JP2015019043A - Electric power supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power supply device which sufficiently improves the product's value without causing steep rise of the manufacturing costs.SOLUTION: An electric power supply device 1 includes: a circuit board 2 on which electronic components are mounted; and a frame 3 which is disposed on a mounting surface Fa of the electronic components in the circuit board 2 so as to enclose the electronic components and is integrated with the circuit board 2. Annular recessed part 12a and an annular recessed part 12b which are arranged along the frame 3 are formed in an annular region of the circuit board 2 which contacts with the frame 3 on the mounting surface Fa.

Description

  The present invention relates to a power supply device configured to include a circuit board on which an electronic component is mounted, and a frame member disposed on the mounting surface of the electronic component on the circuit board so as to surround the electronic component.

  As this type of power supply device, a power conversion device having a main circuit module in which a high thermal conductive printed wiring board (hereinafter also simply referred to as “printed wiring board”) and a mold case are integrated is disclosed in Japanese Patent Laid-Open No. 2005-2005. This is disclosed in Japanese Patent No. 32912. In this case, electronic components such as power semiconductor elements are mounted on the printed wiring board. Further, the mold case is formed in a frame shape as a whole, and has a main terminal connected to a power semiconductor element or the like on a printed wiring board.

  When manufacturing this power conversion device, first, after installing the mold case on the mounting surface of the power semiconductor element and the like on the printed wiring board, the power semiconductor element and the main terminal of the mold case are electrically connected to each other by a bonding wire. Connect to. Next, a filler is injected into the mold case (a shallow dish-shaped container formed by the printed wiring board and the mold case) and cured. Subsequently, after the heat conductive plate is placed on the cured filler layer, the filler is again injected into the mold case and cured so as to cover the heat conductive plate.

  Thus, the printed wiring board, the mold case and the heat conduction plate are integrated by the two upper and lower filler layers, and the printed wiring board is formed by the filler layer formed between the printed wiring board and the heat conduction plate. The upper power semiconductor element is sealed with a filler to complete the main circuit module. Thereafter, the main circuit module is attached to the heat radiating fin so that the back surface of the mounting surface of the power semiconductor element or the like on the printed wiring board and the end of the heat conduction plate that is drawn out of the mold case are in contact with the heat radiating fin. Thus, the power conversion device is manufactured.

Japanese Patent Laying-Open No. 2005-32912 (page 5-10, FIG. 1-7)

  However, the conventional power conversion device has the following problems to be solved. That is, in the conventional power conversion device, in the state where the mold case is installed on the printed wiring board so as to surround the power semiconductor element mounted on the printed wiring board, the shallow dish shape formed by the printed wiring board and the mold case. By injecting the filler into the container and curing it, the power semiconductor elements and the like on the printed wiring board are sealed with the filler layer.

  In this case, in the printed wiring board and the mold case before the filling material is injected, the power semiconductor elements on the printed wiring board and the main terminals provided in the mold case are electrically connected to each other by bonding wires. In this state, they are integrated by a bonding wire. However, since both are not integrated by screwing or the like, a very small gap may be generated between the printed wiring board and the mold case. Therefore, when the filler is injected into the shallow dish-shaped container formed by the printed wiring board and the mold case, the filler may leak from a gap generated between the printed wiring board and the mold case.

  For this reason, the conventional power conversion device has a problem that the filler leaking out from the gap is cured outside the main circuit module, resulting in a loss of product value due to a loss of aesthetics of the power conversion device. . Further, in order to avoid a decrease in product value, when the leaked filler is removed, there is a problem that the manufacturing cost of the power conversion device increases by the cost required for the work of removing the filler. .

  The present invention has been made in view of such problems to be solved, and a main object of the present invention is to provide a power supply device capable of sufficiently improving the product value without causing an increase in manufacturing cost.

  In order to achieve the above object, a power supply device according to the present invention includes a circuit board on which an electronic component is mounted, and a circuit board disposed on the mounting surface of the electronic component on the circuit board so as to surround the electronic component. The circuit board is formed with an annular recess along the frame member in an annular region in contact with the frame member on the mounting surface.

