JP2014510418A - ウェーハを永久的に結合する方法 - Google Patents
ウェーハを永久的に結合する方法 Download PDFInfo
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
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- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
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Abstract
Description
−フロントエンドオブライン適合性
これは、電気的に活性な構成要素の生産時の工程の適合性と定義される。したがって、結合工程は、構造ウェーハ上に既に存在するトランジスタなどの活性構成要素が加工中に有害な影響も損傷も受けないように計画されなければならない。適合性の基準は、主として特定の化学的要素(主としてCMOS構造における)の純度及び主として熱応力による機械的耐荷重性を含む。
−低汚染
−無加力
−特に異なる熱膨張係数を有する材料について、できる限り低い温度
−水
−チオール
−AP3000
−シラン及び/又は
−シラノール
− Si → SiO2、Si3N4、SiNxOy
− Ge → GeO2、Ge3N4
− α−Sn → SnO2
− B → B2O3、BN
− Se → SeO2
− Te → TeO2、TeO3
− Mg → MgO、Mg3N2
− Al → Al2O3、AlN
− Ti → TiO2、TiN
− V → V2O5
− Mn → MnO、MnO2、Mn2O3、Mn2O7、Mn3O4
− Fe → FeO、Fe2O3、Fe3O4
− Co → CoO、Co3O4,
− Ni → NiO、Ni2O3
− Cu → CuO、Cu2O、Cu3N
− Zn → ZnO
− Cr → CrN、Cr23C6、Cr3C、Cr7C3、Cr3C2
− Mo → Mo3C2
− Ti → TiC
− Nb → Nb4C3
− Ta → Ta4C3
− Zr → ZrC
− Hf → HfC
− V → V4C3、VC
− W → W2C、WC
− Fe → Fe3C、Fe7C3、Fe2C
− III−V:GaP、GaAs、InP、InSb、InAs、GaSb、GaN、AlN、InN、AlxGa1−xAs、InxGa1−xN
− IV−IV:SiC、SiGe、
− III−IV:InAlP、
−非線型光学:LiNbO3、LiTaO3、KDP(KH2PO4)
−太陽電池:CdS、CdSe、CdTe、CuInSe2、CuInGaSe2、CuInS2、CuInGaS2
−伝導性酸化物:In2−xSnxO3−y
Si−O−Si+H2O←→2SiOH
−周囲雰囲気にレザバーを曝露するステップ、
−とりわけ脱イオン化された水によりフラッシングするステップ、
−エダクトを含む又はそれ、とりわけH2O、H2O2、NH4OHからなる流体によりフラッシングするステップ、
−任意のガス雰囲気、とりわけ原子ガス、分子ガス、ガス混合物にレザバーを曝露するステップ、
−水蒸気又は過酸化水素蒸気を含む雰囲気にレザバーを曝露するステップ及び
−エダクトで既に充填されたレザバーを第1の基板上にレザバー形成層として堆積させるステップ。
−PECVD
−LPCVD
−蒸着
−エピタキシー
−MOCVD
−大気中水分及び/又は空気に含まれる酸素でレザバーを充填するために、第1の接触面を大気に曝露するステップ、
−第1の接触面をとりわけ主に、好ましくはほぼ完全に、とりわけ脱イオン化されたH2O及び/又はH2O2からなる流体に大気に曝露するステップ、
−第1の接触面をとりわけ0〜2000eVの範囲のイオンエネルギーを有するN2ガス及び/又はO2ガス及び/又はArガス及び/又はとりわけ95%Ar及び5%H2からなるフォーミングガスに曝露するステップ、
−既に挙げたエダクトでレザバーを充填するための蒸着。
−PECVD
−LPCVD
−蒸着
−エピタキシー
−MOCVD
Si−OH+HO−Si←→Si−O−Si+H2O
Si+2H2O→SiO2+2H2
2 第2の基板
3 第1の接触面
4 第2の接触面
5、5’ レザバー
6、6’ レザバー形成層
7、7’ 反応層
8 成長層
9 ナノギャップ
10 反応生成物
11 第1のプロファイル
12 第2のプロファイル
13 和曲線
17 反応層
A 平均厚さ
B 平均距離
R 平均厚さ
Claims (13)
- 以下のステップ、とりわけ以下の順序:
−第1の基板(1)及び/又は第2の基板(2)上の少なくとも1つのレザバー形成層(6、6’)中に、とりわけ少なくとも主として非晶質物質からなる、少なくとも1つのレザバー(5、5’)を形成するステップ、
−レザバー/複数のレザバー(5、5’)を第1のエダクト又はエダクトの第1の群で少なくとも部分的に充填するステップ、
−第2のエダクト又はエダクトの第2の群を含む反応層(17)をレザバー(5)及び/又はレザバー(5’)に形成する又は施すステップ、
−前結合連結部の形成のために第1の接触面(3)を第2の接触面(4)と接触させるステップ、
−第1のエダクト又は第1の群と第2のエダクト又は第2の群との反応により少なくとも部分的に強化された第1及び第2の接触面(3、4)間の永久的結合を形成するステップ
により、第1の基板(1)の第1の接触面(3)を第2の基板(2)の第2の接触面(4)に結合する方法。 - 永久的結合の形成及び/又は強化が第1のエダクトの反応層(17)中への拡散により起こる、請求項1に記載の方法。
- 永久的結合の形成が室温から200℃の間の温度で、とりわけ最長12日間、好ましくは最長1日間、さらにより好ましくは最長1時間、最善には最長15分間に起こる、請求項1又は2に記載の方法。
- 不可逆的結合が1.5J/m2より大きい、とりわけ2J/m2より大きい、好ましくは2.5J/m2より大きい結合強さを有する、請求項1から3の何れか一項に記載の方法。
