JP2015028106A - ポリイミド前駆体ワニス、ポリイミド樹脂、およびそれらの用途 - Google Patents
ポリイミド前駆体ワニス、ポリイミド樹脂、およびそれらの用途 Download PDFInfo
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- JP2015028106A JP2015028106A JP2013157895A JP2013157895A JP2015028106A JP 2015028106 A JP2015028106 A JP 2015028106A JP 2013157895 A JP2013157895 A JP 2013157895A JP 2013157895 A JP2013157895 A JP 2013157895A JP 2015028106 A JP2015028106 A JP 2015028106A
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- Prior art keywords
- polyimide precursor
- diamine
- polyimide
- mol
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 209
- 239000004642 Polyimide Substances 0.000 title claims abstract description 131
- 239000002243 precursor Substances 0.000 title claims abstract description 116
- 239000002966 varnish Substances 0.000 title claims abstract description 79
- 239000009719 polyimide resin Substances 0.000 title claims abstract description 48
- 150000004985 diamines Chemical class 0.000 claims abstract description 91
- 239000000126 substance Substances 0.000 claims abstract description 46
- 239000002253 acid Substances 0.000 claims abstract description 43
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 238000009413 insulation Methods 0.000 claims abstract description 9
- 238000006068 polycondensation reaction Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 49
- 239000012790 adhesive layer Substances 0.000 claims description 35
- 239000011247 coating layer Substances 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 23
- 239000004020 conductor Substances 0.000 claims description 20
- 230000009477 glass transition Effects 0.000 claims description 18
- 239000002390 adhesive tape Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 16
- 239000002313 adhesive film Substances 0.000 claims description 14
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000011888 foil Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical group NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 9
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 8
- UCQABCHSIIXVOY-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]phenoxy]aniline Chemical group NC1=CC=CC(OC=2C=CC(=CC=2)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 UCQABCHSIIXVOY-UHFFFAOYSA-N 0.000 claims description 7
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 4
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 4
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical group NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 3
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 claims description 3
- RLYCRLGLCUXUPO-UHFFFAOYSA-N 2,6-diaminotoluene Chemical compound CC1=C(N)C=CC=C1N RLYCRLGLCUXUPO-UHFFFAOYSA-N 0.000 claims description 3
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical compound C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 claims description 3
- AXNUJYHFQHQZBE-UHFFFAOYSA-N 3-methylbenzene-1,2-diamine Chemical compound CC1=CC=CC(N)=C1N AXNUJYHFQHQZBE-UHFFFAOYSA-N 0.000 claims description 3
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 claims description 3
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 claims description 3
- DGRGLKZMKWPMOH-UHFFFAOYSA-N 4-methylbenzene-1,2-diamine Chemical compound CC1=CC=C(N)C(N)=C1 DGRGLKZMKWPMOH-UHFFFAOYSA-N 0.000 claims description 3
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 claims description 3
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 claims description 2
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
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- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 27
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
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- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
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- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 4
- 239000003431 cross linking reagent Substances 0.000 description 4
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- 238000006116 polymerization reaction Methods 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
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- 238000001816 cooling Methods 0.000 description 3
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- 229920003192 poly(bis maleimide) Polymers 0.000 description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
