JP2014228347A - Board fixation device and board inspection device provided with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a configuration capable of appropriately securing a board such as a coreless board, having flexibility.SOLUTION: In a first step, a board 11 is grasped with center clamps 40 and 43 of a first clamp mechanism 31 and a second clamp mechanism 32. In a second step, the board 11 is grasped with a third clamp mechanism 33 and a fourth clamp mechanism 34. In a third step, the third clamp mechanism 33 and the fourth clamp mechanism 34 are moved relative to each other in a direction to separate by a second movement mechanism 56. In a fourth step, the board 11 is grasped with end clamps 41, 42, 44 and 45 of the first clamp mechanism 31 and the second clamp mechanism 32. In a fifth step, the first clamp mechanism 31 and the second clamp mechanism 32 are moved relative to each other in a direction to separate by a first movement mechanism 55.

Description

  The present invention mainly relates to a substrate fixing device for holding a coreless substrate.

  A substrate inspection apparatus for inspecting a circuit pattern formed on a substrate is known. This type of substrate inspection apparatus includes a substrate fixing device that holds a substrate at a predetermined position. Patent Documents 1 and 2 describe such a substrate fixing device.

Japanese Patent No. 5179289 JP 2012-83252 A

  The conventional substrate fixing apparatus as described above is assumed to fix a general buildup substrate. The build-up substrate has a core layer (support layer) and has a certain degree of rigidity. Therefore, when the substrate is fixed by the substrate fixing device, there is little fear that the substrate is warped or bent.

  On the other hand, in recent years, coreless substrates are becoming widespread. The coreless substrate is obtained by removing the core layer (support layer) from the build-up substrate. The coreless substrate is expected to be capable of increasing the density of the build-up layer wiring and improving the performance of the semiconductor package by eliminating the core layer.

  However, since the coreless substrate does not have a core layer, it is flexible and easily warps and bends. For this reason, in the conventional board | substrate fixing apparatus, the case where a coreless board | substrate cannot be hold | maintained appropriately may arise.

  For example, the substrate fixing device of Patent Document 1 is configured to clamp and fix the central portions of the four sides of the substrate, but the four corners of the fixed substrate are free. For this reason, if a coreless board | substrate is fixed with the structure of patent document 1, it cannot prevent that the four corners of a board | substrate warp or hang down.

  Further, for example, the substrate fixing device of Patent Document 2 is configured to clamp and fix two opposing sides of the substrate, but does not clamp the other two sides. For this reason, if the coreless substrate is fixed in the configuration of Patent Document 2, the substrate is likely to be distorted.

  As described above, in the conventional substrate fixing device, distortion or the like may occur when the coreless substrate is fixed. If the substrate is distorted, the circuit pattern on the substrate cannot be properly inspected.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a configuration capable of appropriately fixing a flexible substrate such as a coreless substrate.

Means and effects for solving the problems

  The problems to be solved by the present invention are as described above. Next, means for solving the problems and the effects thereof will be described.

  According to an aspect of the present invention, a configuration of a substrate fixing device for fixing a substantially rectangular and flexible substrate is provided as follows. That is, the substrate fixing device includes a first clamp mechanism, a second clamp mechanism, a third clamp mechanism, a fourth clamp mechanism, a first movement mechanism, and a second movement memory. The first clamp mechanism includes a plurality of clamps that hold the first side of the substrate along the first side. The second clamp mechanism has a plurality of clamps arranged along the second side for gripping the second side facing the first side of the substrate. The third clamp mechanism includes a clamp that holds a third side substantially orthogonal to the first side and the second side of the substrate. The fourth clamp mechanism includes a clamp that holds a fourth side of the substrate that faces the third side. The first moving mechanism relatively moves the first clamp mechanism and the second clamp mechanism in a state of gripping the substrate in a separating direction. The second moving mechanism relatively moves the third clamp mechanism and the fourth clamp mechanism in a state of gripping the substrate in a separating direction.

  As described above, by arranging a plurality of clamps along the first side and the second side of the substrate, the first side and the second side of the substrate can be gripped step by step. Thereby, compared with the case where each side of a board | substrate is hold | gripped at a stretch, it becomes difficult to produce distortion when holding the said board | substrate. Further, when the substrates are held by the clamp mechanism and moved in a direction in which the clamp mechanisms are separated from each other, tension can be applied by pulling the substrates to eliminate warping and bending.

