WO2014188702A1 - Substrate holding apparatus, and substrate inspection apparatus comprising the same - Google Patents

Substrate holding apparatus, and substrate inspection apparatus comprising the same Download PDF

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Publication number
WO2014188702A1
WO2014188702A1 PCT/JP2014/002632 JP2014002632W WO2014188702A1 WO 2014188702 A1 WO2014188702 A1 WO 2014188702A1 JP 2014002632 W JP2014002632 W JP 2014002632W WO 2014188702 A1 WO2014188702 A1 WO 2014188702A1
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WO
WIPO (PCT)
Prior art keywords
substrate
clamping mechanism
holding apparatus
clamps
grip
Prior art date
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PCT/JP2014/002632
Other languages
French (fr)
Inventor
Goichi TSUJI
Masayuki Tsujimoto
Kazuya Yamamoto
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Nidec-Read Corporation
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Publication date
Application filed by Nidec-Read Corporation filed Critical Nidec-Read Corporation
Publication of WO2014188702A1 publication Critical patent/WO2014188702A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards

Definitions

  • the present invention relates mainly to a substrate holding apparatus for holding a coreless substrate.
  • Patent documents 1 and 2 describe the substrate holding apparatus as described above.
  • Patent document 1 Japanese Patent No. 5179289
  • Patent document 2 Japanese Patent Application Laid-Open No. 2012-83252
  • the conventional substrate holding apparatus as described above is assumed to hold or fix a general build-up substrate.
  • the build-up substrate has a core layer (or a support layer) and has a certain degree of rigidity. Therefore, there is little worry that the substrate is warped or deflected when the substrate is held on the substrate holding apparatus.
  • the coreless substrate has been widespread.
  • the coreless substrate is obtained by removing the core layer (or the support layer) from the build-up substrate. Due to the absence of the core layer, the coreless substrate is expected to increase density of wiring in a build-up layer and to improve performance of a semiconductor package.
  • the coreless substrate however, has no core layer and thus has flexibility, which easily causes a warp and a deflection. Therefore, the conventional substrate holding apparatus cannot appropriately hold the coreless substrate in some cases.
  • the substrate holding apparatus in the Patent document 1 is configured to clamp and hold each of central portions of the four sides of the substrate, but four corners of the substrate in the held state are free.
  • the coreless substrate is held in the configuration described in the Patent document 1, it is hardly possible to prevent the four corners of the substrate from being warped and deflected.
  • the substrate holding apparatus in the Patent document 2 is configured to clamp and hold each of two opposed sides of the substrate, but the other two sides are not clamped. Thus, if the coreless substrate is held in the configuration described in the Patent document 2, the substrate is easily distorted.
  • the coreless substrate can be distorted when being held. If the substrate is distorted, the circuit pattern of the substrate cannot be appropriately inspected.
  • a configuration of a substrate holding apparatus for holding a substantially rectangular substrate having flexibility is provided as follows; namely, the substrate holding apparatus is provided with a first clamping mechanism, a second clamping mechanism, a third clamping mechanism, a fourth clamping mechanism, a first moving mechanism, and a second moving mechanism.
  • the first clamping mechanism has a line of a plurality of clamps configured to grip a first side of the substrate, along the first side.
  • the second clamping mechanism has a line of a plurality of clamps configured to grip a second side opposed to the first side of the substrate, along the second side.
  • the third clamping mechanism has a clamp configured to grip a third side substantially parallel to the first side and the second side of the substrate.
  • the fourth clamping mechanism has a clamp configured to grip a fourth side opposed to the third side of the substrate.
  • the first moving mechanism relatively moves the first clamping mechanism and the second clamping mechanism in a state of gripping the substrate, in a direction away from each other.
  • the second moving mechanism relatively moves the third clamping mechanism and the fourth clamping mechanism in a state of gripping the substrate, in a direction away from each other.
  • the first side and the second side of the substrate can be gripped in stages by providing the line of the plurality of clamps along the first side and the second side of the substrate.
  • the substrate is hardly distorted when being gripped, in comparison with a case where each of the sides of the substrate is gripped all at once.
  • the clamping mechanisms by moving the clamping mechanisms in the direction away from each other in the state of gripping the substrate by using the clamping mechanisms, the substrate can be pulled to apply tension. It is thus possible to solve the warp and the deflection.
  • the substrate holding apparatus described above is configured preferably as follows; namely, the substrate holding apparatus is provided with a first-side positioning guide, a third-side positioning guide, and a substrate pushing mechanism.
  • the first-side positioning guide can be in contact with the first side of the substrate.
  • the third-side positioning guide can be in contact with the third side of the substrate.
  • the substrate pushing mechanism moves the substrate in a direction of bringing the substrate into contact with the first-side positioning guide and the third-guide positioning guide.
  • the substrate can be positioned by bringing the positioning guides into contact with the two sides (or the first side and the third side) of the substrate.
  • the substrate can be held in an accurate position by gripping the substrate while being positioned.
  • At least one of the first clamping mechanism and the third clamping mechanism is preferably fixed or held with respect to a main body of the substrate holding apparatus.
  • the determined position of the substrate is shifted.
  • the shift of the position of the substrate determined by the positioning guides is prevented by setting at least one of the first clamping mechanism and the third clamping mechanism to remain still, as described above.
  • the substrate holding apparatus described above is configured preferably as follows.
  • the first clamping mechanism is provided, along the first side, with a line of: a central clamp configured to grip a central portion of the first side in the vicinity of a central portion thereof; and end clamps configured to grip the first side in the vicinity of end portions thereof.
  • the second clamping mechanism is provided, along the second side, with a line of: a central clamp configured to grip a central portion of the second side in the vicinity of a central portion thereof; and end clamps configured to grip the second side in the vicinity of end portions thereof.
  • the clamps configured to grip the central portions of the substrate and the clamps configured to grip the end portions are separately provided, for example, the central portions of the substrate can be firstly gripped, and then, the end portions can be gripped.
  • the substrate holding apparatus described above is configured preferably as follows.
  • the substrate holding apparatus is provided with a control unit configured to control each of the clamps, the first moving mechanism, and the second moving mechanism.
  • the control unit performs the control such that the substrate is firstly gripped by the central clamps of the first clamping mechanism and the second clamping mechanism and is then gripped by the end clamps.
  • the substrate is held without solving the warp and the deflection of the substrate, and the substrate is thus distorted. Therefore, as described above, the central portions of the substrate are firstly gripped, and the both end portions are then gripped. By this, the warp and the deflection of the substrate can be solved, and the substrate can be certainly held.
  • the substrate holding apparatus described above is configured preferably as follows; namely, the substrate is held by the control unit performing a first step, a second step, a third step, a fourth step, and a fifth step in this order.
  • the substrate is gripped by the central clamps of the first clamping mechanism and the second clamping mechanism.
  • the substrate is gripped by the third clamping mechanism and the fourth clamping mechanism.
  • the third clamping mechanism and the fourth clamping mechanism are relatively moved in the direction away from each other, by the second moving mechanism.
  • the substrate is gripped by the end clamps of the first clamping mechanism and the second clamping mechanism.
  • the first clamping mechanism and the second clamping mechanism are relatively moved in the direction away from each other, by the first moving mechanism.
  • control unit preferably releases the grip by each of the clamps in order opposite to the order of gripping the substrate, when releasing the holding of the substrate.
  • the substrate holding apparatus of the present invention in this application holds the substrate while applying tension to the gripped substrate, and stress is thus accumulated in the inside of the substrate in the held state. If the grip by the clamps is released in inappropriate order, the stress in the inside of the substrate is suddenly released, which causes the substrate to bounce up or to be damaged. Therefore, as described above, the bounce of the substrate or the like is prevented by releasing the grip by the clamps in the order opposite to the order of gripping the substrate.
  • a substrate inspection apparatus provided with the aforementioned substrate holding apparatus, and an inspection unit configured to inspect the substrate held by the substrate holding apparatus.
  • FIG. 1 is a schematic front view illustrating a substrate inspection apparatus in an embodiment of the present invention.
  • FIG. 2 is a schematic plan view illustrating a substrate as an inspection object by the substrate inspection apparatus in the embodiment.
  • FIG. 3 is a plan view illustrating a substrate holding apparatus in the embodiment.
  • FIG. 4 is a plan view illustrating that a substrate is mounted on the substrate holding apparatus.
  • FIG. 5 is a plan view illustrating positioning steps.
  • FIG. 6] is a plan view illustrating a first step.
  • FIG. 7 is a plan view illustrating a second step.
  • FIG. 8 is a plan view illustrating a third step.
  • FIG. 9 is a plan view illustrating a fourth step.
  • FIG. 10 is a plan view illustrating a fifth step.
  • FIG. 1 is a schematic front view illustrating a substrate inspection apparatus 10 in the embodiment.
  • the substrate inspection apparatus 10 in the embodiment is an apparatus for inspecting a circuit pattern formed on a substrate 11 having flexibility such as a coreless substrate.
  • the substrate inspection apparatus 10 has a case or housing 12.
  • a substrate holding apparatus 20 In an interior space of the case 12, there are mainly provided a substrate holding apparatus 20, a first inspection unit 21, and a second inspection unit 22.
  • the substrate holding apparatus 20 is configured to hold the substrate 11 as an inspection object in a predetermined position.