- 反応中に第2のエダクトのモル体積より大きいモル体積を有する反応生成物(10)が反応層(17)において形成される、請求項1から4の何れか一項に記載の方法。
- レザバー(5)がプラズマ活性化により形成される、請求項1から5の何れか一項に記載の方法。
- レザバー形成層(6、6’)が、本質的に完全に非晶質物質、とりわけ熱酸化により生成した酸化ケイ素からなり、反応層(17)が易酸化性物質、とりわけ主として、好ましくは本質的に完全にSi、Ge、InP、GaP又はGaNからなる、請求項1から6の何れか一項に記載の方法。
- レザバー形成層(6、6’)に隣接した第2のエダクト又は第2の群から少なくとも主としてなる、第1の基板(1)が1つの反応層(7)を有し、及び/又は第2の基板(2)が1つの反応層(7’)を有する、請求項1から7の何れか一項に記載の方法。
- 永久的結合の形成の前にレザバー形成層(6、6’)が1オングストロームから10nmの間の平均厚さAを有する、請求項8に記載の方法。
- レザバー形成層(6、6’)及び/又は反応層(17)が成長層(8)の機能を果たす、請求項1から9の何れか一項に記載の方法。
- レザバー(5、5’)が、以下に挙げる1つ又は複数のステップ:
−第1の接触面(3)及び/又は第2の接触面(4)をとりわけ高酸素及び/又は水含量を有する雰囲気に曝露するステップ、
−第1の接触面(3)及び/又は第2の接触面(4)をとりわけ主に、好ましくはほぼ完全にとりわけ脱イオン化されたH2O及び/又はH2O2からなる流体に曝露するステップ、
−第1の接触面(3)及び/又は第2の接触面(4)をとりわけ0〜200eVの範囲のイオンエネルギーを有するN2ガス及び/又はO2ガス及び/又はArガス及び/又はとりわけ95%Ar及び5%H2からなるフォーミングガスに曝露するステップ
により充填される、請求項1から10の何れか一項に記載の方法。 - 永久的結合の形成の直前のレザバー(5、5’)と反応層(7、7’)との間の平均距離(B、B’)が0.1nmから15nmの間、とりわけ0.5nmから5nmの間、好ましくは0.5nmから3nmの間である、請求項1から11の何れか一項に記載の方法。
- 不可逆的結合が前結合強さの2倍、好ましくは4倍、より好ましくは10倍、最も好ましくは25倍を含む結合強さを有する、請求項1から12の何れか一項に記載の方法。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003523627A (ja) * | 2000-02-16 | 2003-08-05 | ジプトロニクス・インコーポレイテッド | 低温結合方法および結合構成物 |
JP2006080314A (ja) * | 2004-09-09 | 2006-03-23 | Canon Inc | 結合基板の製造方法 |
JP2008535230A (ja) * | 2005-04-22 | 2008-08-28 | エス. オー. アイ. テック シリコン オン インシュレーター テクノロジーズ | 半導体材料から選択された材料で作られた2つのウェハを貼り合わせる方法 |
WO2009031392A1 (ja) * | 2007-09-07 | 2009-03-12 | Sumco Corporation | 貼り合わせウェーハの製造方法 |
JP2009517855A (ja) * | 2005-11-28 | 2009-04-30 | エス. オー. アイ. テック シリコン オン インシュレーター テクノロジーズ | 分子接合による結合のためのプロセスおよび装置 |
JP2010056543A (ja) * | 2008-08-01 | 2010-03-11 | Semiconductor Energy Lab Co Ltd | Soi基板の作製方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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EP1295314A2 (en) | 2000-06-26 | 2003-03-26 | Applied Materials, Inc. | Method and apparatus for wafer cleaning |
US7261793B2 (en) | 2004-08-13 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | System and method for low temperature plasma-enhanced bonding |
US8101501B2 (en) | 2007-10-10 | 2012-01-24 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
CN101261932A (zh) * | 2008-04-18 | 2008-09-10 | 华中科技大学 | 一种低温圆片键合方法 |
FR2980916B1 (fr) * | 2011-10-03 | 2014-03-28 | Soitec Silicon On Insulator | Procede de fabrication d'une structure de type silicium sur isolant |
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JP2009517855A (ja) * | 2005-11-28 | 2009-04-30 | エス. オー. アイ. テック シリコン オン インシュレーター テクノロジーズ | 分子接合による結合のためのプロセスおよび装置 |
WO2009031392A1 (ja) * | 2007-09-07 | 2009-03-12 | Sumco Corporation | 貼り合わせウェーハの製造方法 |
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