JP2014523128A - 反転型メタモルフィック多接合(imm)太陽電池セル及び関連する製作方法 - Google Patents
反転型メタモルフィック多接合(imm)太陽電池セル及び関連する製作方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 103
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 103
- 239000010703 silicon Substances 0.000 claims abstract description 103
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims description 44
- 239000002184 metal Substances 0.000 claims description 44
- 239000006117 anti-reflective coating Substances 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- 238000005304 joining Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 11
- 238000007740 vapor deposition Methods 0.000 description 7
- 239000002131 composite material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 5
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/184—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
- H01L31/1852—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising a growth substrate not being an AIIIBV compound
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/043—Mechanically stacked PV cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0687—Multiple junction or tandem solar cells
- H01L31/06875—Multiple junction or tandem solar cells inverted grown metamorphic [IMM] multiple junction solar cells, e.g. III-V compounds inverted metamorphic multi-junction cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
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- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
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- Crystallography & Structural Chemistry (AREA)
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Abstract
Description
本開示の実施形態について一般的用語でこれまで説明してきたが、次に、寸法通りには必ずしも描かれていない添付の図面を参照することとする。
Claims (17)
- 反転型メタモルフィック多接合(inverted metamorphic multi−junction:IMM)太陽電池セルを製作する方法であって:
第1サブセルを仮基板の上に形成することと、
前記第1サブセルよりも小さいバンドギャップを有する第2サブセルを前記第1サブセルの上に形成することと、
前記第2サブセルをシリコンサブセルに接合することと、
前記仮基板を除去することと、
を含む、方法。 - 第1格子状金属層を前記第2サブセルの上に形成することと、
第2格子状金属層を前記シリコンサブセルの上に形成することとを更に含み、
前記第2サブセルを前記シリコンサブセルに接合することは、金属間接合部を、前記第2サブセル及び前記シリコンサブセルの前記第1格子状金属層と前記第2格子状金属層との間に設けることを含む、請求項1に記載の方法。 - 反射防止コーティングを、前記第1格子状金属層のグリッド群の間の前記第2サブセルの露出部分の上に堆積させることと、
反射防止コーティングを、前記第2格子状金属層のグリッド群の間の前記シリコンサブセルの露出部分の上に堆積させることと
を更に含む、請求項2に記載の方法。 - 前記仮基板を除去した後に、電気コンタクトを前記第1サブセルの上に形成することを更に含む、請求項1に記載の方法。
- 反射防止コーティングを、前記第1サブセルの露出部分の上に堆積させることを更に含む、請求項4に記載の方法。
- 前記シリコンサブセルの周辺部分が前記第1及び第2サブセルを超えて突出するように、前記第1及び第2サブセルよりも大きい面積を有する前記シリコンサブセルを設けることを更に含む、請求項1に記載の方法。
- 前記第1サブセルを形成することは、n/p接合を前記第1サブセル内に形成することを含み、そして前記第2サブセルを形成することは、n/p接合を前記第2サブセル内に形成することを含む、請求項1に記載の方法。
- 前記第2サブセルを前記シリコンサブセルに接合する前に、n/p接合を前記シリコンサブセル内に形成することを更に含む、請求項1に記載の方法。
- 反転型メタモルフィック多接合(inverted metamorphic multi−junction:IMM)太陽電池セルを製作する方法であって:
GaInPにより構成される第1サブセルを形成することと、
0≦x≦0.1とした場合に、InxGa1−xAsからなり、かつ前記第1サブセルよりも小さいバンドギャップを有する第2サブセルを前記第1サブセルの上に形成することと、
第1格子状金属層を前記第2サブセルの上に形成することと、
第2格子状金属層をシリコンサブセルの上に有する前記シリコンサブセルを設けることと、
金属間接合部を、前記第2サブセル及び前記シリコンサブセルの前記第1格子状金属層と前記第2格子状金属層との間に設けることと
を含む、方法。 - 前記第1サブセルを形成することは、前記第1サブセルを、GaAsまたはGeからなる仮基板の上に形成することを含み、そして前記方法は、前記金属間接合部を設けた後に、前記仮基板を除去することを更に含む、請求項9に記載の方法。
- 前記シリコン基板を設けることは、前記第2格子状金属層を形成し、そして反射防止コーティングを、前記第2格子状金属層のグリッド群の間の前記シリコンサブセルの露出部分の上に堆積させることを含む、請求項9に記載の方法。
- 前記金属間接合部を設けた後に、電気コンタクトを前記第1サブセルの上に形成することを更に含む、請求項9に記載の方法。
- 前記第1サブセルを形成することは、n/p接合を前記第1サブセル内に形成することを含み、前記第2サブセルを形成することは、n/p接合を前記第2サブセル内に形成することを含み、そして前記シリコン基板を設けることは、前記金属間接合部を設ける前に、n/p接合を前記シリコンサブセル内に形成することを含む、請求項9に記載の方法。
- 第1及び第2サブセルであって、前記第1サブセルが前記第2サブセルの上に配置され、そして前記第2サブセルが前記第1サブセルよりも小さいバンドギャップを有する、前記第1及び第2サブセルと、
前記第1及び第2サブセルをシリコンサブセルの上に支持する前記シリコンサブセルと、