  The substrate fixing device is preferably configured as follows. That is, the substrate fixing device includes a first side positioning guide, a third side positioning guide, and a substrate shifting mechanism. The first side positioning guide can contact the first side of the substrate. The third side positioning guide can contact the third side of the substrate. The substrate shifting mechanism moves the substrate in a direction in which the substrate is brought into contact with the first side positioning guide and the third side positioning guide.

  In this way, the substrate can be positioned by bringing the positioning guide into contact with the two sides (first side and third side) of the substrate. By gripping the substrate in the positioned state, the substrate can be fixed at an accurate position.

  In the substrate fixing device, it is preferable that at least one of the first clamp mechanism and the third clamp mechanism is fixed to a main body of the substrate fixing device.

  In other words, if both the first side and the third side of the substrate are moved after the substrate is positioned, the position of the substrate that has been positioned will be displaced. Therefore, as described above, by preventing at least one of the first clamp mechanism and the third clamp mechanism from moving, the position of the substrate positioned by the positioning guide is prevented from being shifted.

  The substrate fixing device is preferably configured as follows. That is, the first clamp mechanism includes a central clamp that grips the vicinity of the center of the first side and an end clamp that grips the vicinity of the end of the first side along the first side. . The second clamp mechanism includes a central clamp that grips the vicinity of the center of the second side and an end clamp that grips the vicinity of the end of the second side along the second side.

  As described above, if the clamp for gripping the center portion of the substrate and the clamp for gripping both ends are separately provided, for example, the center portion of the substrate can be gripped first, and then both ends can be gripped.

  The substrate fixing device is preferably configured as follows. That is, the substrate fixing apparatus includes a control unit that controls the clamps, the first moving mechanism, and the second moving mechanism. The controller controls the substrate to be gripped by the end clamp after the substrate is gripped by the central clamp of the first clamp mechanism and the second clamp mechanism.

  That is, if the both end portions of the substrate are gripped first, the substrate is fixed without being warped or bent, and the substrate is distorted. Therefore, as described above, by first grasping the central portion of the substrate and then grasping both end portions, it is possible to eliminate the warpage and slackness of the substrate and to securely fix the substrate.

  The substrate fixing device is preferably configured as follows. That is, the control unit fixes the substrate by executing the first step, the second step, the third step, the fourth step, and the fifth step in this order. In the first step, the substrate is held by the central clamp of the first clamp mechanism and the second clamp mechanism. In the second step, the substrate is held by the third clamp mechanism and the fourth clamp mechanism. In the third step, the third moving mechanism and the fourth clamping mechanism are moved relative to each other in the direction of separating by the second moving mechanism. In the fourth step, the substrate is held by the end clamps of the first clamp mechanism and the second clamp mechanism. In the fifth step, the first clamp mechanism and the second clamp mechanism are moved relative to each other in the direction of separating by the first moving mechanism.

  By fixing the substrate in this order, it is possible to accurately fix the substrate while applying tension to the substrate to eliminate warping and bending.

  In the above substrate fixing apparatus, when releasing the fixation of the substrate, the control unit preferably releases the grip by each clamp in an order opposite to the order in which the substrate is gripped.

  That is, since the substrate fixing device of the present invention fixes the gripped substrate in a tensioned state, stress is accumulated inside the fixed substrate. If the clamps are released in an inappropriate order, the stress inside the substrate is suddenly released, causing the substrate to jump or break. Therefore, as described above, the substrate is prevented from bouncing by releasing the clamps in the reverse order from when the substrate is held.

  According to another viewpoint of this invention, a board | substrate inspection apparatus provided with said board | substrate fixing apparatus and the test | inspection part which test | inspects the board | substrate hold | maintained by the said board | substrate fixing apparatus is provided.

1 is a schematic front view of a substrate inspection apparatus according to an embodiment of the present invention. FIG. 3 is a schematic plan view of a substrate to be inspected by the substrate inspection apparatus of the present embodiment. The top view of the board | substrate fixing device of this embodiment. The top view which shows a mode that the board | substrate was mounted in the board | substrate fixing device. The top view which shows the mode of a positioning step. The top view which shows the mode of a 1st step. The top view which shows the mode of a 2nd step. The top view which shows the mode of a 3rd step. The top view which shows the mode of a 4th step. The top view which shows the mode of a 5th step.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a schematic front view of a substrate inspection apparatus 10 according to this embodiment.

