JP5889615B2 - Method for manufacturing resin-sealed module and resin-sealed module - Google Patents

Description

  The present invention relates to a method for manufacturing a resin-sealed module and a resin-sealed module.

  In electrical equipment such as regulators (REG), capacitor discharge igniters (CDI), engine control units (ECUs), etc., printed circuit boards stored in module cases and electronic components mounted on the printed circuit boards are sealed with resin. A stopped resin-sealed module is used.

  As one of the methods for producing this resin-encapsulated module, a transfer mold method is known. Specifically, as described in Patent Document 1, for example, after a printed circuit board on which electronic components are mounted is stored in a mold 10 of a transfer molding apparatus, resin is press-fitted into the mold 10 to perform molding. .

JP 2004-111435 A

  In addition to short components such as IC chips and chip resistors, electronic components mounted on a printed circuit board include tall components such as electrolytic capacitors and transformers. When using an ordinary transfer molding method to encapsulate printed circuit boards and electronic components having different heights, it is necessary to form a sealing resin layer up to a height at which the tallest electronic components are embedded.

  However, in that case, there is a problem that the amount of resin used to form the sealing resin layer becomes excessive. In addition, since the amount of resin used is excessive, there is a problem that the resin-sealed module becomes heavy.

  In addition, when producing a die according to the height of the mounted component as in Patent Document 1, a dedicated die is required for each resin-encapsulated module, which greatly increases manufacturing costs and development. There is a problem that the period becomes longer.

  Therefore, an object of the present invention is to provide a method for manufacturing a resin-encapsulated module capable of reducing the amount of resin used for forming an encapsulating resin layer while suppressing the influence on the manufacturing cost and the development period. And

The manufacturing method of the resin-sealed module according to the first aspect of the present invention includes:
A printed circuit board and a method for producing a resin-sealed module in which electronic components mounted on the surface of the printed circuit board are resin-sealed,
A first electronic component is mounted on a first region of the printed circuit board, and a second electron having a height higher from the surface of the printed circuit board than the first electronic component is mounted on the second region of the printed circuit board. Mounting process of mounting parts,
A storing step of storing the printed board on which the first and second electronic components are mounted in a module case having a bottom plate and a side plate and opening in one direction so that the back surface of the printed board faces the bottom plate. When,
Injecting a thermosetting resin into the module case, and embedding the printed circuit board and the first electronic component in the thermosetting resin;
A mold member having a flat plate portion and a convex portion protruding from the surface of the flat plate portion is immersed in the thermosetting resin injected into the module case, and the first electronic component A positioning step for positioning so as to be located above;
A curing step of heating and curing the thermosetting resin in the module case;
Removing the mold member from the cured resin;
It is characterized by providing.

The manufacturing method of the resin-sealed module according to the second aspect of the present invention is as follows.
A printed circuit board and a method for producing a resin-sealed module in which electronic components mounted on the surface of the printed circuit board are resin-sealed,
A first electronic component is mounted on a first region of the printed circuit board, and a second electron having a height higher from the surface of the printed circuit board than the first electronic component is mounted on the second region of the printed circuit board. Mounting process of mounting parts,
An injection step of injecting a thermosetting resin into a module case having a bottom plate and a side plate and opening in one direction;
The printed circuit board on which the first and second electronic components are mounted is stored in a module case filled with the thermosetting resin so that the back surface of the printed circuit board faces the bottom plate, and the printed circuit board and A storage step of embedding the first electronic component in the thermosetting resin;
A mold member having a flat plate portion and a convex portion protruding from the surface of the flat plate portion is immersed in the thermosetting resin injected into the module case, and the first electronic component A positioning step for positioning so as to be located above;
A curing step of heating and curing the thermosetting resin in the module case;
Removing the mold member from the cured resin;
It is characterized by providing.

The manufacturing method of the resin-sealed module according to the third aspect of the present invention is as follows.
A printed circuit board and a method for producing a resin-sealed module in which electronic components mounted on the surface of the printed circuit board are resin-sealed,
Mounting an electronic component on the first region of the printed circuit board; and
Storing the printed circuit board on which the electronic component is mounted in a module case having a bottom plate and a side plate and opening in one direction so that the back surface of the printed circuit board faces the bottom plate;
Injecting a thermosetting resin into the module case, and embedding the printed circuit board in the thermosetting resin,
A mold member having a flat plate portion and a convex portion protruding from the surface of the flat plate portion is immersed in the thermosetting resin injected into the module case and the electronic component is mounted. A positioning step for positioning so as to be located above the printed circuit board in a second region different from the first region;
A curing step of heating and curing the thermosetting resin in the module case;
Removing the mold member from the cured resin;
It is characterized by providing.

