JP2003297148A - Electrically conductive paste - Google Patents
Electrically conductive pasteInfo
- Publication number
- JP2003297148A JP2003297148A JP2003000986A JP2003000986A JP2003297148A JP 2003297148 A JP2003297148 A JP 2003297148A JP 2003000986 A JP2003000986 A JP 2003000986A JP 2003000986 A JP2003000986 A JP 2003000986A JP 2003297148 A JP2003297148 A JP 2003297148A
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- Prior art keywords
- conductive paste
- solvent
- weight
- viscosity
- ethyl
- Prior art date
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、積層セラミックコ
ンデンサ、積層正特性サーミスタ等の電子部品に用いら
れる導電性ペーストに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste used for electronic parts such as laminated ceramic capacitors and laminated positive temperature coefficient thermistors.
【０００２】[0002]
【従来の技術】従来より、金属粉末を導電性粉末として
含有する電子部品用導電性ペーストに使用されている溶
剤は、ターピネオールやジヒドロターピネオール等の環
式化合物系溶剤を主溶剤としている（特許文献１）。上
記溶剤を使用している導電性ペーストは、焼成により電
極等を形成する際にセラミック基板やグリーンシート等
にスクリーン印刷工法により印刷される。従って、導電
性ペーストの粘度は、印刷性を向上させるための重要な
管理項目の１つとなっている。2. Description of the Related Art Conventionally, a solvent used in a conductive paste for electronic parts, which contains a metal powder as a conductive powder, mainly contains a cyclic compound solvent such as terpineol or dihydroterpineol (Patent Document 1). 1). The conductive paste using the above solvent is printed by a screen printing method on a ceramic substrate, a green sheet or the like when forming an electrode or the like by firing. Therefore, the viscosity of the conductive paste is one of the important control items for improving the printability.
【０００３】[0003]
【特許文献１】特開平７−２１８３２号公報[Patent Document 1] JP-A-7-21832
【０００４】[0004]
【発明が解決しようとする課題】ところが、上記従来の
溶剤系では、導電性ペースト中の金属粉末とのヌレ性が
悪いため導電性ペーストの粘度が経時的に変化する。そ
のため、上記導電性ペーストは、印刷性が著しく変動
し、焼成して電極等を形成した場合の品質が一定しない
という問題があった。However, in the above-mentioned conventional solvent system, the viscosity of the conductive paste changes with time because the wettability with the metal powder in the conductive paste is poor. Therefore, there is a problem in that the printability of the above-mentioned conductive paste is remarkably changed, and the quality when fired to form an electrode or the like is not constant.
【０００５】本発明は、上記従来の問題に鑑みなされた
ものであり、その目的は、長期間粘度の安定した導電性
ペーストを提供することにある。The present invention has been made in view of the above conventional problems, and an object thereof is to provide a conductive paste having a stable viscosity for a long period of time.
【０００６】[0006]
【課題を解決するための手段】本発明の導電性ペースト
は、上記課題を解決するために、金属粉末と、溶剤を含
む有機ビヒクルとを含有する導電性ペーストにおいて、
上記溶剤は、２−エチル−１，３−ヘキサンジオールを
含み、上記溶剤における上記２−エチル−１，３−ヘキ
サンジオールの含有率は、２０重量％〜５０重量％であ
ることを特徴としている。In order to solve the above problems, the conductive paste of the present invention is a conductive paste containing a metal powder and an organic vehicle containing a solvent,
The solvent contains 2-ethyl-1,3-hexanediol, and the content of the 2-ethyl-1,3-hexanediol in the solvent is 20% by weight to 50% by weight. .
