JP2014216089A - Thermosetting conductive paste composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermosetting conductive paste composition which can achieve excellent printing property and reduce the resistance of a resulting electrode or wiring or the like even though the content of a conductive powder is further increased.SOLUTION: There is provided a thermosetting conductive paste composition which comprises (A) a conductive powder, (B) a thermosetting component, (C) a curing agent and (D) a solvent, wherein the content of the conductive powder is 90 mass% or more and (D) the solvent has a viscosity of 100 mPa.s or more.

Description

  The present invention relates to a heat curable conductive paste composition, and in particular, can achieve excellent printability on a substrate and can be obtained by heating and curing a coating film printed on a substrate. The present invention relates to a heat curable conductive paste composition in which wiring can exhibit excellent conductivity.

  2. Description of the Related Art Conventionally, a method using a conductive paste composition is widely known as one of methods for forming an electrode or electrical wiring (wiring) on a substrate such as a film, a substrate, or an electronic component. In this method, when the conductor pattern is formed at a relatively low temperature, a thermosetting type containing a conductive metal powder (conductive powder) and a thermosetting resin is used. Then, this heat curable conductive paste composition is applied or printed on the substrate with a predetermined conductor pattern, and then heating is performed to dry and cure the conductor pattern on the substrate, thereby Conductor pattern electrodes, wiring, and the like are formed on the substrate.

  Here, with the recent improvement in performance of electronic devices and electronic components, further reduction in resistance is required for electrodes, wiring, and the like, and this requirement is becoming stricter year by year. In addition, conductor patterns serving as electrodes, wirings, and the like tend to increase in definition and complexity as electronic devices and electronic components become more sophisticated. Therefore, excellent printability is required for the thermosetting conductive paste composition.

  Therefore, in the field of heat-curing conductive paste compositions, it is possible to achieve high conductivity for electrodes and wiring obtained after curing, and high printability to form a good conductive pattern before curing. Technologies that make it possible have been proposed.

  For example, Patent Document 1 mainly includes silver particles having an average particle diameter of 0.5 μm to 20 μm and spherical silver particles having an average particle diameter of primary particles of 50 nm or less, and a mixing ratio (weight ratio). However, a conductive silver paste in the range of the former: latter = 99: 1 to 80:20 is disclosed. Patent Document 1 discloses that a thermosetting type using a “thermosetting resin” as a binder resin is preferable, and silver powder (silver particles): binder resin (polyester resin) = 85: 15. The range of 95: 5 is preferred, and it is also disclosed that when the silver powder exceeds 95 parts, the printability and adhesiveness are affected.

  The applicant of the present application includes a spherical silver powder having a flaky silver powder and a surface treatment agent attached as a silver powder in Patent Document 2, and the ratio of the silver powder in the solid content is 90 to 95% by weight. A heat-curable conductive paste composition has been proposed. This thermosetting conductive paste composition can achieve excellent printability, high conductivity, and good solder wettability by having the above-described configuration.

JP 2005-294254 A JP 2011-071057 A

  In the thermosetting conductive paste composition, it is possible to reduce the resistance by increasing the content (content ratio) in the composition of the conductive powder (silver powder or the like). However, when the content of the conductive powder is increased, the paste viscosity is increased, so that the printability is lowered. Therefore, as disclosed in Patent Document 1 or Patent Document 2, in the heat-curable conductive paste composition, in order to maintain good printability, the content of the conductive powder is increased. There was a limit.

  The present invention has been made in order to solve such problems, and even when the content of the conductive powder is further increased, excellent printability can be realized, and the obtained electrodes and wirings have low resistance. An object of the present invention is to provide a heat-curable conductive paste composition that can be made into a large amount.

  In order to solve the above-mentioned problems, the heat curable conductive paste composition according to the present invention comprises (A) a conductive powder, (B) a thermosetting component, (C) a curing agent, and (D). A heat-curable conductive paste composition containing a solvent, wherein the content of (A) conductive powder in the solid content of the heat-curable conductive paste composition is 90% by mass or more, and (D) The solvent has a viscosity of 100 mPa · s or more.

  According to the above configuration, in (A) the composition using the two kinds of powders as the conductive powder and (B) the two kinds of compounds as the thermosetting component, By using a high-viscosity material, it is possible to increase the content of the conductive powder (A) while realizing good printability. In addition, if the content of the conductive powder (A) can be increased, the resistance value of the obtained cured product can be lowered, so that it is possible to form an electrode, wiring or the like excellent in conductivity.

  Therefore, according to the above configuration, even when the content of the conductive powder (A) is further increased, excellent printability can be realized, and the resistance of the obtained electrodes and wirings can be reduced. .

  In the heat curable conductive paste composition having the above-described configuration, the (D) solvent may have a viscosity of 300 mPa · s or more.

  Moreover, in the thermosetting conductive paste composition having the above-described configuration, the ratio of the (A) conductive powder may be 95 to 99% by mass.

  In the heat curable conductive paste composition having the above-described configuration, at least one of (A1) flaky powder and (A2) spherical powder is used as the (A) conductive powder, and the (B) thermosetting is performed. The composition containing (B1) an epoxy resin and (B2) a blocked polyisocyanate compound may be used as the sex component.

  In the heat-curable conductive paste composition having the above-described configuration, the conductive powder (A) is silver powder, copper powder, silver-coated copper powder, silver-coated nickel powder, silver-coated aluminum powder, and silver-coated glass powder. A configuration in which at least one selected from the group consisting of:

  In the heat-curable conductive paste composition having the above-described configuration, the conductive pattern printed on the substrate is heat-cured to form an electrode or electrical wiring on the substrate. There may be.

  In the present invention, with the above-described configuration, even when the content of the conductive powder is increased, excellent printability can be realized, and the resistance of the obtained electrode, wiring, etc. can be reduced. There exists an effect that a type | mold conductive paste composition can be provided.

It is a top view which shows the shape of the conductor pattern for evaluating the characteristic (specific resistance) of the thermosetting conductive paste composition which concerns on this invention. It is a top view which shows the shape of the conductor pattern for evaluating the characteristic (conductor pattern formation) of the thermosetting conductive paste composition which concerns on this invention.

