JP6451125B2 - Board unit - Google Patents

Description

  The present invention relates to a magnetic component and a substrate unit on which the magnetic component is mounted, and more particularly to a structure of a magnetic component mounted on a substrate subjected to a potting process.

  For magnetic parts such as reactors and transformers, a structure in which a coil is wound around the core by holding and fixing the core and the coil with a molding bobbin is disclosed in, for example, Japanese Patent Laid-Open No. 58-135616 (Patent Document 1). )It is described in.

  Japanese Patent No. 5175844 (Patent Document 2) discloses an adhesive on the open side of a bottomed container in a magnetic component (inductance element) having a structure in which a donut-shaped core is fixed and held by a cylindrical bottomed container. Is applied to fix the donut-shaped magnetic core and the bottomed container integrally, thereby eliminating the need for a lid.

  Japanese Patent Laying-Open No. 2005-25196 (Patent Document 3) discloses a structure that can be realized at a low cost for suppressing an intrusion of a molding agent for an operation switch mounted on a printed board on which a component mounting surface is molded. Is described.

JP 58-135616 A Japanese Patent No. 5175844 JP 2005-251696 A

  In general, in a magnetic component that fixes a core to a bobbin, an integrated core is fixed by attaching it with a tape or the like from the outside in a state in which the divided core is attached to the bobbin and the divided cores are in close contact with each other. The structure to be formed is used. For this reason, a certain air gap exists in the core. The presence of the air gap generates leakage magnetic flux while contributing to prevention of magnetic saturation of the core. That is, the magnetic characteristics can be adjusted by the gap length (gap length) of the air gap.

  When the above-mentioned magnetic components are mounted on a substrate to be potted, if the potting material comes into contact with the core, the gap size of the air gap becomes smaller than the initial design value due to the penetration of the potting material into the air gap. May grow. When such a phenomenon occurs, there is a concern that a decrease in magnetic characteristics represented by a decrease in inductance value may be caused.

  The present invention has been made to solve such problems, and the object of the present invention is to reduce the magnetic characteristics of a magnetic component mounted on a substrate subjected to a potting process due to the penetration of a potting material. It is to provide a structure for effectively preventing.

  In one aspect of the present invention, a magnetic component mounted on a substrate for forming an electric circuit, the magnetic component comprising a core made of a magnetic material, a coil wound around the core, and a core And a bobbin for holding and fixing the coil. The core is formed by a plurality of divided cores that are integrally fixed to the bobbin. The bobbin has a bobbin stand for mounting the bobbin on the substrate when the magnetic component is mounted on the substrate. The substrate on which the magnetic component is mounted is molded with a potting material. The height of the bobbin stand is ensured so that the core fixed to the bobbin is not in contact with the potting material after molding with the potting material.

  In another aspect of the present invention, a board unit includes a board for forming an electric circuit, a magnetic component mounted on the board, and a case for storing the board. The magnetic component includes a core made of a magnetic material, a coil wound around the core, and a bobbin for holding and fixing the core and the coil. The core is formed by a plurality of divided cores that are integrally fixed to the bobbin. The bobbin has a bobbin stand for mounting the bobbin on the substrate when the magnetic component is mounted on the substrate. After the substrate on which the magnetic component is mounted is stored in the case, it is molded with a potting material. The height of the bobbin stand is ensured so that the core fixed to the bobbin is not in contact with the potting material after molding with the potting material.

  According to the above magnetic component and board unit, the potting material infiltrates into the air gap between the divided cores even if it is mounted on the board to be potted by ensuring the height of the bobbin stand appropriately. Can be prevented. For this reason, it can prevent reliably that the magnetic performance of a magnetic component falls by the air gap length changing by penetration | invasion of a potting material.

  Alternatively, preferably, the bobbin stand has a portion extending along the horizontal direction at a position on the substrate side of the bottom surface of the core in a state where the core is fixed to the bobbin on the bottom surface facing the substrate.

  If it does in this way, with respect to the rise of the potting material at the time of solidification, the penetration of the potting material into the air gap between the divided cores can be prevented by the portion extending along the horizontal direction. Accordingly, it is possible to prevent the potting material from entering the air gap while reducing the margin for the rising height when the potting material is solidified and suppressing the height of the bobbin stand.

  Preferably, in the magnetic component or the substrate unit, the bobbin bottom surface side of the contact portion between the bobbin and the core in a state where the core is fixed to the bobbin includes an end surface of the bobbin in the gap between the bobbin and the core. An adhesive is applied to the part.

