JP2014197504A - Electric component socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a durability-improved electric component socket capable of keeping secure connection with an electric component even after repeated use.SOLUTION: An electric component socket 10 comprises: a socket body 20 disposed on a wiring board 1 and in which an electric component 2 is accommodated on a top face 21; an outside member 30 disposed on the wiring board and disposed outside of the socket body; and a flexible substrate 50 electrically connecting the electric component accommodated on the top face of the socket body and the wiring board at a lower side of the outside member. The flexible substrate is folded in an end portion of the top face of the socket body, extends downwards between the socket body and the outside member along an outer side surface 22 of the socket body, is folded again towards the outside on the wiring board so as to reach the wiring board at the lower side of the outside member, and affixed as a whole over a top face of the socket body, a corner 24 between the top face and the outer side surface, and the outer side surface.

Description

  The present invention relates to an electrical component socket that is electrically connected to an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”).

  Conventionally, as this type of electrical component socket, an IC socket having a structure in which a thin sheet-like tab film is disposed on a base plate and an IC package is placed on the tab film is known (for example, patents). Reference 1).

  The tab film of such an IC socket has, for example, an IC package electrode on the center side of the surface thereof, and the IC package electrode pattern is configured to be bonded to an array of terminals of the IC package. Yes. In addition, a wiring board electrode is provided on the peripheral edge side of the back surface of the tab film, and this wiring board electrode is connected to the above-mentioned IC package electrode by a conductive wire and bonded to a contact pin connected to the wiring board. Is configured to do.

Japanese Patent Laid-Open No. 2003-168531

  In recent years, an IC socket using a flexible substrate (FPC) that is sheet-like and can be bent or curved has been proposed in contrast to an IC socket using such a sheet-like tab film.

  The IC socket using the flexible substrate includes, for example, an IC package electrode to be joined to a terminal of the IC package on the central portion side of the surface of the flexible substrate, and the central portion side is provided on the upper surface of the socket body of the IC socket. Be placed. Further, an intermediate portion from the central portion side to the peripheral portion of the flexible board is bent along the side surface of the socket body so as to reach the lower outside of the socket body. Further, the peripheral edge portion is extended outward from the lower end of the intermediate portion of the flexible substrate, and the wiring board electrode provided on the lower surface side of the peripheral edge portion and connected to the IC package electrode is disposed below the socket body. It is connected to the wiring board.

  Thus, by using a flexible substrate for the IC socket, the pitch between the terminals of the IC package can be easily and surely expanded with the IC socket, and can be electrically connected to the wiring substrates at different horizontal positions.

  However, in such an IC socket, when the IC package is repeatedly put on and taken out from the flexible substrate arranged in the socket body, the stress concentrates on the bent portion of the flexible substrate, and the flexible substrate There has been a problem of slipping or bending. As a result, there is a risk that the connection between the IC socket and the IC package is deteriorated and the IC socket cannot be used.

  Therefore, an object of the present invention is to provide a highly durable electrical component socket that can maintain a reliable connection with electrical components even after repeated use.

  In order to achieve such an object, the invention according to claim 1 is arranged on a wiring board, and a socket main body in which an electrical component is accommodated on an upper surface, is arranged on the wiring board, and is disposed outside the socket main body. An electrical component socket comprising: an outer member to be disposed; and a flexible substrate that electrically connects the electrical component housed on the upper surface of the socket body and the wiring substrate below the outer member. The flexible substrate is bent at an end portion of the upper surface of the socket body, extends downward along the outer surface of the socket body between the socket body and the outer member, and is disposed outside on the wiring substrate. Is bent again toward the wiring board and disposed on the wiring board below the outer member, and the upper surface of the socket body, the corner between the upper surface and the outer surface, front Over the outer surface, characterized in that the socket for electrical parts that are attached to whole.

  According to a second aspect of the present invention, in addition to the configuration of the first aspect, an elastomer member is disposed on the lower surface of the outer member, and the flexible substrate is sandwiched between the elastomer member and the wiring substrate. It is characterized by that.

