CN112369129B - Electronic control device - Google Patents
Electronic control device Download PDFInfo
- Publication number
- CN112369129B CN112369129B CN201980044125.5A CN201980044125A CN112369129B CN 112369129 B CN112369129 B CN 112369129B CN 201980044125 A CN201980044125 A CN 201980044125A CN 112369129 B CN112369129 B CN 112369129B
- Authority
- CN
- China
- Prior art keywords
- card
- edge terminal
- substrate
- control device
- electronic control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 238000007789 sealing Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000007650 screen-printing Methods 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention provides a technology capable of ensuring the quality of a card-type edge terminal part. The electronic control device (10) has two circuit boards (20, 30), wherein the card-type edge terminal portions (27, 36) face in the same direction, and the board surfaces (21, 31) face each other. Each card-type edge terminal part (27, 36) has a plurality of terminals (42) provided on the substrate surface and an electrically insulating printed layer (70) surrounding each terminal (42). The surface of the printed layer (70) is set higher than the contact surface (42 a) of each terminal (42) in the thickness direction of the circuit board (20).
Description
Technical Field
The present invention relates to an electronic control device in which two circuit boards are sealed with resin.
Background
Among electronic control devices having a resin sealing structure, there is a so-called card edge connector type electronic control device having a card edge connector that can be inserted into an edge connector socket. The card edge connector is configured by providing a terminal portion as an external connection terminal at an end portion of a circuit board. As such a card edge connector type electronic control device, there is a technology disclosed in patent document 1.
In the electronic control device disclosed in patent document 1, a circuit board is placed in a cavity of a transfer mold composed of a lower mold and an upper mold, and a molten resin material is pressed into the cavity by sandwiching a card-type edge terminal portion of the circuit board between the lower mold and the upper mold, whereby the circuit board is sealed with the resin.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2006-173402
Disclosure of Invention
Problems to be solved by the invention
However, in such an electronic control device, it is sometimes desirable to add a signal transmission system for transmitting signals to the outside. In this case, the number of terminals constituting the card edge terminal portion may be increased. But when the number of terminals is increased, the width of the card-edge terminal portion becomes wider. This is disadvantageous from the viewpoint of miniaturization of the electronic control apparatus. Therefore, there is a limit to increasing the number of card-type edge terminal portions.
Therefore, it is conceivable to separate and dispose the substrate surfaces of the two circuit boards so as to face each other, and seal the entire two circuit boards with a resin sealing member in a state where the respective card edge terminal portions are exposed.
In order to expose the respective card-shaped edge terminal portions, it is necessary to seal the card-shaped edge terminal portions when the molten resin material is flowed into the cavity of the mold. As an example of the sealing method, a method of moving and inserting a slide die between the card edge terminal portions is considered.
In order to prevent the molten resin from leaking from the cavity, it is necessary to closely attach the card edge terminal portions and the slide die. Therefore, when the sliding die moves, friction occurs between the sliding die and each card-type edge terminal portion. Ensuring the quality of each card edge terminal portion against this friction phenomenon is important for improving the quality of the electronic control device.
The invention provides a technology capable of ensuring the quality of a card-type edge terminal part.
Means for solving the problems
According to the invention of claim 1, there is provided an electronic device having:
two circuit boards, wherein the card-type edge terminal parts face the same direction, and the substrate surfaces are opposite to each other;
a plurality of electronic components mounted on the two circuit substrates, respectively; and
A resin sealing member that exposes only the card-type edge terminal portions and seals all of the plurality of electronic components and the two circuit boards,
Each card-type edge terminal part has a plurality of terminals arranged on the substrate surface and an electric insulation printing layer surrounding each terminal,
The surface of the printed layer is set higher than the contact surface of each terminal in the thickness direction of the circuit board.
According to the invention of claim 2, it is preferable that the two circuit boards each have an electrically insulating plate-like base material, a wiring layer provided on a surface of the base material, and an electrically insulating solder resist layer covering a surface of the base material, and the print layer is a screen print layer printed on a surface of the solder resist layer by screen printing.
According to the invention of claim 3, the two circuit boards are arranged in a tapered shape so as to increase the distance between the card-shaped edge terminal portions.