  The substrate inspection apparatus 10 of this embodiment is an apparatus for inspecting a circuit pattern formed on a flexible substrate 11 such as a coreless substrate.

  As shown in FIG. 1, the board inspection apparatus 10 has a housing 12. In the internal space of the housing 12, a substrate fixing device 20, a first inspection unit 21, and a second inspection unit 22 are mainly provided.

  The substrate fixing device 20 is configured to fix the substrate 11 to be inspected at a predetermined position.

  The first inspection unit 21 is located above the substrate 11 fixed to the substrate fixing device 20. The second inspection unit 22 is located below the substrate 11 fixed to the substrate fixing device 20. The first inspection unit 21 and the second inspection unit 22 include an inspection jig 23 for inspecting a circuit pattern formed on the substrate 11. In addition, the first inspection unit 21 and the second inspection unit 22 include an inspection unit moving mechanism 25 in order to appropriately move within the housing 12.

  The substrate inspection apparatus 10 includes a control unit 27 that controls the substrate fixing device 20, the first inspection unit 21, the second inspection unit 22, and the like. The control unit 27 appropriately moves the inspection units 21 and 22 to bring the inspection jig 23 into contact with the substrate 11 fixed to the substrate fixing device 20, thereby inspecting the circuit pattern of the substrate 11 with the inspection jig 23. Is configured to do.

  Next, the substrate fixing device 20 of this embodiment will be described in detail.

  As described above, the substrate fixing device 20 according to the present embodiment is assumed to fix the flexible substrate 11 such as a coreless substrate. In general, the substrate 11 has a rectangular shape (or a substantially rectangular shape). As shown in FIG. 2, for convenience of explanation, one of the four sides of the rectangular substrate 11 is referred to as a “first side”, and a side facing the first side is referred to as a “second side”. I will decide. In addition, one of the sides orthogonal to the first side and the second side is referred to as a “third side”, and a side facing the third side is referred to as a “fourth side”. The substrate 11 of the present embodiment has a rectangular shape in which the first side and the second side are long sides. However, the substrate 11 may be square. In addition, in order to show the substrate 11 in an easy-to-understand manner in the drawing, the substrate 11 is illustrated with hatching.

  As shown in FIG. 3, the substrate fixing device 20 has a plurality of clamps 40 to 47. Each clamp 40 to 47 has a placement portion 30. By placing the substrate 11 on each placement unit 30, the substrate 11 can be supported in a substantially horizontal posture. A state in which the substrate 11 is placed on each placement unit 30 (state shown in FIG. 4) may be expressed as “a state in which the substrate 11 is placed on the substrate fixing device 20”.

  Each clamp 40-47 is comprised so that the board | substrate 11 mounted in the mounting part 30 can be hold | gripped. The clamps 40 to 47 are each provided with a drive mechanism (not shown) such as a pneumatic actuator, for example, and can be switched between a state in which the substrate 11 is gripped and a state in which the grip is released. Has been. The drive mechanism of each clamp 40-47 is controlled by the control unit 27 described above. In addition, since the structure of this kind of clamp is well-known, description is abbreviate | omitted about the detailed structure of the clamps 40-47.

  The substrate 11 can be fixed to the substrate fixing device 20 by gripping the substrate 11 with the plurality of clamps 40 to 47 described above. For convenience of explanation, when the substrate 11 is fixed to the substrate fixing device 20, the axes parallel to the first side and the second side of the substrate 11 are the Y axis, the third side, and the fourth side of the substrate fixing device 20. An axis parallel to the X axis is the X axis of the substrate fixing device 20.

  The substrate fixing device 20 according to the present embodiment includes a clamp mechanism corresponding to each side of the substrate 11. Specifically, as shown in FIG. 3, the substrate fixing device 20 corresponds to the first clamp mechanism 31 corresponding to the first side of the substrate 11, the second clamp mechanism 32 corresponding to the second side, and the third side. A third clamp mechanism 33 and a fourth clamp mechanism 34 corresponding to the fourth side are provided.