  • the first inspection unit 21 is located above the substrate 11 held on the substrate holding apparatus 20.
  • the second inspection unit 22 is located below the substrate 11 held on the substrate holding apparatus 20.
  • Each of the first inspection unit 21 and the second inspection unit 22 has an inspection jig 23 for inspecting the circuit pattern formed on the substrate 11.
  • Each of the first inspection unit 21 and the second inspection unit 22 also has an inspection unit moving mechanism 25 for moving in the case 12 as occasion demands.
  • the substrate inspection apparatus 10 is provided with a control unit 27 configured to control the substrate holding apparatus 20, the first inspection unit 21, and the second inspection unit 22 or the like.
  • the control unit 27 is configured to move the inspection units 21 and 22 as occasion demands, and to bring the inspection jigs 23 into contact with the substrate 11 held by the substrate holding apparatus 20, thereby inspecting the circuit pattern of the substrate 11 by using the inspection jigs 23.
  • the substrate holding apparatus 20 in the embodiment is assumed to hold the substrate 11 having flexibility such as the coreless substrate.
  • the substrate 11 is rectangular (or substantially rectangular). As illustrated in FIG. 2, for convenience of explanation, one of the four sides of the rectangular substrate 11 is referred to as a "first side", and a side opposed to the first side is referred to as a "second side". One of the sides perpendicular to the first side and the second side is referred to as a "third side", and a side opposed to the third side is referred to as a "fourth side".
  • the substrate 11 in the embodiment is rectangular, wherein the first side and the second side are the long sides.
  • the substrate 11 may be square. In order to emphasize the substrate 11 in an easy-to-understand manner on the drawing, the substrate 11 is hatched.
  • the substrate holding apparatus 20 has a plurality of clamps 40 to 47.
  • Each of the clamps 40 to 47 has a mounting unit 30.
  • the substrate 11 By mounting the substrate 11 on each mounting unit 30, the substrate 11 can be supported in a substantially horizontal posture.
  • a state in which the substrate 11 is mounted on each mounting unit 30 (or a state illustrated in FIG. 4) may be expressed as "a state in which the substrate 11 is mounted on the substrate holding apparatus 20" in some cases.
  • Each of the clamps 40 to 47 is configured to grip or clamp the substrate 11 mounted on the mounting unit 30. Moreover, each of the clamps 40 to 47 is provided with a drive mechanism such as, for example, a pneumatic actuator (not illustrated) and is configured to change its state between a state in which the substrate 11 is gripped and a state in which the grip is released.
  • the drive mechanism of each of the clamps 40 to 47 is controlled by the aforementioned control unit 27. Since the configuration of this type of clamp is known, an explanation of the detailed configuration of the clamps 40 to 47 is omitted.
  • the substrate 11 can be held or fixed with respect to the substrate holding apparatus 20.
  • an axis parallel to the first side and the second side of the substrate 11 is set to be a Y axis of the substrate holding apparatus 20
  • an axis parallel to the third side and the fourth side is set to be an X axis of the substrate holding apparatus 20.
  • the substrate holding apparatus 20 in the embodiment is provided with clamping mechanisms corresponding to the respective sides of the substrate 11. Specifically, as illustrated in FIG. 3, the substrate holding apparatus 20 is provided with a first clamping mechanism 31 corresponding to the first side of the substrate 11, a second clamping mechanism 32 corresponding to the second side, a third clamping mechanism 33 corresponding to the third side, and a fourth clamping mechanism 34 corresponding to the fourth side.
  • the first clamping mechanism 31 has a line of three clamps 40, 41 and 42 along the Y axis.
  • the clamp 40 in the center of the three clamps is referred to as a "central clamp”, and the clamps 41 and 42 on both sides are referred to as "end clamps".
  • the central clamp 40 grips the first side of the substrate 11 in the vicinity of a central portion thereof.
  • the end clamps 41 and 42 grip the first side of the substrate in the vicinity of respective end portions thereof.
  • the end clamps 41 and 42 are arranged substantially line-symmetrically. As described above, the central clamp 40 and the end clamps 41 and 42 are symmetrically arranged, and thus, the first side of the substrate 11 can be gripped, substantially uniformly, over substantially the full length thereof.
  • the second clamping mechanism 32 is opposed to the first clamping mechanism 31.
  • the second clamping mechanism 32 has a line of three clamps 43, 44 and 45 along the Y axis.
  • the clamp 43 in the center of the three clamps is referred to as a "central clamp”
  • the clamps 44 and 45 on both sides are referred to as "end clamps”.
  • the central clamp 43 grips the second side of the substrate 11 in the vicinity of a central portion thereof.
  • the end clamps 44 and 45 grip the second side of the substrate in the vicinity of respective end portions thereof.
  • the end clamps 44 and 45 are arranged substantially line-symmetrically. As described above, the central clamp 43 and the end clamps 44 and 45 are symmetrically arranged, and thus, the second side of the substrate 11 can be gripped, substantially uniformly, over substantially the full length thereof.
  • the third clamping mechanism 33 has one clamp 46.
  • the clamp 46 grips the third side of the substrate 11 over substantially the full length thereof.
  • the fourth clamping mechanism 34 is opposed to the third clamping mechanism 33 and has one clamp 47.
  • the clamp 47 grips the fourth side of the substrate 11 over substantially the full length thereof.
  • the first clamping mechanism 31 is provided with two first-side positioning guides 50 and 51.
  • the first-side positioning guides 50 and 51 are disposed such that the first-side positioning guides 50 and 51 can be in contact with the first side in the vicinity of the end portions thereof, in the substrate 11 in the state of being mounted on the substrate holding apparatus 20 (refer to FIG. 5 and the like).
  • the third clamping mechanism 33 is provided with two third-side positioning guides 52 and 53.
  • the third-side positioning guides 52 and 53 are disposed such that the third-side positioning guides 52 and 53 can be in contact with the third side in the vicinity of the end portions thereof, in the substrate 11 in the state of being mounted on the substrate holding apparatus 20 (refer to FIG. 5 and the like).
  • the substrate holding apparatus 20 is provided with a substrate pushing mechanism 35.
  • the substrate pushing mechanism 35 is provided with a substrate pushing member 48 capable of advancing and retreating, and a drive unit 49 configured to perform advance / retreat drive of the substrate pushing member 48.
  • the substrate pushing mechanism 35 is disposed correspondingly to a corner of the second side and the four side of the substrate 11.
  • the drive unit 49 is controlled by the control unit 27.
  • the substrate pushing member 48 is configured to retreat to a position at which the substrate pushing member 48 is not in contact with the substrate 11 in the state of being mounted on the substrate holding apparatus 20. Moreover, as illustrated in FIG. 5, by using the drive unit 49 to advance the substrate pushing member 48, the substrate pushing member 48 can be brought into contact with the corner of the substrate 11 to push the substrate 11 in a direction oblique to the X axis and the Y axis. By pushing the substrate 11 by using the substrate pushing member 48, the first side of the substrate 11 is pushed against the first-side positioning guides 50 and 51, and the third side of the substrate 11 is pushed against the third-side positioning guides 52 and 53 (in a state in FIG. 5). This makes it possible to position the substrate 11 with respect to the substrate holding apparatus 20.
  • the substrate holding apparatus 20 is provided with a first moving mechanism 55.
  • the first moving mechanism 55 is configured to relatively move the first clamping mechanism 31 and the second clamping mechanism 32 in a direction parallel to the X axis. This makes it possible to relatively move the first clamping mechanism 31 and the second clamping mechanism 32 in a direction close to each other or in a direction away from each other.
  • the operation of the first moving mechanism 55 is controlled by the control unit 27.
  • the first moving mechanism 55 in the embodiment is configured to move only the second clamping mechanism 32 but not to move the first clamping mechanism 31.
  • the first clamping mechanism 31 is fixed or held with respect to a main body of the substrate holding apparatus 20. Therefore, the first clamping mechanism 31 is fixed or held with respect to the case 12 of the substrate holding apparatus 20.
  • the substrate holding apparatus 20 is also provided with a second moving mechanism 56.
  • the second moving mechanism 56 is configured to relatively move the third clamping mechanism 33 and the fourth clamping mechanism 34 in a direction parallel to the Y axis. This makes it possible to relatively move the third clamping mechanism 33 and the fourth clamping mechanism 34 in a direction close to each other or in a direction away from each other.
  • the operation of the second moving mechanism 56 is controlled by the control unit 27.
  • the second moving mechanism 56 in the embodiment is configured to move both the third clamping mechanism 33 and the fourth clamping mechanism 34
  • control unit 27 sets all the clamps 40 to 47 in an open state (or in the state in which the grip is released), as illustrated in FIG. 3. Then, the substrate 11 as the inspection object is mounted on the substrate holding apparatus 20.
  • FIG. 4 illustrates the state in which the substrate 11 is mounted on the substrate holding apparatus 20.
  • a method of mounting the substrate 11 on the substrate holding apparatus 20 is not particularly limited.
  • the substrate inspection apparatus 10 in the embodiment is provided with a substrate transfer apparatus (not illustrated) configured to transfer the substrate 11.
  • the control unit 27 controls the substrate transfer apparatus, as occasion demands, to mount the substrate 11 on the substrate holding apparatus 20.
  • the method is not limited to this example; for example, the substrate 11 may be mounted on the substrate holding apparatus 20 manually by an operator.
  • control unit 27 drives the drive unit 49 of the substrate pushing mechanism 35 to advance the substrate pushing member 48 (or a positioning step in FIG. 5).
  • the substrate 11 is obliquely pushed by the substrate pushing member 48, and the substrate 11 is pushed against the positioning guides 50 to 53.
  • the substrate 11 is positioned with respect to the substrate holding apparatus 20.
  • control unit 27 drives the drive unit 49 of the substrate pushing mechanism 35 to make the substrate pushing member 48 retreat.
  • the substrate pushing member 48 is made to quickly retreat. This can prevent the substrate pushing member 48 from hindering subsequent steps (i.e. a first step to a fifth step).
  • control unit 27 controls the central clamps 40 and 43 to grip the first side and the second side in the vicinity of the central portions thereof (or a first step in FIG. 6). By this, the central portions of the substrate 11 in the Y axis direction are held.