  Hereinafter, an example of a preferred embodiment of the present invention will be specifically described. The heat-curable conductive paste composition according to the present invention contains (A) conductive powder, (B) a thermosetting component, (C) a curing agent, and (D) a solvent. The content of (A) conductive powder in the heat curable conductive paste composition is 90% by mass or more, and (D) the viscosity of the solvent is 100 mPa · s or more.

  In the following description, the heat-curable conductive paste composition according to the present invention is simply abbreviated as “conductive paste composition”. In the present embodiment, the solid content (nonvolatile content) of the thermosetting conductive paste composition refers to the total of (A) the conductive powder and (B) the thermosetting component.

[(A) Conductive powder]
The conductive powder (A) used in the conductive paste composition according to the present invention may be (A1) flaky powder or (A2) spherical powder. From the viewpoint of realizing good conductivity, (A1 ) Flaky powder and (A2) spherical powder may be used in combination. Therefore, in the present invention, as (A) the conductive powder, at least one of (A1) flaky powder and (A2) spherical powder may be used.

  The (A1) flaky powder in the present invention may be a powder having a shape close to a flat plate or a thin rectangular parallelepiped when viewed as a whole, even if there is unevenness and deformation is seen partially. In addition, flake shape can be paraphrased as flake shape or scale shape. In addition, the (A2) spherical powder in the present invention may be a three-dimensional powder closer to a cube than a rectangular parallelepiped when viewed as a whole, even if there are irregularities and deformation is seen partially. Note that the spherical shape can be restated as granular.

  In the present invention, (A) flaky powder and (A2) spherical powder are used in combination as (A) conductive powder. For example, when only the (A1) flaky powder is used, the contact area between the (A) conductive powders can be increased, so that high conductivity can be expected. However, since a lubricant is used in the production process of (A1) flaky powder, if only (A1) flaky powder is used, the adhesiveness of the resulting cured product (electrode, wiring, etc.) may be reduced. .

  In addition, since (A1) flaky powder has a shape having a two-dimensional spread, when only (A1) flaky powder is used, a cured product (electrode, wiring, etc.) is caused by the shape. It tends to be difficult to increase the thickness. Therefore, for example, when a wiring is formed, the resistance value of the wiring may not be as low as expected. In addition, (A1) flaky powder has a relatively higher manufacturing cost than (A2) spherical powder due to its manufacturing process. Therefore, when only (A1) flaky powder is used, the cost is reduced. May be disturbed.

  Alternatively, when only (A2) spherical powder is used, the contact area between (A) conductive powders may be smaller than (A1) flaky powder, and the specific resistance may not be sufficiently reduced. There is. Therefore, in the present invention, it is preferable to use (A1) flaky powder and (A2) spherical powder in combination from the viewpoint of further improving the physical properties of the resulting conductive paste composition and reducing the cost.

  When (A1) flaky powder and (A2) spherical powder are used in combination, the mixing ratio of these powders is not particularly limited, but when the total of both is 100 parts by mass, (A1) flaky powder is 20-80. It is preferably in the range of parts by mass, and (A2) the spherical powder is preferably in the range of 80 to 20 parts by mass, (A1) the flaky powder is in the range of 40 to 60 parts by mass, and (A2) The spherical powder is more preferably in the range of 60 to 40 parts by mass. In other words, (A1) flaky powder and (A2) spherical powder are preferably blended so that the mass ratio is in the range of 20:80 to 80:20, and 40:60 to 60: More preferably, it is blended so as to be within the range of 40.

  If (A1) flaky powder or (A2) spherical powder exceeds 80 parts by mass or less than 20 parts by mass, the effect of improving the conductivity due to the combined use may not be obtained. In some cases, excellent adhesion to a substrate such as a film, a substrate, or an electronic component cannot be obtained. Of course, in the present invention, only (A1) flake powder or (A2) spherical powder can be used as the (A) conductive powder. With respect to, it means relative evaluation when two types are used in combination, and does not mean absolute evaluation.

  Moreover, the ratio (content) in the solid content of (A) conductive powder should just be in the range of 90-99 mass%, and it is preferable to exist in the range of 95-98 mass%, 95-97. More preferably, it is in the range of mass%. Solid content here is the sum total of (A) electroconductive powder and (B) thermosetting component as above-mentioned.

  If the content of (A) the conductive powder is less than 90% by mass, the contact density of the (A) conductive powder becomes small, and (A) the conductivity becomes insufficient due to poor contact between the conductive powders. This is not preferable because it leads to an increase in specific resistance. On the other hand, if the content of the (A) conductive powder is more than 99% by mass, it is not preferable because the (A) conductive powder may not be uniformly dispersed by the resin component. If the conductive powder (A) cannot be uniformly dispersed in the conductive paste composition, there is a possibility that the conductor pattern is blurred or a non-uniform conductor pattern is formed. In particular, in the present invention, as described later, a solvent having a relatively high viscosity is used as the solvent (D), whereby the content of (A) the conductive powder is at least 90% by mass, preferably Since it can be 95 mass% or more, the specific resistance can be reduced.

  Here, in any of (A1) flaky powder and (A2) spherical powder, the material is not particularly limited, and is a conductive substance known in the field of heat-curable conductive paste composition, Those having low resistance can be suitably used. Specifically, gold, silver, copper, and alloys thereof can be preferably used. The material composition of the specific powder (particles) is not particularly limited, but typically, silver powder, copper powder, silver-coated copper powder, silver-coated nickel powder, silver-coated aluminum powder, silver-coated glass powder, etc. Can be mentioned. Only one type of these material configurations may be used, or two or more types may be used in appropriate combination. Among these, silver powder (silver powder) can be given as a representative powder. Therefore, in the present embodiment, flaky silver powder is preferably used as (A1) flaky powder, and spherical silver powder is preferably used as (A2) spherical powder.

  Moreover, in this invention, it is preferable that the upper limit of the amount of alkali metal ions contained in these (A) electroconductive powder is defined in any of (A1) flaky powder and (A2) spherical powder. Specifically, the amount of sodium ions and potassium ions contained in the conductive powder (A) is preferably less than 200 ppm, more preferably less than 100 ppm, and even more preferably less than 10 ppm. In the present invention, it is preferable that at least the amount of sodium ions is less than 200 ppm. If the amount of these ions exceeds 200 ppm, problems are likely to occur in the electrical characteristics and reliability of an electronic component or electronic device in which electrodes and wirings are formed from the conductive paste composition. On the other hand, the lower the lower limit of these ions, the better.