  If it does in this way, the mechanical strength of the base part of a bobbin stand can be raised by the effect of increasing the wall thickness of a bobbin end equivalently by filling a crevice with an adhesion part. Thereby, the fall of the mechanical strength of the base part of a bobbin stand by the height of a bobbin stand can be suppressed.

  Preferably, in the magnetic component or the board unit, the bobbin is in contact with the entire surface of the gap between the bobbin and the core on the bottom surface side of the bobbin in the contact portion between the bobbin and the core when the core is fixed to the bobbin. The agent is applied.

  In this way, the adhesive is applied to the entire gap between the bobbin stand and the core on the bottom surface side of the bobbin, thereby preventing the potting material from entering the air gap between the divided cores from the gap. Accordingly, it is possible to prevent the potting material from entering the air gap while reducing the margin for the rising height when the potting material is solidified and suppressing the height of the bobbin stand. As a result, it is possible to prevent a decrease in magnetic performance of the magnetic component due to the penetration of the potting material while suppressing an increase in the height of the bobbin stand. Further, due to the effect of equivalently increasing the wall thickness, it is possible to suppress a decrease in mechanical strength of the base portion of the bobbin stand.

  According to the present invention, it is possible to provide a structure for effectively preventing a decrease in magnetic characteristics due to penetration of a potting material for a magnetic component mounted on a substrate subjected to a potting process.

It is sectional drawing for demonstrating the structure of the board | substrate unit with which the magnetic component which concerns on embodiment of this invention was mounted. It is sectional drawing for demonstrating the structure of the magnetic component according to a comparative example. FIG. 5 is a cross-sectional view for illustrating the structure of the magnetic component according to the first embodiment. FIG. 4 is a plan view of the bobbin shown in FIG. 3. FIG. 4 is a front view of the bobbin shown in FIG. 3. FIG. 4 is a side view of the bobbin shown in FIG. 3. It is the top view and front view explaining the shape of the division | segmentation core engaged with a bobbin. It is a figure explaining the structure of the core of the state fixed to the bobbin. It is sectional drawing in the state before board | substrate mounting of the magnetic component according to Embodiment 1. FIG. FIG. 7 is a bottom view of a magnetic component according to a modification of the first embodiment in a state before mounting on a substrate. FIG. 10 is a cross sectional view for illustrating the structure of a magnetic component according to the second embodiment. It is a bottom view in the state before the board | substrate mounting of the magnetic component according to Embodiment 2. FIG. It is sectional drawing for demonstrating the structure of the magnetic component according to Embodiment 3. FIG. 14 is a partially enlarged view of FIG. 13. FIG. 10 is a cross-sectional view for explaining a variation of the shape of the bobbin stand in the magnetic component according to the first embodiment, the first embodiment, or the second embodiment. FIG. 10 is a cross-sectional view for explaining a modification of the shape of the bobbin stand in the magnetic component according to the third embodiment.

  Embodiments of the present invention will be described below in detail with reference to the drawings. In the following description, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated in principle.

[Embodiment 1]
FIG. 1 is a cross-sectional view for illustrating the structure of a substrate unit on which a magnetic component according to an embodiment of the present invention is mounted.

  Referring to FIG. 1, substrate unit 10 according to the embodiment of the present invention includes a substrate 400 stored in case 450, and electrical component 15 and magnetic component 50 mounted on substrate 400.

  The substrate 400 is constituted by a printed circuit board on which a wiring pattern (not shown) for forming an electric circuit is formed. An electrical circuit can be formed by mounting the electrical component 15 and the magnetic component 50 on the substrate 400 and ensuring a predetermined electrical coupling to the wiring pattern. The electrical component 15 includes, for example, a microcomputer, a relay, a chip resistor, and a capacitor. The magnetic component 50 includes a transformer or a reactor. The electrical component 15 may be mounted on the back surface of the substrate 400 as shown in FIG.

  A plurality of bosses 460 are formed on the inner bottom surface of the case 450. When the substrate 400 is engaged with the boss 460, the substrate 400 is fixed to the case 450. Note that the substrate 400 may be screwed to the boss 460. In this way, the substrate unit 10 is configured by housing the substrate 400 in the case 450.

  In the substrate unit 10, a potting process is performed so as to cover the component mounting surface of the substrate 400 in order to ensure functions such as electrical insulation, fixing, protection, waterproofing, and dustproofing.