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- GWHJZXXIDMPWGX-UHFFFAOYSA-N 1,2,4-trimethylbenzene Chemical compound CC1=CC=C(C)C(C)=C1 GWHJZXXIDMPWGX-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
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- 238000003786 synthesis reaction Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- DZLUPKIRNOCKJB-UHFFFAOYSA-N 2-methoxy-n,n-dimethylacetamide Chemical compound COCC(=O)N(C)C DZLUPKIRNOCKJB-UHFFFAOYSA-N 0.000 description 1
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- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
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- ZKVLEFBKBNUQHK-UHFFFAOYSA-N helium;molecular nitrogen;molecular oxygen Chemical compound [He].N#N.O=O ZKVLEFBKBNUQHK-UHFFFAOYSA-N 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
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- 239000002994 raw material Substances 0.000 description 1
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Images
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- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013157895A JP2015028106A (ja) | 2013-07-30 | 2013-07-30 | ポリイミド前駆体ワニス、ポリイミド樹脂、およびそれらの用途 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013157895A JP2015028106A (ja) | 2013-07-30 | 2013-07-30 | ポリイミド前駆体ワニス、ポリイミド樹脂、およびそれらの用途 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015028106A true JP2015028106A (ja) | 2015-02-12 |
| JP2015028106A5 JP2015028106A5 (enExample) | 2015-11-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013157895A Pending JP2015028106A (ja) | 2013-07-30 | 2013-07-30 | ポリイミド前駆体ワニス、ポリイミド樹脂、およびそれらの用途 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2015028106A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017110982A1 (ja) | 2015-12-25 | 2017-06-29 | 富士フイルム株式会社 | 樹脂、組成物、硬化膜、硬化膜の製造方法および半導体デバイス |
| JP2017155205A (ja) * | 2016-03-05 | 2017-09-07 | 三菱ケミカル株式会社 | 積層ポリエステルフィルム |
| WO2020091147A1 (ko) * | 2018-10-31 | 2020-05-07 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 피복물의 내열성을 향상시키기 위한 도체 피복용 폴리이미드 바니쉬 및 이로부터 제조된 폴리이미드 피복물 |
| CN112703818A (zh) * | 2018-09-14 | 2021-04-23 | 日东电工株式会社 | 加热器和带有加热器的物品 |
| US20220372224A1 (en) * | 2019-10-28 | 2022-11-24 | Pi Advanced Materials Co., Ltd. | Polyimide film for graphite sheet, and graphite sheet manufactured therefrom |
| US20230227609A1 (en) * | 2020-06-09 | 2023-07-20 | Nitto Denko Corporation | Polyimide film, and metal-clad laminate |
| KR20230146002A (ko) | 2022-04-08 | 2023-10-18 | 제이에프이 케미칼 가부시키가이샤 | 폴리이미드 전구체 조성물 및, 폴리이미드 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0977972A (ja) * | 1995-09-12 | 1997-03-25 | Japan Synthetic Rubber Co Ltd | 樹脂組成物 |
| JP2000327777A (ja) * | 1999-05-24 | 2000-11-28 | Unitika Ltd | ポリイミド前駆体溶液、それから得られるポリイミド塗膜及びその製造方法 |
| JP2005302598A (ja) * | 2004-04-14 | 2005-10-27 | Hitachi Cable Ltd | エナメル線及びそれに用いる絶縁塗料 |
-
2013
- 2013-07-30 JP JP2013157895A patent/JP2015028106A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0977972A (ja) * | 1995-09-12 | 1997-03-25 | Japan Synthetic Rubber Co Ltd | 樹脂組成物 |
| JP2000327777A (ja) * | 1999-05-24 | 2000-11-28 | Unitika Ltd | ポリイミド前駆体溶液、それから得られるポリイミド塗膜及びその製造方法 |
| JP2005302598A (ja) * | 2004-04-14 | 2005-10-27 | Hitachi Cable Ltd | エナメル線及びそれに用いる絶縁塗料 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2017110982A1 (ja) | 2015-12-25 | 2017-06-29 | 富士フイルム株式会社 | 樹脂、組成物、硬化膜、硬化膜の製造方法および半導体デバイス |
| US10450417B2 (en) | 2015-12-25 | 2019-10-22 | Fujifilm Corporation | Resin, composition, cured film, method for manufacturing cured film and semiconductor device |
| JP2017155205A (ja) * | 2016-03-05 | 2017-09-07 | 三菱ケミカル株式会社 | 積層ポリエステルフィルム |
| CN112703818A (zh) * | 2018-09-14 | 2021-04-23 | 日东电工株式会社 | 加热器和带有加热器的物品 |
| WO2020091147A1 (ko) * | 2018-10-31 | 2020-05-07 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 피복물의 내열성을 향상시키기 위한 도체 피복용 폴리이미드 바니쉬 및 이로부터 제조된 폴리이미드 피복물 |
| US20220372224A1 (en) * | 2019-10-28 | 2022-11-24 | Pi Advanced Materials Co., Ltd. | Polyimide film for graphite sheet, and graphite sheet manufactured therefrom |
| US12428526B2 (en) * | 2019-10-28 | 2025-09-30 | Pi Advanced Materials Co., Ltd. | Polyimide film for graphite sheet, and graphite sheet manufactured therefrom |
| US20230227609A1 (en) * | 2020-06-09 | 2023-07-20 | Nitto Denko Corporation | Polyimide film, and metal-clad laminate |
| KR20230146002A (ko) | 2022-04-08 | 2023-10-18 | 제이에프이 케미칼 가부시키가이샤 | 폴리이미드 전구체 조성물 및, 폴리이미드 |
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