  • the substrate 11 treated by the substrate holding apparatus 20 in the embodiment is a substrate having flexibility such as the coreless substrate, and thus, the substrate 11 in the state of being mounted on the substrate holding apparatus 20 is likely warped or deflected. If the both end portions of the warped or deflected substrate 11 are firstly held, the substrate 11 will be distorted.
  • the substrate holding apparatus 20 in the embodiment is configured to grip the first side and the second side of the substrate, firstly in the vicinity of the central portions thereof, as described above. By firstly holding the central portions of the substrate 11, it is possible to prevent the distortion from occurring when the end portions of the substrate 11 are held later.
  • the control unit 27 controls the clamps 46 and 47 to grip the third side and the fourth side of the substrate 11 (or a second step in FIG. 7).
  • the clamp 46 is configured to grip the third side of the substrate 11 over substantially the full length thereof.
  • the clamp 47 is configured to grip the fourth side of the substrate 11 over substantially the full length thereof. Therefore, by using the clamps 46 and 47 to grip the substrate 11, the both end portions of the substrate 11 in the Y axis direction are held.
  • the central portions of the substrate 11 in the Y axis are firstly fixed, and the distortion thus hardly occurs when the both end portions in the Y axis direction are held.
  • the control unit 27 drives the second moving mechanism 56 to relatively move the third clamping mechanism 33 and the fourth clamping mechanism 34 in the direction away from each other (or a third step in FIG. 8).
  • the second moving mechanism 56 is configured to move both the clamping mechanisms 33 and 34. In other words, the second moving mechanism 56 moves the third clamping mechanism 33 in a direction away from the fourth clamping mechanism 34, and moves the fourth clamping mechanism 34 in a direction away from the third clamping mechanism 33.
  • the substrate 11 can be pulled to be extended in the Y axis direction.
  • control unit 27 controls the end clamps 41, 42, 44 and 45 of the first clamping mechanism 31 and the second clamping mechanism 32 to grip the substrate 11 in the state in which the substrate 11 is pulled in the Y axis direction (or a fourth step in FIG. 9). By this, the first side and the second side of the substrate 11 are gripped in the vicinity of the end portions thereof.
  • the first side and the second side of the substrate 11 are already gripped in the vicinity of the central portions thereof by the central clamps 40 and 43. Therefore, by additionally gripping the first side and the second side in the vicinity of the end portions thereof as described above, the first side and the second side are in a state of being gripped over substantially the full length thereof (or in a state in FIG. 9). In other words, by this, the both end portions of the substrate 11 in the X axis direction are held.
  • the control unit 27 drives the first moving mechanism 55 in the state in which the substrate 11 is gripped by all the plurality of clamps 40, 41 and 42 of the first clamping mechanism 31 and all the plurality of clamps 43, 44 and 45 of the second clamping mechanism 32, thereby relatively move the first clamping mechanism 31 and the second clamping mechanism 32 in the direction away from each other (or a fifth step in FIG. 10).
  • the substrate 11 can be pulled to be extended in the X axis direction.
  • the first moving mechanism 55 in the embodiment is configured to move only the second clamping mechanism 32 but not to move the first clamping mechanism 31.
  • the first clamping mechanism 31 is fixed or held, and the first side of the substrate 11 thus remains still in the position determined by the first-side positioning guides 50 and 51. This can prevent the determined position of the first side from being shifted, and can improve the poisoning accuracy of the substrate 11.
  • the substrate 11 having flexibility can be held with good positioning accuracy in the state in which the warp and the deflection or the like are solved.
  • the control unit 27 inspects the substrate 11 by using the inspection units 21 and 22 (or an inspection step). The substrate 11 is accurately held, with the warp and the deflection solved. It is thus possible to appropriately inspect the substrate 11.
  • the inspection of the substrate 11 by the inspection units 21 and 22 is performed while the substrate 11 remains pulled in the X axis direction and in the Y axis direction by the substrate holding apparatus 20 (i.e. while the tension is applied). In other words, if the pulling is stopped or released, chances are that the warp and the deflection will occur again in the substrate 11 and that the inspection by the inspection units 21 and 22 cannot be appropriately performed.
  • the inspection can be performed in the state in which the warp and the deflection of the substrate 11 are solved.
  • control unit 27 releases the grip by the clamps 40 to 47 of the substrate holding apparatus 20. By this, the holding of the substrate 11 is released (or a holding release step).
  • the substrate holding apparatus 20 in the embodiment since the substrate 11 is held in the state of being pulled, stress is accumulated in the inside of the substrate 11. Thus, if the grip by the clamps 40 to 47 is released all at once, the substrate 11 likely bounces up or is damaged.
  • the control unit 27 in the embodiment is configured to release the grip of the clamps 40 to 47 in order opposite to the order of gripping the substrate 11. Specifically, the control unit 27 firstly releases the grip by the end clamps 41, 42, 44 and 45, then releases the grip by the clamps 46 and 47, and lastly releases the grip by the central clamps 40 and 43. This can avoid the bounce and the damage when the holding of the substrate 11 is released.
  • the substrate holding apparatus 20 in the embodiment is provided with the first clamping mechanism 31, the second clamping mechanism 32, the third clamping mechanism 33, the fourth clamping mechanism 34, the first moving mechanism 55, and the second moving mechanism 56.
  • the first clamping mechanism 31 is provided with a line of three clamps along the first side, wherein the three clamps are the central clamp 40 configured to grip the first side of the substrate 11 in the vicinity of the central portion thereof, and the end clamps 41 and 42 configured to grip the first side in the vicinity of the end portions thereof.
  • the second clamping mechanism 32 is provided with a line of three clamps along the second side, wherein the three clamps are the central clamp 43 configured to grip the second side of the substrate 11 in the vicinity of the central portion thereof, and the end clamps 44 and 45 configured to grip the second side in the vicinity of the end portions thereof.
  • the third clamping mechanism 33 has the clamp 46 configured to grip the third side perpendicular to the first side and the second side of the substrate 11.
  • the fourth clamping mechanism 34 has the clamp 47 configured to grip the fourth side opposed to the third side of the substrate 11.
  • the first moving mechanism 55 relatively moves the first clamping mechanism 31 and the second clamping mechanism 32 in the state of gripping the substrate 11, in the direction away from each other.
  • the second moving mechanism 56 relatively moves the third clamping mechanism 33 and the fourth clamping mechanism 34 in the state of gripping the substrate 11, in the direction away from each other.
  • the central portions of the substrate 11 can be firstly gripped, and then, the end portions can be gripped.
  • the substrate 11 is hardly distorted when being gripped, in comparison with the case where each of the sides of the substrate 11 is gripped all at once.
  • the clamping mechanisms by moving the clamping mechanisms in the direction away from each other in the state of gripping the substrate by using the clamping mechanisms, the substrate 11 can be pulled to apply tension. It is thus possible to solve the warp and the deflection.
  • the substrate 11 is held by the control unit 27 in the embodiment performing the first step, the second step, the third step, the fourth step, and the fifth step in this order.
  • the substrate 11 is gripped by the central clamps 40 and 43 of the first clamping mechanism 31 and the second clamping mechanism 32.
  • the substrate 11 is gripped by the third clamping mechanism 33 and the fourth clamping mechanism 34.
  • the third clamping mechanism 33 and the fourth clamping mechanism 34 are relatively moved in the direction away from each other, by the second moving mechanism 56.
  • the substrate 11 is gripped by the end clamps 41, 42, 44 and 45 of the first clamping mechanism 31 and the second clamping mechanism 32.
  • the first clamping mechanism 31 and the second clamping mechanism 32 are relatively moved in the direction away from each other, by the first moving mechanism 55.
  • one end clamp is disposed on each side of the central clamp, line-symmetrically.
  • the number of the clamps of the first clamping mechanism 31 and the second clamping mechanism 32 is not limited to this example, and two or more clamps may be disposed on each side of the central clamp. Even in this case, as in the aforementioned embodiment, if the clamps on the both sides of the central clamp are arranged line-symmetrically with a virtual line crossing the center of the central clamp as an axis of symmetry, then, the first side and the second side of the substrate 11 can be gripped uniformly over the full length thereof, which is preferable.
  • the number of the line of the clamps of the first clamping mechanism 31 and the second clamping mechanism 32 and the arrangement thereof do not have to be interpreted as being limited to the above.
  • the number of the line of the clamps of the first clamping mechanism 31 and the second clamping mechanism 32 may be an even number, such as two, four or more.
  • the arrangement of the line of the clamps of the first clamping mechanism 31 and the second clamping mechanism 32 is not necessarily limited to the line-symmetry.
  • Each of the clamping mechanisms 31 and 32 may have the line of the plurality of clamps which allows the substrate 11 to be gripped at different timing, along respective one of the first side and the second side of the substrate 11.
  • the order of gripping the substrate 11 by using each clamp and the timing of pulling (or applying tension to) the gripped substrate 11 are considered to be most effective in the example explained in the embodiment; however, it should not be interpreted as being limited to this example.
  • the order of gripping the substrate 11 by using each clamp and the timing of pulling the gripped substrate 11 can be changed, as occasion demands, depending on the shape of the substrate 11 (rectangular, square, etc.), how easily the substrate 11 is warped, how easily the substrate 11 is deflected, or the like.
  • each of the third clamping mechanism 33 and the fourth clamping mechanism 34 has only one clamp; however, the third clamping mechanism 33 and/or the fourth clamping mechanism 34 can be configured to have a line of a plurality of clamps, as in the first clamping mechanism 31 and the second clamping mechanism 32.
  • substrate inspection apparatus 11 substrate 20 substrate holding apparatus 31 first clamping mechanism 32 second clamping mechanism 33 third clamping mechanism 34 fourth clamping mechanism 40 to 47 clamp 55 first moving mechanism 56 second moving mechanism

