JP2014216583A - Electronic apparatus - Google Patents

Electronic apparatus Download PDF

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Publication number
JP2014216583A
JP2014216583A JP2013094820A JP2013094820A JP2014216583A JP 2014216583 A JP2014216583 A JP 2014216583A JP 2013094820 A JP2013094820 A JP 2013094820A JP 2013094820 A JP2013094820 A JP 2013094820A JP 2014216583 A JP2014216583 A JP 2014216583A
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Prior art keywords
resin
circuit board
casing
holding
holding portion
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Inventor
考志 横山
Takashi Yokoyama
考志 横山
良平 荒川
Ryohei Arakawa
良平 荒川
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RB Controls Co Ltd
Rinnai Corp
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RB Controls Co Ltd
Rinnai Corp
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Priority to JP2013094820A priority Critical patent/JP2014216583A/en
Publication of JP2014216583A publication Critical patent/JP2014216583A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To solve the problem that a contact area between a resin and a casing becomes narrow since only an upper side of a circuit board is filled with the resin in the prior arts, and if a stress in a direction where the resin is separated from a surface of the casing is generated by an external force acting on the circuit board, there is the risk of exfoliating the resin from the surface of the casing.SOLUTION: An annular hold part is erected on an inner bottom face of a casing, a space that becomes a resin reservoir is formed between a peripheral wall of the casing and the hold part and by mounting the circuit board on a top face of the hold part over all the circumference, the circuit board is held. In the state where the resin flows from a top face of the circuit board to the resin reservoir, the resin is prevented from flowing into a space surrounded by the hold part over the hold part.

Description

本発明は、ケーシング内に配設された回路基板を、回路基板の下方に空間を残存させた状態でポッティングした電子装置に関する。   The present invention relates to an electronic device in which a circuit board disposed in a casing is potted with a space remaining below the circuit board.

回路基板を外気から隔絶するため、ケーシング内に回路基板を配設し、その状態で樹脂を流し込んで樹脂を硬化させ、樹脂で回路基板を覆ったポッティングが行われている。ただし、ケーシング内に樹脂を単に流し込んだのでは、樹脂は回路基板の上下に充填されるので、多量の樹脂をケーシング内に充填しなければならない。そのため、樹脂のコストが高くなるとともに、充填後の電子装置の重量が重くなるという不具合が生じる。   In order to isolate the circuit board from the outside air, potting is performed in which the circuit board is disposed in the casing, the resin is poured in that state to cure the resin, and the circuit board is covered with the resin. However, if the resin is simply poured into the casing, the resin is filled above and below the circuit board, so a large amount of resin must be filled into the casing. As a result, the cost of the resin increases, and the electronic device after filling becomes heavy.

そこで、ケーシングの周壁から内側に向かって張り出す庇状の保持部を全周にわたって設け、その庇状の保持部に回路基板を載置した状態で樹脂を回路基板の上面に流し込んでポッティングをするものが提案されている（例えば、特許文献１参照）。   Therefore, a pot-shaped holding portion that protrudes inward from the peripheral wall of the casing is provided over the entire circumference, and potting is performed by pouring the resin onto the upper surface of the circuit board with the circuit board placed on the hook-shaped holding portion. The thing is proposed (for example, refer patent document 1).

このように構成したものでは、回路基板の上面に流し込まれた樹脂は回路基板の上面に沿って外縁方向に広がるが、回路基板の下面周縁と保持部の上面とが全周にわたって接触しているため、その接触部分で樹脂の流れが止められ、樹脂が回路基板の下方に流れ込まない。その状態、すなわち樹脂は回路基板の上面より上方のみに充填された状態で樹脂を硬化させることにより、回路基板の下方に樹脂が充填されない空間を残存させている。   In such a configuration, the resin poured into the upper surface of the circuit board spreads in the outer edge direction along the upper surface of the circuit board, but the peripheral edge of the lower surface of the circuit board and the upper surface of the holding portion are in contact with each other. Therefore, the resin flow is stopped at the contact portion, and the resin does not flow below the circuit board. In this state, that is, in a state where the resin is filled only above the upper surface of the circuit board, the resin is cured to leave a space not filled with the resin below the circuit board.