Moreover, in the manufacturing method of the resin-sealed module,
The thermosetting resin is an epoxy resin,
At least the convex portion of the mold member may be an insulator including polypropylene.

Moreover, in the manufacturing method of the resin-sealed module,
The thermosetting resin is an epoxy resin,
At least the convex portion of the mold member may have a convex metal body and a film containing polypropylene formed on the surface of the metal body.

Moreover, in the manufacturing method of the resin-sealed module,
The convex portion of the mold member may be formed in a columnar shape, and may have a skirt portion that smoothly connects the surface of the flat plate portion and the side surface of the convex portion.

The resin-sealed module according to the first aspect of the present invention is
A resin-sealed module in which a printed circuit board and an electronic component mounted on the surface of the printed circuit board are resin-sealed,
A module case having a bottom plate and a side plate and opened in one direction;
A printed circuit board stored in the module case such that the back surface faces the bottom plate;
A plurality of electronic components mounted on the surface of the printed circuit board;
A sealing resin that is filled in the module case and embeds the printed circuit board and the plurality of electronic components;
With
Of the plurality of electronic components, the first electronic component mounted on the first region is closer to the surface of the printed board than the second electronic component mounted on the second region of the plurality of electronic components. Is low,
A recess is formed from the surface of the sealing resin exposed at the opening of the module case, and the recess has a thickness of the sealing resin on the printed circuit board in the first region. Is provided so as to be smaller than the height of the sealing resin on the printed circuit board in the second region,
It is characterized by that.

The resin-sealed module according to the second aspect of the present invention is:
A resin-sealed module in which a printed circuit board and an electronic component mounted on the surface of the printed circuit board are resin-sealed,
A module case having a bottom plate and a side plate and opened in one direction;
A printed circuit board stored in the module case such that the back surface faces the bottom plate;
A plurality of electronic components mounted on the surface of the printed circuit board;
A sealing resin that is filled in the module case and embeds the printed circuit board and the plurality of electronic components;
With
A concave portion is formed from the surface of the sealing resin exposed at the opening of the module case, and the concave portion is formed on the printed circuit board in a second region different from the first region where the plurality of electronic components are mounted. The thickness of the sealing resin is provided to be smaller than the thickness of the sealing resin on the printed circuit board in the first region,
It is characterized by that.

  In the method for producing a resin-sealed module according to the present invention, a mold member having a flat plate portion and a convex portion protruding from the surface of the flat plate portion is used as a thermosetting resin in which the convex portion is injected into the module case. And is positioned so as to be located above the first electronic component, and then the thermosetting resin is cured. Thereby, the recessed part corresponding to the convex part of a mold member is formed above the 1st electronic component shorter than a 2nd electronic component.

  Therefore, according to the present invention, the amount of resin used can be reduced by the volume of the recess. Moreover, the weight reduction of the resin sealing module can also be achieved.

It is sectional drawing of the resin sealing module which concerns on the 1st Embodiment of this invention. It is process sectional drawing explaining the manufacturing method of the resin sealing module which concerns on one Embodiment of this invention. (A) is a top view of a mold member, (b) is sectional drawing which follows the AA line of (a). It is sectional drawing of the resin sealing module which concerns on the 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, the component which has an equivalent function is attached | subjected the same code | symbol, and detailed description of the component of the same code | symbol is not repeated.

(First embodiment)
FIG. 1 shows a cross-sectional view of a resin sealing module 10 according to a first embodiment of the present invention.

  As shown in FIG. 1, a resin-sealed module 10 includes a module case 6 that is open in one direction, a printed circuit board 1 that is stored in the module case 6 so that the back surface faces the bottom plate of the module case 6, Electronic components 2 and 3 mounted on the surface of the substrate 1 and a sealing resin 4 filled in the module case 6 and embedded in the printed circuit board 1 and the electronic components 2 and 3 are provided.