Effects of the invention
In claim 1, each card edge terminal portion has a plurality of terminals provided on the substrate surface and an electrically insulating printed layer surrounding the periphery of each terminal. The surface of the printed layer is set higher than the contact surface of each terminal in the thickness direction of the circuit board. Therefore, when the sliding mold is inserted between the card edge terminal portions, the sliding mold is not in contact with the terminals but in contact with the printed layer. Since friction does not occur between the sliding die and each terminal, the quality of the card edge terminal portion can be ensured.
In claim 2, the print layer is printed on the surface of the solder resist layer by screen printing. Therefore, the printing layer can be provided together when the number of the member is printed on the surface of the solder resist layer by screen printing or the like. The printed layer can be provided around the card edge terminal portion without adding a new step.
In claim 3, the circuit board is arranged in a tapered shape so as to increase the distance between the card-shaped edge terminal portions. Therefore, when the sliding die is inserted into and pulled out from between the respective card edge terminal portions, the sliding die is moved only slightly, and becomes out of contact with the printed layer. Therefore, the distance between the contact surfaces of the sliding die and the terminals can be further increased. The quality of the electronic control device can be easily improved.
Drawings
Fig. 1 (a) is a cross-sectional view of the electronic control device of the embodiment. Fig. 1 (b) is an enlarged view of part 1b of fig. 1 (a).
Fig. 2 (a) is a plan view of the periphery of the card-type edge terminal portion of the electronic control device shown in fig. 1. Fig. 2 (b) is a sectional view taken along line 2b-2b of fig. 2 (a).
Fig. 3 (a) is a diagram illustrating a preparation process of the method for manufacturing the electronic control device shown in fig. 1 (a). Fig. 3 (b) is a diagram illustrating the substrate placement process to the press-fitting process.
Fig. 4 (a) is a diagram illustrating a resin molding step. Fig. 4 (b) is a perspective view of the electronic control device.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description, the term "up and down" refers to up and down with reference to the drawings.
< Example >
Refer to fig. 1 (a). For example, the electronic control unit 10 is mounted on a two-wheeled vehicle, and is inserted into the edge connector socket Co for use.
The electronic control device 10 includes: a power supply substrate 20 (circuit substrate 20); a control board 30 (circuit board 30) disposed opposite to the power board 20; a connection portion 11 for electrically connecting the circuit boards 20 and 30; and a resin sealing resin portion 12 (sealing member 12) for sealing a part of the circuit boards 20 and 30 and the connection portion 11.
The surface of the power supply substrate 20 facing the control substrate 30 is a first facing surface 21 (substrate surface 21). The surface opposite to the first opposing surface 21 is a first outer surface 22. The surface of the control substrate 30 facing the power supply substrate 20 is a second facing surface 31 (substrate surface 31). The surface opposite to the second opposing surface 31 is set as a second outer surface 32.
A plurality of electronic components 23 to 26 are mounted on the power supply board 20, and a first card-type edge terminal portion 27 (card-type edge terminal portion 27) is formed, and the first card-type edge terminal portion 27 can supply power to the electronic components 23 to 26 and can be inserted into the edge connector socket Co.
The first card edge terminal portion 27 is exposed to the outside from the sealing resin portion 12. In addition, the first card edge terminal portion 25 needs to be formed at least on the first opposing surface 21.
A plurality of electronic components 33 to 35 are mounted on the control board 30, and a second card-type edge terminal portion 36 (card-type edge terminal portion 35) is formed, and the second card-type edge terminal portion 36 can supply power to the electronic components 33 to 35 and can be inserted into the edge connector socket Co.
The second card edge terminal portion 35 is exposed to the outside from the sealing resin portion 12. In addition, the second card edge terminal portion 35 needs to be formed at least on the second opposing surface 31.
The electronic components 23 to 26 and the electronic components 33 to 35 are, for example, transistors, ICs (integrated circuits), diodes, and the like. The first card-type edge terminal portion 27 and the second card-type edge terminal portion 36 face in the same direction.