特開平８−１６２７４２号公報（図１）JP-A-8-162742 (FIG. 1)

上記特許文献１に記載された従来のものでは、回路基板の上方のみに樹脂を充填させているので、樹脂とケーシングとの接触面積が狭くなる。例えば樹脂の厚みが５ｍｍであるとするなら、その５ｍｍの幅で全周にわたって樹脂がケーシングの周壁内面に接触する部分しか樹脂はケーシングに接触しない。   In the conventional device described in Patent Document 1, since the resin is filled only above the circuit board, the contact area between the resin and the casing is reduced. For example, if the thickness of the resin is 5 mm, the resin contacts the casing only at the portion of the width of 5 mm where the resin contacts the inner surface of the peripheral wall of the casing.

樹脂はケーシングの表面に対してある程度の親和性は有しているが、接着剤ほどの親和性は有していないので、樹脂をケーシング表面から引き離す方向の応力が強く作用すると、樹脂がケーシング表面から剥離するおそれがある。例えば回路基板にコネクタが設けられている場合には、回路基板の下面が樹脂で支えられていないので、コネクタに対してハーネスを抜き差しする際に、その抜き差しの際の力によって回路基板が上下に大きく撓む。そしてその撓みは樹脂をケーシングの内周面から剥がす方向に作用する。仮に樹脂がケーシングの内周面から一部であっても剥がれると、毛細管現象によってその剥がれた部分を通って水などの液体が回路基板の下方の空間に到達するおそれが生じる。   Resin has a certain degree of affinity for the casing surface, but it does not have as much affinity as the adhesive, so if the stress acting in the direction of pulling the resin away from the casing surface acts strongly, the resin will There is a risk of peeling. For example, when a connector is provided on the circuit board, the lower surface of the circuit board is not supported by resin, so that when the harness is inserted into and removed from the connector, the circuit board is moved up and down by the force at the time of insertion and removal. It bends greatly. The bending acts in the direction of peeling the resin from the inner peripheral surface of the casing. If even a part of the resin is peeled off from the inner peripheral surface of the casing, liquid such as water may reach the space below the circuit board through the peeled portion due to capillary action.

そこで本発明は、上記の問題点に鑑み、回路基板の下方に空間を残存させてポッティングするが、樹脂とケーシングの内周面との間に剥がれが生じない電子装置を提供することを課題とする。   Therefore, in view of the above problems, the present invention has an object to provide an electronic device in which a space is left under the circuit board and potted, but no peeling occurs between the resin and the inner peripheral surface of the casing. To do.

上記課題を解決するために本発明による電子装置は、上方に開口したケーシングの内部に、回路基板の下面の全周にわたって接触して、回路基板をケーシングの底部から所定の距離を存して保持する保持部を形成し、保持部に回路基板を保持させた状態で回路基板の上面に樹脂を流し込むことにより、回路基板とケーシングの底部との間に樹脂が充填されない空間を残存させてポッティングされた電子装置において、上記ケーシングの内底面に環状の保持部を立設し、ケーシングの周壁と保持部との間に樹脂溜まりとなる空間を形成するとともに、この保持部の上面に全周にわたって上記回路基板を載置することにより回路基板を保持し、上記樹脂が回路基板の上面から樹脂溜まりまで流れた状態で保持部を越えて保持部で囲まれた空間に樹脂が流れ込まないようにしたことを特徴とする。   In order to solve the above problems, an electronic device according to the present invention is in contact with an entire upper surface of a lower surface of a circuit board inside a casing opened upward, and holds the circuit board at a predetermined distance from the bottom of the casing. The holding portion is formed, and the resin is poured into the upper surface of the circuit board while holding the circuit board in the holding portion, so that a space not filled with the resin remains between the circuit board and the bottom of the casing and potted. In the electronic device, an annular holding portion is erected on the inner bottom surface of the casing to form a space that becomes a resin pool between the peripheral wall of the casing and the holding portion, and the upper surface of the holding portion has the above-described entire circumference. The circuit board is held by placing the circuit board, and the resin flows from the upper surface of the circuit board to the resin reservoir, and is placed in a space surrounded by the holding part beyond the holding part. Characterized in that was prevented from flowing.