[(A1) Flaked powder]
Of the conductive powder (A) in the present invention, the preferred configuration of the (A1) flaky powder will be specifically described. (A1) The average particle diameter D50 of the flaky powder is preferably in the range of 2 to 20 μm, the BET specific surface area is preferably in the range of 0.1 to ¹ m ² / g, and the tap density is 3 to 3. It is preferably in the range of 7 g / cm ³ , and the aspect ratio is preferably in the range of 5-15.

  More specifically, the average particle diameter D50 of (A1) flaky powder is preferably in the range of 2 to 20 μm as described above, more preferably in the range of 2 to 12 μm, and in the range of 6 to 10 μm. More preferably. If the average particle diameter D50 of the (A1) flaky powder is smaller than 2 μm, the contact resistance between the (A) conductive powders tends to increase, and sufficient conductivity may not be obtained. On the other hand, if the average particle diameter D50 is larger than 20 μm, (A) the contact resistance between the conductive powders becomes small, but when a conductor pattern is printed using a mesh screen, the mesh screen is clogged, or fine wiring May be difficult to form.

Further, the BET specific surface area of the (A1) flaky powder is preferably in the range of 0.1 to ¹ m ² / g as described above, but more preferably in the range of 0.2 to 0.8 m ² / g. , More preferably in the range of 0.2 to 0.5 m ² / g. (A1) If the BET specific surface area of the flaky powder is smaller than 0.1 m ² / g, the flake thickness becomes too thick, and (A1) the shape of the flaky powder becomes nearly spherical. The contact area tends to be small, and sufficient conductivity may be obtained. On the other hand, if the BET specific surface area exceeds 1 m ² / g, (A) the contact area between the conductive powders becomes large, but the paste viscosity becomes high, so that high filling becomes difficult (ie, conductive paste composition). Since it tends to be difficult to improve the content of the (A) conductive powder in the product, sufficient conductivity may not be obtained.

The tap density of the (A1) flaky powder is preferably in the range of ^{3 to} 7 g / cm ³ as described above, more preferably in the range of ^{3 to} 6 g / cm ³ , and 3.5 to 5. More preferably within the range of 5 g / cm ³ . (A1) If the tap density of the flaky powder is less than 3 g / cm ³ , (A1) the flaky powder tends to be bulky and high filling tends to be difficult, so sufficient conductivity cannot be obtained. There is a fear. On the other hand, if the tap density exceeds 7 g / cm ³ , it is usually difficult to industrially produce (A1) flaky powder.

  The aspect ratio of the (A1) flaky powder is preferably within the range of 5 to 15 as described above, more preferably within the range of 6 to 12, and even more preferably within the range of 6 to 10. (A1) If the aspect ratio of the flaky powder is less than 5, flaking is insufficient, and the contact area between the conductive powders (A) tends to be small, and sufficient conductivity may not be obtained. is there. On the other hand, if the aspect ratio exceeds 15, (A) the contact area between the conductive powders becomes large, but high filling tends to be difficult, so there is a possibility that sufficient conductivity cannot be obtained.

  The manufacturing method of said (A1) flaky powder is not specifically limited, A well-known method can be used. Specifically, for example, (A1) flaky powder can be produced by using (A2) spherical powder produced by a known method as a base powder and subjecting the base powder to a known mechanical treatment. The physical properties such as the particle size and cohesion of the base powder are appropriately determined according to the purpose of use of the conductive paste composition (types of electrodes, wirings, etc., or types of electronic components or electronic devices equipped with these electrodes, wirings, etc.) You can choose.

[(A2) Spherical powder]
Next, a preferable configuration of the (A2) spherical powder in the (A) conductive powder in the present invention will be specifically described. (A2) The average particle diameter D50 of the spherical powder is preferably in the range of 0.1 to 10 μm, the BET specific surface area is preferably in the range of 0.5 to 1.7 m ² / g, and the tap density Is preferably 1.5 to 5 g / cm ³ , and the degree of aggregation D50 / DSEM is preferably in the range of 2 to 15.

  More specifically, the average particle diameter D50 of the (A2) spherical powder is preferably in the range of 0.1 to 10 μm as described above, more preferably in the range of 1 to 5 μm, and in the range of 1 to 3 μm. If it is in, it is more preferable. (A2) If the average particle diameter D50 of the spherical powder is smaller than 0.1 μm, the conductive paste composition may have a high viscosity, making it difficult to form a paste. On the other hand, if the average particle diameter D50 is larger than 10 μm, as in the case of (A1) flaky powder, when a conductor pattern is printed using a mesh screen, the mesh screen is clogged or fine wiring is formed. It may be difficult.

Further, the BET specific surface area of the (A2) spherical powder is preferably in the range of 0.5 to 1.7 m ² / g as described above, but more preferably in the range of 0.6 to 1.6 m ² / g. Preferably, it is more preferably in the range of 0.9 to 1.6 m ² / g. (A2) If the BET specific surface area of the spherical powder is smaller than 0.5 m ² / g, the contact area between the conductive powders (A) tends to be small, and sufficient conductivity may not be obtained. On the other hand, if the BET specific surface area exceeds 1.7 m ² / g, the contact area between the conductive powders (A) increases, but the paste viscosity tends to be high and high filling tends to be difficult. There is a possibility that conductivity cannot be obtained.

The tap density of the (A2) spherical powder is preferably in the range of 1.5 to 5 g / cm ³ as described above, more preferably in the range of 2 to ⁵ g / cm ³ , and ^{3 to 4} g / cm ^3. If it is in the range of ³ , it is more preferable. (A2) If the tap density of the spherical powder is less than 1.5 g / cm ³ , (A) the conductive powder tends to be bulky and high filling tends to be difficult, so that sufficient conductivity can be obtained. There is a risk of not. On the other hand, if the tap density exceeds 5 g / cm ³ , (A2) the dispersibility of the spherical powder becomes too good, and (A) the resin component easily flows between the conductive powders. The interfacial resistance between the powders tends to increase, and there is a risk that sufficient conductivity cannot be obtained.

