JP2022143473A - Electronic apparatus - Google Patents

Abstract

To provide an electronic apparatus, equipped with a circuit board and a connector, in which the connector is connected to the circuit board by a simple method other than soldering.SOLUTION: An electronic apparatus 10 comprises: a first circuit board 30 having a first connection part 50; and a connector 20 having a terminal 28 and a contact keeping part 26. The terminal 28 has a contact part 288. The first connection part 50 has: a first base material layer 52; a first adhesive layer 54 disposed on the first base material layer 52; and first conducting wire 58 wired on the first adhesive layer 54. The contact part 288 of the terminal 28 is located on the first conducting wire 58. The contact keeping part 26 has bonding parts 262 and a coupling part 264. The bonding parts 262 are located on both sides of the contact part 288. The coupling part 264 couples the bonding parts 262 to each other. The bonding parts 262 are bonded to the first adhesive layer 54. The coupling part 264 presses the contact part 288 against the first conducting wire 58.SELECTED DRAWING: Figure 3

Description

The present invention relates to an electronic device that includes a circuit board and a connector.

An electronic device of this type is disclosed, for example, in Japanese Unexamined Patent Application Publication No. 2002-200010.

Referring to FIG. 22, Patent Literature 1 discloses a mobile phone that is an electronic device 90 . The electronic device 90 includes a connector 92 and a sub-board 98, which is a circuit board, in addition to various members (not shown). The connector 92 has a plurality of terminal portions 94 . The sub-board 98 has a rigid base material and is connected to a main board (not shown), which is another circuit board. A terminal portion 94 of the connector 92 is fixed and connected to a sub-board 98 by soldering.

JP 2016-171049 A

When connecting a connector to a circuit board, the connector is often soldered to the circuit board as in Patent Document 1. However, soldering in industrial manufacturing requires laborious processes such as reflow processes.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an electronic device comprising a circuit board and a connector, wherein the connector is connected to the circuit board by a simple method other than soldering.

According to the present invention, as a first electronic device,
An electronic device comprising a first circuit board and a connector,
The first circuit board has a first connection portion,
The first connection portion includes a first base material layer, a first adhesive layer, and at least one first conductor,
The first adhesive layer contains a pressure-sensitive adhesive and is arranged on the first base layer in the vertical direction,
The first conducting wire is wired on the first adhesive layer in the vertical direction,
the connector includes at least one terminal and a contact maintaining portion;
The terminal has a contact portion,
the contact portion is positioned above the first conductor in the vertical direction and is in contact with the first conductor;
The contact maintaining section has an adhesive section,
The bonding portions are positioned on both sides of the contact portion in a horizontal direction perpendicular to the vertical direction,
The adhesive portion is positioned above the first adhesive layer in the vertical direction and is adhered to the first adhesive layer,
The contact maintaining part applies a downward force to the contact part to provide the electronic device that presses the contact part against the first conductor.

Further, according to the present invention, the second electronic device is the first electronic device,
The contact maintaining unit has at least one connecting portion,
The connecting portion connects the bonding portions to each other in the horizontal direction,
The connecting portion is positioned above the contact portion in the vertical direction, and provides the electronic device in which the contact portion is pressed against the first conductor.

Further, according to the present invention, the third electronic device is the first electronic device,
The terminal has an extension,
The extension portion extends upward from the contact portion,
The extension part provides an electronic device fixed to the contact maintaining part on both sides in the horizontal direction.

Further, the present invention provides a third electronic device as a fourth electronic device,
The terminal has two protrusions,
The protrusions protrude outward from the extensions in the horizontal direction, respectively, to provide an electronic device embedded in the contact maintaining part.

Further, according to the present invention, a fifth electronic device is any one of the first to fourth electronic devices,
The first circuit board has a wiring board section in addition to the first connection section,
The wiring board portion includes a base material layer separate from the first base material layer and at least one conductor,
The conducting wire is wired on the base material layer in the vertical direction, and the first circuit board connected to the first conducting wire has a wiring board portion in addition to the first connecting portion. cage,
The wiring board portion includes a base material layer separate from the first base material layer and at least one conductor,
The conducting wire is wired on the base material layer in the vertical direction, and provides an electronic device connected to the first conducting wire.

Further, according to the present invention, a sixth electronic device is any one of the first to fourth electronic devices,
The electronic device comprises a second circuit board separate from the first circuit board,
The second circuit board has a board connection portion,
the board connecting portion comprises a base and at least one board terminal;
The substrate terminal is arranged below the base in the vertical direction,
The first circuit board has a second connection portion in addition to the first connection portion,
The first connection portion and the second connection portion are provided at both ends of the first circuit board,
The second connection portion includes a second base material layer, a second adhesive layer, and at least one second conductor,
The second adhesive layer contains a pressure-sensitive adhesive and is arranged on the second base layer in the vertical direction,
The second conductor is wired on the second adhesive layer in the vertical direction,
The second adhesive layer is positioned below the base of the second circuit board in the vertical direction and is attached to the base,
The second conductive wire is positioned below the board terminal of the second circuit board in the vertical direction and is pressed against the board terminal.

Further, the present invention provides a sixth electronic device as a seventh electronic device,
The first circuit board has a wiring board section in addition to the first connection section and the second connection section,
The wiring board portion is positioned between the first connection portion and the second connection portion,
The wiring board portion includes a base layer separate from both the first base layer and the second base layer, and at least one conductor,
The conducting wire is wired on the base material layer in the vertical direction,
The first lead provides an electronic device connected to the second lead through the lead.

Further, according to the present invention, an eighth electronic device is any one of the first to seventh electronic devices,
the at least one first conductor includes a plurality of the first conductors;
The first conductors are arranged in the horizontal direction,
said at least one terminal includes a plurality of said terminals respectively corresponding to said first conductors;
The terminals are arranged in the horizontal direction,
each of the contact portions of the terminal is positioned above the corresponding first conductor wire in the vertical direction and is in contact with the corresponding first conductor wire;
the at least one connecting portion includes a plurality of connecting portions corresponding to the contact portions;
The adhesive portion of the contact maintaining portion is positioned between all the contact portions in the horizontal direction and is positioned outside two of the contact portions positioned outermost in the horizontal direction. ,
The connecting portion connects all the bonding portions to each other in the horizontal direction,
All of the adhesive portions are adhered to the first adhesive layer,
Each of the connecting portions is positioned above the corresponding contact portion in the vertical direction, and provides an electronic device that presses the corresponding contact portion against the corresponding first conductor.

Further, according to the present invention, a ninth electronic device is any one of the first to eighth electronic devices,
The connector comprises a housing,
The housing holds the terminals and provides an electronic device that is at least partially adhered to the first adhesive layer.

Further, the present invention provides a ninth electronic device as a tenth electronic device,
The adhesion maintaining part provides an electronic device integrally molded with the housing.