  In the power supply device according to the present invention, the annular recess is formed in the circuit board by recessing a part of the annular region in the resist layer formed on the mounting surface.

  In the power supply device according to the present invention, the circuit board includes an inner peripheral annular convex portion along the frame member and an outer peripheral annular convex portion along the frame member by a printed layer formed in the annular region. Is formed, and the annular recess is formed between the inner peripheral annular convex portion and the outer peripheral annular convex portion.

  Furthermore, in the power supply device according to the present invention, the frame member is provided with a concavo-convex process on a contact surface that contacts the circuit board.

  According to the power supply device of the present invention, the filler layer is formed so as to cover the electronic component by forming the annular recess along the frame member in the annular region in contact with the frame member on the mounting surface of the electronic component on the circuit board. Is formed by the circuit board and the frame member in a state where a gap is formed between the contact surface of the frame member and the mounting surface at any part of the annular region on the mounting surface of the circuit board. Even if the filler is poured into the shallow dish-like container, the fluidity can be sufficiently lowered while the filler that has entered the gap moves so as to spread along the annular recess, As a result of the difficulty in moving the filler to the outside of the annular recess, it is possible to avoid a situation where the filler leaks out of the container body. Therefore, since the work for removing the leaked filler is not necessary, it is possible to manufacture a power supply device with excellent aesthetics and high product value at low cost.

  Further, according to the power supply device of the present invention, the annular recess is formed by recessing a part of the annular region in the resist layer, for example, compared with a configuration in which the annular recess is formed in the circuit board by cutting. Since the annular recess can be easily formed, the manufacturing cost of the circuit board can be sufficiently reduced. As a result, the manufacturing cost of the power supply device can be further reduced.

  Further, according to the power supply device of the present invention, by forming the inner circumferential side annular convex portion and the outer circumferential side annular convex portion by the printed layer, the annular concave portion is formed between both annular convex portions, so that the circuit board or the like When forming the printed layer, which is essential to indicate the model number, manufacturer, part number, etc., the annular recess can be formed by forming the inner annular projection and the outer annular projection. As a result of sufficiently reducing the manufacturing cost of the substrate, the manufacturing cost of the power supply device can be further reduced.

  Furthermore, according to the power supply device according to the present invention, the unevenness generated on the contact surface is formed between the circuit board and the frame member by performing uneven processing on the contact surface of the frame member that contacts the circuit board. Since it becomes resistance to movement of the filler that has entered the gap and the movement speed of the filler in the gap can be sufficiently reduced, the fluidity of the filler is sufficiently lowered while moving in the gap. As a result, it is possible to reliably avoid a situation where the filler leaks outside the container body.

1 is an external perspective view of a power supply device 1. FIG. 1 is a cross-sectional view of a power supply device 1. FIG. 1 is an exploded perspective view of a power supply device 1. FIG. It is the top view which looked at the circuit board 2 in the power supply device 1 from the mounting surface Fa side. 3 is an enlarged cross-sectional view of a contact portion between a circuit board 2 and a frame 3 in the power supply device 1. FIG. 4 is an enlarged cross-sectional view of a contact portion between a circuit board 2A and a frame 3 in the power supply device 1A. FIG. It is the top view which looked at the circuit board 2A in 1 A of power supply devices from the mounting surface Fa side.

  Hereinafter, embodiments of a power supply device will be described with reference to the accompanying drawings.

  The power supply device 1 shown in FIGS. 1 and 2 is an example of a “power supply device”, and includes a circuit board 2, a frame 3, a filler layer 4, and a lid 5.

