所述支架本體31包括一支撐部311及一自所述支撐部311垂直延伸形成的凸緣313。所述支撐部311呈方形。所述支撐部311平行所述電路板本體11。所述支撐部311及所述凸緣313環繞所述開口310。所述支架本體31的支撐部311及凸緣313在垂直所述電路板本體11的方向上的橫截面呈L形。The bracket 30 is made of a metal material, and the bracket includes a bracket body 31 and a plurality of fixing portions 33 extending from the bracket body 31. The bracket body 31 is provided with an opening 310. The bracket body 31 includes a support portion 311 and a flange 313 extending perpendicularly from the support portion 311. The support portion 311 has a square shape. The support portion 311 is parallel to the circuit board body 11 . The support portion 311 and the flange 313 surround the opening 310. The support portion 311 and the flange 313 of the bracket body 31 have an L-shaped cross section in a direction perpendicular to the circuit board body 11.

所述散熱器50包括一底座51及多個自所述底座延伸形成的散熱鰭片53。所述散熱鰭片53相互平行。所述底座51包括一均熱板511，所述底座51設有一密閉空間513。所述均熱板511位於所述密閉空間513中。所述均熱板511包括一板體5111、多個自所述板體5111延伸形成的磁力柱5113及多個自所述板體5111延伸形成的凸柱5115，所述磁力柱5113分佈在所述凸柱5115的周圍。The heat sink 50 includes a base 51 and a plurality of heat dissipation fins 53 extending from the base. The heat dissipation fins 53 are parallel to each other. The base 51 includes a heat equalizing plate 511, and the base 51 is provided with a sealed space 513. The heat equalizing plate 511 is located in the sealed space 513. The heat-receiving plate 511 includes a plate 5111, a plurality of magnetic columns 5113 extending from the plate 5111, and a plurality of protrusions 5115 extending from the plate 5111. The magnetic columns 5113 are distributed in the The periphery of the stud 5115 is described.

請參閱圖3及圖4，組裝時，先將所述支架30的固定部33與所述電路板10的固定孔15對應，將所述固定部33穿過所述固定孔15從而將所述支架30安裝在所述電路板10上。此時，所述發熱元件13位於所述支架30的開口310中。再將所述散熱器50的底座51放置在所述支架30的支撐部311上。由於所述底座51的磁力柱5113的磁力吸附作用，所述底座51與所述支架30的支撐部311吸附在一起。此時，所述底座51的板體5111接觸所述發熱元件13，用於傳導所述發熱元件13的熱量至所述散熱器50的散熱鰭片53。所述底座51的所述凸緣313用於限制所述散熱器50沿一平行所述電路板本體11上的方向上移動。Referring to FIG. 3 and FIG. 4 , in the assembly, the fixing portion 33 of the bracket 30 is corresponding to the fixing hole 15 of the circuit board 10 , and the fixing portion 33 is passed through the fixing hole 15 to A bracket 30 is mounted on the circuit board 10. At this time, the heat generating component 13 is located in the opening 310 of the bracket 30. The base 51 of the heat sink 50 is placed on the support portion 311 of the bracket 30. The base 51 is attracted to the support portion 311 of the bracket 30 due to the magnetic attraction of the magnetic column 5113 of the base 51. At this time, the plate body 5111 of the base 51 contacts the heat generating component 13 for conducting heat of the heat generating component 13 to the heat radiating fins 53 of the heat sink 50. The flange 313 of the base 51 is for restricting movement of the heat sink 50 in a direction parallel to the circuit board body 11.

所述散熱器50磁力吸附作用而固定在所述支架30上，從而可以不使用固定裝置即可固定，簡單方便。在拆卸時，用力分開所述散熱器50及所述支架30即可將所述散熱器50從所述支架30上拆卸下來。The heat sink 50 is magnetically adsorbed and fixed on the bracket 30, so that it can be fixed without using a fixing device, which is simple and convenient. When disassembling, the heat sink 50 and the bracket 30 are separated by force to detach the heat sink 50 from the bracket 30.

綜上所述，本發明確已符合發明專利要求，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，舉凡熟悉本發明技藝之人士，爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above-mentioned preferred embodiments of the present invention are intended to be within the scope of the following claims.

10．．．電路板10. . . Circuit board

11．．．電路板本體11. . . Board body

13．．．發熱元件13. . . Heating element

15．．．固定孔15. . . Fixed hole

30．．．支架30. . . support

31．．．支架本體31. . . Bracket body

310．．．開口310. . . Opening

311．．．支撐部311. . . Support

313．．．凸緣313. . . Flange

50．．．散熱器50. . . heat sink

51．．．底座51. . . Base

511．．．均熱板511. . . Soaking plate

5111．．．板體5111. . . Plate body

5113．．．磁力柱5113. . . Magnetic column

5115．．．凸柱5115. . . Tab

513．．．密閉空間513. . . hermetic space

圖1係本發明散熱器組合的一較佳實施方式的一立體分解圖。1 is an exploded perspective view of a preferred embodiment of a heat sink assembly of the present invention.

圖2係圖1的散熱器的剖視圖。2 is a cross-sectional view of the heat sink of FIG. 1.

圖3係圖1的立體組裝圖。3 is a perspective assembled view of FIG. 1.

圖4係圖3中沿IV-IV線的剖面圖。Figure 4 is a cross-sectional view taken along line IV-IV of Figure 3.

