WO2020066053A1

WO2020066053A1 - Electronic control device

Info

Publication number: WO2020066053A1
Application number: PCT/JP2019/004967
Authority: WO
Inventors: 秀一滝岡
Original assignee: 株式会社ケーヒン
Priority date: 2018-09-27
Filing date: 2019-02-13
Publication date: 2020-04-02
Also published as: JP7233434B2; CN112369129A; JPWO2020066053A1; CN112369129B

Abstract

[Problem] To provide a technique capable of ensuring the quality of a card edge terminal portion. [Solution] An electronic control device (10) includes two circuit boards (20, 30) in which card edge terminal portions (27, 36) face in the same direction, and board surfaces (21, 31) face each other. Each card edge terminal portion (27, 36) has a plurality of terminals (42) provided on the board surface, and an electrically insulating printed layer (70) surrounding each terminal (42). The surface of the printed layer (70) is set higher than a contact surface (42a) of each terminal (42) in the thickness direction of the circuit board (20).

Description

Electronic control unit

The present invention relates to an electronic control device in which two circuit boards are sealed with resin.

電子 Among electronic control devices having a resin sealing structure, there is a so-called card edge connector type electronic control device having a card edge connector that can be inserted into an edge connector socket. The card edge connector is configured such that a terminal portion serving as an external connection terminal is provided at an end of a circuit board. With respect to such a card edge connector type electronic control device, there is a technique disclosed in Patent Document 1.

The electronic control device disclosed in Patent Document 1 arranges a circuit board in a cavity of a transfer mold including a lower mold and an upper mold, and sandwiches a card edge terminal portion of the circuit board between the lower mold and the upper mold. By pressing a molten resin material into the cavity, the circuit board is sealed with the resin.

JP 2006-173402 A

By the way, in such an electronic control device, there is a case where it is desired to increase a signal transmission system with the outside. In this case, the number of terminals constituting the card edge terminal section may be increased. However, when the number of terminals is increased, the width of the card edge terminal portion is increased. This is disadvantageous from the viewpoint of miniaturization of the electronic control device. Therefore, there is a limit in increasing the number of card edge terminals.

Therefore, the two circuit boards are arranged with the board surfaces facing each other while being separated from each other, and the entire two circuit boards are sealed with a resin sealing member in a state where each card edge terminal portion is exposed. It is possible.

In order to expose each card edge terminal, it is necessary to seal between the card edge terminals when the molten resin material is poured into the cavity of the mold. As an example of a sealing method, it is conceivable to move and insert a slide type between the respective card edge terminal portions.

(4) In order to prevent the molten resin from leaking from the cavity, it is necessary that the respective card edge terminal portions and the slide die are brought into close contact with each other. Therefore, when the slide die moves, the slide die rubs against each card edge terminal portion. It is important to ensure the quality of each card edge terminal portion against this rubbing phenomenon in order to improve the quality of the electronic control device.

。 It is an object of the present invention to provide a technique capable of ensuring the quality of a card edge terminal portion.

According to the invention according to claim 1, two circuit boards, each of which has a card edge terminal portion facing in the same direction and each of which has a board surface facing each other,
A plurality of electronic components respectively mounted on the two circuit boards,
A resin sealing member that seals the entire electronic components and the two circuit boards while exposing only the respective card edge terminal portions,
Each of the card edge terminal portions has a plurality of terminals provided on the substrate surface, and an electrically insulating printed layer surrounding each of the terminals,
An electronic control device is provided, wherein a surface of the printed layer is set higher than a contact surface of each terminal in a thickness direction of the circuit board.

As described in claim 2, preferably, each of the two circuit boards is an electrically insulating plate-shaped base, a wiring layer provided on a surface of the base, and a surface of the base. And an electrically insulating solder resist layer covering the
The printing layer is a silk printing layer printed on the surface of the solder resist layer by silk printing.

According to a third aspect of the present invention, preferably, the two circuit boards are arranged in a tapered shape such that a distance between the two circuit boards increases toward the respective card edge terminal portions.

According to claim 1, each card edge terminal portion has a plurality of terminals provided on the substrate surface and an electrically insulating printed layer surrounding the periphery of each terminal. The surface of the printed layer is set higher than the contact surface of each terminal in the thickness direction of the circuit board. Therefore, when the slide type is fitted between the respective card edge terminal portions, the slide type does not contact each terminal but comes into contact with the printed layer. Since the slide type does not rub against each terminal, the quality of the card edge terminal portion is ensured.

