JP2014214036A - Method for forming through-hole through glass substrate by using laser - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method in which occurrence of cracks can be significantly suppressed when a through-hole is formed in a glass substrate using a laser.SOLUTION: A method for forming a through-hole in a glass substrate using a laser comprises (a) a step of installing resin films on a first surface and a second surface of a glass substrate respectively to form a workpiece, and (b) a step of radiating a first laser beam onto a first radiation area of the workpiece to form a through-hole through the glass substrate from the first surface to the second surface. In the method, the step of (b) comprises (c) a step of heating a second radiation area including the first radiation area of the workpiece to a temperature in a range of 100°C to 200°C by using local heating means before the first laser beam is radiated onto the first radiation area of the workpiece.

Description

  The present invention relates to a method for forming a through hole in a glass substrate using a laser.

  2. Description of the Related Art Conventionally, a technique for forming a through hole or the like in a glass substrate using a laser is known.

  For example, Non-Patent Document 1 describes a method of forming a through hole in a glass substrate using an excimer laser.

Nanosecond and femtosecond excimer laser ablation of fused silica Appl.Phys.A 54, 363 (1992)

  As described above, a technique for forming a through hole in a glass substrate using a laser is known. However, in the conventional method, when a through hole is formed in a glass substrate using a laser, there is often a problem that a crack or a crack occurs in the glass substrate.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a method capable of significantly suppressing the occurrence of cracks when forming a through hole in a glass substrate using a laser. And

In the present invention, a method of forming a through hole in a glass substrate using a laser,
(A) installing a resin film on each of the first surface and the second surface of the glass substrate to form a workpiece;
(B) irradiating the first irradiation region of the workpiece with a first laser beam to form a through-hole penetrating from the first surface to the second surface in the glass substrate;
Have
The step (b)
(C) a second irradiation region including the first irradiation region of the workpiece by using a local heating unit before irradiating the first irradiation region of the workpiece with the first laser beam; A step of heating to a temperature of 100 ° C. or higher and 200 ° C. or lower,
There is provided a method characterized by comprising:

  Here, the step of heating the second irradiation region including the first irradiation region of the workpiece to a temperature of 100 ° C. or more and 200 ° C. or less includes the step of heating the first irradiation region of the workpiece to the first irradiation region. One laser beam irradiation may be continued after completion.

Further, in the present invention, a method of forming a through hole in a glass substrate using a laser,
(A) installing a resin film on each of the first surface and the second surface of the glass substrate to form a workpiece;
(B) irradiating the first irradiation region of the workpiece with a first laser beam to form a through-hole penetrating from the first surface to the second surface in the glass substrate;
Have
The step (b)
(D) The first laser beam is irradiated onto the first irradiation region of the workpiece, or at the same time as the first laser beam is irradiated onto the first irradiation region of the workpiece. Until the hole is formed, using the local heating means, in the second irradiation area including the first irradiation area of the workpiece, other than the first irradiation area of the workpiece Heating the temperature of the second irradiation region to a temperature of 100 ° C. or higher and 200 ° C. or lower;
There is provided a method characterized by comprising:

  Here, the step of heating the second irradiation region including the first irradiation region of the workpiece to a temperature of 100 ° C. or more and 200 ° C. or less includes the step of heating the first irradiation region of the workpiece to the first irradiation region. One laser beam irradiation may be continued after completion.

  In the method according to the present invention, the first laser beam may have a pulse waveform.

  In the method according to the present invention, the local heating means may be a second laser source or an infrared lamp.

  In the method according to the present invention, the resin film may include polyethylene terephthalate or polyimide.

  In the present invention, when a through hole is formed in a glass substrate using a laser, it is possible to provide a method capable of significantly suppressing the occurrence of cracks.