  In the potting process, the potting material 480 is injected into the case 450 so as to substantially cover the component mounting surface of the substrate 400 in a state where the substrate 400 is fixed to the case 450, and the injected potting material is solidified. A solidifying step. Thereby, the component mounting surface of the substrate 400 is molded by the potting material 480.

  As the potting material 480, typically, an epoxy resin or a urethane resin is used. In the solidification step, pressure and / or temperature (heating or cooling) conditions are adjusted as necessary. By the potting process, the substrate 400 and a part of the mounting component are sealed in the solidified potting material 480. Hereinafter, the height of the upper surface of the potting material 480 after the potting process from the surface of the substrate 400 is referred to as “potting height HP”.

  This embodiment is directed to the structure of a magnetic component on the premise that it is mounted on a substrate subjected to a potting process. Magnetic component 50 according to the present embodiment is arranged on the upper surface side of substrate 400. First, the structure of the magnetic component 50 # according to the comparative example will be described with reference to the cross-sectional view of FIG.

  Referring to FIG. 2, magnetic component 50 # includes a bobbin 100 #, a core 190 and a coil 300 held and fixed by bobbin 100 #. Core 190 is formed of divided cores 200 and 210 that are integrally fixed to bobbin 100 #. Each of the split cores 200 and 210 is made of a magnetic material such as ferrite or amorphous.

  Bobbin 100 # includes a flange portion 110, a cylindrical portion 120 having a hollow shape, and a bobbin stand 130. The flange part 110 is provided on the upper part of the cylindrical part 120. A coil 300 is formed at the lower portion of the flange portion 110 by winding a winding around the hollow cylindrical portion 120.

  Divided core 200 is engaged with bobbin 100 # from the top of cylindrical portion 120. Furthermore, the core 190 is formed by fixing the split core 210 integrally with the split core 200. For this reason, an air gap 250 exists between the split cores 200 and 210. Details of the structure for attaching the core to the bobbin will be described later.

  Bobbin stand 130 is provided for mounting bobbin 100 # on substrate 400. The bobbin stand 130 has legs 137 that come into contact with the upper surface of the substrate 400. Further, magnetic component 50 # is mounted on substrate 400 by inserting a plurality of pins 140 provided on the lower surface of bobbin stand 130 (the surface facing substrate 400) into through hole 410 of substrate 400.

  At least a part of the plurality of pins 140 is formed of a conductor. For example, the coil 300 is electrically connected to the pin 140 made of a conductor. Thus, coil 300 of magnetic component 50 # can be connected to another electric circuit element on substrate 400.

  In the magnetic component 50 # of the comparative example shown in FIG. 2, the height (hereinafter referred to as “bobbin bottom surface”) from the surface of the substrate 400 (the mounting surface of the magnetic component) to the bottom surface of the cylindrical portion 120 (hereinafter also referred to as “bobbin bottom surface”). HG1 is also referred to as “the height of the bobbin stand”. The height of the bobbin stand is defined by the size and shape of the bobbin stand 130.

  In magnetic component 50 # according to the comparative example, since the height of the bobbin stand is insufficient, the potting height HP is from the surface of substrate 400 to the lower surface of core 190 in the state after the potting process shown in FIG. May be higher than height. In this case, the potting material 480 may enter the air gap 250 and the air gap length on the magnetic circuit may be increased, thereby changing the inductance value and reducing the magnetic performance of the magnetic component 50 #. Is done.

FIG. 3 is a cross-sectional view for illustrating the structure of the magnetic component according to the first embodiment.
3 is compared with FIG. 2, magnetic component 50 according to the first embodiment includes bobbin 100 instead of bobbin 100 #, core 190, and coil 300.

  The bobbin 100 is different in the shape of the bobbin stand 130 from the bobbin 100 # shown in the comparative example of FIG. Specifically, the height of the bobbin stand 130 (bobbin stand height) is HG2 (HG2> HG1). The other structure of the magnetic component 50 is the same as that of the magnetic component 50 # shown in FIG. That is, the coil 300 is formed by a winding wound around the cylindrical portion 120. The core 190 is composed of split cores 200 and 210 that are integrally fixed to the bobbin 100.

Further, the structure of the bobbin 100 will be described in detail.
4 is a plan view of the bobbin 100 as viewed from above, FIG. 5 is a front view of the bobbin 100 as seen from the V direction in FIG. 4, and FIG. 6 is a view of the bobbin 100 as seen from the VI direction in FIG. It is a side view.