Further, according to the present invention, an eleventh electronic device is any one of the first to tenth electronic devices,
The adhesion maintaining portion is made of resin,
The contact portion of the terminal is provided in the electronic device by insert molding into the adhesion maintaining portion.

Further, according to the present invention, a twelfth electronic device is any one of the first to eleventh electronic devices,
The contact portion of the terminal provides an electronic device protruding downward from the adhesive portion.

An electronic device of the present invention includes a first circuit board (circuit board) provided with a first conductor (conductor) and a first adhesive layer (adhesive layer), and a connector provided with a terminal and a contact maintaining portion. there is According to the present invention, when the contact maintaining portion is pressed against the adhesive layer and adhered, the terminal is pressed against and contacts the conductor. That is, according to the electronic device of the present invention, the connector can be connected to the circuit board by a simple method other than soldering.

For example, if an electronic device has a waterproof function, the waterproof function may deteriorate during a reflow process at high temperatures. On the other hand, when manufacturing the electronic device of the present invention, there is no need to provide a reflow process. ADVANTAGE OF THE INVENTION According to this invention, the deterioration of the waterproof function resulting from a reflow process can be prevented.

1 is a perspective view showing an electronic device according to an embodiment of the invention; FIG. 2 is a top view showing the electronic device of FIG. 1; FIG. The hidden outline of the first circuit board and the outline of the retained portion of the terminal embedded in the housing are drawn with dashed lines. 3 is a cross-sectional view showing the electronic device of FIG. 2 along line III-III; FIG. A part of the electronic device (the part surrounded by the dashed line) is enlarged and drawn. 2 is a rear view showing the electronic device of FIG. 1; FIG. FIG. 2 is a bottom view showing a connector of the electronic device of FIG. 1; 6 is a front view of the connector of FIG. 5; FIG. 6 is a rear view of the connector of FIG. 5; FIG. 2 is a perspective view showing a first circuit board and a second circuit board of the electronic device of FIG. 1; FIG. Hidden conductive patterns of the second circuit board are outlined in dashed lines. A portion of the first circuit board (two portions surrounded by broken lines) is drawn in an enlarged manner. 3 is an end view schematically showing the electronic device of FIG. 2 along line IX-IX; FIG. The second connection portion of the first circuit board is adhered to the board connection portion of the second circuit board. 3 is another end view schematically showing the electronic device of FIG. 2 along line IX-IX; FIG. The second connection portion is separated from the substrate connection portion. FIG. 9 is a diagram showing an example of a method of manufacturing the first circuit board of FIG. 8; 3 is a top view showing a modification of the electronic device of FIG. 2; FIG. 13 is a cross-sectional view showing the electronic device of FIG. 12 along line XII-XII; FIG. A part of the electronic device (the part surrounded by the dashed line) is enlarged and drawn. FIG. 13 is a bottom view showing the connector of the electronic device of FIG. 12; 15 is a rear view of the connector of FIG. 14; FIG. FIG. 13 is a perspective view showing a modification of the electronic device of FIG. 12; 17 is a top view showing the electronic device of FIG. 16; FIG. 18 is a cross-sectional view showing the electronic device of FIG. 17 along line XVIII-XVIII; FIG. A part of the electronic device (the part surrounded by the dashed line) is enlarged and drawn. 18 is a cross-sectional view partially showing the electronic device of FIG. 17 along line XIX-XIX; FIG. FIG. 17 is a bottom view showing the connector of the electronic device of FIG. 16; FIG. 19 is a cross-sectional view showing a modification of the electronic device of FIG. 18; 1 is a perspective view showing a part of an electronic device disclosed in Patent Literature 1; FIG.

Referring to FIG. 1, an electronic device 10 according to an embodiment of the invention includes a connector 20, a first circuit board 30, and a second circuit board . The electronic device 10 is mounted inside an electronic device (not shown). The electronic device is not particularly limited, but is, for example, a smart phone. Connector 20 is electrically connected to a mating connector (not shown). The first circuit board 30 electrically connects a mating electronic device (not shown) connected to a mating connector to the second circuit board 70 via the connector 20 . The second circuit board 70 functions according to the counterpart electronic device. Electronic device 10 of the present embodiment functions as described above. However, the present invention is not limited to this, and can be applied to various electronic devices.

Electronic device 10 of the present embodiment includes only connector 20 , first circuit board 30 and second circuit board 70 . The second circuit board 70 is connected to the first circuit board 30 after being formed separately from the first circuit board 30 . In other words, the electronic device 10 includes a second circuit board 70 that is separate from the first circuit board 30 in addition to the first circuit board 30 . However, the present invention is not limited to this. For example, part of the first circuit board 30 may function as the second circuit board 70 . That is, the electronic device 10 may have only the connector 20 and the first circuit board 30 . On the other hand, the electronic device 10 may include other members in addition to the connector 20 , the first circuit board 30 and the second circuit board 70 .

The connector 20 of this embodiment will be described below.

Referring to FIGS. 1 and 6, the connector 20 of this embodiment is a receptacle and can be fitted with a mating connector (not shown) which is a plug. However, the present invention is not limited to this. For example, connector 20 may be a plug. Moreover, the standard and application of the connector 20 are not particularly limited. For example, the connector 20 may be a USB (Universal Serial Bus) connector, or may be a connector that connects to a SIM (Subscriber Identity Module) card.

5 to 7, the connector 20 of this embodiment includes a housing 22 made of an insulator, a metal shell 24, a contact maintaining portion 26 made of an insulator, and a plurality of conductors. A terminal 28 is provided. Housing 22 holds terminals 28 . Shell 24 electromagnetically shields a portion of terminal 28 . Terminal 28 is partially attached to contact maintaining portion 26 .

The connector 20 of this embodiment includes only the members described above. However, the present invention is not limited to this. For example, connector 20 may include other members such as hold-downs in addition to the members described above. On the other hand, the housing 22 and shell 24 may be provided as required. Also, the number of terminals 28 may be one. That is, the connector 20 only needs to have at least one terminal 28 and the contact maintaining portion 26 . At least one terminal 28 may include multiple terminals 28 .

The housing 22 of this embodiment has a main portion 222 , a fixed portion 223 , a fitting portion 224 , a plate-like portion 226 and a waterproof portion 228 .

1 and 5, the main portion 222 is a rear portion of the housing 22 in the front-rear direction. In this embodiment, the front-rear direction is the X direction. Forward is the +X direction and backward is the -X direction. 5 and 7, the fixed portion 223 of the present embodiment is the lower surface of the main portion 222 in the vertical direction perpendicular to the front-rear direction. In this embodiment, the vertical direction is the Z direction. Up is the +Z direction and down is the -Z direction.

1 and 6, the fitting portion 224 has a cylindrical shape extending in the front-rear direction. Referring to FIGS. 1 and 5, mating portion 224 extends forward from main portion 222 . Referring to FIG. 6, the plate-like portion 226 has a flat plate shape parallel to a horizontal plane (XY plane) perpendicular to the vertical direction. , extending forward from the main portion 222 . 1 and 7, the waterproof portion 228 is located at the rear end of the main portion 222. As shown in FIG.