It is the figure which showed schematic structure of the general apparatus used when forming a through-hole in a glass substrate using a laser. It is the figure which showed schematic structure of the apparatus which can be used for the method of forming a through-hole in a glass substrate using the laser by one Example of this invention. It is a schematic flowchart of the method (1st through-hole formation method) which forms a through-hole in a glass substrate using the laser by one Example of this invention. In the first through-hole forming method, first the output P ₁ of the laser source, shows an example of the relationship between the output P ₂ of the second laser source when the auxiliary heating treatment during the processing It is. In the first through-hole forming method, first the output P ₁ of the laser source, shows an example of the relationship between the output P ₂ of the second laser source when the auxiliary heating treatment during the processing It is. In the first through-hole forming method, first the output P ₁ of the laser source, shows an example of the relationship between the output P ₂ of the second laser source when the auxiliary heating treatment during the processing It is. In the first through-hole forming method, first the output P ₁ of the laser source, shows an example of the relationship between the output P ₂ of the second laser source when the auxiliary heating treatment during the processing It is. It is a schematic flowchart of another method (2nd through-hole formation method) which forms a through-hole in a glass substrate using the laser by one Example of this invention. In the second through-hole forming method, first the output P ₁ of the laser source, shows an example of the relationship between the output P ₂ of the second laser source when the auxiliary heating treatment during the processing It is. In the second through-hole forming method, first the output P ₁ of the laser source, shows an example of the relationship between the output P ₂ of the second laser source when the auxiliary heating treatment during the processing It is.

  Hereinafter, the present invention will be described with reference to the drawings.

  First, in order to better understand the configuration and features of the present invention, a conventional method for forming a through hole in a glass substrate using a laser will be briefly described with reference to FIG.

  FIG. 1 schematically shows a configuration of a general apparatus used when forming a through hole in a glass substrate using a laser.

  As shown in FIG. 1, the apparatus 100 includes a laser source 110 and a lens 120. The laser source 110 irradiates laser light 112 toward the lens 120. The laser beam 110 is converged by the lens 120 to generate a converged laser beam 114. The convergent laser beam 114 is applied to the irradiation region 140 of the workpiece 150.

  The workpiece 150 includes a glass substrate 160 and first and second resin films 170 and 175 disposed on both surfaces of the glass substrate. The first and second resin films 170 and 175 are used to prevent debris (processing waste) generated during laser processing of the glass substrate 160 from adhering to the surface of the glass substrate 160.

  When the focused laser beam 114 is applied to the irradiation area 140 of the workpiece 150, the temperature of the irradiation area 140 and the temperature immediately below the local area rapidly increase, and a substance (for example, the first resin film 170) existing in this area is rapidly increased. ) Is removed. Further, the heat of the convergent laser beam 114 is transmitted in the depth direction of the workpiece 150. Thereby, a series of regions existing in the depth direction (Z direction in FIG. 1) of the irradiation region 140 are sequentially removed from the first resin film 170 to the glass substrate 160 and the second resin film 175.

  As a result, the through hole 145 can be formed at a desired position on the glass substrate 160.

  Here, when the through-hole 145 is formed in the glass substrate 160 by such a conventional method, the problem that a crack and a crack generate | occur | produce in the vicinity of the through-hole 145 of the glass substrate 160 may arise often. Such cracks and cracks are considered to be generated as a result of a large thermal stress generated in the glass substrate 160 due to heat input from the convergent laser beam 114 to the workpiece 150 and heat dissipation from the workpiece 150.

In contrast, in the first invention of the present application,
A method of forming a through hole in a glass substrate using a laser,
(A) installing a resin film on each of the first surface and the second surface of the glass substrate to form a workpiece;
(B) irradiating the first irradiation region of the workpiece with a first laser beam to form a through-hole penetrating from the first surface to the second surface in the glass substrate;
Have
The step (b)
(C) a second irradiation region including the first irradiation region of the workpiece by using a local heating unit before irradiating the first irradiation region of the workpiece with the first laser beam; A step of heating to a temperature of 100 ° C. or higher and 200 ° C. or lower,
There is provided a method characterized by comprising:

In the second invention of the present application,
A method of forming a through hole in a glass substrate using a laser,
(A) installing a resin film on each of the first surface and the second surface of the glass substrate to form a workpiece;
(B) irradiating the first irradiation region of the workpiece with a first laser beam to form a through-hole penetrating from the first surface to the second surface in the glass substrate;
Have
The step (b)
(D) The first laser beam is irradiated onto the first irradiation region of the workpiece, or at the same time as the first laser beam is irradiated onto the first irradiation region of the workpiece. A step of heating the second irradiation region including the first irradiation region of the workpiece to a temperature of 100 ° C. or more and 200 ° C. or less using a local heating means until a hole is formed;
There is provided a method characterized by comprising:

  FIG. 2 schematically shows the configuration of an apparatus that can be used in carrying out the first invention and / or the second invention of the present application.

  As shown in FIG. 2, the apparatus 200 basically has the same configuration as the conventional apparatus 100 shown in FIG. Therefore, in the apparatus 200 shown in FIG. 2, the same reference numerals as those shown in FIG. 1 plus 100 are used for the same members as those of the conventional apparatus 100 shown in FIG. For example, the apparatus 200 includes a first laser source 210, a lens 220, and the like.

  However, as shown in FIG. 2, the apparatus 200 is different from the apparatus 100 shown in FIG. 1 in that the apparatus 200 has a heating means 230 different from the first laser source 210.

  If the heating means 230 is a means which can heat the to-be-processed body 250 locally, the kind in particular will not be restricted. The heating unit 230 may be, for example, a laser source different from the first laser source 210, an infrared lamp, or the like. The heating means 230 spots a wider region (second irradiation region) 248 than the irradiation region 240 (first irradiation region 240) by the first laser source 210 by the heat ray 232 (including laser light). Can be heated.

  When using such an apparatus 200 to form a structure such as a through hole 245 (including a through groove; the same applies hereinafter) in the glass substrate 260 of the workpiece 250, for example, the first laser source 210 is used. Before the focused laser beam 214 is irradiated onto the first irradiation region 240 of the workpiece 250 through the lens 220, the second irradiation region 248 of the workpiece 250 is heated by the heat rays 232 from the heating means 230. Heated (auxiliary heat treatment). By this auxiliary heat treatment, the temperature of the second irradiation region 248 rises in the range of 100 ° C. to 200 ° C.

  Next, the first laser beam 212 is emitted from the first laser source 210, and the first laser beam 212 passes through the lens 220 and becomes the converged laser beam 214. The convergent laser light 214 is irradiated to the first irradiation region 240 of the workpiece 250 (main processing).

  During the main processing, the second irradiation region 248 including the first irradiation region 240 of the workpiece 250 has already been heated and the temperature has increased. Therefore, in this state, when the convergent laser beam 114 is irradiated to the first illumination region 240 that is narrower than the second illumination region 248, it is abrupt due to heat input to the workpiece 250 due to the irradiation of the convergent laser beam 214. Temperature rise can be significantly reduced. In particular, when the auxiliary heating process by the heating unit 230 is continued until the main processing process is completed, a sudden temperature drop due to heat radiation from the workpiece 250 when the irradiation of the convergent laser beam 214 is stopped is also significantly mitigated. it can.

  For this reason, in such a method, it becomes possible to relieve | moderate the thermal stress which may arise in the glass substrate 260 significantly. Thereby, the problem that a crack and a crack generate | occur | produce in the vicinity of the through-hole 245 of the glass substrate 260 after a process can be suppressed significantly.

  Alternatively, for example, the first irradiation region 240 of the workpiece 250 is irradiated with the focused laser beam 214 or after the first irradiation region 240 of the workpiece 250 is irradiated with the focused laser beam 214. The second irradiation region 248 of the workpiece 250 may be heated to 100 ° C. to 200 ° C. by auxiliary heating treatment, that is, by the heat ray 232 from the heating means 230. Also in this case, the effects as described above can be obtained.

