JP2014202812A - Electronic device and imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imaging apparatus having a space-saving connection terminal receiving structure, while improving connection reliability of a connection terminal.SOLUTION: A connection terminal unit 300 includes first to fifth connection terminals 107A to 107E, a substrate 420 on which the first to fifth connection terminal 107A to 107E are mounted, a mold component 410 holding the substrate 420 and including a connection terminal receiving part 410A which is close to at least three surfaces of the substrate 420 on which the first to fifth connection terminals 107A to 107E are disposed, and a metal component 430 which is fixed to the mold component 410 and is conductive to the substrate 420. The connection terminal unit 300 is structured so that a surface of the substrate 420 on which the first to fifth connection terminals 107A to 107E are mounted is disposed on the side of the mold component 410.

Description

  The present invention relates to an electronic apparatus and an imaging apparatus having a connection terminal such as a jack for connecting to an external apparatus.

  2. Description of the Related Art In recent years, imaging devices such as digital video and digital cameras have become more multifunctional with various functions, and accordingly, it is indispensable to mount connection terminals for connecting to external devices. As a holding structure of the connection terminal in the main body (housing) of the imaging apparatus, the structure shown in FIG. 8 is known (see Patent Document 1).

  FIG. 8A is an external view of a conventional imaging device 800 equipped with connection terminals 810a and 810b for connecting to external devices, and FIG. 8B crosses the connection terminal 810a of the imaging device 800. It is sectional drawing. The imaging apparatus 800 includes two connection terminals 810a and 810b that are exposed to the exterior member 820 of the main body. A connection terminal receiving portion 830 is disposed inside the main body, and a gap L is provided between the connection terminal 810a and the connection terminal receiving portion 830. Note that the connection terminal 810 a is mounted on the substrate 840, and the substrate 840 is fixed to the exterior member 820 via the sheet metal 850.

  The reason why the gap L is generated is that the gap factors A1 to A6 shown in FIG. The clearance factor A1 is a mounting float when the connection terminal 810a is mounted. The gap factor A2 is the outer tolerance of the connection terminal 810a. The clearance factor A3 is a forming tolerance of the connection terminal receiving portion 830. The gap factor A4 is a substrate thickness tolerance. The clearance factor A5 is a thickness tolerance of the attachment part. The clearance factor A6 is a mounting positioning tolerance of the receiving portion (connection terminal receiving portion 830) of the connection terminal 810a.

  If the gap L is not set in consideration of these gap factors A1 to A6, the connection terminal receiving portion 830 and the connection terminal 810a interfere with each other, and the connection terminal 810a collides with the connection terminal receiving portion 830 during assembly. There is a risk of damage.

JP 2001-338714 A

  However, when the gap L is provided between the connection terminal 810a and the connection terminal receiving portion 830 as in the conventional technique, there are the following problems. That is, when a tensile force is applied to the connection plug with a force larger than usual with the connection plug attached to the connection terminal 810a, the connection terminal 810a is twisted and the connection terminal 810a moves by the gap L. Thereby, there is a possibility that the solder fixing the connection terminal 810a may be peeled off, and it is difficult to say that the connection reliability is high.

  Further, in recent years, there has been a demand for downsizing of the image pickup apparatus main body, and a structure for achieving space saving is also required in the receiving structure of the connection terminal 810a, and the gap L can be designed to be extremely narrow. It is desirable to do.

  An object of the present invention is to provide an electronic apparatus and an imaging apparatus having a space-saving connection terminal receiving structure while improving connection reliability of the connection terminals.

  An electronic apparatus according to the present invention includes a plurality of connection terminals, a substrate on which the connection terminals are mounted, and a connection terminal that holds the substrate and is close to at least three surfaces on which the plurality of connection terminals are arranged. A base member having a receiving part; and a metal part fixed to the base member and electrically connected to the substrate, wherein a surface of the substrate on which the connection terminal is mounted is disposed on the base member side. Features.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic device and imaging device which have a space-saving connection terminal receiving structure can be provided, improving the connection reliability of a connection terminal.

It is a block diagram which shows the internal structure of the electronic device (imaging device) which concerns on embodiment of this invention. FIG. 2 is an external perspective view of the electronic apparatus (imaging device) in FIG. 1. FIG. 2 is an exploded perspective view of a part of the electronic apparatus (imaging device) in FIG. 1. FIG. 2 is a development view of a connection terminal unit included in the electronic apparatus (imaging device) of FIG. 1. FIG. 5 is an assembled perspective view of the connection terminal unit of FIG. 4. FIG. 5 is an enlarged perspective view of a connection terminal receiving portion of a molded part that constitutes the connection terminal unit of FIG. 4. It is sectional drawing of the connecting terminal unit of FIG. FIG. 6 is an external perspective view of a conventional imaging device equipped with a connection terminal for connecting to an external device, and a cross-sectional view across the connection terminal.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing an internal configuration of an imaging apparatus 100 as an electronic apparatus according to an embodiment of the present invention. The imaging apparatus 100 includes a lens 101, an imaging element 102, a camera signal processing unit 103, a monitor 104, a storage device 105, a power supply circuit 106, a connection terminal 107, a control microcomputer 108, an operation key 109, and an image conversion circuit 110.