  According to a third aspect of the present invention, there is provided a frame-shaped socket main body disposed on the wiring board and accommodating an electrical component on an upper surface thereof, and an outer member disposed on the wiring board and disposed outside the socket main body. And a flexible board that electrically connects the electrical component housed on the upper surface of the socket body and the wiring board below the socket body and below the outer member, The flexible board is bent from the upper surface of the socket body at an outer end portion of the upper surface and extends downward along the outer surface of the socket body between the socket body and the outer member, It is bent again outward on the board, reaches the wiring board below the outer member, and is bent from the upper surface of the socket body at the inner edge of the upper surface. , Extending downward along the inner side surface of the socket body, bent again toward the outside on the wiring board, arranged to reach the wiring board below the socket body, and of the socket body The entire upper surface, the outer corner between the upper surface and the outer surface, the outer surface, the inner corner between the upper surface and the inner surface, and the inner surface are affixed as a whole. It is characterized by being a socket for electrical parts.

  According to a fourth aspect of the present invention, in addition to the configuration of the third aspect, an elastomer member is disposed on the lower surface of the socket body and the outer member, and the flexible substrate includes the elastomer member and the wiring board. Is characterized by being pinched.

  According to the first aspect of the present invention, the flexible substrate is bent at the end of the upper surface of the socket body in which the electrical component is accommodated, and the space between the socket body and the outer member is along the outer surface of the socket body. Since it is arranged so as to extend downward, bend outward again on the wiring board, and reach the wiring board below the outer member, the pitch between the terminals of the electrical parts can be easily and reliably set by the socket for electrical parts. And can be electrically connected to wiring boards at different horizontal positions. Furthermore, since the flexible substrate is adhered to the entire upper surface of the socket body, the corner between the upper surface and the outer surface, and the outer surface, the socket for electrical parts is used repeatedly. In addition, the flexible board can be firmly fixed without being displaced or bent with respect to the socket body. As a result, it is possible to provide a highly durable electrical component socket that can maintain a reliable connection with the electrical component even after repeated use.

  According to the second aspect of the present invention, since the flexible substrate is sandwiched between the elastomer member disposed on the lower surface of the outer member and the wiring substrate, the wiring substrate and the flexible substrate are reliably connected. be able to. As a result, a more durable electrical component socket that can maintain a reliable connection between the electrical component and the wiring board even after repeated use can be obtained.

  According to the third aspect of the present invention, the flexible board is bent from the upper surface of the frame-shaped socket main body in which the electrical components are accommodated at the outer end portion of the upper surface, and the socket is provided between the socket main body and the outer member. It extends downward along the outer surface of the main body, is bent again outward on the wiring board, reaches the wiring board below the outer member, and is bent from the upper surface of the socket main body at the inner edge of the upper surface. The pitch between the terminals of the electrical components extends downward along the inner surface of the socket body, is bent again outward on the wiring board, and reaches the wiring board below the socket body. Can be easily and surely expanded at two locations below the outer member and the socket body in the socket for electrical parts, and can be electrically connected to the wiring boards at different horizontal positions, further improving the expandability. Door can be. In addition, the flexible board is entirely formed over the upper surface of the socket body, the outer corner between the upper surface and the outer surface, the outer surface, the inner corner between the upper surface and the inner surface, and the inner surface. Since it is affixed, the flexible substrate can be firmly fixed to the socket body without being displaced or bent even after the electrical component socket is repeatedly used. As a result, it is possible to provide a highly durable electrical component socket that can maintain a reliable connection with the electrical component even after repeated use.

  According to the fourth aspect of the present invention, since the flexible board is sandwiched between the elastomer body and the wiring board disposed on the lower surfaces of the socket body and the outer member, the connection between the wiring board and the flexible board can be performed. It can be done reliably. As a result, a more durable electrical component socket that can maintain a reliable connection between the electrical component and the wiring board even after repeated use can be obtained.

It is a longitudinal cross-sectional view of the IC socket which concerns on Embodiment 1 of this invention. FIG. 2 is a development view of the flexible substrate of the IC socket of FIG. 1 according to the first embodiment. It is a longitudinal cross-sectional view of the IC socket which concerns on Embodiment 2 of this invention. It is an expansion longitudinal cross-sectional view of the IC socket which concerns on the comparative example 1 with respect to the IC socket of this invention. It is an expansion longitudinal cross-sectional view of the IC socket which concerns on the comparative example 2 with respect to the IC socket of this invention. It is an expansion longitudinal cross-sectional view of the IC socket which concerns on the comparative example 3 with respect to the IC socket of this invention.