【０００７】上記の構成によれば、有機ビヒクルの溶剤
に含まれている２−エチル−１，３−ヘキサンジオール
と金属粉末とのヌレ性が良好であるため、経時的に粘度
の安定な導電性ペーストを提供することができる。これ
により、上記導電性ペーストは、均一に印刷することが
できる。この導電性ペーストを焼成することにより、均
一な電極等を得ることができる。つまり、積層セラミッ
クコンデンサや積層正特性サーミスタ等の電子部品に好
適に用いることができる。According to the above constitution, since the wettability between the 2-ethyl-1,3-hexanediol contained in the solvent of the organic vehicle and the metal powder is good, the conductive material whose viscosity is stable over time is obtained. Sex paste can be provided. Thereby, the conductive paste can be printed uniformly. By baking this conductive paste, uniform electrodes and the like can be obtained. That is, it can be suitably used for electronic parts such as a laminated ceramic capacitor and a laminated positive temperature coefficient thermistor.
【０００８】本発明の導電性ペーストは、上記の構成に
加えて、導電性ペーストにおける上記金属粉末の含有率
は、４５重量％〜９０重量％であることが好ましい。In the conductive paste of the present invention, in addition to the above constitution, the content of the metal powder in the conductive paste is preferably 45% by weight to 90% by weight.
【０００９】本発明の導電性ペーストは、上記の構成に
加えて、上記金属粉末が、銅粉末であることが好まし
い。In the conductive paste of the present invention, in addition to the above constitution, it is preferable that the metal powder is a copper powder.
【００１０】これにより、より一層経時的に粘度の安定
な導電性ペーストを提供することができる。This makes it possible to provide a conductive paste having a viscosity which is more stable over time.
【００１１】[0011]
【発明の実施の形態】以下本発明について、実施例に基
づいて説明する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below based on Examples.
【００１２】[0012]
【実施例】〔実施例１〕本実施例では、導電性ペースト
における、２−エチル−１，３−ヘキサンジオール（３
−ヒドロキシメチル−４−ヘプタノール）の粘度安定化
に対する効果の確認を行ったものである。EXAMPLES Example 1 In this example, 2-ethyl-1,3-hexanediol (3
-Hydroxymethyl-4-heptanol) was confirmed for its effect on stabilizing the viscosity.
【００１３】上記導電性ペーストは、有機バインダー
（有機ビヒクル）と金属粉末とを含んでいる。上記有機
バインダーは、有機溶剤と樹脂とを含んでいるものであ
る。The above conductive paste contains an organic binder (organic vehicle) and metal powder. The organic binder contains an organic solvent and a resin.
【００１４】有機バインダー（有機ビヒクル）〜に
使用する溶剤は、ジヒドロターピネオールを主溶剤と評
価溶剤種５種類（２−エチル−１，３−ヘキサンジオー
ル、イソデカノール、プロピレングリコールモノブチル
エーテル、デカン、ＤＯＰ）との混合溶剤系、およびジ
ヒドロターピネオールの単独溶剤の計６種類とした。ま
た、樹脂成分として、エチルセルロースを用いた。The solvent used for the organic binder (organic vehicle) is dihydroterpineol as the main solvent and five types of evaluation solvent types (2-ethyl-1,3-hexanediol, isodecanol, propylene glycol monobutyl ether, decane, DOP). There are a total of 6 types of mixed solvent system with and a single solvent of dihydroterpineol. In addition, ethyl cellulose was used as a resin component.
【００１５】上記有機バインダー〜は、それぞれの
溶剤９４重量％にエチルセルロース６重量％を徐々に加
えて、攪拌機にて２４時間攪拌することにより作製し
た。これら有機バインダー〜の詳細な組成について
は、表１に示す。The above organic binders were prepared by gradually adding 6% by weight of ethyl cellulose to 94% by weight of each solvent and stirring the mixture for 24 hours with a stirrer. Table 1 shows the detailed compositions of these organic binders.