  As shown in FIG. 3, the first clamp mechanism 31 has three clamps 40, 41, and 42 arranged along the Y axis. For convenience of explanation, among the three clamps, the center clamp 40 is referred to as a “center clamp”, and the clamps 41 and 42 on both sides are referred to as “end clamps”. The center clamp 40 grips the vicinity of the center portion of the first side of the substrate 11. Further, the end clamps 41 and 42 respectively grip the vicinity of the end of the first side of the substrate 11.

  The end clamps 41 and 42 are arranged substantially line-symmetrically with an imaginary line passing through the center of the center clamp 40 in the Y-axis direction and parallel to the X-axis as an axis of symmetry. Thus, since the center clamp 40 and the end clamps 41 and 42 are symmetrically arranged, the first side of the substrate 11 can be gripped almost uniformly over the entire length.

  The second clamp mechanism 32 is disposed to face the first clamp mechanism 31. The second clamp mechanism 32 has three clamps 43, 44, and 45 arranged along the Y axis. For convenience of explanation, among the three clamps, the center clamp 43 is referred to as “center clamp”, and the clamps 44 and 45 on both sides are referred to as “end clamps”. The center clamp 43 grips the vicinity of the center portion of the second side of the substrate 11. Further, the end clamps 44 and 45 respectively grip the vicinity of the end of the second side of the substrate 11.

  The end clamps 44 and 45 are arranged substantially line-symmetrically with an imaginary line passing through the center of the center clamp 43 in the Y-axis direction and parallel to the X-axis as the symmetry axis. Thus, since the center clamp 43 and the end clamps 44 and 45 are symmetrically arranged, the second side of the substrate 11 can be gripped substantially uniformly over the entire length thereof.

  The third clamp mechanism 33 has one clamp 46. The clamp 46 grips the third side of the substrate 11 over substantially its entire length.

  The fourth clamp mechanism 34 is disposed opposite to the third clamp mechanism 33 and has one clamp 47. The clamp 47 grips the fourth side of the substrate 11 over substantially the entire length.

  As shown in FIG. 3, the first clamp mechanism 31 includes two first side positioning guides 50 and 51. The first side positioning guides 50 and 51 are arranged so as to be able to contact each other in the vicinity of the end of the first side of the substrate 11 placed on the substrate fixing device 20 (see FIG. 5 and the like).

  As shown in FIG. 3, the third clamp mechanism 33 includes two third side positioning guides 52 and 53. The third side positioning guides 52 and 53 are arranged so as to be able to contact each other in the vicinity of the end of the third side of the substrate 11 placed on the substrate fixing device 20 (see FIG. 5 and the like).

  As shown in FIG. 3, the substrate fixing device 20 includes a substrate shifting mechanism 35. The board moving mechanism 35 includes a board moving member 48 that can move forward and backward, and a drive unit 49 that drives the board moving member 48 to move forward and backward. The board shifting mechanism 35 is arranged corresponding to the corner (cadence) at which the second side and the fourth side of the board 11 intersect. The drive unit 49 is controlled by the control unit 27.

  As shown in FIG. 4, the substrate abutting member 48 is configured to be retracted to a position where it does not come into contact with the substrate 11 placed on the substrate fixing device 20. Further, as shown in FIG. 5, the driving unit 49 advances the substrate abutting member 48 to bring the substrate abutting member 48 into contact with the corner of the substrate 11, so that the substrate 11 is moved with respect to the X axis and the Y axis. And can be pushed diagonally. By pressing the substrate 11 by the substrate shifting member 48, the first side of the substrate 11 is pressed against the first side positioning guides 50 and 51, and the third side of the substrate 11 is pressed against the third side positioning guides 52 and 53, respectively. (State of FIG. 5). Thus, the substrate 11 can be positioned with respect to the substrate fixing device 20.

  The substrate fixing device 20 includes a first moving mechanism 55. The first moving mechanism 55 is configured to relatively move the first clamp mechanism 31 and the second clamp mechanism 32 in a direction parallel to the X axis. Thereby, the 1st clamp mechanism 31 and the 2nd clamp mechanism 32 can be relatively moved in the direction which approaches or spaces apart. The operation of the first moving mechanism 55 is controlled by the control unit 27.

  In addition, the 1st moving mechanism 55 of this embodiment is comprised so that only the 2nd clamp mechanism 32 may be moved and the 1st clamp mechanism 31 may not be moved. The first clamp mechanism 31 is fixed to the main body of the substrate fixing device 20. Accordingly, the first clamp mechanism 31 is fixed to the housing 12 of the board inspection apparatus 10.