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention
1 to 2 show a first embodiment of the present invention.

  As shown in FIG. 1, the IC socket 10 as the “electrical component socket” of the first embodiment is arranged on the wiring board 1 and the upper part accommodates the IC package 2 as the “electrical component” The electrode 1a of the wiring board 1 and the solder balls 2a as “terminals” of the IC package 2 are configured to be electrically connected to each other. For example, the electrode 1a is used in a test device for a continuity test such as a burn-in test for the IC package 2. It is what

  In the IC package 2 of the first embodiment, a plurality of spherical solder balls 2a are provided on the peripheral edge of the lower surface of the package body 2b having a substantially square shape in plan view.

  As shown in FIG. 1, the IC socket 10 includes a socket body 20, an outer member 30, a guide member 40, and a flexible substrate 50. Among these, the socket main body 20 is arranged with its lower surface 23 aligned with a predetermined position on the wiring board 1 and formed in a substantially square shape in plan view, and the accommodating portion 11 that accommodates the IC package 2 is at the upper portion. Is formed.

  Further, the outer member 30 is disposed on the wiring board 1 so as to surround the socket body 20 outside the socket body 20 with a predetermined gap. The outer member 30 is formed in a substantially square frame shape in plan view, and the wiring board 1 has its electrode 1 a arranged in a substantially rectangular frame shape, and the outer member 30 is an electrode 1 a of the wiring board 1. It is the structure arrange | positioned just in the location provided.

  In addition, a guide member 40 is provided on the outer member 30. This guide member 40 is for guiding the IC package 2 to be accommodated in an appropriate position when the IC package 2 is accommodated in the accommodating portion 11 of the socket body 20 by a handler or the like. Further, the guide member 40 is formed in a substantially rectangular frame shape in plan view, and here, a tapered surface 41 inclined downward is formed on the inner upper portion thereof, and the IC package 2 is guided to the housing portion 11. It has become.

  In addition, the flexible substrate 50 includes the solder balls 2 a of the IC package 2 accommodated in the accommodating portion 11 of the socket body 20 and the outer member 30 of the wiring substrate 1 disposed below the socket body 20 and the outer member 30. The electrode 1a provided below is electrically connected. As shown in FIG. 2, the flexible substrate 50 includes a central portion 51, an intermediate portion 52 that extends in the four directions of the central portion 51, and a peripheral portion 53 that is located at the tip of the intermediate portion 52.

  Among these, the center part 51 is a place arrange | positioned at the upper surface 21 of the socket main body 20, and is formed in planar view substantially square shape. A plurality of IC package electrodes 54 corresponding to the solder balls 2 a of the IC package 2 are formed on the upper surface of the central portion 51. Here, the central portion 51 has a substantially rectangular frame shape along the peripheral edge of the central portion 51. Is formed.

  The peripheral portion 53 is a portion disposed on the wiring substrate 1 below the outer member 30 and is formed in a shape that expands in the peripheral direction (front end direction) in plan view. A plurality of wiring substrate electrodes 55 corresponding to the electrodes 1a of the wiring substrate 1 are formed on the lower surface (surface opposite to the IC package electrode 54) of the peripheral portion 53. Here, a plurality of ICs are provided. Each of the package electrodes 54 is connected by a conductive wire, and is formed so as to be arranged in a substantially rectangular shape. The peripheral portion 53 is formed so that its width is wider than the central portion 51 in the peripheral direction (front end direction). The wiring substrate electrode 55 of the peripheral portion 53 has an arrangement pitch of the peripheral portion 53. It is formed so as to extend from the IC package electrode 54 in the central portion 51.

  The intermediate portion 52 is a portion that connects the central portion 51 and the peripheral portion 53, is formed in a substantially rectangular shape in plan view, extends from the four sides of the central portion 51 in four directions, and is formed on the upper surface 21 of the socket body 20. It is a portion that is bent at the end, extends between the socket body 20 and the outer member 30 along the outer surface 22 of the socket body 20, and is bent again outward on the wiring board 1. Further, the width of the intermediate portion 52 is formed in accordance with the width of the central portion 51. Further, the intermediate portion 52 is provided with a conductor (print pattern) (not shown) that electrically connects the IC package electrode 54 in the central portion 51 and the wiring board electrode 55 in the peripheral portion 53.