The waterproof part 228 of this embodiment is a solidified adhesive. Specifically, the portion (body portion) of the housing 22 excluding the waterproof portion 228 is formed by molding resin. After forming the main body, an adhesive is injected so as to close the gaps in the main body and solidified, thereby forming the waterproof portion 228 . The housing 22 of this embodiment is waterproofed by the waterproof portion 228 .

The housing 22 of this embodiment has the structure described above. However, the present invention is not limited to this, and the structure of the housing 22 can be variously modified as required. For example, the waterproof section 228 may be provided as required. Moreover, the housing 22 may be a single member, or may be formed by combining a plurality of members.

Referring to FIG. 1, each of the terminals 28 of this embodiment is a single metal plate having a bend. The terminal 28 of this embodiment is insert-molded in the housing 22 . The terminals 28 are arranged in a horizontal direction orthogonal to both the front-back direction and the up-down direction. In this embodiment, the horizontal direction is the Y direction. The terminals 28 of this embodiment are arranged in a row in the horizontal direction. However, the present invention is not limited to this. For example, the terminals 28 may be horizontally arranged in two rows.

In the present embodiment, each of the two terminals 28 (outer terminals 28) positioned on the outer side in the horizontal direction is larger than each of the three terminals 28 (inner terminals 28) positioned on the inner side in the horizontal direction. Specifically, the horizontal size of each of the outer terminals 28 is larger than the horizontal size of each of the inner terminals 28 . However, the present invention is not limited to this. For example, the size of all terminals 28 may be the same as each other.

2 and 6, the terminals 28 of this embodiment have the same structure. More specifically, each terminal 28 has a contact portion 282 (see FIG. 6), a held portion 284 , an extension portion 286 and a contact portion 288 .

Referring to FIG. 6, each contact portion 282 of the terminal 28 is arranged on the plate-like portion 226 of the housing 22 and extends in the front-rear direction. In a mated state in which the connector 20 is mated with a mating connector (not shown), the contact portions 282 come into contact with mating terminals (not shown) of the mating connector, thereby connecting the connector 20 to the mating connector (not shown). It is electrically connected with the side connector.

Referring to FIG. 2, each of the held portions 284 is embedded and held in the main portion 222 and the waterproof portion 228 of the housing 22 . Each of the held portions 284 extends in the front-rear direction. Referring to FIGS. 1 and 2, each extension 286 extends generally downward from the rear end of the held portion 284 . Each contact portion 288 extends rearward from the lower end of the extension portion 286 .

Each of the terminals 28 of this embodiment has the structure described above. However, the present invention is not limited to this. The structure of each terminal 28 can be modified in various ways as required as long as the contact portion 288 is provided.

Referring to FIG. 6, the shell 24 of the present embodiment is positioned inside the fitting portion 224 of the housing 22, and is positioned in a plate-like portion 226 of the housing 22 on a vertical plane (YZ plane) perpendicular to the front-rear direction. surrounds That is, the shell 24 surrounds and electromagnetically shields the contact portion 282 of the terminal 28 in the vertical plane.

1 and 5, the contact maintaining portion 26 of the present embodiment protrudes rearward from the rear end of the main portion 222 of the housing 22. As shown in FIG. The contact maintaining portion 26 has a flat plate shape parallel to the horizontal plane. The contact maintaining portion 26 is positioned near the lower end of the main portion 222 in the vertical direction and extends along the horizontal direction. The contact maintaining portion 26 of this embodiment is integrally molded with the housing 22 . That is, the contact maintaining portion 26 is a part of the housing 22 and is made of the same resin as the housing 22 . However, the present invention is not limited to this. For example, the contact maintaining portion 26 may be a separate member from the housing 22 as described later.

1 and 3, in this embodiment, the contact portion 288 of the terminal 28 is insert-molded into the contact maintaining portion 26 together with the lower end of the extension portion 286 of the terminal 28 . However, the present invention is not limited to this. For example, the contact portion 288 may be fixed to the bottom surface of the contact maintaining portion 26 .

Referring to FIG. 3 , the contact maintaining portion 26 of the present embodiment has a plurality of connecting portions 264 and a plurality of bonding portions 262 . The connecting portions 264 and the bonding portions 262 are arranged alternately in the horizontal direction. Two bonding portions 262 are provided at both ends of the contact maintaining portion 26 in the horizontal direction. In other words, the adhesive portion 262 is horizontally positioned between all the connecting portions 264 and is positioned outside the two horizontally outermost connecting portions 264 . The connecting portion 264 connects all the bonding portions 262 to each other in the horizontal direction.

The connecting portions 264 are provided corresponding to the contact portions 288 of the terminals 28, respectively. Each of the connecting portions 264 is positioned above the corresponding contact portion 288 in the vertical direction. In other words, the portion of the contact maintaining portion 26 that is positioned above the contact portion 288 is the connection portion 264 , and the portion that is not positioned above the contact portion 288 is the bonding portion 262 . In this embodiment, each contact portion 288 is partially embedded inside the contact maintaining portion 26 . However, the present invention is not limited to this. For example, the top surface of each contact portion 288 may be flush with the bottom surface of the contact maintaining portion 26 .

The contact maintaining portion 26 of the present embodiment has two or more connecting portions 264 and three or more bonding portions 262 . However, the present invention is not limited to this. For example, when the number of terminals 28 is one, the contact maintaining portion 26 may have one connecting portion 264 and two bonding portions 262 . That is, the contact maintaining portion 26 may have at least one connecting portion 264 and at least two bonding portions 262 . At least one connecting portion 264 may connect at least two bonding portions 262 to each other in the horizontal direction. Also, the at least one connecting portion 264 may include a plurality of connecting portions 264 each corresponding to the contact portion 288 of the terminal 28 .

The second circuit board 70 (see FIG. 8) of this embodiment will be described below.

Referring to FIG. 8, the second circuit board 70 of the present embodiment is an FPC (Flexible Printed Circuit) and has flexibility. That is, the second circuit board 70 is easily bent. However, the present invention is not limited to this. For example, the second circuit board 70 may be a rigid (that is, hard to bend) circuit board.

The second circuit board 70 of this embodiment includes a base portion 72 and a plurality of conductive patterns 78 . The base 72 is a thin film member made of resin such as polyimide. Each conductive pattern 78 is a thin sheet of metal such as copper and is formed on the underside of base 72 . The conductive patterns 78 are arranged horizontally and extend in the front-rear direction. The second circuit board 70 of this embodiment includes only the base portion 72 and the conductive pattern 78 formed as described above. However, the present invention is not limited to this. For example, the second circuit board 70 may have electronic components (not shown) connected to the conductive patterns 78 .