Refer to fig. 1 (b). The power supply substrate 20 and the control substrate 30 are arranged obliquely with reference to parallel lines PL, PL extending parallel to each other. The inclination angle of the power supply substrate 20 with respect to the parallel line PL is θ1, and the inclination angle of the control substrate 30 with respect to the parallel line PL is θ2.θ1 and θ2 may be the same angle or different angles. θ1 and θ2 are preferably 0.5 ° to 2.0 °.
The distance from the power supply substrate 20 to the control substrate 30 is L1 at the front end portions 28, 37 of the power supply substrate 20 and the control substrate 30, respectively. The distance from the power supply substrate 20 to the control substrate 30 is L2 near the sealing resin portion 14. Here, L1 > L2. The two circuit boards 20, 30 are arranged so that the card edge terminal portions 27, 36 face each other while being separated, and the two circuit boards 20, 30 are arranged so that the interval of the portions exposed from the sealing resin portion 14 becomes wider toward the front end portions 28, 37 from the portion where the connection portion 11 is provided. That is, the two circuit boards 20, 30 are arranged in a tapered shape so as to be widened toward the interval between the card-shaped edge terminal portions 27, 36.
Refer to fig. 1 (a). The connection portion 11 may be any member such as a lead, a bus bar, or a flexible wiring.
The sealing resin portion 12 is molded by transfer molding. The material of the sealing resin portion 12 may be any resin material such as epoxy resin, phenolic resin, melamine resin, unsaturated polyester, silicone resin, polyurethane, polypropylene, or the like.
Refer to fig. 2 (a). On the first outer surface 22, the first card-type edge terminal portion 27 has a plurality of, for example, 7 terminals 41.
Refer to fig. 2 (b). The power supply substrate 20 includes: a base material 51 of an electric insulating material such as a glass plate; wiring layers 52, 53 made of copper provided on both surfaces of the base material 51; electrically insulating solder resist layers 54, 55 covering both surfaces of the base material 51; and printed layers 60, 70 printed on both sides of the solder resist layers 54, 55. The terminal 41 is a part of the wiring layer 52, and is exposed from the solder resist layer 52.
Refer to fig. 2 (a). The printed layer 60 is formed by screen printing, and is a product number of the power supply board 20, characters, graphics, symbols, and the like that assist in the mounting operation of the electronic components 23 to 26. In the present embodiment, the printed layer 60 includes a symbol 61 representing the electronic component 21 and a first surrounding portion 62 surrounding each terminal 41.
The first surrounding portion 62 can be divided into: a first region 63 extending from the edge of the sealing resin portion 12 to the edge in the short side direction of the terminal 41, a second region 64 adjacent to the first region 63 and extending to the edge in the short side direction on the opposite side of the terminal 41, and a third region 65 adjacent to the second region 64 and extending to the tip portion 28. The first region 63 and the third region 65 are band-shaped. The second region 64 is rectangular, and is intermittently located between and laterally of the 7 terminals 41.
Refer to fig. 2 (b). In the same manner, the first opposing surface 21 is provided with a second surrounding portion 72 surrounding the terminal 42 on the surface of the solder resist layer 55. The second card edge terminal portion 36 of the control board 30 is also configured in the same manner. The description is omitted.
The thickness of the wiring layer 52 on the first outer surface 22 side is the same as the thickness of the wiring layer 53 on the first opposing surface 21 side. Likewise, the thicknesses of the solder resists 54, 55 are the same, as are the thicknesses of the printed layers 60, 70.
The surface 72a of the second surrounding portion 72 (printed layer 70) is set higher than each terminal 42 in the thickness direction of the power supply substrate 20. That is, the height H1 to the surface 72a of the second surrounding portion 72 is higher than the height H2 to the contact surface 42a of the terminal 42 (H1 > H2) with reference to the center C in the thickness direction of the power supply substrate 20.
The second card-type edge terminal portion 36 (fig. 1 (b)) is also the same structure as the first card-type edge terminal portion 27. That is, the second opposing surface 31 is provided with the third surrounding portion 67 around the terminal 43. A fourth surrounding portion 77 is provided around the terminal 44 on the second outer surface 32.
Next, a method of manufacturing the electronic control device will be described.
Refer to fig. 3 (a). First, a main body 13 is prepared, and the main body 13 is composed of a power supply board 20 having a first card edge terminal portion 27, a control board 30 having a second card edge terminal portion 36, and a connection portion 11 connecting the power supply board 20 and the control board 30.
