JP2014509086A - 発光装置のための基板に反射性被覆を供給する方法 - Google Patents

発光装置のための基板に反射性被覆を供給する方法 Download PDF

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Publication number
JP2014509086A
JP2014509086A JP2013558543A JP2013558543A JP2014509086A JP 2014509086 A JP2014509086 A JP 2014509086A JP 2013558543 A JP2013558543 A JP 2013558543A JP 2013558543 A JP2013558543 A JP 2013558543A JP 2014509086 A JP2014509086 A JP 2014509086A
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JP
Japan
Prior art keywords
substrate
reflective coating
surface portion
reflective
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013558543A
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English (en)
Japanese (ja)
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JP2014509086A5 (https=
Inventor
ヘンドリク ヨハンネス ボウデフェイン ヤフト
クリスティアン クレエイネン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
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Filing date
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Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JP2014509086A publication Critical patent/JP2014509086A/ja
Publication of JP2014509086A5 publication Critical patent/JP2014509086A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
JP2013558543A 2011-03-18 2012-03-09 発光装置のための基板に反射性被覆を供給する方法 Pending JP2014509086A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11158839A EP2500623A1 (en) 2011-03-18 2011-03-18 Method for providing a reflective coating to a substrate for a light-emitting device
EP11158839.8 2011-03-18
PCT/IB2012/051112 WO2012127349A1 (en) 2011-03-18 2012-03-09 Method for providing a reflective coating to a substrate for a light-emitting device

Publications (2)

Publication Number Publication Date
JP2014509086A true JP2014509086A (ja) 2014-04-10
JP2014509086A5 JP2014509086A5 (https=) 2015-04-23

Family

ID=44317608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013558543A Pending JP2014509086A (ja) 2011-03-18 2012-03-09 発光装置のための基板に反射性被覆を供給する方法

Country Status (9)

Country Link
US (2) US9660147B2 (https=)
EP (2) EP2500623A1 (https=)
JP (1) JP2014509086A (https=)
KR (1) KR101934891B1 (https=)
CN (1) CN103429949B (https=)
BR (1) BR112013023558B1 (https=)
RU (1) RU2597253C2 (https=)
TW (1) TWI560907B (https=)
WO (1) WO2012127349A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9293667B2 (en) 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
KR101304715B1 (ko) * 2012-04-25 2013-09-06 주식회사 엘지씨엔에스 도광판에서의 빛 누출 방지 방법 및 그 장치와 반사재가 토출된 도광판을 가지는 디스플레이 장치
EP2940748A4 (en) * 2012-12-27 2016-07-20 Konica Minolta Inc COATING LIQUID AND LED DEVICE COMPRISING A REFLECTIVE LAYER MADE OF A HARDENED PRODUCT OF THIS COATING LIQUID
US10204887B2 (en) 2013-12-18 2019-02-12 Lumileds Llc Reflective solder mask layer for LED phosphor package
US20160020370A1 (en) * 2014-07-21 2016-01-21 GE Lighting Solutions, LLC Thin film with multilayer dielectric coatings for light emitting diode (led) lead frame and chip-on-board (cob) substrate reflector
TWI647191B (zh) 2015-06-11 2019-01-11 美商蘋果公司 用於電子裝置之組件之透明保護塗層
WO2017045901A1 (en) * 2015-09-15 2017-03-23 Philips Lighting Holding B.V. Barrier layer delaying oxygen depletion in sealed gas-filled led lamps
US20210195743A1 (en) * 2016-02-18 2021-06-24 3M Innovative Properties Company Multilayer construction for mounting light emitting devices
US11098218B2 (en) 2018-09-26 2021-08-24 Apple Inc. Coatings for electronic devices
DE102018129575A1 (de) * 2018-11-23 2020-05-28 Osram Opto Semiconductors Gmbh Lichtemittereinheit mit wenigstens einem VCSEL-Chip
US11837684B2 (en) * 2019-11-21 2023-12-05 Creeled, Inc. Submount structures for light emitting diode packages
US11873954B2 (en) * 2020-09-03 2024-01-16 Signify Holding B.V. Lighting board and luminaire using the lighting board