  The flexible substrate 50 having the central part 51, the intermediate part 52, and the peripheral part 53 is attached to the entire upper surface 51 of the socket body 20 via an adhesive sheet 70 as an adhesive member. ing. Further, the entire surface of the intermediate portion 52 is attached to the outer side surface 22 of the socket body 20 via an adhesive sheet 70. Further, the intermediate portion 52 is also attached to the corner portion 24 between the upper surface 21 and the outer surface 22 of the socket body 20 via the adhesive sheet 70.

  That is, the flexible substrate 50 has all the locations in contact with the socket body 20 from the central portion 51 to the intermediate portion 52 at the upper surface 21 of the socket body 20, the corner portion 24 between the upper surface 21 and the outer surface 22, It is affixed through the adhesive sheet 70 across the side surface 22 without any gaps.

  Accordingly, the flexible substrate 50 can be prevented from being displaced or bent with respect to the socket body 20, and the IC package electrode 54 of the flexible substrate 50 arranged in alignment can be removed from the solder ball 2 a of the IC package 2. It can be prevented from shifting. In particular, since the flexible substrate 50 is attached to the corner portion 24 between the upper surface 21 and the outer surface 22 of the socket body 20 without any gap, stress is concentrated every time the IC package 2 is mounted or removed. The bent portion A of the flexible board 50 that is easy to be done does not shift or bend the flexible board 50 with respect to the socket body 20 for a long period of time, and the IC socket 10 with good durability can be obtained.

  Further, the intermediate portion 52 of the flexible substrate 50 is bent outward at the same horizontal position as the lower surface 23 below the outer surface 22 of the socket body 20, and the peripheral edge 53 is disposed below the outer member 30. It is like that. Here, an elastomer member 60 is disposed on the lower surface of the outer member 30, and the peripheral edge portion 53 is sandwiched between the elastomer member 60 and the lower wiring board 1.

  Accordingly, the flexible substrate 50 can be prevented from being displaced or bent with respect to the wiring substrate 1, and the wiring substrate electrode 55 of the flexible substrate 50 that is arranged and aligned with an alignment pin or the like is provided on the wiring substrate 1. It can be prevented from shifting from the electrode 1a.

  Incidentally, when the IC socket 10 is used, the IC socket 10 is disposed on the wiring board 1 and the wiring board electrode 55 of the flexible board 50 and the electrode 1a of the wiring board 1 are electrically connected. First, the IC package 2 is housed in the housing portion 11 while being guided by the guide member 40 using a handler or the like.

  Next, when the IC package 2 accommodated in the accommodating portion 11 is pressed with a predetermined pressing force by a handler or the like, the solder ball 2a of the IC package 2 and the IC package electrode 54 of the flexible substrate 50 are electrically connected. .

  Thereby, the solder balls 2 a of the IC package 2 and the electrodes 1 a of the wiring board 1 are electrically connected via the flexible substrate 50 of the IC socket 10.

In such a state, a continuity test such as a burn-in test of the IC package 2 is performed.
[Embodiment 2 of the Invention]
FIG. 3 shows a second embodiment of the present invention. The second embodiment of the present invention is the same as the first embodiment except for the items described below. Therefore, the same reference numerals are given to the same items as those of the first embodiment described above. Omitted.

  In the second embodiment, the socket body 20 in the first embodiment is changed to a frame-shaped socket body 120, and the flexible board 50 is changed to a flexible board 150 having more expandability. Hereinafter, the IC socket 110 according to the second embodiment will be described.

  As shown in FIG. 3, the IC socket 110 according to the second embodiment includes a socket body 120, an outer member 30, a guide member 40, and a flexible substrate 150. Among these, the socket main body 120 is arranged so that the lower surface 123 thereof is aligned with a predetermined position on the wiring substrate 101, is formed in a substantially rectangular frame shape in plan view, and the accommodating portion 111 that accommodates the IC package 102 is the upper portion. Is formed.

  In addition, the flexible substrate 150 includes solder balls 102 a of the IC package 102 housed in the housing portion 111 of the socket body 120, electrodes 101 b disposed below the socket body 120 in the wiring substrate 101, and below the outer member 30. Are electrically connected to the electrode 101a.