【００１６】[0016]
【表１】 [Table 1]
【００１７】次いで、得られた有機バインダー〜と
金属粉末である平均粒径１．５μｍの銅粉末とを三本ロ
ールで混練・分散することにより、導電性ペースト〜
を作製した。本実施例では、導電性ペースト〜に
おいて、銅粉末の比率を導電性ペースト全体に対して８
０重量％、有機バインダー〜の比率を導電性ペース
ト全体に対して２０重量％とした。Then, the obtained organic binder is mixed with copper powder, which is a metal powder and has an average particle size of 1.5 μm, by a three-roll mill to disperse the conductive paste.
Was produced. In this embodiment, the ratio of the copper powder in the conductive paste to 8 is 8 with respect to the entire conductive paste.
The ratio of 0 wt% and the organic binder was set to 20 wt% with respect to the entire conductive paste.
【００１８】作製した導電性ペースト〜は、室温
（２５±５℃）で保管し、粘度の経時変化を測定した。
粘度は、製造後１５日、３０日、６０日に測定し、粘度
変化率として表２に示す。なお、粘度変化率［％］は、
｛（製造後の経過日数の粘度−製造直後の粘度）／製造
直後の粘度｝×１００として求めた。The prepared conductive pastes were stored at room temperature (25 ± 5 ° C.) and the change in viscosity with time was measured.
The viscosity was measured 15 days, 30 days, and 60 days after production, and is shown in Table 2 as a viscosity change rate. The viscosity change rate [%] is
The value was calculated as {(viscosity of elapsed days after production-viscosity immediately after production) / viscosity immediately after production} × 100.
【００１９】[0019]
【表２】 [Table 2]
【００２０】表２に示すように、評価溶剤種として２−
エチル−１，３−ヘキサンジオールを使用した導電性ペ
ーストは、粘度変化率５％以内に安定しているのに対
して、他の５種類の導電性ペースト〜は粘度変化率
が±２０％以上と大きく粘度が変化していることが確認
できた。従って、粘度安定性を向上させるためには、２
−エチル−１，３−ヘキサンジオールが好適であること
が判る。As shown in Table 2, as a solvent type for evaluation, 2-
The conductive paste using ethyl-1,3-hexanediol is stable within a viscosity change rate of 5%, while the other five conductive pastes have a viscosity change rate of ± 20% or more. It was confirmed that the viscosity changed significantly. Therefore, in order to improve the viscosity stability, 2
It turns out that -ethyl-1,3-hexanediol is suitable.
【００２１】〔実施例２〕本実施例は、導電性ペースト
に含まれる有機バインダーの溶剤における２−エチル−
１，３−ヘキサンジオールの含有率の粘度安定化に対す
る効果の確認を行ったものである。Example 2 In this example, 2-ethyl-in a solvent of an organic binder contained in the conductive paste was used.
The effect of the content ratio of 1,3-hexanediol on the viscosity stabilization was confirmed.
【００２２】まず、有機バインダーａ〜ｆでは、主溶剤
であるターピネオールと、２−エチル−１，３−ヘキサ
ンジオールとの混合溶剤を用いた。２−エチル−１，３
−ヘキサンジオールの含有率は、全溶剤量に対して、１
０重量％、２０重量％、２５重量％、３０重量％、５０
重量％、６０重量％になるように変化させて有機バイン
ダーａ〜ｆを作製した。また、ターピネオール単独溶剤
を用いた有機バインダーｇを作製した。これら有機バイ
ンダーの組成については、表３に示す。また、表３にお
いて、各有機バインダーにおける全溶剤量に対する、各
溶剤の比率［重量％］を括弧内に示している。本実施例
の導電性ペーストにおける溶剤成分は、混合される有機
バインダーの溶剤成分のみであるので、上記括弧内の比
率は導電性ペーストにおける溶剤成分の比率と一致す
る。First, as the organic binders a to f, a mixed solvent of terpineol as a main solvent and 2-ethyl-1,3-hexanediol was used. 2-ethyl-1,3
-Hexanediol content is 1 with respect to the total amount of solvent.