  In the imaging apparatus 100, the reflected light from the subject that has passed through the lens 101 forms an image on the imaging element 102 such as a CMOS sensor. The formed optical image is converted into an electrical signal by the image sensor 102 and is digitally processed by the camera signal processing unit 103 to generate image (video) data. The image (video) data is stored in the storage device 105, and the image (video) is displayed on the monitor 104. The photographer operates the operation key 109 while confirming the image (video) displayed on the monitor 104. An input signal from the operation key 109 is broken down into a command indicating a specific processing content by the control microcomputer 108 and then supplied to each unit constituting the imaging apparatus 100.

  The image (video) data is converted into a predetermined format by the image conversion circuit 110 and transmitted to an external device such as an external monitor or an external storage device through the connection terminal 107. Note that the connection terminals 107 illustrated in FIG. 1 are specifically the first connection terminal 107A and the fourth connection terminal 107D illustrated in FIG.

  FIG. 2 is an external perspective view of the imaging apparatus 100 shown in FIG. The imaging apparatus 100 includes five connection terminals exposed to the outside, that is, a first connection terminal 107A, a second connection terminal 107B, a third connection terminal 107C, a fourth connection terminal 107D, and a fifth connection terminal 107E.

  The first connection terminal 107A is a digital output terminal for video and audio in the camera mode and the playback mode, and is, for example, an HDMI (registered trademark) terminal. The second connection terminal 107B is an audio analog input terminal in the camera mode, and is, for example, an MIC terminal. The third connection terminal 107C is an audio analog output terminal in the playback mode, and is, for example, a headphone terminal. The fourth connection terminal 107D is a digital output terminal for video and audio in the playback mode, for example, a USB terminal. The fifth connection terminal 107E is a camera control terminal in the camera mode, for example, a rank remote control terminal.

  FIG. 3 is an exploded perspective view of a part of the imaging apparatus 100 and shows the exterior component 120 and the connection terminal unit 300 on which the first connection terminal 107A to the fifth connection terminal 107E are mounted. The connection terminal unit 300 is fixed to the exterior component 120 with screws. As described above, in the imaging apparatus 100, a plurality of various connection terminals (the first connection terminal 107A to the fifth connection terminal 107E) are concentrated in one place (unitized), thereby reducing the size of the imaging apparatus main body. doing. Note that the types and number of connection terminals that can be mounted on the imaging apparatus 100 are not limited to those described above.

  FIG. 4 is a development view of the connection terminal unit 300. The connection terminal unit 300 includes a substrate 420 on which the first connection terminals 107A to 107E are mounted, a mold component 410 as a base member that holds the substrate 420, and a metal component 430 that is fixed to the mold component 410. Have. The connection terminal receiving portion 410A shown in FIG. 4 will be described later with reference to FIG. 6, and the metal component 430 will be described later with reference to FIG.

  The substrate 420 is composed of a plurality of substrate portions, and at least one of the first connection terminals 107A to 107E is mounted on each substrate portion. The mold part 410 has a substantially rectangular parallelepiped shape. The first connection terminal 107A and the fourth connection terminal 107D having a wide outer shape are arranged on the long side of the mold part 410, and the outer width of the mold part 410 is narrow on the short side. A second connection terminal 107B and a third connection terminal 107C are arranged. Accordingly, a plurality of connection terminals can be arranged on each of the short side and the long side of the mold part 410, and the mold part 410 can be downsized to reduce the size of the image pickup apparatus body while having many connection terminals. it can.

  FIG. 5 is an assembly perspective view of the connection terminal unit 300. The connection terminal unit 300 is fixed to the mold component 410 and includes a metal component 430 for ensuring electrical connection between the substrate 420 and a substrate (not shown). The substrate 420 is fixed to the mold part 410 by the fastening part 440 through the metal part 430.