The second circuit board 70 has board connection portions 80 . The board connecting portion 80 of the present embodiment is the front end portion of the second circuit board 70 . Accordingly, the board connection portion 80 includes the base portion 72 . Further, the board connection portion 80 includes a plurality of board terminals 88 . Each of the board terminals 88 in this embodiment is the front end of the conductive pattern 78 . The board terminal 88 is arranged below the base portion 72 in the vertical direction. However, the present invention is not limited to this. For example, each of the substrate terminals 88 may be made of a different metal than the conductive pattern 78 and may be connected to the conductive pattern 78 .

The board connecting portion 80 of the present embodiment includes two or more board terminals 88 corresponding to the terminals 28 (see FIG. 1) of the connector 20 (see FIG. 1). However, the present invention is not limited to this. For example, if the number of terminals 28 is one, the number of substrate terminals 88 may be one. In other words, the board connecting portion 80 may be provided with at least one board terminal 88 . The at least one substrate terminal 88 may include multiple substrate terminals 88 .

The first circuit board 30 of this embodiment will be described below.

1 and 2, the first circuit board 30 of this embodiment has a wiring board portion 40, a first connection portion 50, and a second connection portion 60. As shown in FIG. The first connection portion 50 and the second connection portion 60 are provided at both ends of the first circuit board 30 in the front-rear direction. The wiring board portion 40 is positioned between the first connection portion 50 and the second connection portion 60 in the front-rear direction.

The first connecting portion 50 is a portion connected to the connector 20 . The second connecting portion 60 is a portion connected to the second circuit board 70 . The wiring board portion 40 is a portion that connects the first connection portion 50 and the second connection portion 60 to each other. The first circuit board 30 of the present embodiment has a second connection portion 60 in addition to the first connection portion 50 . Further, the first circuit board 30 of the present embodiment has the wiring board portion 40 in addition to the first connection portion 50 and the second connection portion 60 . However, the present invention is not limited to this. For example, the wiring board portion 40 and the second connection portion 60 may be provided as required. Moreover, when the electronic device 10 does not include the second circuit board 70, the wiring board section 40 may include a circuit (not shown) including necessary electronic components.

The first circuit board 30 of the present embodiment can be manufactured, for example, by the manufacturing method described below.

Referring to FIG. 11, first, in the preparation process, the main member 40X which is FPC, the first member 50X including the first base layer 52 and the first adhesive layer 54, the second base layer 62 and the second adhesive A second member 60X comprising a layer 64 is prepared.

The main member 40X includes a base material layer 42X and a plurality of conductors 48X. The base material layer 42X is a thin film member made of resin such as polyimide. Each of the conductors 48X is a thin sheet of metal such as copper, and is formed on the upper surface of the base layer 42X. The conducting wires 48X are horizontally aligned and extend in the front-rear direction between the front and rear ends of the base layer 42X.

When preparing the first member 50X, first, a thin film member is formed from a resin such as polyethylene terephthalate (PET) and used as the first base material layer 52 . Next, a resin material containing a pressure-sensitive adhesive is placed on the first base material layer 52 to form the first adhesive layer 54 . Materials such as polyester, polyurethane, acrylic, epoxy, phenol, silicone, polyolefin, polyimide, vinyl, and natural polymers can be used as the resin material.

The second member 60X is manufactured and prepared in the same manner as the first member 50X. Specifically, first, a thin film member is formed from a resin such as PET and used as the second base material layer 62 . Next, a second adhesive layer 64 is formed on the second base material layer 62 . Like the first adhesive layer 54, the second adhesive layer 64 is made of a resin material containing a pressure-sensitive adhesive.

In the processing step after the preparation step, the base layer 42X of the main member 40X is processed to form the base layer 43X. More specifically, a portion of the base material layer 42X located in front of the virtual deletion line 492X is removed while leaving a portion under the conductor 48X. In addition, the portion of the base material layer 42X located behind the imaginary deletion line 494X is removed while leaving the portion under the conductor 48X.

As a result of the processing step, a front conductor 482X and a rear conductor 484X are formed. The front conductor 482X protrudes forward from the front end of the base layer 43X. The rear conductor 484X protrudes rearward from the rear end of the base layer 43X. Each of the front conductors 482X includes the remainder of the base layer 42X fixed to the lower surface in addition to the front portion of the conductor 48X. Each of the rear conductors 484X includes the remainder of the base layer 42X fixed to the lower surface in addition to the rear portion of the conductor 48X. However, the drawings other than FIG. 11 do not show the rest of the base material layer 42X described above. For example, in FIGS. 9 and 10, the boundary between the rear portion of the conductor 48X of the rear conductor 484X and the remainder of the base layer 42X is not drawn, but is shown collectively as the second conductor 68. there is

Referring to FIG. 11, in the assembly process after the processing process, the front conductor 482X is pressed against the upper surface of the first adhesive layer 54 of the first member 50X. As a result, the front conductor 482X is adhered and fixed to the first adhesive layer 54. As shown in FIG. Also, the rear conductive wire 484X is pressed against the upper surface of the second adhesive layer 64 of the second member 60X. As a result, the rear conducting wire 484X is adhered and fixed to the second adhesive layer 64 .

Referring to FIG. 8 together with FIG. 11, the first connecting portion 50 of the present embodiment is formed of a first member 50X and a front conductor 482X adhered to the first member 50X. The second connecting portion 60 of the present embodiment is formed of a second member 60X and a rear conductive wire 484X adhered to the second member 60X. The wiring board portion 40 of the present embodiment is formed of an intermediate portion of the base layer 42X and an intermediate portion of the conductive wire 48X formed on the upper surface of the base layer 42X.

Referring to FIG. 8, the first connection portion 50, the second connection portion 60, and the wiring board portion 40 of the present embodiment are connected without gaps in the front-rear direction. In addition, the lower surface of the first base material layer 52 and the lower surface of the second base material layer 62 are at the same position in the vertical direction. On the other hand, the base material layer 42X (see FIG. 11) is thinner than each of the first member 50X (see FIG. 11) and the second member 60X (see FIG. 11). It is positioned above the lower surfaces of the base material layer 52 and the second base material layer 62 . In addition, the top surface of the first adhesive layer 54 is positioned below the top surface of the base material layer 42 by the thickness of the remainder of the base material layer 42X in the front conductor 482X (see FIG. 11). Similarly, the top surface of the second adhesive layer 64 is located below the top surface of the base layer 42 by the thickness of the remainder of the base layer 42X at the rear conductor 484X (see FIG. 11).

The first connection portion 50 of the present embodiment includes a first base material layer 52 , a first adhesive layer 54 and a plurality of first conductors 58 . Each of the first conductors 58 in this embodiment is a front conductor 482X (see FIG. 11).

The first base material layer 52 is a thin film member made of resin such as PET, as described above. The first adhesive layer 54 is arranged on the first base material layer 52 in the vertical direction. The first adhesive layer 54 contains a pressure sensitive adhesive and is elastically deformable. Each of the first conductors 58 is composed of a thin resin layer (remainder of the base layer 42X shown in FIG. 11) and a thin metal sheet on the resin layer (a portion on the front side of the conductor 48X shown in FIG. 11). Each of the first conducting wires 58 is wired on the first adhesive layer 54 in the vertical direction. Also, each of the first conductors 58 protrudes upward from the first adhesive layer 54 . The first conducting wires 58 are arranged horizontally and extend in the front-rear direction.

The first connecting portion 50 of the present embodiment has the structure described above and is flexible. That is, the first connecting portion 50 is easily bent. However, as long as the first connecting portion 50 includes the first base material layer 52, the first adhesive layer 54, and the first conducting wire 58, the structure of the first connecting portion 50 can be variously modified as necessary. . For example, the first base material layer 52 may be a rigid (that is, hard to bend) substrate.

1 and 2, the first connecting portion 50 of this embodiment includes two or more first conductors 58 corresponding to the terminals 28 of the connector 20, respectively. However, the present invention is not limited to this. For example, if the number of terminals 28 is one, the number of first conductors 58 may be one. That is, the first connecting portion 50 only needs to have at least one first conductor 58 . The at least one first conductor 58 may include multiple first conductors 58 . Also, the at least one terminal 28 may include a plurality of terminals 28 each corresponding to the first conductor 58 .

Referring to FIG. 8, the second connecting portion 60 of the present embodiment includes a second base material layer 62, a second adhesive layer 64, and a plurality of second conductors 68. As shown in FIG. Each of the second conductors 68 of the present embodiment is a rear conductor 484X (see FIG. 11).

The second base material layer 62 is a thin film member made of resin such as PET as described above. The second adhesive layer 64 is arranged on the second base material layer 62 in the vertical direction. The second adhesive layer 64 contains a pressure sensitive adhesive and is elastically deformable. Each of the second conductors 68 consists of a thin resin layer (remaining portion of the base layer 42X shown in FIG. 11) and a thin metal sheet on the resin layer (the rear portion of the conductor 48X shown in FIG. 11). Each of the second conductors 68 is wired on the second adhesive layer 64 in the vertical direction. Also, each of the second conductors 68 protrudes upward from the second adhesive layer 64 . The second conducting wires 68 are arranged horizontally and extend in the front-rear direction.

The second connecting portion 60 of the present embodiment has the structure described above and is flexible. That is, the second connecting portion 60 is easily bent. However, as long as the second connecting portion 60 includes the second base material layer 62, the second adhesive layer 64, and the second conducting wire 68, the structure of the second connecting portion 60 can be variously modified as necessary. . For example, the second base material layer 62 may be a rigid (that is, hard to bend) substrate.

Referring to FIGS. 1 and 2 together with FIG. 8, the second connection portions 60 of the present embodiment correspond to the terminals 28 of the connector 20, respectively, and the conductive patterns 78 of the second circuit board 70, respectively. It is provided with two or more second conductors 68 that connect to each other. However, the present invention is not limited to this. For example, if the number of terminals 28 and the number of conductive patterns 78 are one, the number of second conductors 68 may be one. That is, the second connection portion 60 only needs to have at least one second conductor 68 . The at least one second conductor 68 may include multiple second conductors 68 .

Referring to FIG. 8, the wiring board portion 40 of the present embodiment is FPC as described above and has flexibility. That is, the wiring board portion 40 is easily bent. However, the present invention is not limited to this. For example, the wiring board section 40 may be a rigid (that is, hard to bend) circuit board.

The wiring board section 40 of the present embodiment includes a base material layer 42 and a plurality of conducting wires 48 . Each of the conductors 48 in this embodiment is an intermediate portion of the conductor 48X (see FIG. 11). The base material layer 42 is a thin film member made of resin such as polyimide. Each of the conductors 48 is a thin sheet of metal and is formed on the top surface of the substrate layer 42 . That is, the conducting wire 48 is laid on the base material layer 42 in the vertical direction. The conducting wires 48 are arranged in a horizontal direction and extend along the front-rear direction. The wiring board portion 40 of the present embodiment has the structure described above. However, the present invention is not limited to this, and the structure of the wiring substrate section 40 can be variously modified as required. For example, the wiring board section 40 may include an insulating cover (not shown) that covers the conductors 48 from above.

Referring to FIGS. 1 and 2 together with FIG. 8, the wiring board portion 40 of the present embodiment corresponds to the terminals 28 of the connector 20 and the conductive patterns 78 of the second circuit board 70 respectively. Two or more conductors 48 are provided. However, the present invention is not limited to this. For example, if the number of terminals 28 and the number of conductive patterns 78 are one, the number of conductors 48 may be one. In other words, the wiring substrate section 40 may be provided with at least one conducting wire 48 . The at least one conductor 48 may include multiple conductors 48 .

Referring to FIG. 8, the first base layer 52 and the first adhesive layer 54 of the first connection portion 50 of the present embodiment are formed separately from the base layer 42 of the wiring board portion 40 as described above. After that, it is combined with the wiring board portion 40 . Similarly, the second base material layer 62 and the second adhesive layer 64 of the second connection portion 60 of the present embodiment are formed separately from the base material layer 42 and then combined with the wiring board portion 40. . That is, the wiring board portion 40 of the present embodiment includes the base material layer 42 that is separate from both the first base material layer 52 and the second base material layer 62 . However, the present invention is not limited to this. For example, each of the wiring board portion 40, the first connection portion 50, and the second connection portion 60 may be part of a single member integrally formed with each other. That is, the wiring board section 40 may have the same adhesive layer as the first connection section 50 and the second connection section 60 .

In this embodiment, the conductors 48 of the wiring board section 40 correspond to the first conductors 58 of the first connection section 50 and the second conductors 68 of the second connection section 60 respectively. . Each of the conductors 48 connects with a corresponding first conductor 58 and with a corresponding second conductor 68 . In other words, each of the first conductors 58 is connected to the corresponding second conductor 68 via the corresponding conductor 48 . In particular, in this embodiment, the conductors 48, the first conductors 58 and the second conductors 68, which correspond to each other, are single wires that are integrally formed with each other. Specifically, the first conductor 58 is the leading end of the single wire and the second conductor 68 is the trailing end of the single wire. Conductor 48 is the middle section of a single wire. However, the present invention is not limited to this. For example, the conductors 48, the first conductors 58 and the second conductors 68 corresponding to each other may be formed separately from each other and then connected to each other.

A connection structure between the first circuit board 30 and the second circuit board 70 according to the present embodiment will be described below.

Referring to FIGS. 9 and 10 together with FIG. 4, the board connecting portion 80 of the second circuit board 70 is pressed against the second connecting portion 60 of the first circuit board 30 from above, thereby providing the second connection. Affixed to the portion 60 .

Specifically, first, when the substrate connecting portion 80 and the second connecting portion 60 in the state of FIG. in the vertical direction. At this time, the second adhesive layer 64 is elastically deformed so as to protrude upward beyond the upper surface of the second conductor 68 in the region where the second conductor 68 does not exist along the vertical direction. According to the present embodiment, as shown in FIG. 9, the elastically deformed second adhesive layer 64 forms a gap between the second conductive wires 68 adjacent to each other in the horizontal direction and the substrates adjacent to each other in the horizontal direction. The gaps between the terminals 88 are filled. The second adhesive layer 64 filled in the gap reaches the bottom surface of the base portion 72 and adheres to the bottom surface of the base portion 72 . That is, the second adhesive layer 64 adheres to the base portion 72 by the action of the pressure-sensitive adhesive in the region where the second conductive wire 68 does not exist along the vertical direction.

Here, when the pressure that presses the board connection portion 80 and the second connection portion 60 against each other is released, the portion of the second adhesive layer 64 that was located under the second lead wire 68 and was compressed is restored by elastic restoring force. It elastically deforms to recover its thickness in the vertical direction. Along with this elastic deformation, the portion of the second adhesive layer 64 that has been adhered to the base portion 72 is elastically deformed so as to be stretched beyond its natural length in the vertical direction. The board terminal 88 and the second lead wire 68 are pressed against each other by the elastic restoring force of the vertically stretched second adhesive layer 64 that tends to shrink in the vertical direction as described above, and are stabilized. come into direct contact. As a result, the first circuit board 30 is stably electrically connected to the second circuit board 70 .

To summarize the above description, according to the present embodiment, the substrate terminals 88 and the second conducting wires 68 are connected simply by pressing the substrate connecting portion 80 of the second circuit substrate 70 against the second connecting portion 60 of the first circuit substrate 30 . are in contact with each other. According to the electronic device 10 of the present embodiment, the second circuit board 70 can be connected to the first circuit board 30 by a simple method without using other members. However, the present invention is not limited to this. For example, the second circuit board 70 may be connected to the first circuit board 30 using a board-to-board connector. In this case, the second connecting portion 60 of the present embodiment may not be provided.

A connection structure between the connector 20 (see FIG. 1) and the first circuit board 30 according to the present embodiment will be described below.

Referring to FIG. 3 , the terminals 28 of the connector 20 are pressed against the first connecting portion 50 of the first circuit board 30 from above, and are thereby attached to the first connecting portion 50 . Specifically, according to the present embodiment, when the connector 20 is pressed against the first connecting portion 50, the first adhesive layer 54 of the first connecting portion 50 adheres to the second connecting portion 60 (see FIG. 9). 2 Similar to the elastic deformation of the adhesive layer 64 (see FIG. 9), the gap between the contact portions 288 of the terminals 28 adjacent to each other in the horizontal direction and the gap between the first conductors 58 adjacent to each other in the horizontal direction It is adhered to the contact maintaining portion 26 of the connector 20 while being elastically deformed so as to be buried.

At this time, the contact portion 288 of the at least one terminal 28 is positioned above the at least one first conductor 58 in the vertical direction and is in contact with the at least one first conductor 58 . In particular, when the number of terminals 28 is two or more, each contact portion 288 is positioned above the corresponding first conductor wire 58 of the first connection portion 50 in the vertical direction. are in contact with

At least one connecting portion 264 of the contact maintaining portion 26 is positioned above at least one contact portion 288 of the first connecting portion 50 in the vertical direction. The at least two adhesive portions 262 of the contact maintaining portion 26 are positioned on both sides of the at least one contact portion 288 in the horizontal direction. The at least two adhesive portions 262 are positioned above the first adhesive layer 54 of the first connection portion 50 in the vertical direction and are attached to the first adhesive layer 54 . At least two bonded portions 262 bonded in this way apply downward force to at least one connecting portion 264 . As a result, the at least one coupling portion 264 presses the at least one contact portion 288 onto the at least one first conductor 58 of the first connection portion 50 .

In particular, when the number of terminals 28 is two or more, the bonding portion 262 of the contact maintaining portion 26 is positioned horizontally between all the contact portions 288 and is positioned on the outermost two sides in the horizontal direction. outside of the two contact portions 288 . All of the adhesive portions 262 are adhered to the first adhesive layer 54 of the first connecting portion 50 and apply downward force to the connecting portion 264 of the contact maintaining portion 26 . As a result, each connecting portion 264 presses the corresponding contact portion 288 against the corresponding first conductor 58 .

To summarize the above description, according to the present embodiment, when the contact maintaining portion 26 is pressed against the first adhesive layer 54 of the first connection portion 50 and adhered, the contact maintaining portion 26 is downwardly attached to the contact portion 288 . A force is applied to press the contact portion 288 of the terminal 28 against the first conductor 58 . In particular, the connection portion 264 of the contact maintaining portion 26 according to the present embodiment applies a direct downward force to the contact portion 288 . In other words, when the contact maintaining portion 26 is pressed against the first adhesive layer 54 of the first connecting portion 50 to adhere, the terminal 28 is pressed against the first conductor 58 by the contact maintaining portion 26 and contacts. That is, according to the electronic device 10 of this embodiment, the connector 20 can be connected to the first circuit board 30 by a simple method other than soldering.

According to this embodiment, the contact maintaining portion 26 and the first connecting portion 50 of the connector 20 are firmly fixed to each other by the first adhesive layer 54 . Also, the contact portion 288 of the terminal 28 and the first lead wire 58 are pressed against each other by the restoring force of the elastically deformed first adhesive layer 54 and stably come into contact with each other. As a result, the connector 20 is stably electrically connected to the first circuit board 30 . 4, the connector 20 is electrically and stably connected to the second circuit board 70 through the first circuit board 30. As shown in FIG.

Referring to FIG. 3, according to this embodiment, each contact portion 288 of terminal 28 projects downwardly from adhesive portion 262 . According to this structure, the amount of elastic deformation of the first adhesive layer 54 that is adhered to the adhesive portion 262 and stretched in the vertical direction is increased. That is, the elastic restoring force of the elastically deformed first adhesive layer 54 increases, and each of the contact portions 288 can be strongly pressed against the corresponding first conducting wire 58 . However, the present invention is not limited to this. For example, each contact portion 288 may be completely embedded within the contact maintaining portion 26 . Each contact portion 288 may be recessed upward from the adhesive portion 262 .

Referring to FIG. 3 together with FIG. 5 , the bottom surface of the main portion 222 of the housing 22 (that is, the fixed portion 223 ) is flush with the bottom surface of the contact maintaining portion 26 . When the connector 20 is pressed against the first connecting portion 50 , the fixed portion 223 is adhered to the first adhesive layer 54 of the second connecting portion 60 . That is, the housing 22 of this embodiment is at least partially adhered to the first adhesive layer 54 . The fixed portion 223 of the present embodiment is a flat plane parallel to the horizontal plane, and has a large size on the horizontal plane. According to this embodiment, the connector 20 can be more firmly fixed to the first connecting portion 50 .

However, the present invention is not limited to the present embodiment described above. For example, if the terminal 28 can be prevented from being detached from the first connecting portion 50 only by adhering the contact maintaining portion 26 to the first adhesive layer 54, the fixed portion 223 need not be provided. Moreover, the size of the fixed portion 223 in the horizontal plane may be set as necessary.

Referring to FIG. 3, in the present embodiment, the horizontal size (width dimension) of the first conductor 58 is the same as the horizontal size (width dimension) of the contact portion 288 . However, the present invention is not limited to this. For example, the width dimension of the first conductor 58 may be larger than the width dimension of the contact portion 288 . On the other hand, the width dimension of the first conductor 58 may be smaller than the width dimension of the contact portion 288 . In this case, the relatively narrow first conductor 58 may be positioned in the middle of the relatively wide contact portion 288 in the horizontal direction. According to this structure, the first adhesive layer 54 adheres to the adhesive portion 262 and to both sides of the lower surface of the contact portion 288 in the horizontal direction.

Referring to FIG. 1 , electronic device 10 of the present embodiment has a waterproof function by waterproof section 228 . If the terminal 28 is soldered to the first lead wire 58, the waterproof part 228 will partially melt and deform during the reflow process at high temperature, and the gap between the terminal 28 and the waterproof part 228 and the housing will be deformed. 22, a gap may occur between the main portion 222 and the waterproof portion 228. As a result, the waterproof function may deteriorate. On the other hand, when manufacturing the electronic device 10 of the present embodiment, there is no need to provide a reflow process. According to this embodiment, it is possible to prevent the waterproof function from deteriorating due to the reflow process.

Referring to FIG. 1 in conjunction with FIG. 8, each of the first adhesive layer 54 of the first connection portion 50 and the second adhesive layer 64 of the second connection portion 60 are cured by UV light in addition to the pressure sensitive adhesive. It may contain a resin component. Moreover, if the connector 20 does not have a waterproof function, each of the first adhesive layer 54 and the second adhesive layer 64 may contain a heat-hardening resin component in addition to the pressure-sensitive adhesive. In this case, after fixing the connector 20 and the second circuit board 70 to the first circuit board 30, the first adhesive layer 54 and the second adhesive layer 64 may be cured by irradiation with ultraviolet light or heating. When the first adhesive layer 54 and the second adhesive layer 64 are cured, the connector 20 and the second circuit board 70 can be fixed to the first circuit board 30 more firmly. On the other hand, if the first adhesive layer 54 and the second adhesive layer 64 are not cured, the first circuit board 30 can be easily peeled off from the connector 20 and the second circuit board 70 and replaced.

This embodiment can be modified in various ways in addition to the various modifications already described.

For example, comparing FIG. 12 with FIG. 2, the electronic device 10A according to the first modification includes the same first circuit board 30 and second circuit board 70 as the electronic device 10, while the connector 20 of the electronic device 10 It has a different connector 20A. 14 and 15 with FIGS. 5 and 7, the connector 20A has a housing 22A different from the housing 22 of the connector 20 and a contact maintaining part 26A different from the contact maintaining part 26 of the connector 20. As shown in FIG. Connector 20A has the same structure as connector 20 except for this difference.

26 A of contact maintenance parts of this modification are housing 22A and a separate member. The housing 22A has a main portion 222A. The contact maintaining portion 26A is separated from the main portion 222A and positioned in front of the main portion 222A. In other words, the main portion 222A is not connected to the contact maintaining portion 26A. The housing 22A has the same structure as the housing 22 except for this difference.

The contact maintaining portion 26A has a structure similar to that of the contact maintaining portion 26. As shown in FIG. More specifically, referring to FIGS. 14 and 15, the contact maintaining portion 26A has a plurality of connecting portions 264A corresponding to the contact portions 288 of the terminals 28 and a plurality of bonding portions 262A. The bonding portion 262A is positioned between all the contact portions 288 in the horizontal direction, and is positioned outside the two contact portions 288 positioned on the outermost side in the horizontal direction. 264 A of connection parts mutually connect all the adhesion parts 262A in the horizontal direction.

Housing 22A, terminals 28 and contact maintainers 26A can be combined in a variety of ways. For example, the terminals 28 may be press-fitted into the housing 22A after the terminals 28 are insert-molded into the contact maintaining portion 26A. On the other hand, the contact maintaining portion 26A may be fixed onto the contact portion 288 of the terminal 28 after the terminal 28 is insert-molded into the housing 22A.

Referring to FIG. 13 , when the connector 20A is pressed against the first connection portion 50, the first adhesive layer 54 of the first connection portion 50 spreads between the contact portions 288 of the horizontally adjacent terminals 28 and It is adhered to the contact maintaining portion 26A of the connector 20A while being elastically deformed so as to fill the gaps between the first conductors 58 adjacent to each other in the horizontal direction. At this time, each of the connecting portions 264A is positioned above the corresponding contact portion 288 in the vertical direction. Further, the adhesive portion 262A is entirely adhered to the first adhesive layer 54 and applies downward force to the connection portion 264 of the contact maintaining portion 26 . As a result, each connecting portion 264A presses the corresponding contact portion 288 against the corresponding first conducting wire 58 . As can be understood from the above description, this modification can also provide the same effects as the above-described embodiment.

Comparing FIGS. 16 and 17 with FIG. 12, the electronic device 10B according to the second modification includes a connector 20B different from the connector 20A of the electronic device 10A. The connector 20B has a contact maintaining portion 26B and a terminal 28B which are different from the contact maintaining portion 26A and the terminal 28 of the connector 20A.

17, 18 and 20, the contact maintaining portion 26B has a plurality of bonding portions 262B. Each of the bonding portions 262B has the same structure as the bonding portion 262A (see FIG. 13) of the contact maintaining portion 26A (see FIG. 13), except that the size in the vertical direction and the size in the horizontal plane are large. Also, the bonding portion 262B is arranged in the same manner as the bonding portion 262A.

18-20, terminal 28B has an extension 286 similar to terminal 28 (see FIG. 1), while contact portion 288B differs from contact portion 288 of terminal 28 (see FIG. 14). have. The contact portion 288B of this modified example is the lower end surface of the extension portion 286 . The extension portion 286 extends upward from the contact portion 288B. The extension part 286 is molded to the contact maintenance part 26B, is covered with the contact maintenance part 26B in the horizontal plane, and is fixed to the contact maintenance part 26B. That is, the extended portion 286 is fixed to the contact maintaining portion 26B on both sides in the horizontal direction. Except for the differences described above, the electronic device 10B has the same structure as the electronic device 10A (see FIG. 12).

Referring to FIG. 18, when the connector 20B is pressed against the first connection portion 50, the first adhesive layer 54 of the first connection portion 50 is elastically deformed in the same manner as the connector 20A (see FIG. 13), and the connector 20B contacts the connector 20B. It is adhered to the retaining portion 26B. At this time, the contact maintaining portion 26B indirectly applies downward force to the contact portion 288B via the extension portion 286, and presses the contact portion 288B of the terminal 28B against the first conductor wire 58. As shown in FIG. As can be understood from the above description, according to this modification, the connection portion 264 (see FIG. 3) and the connection portion 264A (see FIG. 13) that apply a force directly downward to the contact portion 288B are provided. The same effects as those of the above-described embodiment and the first modification can be obtained without providing them.

Comparing FIG. 21 with FIG. 18, the electronic device 10C according to the third modification includes a connector 20C different from the connector 20B of the electronic device 10B. Connector 20C has terminals 28C that differ from terminals 28B of connector 20B. Each of the terminals 28C has two protrusions 287C. The protruding portions 287C protrude horizontally outward from the extension portion 286 and are embedded in the contact maintaining portion 26B. Except for the differences described above, the electronic device 10C has the same structure as the electronic device 10B.

As can be understood from the above description, this modification also provides the same effects as the second modification described above. In addition, according to this modified example, downward force can be applied more reliably to the contact portion 288B. However, the present invention is not limited to this. For example, the projecting portion 287C may be provided as required. Alternatively, the extension portion 286 may be fixed to the contact maintaining portion 26B only on both sides in the horizontal direction.

10, 10A, 10B, 10C Electronic device 20, 20A, 20B, 20C Connector 22, 22A Housing 222, 222A Main part 223 Fixed part 224 Fitting part 226 Plate-like part 228 Waterproof part 24 Shell 26, 26A, 26B Contact maintenance Sections 262, 262A, 262B Bonding Sections 264, 264A Connecting Sections 28, 28B, 28C Terminals 282 Contact Sections 284 Held Sections 286 Extensions 287C Protruding Sections 288, 288B Contact Sections 30 First Circuit Board 40 Wiring Board Section 42 Base Layer 48 conducting wire 50 first connecting portion 52 first base material layer 54 first adhesive layer 58 first conducting wire 60 second connecting portion 62 second base material layer 64 second adhesive layer 68 second conducting wire 40X main member 42X, 43X base material Layer 48X Conductor 482X Front Conductor 484X Rear Conductor 492X, 494X Delete Line 50X First Member 60X Second Member 70 Second Circuit Board 72 Base 78 Conductive Pattern 80 Board Connector 88 Board Terminal

Claims (12)

An electronic device comprising a first circuit board and a connector,
The first circuit board has a first connection portion,
The first connection portion includes a first base material layer, a first adhesive layer, and at least one first conductor,
The first adhesive layer contains a pressure-sensitive adhesive and is arranged on the first base layer in the vertical direction,
The first conducting wire is wired on the first adhesive layer in the vertical direction,
the connector includes at least one terminal and a contact maintaining portion;
The terminal has a contact portion,
the contact portion is positioned above the first conductor in the vertical direction and is in contact with the first conductor;
The contact maintaining section has an adhesive section,
The bonding portions are positioned on both sides of the contact portion in a horizontal direction perpendicular to the vertical direction,
The adhesive portion is positioned above the first adhesive layer in the vertical direction and is adhered to the first adhesive layer,
The electronic device, wherein the contact maintaining section applies downward force to the contact section and presses the contact section against the first conductor. The electronic device according to claim 1,
The contact maintaining section has a connecting section,
The connecting portion connects the bonding portions to each other in the horizontal direction,
The electronic device, wherein the connecting portion is positioned above the contact portion in the vertical direction and presses the contact portion against the first conductor. The electronic device according to claim 1,
The terminal has an extension,
The extension portion extends upward from the contact portion,
The electronic device, wherein the extension portion is fixed to the contact maintaining portion on both sides in the horizontal direction. The electronic device according to claim 3,
The terminal has two protrusions,
The electronic device according to claim 1, wherein the projecting portions each project outward in the horizontal direction from the extension portion and are embedded in the contact maintaining portion. The electronic device according to any one of claims 1 to 4,
The first circuit board has a wiring board section in addition to the first connection section,
The wiring board portion includes a base material layer separate from the first base material layer and at least one conductor,
The electronic device, wherein the conducting wire is wired on the base material layer in the vertical direction and is connected to the first conducting wire. The electronic device according to any one of claims 1 to 4,
The electronic device comprises a second circuit board separate from the first circuit board,
The second circuit board has a board connection portion,
the board connecting portion comprises a base and at least one board terminal;
The substrate terminal is arranged below the base in the vertical direction,
The first circuit board has a second connection portion in addition to the first connection portion,
The first connection portion and the second connection portion are provided at both ends of the first circuit board,
The second connection portion includes a second base material layer, a second adhesive layer, and at least one second conductor,
The second adhesive layer contains a pressure-sensitive adhesive and is arranged on the second base layer in the vertical direction,
The second conductor is wired on the second adhesive layer in the vertical direction,
The second adhesive layer is positioned below the base of the second circuit board in the vertical direction and is attached to the base,
The electronic device, wherein the second conducting wire is positioned below the board terminal of the second circuit board in the vertical direction and is pressed against the board terminal. The electronic device according to claim 6,
The first circuit board has a wiring board section in addition to the first connection section and the second connection section,
The wiring board portion is positioned between the first connection portion and the second connection portion,
The wiring board portion includes a base layer separate from both the first base layer and the second base layer, and at least one conductor,
The conducting wire is wired on the base material layer in the vertical direction,
The electronic device, wherein the first conducting wire is connected to the second conducting wire through the conducting wire. The electronic device according to any one of claims 1 to 7,
the at least one first conductor includes a plurality of the first conductors;
The first conductors are arranged in the horizontal direction,
said at least one terminal includes a plurality of said terminals respectively corresponding to said first conductors;
The terminals are arranged in the horizontal direction,
each of the contact portions of the terminal is positioned above the corresponding first conductor wire in the vertical direction and is in contact with the corresponding first conductor wire;
The adhesive portion of the contact maintaining portion is positioned between all the contact portions in the horizontal direction and is positioned outside two of the contact portions positioned outermost in the horizontal direction. ,
The electronic device in which all of the adhesive portions are adhered to the first adhesive layer. The electronic device according to any one of claims 1 to 8,
The connector comprises a housing,
The electronic device, wherein the housing holds the terminals and is at least partially adhered to the first adhesive layer. The electronic device according to claim 9,
The electronic device, wherein the adhesion maintaining part is integrally molded with the housing. The electronic device according to any one of claims 1 to 10,
The adhesion maintaining portion is made of resin,
The electronic device, wherein the contact portion of the terminal is insert-molded into the adhesion maintaining portion. The electronic device according to any one of claims 1 to 11,
The electronic device, wherein the contact portion of the terminal protrudes downward from the adhesive portion.

Images