  For example, when the auxiliary heating process and the main processing process are started at the same time and the auxiliary heating process is continued after the completion of the main processing process, a rapid temperature decrease due to heat dissipation from the workpiece 250 can be significantly reduced. The same applies to the case where the auxiliary heat treatment is started during the continuation of the main processing and the auxiliary heat processing is continued after the completion of the main processing.

  As described above, according to the first and second inventions of the present application, the object to be processed due to the rapid temperature rise of the object 250 by the main processing using the convergent laser beam 214 and / or the irradiation of the convergent laser beam 214 is stopped. 250 rapid temperature drops can be significantly mitigated. Therefore, in the 1st invention and the 2nd invention of this application, the problem that a crack and a crack generate | occur | produce in the vicinity of the through-hole 245 of the glass substrate 260 can be suppressed significantly after a process.

  In the first invention of the present application, the temperature of the second irradiation region 248 of the workpiece 250 refers to the temperature of the workpiece before the first irradiation region 240 is irradiated with the first laser light. It means the temperature of the second irradiation region 248 including one irradiation region. On the other hand, in the second invention of the present application, the temperature of the second irradiation region 248 of the workpiece 250 means the temperature of the second irradiation region 248 other than the first irradiation region 240 of the workpiece 250.

(About the through-hole formation method by one Example of this invention)
Next, a method for forming a through hole in a glass substrate according to an embodiment of the present invention (hereinafter, referred to as “first through hole forming method”) will be described with reference to FIG.

  In FIG. 3, the flow of the 1st through-hole formation method is shown typically.

As shown in FIG. 3, the first through hole forming method is:
(A) installing a resin film on each of the first surface and the second surface of the glass substrate to form a workpiece (step S110);
(B) irradiating the first irradiation region of the workpiece with a first laser beam to form a through-hole penetrating from the first surface to the second surface in the glass substrate; Before irradiating the first irradiation region of the workpiece with the first laser beam, the second irradiation region including the first irradiation region of the workpiece using the local heating means, A step (step S120) including a step of heating to a temperature of 100 ° C. or higher and 200 ° C. or lower;
Have

  Hereinafter, each step will be described in detail. In the following description, for the sake of clarity, reference numerals shown in FIG. 2 will be used when representing each member. Further, in the following description, as an example, each step when the second laser source 230 is used as the heating unit 230 will be described. However, it will be apparent to those skilled in the art that the following description can be similarly applied to the case where the heating unit 230 other than the second laser source is used.

(Step S110)
First, a glass substrate 260 for processing through holes and two resin films 270 and 275 are prepared.

  The glass substrate 260 has a first surface 262 and a second surface 264. A first resin film 270 is installed on the first surface 262 of the glass substrate 260, and a second resin film 275 is installed on the second surface 264 of the glass substrate 260, whereby the workpiece is processed. 250 is configured.

  The composition of the glass substrate 260 is not particularly limited. The glass substrate may be, for example, soda lime glass, borosilicate glass, silica glass, and alkali-free glass. Further, the dimensions of the glass substrate 260 are not particularly limited. For example, the thickness of the glass substrate 260 may be in a range of 0.05 mm to 0.7 mm, for example.

  Similarly, the types and dimensions of the first and second resin films 270 and 275 are not particularly limited. The first and second resin films 270 and 275 may be, for example, polyethylene terephthalate (PET) or polyimide. In addition, the heat-resistant temperature of PET is about 120 degreeC. Moreover, the heat-resistant temperature of a polyimide is about 200 degreeC. The thicknesses of the first and second resin films 270 and 275 are, for example, in the range of 0.005 mm to 0.2 mm.

  Note that the types and thicknesses of the first and second resin films 270 and 275 may be the same or different.

(Step S120)
Next, the to-be-processed body 250 comprised by step S110 is installed in the apparatus 200 as shown, for example in FIG.