  The circuit board 2 is an example of a “circuit board”. As shown in FIGS. 2 and 3, a resist layer 12 is formed on the surface of the board body 11, and an electronic component 13 is formed on the mounting surface Fa of the board body 11. Etc. are implemented and configured. As an example, the substrate body 11 has an insulating layer made of epoxy resin or the like formed on one surface of an aluminum plate (support) having a thickness of about 1.5 mm, and an electronic component on the insulating layer. Conductor patterns constituting connection lands and wiring patterns are formed. In addition, in each drawing referred in this specification, illustration of said insulating layer and a conductor pattern is abbreviate | omitted.

  The resist layer 12 is formed in a thin film so as to cover the mounting surface Fa of the electronic component 13 and the like in the substrate body 11. In this case, in the circuit board 2 in the power supply device 1 of the present example, as shown in FIG. 4, the resist layer 12 in the annular region A that is in contact with the frame 3 is partially recessed, so that the frame 3 in a plan view is seen. Annular annular recesses 12a and 12b (an example of an “annular recess”) along the outer shape are formed. More specifically, as an example, by providing an annular region in which the resist layer 12 does not exist in the annular region A, an annular recess (with the same depth as the resist layer 12) within the thickness range of the resist layer 12 12 a and 12 b are formed in the annular region A.

  The electronic component 13 is an example of an “electronic component” and is surface-mounted on the mounting surface Fa of the circuit board 2 as shown in FIGS. In the actual power supply device 1 (circuit board 2), many electronic components are mounted in addition to the electronic component 13. To facilitate understanding of the configuration of the “power supply device (circuit board)”, In both figures, only the electronic component 13 is shown.

  The frame 3 is an example of a “frame member”, and is formed in a planar viewing angle frame shape by an injection molding process using an insulating resin material such as polyphenylene sulfide (PSS) as a molding material. In this case, in the power supply device 1 of this example, as an example, a forming surface (not shown) that forms the contact surface Fb of the frame 3 with the circuit board 2 in the mold for injection molding is processed with a matte finish. In addition, fine irregularities are formed on the contact surface Fb of the frame 3 formed using the mold (an example of a state in which “the contact surface is processed to be uneven”). As will be described later, the frame 3 is disposed on the mounting surface Fa of the circuit board 2 so as to surround the electronic component 13 and the like, and is integrated with the circuit board 2.

  The filler layer 4 is a heat generated in the electronic component 13 or the like during operation while avoiding damage to the electronic component 13 or the like mounted on the circuit board 2 due to vibration or impact applied to the power supply device 1. The functional layer for transferring heat to the substrate body 11 is configured. As will be described later, the filler layer 4 is formed by pouring an insulating resin material such as a silicon-based resin into a shallow dish-like container formed by the circuit board 2 and the frame 3 to cure the electronic component 13 and the like. It is formed so as to cover.

  The lid 5 is formed in a flat plate shape with a thin metal plate, and is fixed to the frame 3 so as to be opposed to the circuit board 2 with the frame 3 interposed therebetween. In this case, in the power supply device 1 of this example, the pair of insertion holes H2 and H2 formed in the circuit board 2, the pair of insertion holes H3 and H3 formed in the frame 3, and the pair of holes formed in the lid 5 The circuit board 2, the frame 3, and the lid by a pair of fixing screws (not shown) through which the insertion holes H5 and H5 (hereinafter, the insertion holes H2, H3, and H5 are generically referred to as “insertion holes H”) are inserted. The body 5 is integrated.

  In manufacturing the power supply device 1, first, the circuit board 2 and the frame 3 are manufactured. As described above, the frame 3 is molded in the same procedure as that of a known resin molding process, except that a mold having a matte finish is used to form the contact surface Fb of the frame 3 as described above. Since the process is performed, the description of the method for manufacturing the frame 3 is omitted.

