JP2014518009A5 - - Google Patents

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Publication number
JP2014518009A5
JP2014518009A5 JP2014508603A JP2014508603A JP2014518009A5 JP 2014518009 A5 JP2014518009 A5 JP 2014518009A5 JP 2014508603 A JP2014508603 A JP 2014508603A JP 2014508603 A JP2014508603 A JP 2014508603A JP 2014518009 A5 JP2014518009 A5 JP 2014518009A5
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JP
Japan
Prior art keywords
light
process chamber
processing system
reflected
photodetector
Prior art date
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Granted
Application number
JP2014508603A
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English (en)
Japanese (ja)
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JP2014518009A (ja
JP6019105B2 (ja
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Publication date
Priority claimed from US13/440,564 external-priority patent/US9347132B2/en
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Publication of JP2014518009A publication Critical patent/JP2014518009A/ja
Publication of JP2014518009A5 publication Critical patent/JP2014518009A5/ja
Application granted granted Critical
Publication of JP6019105B2 publication Critical patent/JP6019105B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014508603A 2011-04-29 2012-04-27 光学的終点検出システム Active JP6019105B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161480839P 2011-04-29 2011-04-29
US61/480,839 2011-04-29
US13/440,564 2012-04-05
US13/440,564 US9347132B2 (en) 2011-04-29 2012-04-05 Optical endpoint detection system
PCT/US2012/035469 WO2012149331A2 (en) 2011-04-29 2012-04-27 Optical endpoint detection system

Publications (3)

Publication Number Publication Date
JP2014518009A JP2014518009A (ja) 2014-07-24
JP2014518009A5 true JP2014518009A5 (cg-RX-API-DMAC7.html) 2015-06-18
JP6019105B2 JP6019105B2 (ja) 2016-11-02

Family

ID=47066950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014508603A Active JP6019105B2 (ja) 2011-04-29 2012-04-27 光学的終点検出システム

Country Status (7)

Country Link
US (2) US9347132B2 (cg-RX-API-DMAC7.html)
JP (1) JP6019105B2 (cg-RX-API-DMAC7.html)
KR (1) KR101742478B1 (cg-RX-API-DMAC7.html)
CN (1) CN103493192B (cg-RX-API-DMAC7.html)
SG (1) SG194450A1 (cg-RX-API-DMAC7.html)
TW (1) TWI538079B (cg-RX-API-DMAC7.html)
WO (1) WO2012149331A2 (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10047457B2 (en) 2013-09-16 2018-08-14 Applied Materials, Inc. EPI pre-heat ring
US10153141B2 (en) 2014-02-14 2018-12-11 Electronics And Telecommunications Research Institute Apparatus for monitoring gas and plasma process equipment including the same
US10053777B2 (en) * 2014-03-19 2018-08-21 Applied Materials, Inc. Thermal processing chamber
JP2018046044A (ja) * 2016-09-12 2018-03-22 大陽日酸株式会社 サセプタのクリーニング装置及びクリーニング方法
US10043641B2 (en) 2016-09-22 2018-08-07 Applied Materials, Inc. Methods and apparatus for processing chamber cleaning end point detection
CN109226131A (zh) * 2018-10-11 2019-01-18 武汉华星光电半导体显示技术有限公司 清洗终点监测方法以及监测装置
CN109365410B (zh) * 2018-10-17 2020-09-18 北京航天控制仪器研究所 一种实现高效激光清洗的加工头装置及清洗方法
KR102774924B1 (ko) * 2019-07-26 2025-02-27 어플라이드 머티어리얼스, 인코포레이티드 기판 프로세싱 모니터링
US11708635B2 (en) 2020-06-12 2023-07-25 Applied Materials, Inc. Processing chamber condition and process state monitoring using optical reflector attached to processing chamber liner
US12009191B2 (en) 2020-06-12 2024-06-11 Applied Materials, Inc. Thin film, in-situ measurement through transparent crystal and transparent substrate within processing chamber wall
US12031910B2 (en) 2021-09-15 2024-07-09 Applied Materials, Inc. Transmission corrected plasma emission using in-situ optical reflectometry
US12467136B2 (en) 2022-03-16 2025-11-11 Applied Materials, Inc. Process characterization and correction using optical wall process sensor (OWPS)
US12469686B2 (en) 2022-03-16 2025-11-11 Applied Materials, Inc. Process characterization and correction using optical wall process sensor (OWPS)
USD1031743S1 (en) 2022-05-06 2024-06-18 Applied Materials, Inc. Portion of a display panel with a graphical user interface
US20250038040A1 (en) * 2023-07-27 2025-01-30 Applied Materials, Inc. Lift frames for central heating, and related processing chambers and methods
CN120072606A (zh) * 2023-11-28 2025-05-30 北京北方华创微电子装备有限公司 半导体工艺设备及其控制方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6129807A (en) 1997-10-06 2000-10-10 Applied Materials, Inc. Apparatus for monitoring processing of a substrate
JPH11140655A (ja) 1997-11-14 1999-05-25 Sony Corp プラズマ処理装置
JP3535785B2 (ja) 1999-11-26 2004-06-07 Necエレクトロニクス株式会社 クリーニング終点検出装置およびクリーニング終点検出方法
JP2002057149A (ja) 2000-08-08 2002-02-22 Tokyo Electron Ltd 処理装置及びそのクリーニング方法
JP2002246320A (ja) 2001-02-20 2002-08-30 Hitachi Ltd プラズマ処理装置のプラズマクリーニング方法
JP2004047020A (ja) * 2002-07-15 2004-02-12 Fuji Electric Holdings Co Ltd 磁気ディスク媒体及び固定磁気ディスク装置
KR100844273B1 (ko) 2002-12-20 2008-07-07 동부일렉트로닉스 주식회사 챔버 세정장치
US8460945B2 (en) 2003-09-30 2013-06-11 Tokyo Electron Limited Method for monitoring status of system components
US20060021633A1 (en) 2004-07-27 2006-02-02 Applied Materials, Inc. Closed loop clean gas control
US7534469B2 (en) * 2005-03-31 2009-05-19 Asm Japan K.K. Semiconductor-processing apparatus provided with self-cleaning device
JP5441332B2 (ja) * 2006-10-30 2014-03-12 アプライド マテリアルズ インコーポレイテッド フォトマスクエッチングのための終点検出
US8092695B2 (en) 2006-10-30 2012-01-10 Applied Materials, Inc. Endpoint detection for photomask etching
CN201182036Y (zh) 2007-02-01 2009-01-14 应用材料股份有限公司 气体注入喷嘴

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