  Further, the substrate fixing device 20 includes a second moving mechanism 56. The second moving mechanism 56 is configured to be able to relatively move the third clamp mechanism 33 and the fourth clamp mechanism 34 in a direction parallel to the Y axis. Thereby, the 3rd clamp mechanism 33 and the 4th clamp mechanism 34 can be relatively moved in the direction which approaches or spaces apart. The operation of the second moving mechanism 56 is controlled by the control unit 27.

  In addition, the 2nd moving mechanism 56 of this embodiment is comprised so that both the 3rd clamp mechanism 33 and the 4th clamp mechanism 34 can be moved.

  Subsequently, the operation of fixing the substrate 11 by the substrate fixing device 20 of the present embodiment will be specifically described step by step.

  First, as illustrated in FIG. 3, the control unit 27 sets all the clamps 40 to 47 to a released state (a state in which gripping is released). Next, the substrate 11 to be inspected is placed on the substrate fixing device 20. FIG. 4 shows a state where the substrate 11 is placed on the substrate fixing device 20.

  The method for placing the substrate 11 on the substrate fixing device 20 is not particularly limited. For example, the substrate inspection apparatus 10 of this embodiment includes a substrate transfer device (not shown) for transferring the substrate 11. The controller 27 places the substrate 11 on the substrate fixing device 20 by appropriately controlling the substrate transfer device. However, the present invention is not limited to this, and the substrate 11 may be placed on the substrate fixing device 20 by, for example, an operator's manual work.

  Subsequently, the control unit 27 drives the drive unit 49 of the substrate alignment mechanism 35 to advance the substrate alignment member 48 (FIG. 5, positioning step). As a result, the substrate 11 is pushed obliquely by the substrate abutting member 48 and the substrate 11 is pressed against the positioning guides 50 to 53, so that the substrate 11 is positioned with respect to the substrate fixing device 20.

  Next, the control unit 27 drives the drive unit 49 of the substrate alignment mechanism 35 to retract the substrate alignment member 48. Thus, after the positioning of the substrate 11 is finished, the substrate abutting member 48 is quickly retracted. Thereby, it can prevent that the board | substrate approach member 48 becomes obstructive at a later process (1st step to 5th step).

  Subsequently, the control unit 27 causes the central clamps 40 and 43 to grip the vicinity of the central part of the first side and the second side of the substrate 11 (FIG. 6, first step). Thereby, the center part of the Y-axis direction of the board | substrate 11 is fixed.

  That is, the substrate 11 handled by the substrate fixing device 20 according to the present embodiment is a flexible substrate such as a coreless substrate. Therefore, the substrate 11 placed on the substrate fixing device 20 is warped or bent. There is a possibility. If both ends of the substrate 11 that is warped or bent are first fixed, the substrate 11 is distorted.

  Therefore, as described above, the substrate fixing device 20 of the present embodiment is configured to first grip the vicinity of the central portion of the first side and the second side of the substrate 11. Thus, by fixing the center part of the board | substrate 11 first, it can prevent that distortion arises when the edge part of the board | substrate 11 is fixed later.

  Next, the control unit 27 causes the clamps 46 and 47 to grip the third side and the fourth side of the substrate 11 (FIG. 7, second step). As described above, the clamp 46 is configured to grip the third side of the substrate 11 over substantially the entire length. The clamp 47 is configured to grip the fourth side of the substrate 11 over almost the entire length. Therefore, by holding the substrate 11 with the clamps 46 and 47, both ends of the substrate 11 in the Y-axis direction are fixed. As described above, since the central portion of the substrate 11 in the Y-axis direction is fixed first, distortion is less likely to occur when both ends in the Y-axis direction are fixed.

  Next, the control unit 27 drives the second moving mechanism 56 to relatively move the third clamp mechanism 33 and the fourth clamp mechanism 34 in directions away from each other (FIG. 8, third step). As described above, the second moving mechanism 56 of the present embodiment is configured to move both the clamp mechanisms 33 and 34. That is, the second moving mechanism 56 moves the third clamp mechanism 33 in a direction away from the fourth clamp mechanism 34 and moves the fourth clamp mechanism 34 in a direction away from the third clamp mechanism 33.