  The flexible substrate 150 is divided into four sides in the substantially rectangular frame-shaped socket body 120, and each of them is divided into a central portion 151 and the outer portion 30 side from the central portion 151 as shown in FIG. An outer intermediate portion 152 that extends, an outer peripheral edge portion 153 located at the tip of the outer intermediate portion 152, an inner intermediate portion 156 that extends from the central portion 51 to the inside of the socket body 120 opposite to the outer member 30 side, And an inner peripheral edge 157 located at the tip of the intermediate portion 156.

  Among these, the center part 151 is a part arrange | positioned at the upper surface 121 of the socket main body 120, and is formed in planar view substantially rectangular shape. A plurality of IC package electrodes 154 corresponding to the solder balls 102a of the IC package 102 are formed on the upper surface of the central portion 151. Here, the central portion 151 is formed on the entire central portion 151.

  Further, the outer peripheral edge 153 is a portion disposed on the wiring substrate 101 below the outer member 30 and is formed in a substantially rectangular shape in plan view. A plurality of wiring substrate electrodes 155 corresponding to the electrodes 101a of the wiring substrate 101 are formed on the outer peripheral edge portion 153 on the lower surface (the surface opposite to the IC package electrode 154). Each of the IC package electrodes 154 is connected by a conductive wire.

  The outer intermediate portion 152 is a portion connecting the central portion 151 and the outer peripheral edge portion 153, extends from the outer member 30 side of the central portion 151, and is bent at an outer end portion of the upper surface 121 of the socket body 120. This is a portion that extends along the outer surface 122 of the socket body 120 between the socket body 120 and the outer member 30 and is bent again toward the outside on the wiring board 101. Further, the outer intermediate portion 152 is provided with a conductor (print pattern) (not shown) that electrically connects a part of the IC package electrode 154 in the central portion 151 and the wiring board electrode 155 in the outer peripheral portion 153. ing.

  Further, the inner peripheral edge portion 157 is a portion disposed on the wiring substrate 101 below the socket body 120, and is formed in a substantially rectangular shape in plan view. A plurality of wiring substrate electrodes 158 corresponding to the electrodes 101b of the wiring substrate 101 are formed on the inner peripheral edge portion 157 on the lower surface (the surface on the same side as the IC package electrode 154). Of the IC package electrodes 154, the IC package electrodes 154 other than those connected to the wiring substrate electrodes 155 of the outer peripheral edge portion 153 are connected by conductive wires.

  The inner intermediate portion 156 is a portion that connects the central portion 151 and the inner peripheral edge portion 157, extends from the inner side of the socket main body 120 of the central portion 151, and is bent at an inner end portion of the upper surface 121 of the socket main body 120. Thus, the portion extends along the inner side surface 125 of the socket body 120 and is bent again outward on the wiring board 101. Further, the inner intermediate portion 156 includes a part of the IC package electrode 154 in the central portion 151 (the IC package electrode 154 other than that connected to the wiring substrate electrode 155 in the outer peripheral portion 153) and the inner peripheral portion. Conductive wires (print pattern) (not shown) that electrically connect the wiring board electrodes 158 of 157 are provided.

  The flexible substrate 150 having the central portion 151, the outer intermediate portion 152, the outer peripheral portion 153, the inner intermediate portion 156, and the inner peripheral portion 157 is bonded to the upper surface 151 of the socket body 120. Affixed via an adhesive sheet 170 as a member. Further, the entire surface of the outer intermediate portion 152 is attached to the outer surface 122 of the socket body 120 via an adhesive sheet 170. Further, the outer intermediate portion 152 is also attached to the outer corner portion 124 between the upper surface 121 and the outer surface 122 of the socket body 120 via the adhesive sheet 170. Further, the entire surface of the inner intermediate portion 156 is attached to the inner side surface 125 of the socket body 120 via an adhesive sheet 170. Further, the inner intermediate portion 156 is also attached to the inner corner portion 126 between the upper surface 121 and the inner side surface 125 of the socket body 120 via the adhesive sheet 170.

