JP2014189806A5 - - Google Patents

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Publication number
JP2014189806A5
JP2014189806A5 JP2013063800A JP2013063800A JP2014189806A5 JP 2014189806 A5 JP2014189806 A5 JP 2014189806A5 JP 2013063800 A JP2013063800 A JP 2013063800A JP 2013063800 A JP2013063800 A JP 2013063800A JP 2014189806 A5 JP2014189806 A5 JP 2014189806A5
Authority
JP
Japan
Prior art keywords
substrate
suction mechanism
substrate holder
suction
axis actuator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013063800A
Other languages
English (en)
Japanese (ja)
Other versions
JP6018961B2 (ja
JP2014189806A (ja
Filing date
Publication date
Priority claimed from JP2013063800A external-priority patent/JP6018961B2/ja
Priority to JP2013063800A priority Critical patent/JP6018961B2/ja
Application filed filed Critical
Priority to US14/223,972 priority patent/US9388504B2/en
Priority to TW103110989A priority patent/TWI613322B/zh
Priority to TW106145064A priority patent/TWI657165B/zh
Publication of JP2014189806A publication Critical patent/JP2014189806A/ja
Publication of JP2014189806A5 publication Critical patent/JP2014189806A5/ja
Priority to US15/179,835 priority patent/US10294576B2/en
Publication of JP6018961B2 publication Critical patent/JP6018961B2/ja
Application granted granted Critical
Priority to US16/380,843 priority patent/US10577706B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013063800A 2013-03-26 2013-03-26 めっき装置およびめっき方法 Active JP6018961B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013063800A JP6018961B2 (ja) 2013-03-26 2013-03-26 めっき装置およびめっき方法
US14/223,972 US9388504B2 (en) 2013-03-26 2014-03-24 Plating apparatus and plating method
TW103110989A TWI613322B (zh) 2013-03-26 2014-03-25 鍍覆裝置及鍍覆方法
TW106145064A TWI657165B (zh) 2013-03-26 2014-03-25 鍍覆裝置
US15/179,835 US10294576B2 (en) 2013-03-26 2016-06-10 Plating apparatus
US16/380,843 US10577706B2 (en) 2013-03-26 2019-04-10 Plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013063800A JP6018961B2 (ja) 2013-03-26 2013-03-26 めっき装置およびめっき方法

Publications (3)

Publication Number Publication Date
JP2014189806A JP2014189806A (ja) 2014-10-06
JP2014189806A5 true JP2014189806A5 (enrdf_load_stackoverflow) 2015-12-03
JP6018961B2 JP6018961B2 (ja) 2016-11-02

Family

ID=51836384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013063800A Active JP6018961B2 (ja) 2013-03-26 2013-03-26 めっき装置およびめっき方法

Country Status (1)

Country Link
JP (1) JP6018961B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6746185B2 (ja) * 2016-02-01 2020-08-26 アスカコーポレーション株式会社 半導体ウェハめっき用治具
JP6951269B2 (ja) * 2018-01-29 2021-10-20 株式会社荏原製作所 基板処理装置、基板処理装置の制御装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP7059172B2 (ja) * 2018-12-21 2022-04-25 株式会社荏原製作所 基板ホルダのシールから液体を除去するための方法
EP3758049B8 (en) * 2019-06-26 2022-03-23 Atotech Deutschland GmbH & Co. KG Device and method for moving an object into a processing station, conveying system and processing apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2911882B1 (ja) * 1998-06-23 1999-06-23 日本エレクトロプレイテイング・エンジニヤース株式会社 カップ式めっき装置
US6660139B1 (en) * 1999-11-08 2003-12-09 Ebara Corporation Plating apparatus and method
JP3284496B2 (ja) * 2000-08-09 2002-05-20 株式会社荏原製作所 めっき装置及びめっき液除去方法
JP2003247098A (ja) * 2002-02-21 2003-09-05 Ebara Corp めっき装置
JP2005068450A (ja) * 2003-08-26 2005-03-17 Noge Denki Kogyo:Kk 長尺材の連続めっき加工における減圧式洗浄方法及び装置
JP2008255374A (ja) * 2007-03-30 2008-10-23 Kayaba Ind Co Ltd 表面処理装置および表面処理方法
JP5785480B2 (ja) * 2011-11-16 2015-09-30 株式会社荏原製作所 無電解めっき装置及び無電解めっき方法

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