  Further, the degree of aggregation D50 / DSEM of the spherical powder (A2) is preferably in the range of 2 to 15 as described above, more preferably in the range of 3 to 11, and more preferably in the range of 3 to 7.5. More preferred. If the degree of aggregation D50 / DSEM is less than 2, (A2) the dispersibility of the spherical powder becomes too good, and (A) the resin component tends to wrap around between the conductive powders. The interfacial resistance tends to increase, and there is a possibility that sufficient conductivity cannot be obtained. On the other hand, if the degree of aggregation D50 / DSEM is greater than 15, (A) the conductive powder tends to be bulky and high filling tends to be difficult, so that sufficient conductivity may not be obtained.

  The method for producing the (A2) spherical powder is not particularly limited, and in the present embodiment, for example, a product produced by a wet reduction method can be suitably used, but known methods such as an electrolytic method and an atomizing method can be used. (A2) spherical powder produced by other methods can also be used.

[(B) Thermosetting component]
As the (B) thermosetting component used in the conductive paste composition according to the present invention, a component known in the field of the thermosetting conductive paste composition can be suitably used. Typically, (B1) an epoxy resin and (B2) a blocked polyisocyanate compound can be mentioned. When these (B1) epoxy resin and (B2) blocked polyisocyanate compound are used as the (B) thermosetting component, it is preferable that these are blended at a predetermined blending ratio.

  Among these (B) thermosetting components, (B1) epoxy resin is a component that is the base of (B) thermosetting component, whereas (B2) blocked polyisocyanate compound is mainly a specific resistance. Functions as a component to reduce Therefore, a favorable specific resistance can be realized by combining (B1) an epoxy resin and (B2) a blocked polyisocyanate compound.

  (B1) Although the specific kind and structure of an epoxy resin are not specifically limited, It is preferable that all are polyvalent epoxy resins which have a 2 or more oxirane ring (epoxy group) in 1 molecule. For example, epichlorohydrin, novolak such as phenol novolak and cresol novolak, polyphenol such as bisphenol A, hydrogenated bisphenol A, bisphenol F, bisphenol AD, and resorcin, ethylene glycol, neopentyl glycol, glycerin, trimethylolpropane, pentaerythritol Glycidyl ether type obtained by reacting polyhydric alcohol such as triethylene glycol and polypropylene glycol; glycidyl amine type obtained by reacting polyamino compound such as ethylenediamine, triethylenetetramine and aniline; adipic acid Glycidyl ester type obtained by reacting with polyvalent carboxyl compounds such as phthalic acid and isophthalic acid, oxidation of olefin, etc. Alicyclic type, etc. to be can be given. These epoxy resins may be used alone or in combination.

  Further, as the (B2) blocked polyisocyanate compound, compounds known in the field of conductive paste compositions can be suitably used.

  Specifically, for example, aromatic isocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, polymethylene polyphenyl polyisocyanate, tolidine diisocyanate, xylylene diisocyanate, naphthalene diisocyanate; hexamethylene diisocyanate, isophorone diisocyanate, hydrogenated xylylene diisocyanate, dicyclohexyl And aliphatic polyisocyanates such as methane diisocyanate, octamethylene diisocyanate, and trimethylhexamethylene diisocyanate. These polyisocyanate compounds may be used alone or in combination of two or more. Of these polyisocyanate compounds, polymethylene polyphenyl polyisocyanates having three or more nuclei are more preferably used.

  In the present embodiment, a terminal isocyanate group-containing compound synthesized by reacting a known polyisocyanate and a known polyol by a known method can also be suitably used as the polyisocyanate compound in the present invention. The polyol used in this case is not particularly limited, and general polyether polyols, polyester polyols, polycarbonate polyols and the like can be suitably used.

  The (B2) blocked polyisocyanate compound in the present invention is obtained by blocking the polyisocyanate compound described above, but the blocking agent for the polyisocyanate compound is not particularly limited, and imidazoles, phenols, oximes, etc. Can be suitably used.

  In the conductive paste composition according to the present invention, when (B1) an epoxy resin and (B2) a blocked polyisocyanate compound are used in combination as the (B) thermosetting component, the mixing ratio (mixing ratio) thereof is particularly limited. Although it is not, it is preferable to mix | blend in the range of B1: B2 = 30: 70-90: 10 by mass ratio, and it is more preferable to mix | blend in the range of 50: 50-80: 20.

  When the total of (B1) epoxy resin and (B2) blocked polyisocyanate compound is 100 parts by mass, if (B1) the epoxy resin is less than 30 parts by mass, that is, (B2) blocked polyisocyanate compound is If it exceeds 70 parts by mass, the strength and adhesiveness of the obtained cured product (electrode, wiring, etc.) are lowered, which is not preferable. On the other hand, if (B1) the epoxy resin exceeds 90 parts by mass, ie, (B2) the blocked polyisocyanate compound is less than 10 parts by mass, (B2) (A) conductivity due to curing shrinkage of the blocked polyisocyanate compound This is not preferable because the effect of promoting the contact between the powders is reduced and the conductivity is lowered.

  Moreover, the conductive paste composition according to the present invention includes, as (B) a thermosetting component, (B1) an epoxy resin, and (B2) other resins known as binder resins in addition to the blocked polyisocyanate compound. You may contain. Examples of other resins that can be used as the binder resin include, but are not limited to, phenol resins, polyester resins, polyurethane resins, acrylic resins, melamine resins, polyimide resins, and silicone resins.

[(C) Curing agent]
The (C) curing agent used in the conductive paste composition according to the present invention is not particularly limited as long as it is a compound capable of curing the (B) thermosetting component. In the present embodiment, (B) the epoxy resin is preferably used as the (B) thermosetting component. Therefore, (C) at least (B1) the epoxy resin is cured as the curing agent. If it exists, the kind etc. are not specifically limited, Various compounds well-known in the field | area of an electrically conductive paste composition can be mentioned.