  In other words, the flexible substrate 150 has sockets at all locations where the central portion 151 contacts the socket body 120 of the outer intermediate portion 152 and all locations where the central portion 151 contacts the socket body 120 of the inner intermediate portion 156. Over the upper surface 121 of the main body 120, the outer corner portion 124 between the upper surface 121 and the outer surface 122, the outer surface 122, the inner corner portion 126 between the upper surface 121 and the inner surface 125, and the inner surface 125. It is affixed via the adhesive sheet 170 without a gap.

  Accordingly, the flexible substrate 150 can be prevented from being displaced or bent with respect to the socket body 120, and the IC package electrode 154 of the flexible substrate 150 arranged and aligned can be removed from the solder ball 102 a of the IC package 102. It can be prevented from shifting.

  In particular, the flexible substrate 150 is attached to the outer corner portion 124 between the upper surface 121 and the outer surface 122 of the socket body 120 and the inner corner portion 126 between the upper surface 121 and the inner surface 125 without any gaps. Therefore, the bent portions A and B of the flexible substrate 150 where stress is easily concentrated every time the IC package 2 is mounted or removed may cause the flexible substrate 150 to be displaced or bent with respect to the socket body 120 for a long period of time. Therefore, the IC socket 110 with high durability can be obtained.

  Further, the outer intermediate portion 152 of the flexible substrate 150 is bent outward at substantially the same horizontal position as the lower surface 123 below the outer surface 122 of the socket body 120, and the outer peripheral edge portion 153 of the outer intermediate portion 152 is positioned below the outer member 30. It is arranged. Here, an elastomer member 60 is disposed on the lower surface of the outer member 30, and the outer peripheral edge 153 is sandwiched between the elastomer member 60 and the lower wiring substrate 101.

  Further, the inner intermediate portion 156 of the flexible substrate 150 is bent outward at substantially the same horizontal position as the lower surface 123 below the inner side surface 125 of the socket body 120, and the inner peripheral edge portion 157 is further below the socket body 120. It is arranged. Here, an elastomer member 160 is disposed on the lower surface 123 of the socket body 120, and the inner peripheral edge 157 is sandwiched between the elastomer member 160 and the lower wiring substrate 101.

  By sandwiching the flexible board 150 between the elastomer members 60 and 160 and the wiring board 101 in this way, the flexible board 150 can be prevented from being displaced or bent with respect to the wiring board 101. It is possible to prevent the wiring board electrodes 155 and 158 of the flexible board 150 arranged in alignment from being displaced from the electrodes 101 a and 101 b of the wiring board 101.

  Incidentally, when the IC socket 110 is used, the IC socket 110 is disposed on the wiring board 101, and the wiring board electrodes 155 and 158 of the flexible board 150 and the electrodes 101a and 101b of the wiring board 101 are electrically connected. In this state, first, the IC package 102 is housed in the housing portion 111 while being guided by the guide member 40 using a handler or the like.

  Next, when the IC package 102 accommodated in the accommodating portion 111 is pressed with a predetermined pressing force by a handler or the like, the solder ball 102a of the IC package 102 and the IC package electrode 154 of the flexible substrate 150 are electrically connected. .

  As a result, the solder balls 102 a of the IC package 102 and the electrodes 101 a and 101 b of the wiring substrate 101 are electrically connected via the flexible substrate 150 of the IC socket 110.

  In such a state, a continuity test such as a burn-in test of the IC package 102 is performed.

  Next, an evaluation test supporting the effect of the present invention will be described with reference to FIGS.

  Here, first, the IC socket 10 of Embodiment 1 of the present invention was prepared.

  In addition, as Comparative Example 1 to be compared with this, an IC socket 210 in which the flexible substrate 50 is not attached to the socket body 20 with respect to the IC socket 10 of the present invention as shown in FIG. 4 was prepared. That is, there is no adhesive sheet, the central portion 51 of the flexible substrate 50 is not attached to the upper surface 21 of the socket body 20, and the intermediate portion 52 of the flexible substrate 50 is either the outer surface 22 or the corner portion 24 of the socket body 20. It is something that is not pasted. Other configurations are the same as those of the IC socket 10 according to the first embodiment of the present invention, and the same reference numerals as those in the first embodiment are used for the same configurations. FIG. 4 shows the state of the test result of the IC socket 210 of Comparative Example 1.