In claim 2, the printing layer is printed on the surface of the solder resist layer by silk printing. Therefore, when printing the part number or the like on the surface of the solder resist layer by silk printing, a print layer can be additionally provided. A printed layer can be provided around the card edge terminal portion without adding a new step.

According to the third aspect, the circuit boards are arranged in a tapered shape so that the distance between the circuit boards increases toward the respective card edge terminal portions. Therefore, when the slide die is fitted or pulled out between the respective card edge terminal portions, the slide die moves only slightly and does not contact the print layer. Therefore, the distance between the slide die and the contact surface of the terminal can be further increased. The quality of the electronic control unit can be easily increased.

FIG. 1A is a cross-sectional view of the electronic control device according to the embodiment. FIG. 1B is an enlarged view of a portion 1b of FIG. 1A. . FIG. 2A is a plan view around the card edge terminal portion of the electronic control device shown in FIG. FIG. 2B is a cross-sectional view taken along the line 2b-2b in FIG. FIG. 3A is a diagram illustrating a preparation step of a method for manufacturing the electronic control device illustrated in FIG. FIG. 3B is a diagram for explaining a substrate arrangement step to a pressing step. FIG. 4A is a diagram illustrating a resin molding step. FIG. 4B is a perspective view of the electronic control device.

An embodiment of the present invention will be described below with reference to the accompanying drawings. In the description, “up and down” means up and down with reference to the drawings.
<Example>

参照 Refer to FIG. The electronic control unit 10 is mounted on a motorcycle, for example, and used by being inserted into an edge connector socket Co.

The electronic control unit 10 electrically connects the power supply board 20 (circuit board 20), the control board 30 (circuit board 30) provided to face the power supply board 20, and the

circuit boards

20, 30. And a sealing resin portion 12 (sealing member 12) made of resin which seals a part of the

circuit boards

20 and 30 and the connection portion 11.

(4) The surface of the power supply substrate 20 facing the control substrate 30 is referred to as a first facing surface 21 (substrate surface 21). A surface opposite to the first facing surface 21 is referred to as a first outer surface 22. The surface of the control substrate 30 facing the power supply substrate 20 is referred to as a second facing surface 31 (substrate surface 31). A surface opposite to the second facing surface 31 is referred to as a second outer surface 32.

A plurality of electronic components 23 to 26 are mounted on the power supply board 20, and a first card edge terminal 27 (card edge terminal) that can supply power to these electronic components 23 to 26 and can be inserted into the edge connector socket Co. Part 27) is formed.

{Circle around (1)} The first card edge terminal portion 27 is exposed from the sealing resin portion 12 to the outside. Note that the first card edge terminal portion 25 needs to be formed at least on the first facing surface 21.

A plurality of electronic components 33 to 35 are mounted on the control board 30, and a second card edge terminal portion 36 (card edge terminal) that can supply power to these electronic components 33 to 35 and can be inserted into the edge connector socket Co. Part 35) is formed.

{Circle around (2)} The second card edge terminal portion 35 is exposed outside from the sealing resin portion 12. Note that the second card edge terminal portion 35 needs to be formed at least on the second facing surface 31.

The electronic components 23 to 26 and the electronic components 33 to 35 are, for example, transistors, ICs, diodes, and the like. The first card edge terminal 27 and the second card edge terminal 36 face the same direction.

参照 Refer to FIG. The power supply board 20 and the control board 30 are arranged obliquely with reference to parallel lines PL, PL extending parallel to each other. The tilt angle of the power supply board 20 with respect to the parallel line PL is θ1, and the tilt angle of the control board 30 with respect to the parallel line PL is θ2. θ1 and θ2 may be the same angle or may be different. It is desirable that θ1 and θ2 be 0.5 ° to 2.0 °.

距離 The distance from the power supply board 20 to the control board 30 is L1 at each of the

tips

28 and 37. The distance from the power supply board 20 to the control board 30 is L2 near the sealing resin portion 14. Here, L1> L2. The two

circuit boards

20 and 30 are arranged such that the card

edge terminal portions

27 and 36 are opposed to each other while being separated from each other, and the interval between the portions exposed from the sealing resin portion 14 is such that the connection portion 11 is provided. The parts are inclined with respect to each other so as to spread toward the

tip parts

28 and 37 from the part where they are located. That is, the two

circuit boards

20 and 30 are arranged in a tapered shape so that the distance between the two

circuit boards

20 and 30 increases toward the respective card

edge terminal portions

27 and 36.