0% by weight, 20% by weight, 25% by weight, 30% by weight, 50
The organic binders a to f were prepared by changing the content to be 60% by weight. Further, an organic binder g was prepared using a terpineol single solvent. The compositions of these organic binders are shown in Table 3. Further, in Table 3, the ratio [% by weight] of each solvent to the total amount of solvent in each organic binder is shown in parentheses. Since the solvent component in the conductive paste of this example is only the solvent component of the organic binder to be mixed, the ratio in the above parentheses matches the ratio of the solvent component in the conductive paste.
【００２３】[0023]
【表３】 [Table 3]
【００２４】上記有機バインダーａ〜ｇは、溶剤９１重
量％にエチルセルロース９重量％を徐々に添加し、攪拌
機にて２４時間攪拌することにより作製した。The organic binders a to g were prepared by gradually adding 9% by weight of ethyl cellulose to 91% by weight of a solvent and stirring with a stirrer for 24 hours.
【００２５】得られた有機バインダーａ〜ｇと金属粉末
である平均粒径１．５μｍの銅粉末と金属元素としてＢ
ａおよびＳｉを主成分とする金属酸化物粉末とを三本ロ
ールで混練・分散して導電性ペーストａ〜ｇを作製し
た。上記金属酸化物粉末を添加することにより、デラミ
ネーションを抑える効果がある。本実施例では、導電性
ペーストａ〜ｇにおいて、銅粉末の比率を導電性ペース
ト全体に対して６０重量％、金属酸化物粉末の比率を導
電性ペースト全体に対して６重量％、有機バインダーの
比率を導電性ペースト全体に対して３４重量％とした。The obtained organic binders a to g, copper powder having an average particle diameter of 1.5 μm, which is a metal powder, and B as a metal element.
Conductive pastes a to g were prepared by kneading and dispersing a and a metal oxide powder containing Si as a main component with a three-roll mill. The addition of the metal oxide powder has the effect of suppressing delamination. In this example, in the conductive pastes a to g, the ratio of copper powder was 60 wt% with respect to the whole conductive paste, the ratio of metal oxide powder was 6 wt% with respect to the whole conductive paste, and the organic binder was added. The ratio was 34% by weight with respect to the entire conductive paste.
【００２６】作製した導電性ペーストａ〜ｇは、室温
（２５±５℃）で保管し、粘度の経時変化を測定した。
粘度は、製造後３０日の粘度を測定し、表４に粘度変化
率を示す。なお、粘度変化率は、実施例１と同様にして
求めた。The prepared conductive pastes a to g were stored at room temperature (25 ± 5 ° C.) and the change in viscosity with time was measured.
The viscosity was measured 30 days after production, and Table 4 shows the rate of change in viscosity. The viscosity change rate was obtained in the same manner as in Example 1.
【００２７】[0027]
【表４】 [Table 4]
【００２８】表４に示すように、２−エチル−１，３−
ヘキサンジオールを溶剤全量中２０重量％〜５０重量％
の割合使用した導電性ペーストｂ〜ｅは、粘度変化率が
±１０％以内に安定しているのに対して、ターピネオー
ル単独溶剤の有機バインダーを使用した導電性ペースト
ｇは、粘度が２０％変化していることを確認した。ま
た、２−エチル−１，３−ヘキサンジオール量が２０重
量％未満の場合は、導電性ペーストａのように、粘度変
化率が＋１８％と大きくなり、５０重量％を超えると導
電性ペーストｆのように、粘度変化率が−１５％と大き
くなり、いずれも好ましくないことを確認した。以上の
ように、導電性ペーストにおける２−エチル−１，３−
ヘキサンジオールは、導電性ペーストにおける全溶剤量
に対して２０重量％〜５０重量％が好ましいことが判っ
た。As shown in Table 4, 2-ethyl-1,3-
Hexanediol 20% to 50% by weight in the total amount of solvent
In the conductive pastes b to e used, the rate of change in viscosity is stable within ± 10%, whereas in the conductive paste g using an organic binder of terpineol alone, the viscosity changes by 20%. I have confirmed that. When the amount of 2-ethyl-1,3-hexanediol is less than 20% by weight, the rate of change in viscosity is as large as + 18% as in the conductive paste a, and when it exceeds 50% by weight, the conductive paste f is used. As described above, the rate of change in viscosity was as large as -15%, and it was confirmed that neither was preferable. As described above, 2-ethyl-1,3-in the conductive paste
It was found that hexanediol is preferably 20% by weight to 50% by weight based on the total amount of solvent in the conductive paste.