  On the other hand, when the circuit board 2 is manufactured, a conductor pattern is formed on one surface (surface to be mounted surface Fa) having an insulating layer formed on one surface, and the substrate body 11 is manufactured, and then the conductor pattern is covered. Thus, the resist layer 12 is formed on the substrate body 11. At this time, as an example, a resist layer is formed by applying a mask to a portion to be a land for connecting the electronic component 13 or the like in the conductor pattern and a portion (in the annular region A) where the annular recesses 12a and 12b are to be formed. By forming 12, the land is exposed from the formed resist layer 12 and annular recesses 12 a and 12 b are formed in the annular region A, respectively. Next, according to a known component mounting process, the electronic component 13 and the like are mounted on the mounting surface Fa of the substrate body 11 on which the resist layer 12 is formed. Thereby, as shown in FIG. 3, the circuit board 2 is completed.

  Subsequently, after placing the frame 3 on the mounting surface Fa of the circuit board 2 so as to surround the electronic component 13 and the like, the frame 3 is temporarily fixed to the circuit board 2 using a clamp member (manufacturing jig) (not shown). Next, a liquid filler for forming the filler layer 4 is poured into a shallow dish-like container formed by the circuit board 2 and the frame 3. In this case, as an example, the filler is cured by pouring a filler having a viscosity of about 3.2 Pa · s (filler having a certain amount of fluidity) and allowing it to stand for a necessary time.

  In this case, the circuit board (in this example, the circuit board 2) constituting this type of device undergoes extremely small deformation during its manufacture, and the mounting surface (in this example, the mounting surface Fa) has a very small deflection. May occur. In addition, the frame (frame 3 in this example) constituting this type of apparatus is extremely small in deformation at the time of manufacture and extremely on the contact surface with the circuit board (contact surface Fb in this example). Small deflection may occur. For this reason, when the power supply device 1 is manufactured, as shown in FIG. 5, a very small gap is formed between the contact surface Fb of the frame 3 and any part of the annular region A on the mounting surface Fa of the circuit board 2. S may occur. When the filler is poured in such a state, the filler enters the gap S between the annular region A and the contact surface Fb, and the invading filler enters the annular region A and the contact surface Fb. The inside of the gap S is moved from the peripheral portion toward the outer peripheral portion (for example, in the direction of arrow B shown in FIG. 4).

  However, as described above, in the power supply device 1 of the present example, the annular recesses 12 a and 12 b are formed in the annular region A on the mounting surface Fa of the circuit board 2. Therefore, when the filler moving in the gap S toward the outer peripheral side portion of the annular region A and the contact surface Fb reaches the annular recess 12a, the filler moves along the annular recess 12a ( For example, in the direction of the arrow C shown in FIG. 4 (direction orthogonal to the direction of the arrow B), it moves in the annular recess 12a (expands along the annular recess 12a). For this reason, in the power supply device 1 of this example, the situation where the filler that has entered the gap S reaches the annular region A and the outer peripheral side portion of the contact surface Fb in a short time is avoided, and the inside of the annular recess 12a becomes the annular recess 12a. While moving along, the fluidity is sufficiently reduced. As a result, it becomes difficult for the filler that has entered the gap S to move outside the annular recess 12a in the gap S, and as a result, the filler leaks out of the container formed by the circuit board 2 and the frame 3. The situation to do is avoided.

  On the other hand, even if a certain amount of filler enters the gap S, and this filler passes through the annular recess 12a and reaches the annular recess 12b, the filler remains along the annular recess 12b (for example, FIG. 4). (In the direction of the arrow C shown in FIG. 4), the inside of the annular recess 12b is moved (expanded along the annular recess 12b). For this reason, in the power supply device 1 of this example, the situation where the filler that has entered the gap S and passed through the annular recess 12a reaches the annular region A and the outer peripheral side portion of the contact surface Fb in a short time is avoided. While moving in the inside of 12b along the annular recessed part 12b, the fluidity | liquidity falls sufficiently. This makes it difficult for the filler that has entered the gap S to move outside the annular recess 12b in the gap S, so that the filler leaks to the outside of the container formed by the circuit board 2 and the frame 3. The situation to do is surely avoided.