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

In a first step, a substrate 11 is gripped by central clamps 40 and 43 of a first clamping mechanism 31 and a second clamping mechanism 32. In a second step, the substrate 11 is gripped by a third clamping mechanism 33 and a fourth clamping mechanism 34. In a third step, the third clamping mechanism 33 and the fourth clamping mechanism 33 are relatively moved in a direction away from each other, by the second moving mechanism 56. In a fourth step, the substrate 11 is gripped by end clamps 41, 42, 44 and 45 of the first clamping mechanism 31 and the second clamping mechanism 32. In a fifth step, the first clamping mechanism 31 and the second clamping mechanism 32 are relatively moved in a direction away from each other, by the first moving mechanism 55.

Description

SUBSTRATE HOLDING APPARATUS, AND SUBSTRATE INSPECTION APPARATUS COMPRISING THE SAME
The present invention relates mainly to a substrate holding apparatus for holding a coreless substrate.
There is known a substrate inspection apparatus configured to inspect a circuit pattern formed on a substrate or a circuit board. This type of substrate inspection apparatus is provided with a substrate holding apparatus for holding the substrate in a predetermined position. Patent documents 1 and 2 describe the substrate holding apparatus as described above.
Prior Art Document
Patent Document
Patent document 1: Japanese Patent No. 5179289
Patent document 2: Japanese Patent Application Laid-Open No. 2012-83252
Problem to be Solved by the Invention
The conventional substrate holding apparatus as described above is assumed to hold or fix a general build-up substrate. The build-up substrate has a core layer (or a support layer) and has a certain degree of rigidity. Therefore, there is little worry that the substrate is warped or deflected when the substrate is held on the substrate holding apparatus.
In contrast, recently, the coreless substrate has been widespread. The coreless substrate is obtained by removing the core layer (or the support layer) from the build-up substrate. Due to the absence of the core layer, the coreless substrate is expected to increase density of wiring in a build-up layer and to improve performance of a semiconductor package.
The coreless substrate, however, has no core layer and thus has flexibility, which easily causes a warp and a deflection. Therefore, the conventional substrate holding apparatus cannot appropriately hold the coreless substrate in some cases.
For example, the substrate holding apparatus in the Patent document 1 is configured to clamp and hold each of central portions of the four sides of the substrate, but four corners of the substrate in the held state are free. Thus, if the coreless substrate is held in the configuration described in the Patent document 1, it is hardly possible to prevent the four corners of the substrate from being warped and deflected.
Moreover, the substrate holding apparatus in the Patent document 2 is configured to clamp and hold each of two opposed sides of the substrate, but the other two sides are not clamped. Thus, if the coreless substrate is held in the configuration described in the Patent document 2, the substrate is easily distorted.
As described above, in the conventional substrate holding apparatus, the coreless substrate can be distorted when being held. If the substrate is distorted, the circuit pattern of the substrate cannot be appropriately inspected.
In view of the above circumstances, it is therefore an object of the present invention to provide a configuration which allows appropriate holding of the substrate having flexibility such as the coreless substrate.
Means for Solving the Problem and Effect
The problem to be solved by the present invention is as described above. Next, means for solving the problem and its effect will be explained.
According to a viewpoint of the present invention in this application, a configuration of a substrate holding apparatus for holding a substantially rectangular substrate having flexibility is provided as follows; namely, the substrate holding apparatus is provided with a first clamping mechanism, a second clamping mechanism, a third clamping mechanism, a fourth clamping mechanism, a first moving mechanism, and a second moving mechanism. The first clamping mechanism has a line of a plurality of clamps configured to grip a first side of the substrate, along the first side. The second clamping mechanism has a line of a plurality of clamps configured to grip a second side opposed to the first side of the substrate, along the second side. The third clamping mechanism has a clamp configured to grip a third side substantially parallel to the first side and the second side of the substrate. The fourth clamping mechanism has a clamp configured to grip a fourth side opposed to the third side of the substrate. The first moving mechanism relatively moves the first clamping mechanism and the second clamping mechanism in a state of gripping the substrate, in a direction away from each other. The second moving mechanism relatively moves the third clamping mechanism and the fourth clamping mechanism in a state of gripping the substrate, in a direction away from each other.
As described above, the first side and the second side of the substrate can be gripped in stages by providing the line of the plurality of clamps along the first side and the second side of the substrate. By this, the substrate is hardly distorted when being gripped, in comparison with a case where each of the sides of the substrate is gripped all at once. Moreover, by moving the clamping mechanisms in the direction away from each other in the state of gripping the substrate by using the clamping mechanisms, the substrate can be pulled to apply tension. It is thus possible to solve the warp and the deflection.
The substrate holding apparatus described above is configured preferably as follows; namely, the substrate holding apparatus is provided with a first-side positioning guide, a third-side positioning guide, and a substrate pushing mechanism. The first-side positioning guide can be in contact with the first side of the substrate. The third-side positioning guide can be in contact with the third side of the substrate. The substrate pushing mechanism moves the substrate in a direction of bringing the substrate into contact with the first-side positioning guide and the third-guide positioning guide.
As described above, the substrate can be positioned by bringing the positioning guides into contact with the two sides (or the first side and the third side) of the substrate. The substrate can be held in an accurate position by gripping the substrate while being positioned.
In the substrate holding apparatus described above, at least one of the first clamping mechanism and the third clamping mechanism is preferably fixed or held with respect to a main body of the substrate holding apparatus.
If both the first side and the third side of the substrate are moved after the substrate is positioned, the determined position of the substrate is shifted. Thus, the shift of the position of the substrate determined by the positioning guides is prevented by setting at least one of the first clamping mechanism and the third clamping mechanism to remain still, as described above.
The substrate holding apparatus described above is configured preferably as follows. The first clamping mechanism is provided, along the first side, with a line of: a central clamp configured to grip a central portion of the first side in the vicinity of a central portion thereof; and end clamps configured to grip the first side in the vicinity of end portions thereof. The second clamping mechanism is provided, along the second side, with a line of: a central clamp configured to grip a central portion of the second side in the vicinity of a central portion thereof; and end clamps configured to grip the second side in the vicinity of end portions thereof.
As described above, if the clamps configured to grip the central portions of the substrate and the clamps configured to grip the end portions are separately provided, for example, the central portions of the substrate can be firstly gripped, and then, the end portions can be gripped.
The substrate holding apparatus described above is configured preferably as follows. The substrate holding apparatus is provided with a control unit configured to control each of the clamps, the first moving mechanism, and the second moving mechanism. The control unit performs the control such that the substrate is firstly gripped by the central clamps of the first clamping mechanism and the second clamping mechanism and is then gripped by the end clamps.
If the both end portions of the substrate are firstly gripped, the substrate is held without solving the warp and the deflection of the substrate, and the substrate is thus distorted. Therefore, as described above, the central portions of the substrate are firstly gripped, and the both end portions are then gripped. By this, the warp and the deflection of the substrate can be solved, and the substrate can be certainly held.
The substrate holding apparatus described above is configured preferably as follows; namely, the substrate is held by the control unit performing a first step, a second step, a third step, a fourth step, and a fifth step in this order. In the first step, the substrate is gripped by the central clamps of the first clamping mechanism and the second clamping mechanism. In the second step, the substrate is gripped by the third clamping mechanism and the fourth clamping mechanism. In the third step, the third clamping mechanism and the fourth clamping mechanism are relatively moved in the direction away from each other, by the second moving mechanism. In the fourth step, the substrate is gripped by the end clamps of the first clamping mechanism and the second clamping mechanism. In the fifth step, the first clamping mechanism and the second clamping mechanism are relatively moved in the direction away from each other, by the first moving mechanism.