  Specifically, for example, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, succinic anhydride Acid anhydrides such as acids; imidazole, 2-methylimidazole, 2-ethyl-4methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1-benzyl-2-methylimidazole, 2-phenyl-4methyl Imidazoles such as imidazole, 1-cyanoethyl-2-methylimidazole, 1-aminoethyl-2-methylimidazole, 1-methylimidazole, 2-ethylimidazole; dimethyloctylamine, dimethyldecylamine, dimethyllaurylamine, dimethyl Listylamine, dimethylpalmitylamine, dimethylstearylamine, dimethylbehenylamine, dilaurylmonoethylamine, methyldidecylamine, methyldioleylamine, triallylamine, triisopropanolamine, triethylamine, 3- (dibutylamino) propylamine, tri-n -Tertiary amines such as octylamine, 2,4,6-trisdimethylaminomethylphenol, triethanolamine, methyldiethanolamine, diazabicycloundecene; boron trifluoride ethyl ether, boron trifluoride phenol, three Contains boron fluoride such as boron fluoride piperidine, boron acetate trifluoride, boron trifluoride monoethylamine, boron trifluoride triethanolamine, boron trifluoride monoethanolamine Suic acid or its compounds; such as Amicure series PN-23 or MY-24 commercially available from Ajinomoto Fine Techno Co., Ltd., Fujicure series FXR-1020 or FXR-1030 commercially available from Fuji Kasei Kogyo Co., Ltd. Amine adducts; dicyandiamide; and the like. These compounds may be used alone or in combination of two or more.

  (C) Although the addition amount of a hardening | curing agent is not specifically limited, In this Embodiment, it is preferable that it exists in the range of 3-30 mass parts with respect to 100 mass parts of (B1) epoxy resins, and 3-15 mass parts. More preferably, it is in the range of 3 to 10 parts by mass. (C) If the addition amount of the curing agent is less than 3 parts by mass, (B1) the epoxy resin may be insufficiently cured, and the cured product (electrode, wiring, etc.) has good conductivity. There is a risk of not being able to. On the other hand, if it exceeds 30 parts by mass, the paste viscosity may be increased, and it is not preferable in terms of cost.

[(D) Solvent]
The (D) solvent used in the conductive paste composition according to the present invention has a viscosity of 100 mPa · s or more.

  (D) The specific type of the solvent is not particularly limited, and the solvent is determined to be usable in the field of the heat curable conductive paste composition (that is, does not hinder the physical properties of the conductive paste composition from the technical viewpoint). As long as the viscosity is 100 mPa · s or more at room temperature. The normal temperature at this time may be in the range of 20 ° C. ± 15 ° C., but a preferable reference temperature is 20 ° C. Further, the viscosity of the solvent (D) may be 100 mPa · s or more, but is preferably 300 mPa · s or more at room temperature, and more preferably 1500 mPa · s or more at room temperature. In addition, although the upper limit of the viscosity of the solvent (D) is not particularly limited, the use of an excessively high viscosity solvent increases the amount of addition of the solvent necessary for adjusting to the desired viscosity. Becomes lower. Therefore, the viscosity of the solvent is preferably less than 20000 mPa · s.

  Examples of the solvent (D) preferably used in the present invention include 2-ethyl-1,3-hexanediol (viscosity at 20 ° C. is 320 mPa · s), 2,4-diethyl-1,5-pentanediol ( And a mixture with p-menthan-8-ol and p-menthan-1-ol (viscosity at 20 ° C. is 8200 mPa · s). Only one type of these solvents may be used, or two or more types may be used in appropriate combination. The (D) solvent used in the present invention may have a viscosity of 100 mPa · s or more, for example, a combination of a low viscosity solvent having a viscosity of less than 100 mPa · s and a high viscosity solvent having a viscosity of 100 mPa · s or more. Even if it is a mixed solvent, if the viscosity is 100 mPa * s or more, it can be used conveniently.

  In the field of heat curable conductive paste compositions, it is generally known that if the paste viscosity of the conductive paste composition is high, the printability is lowered. In order to improve the conductivity of the cured product (to reduce resistance), it is conceivable to increase the content of (A) the conductive powder. Since the increase in the content leads to an increase in the paste viscosity, the printability is also lowered.

  On the other hand, in the present invention, in the composition using (A) the two types of powders described above as the conductive powder and (B) the two types of compounds described above as the thermosetting component, A high (D) solvent is selected and used. That is, according to the study by the present inventors, as shown in the results of Examples described later, (D) a solvent having a relatively low viscosity is used by using a solvent having a relatively high viscosity. The paste viscosity of the conductive paste composition was significantly reduced as compared with the case where it was, and as a result, it became clear that good printability could be realized even if the content of the conductive powder (A) was increased. .

  Here, the paste viscosity of the conductive paste composition according to the present invention may be a level that does not impair the printability even when the content of the conductive powder (A) is 90% by mass or more. Is not particularly limited. Generally, the paste viscosity at normal temperature is preferably in the range of 200 to 500 Pa · s, and more preferably in the range of 250 to 450 Pa · s. By setting the paste viscosity of the conductive paste composition in such a predetermined range, it is possible to improve the shape retention after the conductor pattern is formed by printing. In the case of wiring, it is possible to suppress wiring dripping or wiring bleeding. Therefore, a high-definition conductor pattern can be formed.

  Note that the viscometer for measuring the paste viscosity and its conditions are not particularly limited, but in this embodiment, as used in the examples and comparative examples described later, a Brookfield DV-III viscometer is used, and 1 rpm The paste viscosity (η1 rpm) is measured under measurement conditions during rotation. Here, in Examples and Comparative Examples, which will be described later, the paste viscosity was also measured when the measurement conditions were 5 rpm, and the TI value (η1 rpm / η5 rpm) obtained by dividing the paste viscosity at 1 rpm by the paste viscosity at 5 rpm. ) Is also calculated, and these comprehensively evaluate the paste viscosity. The paste viscosity at the time of 5 rpm rotation should just be in the range of 70-140 Pa * s, and the TI value should just be in the range of 2.0-5.0.

[Production and Use of Conductive Paste Composition]
The manufacturing method of the electrically conductive paste composition which concerns on this invention is not specifically limited, A well-known method can be used suitably in the field | area of the electrically conductive paste composition. As a typical example, there is a method in which the above-described components are blended at a predetermined blending ratio (mass basis) and formed into a paste using a known kneading apparatus. Examples of the kneading apparatus include a three roll mill.

  In the conductive paste composition according to the present invention, the above-described components ((A) conductive powder, (B) thermosetting component, (C) curing agent, and (D) solvent) are included as necessary. Besides, various additives known in the field of conductive paste compositions may be contained. Although it does not specifically limit as the said additive, Specifically, a dispersing agent, a leveling agent, antioxidant, a ultraviolet absorber, a silane coupling agent, an antifoamer, a viscosity modifier etc. can be mentioned, for example. These additives can be added as long as the effects of the present invention are not hindered.

