KR101934891B1 - 발광 디바이스용 기판에 반사성 코팅을 제공하는 방법 - Google Patents

발광 디바이스용 기판에 반사성 코팅을 제공하는 방법 Download PDF

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KR101934891B1
KR101934891B1 KR1020137027446A KR20137027446A KR101934891B1 KR 101934891 B1 KR101934891 B1 KR 101934891B1 KR 1020137027446 A KR1020137027446 A KR 1020137027446A KR 20137027446 A KR20137027446 A KR 20137027446A KR 101934891 B1 KR101934891 B1 KR 101934891B1
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substrate
surface portion
reflective coating
reflective
emitting device
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Korean (ko)
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KR20140013033A (ko
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헨드릭 요하네스 보데비즌 자그트
크리스천 클레이즈넨
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루미리즈 홀딩 비.브이.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
KR1020137027446A 2011-03-18 2012-03-09 발광 디바이스용 기판에 반사성 코팅을 제공하는 방법 Active KR101934891B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11158839A EP2500623A1 (en) 2011-03-18 2011-03-18 Method for providing a reflective coating to a substrate for a light-emitting device
EP11158839.8 2011-03-18
PCT/IB2012/051112 WO2012127349A1 (en) 2011-03-18 2012-03-09 Method for providing a reflective coating to a substrate for a light-emitting device

Publications (2)

Publication Number Publication Date
KR20140013033A KR20140013033A (ko) 2014-02-04
KR101934891B1 true KR101934891B1 (ko) 2019-01-04

Family

ID=44317608

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KR1020137027446A Active KR101934891B1 (ko) 2011-03-18 2012-03-09 발광 디바이스용 기판에 반사성 코팅을 제공하는 방법

Country Status (9)

Country Link
US (2) US9660147B2 (https=)
EP (2) EP2500623A1 (https=)
JP (1) JP2014509086A (https=)
KR (1) KR101934891B1 (https=)
CN (1) CN103429949B (https=)
BR (1) BR112013023558B1 (https=)
RU (1) RU2597253C2 (https=)
TW (1) TWI560907B (https=)
WO (1) WO2012127349A1 (https=)

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US9293667B2 (en) 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
KR101304715B1 (ko) * 2012-04-25 2013-09-06 주식회사 엘지씨엔에스 도광판에서의 빛 누출 방지 방법 및 그 장치와 반사재가 토출된 도광판을 가지는 디스플레이 장치
EP2940748A4 (en) * 2012-12-27 2016-07-20 Konica Minolta Inc COATING LIQUID AND LED DEVICE COMPRISING A REFLECTIVE LAYER MADE OF A HARDENED PRODUCT OF THIS COATING LIQUID
US10204887B2 (en) 2013-12-18 2019-02-12 Lumileds Llc Reflective solder mask layer for LED phosphor package
US20160020370A1 (en) * 2014-07-21 2016-01-21 GE Lighting Solutions, LLC Thin film with multilayer dielectric coatings for light emitting diode (led) lead frame and chip-on-board (cob) substrate reflector
TWI647191B (zh) 2015-06-11 2019-01-11 美商蘋果公司 用於電子裝置之組件之透明保護塗層
WO2017045901A1 (en) * 2015-09-15 2017-03-23 Philips Lighting Holding B.V. Barrier layer delaying oxygen depletion in sealed gas-filled led lamps
US20210195743A1 (en) * 2016-02-18 2021-06-24 3M Innovative Properties Company Multilayer construction for mounting light emitting devices
US11098218B2 (en) 2018-09-26 2021-08-24 Apple Inc. Coatings for electronic devices
DE102018129575A1 (de) * 2018-11-23 2020-05-28 Osram Opto Semiconductors Gmbh Lichtemittereinheit mit wenigstens einem VCSEL-Chip
US11837684B2 (en) * 2019-11-21 2023-12-05 Creeled, Inc. Submount structures for light emitting diode packages
US11873954B2 (en) * 2020-09-03 2024-01-16 Signify Holding B.V. Lighting board and luminaire using the lighting board

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US20110012149A1 (en) 2009-07-16 2011-01-20 Koninklijke Philips Electronics N.V. Reflective substratefor leds
JP5665285B2 (ja) 2009-06-15 2015-02-04 日立化成株式会社 光半導体素子搭載用部材及び光半導体装置

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US6885147B2 (en) * 1998-05-18 2005-04-26 Emagin Corporation Organic light emitting diode devices with improved anode stability
US6845184B1 (en) * 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
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Also Published As

Publication number Publication date
RU2597253C2 (ru) 2016-09-10
BR112013023558A2 (pt) 2016-12-06
US9660147B2 (en) 2017-05-23
WO2012127349A1 (en) 2012-09-27
KR20140013033A (ko) 2014-02-04
JP2014509086A (ja) 2014-04-10
US20170236987A1 (en) 2017-08-17
US10043959B2 (en) 2018-08-07
US20140001497A1 (en) 2014-01-02
CN103429949B (zh) 2017-07-07
EP2500623A1 (en) 2012-09-19
EP2686604B8 (en) 2018-08-29
TW201244175A (en) 2012-11-01
BR112013023558B1 (pt) 2021-05-25
EP2686604B1 (en) 2018-02-21
RU2013146546A (ru) 2015-04-27
EP2686604A1 (en) 2014-01-22
CN103429949A (zh) 2013-12-04
TWI560907B (en) 2016-12-01

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