By holding the substrate in this order, it is possible to accurately hold the substrate while applying tension to the substrate and solving the warp and the deflection.
In the substrate holding apparatus described above, the control unit preferably releases the grip by each of the clamps in order opposite to the order of gripping the substrate, when releasing the holding of the substrate.
In other words, the substrate holding apparatus of the present invention in this application holds the substrate while applying tension to the gripped substrate, and stress is thus accumulated in the inside of the substrate in the held state. If the grip by the clamps is released in inappropriate order, the stress in the inside of the substrate is suddenly released, which causes the substrate to bounce up or to be damaged. Therefore, as described above, the bounce of the substrate or the like is prevented by releasing the grip by the clamps in the order opposite to the order of gripping the substrate.
According to another viewpoint of the present invention in this application, there is provided a substrate inspection apparatus provided with the aforementioned substrate holding apparatus, and an inspection unit configured to inspect the substrate held by the substrate holding apparatus.
[FIG. 1] FIG. 1 is a schematic front view illustrating a substrate inspection apparatus in an embodiment of the present invention.
[FIG. 2] FIG. 2 is a schematic plan view illustrating a substrate as an inspection object by the substrate inspection apparatus in the embodiment.
[FIG. 3] FIG. 3 is a plan view illustrating a substrate holding apparatus in the embodiment.
[FIG. 4] FIG. 4 is a plan view illustrating that a substrate is mounted on the substrate holding apparatus.
[FIG. 5] FIG. 5 is a plan view illustrating positioning steps.
[FIG. 6] FIG. 6 is a plan view illustrating a first step.
[FIG. 7] FIG. 7 is a plan view illustrating a second step.
[FIG. 8] FIG. 8 is a plan view illustrating a third step.
[FIG. 9] FIG. 9 is a plan view illustrating a fourth step.
[FIG. 10] FIG. 10 is a plan view illustrating a fifth step.
Modes for Carrying Out the Invention
Next, an embodiment of the present invention will be explained with reference to the drawings. FIG. 1 is a schematic front view illustrating a substrate inspection apparatus 10 in the embodiment.
The substrate inspection apparatus 10 in the embodiment is an apparatus for inspecting a circuit pattern formed on a substrate 11 having flexibility such as a coreless substrate.
As illustrate in FIG. 1, the substrate inspection apparatus 10 has a case or housing 12. In an interior space of the case 12, there are mainly provided a substrate holding apparatus 20, a first inspection unit 21, and a second inspection unit 22.
The substrate holding apparatus 20 is configured to hold the substrate 11 as an inspection object in a predetermined position.
The first inspection unit 21 is located above the substrate 11 held on the substrate holding apparatus 20. The second inspection unit 22 is located below the substrate 11 held on the substrate holding apparatus 20. Each of the first inspection unit 21 and the second inspection unit 22 has an inspection jig 23 for inspecting the circuit pattern formed on the substrate 11. Each of the first inspection unit 21 and the second inspection unit 22 also has an inspection unit moving mechanism 25 for moving in the case 12 as occasion demands.
The substrate inspection apparatus 10 is provided with a control unit 27 configured to control the substrate holding apparatus 20, the first inspection unit 21, and the second inspection unit 22 or the like. The control unit 27 is configured to move the inspection units 21 and 22 as occasion demands, and to bring the inspection jigs 23 into contact with the substrate 11 held by the substrate holding apparatus 20, thereby inspecting the circuit pattern of the substrate 11 by using the inspection jigs 23.
Next, the substrate holding apparatus 20 in the embodiment will be explained in detail.
As described above, the substrate holding apparatus 20 in the embodiment is assumed to hold the substrate 11 having flexibility such as the coreless substrate. In general, the substrate 11 is rectangular (or substantially rectangular). As illustrated in FIG. 2, for convenience of explanation, one of the four sides of the rectangular substrate 11 is referred to as a "first side", and a side opposed to the first side is referred to as a "second side". One of the sides perpendicular to the first side and the second side is referred to as a "third side", and a side opposed to the third side is referred to as a "fourth side". The substrate 11 in the embodiment is rectangular, wherein the first side and the second side are the long sides. The substrate 11 may be square. In order to emphasize the substrate 11 in an easy-to-understand manner on the drawing, the substrate 11 is hatched.
As illustrated in FIG. 3, the substrate holding apparatus 20 has a plurality of clamps 40 to 47. Each of the clamps 40 to 47 has a mounting unit 30. By mounting the substrate 11 on each mounting unit 30, the substrate 11 can be supported in a substantially horizontal posture. A state in which the substrate 11 is mounted on each mounting unit 30 (or a state illustrated in FIG. 4) may be expressed as "a state in which the substrate 11 is mounted on the substrate holding apparatus 20" in some cases.
Each of the clamps 40 to 47 is configured to grip or clamp the substrate 11 mounted on the mounting unit 30. Moreover, each of the clamps 40 to 47 is provided with a drive mechanism such as, for example, a pneumatic actuator (not illustrated) and is configured to change its state between a state in which the substrate 11 is gripped and a state in which the grip is released. The drive mechanism of each of the clamps 40 to 47 is controlled by the aforementioned control unit 27. Since the configuration of this type of clamp is known, an explanation of the detailed configuration of the clamps 40 to 47 is omitted.
By using the plurality of clamps 40 to 47 to grip the substrate 11, the substrate 11 can be held or fixed with respect to the substrate holding apparatus 20. For convenience of explanation, when the substrate 11 is held on the substrate holding apparatus 20, an axis parallel to the first side and the second side of the substrate 11 is set to be a Y axis of the substrate holding apparatus 20, and an axis parallel to the third side and the fourth side is set to be an X axis of the substrate holding apparatus 20.
The substrate holding apparatus 20 in the embodiment is provided with clamping mechanisms corresponding to the respective sides of the substrate 11. Specifically, as illustrated in FIG. 3, the substrate holding apparatus 20 is provided with a first clamping mechanism 31 corresponding to the first side of the substrate 11, a second clamping mechanism 32 corresponding to the second side, a third clamping mechanism 33 corresponding to the third side, and a fourth clamping mechanism 34 corresponding to the fourth side.
As illustrated in FIG. 3, the first clamping mechanism 31 has a line of three clamps 40, 41 and 42 along the Y axis. For convenience of explanation, the clamp 40 in the center of the three clamps is referred to as a "central clamp", and the clamps 41 and 42 on both sides are referred to as "end clamps". The central clamp 40 grips the first side of the substrate 11 in the vicinity of a central portion thereof. The end clamps 41 and 42 grip the first side of the substrate in the vicinity of respective end portions thereof.
With a virtual line crossing the center of the central clamp 40 in the Y axis direction and parallel to the X axis as an axis of symmetry, the end clamps 41 and 42 are arranged substantially line-symmetrically. As described above, the central clamp 40 and the end clamps 41 and 42 are symmetrically arranged, and thus, the first side of the substrate 11 can be gripped, substantially uniformly, over substantially the full length thereof.
The second clamping mechanism 32 is opposed to the first clamping mechanism 31. The second clamping mechanism 32 has a line of three clamps 43, 44 and 45 along the Y axis. For convenience of explanation, the clamp 43 in the center of the three clamps is referred to as a "central clamp", and the clamps 44 and 45 on both sides are referred to as "end clamps". The central clamp 43 grips the second side of the substrate 11 in the vicinity of a central portion thereof. The end clamps 44 and 45 grip the second side of the substrate in the vicinity of respective end portions thereof.
With a virtual line crossing the center of the central clamp 43 in the Y axis direction and parallel to the X axis as an axis of symmetry, the end clamps 44 and 45 are arranged substantially line-symmetrically. As described above, the central clamp 43 and the end clamps 44 and 45 are symmetrically arranged, and thus, the second side of the substrate 11 can be gripped, substantially uniformly, over substantially the full length thereof.
The third clamping mechanism 33 has one clamp 46. The clamp 46 grips the third side of the substrate 11 over substantially the full length thereof.
The fourth clamping mechanism 34 is opposed to the third clamping mechanism 33 and has one clamp 47. The clamp 47 grips the fourth side of the substrate 11 over substantially the full length thereof.
As illustrated in FIG. 3, the first clamping mechanism 31 is provided with two first-side positioning guides 50 and 51. The first-side positioning guides 50 and 51 are disposed such that the first-side positioning guides 50 and 51 can be in contact with the first side in the vicinity of the end portions thereof, in the substrate 11 in the state of being mounted on the substrate holding apparatus 20 (refer to FIG. 5 and the like).