  In this way, the substrate 11 is stretched in the Y-axis direction by relatively moving the clamp mechanisms 33 and 34 in the separating direction while the clamp mechanisms 33 and 34 hold the end of the substrate 11 in the Y-axis direction. Can be pulled as Thereby, tension (tension) can be applied to the substrate 11 in the Y-axis direction, and distortion and slackness of the substrate 11 can be eliminated.

  Furthermore, the control unit 27 holds the substrate 11 by the end clamps 41, 42, 44, and 45 of the first clamp mechanism 31 and the second clamp mechanism 32 while the substrate 11 is pulled in the Y-axis direction ( FIG. 9, 4th step). Thereby, the vicinity of both end portions of the first side and the second side of the substrate 11 is gripped.

  As described above, the vicinity of the central portion of the first side and the second side of the substrate 11 is already gripped by the central clamps 40 and 43. Therefore, by additionally grasping the vicinity of both end portions of the first side and the second side as described above, the first side and the second side are in a state of being gripped over almost the entire length (FIG. 9). State). That is, this fixes both ends of the substrate 11 in the X-axis direction.

  The control unit 27 holds the substrate 11 with all of the plurality of clamps 40, 41, and 42 included in the first clamp mechanism 31 and all of the plurality of clamps 43, 44, and 45 included in the second clamp mechanism 32. Thus, by driving the first moving mechanism 55, the first clamp mechanism 31 and the second clamp mechanism 32 are moved relative to each other in a direction away from each other (FIG. 10, fifth step).

  In this manner, the substrate 11 is stretched in the X-axis direction by relatively moving the clamp mechanisms 31 and 32 away from each other with the clamp mechanisms 31 and 32 gripping the end of the substrate 11 in the X-axis direction. Can be pulled as Thereby, tension (tension) can be applied to the substrate 11 in the X-axis direction, and distortion and looseness of the substrate 11 can be eliminated.

  As described above, the first moving mechanism 55 of the present embodiment is configured to move only the second clamp mechanism 32 and not to move the first clamp mechanism 31. Thus, in this embodiment, since the 1st clamp mechanism 31 is being fixed, the 1st edge | side of the board | substrate 11 does not move with the position positioned with the 1st edge | side positioning guides 50 and 51. FIG. Thereby, it can prevent that the position of the positioned 1st edge | side has shifted | deviated, and the positioning accuracy of the board | substrate 11 can be improved.

  As described above, according to the substrate fixing device 20 of the present embodiment, the flexible substrate 11 can be fixed with high positioning accuracy in a state in which warping, bending, and the like are eliminated. When the fixing of the substrate 11 is completed, the control unit 27 inspects the substrate 11 by the inspection units 21 and 22 (inspection step). Since the substrate 11 is fixed with high accuracy by eliminating warping and bending, the substrate 11 can be appropriately inspected.

  The inspection of the substrate 11 by the inspection units 21 and 22 is performed in a state where the substrate 11 is pulled in the X axis direction and the Y axis direction by the substrate fixing device 20 (a state where tension is applied). That is, if the tension is released, the substrate 11 may return to a warped or bent state, and inspection by the inspection units 21 and 22 may not be performed properly. By performing the inspection while the substrate 11 is pulled, the inspection can be performed in a state in which the warpage and the bending of the substrate 11 are eliminated.

  When the inspection of the substrate 11 is completed, the control unit 27 releases the grip by the clamps 40 to 47 of the substrate fixing device 20. Thereby, the fixation of the substrate 11 is released (fixation release step).

  In the substrate fixing device 20 of this embodiment, since the substrate 11 is fixed in a pulled state, stress is accumulated inside the substrate 11. For this reason, if the holding | grip by the clamps 40-47 is cancelled | released all at once, the said board | substrate 11 may bounce or break.

  Therefore, the control unit 27 of the present embodiment is configured to sequentially release the clamps 40 to 47 in the reverse order to when the substrate 11 is held when releasing the fixation of the substrate 11. Yes. Specifically, the control unit 27 first releases the grip by the end clamps 41, 42, 44, and 45, then releases the grip by the clamps 46 and 47, and finally performs the grip by the central clamps 40 and 43. To release. As a result, it is possible to avoid splashing and breakage when the fixing of the substrate 11 is released.

