JP2014524597A5 - - Google Patents
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- Publication number
- JP2014524597A5 JP2014524597A5 JP2014526352A JP2014526352A JP2014524597A5 JP 2014524597 A5 JP2014524597 A5 JP 2014524597A5 JP 2014526352 A JP2014526352 A JP 2014526352A JP 2014526352 A JP2014526352 A JP 2014526352A JP 2014524597 A5 JP2014524597 A5 JP 2014524597A5
- Authority
- JP
- Japan
- Prior art keywords
- regions
- processing step
- wafer
- layer
- spacer wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 16
- 125000006850 spacer group Chemical group 0.000 claims 10
- 230000003287 optical effect Effects 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 8
- 239000000463 material Substances 0.000 claims 6
- 230000005856 abnormality Effects 0.000 claims 5
- 238000003801 milling Methods 0.000 claims 4
- 238000000608 laser ablation Methods 0.000 claims 3
- 238000005520 cutting process Methods 0.000 claims 2
- 238000003754 machining Methods 0.000 claims 2
- 239000002861 polymer material Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000003247 decreasing effect Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000012780 transparent material Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161527355P | 2011-08-25 | 2011-08-25 | |
| US61/527,355 | 2011-08-25 | ||
| PCT/CH2012/000201 WO2013026175A1 (en) | 2011-08-25 | 2012-08-24 | Wafer-level fabrication of optical devices with front focal length correction |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014524597A JP2014524597A (ja) | 2014-09-22 |
| JP2014524597A5 true JP2014524597A5 (https=) | 2015-09-24 |
| JP6282225B2 JP6282225B2 (ja) | 2018-02-21 |
Family
ID=46969906
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014526352A Active JP6282225B2 (ja) | 2011-08-25 | 2012-08-24 | 前方焦点距離訂正を有する光学装置のウェハレベルの製作 |
| JP2014526351A Active JP6223975B2 (ja) | 2011-08-25 | 2012-08-24 | 光学装置の、特にコンピュテーショナルカメラ用モジュールのウェハレベルの製作 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014526351A Active JP6223975B2 (ja) | 2011-08-25 | 2012-08-24 | 光学装置の、特にコンピュテーショナルカメラ用モジュールのウェハレベルの製作 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US10444477B2 (https=) |
| EP (2) | EP2748854B1 (https=) |
| JP (2) | JP6282225B2 (https=) |
| KR (2) | KR102056501B1 (https=) |
| CN (2) | CN103890948B (https=) |
| SG (4) | SG2014008726A (https=) |
| TW (3) | TWI620310B (https=) |
| WO (2) | WO2013026175A1 (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130122247A1 (en) * | 2011-11-10 | 2013-05-16 | Omnivision Technologies, Inc. | Spacer Wafer For Wafer-Level Camera And Method For Manufacturing Same |
| US9595553B2 (en) | 2012-11-02 | 2017-03-14 | Heptagon Micro Optics Pte. Ltd. | Optical modules including focal length adjustment and fabrication of the optical modules |
| KR101873132B1 (ko) | 2013-11-22 | 2018-06-29 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 컴팩트 광전자 모듈들 |
| US9977153B2 (en) | 2014-02-07 | 2018-05-22 | Heptagon Micro Optics Pte. Ltd. | Stacks of arrays of beam shaping elements including stacking, self-alignment and/or self-centering features |
| SG11201606706WA (en) * | 2014-02-18 | 2016-09-29 | Heptagon Micro Optics Pte Ltd | Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules |
| US10371954B2 (en) | 2014-06-10 | 2019-08-06 | Ams Sensors Singapore Pte. Ltd. | Optoelectronic modules including hybrid arrangements of beam shaping elements, and imaging devices incorporating the same |