参照 Refer to FIG. The connection part 11 can employ any components such as a wire, a bus bar, and a flexible wiring.

The sealing resin portion 12 is formed by transfer molding. As a material of the sealing resin portion 12, any resin material such as an epoxy resin, a phenol resin, a melamine resin, an unsaturated polyester, a silicone resin, a polyurethane, and a polypropylene can be used.

参照 Refer to FIG. On the first outer surface 22, the first card edge terminal portion 27 has a plurality of, for example, seven terminals 41.

参照 Refer to FIG. The power supply board 20 is electrically insulative, for example, a glass substrate 51, copper wiring layers 52 and 53 provided on both surfaces of the substrate 51, and an electric insulation covering both surfaces of the substrate 51. Solder resist

layers

54 and 55, and printed

layers

60 and 70 printed on both sides of the solder resist

layers

54 and 55, respectively. The terminal 41 is a part of the wiring layer 52 and is exposed from the solder resist layer 52.

参照 Refer to FIG. The printing layer 60 is a part number of the power supply substrate 20, characters, figures, symbols, and the like for assisting in mounting the electronic components 23 to 26, and is formed by silk printing. In this embodiment, the printing layer 60 includes a symbol 61 indicating the electronic component 21 and a first surrounding portion 62 surrounding each terminal 41.

In a plan view, the first surrounding portion 62 includes a first region 63 extending from an edge of the sealing resin portion 12 to an edge in the short direction of the terminal 41, and a terminal 41 adjacent to the first region 63. , And a third region 65 adjacent to the second region 64 and extending to the tip end portion 28. The first region 63 and the third region 65 have a band shape. The second region 64 has a rectangular shape and is intermittently located between the seven terminals 41 and on the sides thereof.

参照 Refer to FIG. Also on the first facing surface 21, a second surrounding portion 72 surrounding the terminal 42 is formed on the surface of the solder resist layer 55. Further, the second card edge terminal section 36 of the control board 30 has the same configuration. Description is omitted.

(4) The thickness of the wiring layer 52 on the first outer surface 22 side is the same as the thickness of the wiring layer 53 on the first opposing surface 21 side. Similarly, the solder resist

layers

54 and 55 have the same thickness, and the print layers 60 and 70 have the same thickness.

The surface 72 a of the second surrounding portion 72 (print layer 70) is set higher than each terminal 42 in the thickness direction of the power supply board 20. That is, the height H1 to the surface 72a of the second surrounding part 72 is higher than the height H2 to the contact surface 42a of the terminal 42 with reference to the center C in the thickness direction of the power supply board 20 (H1> H2). ).

The second card edge terminal section 36 (FIG. 1B) has the same configuration as the first card edge terminal section 27. That is, the third surrounding portion 67 is provided around the terminal 43 on the second facing surface 31. A fourth surrounding portion 77 is provided on the second outer surface 32 around the terminal 44.

Next, a method for manufacturing the electronic control device will be described.

参照 Refer to FIG. First, the power supply board 20 includes the first card edge terminal section 27, the control board 30 includes the second card edge terminal section 36, and the connection section 11 that connects the power supply board 20 and the control board 30. The main body 13 is prepared.

参照 Refer to FIG. A molding die 80 for molding the sealing resin portion 12 (see FIG. 1A) will be described. The molding die 80 includes a fixed lower die 81, an upper die 82 which is overlapped on the lower die 81 and can move up and down, and slides between the lower die 81 and the upper die 82 in the left-right direction. A slide die 84 whose tip can enter the cavity 83, a first support member 85 extending upward from the lower die 81 to support the power supply board 20, and a control extending upward from the lower die 81 A second support member 86 that supports the board 30, a first urging unit 87 that urges the power supply board 20 toward the slide mold 53, and a second urging unit that urges the control board 30 toward the slide mold 53. And a plunger 89 for heating the resin material 12M to fill the cavity 83.

The length 84a of the end 84a on the cavity 83 side of the slide die 84 is L3, and the length of the end 84b on the opposite side is L4. The length L4 of the end 84b is longer than the length L3 of the end 84a. That is, L3 <L4. The slide die 84 has a tapered shape from the end 84b to the end 84a.

Next, the power supply board 20 and the control board 30 are placed on the

support members

85 and 86, respectively (board placement step).