  Referring to FIGS. 4 to 6, a hollow portion 150 for inserting a core is formed in the central portion of the cylindrical portion 120. Further, the winding forming the coil 300 is wound around the cylindrical portion 120 using the space 160 around the cylindrical portion 120 and below the flange portion 110.

  As shown in FIG. 4 and FIG. 5, a space 170 for assembling the core is secured by forming a notch in the portion of the flange portion 110 that extends in the vertical direction in FIG. 4.

  As shown in FIG. 6, a groove 132 is provided on the side surface of the bobbin stand 130. For example, the coil 300 can be electrically connected to other electric circuit elements on the substrate 400 by electrically connecting a conductive wire wound around the space 160 to the pin 140 using the groove 132. It becomes possible.

  7 and 8 show the structure of the core 190 that is held and fixed to the bobbin 100. FIG.

  7A and 7B show the shape of the split core 200 in the core 190. FIG. FIG. 7A shows a plan view of the split core 200, and FIG. 7B shows a front view of the split core 200 viewed from the B direction in FIG. 7A.

  With reference to FIGS. 7A and 7B, the split core 200 has a structure in which protrusions 201 to 203 are provided with respect to the base portion 204. The split core 200 is attached to the bobbin 100 shown in the plan view of FIG. 4 vertically downward with respect to the paper surface with the protrusions 201 to 203 facing downward. Accordingly, the split core 200 is engaged with the bobbin 100 while the protrusion 202 is inserted into the hollow portion 150 and the protrusions 201 and 203 are accommodated in the space 170.

  Referring to FIG. 8, in a state where split core 200 is engaged with bobbin 100, split core 210 is attached so as to be in contact with protrusions 201 to 203. In this state, the core 190 is configured by fixing the split cores 200 and 210 integrally with the tape 205. As a result, an air gap 250 is formed between each of the protrusions 201 to 203 of the split core 200 and the split core 210.

  Referring to FIG. 4 again, the height HG2 of the bobbin stand 130 is designed such that the core 190 is not in contact with the potting height HP after the potting process. Thereby, it is possible to avoid the potting material 480 from entering the air gap 250 of the core 190. Even if the air gap 250 is positioned above the potting height HP, if the lower surface of the core 190 comes into contact with the potting material 480, the potting material 480 may enter the air gap 250 through a path along the core surface.

  Here, the potting height HP is indicated by the sum (HP = H1 + H2) of the height H1 of the liquid level of the potting material 480 at the time of injection and the rising height H2 in the vertical direction when the potting material 480 is solidified. The height H1 of the liquid level can be predicted by the injection amount of the potting material 480. On the other hand, the rising height H2 at the time of solidification varies depending on temperature conditions and humidity conditions at the time of solidification. For this reason, in order to ensure that the height to the air gap 250 is larger than H1 + H2, it is necessary to design the height HG2 of the bobbin stand 130 with a certain margin.

  In this way, even if the magnetic component according to the first embodiment is mounted on the substrate subjected to the potting process, the potting material 480 can enter the air gap 250 between the split cores 200 and 210. Can be prevented. For this reason, it can prevent reliably that the magnetic performance of a magnetic component falls by the air gap length changing by penetration | invasion of a potting material.

[Modification of Embodiment 1]
FIG. 9 is a cross-sectional view of the magnetic component according to the first embodiment before being mounted on the substrate.

  Referring to FIG. 9, in magnetic component 50 according to the first embodiment, the bobbin with respect to the force applied in the direction A in FIG. There is a concern that the strength of the base portion 252 of the stand 130 may decrease. This is because when the height (HG2) of the bobbin stand 130 is enlarged, the moment acting on the root portion 252 with respect to the external force in the A direction increases.

  On the other hand, if the thickness of the cylindrical portion 120 or the bobbin bottom surface portion is increased in order to ensure the strength of the base portion 252, the dimensions of the split cores 200 and 210 attached to the bobbin 100 or the coil 300 may be affected. There is.

  FIG. 10 is a bottom view of the magnetic component according to the modification of the first embodiment in a state before mounting on the board. In the magnetic component according to the modification of the first embodiment, the shapes and dimensions of the bobbin 100 and the core 190 are the same as those of the magnetic component 50 according to the first embodiment.

  Referring to FIG. 10, in the magnetic component according to the modification of the first embodiment, in the magnetic component according to the first embodiment (FIG. 9), the bobbin stand at the bottom surface portion of the bobbin 100 and the contact portion of core 190. An adhesive part 500 is further provided, which is formed by applying (filling) an adhesive into the gap part 253 between the core 130 and the core 190.