  Next, an auxiliary heating process is performed on the workpiece 250. That is, the second irradiation region 248 of the workpiece 250 is heated by the second laser light 232 from the second laser source 230. By this auxiliary heat treatment, the temperature of the second irradiation region 248 rises to 100 ° C. to 200 ° C.

  Note that, from the viewpoint of thermal stress relaxation in the main processing performed thereafter, the temperature of the second irradiation region 248 heated by the auxiliary heat treatment is preferably higher. However, when the temperature of the second irradiation region 248 exceeds 200 ° C., there is a problem that the resin films 270 and 275 are thermally decomposed even when a heat resistant resin (polyimide) is used as the material of the resin films 270 and 275. Arise. Further, if the temperature of the second irradiation region 248 is less than 100 ° C., the effect of the auxiliary heat treatment is not recognized so much. For this reason, the temperature of the 2nd irradiation area | region 248 shall be the range of 100 to 200 degreeC.

In addition, the area S2 of the _second irradiation region 248 is not particularly limited. However, if the auxiliary heating process is performed on the workpiece 250 over an excessively wide range, the workpiece 250 may be warped. is there. Therefore, the area _{S 2} of the second irradiation region 248, for ^example, is preferably in the range of 1 mm 2 to 10 mm ^2.

  Next, the main processing is performed while continuing the auxiliary heat treatment or immediately after stopping the auxiliary heat treatment. That is, the first laser beam 212 is emitted from the first laser source 210. The first laser beam 212 passes through the lens 220 and becomes the converged laser beam 214. Further, the convergent laser beam 214 is irradiated to the first irradiation region 240 of the workpiece 250.

  The first laser light emitted from the first laser source 210 may have a pulse waveform.

  By this processing, the temperature of the first irradiation region 240 of the workpiece 250 is increased, and the first irradiation region 240 and the material existing therebelow, that is, the first resin film 170 and the glass substrate. 160 and the second resin film 175 are sequentially removed.

  As a result, a through hole 245 is formed at a desired position on the glass substrate 260. Note that the first and second resin films 270 and 275 may be finally peeled off.

  As described above, in the main processing, the second irradiation region 248 of the workpiece 250 is already heated and the temperature is increased by the auxiliary heating processing. Therefore, in this state, when the convergent laser beam 114 is irradiated to the first illumination region 240 that is narrower than the second illumination region 248, it is abrupt due to heat input to the workpiece 250 due to the irradiation of the convergent laser beam 214. Temperature rise can be significantly reduced.

  As a result, it is possible to significantly suppress the problem that cracks or cracks occur in the vicinity of the through hole 245 of the glass substrate 260 after processing.

Here, referring to FIG. 4 to FIG. 7, in such a first through hole forming method, the output P ₁ of the first laser source 210 in the main processing and the _first in the auxiliary heating process. An example of the relationship with the output P ₂ of the _second laser source 230 will be described.

In the following description, first laser beam 212 (more convergent laser beam 214), the pulse wave (the maximum value output between the time t ₁ of t ₂ which is irradiated from the first laser source 210 P _1max ). Further, it is assumed that the second laser light 232 irradiated from the second laser source 230 is a rectangular continuous wave having a maximum value _P2max .

The 4-7, the output P ₂ of the second laser source 230 when the auxiliary heating, the first timing chart obtained by superimposing the output P ₁ of the laser source 210 at the time of the processing Shown schematically.

The timing chart shown in FIG. 4 corresponds to a timing chart in the case where the auxiliary heating process is started from time 0 and the auxiliary heating process is stopped immediately before the main processing process. That is, in this example, auxiliary heating treatment using a second laser source 230 is continues for a time 0 to t _1, is interrupted at time t _1. On the other hand, the processing according to the first laser source 210 is carried between the time _{t 1} of _{t 2.}

  When the auxiliary heating process and the main processing process are performed at such timing, a rapid temperature increase due to heat input to the workpiece 250 due to irradiation of the convergent laser light 214 can be significantly reduced.