11．．．電路板本體11. . . Board body

13．．．發熱元件13. . . Heating element

30．．．支架30. . . support

50．．．散熱器50. . . heat sink

5113．．．磁力柱5113. . . Magnetic column

513．．．密閉空間513. . . hermetic space

Claims (8)

一種散熱器組合，包括一散熱器，所述散熱器包括一底座，其改進在於：所述底座設有一密閉空間，所述底座包括一用於接觸一發熱元件的板體及多個自所述板體延伸形成的磁力柱，所述磁力柱位於所述密閉空間中，所述底座藉由所述磁力柱能吸附在一金屬材質的物體上。A heat sink assembly includes a heat sink, the heat sink including a base, wherein the base is provided with a sealed space, the base includes a plate body for contacting a heat generating component, and a plurality of A magnetic column formed by the extension of the plate body, the magnetic column is located in the sealed space, and the base can be adsorbed on a metal object by the magnetic column. 如申請專利範圍第1項所述之散熱器組合，其中所述底座還包括多個自所述板體延伸形成的凸柱，所述凸柱位於所述密閉空間中，所述磁力柱環繞所述凸柱。The heat sink assembly of claim 1, wherein the base further comprises a plurality of protrusions extending from the plate body, the protrusions are located in the sealed space, and the magnetic column surrounds the Said stud. 如申請專利範圍第1項所述之散熱器組合，其中所述散熱器還包括多個自所述底座延伸形成的散熱鰭片，所述散熱鰭片相互平行。The heat sink assembly of claim 1, wherein the heat sink further comprises a plurality of heat dissipation fins extending from the base, the heat dissipation fins being parallel to each other. 如申請專利範圍第1項所述之散熱器組合，其中所述散熱器組合還包括一電路板，所述支架安裝於所述電路板上，所述電路板包括一電路板本體及一安裝於所述電路板本體上的發熱元件，所述支架設有一開口，所述發熱元件位於所述開口中，所述底座安裝在所述支架上且所述板體接觸所述發熱元件。The heat sink assembly of claim 1, wherein the heat sink assembly further comprises a circuit board, the bracket is mounted on the circuit board, the circuit board includes a circuit board body and a mounting body a heating element on the circuit board body, the bracket is provided with an opening, the heating element is located in the opening, the base is mounted on the bracket and the board contacts the heating element. 如申請專利範圍第4項所述之散熱器組合，其中所述支架包括一支架本體，所述支架本體包括一環繞所述開口的支撐部，所述支撐部平行所述電路板本體，所述底座放置在所述支撐部上。The heat sink assembly of claim 4, wherein the bracket comprises a bracket body, the bracket body includes a support portion surrounding the opening, the support portion is parallel to the circuit board body, A base is placed on the support. 如申請專利範圍第5項所述之散熱器組合，其中所述支架本體還包括一自所述支撐部延伸形成的凸緣，所述凸緣環繞所述底座，所述凸緣用於限制所述底座沿一平行所述電路板本體的方向上移動。The heat sink assembly of claim 5, wherein the bracket body further comprises a flange extending from the support portion, the flange surrounding the base, the flange being used to limit the The base moves in a direction parallel to the body of the circuit board. 如申請專利範圍第6項所述之散熱器組合，其中所述支撐部及所述凸緣沿一垂直所述電路板本體的方向上的橫截面呈L形。The heat sink assembly of claim 6, wherein the support portion and the flange are L-shaped in a cross section in a direction perpendicular to the circuit board body. 如申請專利範圍第4項所述之散熱器組合，其中所述支架包括一支架本體及多個自所述支架本體延伸形成的固定部，所述開口設於所述支架本體中，所述電路板本體設有多個收容所述固定部的固定孔。
The heat sink assembly of claim 4, wherein the bracket comprises a bracket body and a plurality of fixing portions extending from the bracket body, the opening being disposed in the bracket body, the circuit The plate body is provided with a plurality of fixing holes for receiving the fixing portion.
TW101139792A 2012-10-26 2012-10-26 Heat sink assembly TW201416837A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101139792A TW201416837A (en) 2012-10-26 2012-10-26 Heat sink assembly
US13/928,355 US20140116671A1 (en) 2012-10-26 2013-06-26 Heat sink assembly

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TW101139792A TW201416837A (en) 2012-10-26 2012-10-26 Heat sink assembly

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TWM504269U (en) * 2014-11-19 2015-07-01 Giga Byte Tech Co Ltd Board fixing structure
CN115589646B (en) * 2022-12-12 2023-03-21 久盛电气股份有限公司 Heating system, tank device and control method thereof

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US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6542369B1 (en) * 2001-12-27 2003-04-01 Nextronics Engineering Corp. Fixing frame for CPU cooling devices
TW530935U (en) * 2002-07-26 2003-05-01 Tai Sol Electronics Co Ltd Heat dissipation apparatus for lower-connect type integrated circuit
US6831541B1 (en) * 2003-09-16 2004-12-14 Concept Workshop Worldwide, Llc Multi-stable magnetic article
TWI251656B (en) * 2004-12-03 2006-03-21 Hon Hai Prec Ind Co Ltd Boiling chamber cooling device
TW201221041A (en) * 2010-11-11 2012-05-16 Hon Hai Prec Ind Co Ltd Heat dissipation apparatus assembly

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