  Moreover, the formation method of a conductor pattern with the electrically conductive paste composition which concerns on this invention is not specifically limited, A well-known various method can be used suitably. Typically, as shown in the examples described later, there is a screen printing method, and particularly, it is suitably used for forming a conductor pattern by this screen printing method, but the present invention is not limited to this, and an ink jet method. It can also be applied to other printing methods such as the dispenser method and the dispenser method.

  The conductive paste composition according to the present invention can be widely used for forming high-definition electrodes and wirings. Specifically, for example, a collector electrode of a solar battery cell; an external electrode of a chip-type electronic component; an RFID (Radio Frequency IDentification), an electromagnetic wave shield, a vibrator adhesive, a membrane switch, or a component used for electroluminescence It can be suitably used for applications such as electrodes or wirings. Among these applications, one of particularly preferable applications is a collecting electrode of a solar battery cell.

  The present invention will be described more specifically based on examples, comparative examples, and reference examples, but the present invention is not limited thereto. Those skilled in the art can make various changes, modifications, and alterations without departing from the scope of the present invention. In addition, measurement / evaluation of various synthesis reactions and physical properties in the following examples were performed as follows.

(Measurement and evaluation method)
[Evaluation method of conductive powder]
In the examples and comparative examples, flaky silver powder and spherical silver powder were used as the conductive powder. Among these, for the flaky silver powder, the average particle diameter D50, the maximum particle diameter Dmax, the aspect ratio, the BET specific surface area, the tap density, and the amount of sodium ions were evaluated. For the spherical silver powder, the average particle diameter D50, the maximum particle diameter Dmax, the average particle diameter DSEM, the degree of aggregation D50 / DSEM, the BET specific surface area, the tap density, and the amount of sodium ions were evaluated. Details of each evaluation will be described below.

(1) Evaluation of average particle diameter D50 and maximum particle diameter Dmax The average particle diameter D50 and the maximum particle diameter Dmax of the flaky silver powder and the spherical silver powder were evaluated by a laser diffraction method. A sample of 0.3 g of flaky silver powder or spherical silver powder was weighed into a 50 ml beaker, 30 ml of isopropyl alcohol was added, and then dispersed by treating for 5 minutes with an ultrasonic cleaner (USM-1 manufactured by ASONE Corporation). The average particle size D50 and the maximum particle size Dmax were measured and evaluated using a microtrack particle size distribution measuring device (Microtrack particle size distribution measuring device 9320-HRA X-100 manufactured by Nikkiso Co., Ltd.).

(2) Evaluation of average particle diameter DSEM Spherical silver powder was observed with a scanning electron microscope (SEM, JSM-5500 manufactured by JEOL Ltd.), and 100 particles were randomly selected from an image magnified 20,000 times. The particle size (major axis on the image) was measured. Then, the SEM particle size DSEM was calculated and evaluated by averaging the particle size of each particle.

(3) Evaluation of aspect ratio 10 particles were randomly selected from an image magnified 2,000 times by observing the flaky silver powder with a scanning electron microscope (JSM-5500 manufactured by JEOL Ltd.). Then, the particle size (diameter of the circumscribed circle) was measured, and the length of the long side was obtained by averaging the number. Similarly, ten particles were randomly selected from an image magnified 2,000 times, the thickness was measured, and the number was averaged to obtain the thickness. The aspect ratio was calculated and evaluated by dividing the length of the obtained long side by the thickness.

(4) Evaluation of BET specific surface area The BET specific surface area of flaky silver powder or spherical silver powder is evaluated by measuring 1 g of a sample using a monosorb (manufactured by Quanta Chrome) by a BET one-point method by nitrogen adsorption. did. In the measurement of the BET specific surface area, the deaeration conditions before the measurement were 10 minutes at 60 ° C.

(5) Evaluation of tap density The tap density of the flaky silver powder or the spherical silver powder was measured using a tap density measuring device (Casa specific gravity measuring device SS-DA-2 manufactured by Shibayama Scientific Instruments Co., Ltd.) The sample was weighed and placed in a 20 ml test tube, tapped 1,000 times with a drop of 20 mm, and the tap density was calculated by the following formula and evaluated.

Tap density = sample mass (15 g) / sample volume after tapping (cm ³ )
(6) Evaluation of sodium ion amount The sodium ion amount of flaky silver powder or spherical silver powder was evaluated by measuring 1 g of sample in nitric acid, adding pure water and diluting, and then measuring by atomic absorption method.

(7) Evaluation of degree of aggregation D50 / DSEM The degree of aggregation 50D / DSEM of the spherical silver powder is the average particle diameter D50 obtained by the laser diffraction method, as determined by a scanning electron microscope image (SEM, JSM-5500 manufactured by JEOL Ltd.). The average particle size of primary particles obtained from the image observation was calculated by dividing by DSEM and evaluated.

[Measurement of paste viscosity]
The paste viscosity of the conductive paste composition was measured using a DV-III viscometer manufactured by Brookfield. CP-52 is used as the cone for measurement, and the paste viscosity (η1 rpm) at 1 rpm rotation (shear rate 2 s-1) and the paste viscosity (η5 rpm) at 5 rpm rotation (shear rate 10 s-1) are measured. In addition, a TI value (η1 rpm / η5 rpm) obtained by dividing the former by the latter was calculated.

[Evaluation of resistivity]
An alumina substrate was used as the base material. As shown in FIG. 1, the conductive paste composition of the example or comparative example is used on the surface of the alumina substrate, and terminals 11a and 11b are provided at both ends, and the wiring portion 11c is zigzag-shaped. The conductor pattern 11 and a 2 mm × 2 mm square conductor pattern (square pattern) (not shown) were screen-printed. Thereafter, the alumina substrate was heated in a hot air dryer at 180 ° C. for 60 minutes to cure the conductor pattern 11 (conductive paste composition). This produced a sample for evaluating specific resistance.

  About the specific resistance evaluation sample of each Example or Comparative Example, the film thickness of the conductor pattern 11 is a surface roughness meter (Surfcom 480A manufactured by Tokyo Seimitsu Co., Ltd.), and the electric resistance is a digital multimeter (R6551 manufactured by Advantest Corporation). The specific resistance was calculated and evaluated based on the film thickness, the electrical resistance, and the aspect ratio of the wiring pattern.