  Further, as Comparative Example 2, an IC socket 310 was prepared in which the flexible substrate 50 was attached only to the upper surface 21 of the socket body 20 with respect to the IC socket 10 of the present invention as shown in FIG. That is, the central portion 51 of the flexible substrate 50 is attached to the upper surface 21 of the socket body 20 via the adhesive sheet 370, but there is no adhesive sheet in other portions, and the intermediate portion 52 of the flexible substrate 50 is the socket body. It is not affixed to any of the outer side surface 22 and the corner portion 24 of 20. Other configurations are the same as those of the IC socket 10 according to the first embodiment of the present invention, and the same reference numerals as those in the first embodiment are used for the same configurations. FIG. 5 shows the state of the test result of the IC socket 310 of Comparative Example 2.

  Further, as Comparative Example 3, an IC socket 410 was prepared in which a flexible substrate 50 was attached only to the upper surface 21 and the outer surface 22 of the socket body 20 with respect to the IC socket 10 of the present invention as shown in FIG. That is, the central portion 51 of the flexible substrate 50 is attached to the upper surface 21 of the socket body 20 via the adhesive sheet 471, and is along the outer surface 22 of the socket body 20 in the intermediate portion 52 of the flexible substrate 50. The location is affixed to the outer surface 22 via the adhesive sheet 472, but the location located at the corner 24 of the socket body 20 in the intermediate portion 52 of the flexible substrate 50 has no adhesive sheet. It is not attached to the corner 24. Other configurations are the same as those of the IC socket 10 according to the first embodiment of the present invention, and the same reference numerals as those in the first embodiment are used for the same configurations. FIG. 6 shows the state of the test result of the IC socket 410 of Comparative Example 3.

  The same test was repeated for each of the four IC sockets 10, 210, 310, and 410, and the intermediate results and final results were recorded.

(1) Test contents <1> First, the four IC sockets 10, 210, 310, 410 described above are positioned and placed on the wiring board 1.
<2> Then, the IC package 2 is accommodated in the IC sockets 10, 210, 310, 410 and pressed with a predetermined force.
<3> Thereafter, the pressing force is released and the IC package 2 is taken out.
<4> Among the above, <2> to <3> are repeated 500,000 times.
<5> Thereafter, the IC sockets 10, 210, 310, 410 are removed from the wiring board 1.

(2) Specifications The IC sockets 10, 210, 310, 410, IC package 2 and wiring board 1 used in this test have the following specifications.
Specification of IC socket 10 in Embodiment 1 of the present invention and IC sockets 210, 310, 410 in Comparative Examples 1 to 3 Material and thickness of flexible substrate: polyimide, 0.05 mm
Adhesive sheet material and thickness: non-woven fabric, 0.1 mm
(3) Test method-Up to 20,000 times, every time <2> to <3> of the above (1) test contents were performed 5000 times, it was visually confirmed that the flexible substrate 50 was not displaced or bent. Moreover, it was confirmed by a continuity test whether the conductive wire of the flexible substrate 50 was broken. In addition, the above (1) <2> to <3> of the test content is confirmed every 10,000 times up to 20,000 to 50,000 times, and the above (1) < This was confirmed every time 50,000 to <2> to <3> were performed.
・ Pressing force for one test condition: 196N
Pressing time: 0.2 seconds Ambient temperature: 23 ° C
(4) Results As a result of performing the above test and confirming the state of each IC socket, when the IC socket 210 of Comparative Example 1 is repeatedly tested about 10,000 times, the entire flexible substrate 50 is displaced or bent. Disconnected.

  Further, when the IC socket 310 of Comparative Example 2 is repeatedly tested about 15,000 times, stress is concentrated every time the IC package 2 of the intermediate portion 52 of the flexible substrate 50 is mounted or removed. The easily bent portion A (location contacting the corner portion 24 of the socket body 20) was displaced and bent, and was broken.

  Further, in the IC socket 410 of Comparative Example 3, when the test is repeatedly performed about 20,000 times, the stress is easily concentrated every time the IC package 2 of the intermediate portion 52 of the flexible substrate 50 is mounted or removed. The bent portion A (the portion in contact with the corner portion 24 of the socket body 20) was displaced or bent, and was disconnected.