Next, the timing chart shown in FIG. 5 corresponds to a timing chart in the case where the auxiliary heating process is started from time 0 and the auxiliary heating process is stopped during the main processing. That is, in this example, auxiliary heating treatment using a second laser source 230 is continues for a time _{0~t 3 (t 3 <t 2} ), is interrupted at time _{t 3.} On the other hand, the processing according to the first laser source 210 is carried between the time _{t 1} of _{t 2.}

  Even when the auxiliary heating process and the main processing process are performed at such timing, the rapid temperature increase due to heat input to the workpiece 250 due to the irradiation of the convergent laser light 214 can be significantly reduced.

Next, the timing chart shown in FIG. 6 corresponds to a timing chart in the case where the auxiliary heating process is started from time 0 and the auxiliary heating process is stopped simultaneously with the completion of the main processing. That is, in this example, auxiliary heating treatment using a second laser source 230 is continues for a time 0 to t _2, is interrupted at time t _2. On the other hand, the processing according to the first laser source 210 is carried between the time _{t 1} of _{t 2.}

  Even when the auxiliary heating process and the main processing process are performed at such timing, the rapid temperature increase due to heat input to the workpiece 250 due to the irradiation of the convergent laser light 214 can be significantly reduced.

Next, the timing chart shown in FIG. 7 corresponds to a timing chart in the case where the auxiliary heating process is started from time 0 and the auxiliary heating process is continued even after the completion of the main processing. That is, in this example, auxiliary heating treatment using a second laser source 230 is continued for a time _{0~t 3 (t 3> t 2} ), is interrupted at time _{t 3.} On the other hand, the processing according to the first laser source 210 is carried between the time _{t 1} of _{t 2.}

  When the auxiliary heating process and the main processing process are performed at such timing, the irradiation of the convergent laser beam 214 is stopped in addition to the rapid temperature increase caused by the heat input to the workpiece 250 by the irradiation of the convergent laser beam 214. An abrupt temperature decrease due to heat dissipation from the workpiece 250 at the time can be significantly mitigated.

  Therefore, it is possible to further suppress the possibility of occurrence of cracks or cracks in the vicinity of the through holes 245 of the glass substrate 260 after processing.

(About another through-hole formation method by one Example of this invention)
Next, another method for forming a through hole in a glass substrate according to an embodiment of the present invention (hereinafter referred to as “second through hole forming method”) will be described with reference to FIG.

  In FIG. 8, the flow of the 2nd through-hole formation method is shown typically.

As shown in FIG. 8, the second through hole forming method is:
(A) installing a resin film on each of the first surface and the second surface of the glass substrate to form a workpiece (step S210);
(B) irradiating the first irradiation region of the workpiece with a first laser beam to form a through-hole penetrating from the first surface to the second surface in the glass substrate; A through-hole is formed at the same time when the first laser beam is irradiated onto the first irradiation region of the workpiece, or after the first laser beam is irradiated onto the first irradiation region of the workpiece. In the meantime, a step of heating the second irradiation region including the first irradiation region of the workpiece to a temperature of 100 ° C. or higher and 200 ° C. or lower using local heating means (step S220). When,
Have

  Here, step S210 is the same as step S110 in the first through hole forming method described above. Further, in step S220, a part of the aspect described in step S120 in the first through hole forming method described above can be used.

  Therefore, here, a part of Step S220 of the second through-hole forming method that is greatly different from Step S120 in the above-described first through-hole forming method will be described in detail. In the following description, for the sake of clarity, the reference numerals shown in FIG.

(Step S220)
After step S210, the workpiece 250 is placed in the apparatus 200 as shown in FIG. 2, for example.

  Next, the main processing is performed on the workpiece 250. That is, the first laser beam 212 is emitted from the first laser source 210. The first laser beam 212 passes through the lens 220 and becomes the converged laser beam 214. Further, the convergent laser beam 214 is irradiated to the first irradiation region 240 of the workpiece 250.