  The module case 6 is a case having a rectangular bottom plate and four side plates, but the case shape is not limited to this.

  The printed circuit board 1 is placed on a base (not shown) having a predetermined height provided on the bottom plate of the module case 6. Note that the printed circuit board 1 may be stored in the module case 6 so that the back surface thereof is in contact with the inner bottom surface of the module case 6 instead of on the pedestal. In addition, electronic components such as chip resistors may be mounted on the back surface of the printed circuit board 1.

  The electronic component 2 is a relatively short electronic component such as an IC chip or a chip component, and is mounted on the first region of the printed circuit board 1. On the other hand, the electronic component 3 is a relatively tall electronic component such as a transformer or an electrolytic capacitor, and is mounted on the second region of the printed board. In other words, the height of the electronic component 2 mounted on the first region from the surface of the printed circuit board 1 is lower than that of the electronic component 3 mounted on the second region.

  The sealing resin 4 is made of, for example, an epoxy resin. Further, as shown in FIG. 1, a recess 5 is provided from the surface of the sealing resin 4 exposed at the opening of the module case 6. In the recess 5, the thickness (T1) of the sealing resin 4 on the printed circuit board 1 in the first region is smaller than the thickness (T2) of the sealing resin 4 on the printed circuit board 1 in the second region. (Ie, T1 <T2). Further, the thickness T1 is larger than the height of the electronic component 2, and the sealing resin 4 embeds the electronic component 2. The recess 5 is provided such that the bottom surface is located above the electronic component 2.

  Moreover, as shown in FIG. 1, the recessed part 5 has the edge part 5a reflecting the shape of the skirt part 25 of the below-mentioned mold member 20. As shown in FIG.

  As described above, in the resin-sealed module 10 according to the present embodiment, the short electronic component 2 and the tall electronic component 3 are mounted in the first region and the second region, respectively. , 3 is provided with a recess 5 above the printed circuit board 1 in the first region where the short electronic component 2 is mounted. The recess 5 has a thickness of the sealing resin 4 on the printed circuit board 1 in the first region larger than the height of the electronic component 2 and a thickness of the sealing resin 4 on the printed circuit board 1 in the second region. Is also provided to be smaller. Thereby, according to this embodiment, the volume of sealing resin can be reduced and the resin sealing module 10 can be reduced in weight, without impairing the function of sealing resin.

  Next, the manufacturing method of the resin sealing module 10 is demonstrated with reference to FIG. 2 and FIG. FIG. 2 is a process cross-sectional view illustrating a method for manufacturing the resin-encapsulated module 10. FIG. 3A is a plan view of the mold member 20, and FIG. 3B is a cross-sectional view taken along line AA in FIG.

(1) First, as shown in FIG. 2 (1), the electronic component 2 is mounted in the first region of the printed circuit board 1, and the surface of the printed circuit board 1 is placed in the second region of the printed circuit board 1 rather than the electronic component 2. The electronic component 3 having a high height is mounted (mounting process).

(2) Next, as shown in FIG. 2 (2), the printed circuit board 1 on which the electronic components 2 and 3 are mounted is placed in the module case 6 so that the back surface of the printed circuit board 1 faces the bottom plate of the module case 6. (Store process).

(3) Next, as shown in FIG. 2 (3), liquid thermosetting resin 4 A (for example, thermosetting epoxy resin) is injected into the module case 6, and the printed circuit board 1 and the electronic component 2 are assembled. It is embedded in the thermosetting resin 4A (injection step). In this step, it is not essential that the electronic component 3 is embedded in the thermosetting resin 4A as shown in FIG. The electronic component 3 may be embedded in the thermosetting resin 4A in a state where the mold member 20 is positioned in the positioning step described later.

(4) Next, as shown in FIG. 2 (4), the convex portion 22 of the mold member 20 is immersed in the thermosetting resin 4 A injected into the module case 6 and positioned above the electronic component 2. Next, the mold member 20 is positioned (positioning step).

  The configuration of the mold member 20 is shown in FIGS. The mold member 20 includes a flat plate portion 21, a convex portion 22 protruding in a columnar shape from the surface of the flat plate portion 21, and a fixing metal fitting 23 bonded to the flat plate portion 21. The flat plate part 21 and the convex part 22 are produced by cutting out from a resin material such as polypropylene, for example, by machining. The height of the convex portion 22 can be adjusted so that the distance between the convex portion 22 and the electronic component 2 is equal to or greater than the thickness required for the sealing resin 4 in a state where the mold member 20 is positioned. preferable.