  For example, the adhesion part 500 can be provided corresponding to the four corners including the end face of the bobbin where the mechanical strength decreases. By integrating the bobbin 100 and the core 190 by the bonding portion 500, an effect equivalent to increasing the thickness can be obtained with respect to the moment acting on the root portion 252 by an external force.

  Therefore, in the magnetic component according to the modification of the first embodiment, the mechanical strength of the bobbin stand 130, specifically, without increasing the thickness of each part of the bobbin 100 while the height of the bobbin stand 130 is secured. Specifically, the strength against the stress in the A direction in FIG. 9 can be improved.

[Embodiment 2]
In the magnetic component according to the first embodiment and its modification, the potting material 480 is prevented from entering the air gap 250 by securing the height of the bobbin stand 130. As a result, the size of the magnetic component 50 in the vertical direction is increased, which may be disadvantageous in terms of space constraints during mounting.

  FIG. 11 is a cross-sectional view for explaining the structure of the magnetic component 51 according to the second embodiment, and FIG. 12 is a bottom view of the magnetic component 51 shown in FIG. 11 viewed from the XII direction.

  Referring to FIG. 11, magnetic component 51 according to the second embodiment has a bobbin stand 130 having a height higher than that of magnetic component 50 according to the first embodiment and its modification shown in FIGS. 3 and 8. Different. Specifically, the height of the bobbin stand 130 is HG3 (HG3 <HG2).

  Referring to FIG. 12, in magnetic component 51 according to the second embodiment, adhesive is applied to the entire gap portion 253 of bobbin stand 130 and core 190 at the bobbin bottom surface portion of the contact portion between bobbin 100 and core 190. The adhesive part 501 is formed by (filling). Thereby, the intrusion route of the potting material 480 from the gap 253 to the air gap 250 can be blocked. Since the other structure of the magnetic component 51 is the same as that of the magnetic component 50, detailed description will not be repeated.

  Referring to FIG. 11 again, in magnetic component 51 according to the second embodiment, the height HG3 of bobbin stand 130 is such that core 190 is not in contact with potting material 480 with respect to potting height HP after the potting process. Designed to.

  However, in the magnetic component 51 according to the second embodiment, the potting material can be prevented from entering the air gap 250 by the adhesive portion 501 against the rise of the potting material during solidification. Therefore, the bobbin stand 130 can be designed by making the margin for the rising height H2 of the potting height HP when the potting material solidifies smaller than that of the first embodiment.

  Therefore, in the magnetic component according to the second embodiment, the bonding portion 501 is provided in the entire gap portion 253 of the bobbin stand 130 and the core 190 on the bottom surface side of the bobbin, thereby suppressing an increase in the height of the bobbin stand and It is possible to prevent the magnetic performance of the magnetic component from being lowered due to the penetration.

  Further, in the magnetic component according to the second embodiment, the height of the bobbin stand 130 is suppressed, and the gap portion 253 between the bobbin stand 130 and the core 190 is filled with an adhesive, so that the root portion 252 (see FIG. The strength of 9) is also ensured.

[Embodiment 3]
FIG. 13 is a cross-sectional view for illustrating the structure of the magnetic component according to the third embodiment.

  Referring to FIG. 13, magnetic component 52 according to the third embodiment includes bobbin 101 instead of bobbin 100. The bobbin 101 has a bobbin stand 131 instead of the bobbin stand 130 as compared with the bobbin 100 shown in the first embodiment. The bobbin stand 131 differs from the bobbin stand 130 shown in the first embodiment in the shape of the bobbin bottom surface portion 135.

FIG. 14 is an enlarged view corresponding to the bobbin bottom surface portion 135 in FIG.
Referring to FIG. 14, in magnetic component 52 according to the third embodiment, bobbin stand 131 has horizontal portion 136 extending in a direction crossing the ascending direction of potting material 480 in addition to bobbin bottom surface 138. . The horizontal portion 136 is provided so as to be positioned between the lower surface of the core 190 (the divided core 210) and the substrate 400. Since the other structure of the magnetic component 52 is the same as that of the magnetic component 50, detailed description will not be repeated.

  In the bobbin 101, in addition to the bobbin bottom surface 138, the horizontal part 136 is provided, so that the horizontal part 136 prevents the potting material 480 from entering the air gap 250.