  As described above, the substrate fixing device 20 of this embodiment includes the first clamp mechanism 31, the second clamp mechanism 32, the third clamp mechanism 33, the fourth clamp mechanism 34, and the first moving mechanism 55. And a second moving mechanism 56.

  The first clamp mechanism 31 includes three clamps: a center clamp 40 that grips the vicinity of the center of the first side of the substrate 11, and two end clamps 41 and 42 that grip the vicinity of the end of the first side. Are arranged side by side along the first side. The second clamp mechanism 32 includes three clamps: a center clamp 43 that grips the vicinity of the center of the second side of the substrate 11 and two end clamps 44 and 45 that grip the vicinity of the end of the second side. Are arranged side by side along the second side.

  The third clamp mechanism 33 includes a clamp 46 that holds a third side orthogonal to the first side and the second side of the substrate 11. The fourth clamp mechanism 34 includes a clamp 47 that holds the fourth side of the substrate 11 that faces the third side.

  The first moving mechanism 55 relatively moves the first clamp mechanism 31 and the second clamp mechanism 32 in the state of holding the substrate 11 in the direction of separating. The second moving mechanism 56 relatively moves the third clamp mechanism 33 and the fourth clamp mechanism 34 in a state in which the substrate 11 is gripped in the separating direction.

  As described above, since the three clamps are arranged side by side along the first side and the second side of the substrate 11, the center portion of the substrate 11 can be gripped first, and then both end portions can be gripped thereafter. . Thereby, compared with the case where each side of the board | substrate 11 is hold | gripped at a stretch, it becomes difficult to produce distortion when holding the said board | substrate 11. FIG. Further, when the substrates are held by the clamp mechanism and moved in a direction in which the clamp mechanisms are separated from each other, the substrate 11 can be pulled and tension can be applied, and warping and bending can be eliminated.

  As described above, the control unit 27 of the present embodiment fixes the substrate 11 by executing the first step, the second step, the third step, the fourth step, and the fifth step in this order. ing.

  In the first step, the substrate 11 is held by the central clamps 40 and 43 of the first clamp mechanism 31 and the second clamp mechanism 32. In the second step, the substrate 11 is held by the third clamp mechanism 33 and the fourth clamp mechanism 34. In the third step, the second moving mechanism 56 relatively moves the third clamp mechanism 33 and the fourth clamp mechanism 34 in the separating direction. In the fourth step, the substrate 11 is held by the end clamps 41, 42, 44, 45 of the first clamp mechanism 31 and the second clamp mechanism 32. In the fifth step, the first clamp mechanism 31 and the second clamp mechanism 32 are moved relative to each other in the direction of separating by the first moving mechanism 55.

  By fixing the substrate in this order, the substrate 11 can be accurately fixed while applying tension to the substrate 11 to eliminate warping and bending.

  The preferred embodiment of the present invention has been described above, but the above configuration can be modified as follows, for example.

  In the said embodiment, in the 1st clamp mechanism 31 and the 2nd clamp mechanism 32, the edge part clamp is arrange | positioned one line symmetrically at both sides of the center clamp. However, the number of clamps provided in the clamps of the first clamp mechanism 31 and the second clamp mechanism 32 is not limited to this, and two or more clamps may be arranged on both sides of the central clamp. Also in this case, as in the above embodiment, if the clamps on both sides of the central clamp are arranged symmetrically with respect to an imaginary line passing through the center of the central clamp, the first side and the second side of the substrate 11 are arranged. It is preferable because it can be uniformly gripped over its entire length.

  However, it is not necessary to interpret that the number of clamps arranged in the first clamp mechanism 31 and the second clamp mechanism 32 and the arrangement thereof are limited to the above. For example, the number of clamps provided in the first clamp mechanism 31 and the second clamp mechanism 32 may be two, or an even number of four or more. In addition, the arrangement of the clamps provided side by side in the first clamp mechanism 31 and the second clamp mechanism 32 is not necessarily limited to a line-symmetric shape. The clamp mechanisms 31 and 32 only need to have a plurality of clamps that can grip the substrate 11 at different timings along the first side and the second side of the substrate 11. According to this, it is possible to grip the first side and the second side of the substrate 11 stepwise (gradually) by changing the timing of gripping the substrate 11 by the clamps of the clamp mechanisms 31 and 32. it can. Thereby, compared with the case where the 1st edge | side and 2nd edge | side of the board | substrate 11 are grasped at a stretch with one clamp, the bending and distortion which arise in the board | substrate 11 can be reduced.