| US9711552B2 (en) * | 2014-08-19 | 2017-07-18 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
| US9507143B2 (en) | 2014-09-19 | 2016-11-29 | Intel Corporation | Compact illumination system |
| SG11201702556TA (en) | 2014-10-14 | 2017-04-27 | Heptagon Micro Optics Pte Ltd | Optical element stack assemblies |
| US20160307881A1 (en) * | 2015-04-20 | 2016-10-20 | Advanced Semiconductor Engineering, Inc. | Optical sensor module and method for manufacturing the same |
| EP3276957A4 (en) | 2015-05-12 | 2018-02-28 | Samsung Electronics Co., Ltd. | Image encoding method and device for sample value compensation and image decoding method and device for sample value compensation |
| WO2016191142A2 (en) | 2015-05-27 | 2016-12-01 | Verily Life Sciences Llc | Nanophotonic hyperspectral/lightfield superpixel imager |
| JP6619174B2 (ja) * | 2015-07-31 | 2019-12-11 | ソニーセミコンダクタソリューションズ株式会社 | 製造装置および方法 |
| WO2017023211A1 (en) * | 2015-08-06 | 2017-02-09 | Heptagon Micro Optics Pte. Ltd. | Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules |
| DE102015215833A1 (de) | 2015-08-19 | 2017-02-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Multiaperturabbildungsvorrichtung mit Optiksubstrat |
| EP3374815B1 (en) | 2015-11-12 | 2022-09-28 | Heptagon Micro Optics Pte. Ltd. | Optical element stack assemblies |
| KR20170073910A (ko) | 2015-12-21 | 2017-06-29 | 에스케이하이닉스 주식회사 | 라이트 필드 이미징 장치 및 그 제조방법 |
| DE102016200285A1 (de) * | 2016-01-13 | 2017-07-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Multiaperturabbildungsvorrichtung, Abbildungssystem und Verfahren zum Erfassen eines Objektbereichs |
| CN108941932A (zh) * | 2017-05-23 | 2018-12-07 | 东莞东阳光科研发有限公司 | 人工晶体制备方法 |
| US10677964B2 (en) * | 2017-10-23 | 2020-06-09 | Omnivision Technologies, Inc. | Lens wafer assembly and associated method for manufacturing a stepped spacer wafer |
| CN113366359B (zh) | 2019-03-12 | 2022-11-15 | 奥林巴斯株式会社 | 内窥镜用摄像装置及内窥镜 |
| WO2021153629A1 (ja) * | 2020-01-30 | 2021-08-05 | 古河電気工業株式会社 | 光モジュールおよび光学装置 |
| US11664399B2 (en) * | 2021-02-01 | 2023-05-30 | Visera Technologies Company Limited | Solid-state image sensor |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5232549A (en) * | 1992-04-14 | 1993-08-03 | Micron Technology, Inc. | Spacers for field emission display fabricated via self-aligned high energy ablation |
| DE10058305A1 (de) * | 2000-11-24 | 2002-06-06 | Wacker Siltronic Halbleitermat | Verfahren zur Oberflächenpolitur von Siliciumscheiben |
| EP1362247B1 (en) * | 2001-02-09 | 2012-03-28 | DigitalOptics Corporation East | Compensation and/or variation of wafer level produced lenses and resultant structures |
| WO2004027880A2 (en) | 2002-09-17 | 2004-04-01 | Koninklijke Philips Electronics N.V. | Camera device, method of manufacturing a camera device, wafer scale package |
| DE102005002545A1 (de) | 2005-01-19 | 2006-07-20 | Airbus Deutschland Gmbh | Energiepuffereinrichtung für ein Flugzeug |
| US8053705B2 (en) * | 2005-09-07 | 2011-11-08 | Purdue Research Foundation | Laser assisted machining process with distributed lasers |
| JP2007110588A (ja) * | 2005-10-17 | 2007-04-26 | Funai Electric Co Ltd | 複眼撮像装置 |
| CN101009779B (zh) * | 2006-01-24 | 2010-06-16 | 采钰科技股份有限公司 | 高精密度成像控制的影像感应模块 |
| US7721564B2 (en) | 2006-11-21 | 2010-05-25 | B/E Aerospace, Inc. | Wild frequency avionic refrigeration system and controller therefor |
| US7692256B2 (en) * | 2007-03-23 | 2010-04-06 | Heptagon Oy | Method of producing a wafer scale package |