  Thereby, a through hole 245 is formed at a desired position of the glass substrate 260. Thereafter, the first and second resin films 270 and 275 are peeled and removed.

  Here, in the second through hole forming method, the auxiliary heating process is started simultaneously with the main processing or during the main processing. That is, simultaneously with the irradiation of the convergent laser beam 214 onto the first irradiation region 240 of the workpiece 250, the second region 248 of the workpiece 250 is caused by the second laser beam 232 from the second laser source 230. Heated. Alternatively, the second region 248 of the workpiece 250 is caused to be irradiated by the second laser beam 232 from the second laser source 230 while the first irradiation region 240 of the workpiece 250 is irradiated with the focused laser beam 214. Heated.

  By this auxiliary heat treatment, the temperature of the second region 248 rises to 100 ° C. to 200 ° C.

As described above, the area of the second region 248 is not particularly limited, for ^example, is preferably in the range of 1 mm 2 to 10 mm ^2.

  In the second through hole forming method, the second irradiation region 248 of the workpiece 250 is not yet sufficiently heated at the start of the main processing. However, at the end of the main processing, the second irradiation region 248 of the workpiece 250 is heated by the auxiliary heating processing, and the temperature rises to 100 ° C. to 200 ° C.

  Therefore, in this second through-hole forming method, a rapid temperature decrease due to heat radiation from the workpiece 250 when irradiation of the convergent laser beam 214 is stopped can be significantly mitigated. This also makes it possible to significantly suppress the problem of cracks and cracks occurring in the vicinity of the through holes 245 of the glass substrate 260 after processing.

Next, referring to FIGS. 9 to 10, the output P ₁ of the first laser source 210 at the time of the main processing in the second through-hole forming method and the first at the time of the auxiliary heating process are described. An example of the relationship with the output P ₂ of the _second laser source 230 will be described.

In this case as well, the first laser beam 212 (and the convergent laser beam 214) emitted from the first laser source 210 is a pulse wave (maximum value P _1max) output between times t ₁ and t _2. ). Further, it is assumed that the second laser light 232 irradiated from the second laser source 230 is a rectangular continuous wave having a maximum value _P2max .

  9 to 10 schematically show timing charts in which the output of the second laser source 230 during the auxiliary heating process and the output of the first laser source 210 during the main processing are overlaid. .

The timing chart shown in FIG. 9 is a timing chart in the case where the auxiliary heating process is started substantially at the same time as time t ₁ , that is, the start of the main process, and the auxiliary heat process is continued even after the main process is completed. Equivalent to.

  When the auxiliary heat treatment and the main processing are performed at such timing, the rapid temperature decrease due to the heat radiation from the workpiece 250 when the irradiation of the focused laser beam 214 is stopped is significantly reduced. it can.

Next, the timing chart shown in FIG. 10, middle stage of the processing, namely to start the auxiliary heating treatment from the time _{t 3 (t 3 <t 2} ), after completion of the processing _{(t 2),} This corresponds to a timing chart when the auxiliary heating process is continued.

  Even when the auxiliary heat treatment and the main processing are performed at such timing, the rapid temperature drop due to the heat radiation from the workpiece 250 when the main processing, that is, the irradiation of the convergent laser beam 214 is stopped, is significantly increased. Can be relaxed.

  Here, the type of the first laser source 210 used in the first and second through-hole forming methods is not particularly limited. Similarly, the type of the second laser source 230 is not particularly limited. The first laser source 210 and / or the second laser source 230 are, for example, an excimer laser source (XeCl: wavelength 308 nm, KrF: wavelength 248 nm, ArF: wavelength 193 nm), a YAG laser source (wavelength 1064 nm), a YVO4 laser source. (Wavelength 1064 nm), titanium sapphire laser source (wavelength 800 nm), carbon dioxide laser source (wavelength 9.3 μm, 9.6 μm, 10.6 μm) or the like may be used.