  On the other hand, in the IC socket 10 of the present invention, even after the test is repeated 500,000 times, the stress is easily concentrated every time the IC package 2 in the intermediate portion 52 of the flexible substrate 50 is mounted or removed. There was no displacement or bending anywhere including the bent portion A (the portion in contact with the corner portion 24 of the socket body 20), and there was no disconnection.

  From these facts, it was found that the IC socket of the present invention can obtain accurate test results up to about 500,000 tests, and can be practically used up to 500,000 tests.

  On the other hand, the IC sockets of Comparative Examples 1 to 3 cannot obtain an accurate test result after about 20,000 tests, and can only be practically used up to 20,000 tests. It was.

  The electrical component socket of the present invention is not limited to the one described in the first and second embodiments, and is not limited to the one shown in the figure. What is necessary is just to change suitably the structure of a member, a flexible substrate, etc. so that the effect of this invention may be acquired. For example, in the first and second embodiments, the adhesive sheet is used as the adhesive member. However, the adhesive member is not a sheet-like member, and a liquid adhesive member such as an adhesive may be appropriately changed and used.

  In the first and second embodiments, the “socket for electrical parts” of the present invention is applied to an IC socket. However, the present invention is not limited to this and can be applied to other electrical parts.

1,101 Wiring board
1a, 101a, 101b Wiring board electrodes
2,102 IC package (electrical parts)
2a, 102a Solder ball (terminal)
2b, 102b Package body
10,110 IC socket (socket for electrical parts)
11,111 containment
20,120 socket body
21,121 Top surface of socket body
22,122 Outer surface of socket body
23,123 Bottom of socket body
24 Corner of socket body
30 Outer member
40 Guide member
50,150 Flexible substrate (FPC)
51,151 Central part of flexible substrate
52 Middle part of flexible substrate
53 Peripheral edge of flexible substrate
54,154 IC package electrodes
55,155,158 Wiring board electrode
60,160 Elastomer parts
70,170 Adhesive sheet (adhesive member)
124 Outer corner
125 Inside
126 Inner corner
152 Outer middle part of flexible substrate
153 Outer peripheral edge of flexible substrate
156 Inside middle part of flexible substrate
157 Inner peripheral edge of flexible substrate
A, B Folded part of flexible substrate

Claims (4)

A socket body disposed on the wiring board and containing electrical components on the upper surface;
An outer member disposed on the wiring board and disposed outside the socket body;
A flexible board that electrically connects the electrical component housed on the top surface of the socket body and the wiring board below the outer member;
A socket for an electrical component comprising:
The flexible substrate is
It is bent at the end of the upper surface of the socket body, extends downward along the outer surface of the socket body between the socket body and the outer member, and is bent again outward on the wiring board. And arranged to reach the wiring board below the outer member,
And the socket for electrical components characterized by being affixed over the said upper surface of the said socket main body, the corner | angular part between the said upper surface and the said outer surface, and the said outer surface.   2. The electrical component according to claim 1, wherein an elastomer member is disposed on a lower surface of the outer member, and the flexible substrate is sandwiched between the elastomer member and the wiring board. socket. A frame-shaped socket body disposed on the wiring board and containing electrical components on the upper surface;
An outer member disposed on the wiring board and disposed outside the socket body;
A flexible board that electrically connects the electrical component housed on the top surface of the socket body and the wiring board below the socket body and below the outer member;
A socket for an electrical component comprising:
The flexible substrate is
It is bent from the upper surface of the socket body at the outer edge of the upper surface, and extends downward along the outer surface of the socket body between the socket body and the outer member, and is directed outward on the wiring board. Is bent again and reaches the wiring board below the outer member, is bent from the upper surface of the socket body at the inner end of the upper surface, and extends downward along the inner surface of the socket body, It is bent again toward the outside on the wiring board, and is arranged to reach the wiring board below the socket body,
And over the upper surface of the socket body, the outer corner between the upper surface and the outer surface, the outer surface, the inner corner between the upper surface and the inner surface, and the inner surface. A socket for electrical parts, characterized in that it is attached to the socket.   The elastomer member is arrange | positioned at the lower surface of the said socket main body and the said outer side member, The said flexible substrate is clamped by this elastomer member and the said wiring board, The Claim 3 characterized by the above-mentioned. Socket for electrical parts.

Images