【００２９】なお、各表において、有機バインダーおよ
び導電性ペーストに※を付したものは本発明の範囲外の
条件のものであり、それ以外はすべて本発明の範囲内の
条件のものである。In the tables, the organic binders and conductive pastes marked with * are under the conditions outside the scope of the present invention, and all other conditions are within the scope of the present invention.
【００３０】また、導電性ペースト中の金属粉末の含有
量は、４５重量％〜９０重量％の範囲が好ましい。これ
は、４５重量％未満の場合は、分散が不安定となり、金
属粉末が沈降分離しやすくなり、９０重量％を超える
と、ペースト状になりにくくなるためである。The content of the metal powder in the conductive paste is preferably in the range of 45% by weight to 90% by weight. This is because when it is less than 45% by weight, the dispersion becomes unstable and the metal powder easily separates by sedimentation, and when it exceeds 90% by weight, it becomes difficult to form a paste.
【００３１】また、上記実施例では、導電性粉末として
銅粉末を用いたが、これに限らず、ニッケル、銀、パラ
ジウム等を金属粉末として用いてもよく、銅と同様に粘
度の経時的変化を抑えた導電性ペーストを得ることがで
きる。Further, in the above embodiment, the copper powder was used as the conductive powder, but the present invention is not limited to this, and nickel, silver, palladium or the like may be used as the metal powder, and like the copper, the viscosity changes with time. It is possible to obtain a conductive paste in which
【００３２】また、上記実施例では、有機バインダーに
おける樹脂として、エチルセルロースを用いたが、これ
に限らず、他のセルロース系樹脂やアクリル系樹脂を用
いることができる。Although ethyl cellulose is used as the resin in the organic binder in the above embodiments, the present invention is not limited to this, and other cellulose resins or acrylic resins can be used.
【００３３】以上のように、本発明の導電性ペーストで
は、有機バインダーに使用する溶剤に２−エチル−１，
３−ヘキサンジオールを溶剤全量中に２０重量％〜５０
重量％含む混合溶剤を用いている。これにより、導電性
ペーストの粘度の経時的変化を抑える（安定させる）こ
とができるので、上記導電性ペーストにおける印刷性の
変動がほとんどない。従って、上記導電性ペーストは、
均一に印刷することができ、品質が一定した電極等を製
造することができる。As described above, in the conductive paste of the present invention, the solvent used for the organic binder is 2-ethyl-1,
20% by weight to 50% by weight of 3-hexanediol in the total amount of solvent
A mixed solvent containing wt% is used. As a result, it is possible to suppress (stabilize) the change in viscosity of the conductive paste with time, so that there is almost no change in the printability of the conductive paste. Therefore, the conductive paste,
It is possible to print uniformly, and it is possible to manufacture electrodes and the like having a constant quality.
【００３４】[0034]
【発明の効果】本発明の導電性ペーストでは、有機バイ
ンダーに使用する溶剤に２−エチル−１，３−ヘキサン
ジオールを溶剤全量中に２０重量％〜５０重量％含む混
合溶剤を用いている。これにより、経時的に粘度の安定
な導電性ペーストを提供することができる。In the conductive paste of the present invention, the solvent used for the organic binder is a mixed solvent containing 2-ethyl-1,3-hexanediol in an amount of 20% by weight to 50% by weight in the total amount of the solvent. Thereby, it is possible to provide a conductive paste whose viscosity is stable over time.