上記構成では、保持部の外側に樹脂溜まりが形成される。回路基板の上面に注入された樹脂は回路基板の上面を覆うとともに樹脂溜まり内にも流れ込むので、硬化後の樹脂とケーシングの内周面との接触面積は従来ものと比較して大幅に増加している。このため、樹脂の硬化後に回路基板に外力が作用しても樹脂がケーシングの内周面から剥離するおそれが減少する。   In the above configuration, the resin reservoir is formed outside the holding portion. Since the resin injected into the upper surface of the circuit board covers the upper surface of the circuit board and also flows into the resin reservoir, the contact area between the cured resin and the inner peripheral surface of the casing is greatly increased compared to the conventional one. ing. For this reason, even if an external force is applied to the circuit board after the resin is cured, the possibility of the resin peeling off from the inner peripheral surface of the casing is reduced.

なお、従来のものではケーシングの周壁から内側に向かって張り出す庇状の保持部を形成し、その保持部に回路基板を載置するので、回路基板の下面の周縁部分に回路パターンを設けられない範囲が生じ、回路基板が必要以上に大きくなる。このような場合には、上記回路基板の周縁が上記保持部の外側に張り出さないようにすることにより、回路基板の大きさを必要最小限にすることができる。   In addition, in the conventional one, a bowl-shaped holding portion that protrudes inward from the peripheral wall of the casing is formed, and the circuit board is placed on the holding portion, so that a circuit pattern can be provided on the peripheral portion of the lower surface of the circuit board. A non-existing range occurs and the circuit board becomes larger than necessary. In such a case, it is possible to minimize the size of the circuit board by preventing the peripheral edge of the circuit board from protruding outside the holding portion.

以上の説明から明らかなように、本発明は、樹脂溜まりを形成して硬化後の樹脂とケーシングの内周面との接触面積を従来の電子装置より広げているので、回路基板に外力が作用しても樹脂がケーシングの内周面から剥離することが防止でき、そのため、回路基板の下方の空間に外部から水などが浸入するおそれが生じない。   As is apparent from the above description, the present invention forms a resin reservoir and expands the contact area between the cured resin and the inner peripheral surface of the casing as compared with the conventional electronic device, so that an external force acts on the circuit board. Even so, it is possible to prevent the resin from peeling from the inner peripheral surface of the casing, and therefore, there is no possibility that water or the like enters the space below the circuit board from the outside.

本発明の一実施の形態の構成を示す図The figure which shows the structure of one embodiment of this invention ケーシングの形状を示す斜視図Perspective view showing the shape of the casing 樹脂の充填状態を示す断面図Sectional view showing the state of resin filling 保持部の他の形態を示す断面図Sectional drawing which shows the other form of a holding | maintenance part ケーシングの他の形態を示す斜視図The perspective view which shows the other form of a casing

図１および図２を参照して、１は本発明による電子装置の一例である。樹脂製のケーシング２内に回路基板３を配設し、その状態で樹脂Ｐをケーシング２内に流し込み、その後に加熱することによって樹脂Ｐの硬化を促進して、回路基板３を樹脂Ｐで封止した。   1 and 2, 1 is an example of an electronic device according to the present invention. The circuit board 3 is disposed in the casing 2 made of resin, and the resin P is poured into the casing 2 in this state, and then the resin P is cured by heating, whereby the circuit board 3 is sealed with the resin P. Stopped.