  More specifically, the positioning in this step is performed by the adjustment hole 24 provided in the fixing bracket 23. A pin (not shown) having the same diameter as the adjustment hole 24 is provided on the work table to which the module case 6 is fixed or the module case 6 itself, and the mold member 20 is inserted into the adjustment hole 24 by inserting the pin into the adjustment hole 24. Fix in position.

  In FIG. 2 (4), the flat plate portion 21 and the convex portion 22 are in contact with the thermosetting resin 4A, but not limited thereto, only the convex portion 22 is in contact with the thermosetting resin 4A, and the flat plate portion. 21 may position the mold member 20 so as not to contact the thermosetting resin 4A.

(5) Next, the thermosetting resin 4A in the module case 6 is heated and cured (curing step). Thereby, the sealing resin 4 which embeds the printed circuit board 1 and the electronic components 2 and 3 is formed.

(6) Next, the mold member 20 is removed from the cured resin (removal step).

  Through the above steps, the resin sealing module 10 shown in FIG. 1 is obtained.

  According to the method for manufacturing the resin-encapsulated module, the concave portion 5 corresponding to the convex portion 22 of the mold member 20 is formed above the electronic component 2. Thus, the amount of resin used is reduced by the volume of the recess 5 while ensuring the thickness of the sealing resin that seals the first region on which the electronic component 2 is mounted to an extent that does not impair the function of the sealing resin. Can be reduced. Moreover, weight reduction of the resin sealing module 10 can also be achieved by reducing the resin to be used.

  Moreover, manufacturing cost can be reduced by making the flat plate part 21 and the convex part 22 of the mold member 23 into resin. That is, when the flat plate portion 21 and the convex portion 22 are cut out from a resin material by machining, the machining cost can be reduced because the machining is easier than metal. Moreover, also when producing the flat plate part 21 and the convex part 22 using a metal mold | die, the mold for resin mold members is cheaper compared with the metal mold member mold. As described above, it is advantageous in terms of cost that the flat plate portion 21 and the convex portion 22 are made of resin in both the case of manufacture by machining and the case of manufacture by a mold.

  In addition, it is preferable that at least a portion (such as the convex portion 22) in contact with the thermosetting resin 4A in the positioned state of the mold member 20 is formed of polypropylene and an epoxy resin is used as the sealing resin. Thereby, the mold release property of the mold member 20 and the cured sealing resin 4 can be improved. The convex portion 22 is preferably an insulator cut out by machining from a material having good releasability (such as an insulating material containing polypropylene). Or it is preferable that the convex part 22 has a convex-shaped metal body and the film containing the material (polypropylene etc.) formed in the surface of this metal body with good mold release property.

  In addition, as shown in FIG. 2 (4), when the flat plate portion 21 is in contact with the thermosetting resin 4A in a state where the mold member 20 is positioned, the flat plate portion 21 is also preferably covered with polypropylene. . That is, the flat plate portion 21 may be an insulator containing polypropylene, or may have a configuration including a metal plate and a film containing polypropylene formed on the surface of the metal plate.

  Further, as shown in FIG. 3B, the convex portion 22 of the mold member 20 may have a skirt portion 25 that smoothly connects the surface of the flat plate portion 21 and the side surface of the convex portion 22. Thereby, the releasability between the mold member and the cured resin can be further improved.

  The thermosetting resin 4A is not limited to the above manufacturing method, and may be injected before the printed circuit board 1 is stored in the module case 6. The manufacturing method of the resin-encapsulated module in this case is as follows.

(1) The same mounting process as described above is performed to mount the electronic components 2 and 3 on the printed circuit board 1.

(2) Next, liquid thermosetting resin 4A is injected into module case 6 (injection step).

(3) Next, the printed circuit board 1 on which the electronic components 2 and 3 are mounted is placed in the module case 6 into which the thermosetting resin 4A is injected so that the back surface of the printed circuit board 1 faces the bottom plate of the module case 6. The printed board 1 and the electronic component 2 are embedded in the thermosetting resin 4A (storage process).