  Further, in the power supply device 1 of this example, fine irregularities are formed on the contact surface Fb of the frame 3. Therefore, for example, unlike the configuration employing a “frame member” in which the contact surface Fb is mirror-finished (not uneven), the presence of fine unevenness formed on the contact surface Fb causes the clearance S to be within the gap S. The movement of the filler (movement in the direction of the arrow B shown in FIG. 4 or movement in the direction of the arrow C) is hindered (fine irregularities become the flow resistance of the filler), and the filler in the gap S The moving speed is sufficiently reduced. As a result, a situation in which the filler that has entered the gap S reaches the annular region A and the outer peripheral side portion of the contact surface Fb in a short time is preferably avoided, and the fluidity of the filler while moving in the gap S. Is sufficiently reduced. Thus, in combination with the presence of the annular recesses 12a and 12b, a situation in which the filler leaks out of the container formed by the circuit board 2 and the frame 3 is reliably avoided.

  In the power supply device 1 of this example, as described above, the insertion holes H3 and H3 (see FIG. 3) are formed in the frame 3, and the insertion holes H3 and H3 are formed in the inner and outer peripheral directions of the frame 3. The thickness is increased. Thereby, in the power supply device 1 of this example, the width | variety of the formation part of insertion hole H3, H3 in the contact surface Fb in the flame | frame 3 is fully wide. Therefore, as shown in FIG. 4, in the annular region A, the annular recesses 12a and 12b are formed at the portions (the lower left corner and the upper right corner in the figure) that are brought into contact with the formation portions of the insertion holes H3 and H3 of the contact surface Fb. Even if is not formed, a situation where the filler leaks out of the container body at this portion is avoided. Then, the filler layer 4 is completely formed by allowing the poured filler to stand until it is sufficiently cured.

  Subsequently, after removing the clamp member, the lid body 5 is placed on the frame 3 so as to face the circuit board 2, and the circuit board 2, the frame 3, and the lid body are fixed by the fixing screws inserted through the insertion holes H. Screw 5 in. As a result, the power supply device 1 is completed as shown in FIGS.

  As described above, according to the power supply device 1, the annular recesses 12 a and 12 b are formed along the frame 3 in the annular region A that contacts the frame 3 on the mounting surface Fa of the electronic component 13 and the like on the circuit board 2. Thus, when the filler layer 4 is formed, the circuit board 2 in a state where a gap S is generated between the contact surface Fb of the frame 3 in any part of the annular region A on the mounting surface Fa of the circuit board 2. Even when the filler is poured into the shallow dish-shaped container formed by the frame 3, the filler enters the gap S while the filler moves so as to spread along the annular recesses 12a and 12b. As a result, it is difficult for the filler to move to the outside of the annular recesses 12a and 12b, thereby avoiding the situation where the filler leaks outside the container body. Can. Therefore, since the operation | work which removes the leaked filler becomes unnecessary, the power supply device 1 with the high product value excellent in aesthetics can be manufactured at low cost.

  Further, according to the power supply device 1, the annular region A in the resist layer 12 is partially recessed to form the annular recesses 12 a and 12 b, so that, for example, an “annular recess” is formed in the circuit board 2 by cutting. Since the annular recesses 12a and 12b can be easily formed as compared with the configuration to be performed, the manufacturing cost of the circuit board 2 can be sufficiently reduced. As a result, the manufacturing cost of the power supply device 1 can be further reduced. it can.

  Furthermore, according to the power supply device 1, the unevenness generated on the contact surface Fb is introduced into the gap S by performing uneven processing on the contact surface Fb that contacts the circuit board 2 in the frame 3. As a result of being able to sufficiently reduce the fluidity of the filler while moving in the gap S, the movement speed of the filler in the gap S can be sufficiently reduced. A situation where the filler leaks out of the container body can be surely avoided.