ケーシング２の内底面２０には回路基板３より一回り小さい保持部２１が環状に連続して形成されている。そのため、ケーシング２の周壁とこの保持部２１との間には溝状の樹脂溜まり２２が形成される。回路基板３はこの保持部３２の上面に載置されるが、水平方向の位置決めをする必要がある。そこで、保持部２１の角部から外側、すなわち樹脂溜まり２２側に向かって一部を張り出し、その上面に位置決め部２３を形成した。この位置決め部２３は対向する２カ所に形成してもよく、あるいは４隅全てに形成してもよい。   A holding portion 21 that is slightly smaller than the circuit board 3 is continuously formed in an annular shape on the inner bottom surface 20 of the casing 2. Therefore, a groove-shaped resin reservoir 22 is formed between the peripheral wall of the casing 2 and the holding portion 21. The circuit board 3 is placed on the upper surface of the holding portion 32, but needs to be positioned in the horizontal direction. Therefore, a part is projected from the corner of the holding portion 21 to the outside, that is, toward the resin reservoir 22 side, and the positioning portion 23 is formed on the upper surface thereof. The positioning portions 23 may be formed at two opposing positions, or may be formed at all four corners.

このようにして、回路基板３をケーシング２内に配設すると、回路基板３の下面の外周縁近傍が保持部２１の上端面に当接して、回路基板３は保持部２１に保持される。その状態で樹脂Ｐを注入すると、最初に回路基板３の上面に樹脂Ｐが注がれる。そして、その樹脂Ｐは回路基板３の上面に沿って回路基板３の外縁に向かって広がる。樹脂Ｐが回路基板３の外縁まで到達すると、ケーシング２の内面と回路基板３の外縁との間の隙間を通って樹脂Ｐは樹脂溜まり２２に流れ込む。回路基板３の下面は支持部２１の上端面に全周にわたって当接しているので、樹脂Ｐは支持部２１を越えることなく樹脂溜まり２２内に留まる。このため、回路基板３の下方には保持部２１で囲まれた樹脂が充填されない空間が確保される。   When the circuit board 3 is thus arranged in the casing 2, the vicinity of the outer peripheral edge of the lower surface of the circuit board 3 comes into contact with the upper end surface of the holding part 21, and the circuit board 3 is held by the holding part 21. When the resin P is injected in this state, the resin P is first poured onto the upper surface of the circuit board 3. The resin P spreads along the upper surface of the circuit board 3 toward the outer edge of the circuit board 3. When the resin P reaches the outer edge of the circuit board 3, the resin P flows into the resin reservoir 22 through a gap between the inner surface of the casing 2 and the outer edge of the circuit board 3. Since the lower surface of the circuit board 3 is in contact with the upper end surface of the support portion 21 over the entire circumference, the resin P remains in the resin reservoir 22 without exceeding the support portion 21. Therefore, a space that is not filled with the resin surrounded by the holding portion 21 is secured below the circuit board 3.

図３を参照して、樹脂Ｐは上述のように、回路基板３の上方のみならず樹脂溜まり２２内にも充填されるので、樹脂Ｐとケーシング２の内周面との接触面積は、樹脂が回路基板３の上方のみに充填される従来のものより広くなるため、例えば回路基板にコネクタを抜き差しする際に回路基板３が上下に撓んだとしても、樹脂Ｐとケーシング２の内周面との間に剥離は生じない。ただし、図３に示すものでは回路基板３の周縁部３１が樹脂溜まり２２に張り出している。このため張り出した部分の回路基板３の下面には回路パターンを設けることが出来ない。   Referring to FIG. 3, as described above, resin P is filled not only above circuit board 3 but also into resin reservoir 22, so that the contact area between resin P and the inner peripheral surface of casing 2 is Therefore, even if the circuit board 3 bends up and down when the connector is inserted into and removed from the circuit board, for example, the resin P and the inner peripheral surface of the casing 2 No peeling occurs between the two. However, in the case shown in FIG. 3, the peripheral edge 31 of the circuit board 3 protrudes from the resin reservoir 22. For this reason, a circuit pattern cannot be provided on the lower surface of the protruding circuit board 3.