As illustrated in FIG. 3, the third clamping mechanism 33 is provided with two third-side positioning guides 52 and 53. The third-side positioning guides 52 and 53 are disposed such that the third-side positioning guides 52 and 53 can be in contact with the third side in the vicinity of the end portions thereof, in the substrate 11 in the state of being mounted on the substrate holding apparatus 20 (refer to FIG. 5 and the like).
As illustrated in FIG. 3, the substrate holding apparatus 20 is provided with a substrate pushing mechanism 35. The substrate pushing mechanism 35 is provided with a substrate pushing member 48 capable of advancing and retreating, and a drive unit 49 configured to perform advance / retreat drive of the substrate pushing member 48. The substrate pushing mechanism 35 is disposed correspondingly to a corner of the second side and the four side of the substrate 11. The drive unit 49 is controlled by the control unit 27.
As illustrated in FIG. 4, the substrate pushing member 48 is configured to retreat to a position at which the substrate pushing member 48 is not in contact with the substrate 11 in the state of being mounted on the substrate holding apparatus 20. Moreover, as illustrated in FIG. 5, by using the drive unit 49 to advance the substrate pushing member 48, the substrate pushing member 48 can be brought into contact with the corner of the substrate 11 to push the substrate 11 in a direction oblique to the X axis and the Y axis. By pushing the substrate 11 by using the substrate pushing member 48, the first side of the substrate 11 is pushed against the first-side positioning guides 50 and 51, and the third side of the substrate 11 is pushed against the third-side positioning guides 52 and 53 (in a state in FIG. 5). This makes it possible to position the substrate 11 with respect to the substrate holding apparatus 20.
The substrate holding apparatus 20 is provided with a first moving mechanism 55. The first moving mechanism 55 is configured to relatively move the first clamping mechanism 31 and the second clamping mechanism 32 in a direction parallel to the X axis. This makes it possible to relatively move the first clamping mechanism 31 and the second clamping mechanism 32 in a direction close to each other or in a direction away from each other. The operation of the first moving mechanism 55 is controlled by the control unit 27.
The first moving mechanism 55 in the embodiment is configured to move only the second clamping mechanism 32 but not to move the first clamping mechanism 31. The first clamping mechanism 31 is fixed or held with respect to a main body of the substrate holding apparatus 20. Therefore, the first clamping mechanism 31 is fixed or held with respect to the case 12 of the substrate holding apparatus 20.
The substrate holding apparatus 20 is also provided with a second moving mechanism 56. The second moving mechanism 56 is configured to relatively move the third clamping mechanism 33 and the fourth clamping mechanism 34 in a direction parallel to the Y axis. This makes it possible to relatively move the third clamping mechanism 33 and the fourth clamping mechanism 34 in a direction close to each other or in a direction away from each other. The operation of the second moving mechanism 56 is controlled by the control unit 27.
The second moving mechanism 56 in the embodiment is configured to move both the third clamping mechanism 33 and the fourth clamping mechanism 34
Next, the operation of holding the substrate 11 by the substrate holding apparatus 20 in the embodiment will be specifically explained in order.
Firstly, the control unit 27 sets all the clamps 40 to 47 in an open state (or in the state in which the grip is released), as illustrated in FIG. 3. Then, the substrate 11 as the inspection object is mounted on the substrate holding apparatus 20. FIG. 4 illustrates the state in which the substrate 11 is mounted on the substrate holding apparatus 20.
Incidentally, a method of mounting the substrate 11 on the substrate holding apparatus 20 is not particularly limited. For example, the substrate inspection apparatus 10 in the embodiment is provided with a substrate transfer apparatus (not illustrated) configured to transfer the substrate 11. The control unit 27 controls the substrate transfer apparatus, as occasion demands, to mount the substrate 11 on the substrate holding apparatus 20. The method is not limited to this example; for example, the substrate 11 may be mounted on the substrate holding apparatus 20 manually by an operator.
Then, the control unit 27 drives the drive unit 49 of the substrate pushing mechanism 35 to advance the substrate pushing member 48 (or a positioning step in FIG. 5). By this, the substrate 11 is obliquely pushed by the substrate pushing member 48, and the substrate 11 is pushed against the positioning guides 50 to 53. As a result, the substrate 11 is positioned with respect to the substrate holding apparatus 20.
Then, the control unit 27 drives the drive unit 49 of the substrate pushing mechanism 35 to make the substrate pushing member 48 retreat. As described above, as soon as the positioning of the substrate 11 ends, the substrate pushing member 48 is made to quickly retreat. This can prevent the substrate pushing member 48 from hindering subsequent steps (i.e. a first step to a fifth step).
Then, the control unit 27 controls the central clamps 40 and 43 to grip the first side and the second side in the vicinity of the central portions thereof (or a first step in FIG. 6). By this, the central portions of the substrate 11 in the Y axis direction are held.
In other words, the substrate 11 treated by the substrate holding apparatus 20 in the embodiment is a substrate having flexibility such as the coreless substrate, and thus, the substrate 11 in the state of being mounted on the substrate holding apparatus 20 is likely warped or deflected. If the both end portions of the warped or deflected substrate 11 are firstly held, the substrate 11 will be distorted.
That is why the substrate holding apparatus 20 in the embodiment is configured to grip the first side and the second side of the substrate, firstly in the vicinity of the central portions thereof, as described above. By firstly holding the central portions of the substrate 11, it is possible to prevent the distortion from occurring when the end portions of the substrate 11 are held later.
Then, the control unit 27 controls the clamps 46 and 47 to grip the third side and the fourth side of the substrate 11 (or a second step in FIG. 7). As described above, the clamp 46 is configured to grip the third side of the substrate 11 over substantially the full length thereof. The clamp 47 is configured to grip the fourth side of the substrate 11 over substantially the full length thereof. Therefore, by using the clamps 46 and 47 to grip the substrate 11, the both end portions of the substrate 11 in the Y axis direction are held. As described above, the central portions of the substrate 11 in the Y axis are firstly fixed, and the distortion thus hardly occurs when the both end portions in the Y axis direction are held.
Then, the control unit 27 drives the second moving mechanism 56 to relatively move the third clamping mechanism 33 and the fourth clamping mechanism 34 in the direction away from each other (or a third step in FIG. 8). As described above, the second moving mechanism 56 is configured to move both the clamping mechanisms 33 and 34. In other words, the second moving mechanism 56 moves the third clamping mechanism 33 in a direction away from the fourth clamping mechanism 34, and moves the fourth clamping mechanism 34 in a direction away from the third clamping mechanism 33.
As described above, by relatively move the clamping mechanisms 33 and 34 in the direction away from each other in the state in which the end portions of the substrate 11 in the Y axis direction are gripped by the clamping mechanisms 33 and 34, the substrate 11 can be pulled to be extended in the Y axis direction. This applies tension (or tensile force) to the substrate 11 in the Y axis direction, and it is thus possible to solve the distortion and the deflection of the substrate 11.
Moreover, the control unit 27 controls the end clamps 41, 42, 44 and 45 of the first clamping mechanism 31 and the second clamping mechanism 32 to grip the substrate 11 in the state in which the substrate 11 is pulled in the Y axis direction (or a fourth step in FIG. 9). By this, the first side and the second side of the substrate 11 are gripped in the vicinity of the end portions thereof.
As described above, the first side and the second side of the substrate 11 are already gripped in the vicinity of the central portions thereof by the central clamps 40 and 43. Therefore, by additionally gripping the first side and the second side in the vicinity of the end portions thereof as described above, the first side and the second side are in a state of being gripped over substantially the full length thereof (or in a state in FIG. 9). In other words, by this, the both end portions of the substrate 11 in the X axis direction are held.
The control unit 27 drives the first moving mechanism 55 in the state in which the substrate 11 is gripped by all the plurality of clamps 40, 41 and 42 of the first clamping mechanism 31 and all the plurality of clamps 43, 44 and 45 of the second clamping mechanism 32, thereby relatively move the first clamping mechanism 31 and the second clamping mechanism 32 in the direction away from each other (or a fifth step in FIG. 10).