  The subsequent positioning process, curing process, and detaching process are the same as in the above-described manufacturing method, and thus the description thereof is omitted.

(Second Embodiment)
Next, a resin sealing module according to the second embodiment will be described. One of the differences from the first embodiment is that the concave portion of the sealing resin is provided above the printed circuit board in a region where no electronic component is mounted. Hereinafter, a description will be given focusing on differences from the first embodiment.

  FIG. 4 shows a cross-sectional view of a resin sealing module 10A according to the second embodiment. Both the electronic component 2 and the electronic component 3 are mounted in the first region on the surface of the printed circuit board 1.

  A recess 5 </ b> A is formed from the surface of the sealing resin 4 exposed at the opening of the module case 6. The recess 5A is provided above the printed circuit board 1 in a second area different from the first area where the electronic components 2 and 3 are mounted. A wide wiring pattern (not shown) for large current may be formed in the second region.

  As shown in FIG. 4, the recess 5A has a first thickness (T3) of the sealing resin 4 on the printed circuit board 1 in a second region different from the first region where the electronic components 2 and 3 are mounted. It is provided to be smaller than the thickness (T4) of the sealing resin 4 on the printed circuit board 1 in the region (ie, T3 <T4).

  Thereby, according to 2nd Embodiment, the volume of sealing resin can be reduced and the resin sealing module 10 can be reduced in weight, without impairing the function of sealing resin similarly to 1st Embodiment. it can.

  Next, a method for manufacturing the resin sealing module 10A according to the second embodiment will be described.

(1) First, the electronic components 2 and 3 are mounted on the first region of the printed circuit board 1 (mounting process). Note that the heights of the electronic components mounted in the first region may be the same or different.

(2) Next, the printed circuit board on which the electronic components 2 and 3 are mounted is stored in the module case 6 so that the back surface of the printed circuit board 1 faces the bottom plate of the module case 6 (storage process).

(3) Next, the liquid thermosetting resin 4A is injected into the module case 6, and the printed circuit board 1 is embedded in the thermosetting resin 4A (injecting step). Note that the electronic components on the printed circuit board 1 may be embedded in the thermosetting resin 4A in a state where the mold member 20 is positioned in the positioning step described later.

(4) Next, a second region different from the first region in which the convex portion 22 of the mold member 20 is immersed in the thermosetting resin 4A injected into the module case 6 and the electronic components 2 and 3 are mounted. The mold member 20 is positioned so as to be positioned above the printed circuit board 1 (positioning step).

  Since the subsequent curing step and removal step are the same as those in the first embodiment, description thereof will be omitted. Note that as described in the first embodiment, the injection of the thermosetting resin 4 </ b> A may be performed before the printed circuit board 1 is stored in the module case 6.

  Based on the above description, those skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the individual embodiments described above. . You may combine suitably the component covering different embodiment. Various additions, modifications, and partial deletions can be made without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Printed circuit board 2, 3 Electronic component 4 Sealing resin 4A Thermosetting resin 5, 5A Concave part 5a Edge part 6 Module case 10, 10A Resin sealing module 20 Mold member 21 Flat plate part 22 Convex part 23 Fixing bracket 24 Adjustment hole 25 Bottoming part

Claims (7)