  As for the evaluation standard of the specific resistance, an upper limit value of the specific resistance was set, and the evaluation was made based on whether or not the specific resistance was lower. If the specific resistance of the wiring (electrode) is high, it is necessary to increase the film thickness in order to obtain the same level of wiring resistance, so that a large amount of the conductive paste composition to be used is also required. Therefore, it is preferable that the specific resistance of the electrode and wiring is as low as possible. In the following examples and comparative examples, the specific resistance of the wiring was preferably 10 μΩ · cm or less, more preferably 9 μΩ · cm or less, and more preferably 8 μΩ · cm or less.

[Evaluation of printability]
A comb-like conductor pattern 12 having a line width of 100 μm is continuously printed on an alumina substrate using 100 g of the conductive paste composition of each example or comparative example as shown in FIG. The printability was evaluated by observation.
The conductor pattern 12 printed even after continuous printing of 500 times or more is evaluated as “Good” when no wiring dripping, wiring bleeding, or wiring fading is observed, and wiring is performed during continuous printing of 300 times or more and less than 500 times. A case in which at least one of wiring blur and wiring blur was recognized was evaluated as Δ, and a case in which at least one of wiring dripping, wiring blur, and wiring blur was observed was evaluated as x.

Example 1
(A) As conductive powder, (A1) flaky silver powder and (A2) spherical silver powder 1 shown in Table 1 are used, and (B) thermosetting component and (C) curing agent shown in Table 2. Using compounds, (D) Solvent 1 shown in Table 3 (viscosity at 20 ° C .: 320 mPa · s) as a solvent, these components were blended in the composition shown in Table 4 (both parts by mass), and 3 The conductive paste composition of Example 1 was prepared (manufactured) by kneading with a roll mill to form a paste.

  While measuring the paste viscosity of the obtained conductive paste composition, the specific resistance evaluation sample described above was prepared, and the specific resistance of the conductor pattern 11 and the printing of the conductive paste composition when forming the conductor pattern 12 were performed. Sex was evaluated. The results are shown in Table 4.

(Example 2)
(A) As the conductive powder, (A1) flaky silver powder and (A2) spherical silver powder 2 shown in Table 1 were used, and (D) Solvent 2 shown in Table 3 (viscosity at 20 ° C .: 1650 mPa · s) as the solvent. A conductive paste composition was prepared in the same manner as in Example 1 except that each component of (A) to (D) was blended with the composition shown in Table 4 using s). Moreover, it carried out similarly to Example 1, and evaluated the specific resistance of the conductor pattern 11, and the printability of the conductive paste composition. The results are shown in Table 4.

Example 3
(D) Examples except that each component of (A) to (D) was blended in the composition shown in Table 4 using the solvent 2 shown in Table 3 (viscosity at 20 ° C .: 1650 mPa · s) as the solvent. In the same manner as in Example 1, a conductive paste composition was prepared. Moreover, it carried out similarly to Example 1, and evaluated the specific resistance of the conductor pattern 11, and the printability of the conductive paste composition. The results are shown in Table 4.

Example 4
(D) Examples except that each component of (A) to (D) was blended in the composition shown in Table 4 using the solvent 1 shown in Table 3 (viscosity at 20 ° C .: 320 mPa · s) as the solvent. In the same manner as in No. 2, a conductive paste composition was prepared. Moreover, it carried out similarly to Example 1, and evaluated the specific resistance of the conductor pattern 11, and the printability of the conductive paste composition. The results are shown in Table 4.

(Example 5)
(D) Examples except that each component of (A) to (D) was blended in the composition shown in Table 4 using the solvent 2 shown in Table 3 (viscosity at 20 ° C .: 1650 mPa · s) as the solvent. In the same manner as in Example 3, a conductive paste composition was prepared. Moreover, it carried out similarly to Example 1, and evaluated the specific resistance of the conductor pattern 11, and the printability of the conductive paste composition. The results are shown in Table 4.

(Example 6)
(D) Examples except that each component of (A) to (D) was blended in the composition shown in Table 4 using the solvent 3 shown in Table 3 (viscosity at 20 ° C .: 110 mPa · s) as the solvent. In the same manner as in Example 1, a conductive paste composition was prepared. Moreover, it carried out similarly to Example 1, and evaluated the specific resistance of the conductor pattern 11, and the printability of the conductive paste composition. The results are shown in Table 4.

(Example 7)
(A) As the conductive powder, (A1) flaky silver powder and (A2) spherical silver powder 1 shown in Table 1 are used, and (A1) flaky silver powder is (A2) spherical silver as shown in Table 5. More than powder 2, the composition shown in Table 5 for each component of (B) to (D), using as solvent (D) the solvent 4 shown in Table 3 (viscosity at 20 ° C .: 8200 mPa · s). A conductive paste composition was prepared in the same manner as in Example 2 except that it was blended in the above. In the same manner as in Example 1, the specific resistance of the conductor pattern 11 and the printability of the conductive paste composition were evaluated. The results are shown in Table 5.

(Example 8)
(A) As conductive powder, (A1) flaky silver powder and (A2) spherical silver powder 1 shown in Table 1 are used, and (D) solvent 4 shown in Table 3 (viscosity at 20 ° C .: 8200 mPas) is used as a solvent. Conductivity in the same manner as in Example 2 except that each component of (A) to (D) was blended with the composition shown in Table 5 using s) and solvent 5 (viscosity at 20 ° C .: 4 mPa · s). Paste composition was prepared. In addition, as shown in Table 5, the viscosity of the mixed solvent of the solvents 4 and 5 was 300 mPa · s. Moreover, it carried out similarly to Example 1, and evaluated the specific resistance of the conductor pattern 11, and the printability of the conductive paste composition. The results are shown in Table 5.

(Comparative Example 1)
(D) Examples except that each component of (A) to (D) was blended in the composition shown in Table 5 using the solvent 5 shown in Table 3 (viscosity at 20 ° C .: 4 mPa · s) as the solvent. In the same manner as in Example 1, a conductive paste composition was prepared. Moreover, it carried out similarly to Example 1, and evaluated the specific resistance of the conductor pattern 11, and the printability of the conductive paste composition. The results are shown in Table 5.