  The configuration of the “power supply device” is not limited to the configuration of the power supply device 1 described above. For example, the power supply device 1 in which the annular recesses 12a and 12b, which are examples of the “annular recesses”, are formed in the circuit board 2 has been described as an example, but instead of such a configuration, an “inner circumferential annular protrusion” In addition, it is possible to adopt a configuration in which an “annular recess” is formed between the two “annular protrusions” by forming the “outer circumferential annular protrusion”. Specifically, as an example, the power supply device 1A shown in FIG. 6 is another example of the “power supply device”, and instead of the circuit board 2 in the power supply device 1 described above, the circuit shown in FIG. The board 2A (another example of “circuit board”) is provided. In addition, about the component which has a function similar to the power supply device 1 (circuit board 2) mentioned above in this power supply device 1A (circuit board 2A), the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

  In the circuit board 2A of the power supply device 1A, instead of the annular recesses 12a and 12b in the circuit board 2 of the power supply device 1, the annular protrusions 14a and 14b are formed in the annular region A by the printing layer 14, thereby An annular recess 14c, which is another example of the “annular recess”, is formed between the annular protrusions 14a and 14b. In this example, the annular convex portion 14a corresponds to an “inner circumferential annular convex portion”, and the annular convex portion 14b corresponds to an “outer circumferential annular convex portion”.

  In this case, the printed layer 14 is a layer for writing a character string or a symbol indicating various types of information such as a model number and manufacturer of the circuit board 2A and a component number of an electronic component mounted on the circuit board 2A. As an example, as shown in FIG. 6, it is formed on a resist layer 12 provided on the substrate body 11 by a known printing method such as a silk printing method. The shape (formation position) in plan view of the annular protrusions 14a and 14b is the same except that the protrusions and recesses of the annular recesses 12a and 12b of the circuit board 2 are inverted, and detailed description thereof is omitted. Further, since the annular recess 14c is formed between the annular projections 14a and 14b by forming the annular projections 14a and 14b, detailed description of the annular recess 14c is also omitted.

  In manufacturing the power supply device 1A, the electronic component is mounted on the mounting surface Fa of the circuit board 2A after the mounting of the electronic component 13 and the like on the substrate body 11 in which the annular recess 14c is formed in advance by forming the annular protrusions 14a and 14b. After the frame 3 is placed so as to surround 13 and the like, the frame 3 is temporarily fixed to the circuit board 2A using a clamp member (manufacturing jig) (not shown). Next, a liquid filler for forming the filler layer 4 is poured into a shallow dish-shaped container formed by the circuit board 2 </ b> A and the frame 3.

  In this case, as shown in FIG. 6, when the power supply device 1A is manufactured, the frame is formed in any part of the annular region A on the mounting surface Fa of the circuit board 2A in the same manner as the manufacture of the power supply device 1 described above. 3 may be in a state where a very small gap S is generated between the contact surface Fb and the third contact surface Fb. When the filler is poured in such a state, the filler enters the gap S between the annular region A and the contact surface Fb, and the invading filler enters the annular region A and the contact surface Fb. The inside of the gap S is moved from the peripheral side portion toward the outer peripheral side portion (for example, in the direction of the arrow B shown in FIG. 7).

  However, as described above, in the power supply device 1A of the present example, the annular protrusions 14a and 14b are formed in the annular region A that contacts the contact surface Fb of the frame 3 on the mounting surface Fa of the circuit board 2A. An annular recess 14c is formed between the protrusions 14a and 14b. Therefore, when the filler that has moved in the gap S toward the outer peripheral side portion of the annular region A and the contact surface Fb reaches the annular recess 14c, the filler moves along the annular recess 14c ( For example, in the direction of the arrow C shown in FIG. 7 (direction orthogonal to the direction of the arrow B), it moves in the annular recess 14c (expands along the annular recess 14c). For this reason, in the power supply device 1A of this example, the situation where the filler that has entered the gap S reaches the annular region A and the outer peripheral side portion of the contact surface Fb in a short time is avoided, and the inside of the annular recess 14c becomes the annular recess 14c. While moving along, the fluidity is sufficiently reduced. This makes it difficult for the filler that has entered the gap S to move outside the annular recess 14c in the gap S. As a result, the filler leaks out of the container formed by the circuit board 2A and the frame 3. The situation to do is avoided.