Next, with the two

circuit boards

20 and 30 arranged, the upper mold 82 is superimposed on the lower mold 81 to form a cavity 83 therein (mold clamping step).

Next, the slide die 84 is moved and fitted between the

card edge terminals

27 and 36 to seal between the card edge terminals 27 and 36 (sealing step).

Next, the urging

portions

87 and 88 are relatively moved in the mold clamping direction, and the

circuit boards

20 and 30 are pressed against the slide mold 84 (pressing step).

参照 Refer to FIG. Next, while the space between the

card edge terminals

25 and 35 is sealed, the cavity 83 is filled with the melted resin material 12M, and the

circuit boards

20 and 30 are sealed with the melted resin material 12M (resin molding process). ).

参照 Referring also to FIG. Finally, after cooling the resin material 12M, the upper mold 82 is separated from the lower mold 81, and the main body 13 sealed with the resin material 12M is taken out from the lower mold (mold releasing step). Thereby, the electronic control unit 10 is obtained.

Next, effects of the embodiment will be described.

参照 Refer to FIG. On the first outer surface 22, each terminal 41 of the first card edge terminal portion 27 is surrounded by an electrically insulating first surrounding portion 62 (printing layer 60). The first facing surface 21 has the same configuration, and a second surrounding portion 72 is provided.

参照 Refer to FIG. The surface of the (print layer 70) of the second surrounding portion 72 is set higher than the contact surface 42a of each terminal 42 with reference to the thickness direction of the power supply substrate 20. Therefore, when the slide mold 84 is fitted between the card

edge terminal portions

27 and 36, the slide mold 84 does not contact each terminal 42 but contacts the second surrounding portion 72. Since the slide mold 84 does not rub against each terminal 42, the quality of the second card edge terminal portion 27 is ensured.

In addition, the second surrounding portion 72 is provided on the surface of the solder resist layer 55 by silk printing. Therefore, when printing the component numbers and the like on the surface of the solder resist layer 55 by silk printing, the second surrounding portion 72 can be additionally provided. The second surrounding portion 72 can be provided without increasing a new process for providing only the second surrounding portion 72.

Referring to FIG. The power supply board 20 and the control board 30 are arranged in a tapered shape so that the distance between the power supply board 20 and the control board 30 increases toward the respective

card edge terminals

27 and 36.
FIG. 3B is also referred to. Therefore, when the slide die 84 is fitted or pulled out between the respective card

edge terminal portions

27 and 36, the slide die 84 moves only slightly and does not contact the second surrounding portion 72. . Therefore, the distance between the slide die 84 and the contact surface 42a of the terminal portion 42 is further increased, so that the quality of the electronic control device can be easily improved.

The present invention is not limited to the embodiments as long as the functions and effects of the present invention are achieved.

電子 The electronic control device of the present invention is suitable for a motorcycle.

10 Electronic control unit 12 Sealing resin part 20 Power supply board (circuit board)
21 ‥ First opposing surface (substrate surface)
22 {first outer surface 27} first card edge terminal 30} control board (circuit board)
31 ‥ second opposing surface (substrate surface)
32 second outer surface 36 second card edge terminal 41 terminal 42 terminal 42a contact surface 51 substrate 52 wiring layer 53 wiring layer 54 solder resist 55 solder resist 60 printing layer 61 {Symbol 62} first enclosing portion 63 first region 64 second region 65 third region 70 printing layer 72 second enclosing portion

Claims

Two circuit boards in which each card edge terminal faces in the same direction and each board surface faces each other;
A plurality of electronic components respectively mounted on the two circuit boards,
A resin sealing member that seals the entire electronic components and the two circuit boards while exposing only the respective card edge terminal portions,
Each of the card edge terminal portions has a plurality of terminals provided on the substrate surface, and an electrically insulating printed layer surrounding each of the terminals,
An electronic control device, wherein a surface of the printed layer is set higher than a contact surface of each terminal in a thickness direction of the circuit board.
The two circuit boards are respectively an electrically insulating plate-shaped substrate, a wiring layer provided on the surface of the substrate, and an electrically insulating solder resist covering the surface of the substrate. And a layer,
The electronic control device according to claim 1, wherein the printing layer is a silk printing layer printed on a surface of the solder resist layer by silk printing.
3. The electronic device according to claim 1, wherein the two circuit boards are arranged in a tapered shape such that a distance between the two circuit boards increases toward each of the card edge terminal portions. 4. Control device.