| US7812869B2 (en) * | 2007-05-11 | 2010-10-12 | Aptina Imaging Corporation | Configurable pixel array system and method |
| JP5580207B2 (ja) * | 2007-11-27 | 2014-08-27 | ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッド | ウェハ・スケール・パッケージおよびその製作方法、ならびに光学デバイスおよびその製作方法 |
| US20090159200A1 (en) * | 2007-12-19 | 2009-06-25 | Heptagon Oy | Spacer element and method for manufacturing a spacer element |
| US8610823B2 (en) | 2007-12-19 | 2013-12-17 | Heptagon Micro Optics Pte. Ltd. | Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor |
| TWI478808B (zh) * | 2007-12-19 | 2015-04-01 | Heptagon Micro Optics Pte Ltd | 製造光學元件的方法 |
| US8319301B2 (en) * | 2008-02-11 | 2012-11-27 | Omnivision Technologies, Inc. | Self-aligned filter for an image sensor |
| EP2265978A1 (en) * | 2008-03-27 | 2010-12-29 | Tessera North America, Inc. | Optical device including at least one replicated surface and associated methods |
| WO2010074743A1 (en) * | 2008-12-22 | 2010-07-01 | Tessera North America, Inc. | Focus compensation for thin cameras |
| WO2010108041A1 (en) | 2009-03-18 | 2010-09-23 | Artificial Muscle, Inc. | Wafer level optical system |
| JP2011018974A (ja) * | 2009-07-07 | 2011-01-27 | Renesas Electronics Corp | Ｄ／ａコンバータ |
| US8193599B2 (en) * | 2009-09-02 | 2012-06-05 | Himax Semiconductor, Inc. | Fabricating method and structure of a wafer level module |
| US8059341B2 (en) * | 2009-09-23 | 2011-11-15 | Visera Technologies Company Limited | Lens assembly and method for forming the same |
| US8885257B2 (en) * | 2009-10-20 | 2014-11-11 | Flir Systems Trading Belgium Bvba | Focus compensation for optical elements and applications thereof |
| WO2011049635A1 (en) | 2009-10-20 | 2011-04-28 | Tessera North America, Inc. | Focus compensation for optical elements and applications thereof |
| EP2502115A4 (en) | 2009-11-20 | 2013-11-06 | Pelican Imaging Corp | RECORDING AND PROCESSING IMAGES THROUGH A MONOLITHIC CAMERA ARRAY WITH HETEROGENIC IMAGE CONVERTER |
| WO2011156928A2 (en) | 2010-06-14 | 2011-12-22 | Heptagon Oy | Camera, and method of manufacturing a plurality of cameras |
-
2012
- 2012-08-24 CN CN201280052514.0A patent/CN103890948B/zh active Active
- 2012-08-24 WO PCT/CH2012/000201 patent/WO2013026175A1/en not_active Ceased
- 2012-08-24 JP JP2014526352A patent/JP6282225B2/ja active Active
- 2012-08-24 CN CN201280052516.XA patent/CN103890949B/zh active Active
- 2012-08-24 KR KR1020147007081A patent/KR102056501B1/ko active Active
- 2012-08-24 WO PCT/CH2012/000200 patent/WO2013026174A2/en not_active Ceased
- 2012-08-24 SG SG2014008726A patent/SG2014008726A/en unknown
- 2012-08-24 JP JP2014526351A patent/JP6223975B2/ja active Active
- 2012-08-24 EP EP12768696.2A patent/EP2748854B1/en active Active
- 2012-08-24 US US14/239,362 patent/US10444477B2/en active Active
- 2012-08-24 KR KR1020147007074A patent/KR101966480B1/ko not_active Expired - Fee Related
- 2012-08-24 US US14/239,334 patent/US20140307081A1/en not_active Abandoned
- 2012-08-24 SG SG10201606882XA patent/SG10201606882XA/en unknown
- 2012-08-24 SG SG2014008718A patent/SG2014008718A/en unknown
- 2012-08-24 EP EP12768695.4A patent/EP2748853B1/en active Active
- 2012-08-24 SG SG10201606884TA patent/SG10201606884TA/en unknown
- 2012-08-27 TW TW105134073A patent/TWI620310B/zh not_active IP Right Cessation
- 2012-08-27 TW TW101131007A patent/TWI567956B/zh not_active IP Right Cessation
- 2012-08-27 TW TW101131008A patent/TWI582969B/zh active
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