JP2014193529A5 - - Google Patents
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- Publication number
- JP2014193529A5 JP2014193529A5 JP2013070006A JP2013070006A JP2014193529A5 JP 2014193529 A5 JP2014193529 A5 JP 2014193529A5 JP 2013070006 A JP2013070006 A JP 2013070006A JP 2013070006 A JP2013070006 A JP 2013070006A JP 2014193529 A5 JP2014193529 A5 JP 2014193529A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- dispersion
- radiation layer
- heat radiation
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005855 radiation Effects 0.000 claims 27
- 230000017525 heat dissipation Effects 0.000 claims 18
- 239000006185 dispersion Substances 0.000 claims 14
- 150000002484 inorganic compounds Chemical class 0.000 claims 10
- 229910010272 inorganic material Inorganic materials 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 9
- 229920003002 synthetic resin Polymers 0.000 claims 9
- 239000000057 synthetic resin Substances 0.000 claims 9
- 239000002612 dispersion medium Substances 0.000 claims 8
- 229910052751 metal Inorganic materials 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 5
- -1 silica compound Chemical class 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims 3
- 239000002243 precursor Substances 0.000 claims 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 239000002734 clay mineral Substances 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 229910052604 silicate mineral Inorganic materials 0.000 claims 2
- 238000003892 spreading Methods 0.000 claims 2
- 230000008961 swelling Effects 0.000 claims 2
- 239000005995 Aluminium silicate Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims 1
- 239000004962 Polyamide-imide Substances 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 235000012211 aluminium silicate Nutrition 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 229940043430 calcium compound Drugs 0.000 claims 1
- 150000001674 calcium compounds Chemical class 0.000 claims 1
- 230000015556 catabolic process Effects 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000010883 coal ash Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000005336 cracking Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 238000007731 hot pressing Methods 0.000 claims 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000010445 mica Substances 0.000 claims 1
- 229910052618 mica group Inorganic materials 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- 230000035699 permeability Effects 0.000 claims 1
- 229920002312 polyamide-imide Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 229910052903 pyrophyllite Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims 1
- 239000000454 talc Substances 0.000 claims 1
- 229910052623 talc Inorganic materials 0.000 claims 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013070006A JP6292549B2 (ja) | 2013-03-28 | 2013-03-28 | 放熱フィルム、熱放射層用分散液、放熱フィルムの製造方法、及び、太陽電池 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013070006A JP6292549B2 (ja) | 2013-03-28 | 2013-03-28 | 放熱フィルム、熱放射層用分散液、放熱フィルムの製造方法、及び、太陽電池 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014193529A JP2014193529A (ja) | 2014-10-09 |
| JP2014193529A5 true JP2014193529A5 (cg-RX-API-DMAC7.html) | 2016-05-26 |
| JP6292549B2 JP6292549B2 (ja) | 2018-03-14 |
Family
ID=51839176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013070006A Active JP6292549B2 (ja) | 2013-03-28 | 2013-03-28 | 放熱フィルム、熱放射層用分散液、放熱フィルムの製造方法、及び、太陽電池 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6292549B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6580592B2 (ja) | 2015-02-17 | 2019-09-25 | エルジー・ケム・リミテッド | 封止フィルム |
| JP2018139236A (ja) * | 2015-07-10 | 2018-09-06 | 住友精化株式会社 | ヒートシンク |
| KR102031722B1 (ko) * | 2017-10-31 | 2019-11-27 | 케이알솔라 주식회사 | 경량골재를 이용한 건물용태양광패널 |
| KR102296731B1 (ko) * | 2019-12-06 | 2021-09-02 | 주식회사 네패스 | 박형화 가능하고 유연성이 뛰어난 복합방열시트, 이의 제조방법 및 이를 포함하는 모바일 기기 |
| JPWO2024204490A1 (cg-RX-API-DMAC7.html) * | 2023-03-28 | 2024-10-03 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5446114B2 (ja) * | 2007-04-25 | 2014-03-19 | 日立化成株式会社 | 熱伝導性フィルム |
| JP5297740B2 (ja) * | 2007-09-28 | 2013-09-25 | 新日鉄住金化学株式会社 | 熱伝導性フレキシブル基板用積層体 |
| US20090229809A1 (en) * | 2008-03-14 | 2009-09-17 | E. I. Du Pont De Nemours And Company | Device capable of thermally cooling while electrically insulating |
| JP5643536B2 (ja) * | 2010-04-16 | 2014-12-17 | 三井化学株式会社 | 熱伝導性接着樹脂組成物、それを含む積層体および半導体装置 |
| US20130309485A1 (en) * | 2011-01-28 | 2013-11-21 | Nitto Denko Corporation | Heat-conductive film and production method therefor |
| JP2012213899A (ja) * | 2011-03-31 | 2012-11-08 | Nippon Steel Chem Co Ltd | 熱伝導性ポリイミド−金属基板 |
| JP2012213900A (ja) * | 2011-03-31 | 2012-11-08 | Nippon Steel Chem Co Ltd | 熱伝導性ポリイミド−金属基板 |
-
2013
- 2013-03-28 JP JP2013070006A patent/JP6292549B2/ja active Active
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