そこで、図４に示すように、回路基板３の周縁部３１が保持部２１より外側に張り出さないようにすれば、回路パターンを周縁部３１に可及的に接近する位置まで設けることができる。   Therefore, as shown in FIG. 4, if the peripheral portion 31 of the circuit board 3 does not protrude outward from the holding portion 21, the circuit pattern can be provided up to a position as close as possible to the peripheral portion 31. .

なお、このように回路基板３の周縁部３１を保持部２１から張り出さないようにするためには、回路基板３をより正確に位置決めする必要がある。上述の位置決め部２３による位置決めでもよいが、図５に示すように、ケーシング２の周壁の内面から樹脂溜まり２２に向かってリブ２４を形成し、このリブ２４によって回路基板３の位置決めを行うようにしてもよい。このリブ２４を設けることにより、回路基板３の位置決めを行うことができるとともに、樹脂とケーシング２の内周面との接触面積をさらに増やすことができる。   In order to prevent the peripheral edge 31 of the circuit board 3 from protruding from the holding part 21 as described above, it is necessary to position the circuit board 3 more accurately. Although positioning by the positioning portion 23 described above may be performed, as shown in FIG. 5, ribs 24 are formed from the inner surface of the peripheral wall of the casing 2 toward the resin reservoir 22, and the circuit board 3 is positioned by the ribs 24. May be. By providing the rib 24, the circuit board 3 can be positioned, and the contact area between the resin and the inner peripheral surface of the casing 2 can be further increased.

なお、本発明は上記した形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更を加えてもかまわない。   In addition, this invention is not limited to an above-described form, You may add a various change in the range which does not deviate from the summary of this invention.

１ 電子装置
２ ケーシング
２１ 保持部
２２ 樹脂溜まり
２３ 位置決め部
３ 回路基板
Ｐ 樹脂
DESCRIPTION OF SYMBOLS 1 Electronic device 2 Casing 21 Holding part 22 Resin pool 23 Positioning part 3 Circuit board P Resin

Claims (2)

上方に開口したケーシングの内部に、回路基板の下面の全周にわたって接触して、回路基板をケーシングの底部から所定の距離を存して保持する保持部を形成し、保持部に回路基板を保持させた状態で回路基板の上面に樹脂を流し込むことにより、回路基板とケーシングの底部との間に樹脂が充填されない空間を残存させてポッティングされた電子装置において、上記ケーシングの内底面に環状の保持部を立設し、ケーシングの周壁と保持部との間に樹脂溜まりとなる空間を形成するとともに、この保持部の上面に全周にわたって上記回路基板を載置することにより回路基板を保持し、上記樹脂が回路基板の上面から樹脂溜まりまで流れた状態で保持部を越えて保持部で囲まれた空間に樹脂が流れ込まないようにしたことを特徴とする電子装置。   A holding part that holds the circuit board at a predetermined distance from the bottom part of the casing is formed inside the casing that opens upward and contacts the entire circumference of the lower surface of the circuit board, and the circuit board is held by the holding part. In an electronic device in which a resin-filled space is left between the circuit board and the bottom of the casing by pouring resin into the upper surface of the circuit board in a state where the resin is potted, an annular holding is held on the inner bottom surface of the casing. The part is erected, forming a space for a resin reservoir between the peripheral wall of the casing and the holding part, and holding the circuit board by placing the circuit board on the entire upper surface of the holding part, An electronic device characterized in that the resin does not flow into the space surrounded by the holding portion beyond the holding portion when the resin flows from the upper surface of the circuit board to the resin pool. . 上記回路基板の周縁が上記保持部の外側に張り出さないようにしたことを特徴とする請求項１に記載の電子装置。
The electronic device according to claim 1, wherein a peripheral edge of the circuit board does not protrude outside the holding portion.
JP2013094820A 2013-04-27 2013-04-27 Electronic apparatus Pending JP2014216583A (en)

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JP2018137295A (en) * 2017-02-20 2018-08-30 リンナイ株式会社 Electronic unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018137295A (en) * 2017-02-20 2018-08-30 リンナイ株式会社 Electronic unit

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