Refer to fig. 3 (b). A molding die 80 for molding the sealing resin portion 12 (see fig. 1 (a)) will be described. The molding die 80 has: a fixed lower die 81; an upper die 82 which is overlapped with the upper part of the lower die 81 and can move up and down; a slide die 84 that can slide in the left-right direction between the lower die 81 and the upper die 82 and the front end of which can enter the cavity 83; a first support member 85 extending upward from the lower die 81 and supporting the power supply substrate 20; a second support member 86 extending upward from the lower die 81 and supporting the control substrate 30; a first urging portion 87 that urges the power supply substrate 20 toward the slide die 53; a second urging portion 88 that urges the control board 30 toward the slide die 53; and a plunger 89 that heats and fills the resin material 12M into the cavity 83.
The length of the end 84a of the slide die 84 on the cavity 83 side is L3, and the length of the end 84b on the opposite side is L4. The length L4 of the end 84b is longer than the length L3 of the end 84 a. I.e., L3 < L4. The slide die 84 is formed in a tapered shape from the end 84b to the end 84 a.
Next, the power supply substrate 20 and the control substrate 30 are placed on the support members 85, 86, respectively (substrate placement step).
Next, the upper die 82 and the lower die 81 are overlapped with each other in a state where the two circuit boards 20 and 30 are arranged, and a cavity 83 is formed therein (a die clamping step).
Next, the sliding die 84 is moved to fit between the card edge terminal portions 27 and 36, thereby sealing the card edge terminal portions 27 and 36 (sealing step).
Next, the biasing portions 87 and 88 are moved relatively in the mold closing direction, and the circuit boards 20 and 30 are pressed against the slide mold 84 (pressing step).
Refer to fig. 4 (a). Next, the cavity 83 is filled with the molten resin material 12M in a state where the space between the card edge terminal portions 25, 35 is sealed, and the circuit boards 20, 30 are sealed with the molten resin material 12M (resin molding step).
Referring to fig. 4 (b) together. Finally, after the resin material 12M is cooled, the upper die 82 is separated from the lower die 81, and the body portion 13 sealed with the resin material 12M is taken out from the lower die (a demolding step). Thus, the electronic control device 10 is obtained.
Next, effects of the examples will be described.
Refer to fig. 2 (a). In the first outer surface 22, each terminal 41 of the first card edge terminal portion 27 is surrounded by an electrically insulating first surrounding portion 62 (printed layer 60). The first opposing surface 21 has the same structure and is provided with a second surrounding portion 72.
Refer to fig. 2 (b). The surface of the second surrounding portion 72 (the printed layer 70) is set higher than the contact surface 42a of each terminal 42 with reference to the thickness direction of the power supply substrate 20. Therefore, when the slide die 84 is inserted between the card-edge terminal portions 27, 36, the slide die 84 is in contact with the second surrounding portion 72 without being in contact with each terminal 42. The slide mold 84 and each terminal 42 do not rub, and therefore the quality of the second card edge terminal portion 27 can be ensured.
Further, the second surrounding portion 72 is provided on the surface of the solder resist layer 55 by screen printing. Therefore, the second surrounding portion 72 can be provided together when the number of the member is printed on the surface of the solder resist layer 55 by screen printing or the like. The second surrounding portion 72 can be provided without adding a new process for providing only the second surrounding portion 72.
Refer to fig. 1 (b). The power supply board 20 and the control board 30 are arranged in a tapered shape so as to be widened toward the interval between the card edge terminal portions 27 and 36.
Refer to fig. 3 (b) together. Therefore, when the slide die 84 is inserted into the card edge terminal portions 27 and 36 or the slide die 84 is pulled out from the card edge terminal portions 27 and 36, the slide die 84 can be prevented from coming into contact with the second surrounding portion 72 by a slight movement. Therefore, the distance between the slide die 84 and the contact surface 42a of the terminal portion 42 can be further increased, and the quality of the electronic control device can be easily improved.
In addition, the present invention is not limited to the examples as long as the functions and effects of the present invention are exhibited.