A printed circuit board and a method for producing a resin-sealed module in which electronic components mounted on the surface of the printed circuit board are resin-sealed,
A first electronic component is mounted on a first region of the printed circuit board, and a second electron having a height higher from the surface of the printed circuit board than the first electronic component is mounted on the second region of the printed circuit board. Mounting process of mounting parts,
A storing step of storing the printed board on which the first and second electronic components are mounted in a module case having a bottom plate and a side plate and opening in one direction so that the back surface of the printed board faces the bottom plate. When,
Injecting a thermosetting resin into the module case, and embedding the printed circuit board and the first electronic component in the thermosetting resin;
A mold member having a flat plate portion and a convex portion protruding from the surface of the flat plate portion is immersed in the thermosetting resin injected into the module case, and the first electronic component A positioning step for positioning so as to be located above;
A curing step of heating and curing the thermosetting resin in the module case;
Removing the mold member from the cured resin;
Equipped with a,
Producing the resin-encapsulated module, wherein the convex portion of the mold member is formed in a columnar shape and has a skirt portion that smoothly connects the surface of the flat plate portion and the side surface of the convex portion. Method. A printed circuit board and a method for producing a resin-sealed module in which electronic components mounted on the surface of the printed circuit board are resin-sealed,
A first electronic component is mounted on a first region of the printed circuit board, and a second electron having a height higher from the surface of the printed circuit board than the first electronic component is mounted on the second region of the printed circuit board. Mounting process of mounting parts,
An injection step of injecting a thermosetting resin into a module case having a bottom plate and a side plate and opening in one direction;
The printed circuit board on which the first and second electronic components are mounted is stored in a module case filled with the thermosetting resin so that the back surface of the printed circuit board faces the bottom plate, and the printed circuit board and A storage step of embedding the first electronic component in the thermosetting resin;
A mold member having a flat plate portion and a convex portion protruding from the surface of the flat plate portion is immersed in the thermosetting resin injected into the module case, and the first electronic component A positioning step for positioning so as to be located above;
A curing step of heating and curing the thermosetting resin in the module case;
Removing the mold member from the cured resin;
A method for producing a resin-sealed module, comprising: A printed circuit board and a method for producing a resin-sealed module in which electronic components mounted on the surface of the printed circuit board are resin-sealed,
Mounting an electronic component on the first region of the printed circuit board; and
Storing the printed circuit board on which the electronic component is mounted in a module case having a bottom plate and a side plate and opening in one direction so that the back surface of the printed circuit board faces the bottom plate;
Injecting a thermosetting resin into the module case, and embedding the printed circuit board in the thermosetting resin,
A mold member having a flat plate portion and a convex portion protruding from the surface of the flat plate portion is immersed in the thermosetting resin injected into the module case and the electronic component is mounted. A positioning step for positioning so as to be located above the printed circuit board in a second region different from the first region;
A curing step of heating and curing the thermosetting resin in the module case;
Removing the mold member from the cured resin;
Equipped with a,
Producing the resin-encapsulated module, wherein the convex portion of the mold member is formed in a columnar shape and has a skirt portion that smoothly connects the surface of the flat plate portion and the side surface of the convex portion. Method. The thermosetting resin is an epoxy resin,
The method for manufacturing a resin-sealed module according to any one of claims 1 to 3, wherein at least the convex portion of the mold member is an insulator containing polypropylene. The thermosetting resin is an epoxy resin,
At least the convex portion of the mold member has a convex metal body and a film containing polypropylene formed on the surface of the metal body.
The method for producing a resin-encapsulated module according to any one of claims 1 to 3. A resin-sealed module in which a printed circuit board and an electronic component mounted on the surface of the printed circuit board are resin-sealed,
A module case having a bottom plate and a side plate and opened in one direction;
A printed circuit board stored in the module case such that the back surface faces the bottom plate;
A plurality of electronic components mounted on the surface of the printed circuit board;
A sealing resin that is filled in the module case and embeds the printed circuit board and the plurality of electronic components;
With
Of the plurality of electronic components, the first electronic component mounted on the first region is closer to the surface of the printed board than the second electronic component mounted on the second region of the plurality of electronic components. Is low,
A recess is formed from the surface of the sealing resin exposed at the opening of the module case, and the recess has a thickness of the sealing resin on the printed circuit board in the first region. the al is provided to be smaller than the thickness of the sealing resin are, smoothly connecting the side surface of the the upper surface of the sealing resin recess on the printed circuit board in large and the second region than the height of the A resin-sealed module having an edge . A resin-sealed module in which a printed circuit board and an electronic component mounted on the surface of the printed circuit board are resin-sealed,
A module case having a bottom plate and a side plate and opened in one direction;
A printed circuit board stored in the module case such that the back surface faces the bottom plate;
A plurality of electronic components mounted on the surface of the printed circuit board;
A sealing resin that is filled in the module case and embeds the printed circuit board and the plurality of electronic components;
With
A concave portion is formed from the surface of the sealing resin exposed at the opening of the module case, and the concave portion is formed on the printed circuit board in a second region different from the first region where the plurality of electronic components are mounted. wherein said printed circuit board provided we are to be smaller than the thickness of the sealing resin, smooth and side of the upper surface and the recess of the sealing resin in the thickness first region of said sealing resin A resin-sealed module having an edge to be connected .

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