前記シリコンサブセルと前記第2サブセルとの間の金属間接合部と
を備える、反転型メタモルフィック多接合(IMM)太陽電池セル。 - 前記金属間接合部は、前記第2サブセルの上の第1格子状金属層と、そして前記シリコンサブセルの上の第2格子状金属層と、を備える、請求項14に記載の反転型メタモルフィック多接合(IMM)太陽電池セル。
- 前記シリコンサブセルは、前記第1及び第2サブセルよりも大きい面積を有することにより、前記シリコンサブセルの周辺部分が、前記第1及び第2サブセルを超えて突出する、請求項14に記載の反転型メタモルフィック多接合(IMM)太陽電池セル。
- 前記第1サブセルはGaInPにより構成され、前記第2サブセルは、0≦x≦0.1とした場合に、InxGa1−xAsにより構成され、そして前記第1サブセル、前記第2サブセル、及び前記シリコンサブセルの各サブセルは、該当するn/p接合を有する、請求項14に記載の反転型メタモルフィック多接合(IMM)太陽電池セル。
Applications Claiming Priority (3)
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US13/176,325 US9184332B2 (en) | 2011-07-05 | 2011-07-05 | Inverted metamorphic multi-junction (IMM) solar cell and associated fabrication method |
US13/176,325 | 2011-07-05 | ||
PCT/US2012/040917 WO2013006243A2 (en) | 2011-07-05 | 2012-06-05 | Inverted metamorphic multi-junction (imm) solar cell and associated fabrication method |
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JP2014523128A true JP2014523128A (ja) | 2014-09-08 |
JP5972369B2 JP5972369B2 (ja) | 2016-08-17 |
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US (1) | US9184332B2 (ja) |
JP (1) | JP5972369B2 (ja) |
DE (1) | DE112012002841B4 (ja) |
SG (1) | SG195232A1 (ja) |
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US9018020B2 (en) * | 2013-05-24 | 2015-04-28 | The Boeing Company | Shunt treatment in inverted and wafer bonded solar cells |
US9425331B2 (en) * | 2014-08-06 | 2016-08-23 | The Boeing Company | Solar cell wafer connecting system |
US20170330986A1 (en) * | 2016-05-12 | 2017-11-16 | North Carolina State University | Intermetallic bonded multi-junction structures |
CN113964225A (zh) * | 2020-07-20 | 2022-01-21 | 西安电子科技大学 | 低成本高可靠四端CsPbBr3/Si叠层太阳电池及其制作方法 |
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US20080190479A1 (en) * | 2007-02-13 | 2008-08-14 | Epistar Corporation | Optoelectronical semiconductor device |
JP2009076921A (ja) * | 2007-09-24 | 2009-04-09 | Emcore Corp | 多接合ソーラーセル及びその製造方法 |
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US4338480A (en) | 1980-12-29 | 1982-07-06 | Varian Associates, Inc. | Stacked multijunction photovoltaic converters |
US6340788B1 (en) | 1999-12-02 | 2002-01-22 | Hughes Electronics Corporation | Multijunction photovoltaic cells and panels using a silicon or silicon-germanium active substrate cell for space and terrestrial applications |
WO2006015185A2 (en) | 2004-07-30 | 2006-02-09 | Aonex Technologies, Inc. | GaInP/GaAs/Si TRIPLE JUNCTION SOLAR CELL ENABLED BY WAFER BONDING AND LAYER TRANSFER |
US20090272430A1 (en) * | 2008-04-30 | 2009-11-05 | Emcore Solar Power, Inc. | Refractive Index Matching in Inverted Metamorphic Multijunction Solar Cells |
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US20080190479A1 (en) * | 2007-02-13 | 2008-08-14 | Epistar Corporation | Optoelectronical semiconductor device |
JP2009076921A (ja) * | 2007-09-24 | 2009-04-09 | Emcore Corp | 多接合ソーラーセル及びその製造方法 |
Non-Patent Citations (1)
Title |
---|
JPN6016006295; Jingfeng Yang et al.: 'SILICON-BASED MULTI-JUNCTION SOLAR CELL WITH 19.7% EFFICIENCY AT 1-SUNUSING AREAL CURRENT MATCHING F' Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE , 201106, Page(s):001019 - 001024 * |
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DE112012002841T5 (de) | 2014-04-17 |
SG195232A1 (en) | 2013-12-30 |
WO2013006243A2 (en) | 2013-01-10 |
JP5972369B2 (ja) | 2016-08-17 |
US20130008493A1 (en) | 2013-01-10 |
DE112012002841B4 (de) | 2019-10-24 |
US9184332B2 (en) | 2015-11-10 |
WO2013006243A3 (en) | 2013-05-10 |
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