  Then, the filler layer 4 is completely formed by allowing the poured filler to stand until it is sufficiently cured. Subsequently, after removing the clamp member, the lid body 5 is placed on the frame 3 so as to face the circuit board 2A, and the circuit board 2A, the frame 3 and the lid body are fixed by the fixing screws inserted through the insertion holes H. Screw 5 in. Thereby, as shown in FIG. 6, 1 A of power supply devices are completed.

  Thus, according to the power supply device 1A, the annular annular protrusions 14a and 14b are formed along the frame 3 in the annular region A that contacts the frame 3 on the mounting surface Fa of the electronic component 13 and the like on the circuit board 2A. As a result, when the filler layer 4 is formed, the circuit board is formed with a gap S between the contact surface Fb of the frame 3 and any part of the annular region A on the mounting surface Fa of the circuit board 2A. Even if the filler is poured into the shallow dish-shaped container formed by 2A and the frame 3, the fluidity of the filler that has entered the gap S is moving while spreading along the annular recess 14c. As a result, it is difficult for the filler to move to the outside of the annular recess 14c. As a result, it is possible to avoid a situation where the filler leaks outside the container body. . Therefore, since the operation | work which removes the leaked filler becomes unnecessary, the power supply device 1 with the high product value excellent in aesthetics can be manufactured at low cost.

  Further, according to the power supply device 1A, the annular recesses 14c are formed between the annular projections 14a and 14b by forming the annular projections 14a and 14b with the printed layer 14, thereby manufacturing the circuit board 2A and the like. At the time, the annular recess 14c can be formed by forming the annular protrusions 14a and 14b when forming the printing layer 14 which is indispensable for writing the model number, manufacturer, part number, etc., so that the manufacturing cost of the circuit board 2A can be reduced. As a result of being able to reduce sufficiently, the manufacturing cost of the power supply device 1A can be further reduced.

  Further, the power supply device 1 having the circuit board 2 in which the two annular recesses 12a and 12b on the inner peripheral side and the outer peripheral side are formed in the annular region A, and the two annular convex portions 14a on the inner peripheral side and the outer peripheral side. , 14b, the power supply device 1A having the circuit board 2A in which one annular recess 14c is formed in the annular region A between the annular projections 14a, 14b has been described as an example. The number of "" is not limited to the above example, and even in a configuration in which a plurality of "annular recesses" of three or more are formed, the same effects as those of the power supply devices 1 and 1A can be obtained. Furthermore, the “lid” such as the lid 5 is not an essential component of the “power supply device”, and a configuration without the “lid” may be employed.

DESCRIPTION OF SYMBOLS 1,1A Power supply device 2,2A Circuit board 3 Frame 4 Filler layer 11 Board | substrate body 12 Resist layer 12a, 12b, 14c Annular recessed part 13 Electronic component 14 Print layer 14a, 14b Annular convex part A Annular area | region Fa Mounting surface Fb Contact Surface S Clearance

Claims (4)

A power supply device including a circuit board on which an electronic component is mounted, and a frame member that is disposed on the mounting surface of the electronic component on the circuit board so as to surround the electronic component and is integrated with the circuit board. ,
The circuit board is a power supply device in which an annular recess along the frame member is formed in an annular region in contact with the frame member on the mounting surface.   The power supply device according to claim 1, wherein a part of the annular region in the resist layer formed on the mounting surface is recessed in the circuit board to form the annular recess.   On the circuit board, an inner peripheral side annular convex portion along the frame member and an outer peripheral side annular convex portion along the frame member are formed by a printed layer formed in the annular region, and the inner peripheral side annular convex portion is formed. The power supply device according to claim 1, wherein the annular recess is formed between the outer periphery and the outer circumferential annular projection.   The power supply device according to any one of claims 1 to 3, wherein the frame member is provided with an uneven surface on an abutting surface that abuts on the circuit board.

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