Claims (3)
含有する導電性ペーストにおいて、 上記溶剤は、２−エチル−１，３−ヘキサンジオールを
含み、上記溶剤における上記２−エチル１，３ヘキサン
ジオールの含有率は、２０重量％〜５０重量％であるこ
とを特徴とする請求項１に記載の導電性ペースト。1. A conductive paste containing a metal powder and an organic vehicle containing a solvent, wherein the solvent contains 2-ethyl-1,3-hexanediol, and the 2-ethyl-1,3 in the solvent. The conductive paste according to claim 1, wherein the content of hexanediol is 20% by weight to 50% by weight.
有率は、４５重量％〜９０重量％であることを特徴とす
る請求項１に記載の導電性ペースト。2. The conductive paste according to claim 1, wherein the content of the metal powder in the conductive paste is 45% by weight to 90% by weight.
とする請求項１または２に記載の導電性ペースト。3. The conductive paste according to claim 1, wherein the metal powder is copper powder.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003000986A JP3928558B2 (en) | 2002-01-30 | 2003-01-07 | Conductive paste |
| CN 03103492 CN1224649C (en) | 2002-01-30 | 2003-01-29 | Conductive paste |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002022281 | 2002-01-30 | ||
| JP2002-22281 | 2002-01-30 | ||
| JP2003000986A JP3928558B2 (en) | 2002-01-30 | 2003-01-07 | Conductive paste |
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| Publication Number | Publication Date |
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| JP2003297148A true JP2003297148A (en) | 2003-10-17 |
| JP3928558B2 JP3928558B2 (en) | 2007-06-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2003000986A Expired - Lifetime JP3928558B2 (en) | 2002-01-30 | 2003-01-07 | Conductive paste |
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| JP (1) | JP3928558B2 (en) |
| CN (1) | CN1224649C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012174797A (en) * | 2011-02-18 | 2012-09-10 | Sumitomo Metal Mining Co Ltd | Conductive paste for photogravure used for multilayer ceramic capacitor internal electrode |
| JP2012231119A (en) * | 2011-04-13 | 2012-11-22 | Daicel Corp | Solvent or solvent composition for manufacturing multilayer ceramic component |
| JP2014216089A (en) * | 2013-04-23 | 2014-11-17 | 京都エレックス株式会社 | Thermosetting conductive paste composition |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4549655B2 (en) * | 2003-11-18 | 2010-09-22 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Functional paint |
| JP5600488B2 (en) * | 2009-08-04 | 2014-10-01 | 積水化学工業株式会社 | Inorganic fine particle dispersion paste |
| CN113964324B (en) * | 2021-10-27 | 2023-10-24 | 远景动力技术(江苏)有限公司 | Paste conductive agent and preparation method thereof, negative electrode slurry and preparation method thereof, negative electrode and lithium ion battery |
-
2003
- 2003-01-07 JP JP2003000986A patent/JP3928558B2/en not_active Expired - Lifetime
- 2003-01-29 CN CN 03103492 patent/CN1224649C/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012174797A (en) * | 2011-02-18 | 2012-09-10 | Sumitomo Metal Mining Co Ltd | Conductive paste for photogravure used for multilayer ceramic capacitor internal electrode |
| JP2012231119A (en) * | 2011-04-13 | 2012-11-22 | Daicel Corp | Solvent or solvent composition for manufacturing multilayer ceramic component |
| JP2014216089A (en) * | 2013-04-23 | 2014-11-17 | 京都エレックス株式会社 | Thermosetting conductive paste composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3928558B2 (en) | 2007-06-13 |
| CN1435452A (en) | 2003-08-13 |
| CN1224649C (en) | 2005-10-26 |
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