Industrial applicability
The electronic control device of the present invention is suitable for use in a two-wheeled vehicle.
Reference numerals
10: An electronic control device;
12: a sealing resin portion;
20: a power supply substrate (circuit substrate);
21: a first opposing surface (substrate surface);
22: a first outer surface;
27: a first card-type edge terminal portion;
30: a control board (circuit board);
31: a second opposing surface (substrate surface);
32: a second outer surface;
36: a second card-type edge terminal portion;
41: a terminal;
42: a terminal;
42a: a contact surface;
51: a substrate;
52: a wiring layer;
53: a wiring layer;
54: a solder resist layer;
55: a solder resist layer;
60: printing a layer;
61: marking;
62: a first surrounding portion;
63: a first region;
64: a second region;
65: a third region;
70: printing a layer;
72: and a second surrounding portion.
Claims (2)
1. An electronic control device, comprising:
two circuit boards, wherein the card-type edge terminal parts face the same direction, and the substrate surfaces are opposite to each other;
a plurality of electronic components mounted on the two circuit substrates, respectively; and
A resin sealing member that exposes only the card-type edge terminal portions and seals all of the plurality of electronic components and the two circuit boards,
Each card-type edge terminal part has a plurality of terminals arranged on the substrate surface and an electric insulation printing layer surrounding each terminal,
The surface of the printed layer is set higher than the contact surface of each terminal in the thickness direction of the circuit substrate,
The two circuit boards are arranged in a tapered shape so as to increase the distance between the card-shaped edge terminal portions.
2. The electronic control device according to claim 1, wherein,
The two circuit boards each have an electrically insulating plate-like base material, a wiring layer provided on a surface of the base material, and an electrically insulating solder resist layer covering a surface of the base material,
The printing layer is a screen printing layer printed on the surface of the solder resist layer by screen printing.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-181736 | 2018-09-27 | ||
| JP2018181736 | 2018-09-27 | ||
| PCT/JP2019/004967 WO2020066053A1 (en) | 2018-09-27 | 2019-02-13 | Electronic control device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112369129A CN112369129A (en) | 2021-02-12 |
| CN112369129B true CN112369129B (en) | 2024-05-24 |
Family
ID=69951279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980044125.5A Active CN112369129B (en) | 2018-09-27 | 2019-02-13 | Electronic control device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7233434B2 (en) |
| CN (1) | CN112369129B (en) |
| WO (1) | WO2020066053A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003329894A (en) * | 2002-05-13 | 2003-11-19 | Sumitomo Electric Ind Ltd | Card edge type optical communication module and optical communication equipment |
| US9769944B2 (en) * | 2015-07-15 | 2017-09-19 | Toshiba Memory Corporation | Semiconductor memory device |
| CN108574157A (en) * | 2017-03-09 | 2018-09-25 | 三菱电机株式会社 | Card edge connector |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5936945Y2 (en) * | 1980-03-19 | 1984-10-12 | 富士通株式会社 | Connection structure between printed boards |
| JPH0644177U (en) * | 1992-11-18 | 1994-06-10 | パロマ工業株式会社 | Printed wiring board |
-
2019
- 2019-02-13 CN CN201980044125.5A patent/CN112369129B/en active Active
- 2019-02-13 WO PCT/JP2019/004967 patent/WO2020066053A1/en active Application Filing
- 2019-02-13 JP JP2020547909A patent/JP7233434B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003329894A (en) * | 2002-05-13 | 2003-11-19 | Sumitomo Electric Ind Ltd | Card edge type optical communication module and optical communication equipment |
| US9769944B2 (en) * | 2015-07-15 | 2017-09-19 | Toshiba Memory Corporation | Semiconductor memory device |
| CN108574157A (en) * | 2017-03-09 | 2018-09-25 | 三菱电机株式会社 | Card edge connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112369129A (en) | 2021-02-12 |
| WO2020066053A1 (en) | 2020-04-02 |
| JPWO2020066053A1 (en) | 2021-12-09 |
| JP7233434B2 (en) | 2023-03-06 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20211228 Address after: Ibaraki Applicant after: Hitachi astemo Co.,Ltd. Address before: Tokyo, Japan Applicant before: KEIHIN Corp. |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant |