JP2015008137A - 印刷した導電性インクのシート抵抗を改良する方法 - Google Patents
印刷した導電性インクのシート抵抗を改良する方法 Download PDFInfo
- Publication number
- JP2015008137A JP2015008137A JP2014123738A JP2014123738A JP2015008137A JP 2015008137 A JP2015008137 A JP 2015008137A JP 2014123738 A JP2014123738 A JP 2014123738A JP 2014123738 A JP2014123738 A JP 2014123738A JP 2015008137 A JP2015008137 A JP 2015008137A
- Authority
- JP
- Japan
- Prior art keywords
- ink
- substrate
- conductive
- printing
- printed pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
Description
Claims (8)
- 印刷したパターンを基材の上に作成する方法であって、
導電性材料、熱可塑性バインダーおよび溶媒で構成される導電性インクを用い、基材の上にパターンを印刷することと、
印刷したパターンを硬化させることと、
熱可塑性バインダーのガラス転移温度より約20℃〜約130℃高い温度、最低でも少なくとも120℃、約50psi〜約1500psiの圧力、融合システムを通る供給速度が約1m/分〜約100m/分で操作される融合システムを通り、表面に印刷したパターンを含む基材を供給することによって、印刷したパターンを融合させることとを含む、方法。 - 導電性材料は、平均粒径が約0.5〜約15ミクロンであり、アスペクト比が少なくとも約3対1である導電性粒状物である、請求項1に記載の方法。
- 導電性材料は、平均粒径が約2〜約10ミクロンである銀フレークである、請求項2に記載の方法。
- 熱可塑性バインダーは、以下の式
- 融合が少なくとも約130℃の温度で行われる、請求項1に記載の方法。
- 硬化と融合を同時に行う、請求項1に記載の方法。
- 融合システムは、少なくとも1対の加熱したフューザーロールを備えている、請求項1に記載の方法。
- 印刷したパターンと接触している少なくとも1対のうち1個のフューザーロールが、その表面に除去可能な剥離層を含み、および/またはフッ素化材料で構成される表面を有する、請求項7に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/925,438 | 2013-06-24 | ||
US13/925,438 US9374907B2 (en) | 2013-06-24 | 2013-06-24 | Method of improving sheet resistivity of printed conductive inks |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015008137A true JP2015008137A (ja) | 2015-01-15 |
JP2015008137A5 JP2015008137A5 (ja) | 2017-07-20 |
JP6185886B2 JP6185886B2 (ja) | 2017-08-23 |
Family
ID=52010650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014123738A Expired - Fee Related JP6185886B2 (ja) | 2013-06-24 | 2014-06-16 | 印刷した導電性インクのシート抵抗を改良する方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9374907B2 (ja) |
JP (1) | JP6185886B2 (ja) |
KR (1) | KR102071082B1 (ja) |
CN (1) | CN104228377B (ja) |
DE (1) | DE102014211908A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017026717A3 (ko) * | 2015-08-13 | 2017-05-11 | 주식회사 네패스 | 친환경 수계 전도성 잉크 조성물 및 이를 포함하는 전도성 펜 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2871029A1 (en) * | 2013-11-08 | 2015-05-08 | National Research Council Of Canada | Improving properties of printed conductive tracks |
US10272709B2 (en) | 2015-01-23 | 2019-04-30 | Hewlett-Packard Development Company, L.P. | Coated print media |
US20170233541A1 (en) * | 2016-02-12 | 2017-08-17 | Tyco Electronics Corporation | Method of Enhancing Adhesion of Silver Nanoparticle Inks on Plastic Substrates Using a Crosslinked Poly(vinyl butyral) Primer Layer |
JP6924203B2 (ja) | 2016-03-24 | 2021-08-25 | フエロ コーポレーション | 導電性ペースト、及び導電性トレースの形成方法 |
KR102551046B1 (ko) | 2016-09-02 | 2023-07-04 | 다우 글로벌 테크놀로지스 엘엘씨 | 높은 내소수성 및 높은 내친수성을 갖는 코팅 조성물 |
US20180255637A1 (en) * | 2017-03-01 | 2018-09-06 | Microsoft Technology Licensing, Llc | Printing electrically conductive ink on fabric |
US20190059158A1 (en) * | 2017-08-17 | 2019-02-21 | Avery Dennison Retail Information Services, Llc | Use of rf driven coherence between conductive particles for rfid antennas |
EP3749124A4 (en) | 2018-02-13 | 2021-04-28 | Liquid X Printed Metals, Inc. | ELECTRONIC TEXTILES MANUFACTURED USING CONDUCTIVE PARTICLE-FREE INKS |
CN108717933B (zh) * | 2018-04-08 | 2021-02-26 | 湖北光安伦芯片有限公司 | 一种光敏树脂bcb的固化方法 |
CN109659682B (zh) * | 2018-12-13 | 2020-11-20 | 江苏南通海之升电子商务有限公司 | 一种通讯天线生产工艺 |
CN111276790A (zh) * | 2020-03-31 | 2020-06-12 | 西安理工大学 | 一种提升丝网印刷rfid读写器天线性能的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008531810A (ja) * | 2005-03-04 | 2008-08-14 | インクテック カンパニー リミテッド | 導電性インク組成物及びこの製造方法 |
JP2012041534A (ja) * | 2010-08-20 | 2012-03-01 | Xerox Corp | 機械特性が向上した高導電性部分のための銀ナノ粒子インク組成物 |
Family Cites Families (11)
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JP3123195B2 (ja) * | 1992-04-15 | 2001-01-09 | ミノルタ株式会社 | インクジェット用記録液 |
JP2005530313A (ja) * | 2002-06-14 | 2005-10-06 | ハイピリオン カタリシス インターナショナル インコーポレイテッド | 導電性カーボンフィブリル系インキ及び塗料 |
JP5071105B2 (ja) | 2005-03-11 | 2012-11-14 | 東洋インキScホールディングス株式会社 | 導電性インキ、導電回路、及び非接触型メディア |
EP1917111B1 (en) * | 2005-08-24 | 2015-01-21 | A.M. Ramp & Co. GmbH | Process for producing articles having an electrically conductive coating |
EP2752470A1 (en) * | 2006-08-07 | 2014-07-09 | Inktec Co., Ltd. | Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same |
US20100231672A1 (en) * | 2009-03-12 | 2010-09-16 | Margaret Joyce | Method of improving the electrical conductivity of a conductive ink trace pattern and system therefor |
US8911823B2 (en) * | 2010-05-03 | 2014-12-16 | Pen Inc. | Mechanical sintering of nanoparticle inks and powders |
JP6185229B2 (ja) * | 2011-11-04 | 2017-08-23 | ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー | 電気伝導性ペースト用有機媒体 |
US9245664B2 (en) | 2011-12-02 | 2016-01-26 | E I Du Pont De Nemours And Company | Conductive metal ink |
TWI448521B (zh) * | 2011-12-07 | 2014-08-11 | Ind Tech Res Inst | 導電漿料 |
US8767378B2 (en) * | 2012-11-02 | 2014-07-01 | E I Du Pont De Nemours And Company | Electrically conductive paste composition |
-
2013
- 2013-06-24 US US13/925,438 patent/US9374907B2/en active Active
-
2014
- 2014-06-16 JP JP2014123738A patent/JP6185886B2/ja not_active Expired - Fee Related
- 2014-06-16 KR KR1020140072667A patent/KR102071082B1/ko active IP Right Grant
- 2014-06-16 CN CN201410267457.9A patent/CN104228377B/zh not_active Expired - Fee Related
- 2014-06-20 DE DE102014211908.1A patent/DE102014211908A1/de not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008531810A (ja) * | 2005-03-04 | 2008-08-14 | インクテック カンパニー リミテッド | 導電性インク組成物及びこの製造方法 |
JP2012041534A (ja) * | 2010-08-20 | 2012-03-01 | Xerox Corp | 機械特性が向上した高導電性部分のための銀ナノ粒子インク組成物 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017026717A3 (ko) * | 2015-08-13 | 2017-05-11 | 주식회사 네패스 | 친환경 수계 전도성 잉크 조성물 및 이를 포함하는 전도성 펜 |
Also Published As
Publication number | Publication date |
---|---|
CN104228377B (zh) | 2017-03-15 |
CN104228377A (zh) | 2014-12-24 |
JP6185886B2 (ja) | 2017-08-23 |
KR20150000823A (ko) | 2015-01-05 |
US20140377454A1 (en) | 2014-12-25 |
US9374907B2 (en) | 2016-06-21 |
KR102071082B1 (ko) | 2020-01-29 |
DE102014211908A1 (de) | 2014-12-24 |
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