As described above, by relatively moving the clamping mechanisms 31 and 32 in the direction away from each other in the state in which the end portions of the substrate 11 in the X axis direction are gripped by the clamping mechanisms 31 and 32, the substrate 11 can be pulled to be extended in the X axis direction. This applies tension (or tensile force) to the substrate 11 in the X axis direction, and it is thus possible to solve the distortion and the deflection of the substrate 11.
As described above, the first moving mechanism 55 in the embodiment is configured to move only the second clamping mechanism 32 but not to move the first clamping mechanism 31. As described above, in the embodiment, the first clamping mechanism 31 is fixed or held, and the first side of the substrate 11 thus remains still in the position determined by the first-side positioning guides 50 and 51. This can prevent the determined position of the first side from being shifted, and can improve the poisoning accuracy of the substrate 11.
As described above, according to the substrate holding apparatus 20 in the embodiment, the substrate 11 having flexibility can be held with good positioning accuracy in the state in which the warp and the deflection or the like are solved. After the holding of the substrate 11 is completed, the control unit 27 inspects the substrate 11 by using the inspection units 21 and 22 (or an inspection step). The substrate 11 is accurately held, with the warp and the deflection solved. It is thus possible to appropriately inspect the substrate 11.
The inspection of the substrate 11 by the inspection units 21 and 22 is performed while the substrate 11 remains pulled in the X axis direction and in the Y axis direction by the substrate holding apparatus 20 (i.e. while the tension is applied). In other words, if the pulling is stopped or released, chances are that the warp and the deflection will occur again in the substrate 11 and that the inspection by the inspection units 21 and 22 cannot be appropriately performed. By performing the inspection while the substrate 11 is pulled, the inspection can be performed in the state in which the warp and the deflection of the substrate 11 are solved.
If the inspection of the substrate 11 ends, the control unit 27 releases the grip by the clamps 40 to 47 of the substrate holding apparatus 20. By this, the holding of the substrate 11 is released (or a holding release step).
In the substrate holding apparatus 20 in the embodiment, since the substrate 11 is held in the state of being pulled, stress is accumulated in the inside of the substrate 11. Thus, if the grip by the clamps 40 to 47 is released all at once, the substrate 11 likely bounces up or is damaged.
Thus, when releasing the holding of the substrate 11, the control unit 27 in the embodiment is configured to release the grip of the clamps 40 to 47 in order opposite to the order of gripping the substrate 11. Specifically, the control unit 27 firstly releases the grip by the end clamps 41, 42, 44 and 45, then releases the grip by the clamps 46 and 47, and lastly releases the grip by the central clamps 40 and 43. This can avoid the bounce and the damage when the holding of the substrate 11 is released.
As explained above, the substrate holding apparatus 20 in the embodiment is provided with the first clamping mechanism 31, the second clamping mechanism 32, the third clamping mechanism 33, the fourth clamping mechanism 34, the first moving mechanism 55, and the second moving mechanism 56.
The first clamping mechanism 31 is provided with a line of three clamps along the first side, wherein the three clamps are the central clamp 40 configured to grip the first side of the substrate 11 in the vicinity of the central portion thereof, and the end clamps 41 and 42 configured to grip the first side in the vicinity of the end portions thereof. The second clamping mechanism 32 is provided with a line of three clamps along the second side, wherein the three clamps are the central clamp 43 configured to grip the second side of the substrate 11 in the vicinity of the central portion thereof, and the end clamps 44 and 45 configured to grip the second side in the vicinity of the end portions thereof.
The third clamping mechanism 33 has the clamp 46 configured to grip the third side perpendicular to the first side and the second side of the substrate 11. The fourth clamping mechanism 34 has the clamp 47 configured to grip the fourth side opposed to the third side of the substrate 11.
The first moving mechanism 55 relatively moves the first clamping mechanism 31 and the second clamping mechanism 32 in the state of gripping the substrate 11, in the direction away from each other. The second moving mechanism 56 relatively moves the third clamping mechanism 33 and the fourth clamping mechanism 34 in the state of gripping the substrate 11, in the direction away from each other.
As described above, since the three clamps are provided in line along the first side and the second side of the substrate 11, the central portions of the substrate 11 can be firstly gripped, and then, the end portions can be gripped. By this, the substrate 11 is hardly distorted when being gripped, in comparison with the case where each of the sides of the substrate 11 is gripped all at once. Moreover, by moving the clamping mechanisms in the direction away from each other in the state of gripping the substrate by using the clamping mechanisms, the substrate 11 can be pulled to apply tension. It is thus possible to solve the warp and the deflection.
As described above, the substrate 11 is held by the control unit 27 in the embodiment performing the first step, the second step, the third step, the fourth step, and the fifth step in this order.
In the first step, the substrate 11 is gripped by the central clamps 40 and 43 of the first clamping mechanism 31 and the second clamping mechanism 32. In the second step, the substrate 11 is gripped by the third clamping mechanism 33 and the fourth clamping mechanism 34. In the third step, the third clamping mechanism 33 and the fourth clamping mechanism 34 are relatively moved in the direction away from each other, by the second moving mechanism 56. In the fourth step, the substrate 11 is gripped by the end clamps 41, 42, 44 and 45 of the first clamping mechanism 31 and the second clamping mechanism 32. In the fifth step, the first clamping mechanism 31 and the second clamping mechanism 32 are relatively moved in the direction away from each other, by the first moving mechanism 55.
By holding the substrate in this order, it is possible to accurately hold the substrate 11 while applying tension to the substrate 11 and solving the warp and the deflection.
Although the preferred embodiment of the present invention is explained as described above, the aforementioned configuration can be changed, for example, as follows.
In the embodiment described above, in the first clamping mechanism 31 and the second clamping mechanism 32, one end clamp is disposed on each side of the central clamp, line-symmetrically. The number of the clamps of the first clamping mechanism 31 and the second clamping mechanism 32, however, is not limited to this example, and two or more clamps may be disposed on each side of the central clamp. Even in this case, as in the aforementioned embodiment, if the clamps on the both sides of the central clamp are arranged line-symmetrically with a virtual line crossing the center of the central clamp as an axis of symmetry, then, the first side and the second side of the substrate 11 can be gripped uniformly over the full length thereof, which is preferable.
Of course, the number of the line of the clamps of the first clamping mechanism 31 and the second clamping mechanism 32 and the arrangement thereof do not have to be interpreted as being limited to the above. For example, the number of the line of the clamps of the first clamping mechanism 31 and the second clamping mechanism 32 may be an even number, such as two, four or more. The arrangement of the line of the clamps of the first clamping mechanism 31 and the second clamping mechanism 32 is not necessarily limited to the line-symmetry. Each of the clamping mechanisms 31 and 32 may have the line of the plurality of clamps which allows the substrate 11 to be gripped at different timing, along respective one of the first side and the second side of the substrate 11. According to this, by setting the different timing of gripping the substrate 11 by using each of the clamps between the clamping mechanisms 31 and 32, it is possible to grip the first side and the second side of the substrate 11 in stages (or gradually). This can reduce the deflection and the distortion of the substrate 11, in comparison with a case where the first side and the second side of the substrate 11 are gripped by one clamp all at once.
The order of gripping the substrate 11 by using each clamp and the timing of pulling (or applying tension to) the gripped substrate 11 are considered to be most effective in the example explained in the embodiment; however, it should not be interpreted as being limited to this example. The order of gripping the substrate 11 by using each clamp and the timing of pulling the gripped substrate 11 can be changed, as occasion demands, depending on the shape of the substrate 11 (rectangular, square, etc.), how easily the substrate 11 is warped, how easily the substrate 11 is deflected, or the like.
The embodiment described above is configured such that each of the third clamping mechanism 33 and the fourth clamping mechanism 34 has only one clamp; however, the third clamping mechanism 33 and/or the fourth clamping mechanism 34 can be configured to have a line of a plurality of clamps, as in the first clamping mechanism 31 and the second clamping mechanism 32.
Description of Reference Numerals
10 substrate inspection apparatus
11 substrate
20 substrate holding apparatus
31 first clamping mechanism
32 second clamping mechanism
33 third clamping mechanism
34 fourth clamping mechanism
40 to 47 clamp
55 first moving mechanism
56 second moving mechanism