  Referring to FIG. 13 again, the height HG4 (HG4 <HG2) of the bobbin stand 131 is designed such that the core 190 is not in contact with the potting material 480 with respect to the potting height HP after the potting process. However, in the magnetic component 52 according to the third embodiment, the horizontal portion 136 can prevent the air gap 250 from entering the potting material when it is solidified. Therefore, the bobbin stand 131 can be designed by making the margin for the rising height H2 of the potting height HP when the potting material solidifies smaller than that of the first embodiment.

  Therefore, in the magnetic component according to the third embodiment, by providing the horizontal portion 136 on the lower surface side of the bobbin stand 131, the increase in the height of the bobbin stand is suppressed, and the magnetic performance of the magnetic component is reduced due to the penetration of the potting material. It becomes possible to prevent.

  It should be noted that the magnetic component 52 of the third embodiment is filled with an adhesive in a part or the whole of the gap portion 253 of the bobbin 101 and the core 190 as in the modification of the first embodiment or the second embodiment. It is also possible to provide the adhesive portions 500 and 501.

[Example of changing the shape of the bobbin stand]
FIG. 15 is a cross-sectional view for explaining a modification of the shape of the bobbin stand in magnetic components 50 and 51 according to the first embodiment, the first modification, or the second embodiment.

  Referring to FIG. 15, a bobbin stand 130 #, which is a modification of bobbin stand 130, differs from bobbin stand 130 shown in FIGS. 3 and 11 in the arrangement position and shape of legs 137. The structure of other parts of bobbin stand 130 # is the same as that of bobbin stand 130.

  FIG. 16 is a cross-sectional view for explaining a modification of the shape of the bobbin stand in magnetic component 52 according to the third embodiment.

  Referring to FIG. 16, bobbin stand 131 #, which is a modification of bobbin stand 131, differs from bobbin stand 131 shown in FIG. The structure of other parts of bobbin stand 131 # is the same as that of bobbin stand 131.

  As shown in FIGS. 15 and 16, the leg portions 137 of the bobbin stands 130 and 131 may be arranged at the bobbin central portion in addition to being arranged at the bobbin end portion.

  The shape of the bobbin stand, including the leg portion 137, is not particularly defined, and the height of the bobbin stand is such that the air gap 250 of the split cores 200 and 210 is not in contact with the potting material 480 even after solidification. If the height of the bobbin stand is ensured, it is possible to realize a magnetic component having a bobbin structure according to the embodiment of the present invention.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  10 substrate unit, 15 electrical component, 50 # magnetic component (comparative example), 50, 51, 52 magnetic component, 100, 100 #, 101 bobbin, 110 flange portion, 120 cylindrical portion, 130, 130 #, 131 bobbin stand , 132 groove part, 135 bobbin bottom part, 136 horizontal part, 137 leg part, 138 bobbin bottom face, 140 pins, 150 hollow part, 160, 170 space, 190 core, 200, 210 split core, 201, 202, 203 protrusion, 204 Base part, 250 Air gap, 252 Base part, 253 Gap part, 300 Coil, 400 Substrate, 410 Through hole, 450 Case, 460 Boss, 480 Potting material, 500,501 Adhesive part, HG1, HG2, HG3, HG4 height (Bobbin stand), HP Ting high.

Claims (4)

A substrate for forming an electrical circuit;
Magnetic components mounted on the substrate;
A case for storing the substrate,
The magnetic component is
A core made of a magnetic material;
A coil wound around the core;
A bobbin for holding and fixing the core and the coil,
The core is formed by a plurality of split cores that are integrally fixed to the bobbin,
The bobbin is
A bobbin stand for mounting the bobbin on the substrate when the magnetic component is mounted on the substrate;
The substrate on which the magnetic component is mounted is molded by a potting material after being stored in the case,
The height of the bobbin stand is ensured so that the core fixed to the bobbin is not in contact with the potting material after molding with the potting material ,
The height of the lower surface facing the said board | substrate of the said core is a board | substrate unit higher than the height of the said potting material after the said mold . The bobbin stand has a portion that extends along the horizontal direction at a position on the substrate side of the bottom surface of the core in a state where the core is fixed to the bobbin on a bottom surface facing the substrate. The substrate unit according to claim 1 . Of the contact portion between the bobbin and the core in a state where the core is fixed to the bobbin, on the bottom surface side of the bobbin, with respect to a part including the end surface of the bobbin in the gap between the bobbin and the core adhesive is applied, the substrate unit according to claim 1 or 2. On the bottom surface side of the bobbin in the contact portion between the bobbin and the core in a state where the core is fixed to the bobbin, an adhesive is applied to the entire surface of the gap between the bobbin and the core. The substrate unit according to claim 1 or 2 .

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