  Further, the order of gripping the substrate 11 by each clamp and the timing of pulling (tensioning) the gripped substrate 11 are considered to be most effective in the example described in the above embodiment, but are not limited thereto. Should not be interpreted. Rather, the order of gripping the substrate 11 by each clamp and the timing of pulling the substrate 11 are appropriately changed according to the shape of the substrate 11 (eg, rectangular or square), the ease of warping, the ease of bending, etc. it can.

  In the above-described embodiment, each of the third clamp mechanism 33 and the fourth clamp mechanism 34 includes only one clamp. However, the third clamp mechanism 33 and / or the fourth clamp mechanism 34 also includes the first clamp mechanism 31 and the fourth clamp mechanism 34. Similar to the second clamp mechanism 32, a plurality of clamps may be arranged side by side.

DESCRIPTION OF SYMBOLS 10 Board | substrate inspection apparatus 11 Board | substrate 20 Board | substrate fixing apparatus 31 1st clamp mechanism 32 2nd clamp mechanism 33 3rd clamp mechanism 34 4th clamp mechanism 40-47 Clamp 55 1st moving mechanism 56 2nd moving mechanism

Claims (8)

A substrate fixing device for fixing a substantially rectangular and flexible substrate,
A first clamp mechanism having a plurality of clamps that hold the first side of the substrate arranged along the first side;
A second clamp mechanism having a plurality of clamps that hold the second side opposite to the first side of the substrate and arranged along the second side;
A third clamping mechanism having a clamp for gripping a third side substantially orthogonal to the first side and the second side of the substrate;
A fourth clamping mechanism having a clamp for gripping a fourth side facing the third side of the substrate;
A first moving mechanism for relatively moving the first clamping mechanism and the second clamping mechanism in a state of gripping the substrate in a direction of separating;
A second movement mechanism for relatively moving the third clamp mechanism and the fourth clamp mechanism in a state of gripping the substrate in a direction of separating;
A substrate fixing apparatus comprising: The substrate fixing device according to claim 1,
A first side positioning guide that can contact the first side of the substrate;
A third side positioning guide that can contact the third side of the substrate;
A board moving mechanism for moving the board in a direction to contact the first side positioning guide and the third side positioning guide;
A substrate fixing apparatus comprising: The substrate fixing device according to claim 2,
At least one of the first clamp mechanism and the third clamp mechanism is fixed to a main body of the substrate fixing apparatus. It is a board | substrate fixing device as described in any one of Claim 1 to 3,
The first clamping mechanism includes:
A center clamp for gripping the vicinity of the center of the first side;
An end clamp for gripping the vicinity of the end of the first side;
Arranged side by side along the first side,
The second clamping mechanism is
A center clamp for gripping the vicinity of the center of the second side;
An end clamp for gripping the vicinity of the end of the second side;
Are arranged side by side along the second side. The substrate fixing device according to claim 4,
A controller that controls each of the clamps, the first moving mechanism, and the second moving mechanism;
The substrate fixing device, wherein the control unit controls the substrate to be gripped by the end clamp after the substrate is gripped by the central clamp of the first clamp mechanism and the second clamp mechanism. The substrate fixing device according to claim 5,
The controller is
A first step of gripping the substrate with the central clamp of the first clamp mechanism and the second clamp mechanism;
A second step of gripping the substrate by the third clamp mechanism and the fourth clamp mechanism;
A third step of relatively moving the third clamp mechanism and the fourth clamp mechanism in a direction away from each other by the second movement mechanism;
A fourth step of gripping the substrate with the end clamps of the first clamp mechanism and the second clamp mechanism;
A fifth step of moving the first clamp mechanism and the second clamp mechanism relative to each other in a direction away from each other by the first movement mechanism;
A substrate fixing apparatus, wherein the substrate is fixed by executing in this order. The substrate fixing device according to claim 5 or 6,
When releasing the fixing of the substrate, the control unit releases the holding by each clamp in an order opposite to the order of holding the substrate. A substrate fixing device according to any one of claims 1 to 7,
An inspection unit for inspecting the substrate held by the substrate fixing device;
A board inspection apparatus comprising:

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