(Comparative Example 2)
A conductive paste composition was prepared in the same manner as in Comparative Example 1 except that the components (A) to (D) were changed to the compositions shown in Table 5. Moreover, it carried out similarly to Example 1, and evaluated the specific resistance of the conductor pattern 11, and the printability of the conductive paste composition. The results are shown in Table 5.

(Comparative Example 3)
(D) A conductive paste composition was prepared in the same manner as in Comparative Example 2 except that the solvent 6 shown in Table 3 (viscosity at 20 ° C .: 67 mPa · s) was used as the solvent. Moreover, it carried out similarly to Example 1, and evaluated the specific resistance of the conductor pattern 11, and the printability of the conductive paste composition. The results are shown in Table 5.

  As shown in Examples 1 to 8, a thermosetting conductive paste composition containing (A) conductive powder, (B) thermosetting component, (C) curing agent, and (D) solvent. In (1), a favorable paste viscosity is obtained by using the (D) solvent having a viscosity of 100 mPa · s or more at room temperature. Therefore, the conductive paste compositions of Examples 1 to 8 can achieve good printability, and the cured product can have good specific resistance.

  In particular, in Examples 1 to 5, the content of the conductive powder (A) in the solid content increased by 1% by mass from 95.0% by mass in Example 1 to 99.0% by mass in Example 5. However, both can achieve good paste viscosity and printability, and the specific resistance is also good.

  In Example 6, (A) the content of the conductive powder in the solid content is the same as in Example 1, and the solvent 3 having a viscosity of 110 mPa · s is used. In Example 7, (A ) The content of the conductive powder in the solid content is the same as in Example 2, and the solvent 4 having a viscosity of 8200 mPa · s is used, both of which are good pastes as in Examples 1 to 5 Viscosity and printability can be realized, and the specific resistance is also a good value.

  Further, in Example 8, (A) the content of the conductive powder in the solid content was the same as in Example 2, and the low-viscosity solvent 5 of less than 100 mPa · s was mixed with the high-viscosity solvent 4. Although a mixed solvent is used, since the viscosity of this mixed solvent is 300 mPa · s, a good paste viscosity and printability can be realized, and the specific resistance is also a good value, as in Examples 1-7. Yes.

  On the other hand, in Comparative Example 1, the viscosity of the solvent (D) is less than 100 mPa · s, but the printability of the obtained conductive paste composition is inferior to that of Examples 1-8. Moreover, since content of (A) electroconductive powder is lower than Example 1 (93 mass% in solid content), the specific resistance of hardened | cured material is also high.

  Further, in Comparative Example 2, as in Comparative Example 1, the viscosity of the solvent 4 used as the solvent (D) is less than 100 mPa · s (4 mPa · s), but (A) in the solid content of the conductive powder. When the content is 95% by mass, which is the same as in Example 1, the paste viscosity is higher than that in Comparative Example 1, and the printability is greatly reduced, making it impossible to form an appropriate conductor pattern 12.

  In Comparative Example 3, (A) the content of the conductive powder in the solid content is the same as in Example 1 and Example 6, but the viscosity of the solvent 5 used in Comparative Example 3 is 67 mPa · s. The viscosity of the solvent 1 used in Example 1 is 320 mPa · s, and the viscosity of the solvent 3 used in Example 6 is 110 mPa · s. Comparing these results, the specific resistance of Comparative Example 3 is about the same as that of Examples 1 and 6, but the paste viscosity of Comparative Example 3 is three values (η1 rpm, η5 rpm and TI) all increased, and printability decreased. The paste viscosities of Examples 1 and 6 are almost the same for all three values, and the printability is also good.

  Further, when the results of Examples 1, 6, 8 and Comparative Examples 1 to 3 are compared, when the viscosity of the solvent (D) is less than 300 mPa · s, the TI value tends to increase. Therefore, it can be seen that the viscosity of the solvent (D) may be 100 mPa · s or more, and preferably 300 mPa · s or more.

  Thus, according to the present invention, by using the solvent (D) having a relatively high viscosity, the paste viscosity of the obtained conductive paste composition is reduced and good printability is achieved (A). It becomes possible to increase the content of the conductive powder. In addition, if the content of the conductive powder (A) can be increased, the resistance value of the obtained cured product can be lowered, so that it is possible to form an electrode, wiring or the like excellent in conductivity.

  It should be noted that the present invention is not limited to the description of the above-described embodiment, and various modifications are possible within the scope shown in the scope of claims, and each disclosed in different embodiments and a plurality of modifications. Embodiments obtained by appropriately combining technical means are also included in the technical scope of the present invention.

  INDUSTRIAL APPLICABILITY The present invention can be suitably used in the field of manufacturing various electronic devices and electronic components, and in particular, collecting electrodes for solar cells, external electrodes for chip-type electronic components, RFID, electromagnetic wave shields, vibrator adhesives, membrane switches Alternatively, it can be suitably used in fields where it is required to form higher-definition electrodes and wiring such as electrodes and wiring of parts used for electroluminescence and the like.

11 Conductor pattern 11a Terminal 11b Terminal 11c Wiring part 12 Conductor pattern

Claims (6)

A heat-curable conductive paste composition containing (A) conductive powder, (B) a thermosetting component, (C) a curing agent, and (D) a solvent,
The content of (A) conductive powder in the solid content of the thermosetting conductive paste composition is 90% by mass or more, and (D) the viscosity of the solvent is 100 mPa · s or more. To
Heat curable conductive paste composition. (D) The viscosity of the solvent is 300 mPa · s or more,
The thermosetting conductive paste composition according to claim 1. The ratio of the conductive powder (A) is 95 to 99% by mass,
The heat-curable conductive paste composition according to claim 1 or 2. As the (A) conductive powder, at least one of (A1) flaky powder and (A2) spherical powder is used,
The (B) thermosetting component contains (B1) an epoxy resin and (B2) a blocked polyisocyanate compound,
The heat-curable conductive paste composition according to any one of claims 1 to 3. The (A) conductive powder is at least one selected from the group consisting of silver powder, copper powder, silver-coated copper powder, silver-coated nickel powder, silver-coated aluminum powder, and silver-coated glass powder. And
The thermosetting conductive paste composition according to any one of claims 1 to 4. It is characterized in that it is used for forming an electrode or an electric wiring on the base material by heating and curing the conductor pattern printed on the base material,
The thermosetting conductive paste composition according to any one of claims 1 to 5.

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