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281260A (ja) * 2006-04-07 2007-10-25 Sumitomo Metal Electronics Devices Inc リフレクターとそれを用いた発光素子収納用パッケージ及びリフレクターに用いるレンズ
WO2009075530A2 (en) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
JP2009141318A (ja) * 2007-07-30 2009-06-25 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 高められた熱伝導度を有するｌｅｄ光源
WO2010150880A1 (ja) * 2009-06-26 2010-12-29 株式会社朝日ラバー 白色反射材及びその製造方法
WO2012002580A1 (ja) * 2010-07-01 2012-01-05 シチズンホールディングス株式会社 Ｌｅｄ光源装置及びその製造方法
JP2012151191A (ja) * 2011-01-17 2012-08-09 Ibiden Co Ltd Ｌｅｄ用配線基板、発光モジュール、ｌｅｄ用配線基板の製造方法、及び発光モジュールの製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4662927A (en) 1985-12-17 1987-05-05 Emhart Industries, Inc. Glass temperature preconditioning system in a distribution channel
US6885147B2 (en) * 1998-05-18 2005-04-26 Emagin Corporation Organic light emitting diode devices with improved anode stability
US6845184B1 (en) * 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
US20030236318A1 (en) 2002-04-18 2003-12-25 Kuraray Co., Ltd. Curable resin composition, method for manufacture of laminate using the composition, transfer material, method for manufacture thereof and transferred product
JP4179866B2 (ja) 2002-12-24 2008-11-12 株式会社沖データ 半導体複合装置及びｌｅｄヘッド
US7201497B2 (en) * 2004-07-15 2007-04-10 Lumination, Llc Led lighting system with reflective board
US7285802B2 (en) 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
JP2007042668A (ja) 2005-07-29 2007-02-15 Toyoda Gosei Co Ltd Ｌｅｄ発光装置
TWI360238B (en) 2007-10-29 2012-03-11 Epistar Corp Photoelectric device
US9024340B2 (en) * 2007-11-29 2015-05-05 Nichia Corporation Light emitting apparatus and method for producing the same
KR100979174B1 (ko) 2008-06-05 2010-08-31 (주) 아모엘이디 멀티칩 패키지 및 그의 제조방법
JP5355219B2 (ja) 2008-05-21 2013-11-27 京セラ株式会社 発光素子搭載用基板および発光装置
US20100279437A1 (en) 2009-05-01 2010-11-04 Koninklijke Philips Electronics N.V. Controlling edge emission in package-free led die
KR101639793B1 (ko) 2008-09-25 2016-07-15 코닌클리케 필립스 엔.브이. 코팅된 발광 장치 및 그 코팅 방법
EP2228841A1 (en) * 2009-03-09 2010-09-15 Ledon Lighting Jennersdorf GmbH LED module with improved light output
JP5665285B2 (ja) 2009-06-15 2015-02-04 日立化成株式会社 光半導体素子搭載用部材及び光半導体装置
US8431423B2 (en) 2009-07-16 2013-04-30 Koninklijke Philips Electronics N.V. Reflective substrate for LEDS
US20110049545A1 (en) * 2009-09-02 2011-03-03 Koninklijke Philips Electronics N.V. Led package with phosphor plate and reflective substrate
US8486761B2 (en) * 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281260A (ja) * 2006-04-07 2007-10-25 Sumitomo Metal Electronics Devices Inc リフレクターとそれを用いた発光素子収納用パッケージ及びリフレクターに用いるレンズ
JP2009141318A (ja) * 2007-07-30 2009-06-25 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 高められた熱伝導度を有するｌｅｄ光源
WO2009075530A2 (en) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
WO2010150880A1 (ja) * 2009-06-26 2010-12-29 株式会社朝日ラバー 白色反射材及びその製造方法
WO2012002580A1 (ja) * 2010-07-01 2012-01-05 シチズンホールディングス株式会社 Ｌｅｄ光源装置及びその製造方法
JP2012151191A (ja) * 2011-01-17 2012-08-09 Ibiden Co Ltd Ｌｅｄ用配線基板、発光モジュール、ｌｅｄ用配線基板の製造方法、及び発光モジュールの製造方法

Also Published As

Publication number Publication date
RU2597253C2 (ru) 2016-09-10
BR112013023558A2 (pt) 2016-12-06
US9660147B2 (en) 2017-05-23
WO2012127349A1 (en) 2012-09-27
KR20140013033A (ko) 2014-02-04
US20170236987A1 (en) 2017-08-17
US10043959B2 (en) 2018-08-07
US20140001497A1 (en) 2014-01-02
CN103429949B (zh) 2017-07-07
EP2500623A1 (en) 2012-09-19
KR101934891B1 (ko) 2019-01-04
EP2686604B8 (en) 2018-08-29
TW201244175A (en) 2012-11-01
BR112013023558B1 (pt) 2021-05-25
EP2686604B1 (en) 2018-02-21
RU2013146546A (ru) 2015-04-27
EP2686604A1 (en) 2014-01-22
CN103429949A (zh) 2013-12-04
TWI560907B (en) 2016-12-01

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