Claims (8)

  1. A substrate holding apparatus for holding a substantially rectangular substrate having flexibility, said substrate holding apparatus comprising:
    a first clamping mechanism having a line of a plurality of clamps configured to grip a first side of the substrate, along the first side;
    a second clamping mechanism having a line of a plurality of clamps configured to grip a second side opposed to the first side of the substrate, along the second side;
    a third clamping mechanism having a clamp configured to grip a third side substantially parallel to the first side and the second side of the substrate;
    a fourth clamping mechanism having a clamp configured to grip a fourth side opposed to the third side of the substrate;
    a first moving mechanism configured to relatively move the first clamping mechanism and the second clamping mechanism in a state of gripping the substrate, in a direction away from each other; and
    a second moving mechanism configured to relatively move the third clamping mechanism and the fourth clamping mechanism in a state of gripping the substrate, in a direction away from each other.
  2. The substrate holding apparatus according to claim 1, comprising:
    a first-side positioning guide configured to be in contact with the first side of the substrate;
    a third-side positioning guide configured to be in contact with the third side of the substrate; and
    a substrate pushing mechanism configured to move the substrate in a direction of bringing the substrate into contact with the first-side positioning guide and the third-guide positioning guide.
  3. The substrate holding apparatus according to claim 2, wherein at least one of the first clamping mechanism and the third clamping mechanism is fixed with respect to a main body of said substrate holding apparatus.
  4. The substrate holding apparatus according to any one of claims 1 to 3, wherein
    the first clamping mechanism comprises, along the first side, a line of:
    a central clamp configured to grip a central portion of the first side in the vicinity of a central portion thereof; and
    end clamps configured to grip the first side in the vicinity of end portions thereof, and
    the second clamping mechanism comprises, along the second side, a line of:
    a central clamp configured to grip a central portion of the second side in the vicinity of a central portion thereof; and
    end clamps configured to grip the second side in the vicinity of end portions thereof.
  5. The substrate holding apparatus according to claim 4, wherein
    said substrate holding apparatus comprises a control unit configured to control each of the clamps, the first moving mechanism, and the second moving mechanism, and
    the control unit performs the control such that the substrate is firstly gripped by the central clamps of the first clamping mechanism and the second clamping mechanism and is then gripped by the end clamps.
  6. The substrate holding apparatus according to claim 5, wherein
    the substrate is held by the control unit performing, in this order,:
    a first step of gripping the substrate by using the central clamps of the first clamping mechanism and the second clamping mechanism;
    a second step of gripping the substrate by using the third clamping mechanism and the fourth clamping mechanism;
    a third step of relatively moving the third clamping mechanism and the fourth clamping mechanism in the direction away from each other, by using the second moving mechanism;
    a fourth step of gripping the substrate by using the end clamps of the first clamping mechanism and the second clamping mechanism; and
    a fifth step of relatively moving the first clamping mechanism and the second clamping mechanism in the direction away from each other, by using the first moving mechanism.
  7. The substrate holding apparatus according to claim 5 or 6, wherein the control unit releases the grip by each of the clamps in order opposite to the order of gripping the substrate, when releasing the holding of the substrate.
  8. A substrate inspection apparatus comprising:
    said substrate holding apparatus according to any one of claims 1 to 7; and
    an inspection unit configured to inspect the substrate held by said substrate holding apparatus.
PCT/JP2014/002632 2013-05-21 2014-05-19 Substrate holding apparatus, and substrate inspection apparatus comprising the same WO2014188702A1 (en)

Applications Claiming Priority (2)

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JP2013107220A JP2014228347A (en) 2013-05-21 2013-05-21 Board fixation device and board inspection device provided with the same
JP2013-107220 2013-05-21

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JP2016139764A (en) * 2015-01-29 2016-08-04 日置電機株式会社 Substrate fixing device and substrate inspection equipment
JP6829991B2 (en) * 2016-12-28 2021-02-17 Ｔｏｙｏ Ｔｉｒｅ株式会社 Pneumatic tires
CN110611051A (en) * 2018-06-15 2019-12-24 京东方科技集团股份有限公司 Preparation method of electronic device, electronic device and preparation tool thereof
CN112410745A (en) * 2020-10-26 2021-02-26 Tcl华星光电技术有限公司 Clamping device and control method thereof

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JP2000304814A (en) * 1999-04-16 2000-11-02 Nidec Tosok Corp Apparatus for supporting bearing board
JP2002193441A (en) * 2000-12-28 2002-07-10 Hioki Ee Corp Tested substrate fixing mechanism for substrate testing device
JP2003344486A (en) * 2002-05-31 2003-12-03 Hioki Ee Corp Positioning mechanism for substrate under test

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TW201446108A (en) 2014-12-01

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