  Here, the surface of the substrate 420 on which the first connection terminal 107 </ b> A is mounted is in contact with the mold component 410. As described with reference to FIG. 4, the substrate 420 includes a plurality of substrate portions, and as shown in FIG. 5, each substrate portion has a plurality of directions (an arrow A direction, an arrow B direction, and an arrow C). Direction) to the mold part 410 by the fastening portion 440. Then, the metal component 430 for conducting the substrate portions of the substrate 420 is fastened together with the substrate 420 to the mold component 410 by the fastening portion 440. At this time, since the metal component 430 is also disposed on the surface 410B of the mold component 410 where the substrate 420 is not fastened, the metal component 430 saves space between the substrate 420 and a substrate (not shown). Can be secured.

  FIG. 6 is an enlarged perspective view of the connection terminal receiving portion 410A of the molded component 410 constituting the connection terminal unit 300. FIG. The connection terminal receiving portion 410A provided in the mold component 410 is formed of ribs that are close to at least three surfaces on which the first connection terminal 107A to the fifth connection terminal 107E are arranged. The connection terminal receiving portion 410A moves when the first connection terminal 107A is twisted when the connection plug is attached to the first connection terminal 107A and a tensile force larger than usual is applied to the connection plug. It plays a role of preventing the connection reliability from being impaired by the solder peeling of the terminal 107A. This point will be described below with reference to FIG.

  FIG. 7 is a cross-sectional view of the connection terminal unit 300. A gap S is provided between the first connection terminal 107A and the connection terminal receiving portion 410A. The gap S is provided in order to prevent interference with the connection terminal receiving portion 410A due to variations in the external dimensions of the first connection terminal 107A and to improve assembly.

  Here, as described above, in the present embodiment, the surface of the substrate 420 on which the first connection terminal 107A is mounted is in contact with the mold component 410. Therefore, the items to be considered when setting the gap S in the connection terminal unit 300 are the three points of the gap factors B1, B2, and B3 shown in FIG. 7, and the gap factor B1 mounts the first connection terminal 107A. It is a floating implementation. The clearance factor B2 is the outer tolerance of the first connection terminal 107A, and the clearance factor B3 is the molding tolerance of the connection terminal receiving portion 410A.

  Therefore, in the conventional structure described with reference to FIG. 8, the items to be considered when setting the gap L are the six points of the gap factors A1 to A6, whereas in this embodiment, the gap S is set. There are three items to be taken into consideration when performing the gap factors B1 to B3. As described above, since the gap factor to be considered when setting the gap S is halved compared to the conventional case, the gap S can also be substantially halved. Thereby, the movement amount of the first connection terminal 107A is regulated. Therefore, the risk of the solder peeling of the first connection terminal 107A can be reduced, and the connection reliability can be improved. In addition, since the gap S is halved compared to the conventional case, that is, the receiving structure of the connection terminal is saved, it is possible to reduce the size of the imaging apparatus main body.

  Although the present invention has been described in detail based on preferred embodiments thereof, the present invention is not limited to these specific embodiments, and various forms within the scope of the present invention are also included in the present invention. included.

  For example, in the above-described embodiment, the structure in which the surface on which the first connection terminal 107A is mounted on the substrate 420 is in contact with the mold component 410 is taken up, but the present invention is not limited to such a structure. For example, even if the surface on which the first connection terminal 107A is mounted is arranged on the mold component 410 side via another component such as a metal component, only the thickness tolerance of the intervening component is added as a gap factor. It is. Therefore, in this case as well, the gap S can be set with fewer gap factors than in the past, thereby improving the connection reliability and reducing the size of the imaging apparatus main body.

107A to 107E First connection terminal to fifth connection terminal 300 Connection terminal unit 410 Mold component (base member)
410A Connection terminal receiving part 420 Substrate 430 Metal part 440 Fastening part

Claims (5)

Multiple connection terminals;
A substrate on which the connection terminal is mounted;
A base member that holds the substrate and has a connection terminal receiving portion adjacent to at least three surfaces on which the plurality of connection terminals are arranged on the substrate;
A metal part fixed to the base member and electrically connected to the substrate;
An electronic apparatus, wherein a surface of the substrate on which the connection terminal is mounted is disposed on the base member side. The substrate is composed of a plurality of substrate portions, and at least one of the plurality of connection terminals is arranged on each substrate portion,
The electronic device according to claim 1, wherein the substrate is fastened to the base member from a plurality of directions.   The electronic device according to claim 1, wherein the metal component is disposed on a surface of the base member where the substrate is not fastened.   The base member is formed in a substantially rectangular parallelepiped. Among the plurality of connection terminals, a connection terminal having a wide outer shape is arranged on the long side of the base member, and a connection terminal having a narrow outer shape is arranged on the short side. The electronic device according to claim 1, wherein the electronic device is provided. An imaging apparatus comprising the electronic device according to claim 1.