Further, the area S ₁ of the first irradiation region 240 irradiated with the convergent laser light 214 is not particularly limited. S ₁ may be, for example, in the range of 0.0001 mm ² ~ 1 mm ^2. The ratio of the area _{S 2} of the area _{S 1} of the first irradiation region 240 second irradiation region 248 _(S 1: _{S 2)} is, for example, 1: 10-1: may be in the range of 10000 . In particular, S ₁ : S ₂ is preferably in the range of 1: 100 to 1: 1000.

  The characteristics of the embodiment of the present invention have been described above based on the first through hole forming method and the second through hole forming method. However, it will be apparent to those skilled in the art that the first through-hole forming method and the second through-hole forming method are merely examples, and the present invention is not limited to these embodiments.

  For example, in the above-described embodiment, the characteristics of the method according to the present invention have been described by taking as an example a technique for forming a through hole in a glass substrate by laser light irradiation. However, the present invention may be applied to a technique for forming a through-hole in an object to be processed by combining laser light irradiation and an interelectrode discharge phenomenon, that is, a so-called laser induction type electric discharge machining technique.

  The present invention can be applied to a laser processing method of a glass substrate.

DESCRIPTION OF SYMBOLS 100 Apparatus 110 Laser source 112 Laser beam 114 Convergent laser beam 120 Lens 140 Irradiation area 145 Through-hole 150 Work piece 160 Glass substrate 170 1st resin film 175 2nd resin film 200 Apparatus 210 1st laser source 212 1st Laser beam 214 converged laser beam 220 lens 230 heating means (second laser source)
232 heat ray (second laser beam)
240 1st irradiation area | region 245 Through-hole 248 2nd irradiation area | region 250 Workpiece 260 Glass substrate 262 1st surface 264 2nd surface 270 1st resin film 275 2nd resin film

Claims (7)

A method of forming a through hole in a glass substrate using a laser,
(A) installing a resin film on each of the first surface and the second surface of the glass substrate to form a workpiece;
(B) irradiating the first irradiation region of the workpiece with a first laser beam to form a through-hole penetrating from the first surface to the second surface in the glass substrate;
Have
The step (b)
(C) a second irradiation region including the first irradiation region of the workpiece by using a local heating unit before irradiating the first irradiation region of the workpiece with the first laser beam; A step of heating to a temperature of 100 ° C. or higher and 200 ° C. or lower,
A method characterized by comprising:   The step of heating the second irradiation region including the first irradiation region of the workpiece to a temperature of 100 ° C. or more and 200 ° C. or less includes a first laser to the first irradiation region of the workpiece. The method of claim 1, wherein the light irradiation is continued after completion. A method of forming a through hole in a glass substrate using a laser,
(A) installing a resin film on each of the first surface and the second surface of the glass substrate to form a workpiece;
(B) irradiating the first irradiation region of the workpiece with a first laser beam to form a through-hole penetrating from the first surface to the second surface in the glass substrate;
Have
The step (b)
(D) The first laser beam is irradiated onto the first irradiation region of the workpiece, or at the same time as the first laser beam is irradiated onto the first irradiation region of the workpiece. Until the hole is formed, using the local heating means, in the second irradiation area including the first irradiation area of the workpiece, other than the first irradiation area of the workpiece Heating the temperature of the second irradiation region to a temperature of 100 ° C. or higher and 200 ° C. or lower;
A method characterized by comprising:   The step of heating the second irradiation region including the first irradiation region of the workpiece to a temperature of 100 ° C. or more and 200 ° C. or less includes a first laser to the first irradiation region of the workpiece. The method according to claim 3, wherein the light irradiation is continued after completion.   The method according to claim 1, wherein the first laser beam has a pulse waveform.   The method according to any one of claims 1 to 5, wherein the local heating means is a second laser source or an infrared lamp.   The method according to claim 1, wherein the resin film includes polyethylene terephthalate or polyimide.

Images