JP2014182844A - Manufacturing method for glass substrate for magnetic disk - Google Patents

Manufacturing method for glass substrate for magnetic disk Download PDF

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JP2014182844A
JP2014182844A JP2013055220A JP2013055220A JP2014182844A JP 2014182844 A JP2014182844 A JP 2014182844A JP 2013055220 A JP2013055220 A JP 2013055220A JP 2013055220 A JP2013055220 A JP 2013055220A JP 2014182844 A JP2014182844 A JP 2014182844A
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polishing
glass substrate
side wall
brush
wall surface
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JP6121759B2 (en
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Samagugoon Kiettitam
サムアーググーン キェットティタム
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Hoya Corp
Hoya Glass Disk Thailand Ltd
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Hoya Glass Disk Thailand Ltd
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Abstract

PROBLEM TO BE SOLVED: To polish an end face of a glass plate without leaving an unpolished part of an interposing face, when manufacturing a glass substrate for a magnetic disk.SOLUTION: The end face of the glass substrate includes a side wall face perpendicular to a main face of the glass substrate, and the interposed face which is interposed between the main face and the side wall face. In the manufacturing method of the glass substrate for the magnetic disk, an end face polishing process is performed by relatively moving a polishing brush and the glass substrate while supplying a polishing liquid containing free abrasive grains between the polishing brush and the end face of the glass substrate. The end face polishing process includes a first process for polishing the side wall face, and a second process for at least performing polishing of the interposed face after the first process while maintaining the surface roughness of the side wall face.

Description

本発明は、中心に円孔を有する円盤状のガラス基板の端面に、研磨ブラシを押し当てて研磨する端面研磨処理を含む磁気ディスク用ガラス基板の製造方法に関する。   The present invention relates to a method for manufacturing a glass substrate for a magnetic disk including an end surface polishing process in which a polishing brush is pressed against an end surface of a disk-shaped glass substrate having a circular hole in the center.

情報記録媒体の1つとして用いられる磁気ディスクには、従来より、ガラス基板が好適に用いられている。今日、ハードディスクドライブ装置における記憶容量の増大の要請を受けて、磁気記録の高密度化が図られている。これに伴って、磁気ヘッドの磁気記録面からの浮上距離を極めて短くして磁気記録情報エリアを微細化することが行われている。このような磁気ディスクに用いるガラス基板の寸法及び形状は目標通り精度高く作製されていることが好ましい。   Conventionally, a glass substrate has been suitably used for a magnetic disk used as one of information recording media. Today, in response to a request for an increase in storage capacity in a hard disk drive device, the density of magnetic recording has been increased. Along with this, the magnetic recording information area is miniaturized by extremely shortening the flying distance from the magnetic recording surface of the magnetic head. It is preferable that the size and shape of the glass substrate used for such a magnetic disk be manufactured with high accuracy as intended.

一般的に、この磁気ディスク用ガラス基板の中心に設けられる円孔の内周側及びガラス基板の円盤形状の外周側の端面は、ガラス基板の主表面に対して直交する側壁面と、主表面と側壁面との間に介在する介在面と、を有する。介在面は、例えば主表面に対して傾斜角度を持って面取りされてできた傾斜面である。このような側壁面及び介在面は表面粗さが小さく、形状も目標通りに作製されていることが好ましい。このために、磁気ディスク用ガラス基板を作製するとき、素板であるガラス基板を形状加工した後、端面研磨を行う。   In general, the inner peripheral side of the circular hole provided at the center of the glass substrate for magnetic disk and the end surface on the outer peripheral side of the disk shape of the glass substrate are a side wall surface orthogonal to the main surface of the glass substrate, and the main surface And an intervening surface interposed between the side wall surfaces. The interposed surface is, for example, an inclined surface that is chamfered with an inclination angle with respect to the main surface. It is preferable that the side wall surface and the interposition surface have a small surface roughness and have a shape as designed. For this purpose, when a glass substrate for a magnetic disk is manufactured, the glass substrate, which is a base plate, is shaped and then subjected to end face polishing.

一般に、磁気ディスク用ガラス基板を作製するために、素板であるガラス基板の介在面及び側壁面は、例えば研磨砥粒として例えば酸化セリウム砥粒を含むスラリー(遊離砥粒)を用いたブラシ研磨により研磨される。このような研磨例は、例えば下記特許文献1の段落0034に記載されている。   In general, in order to produce a glass substrate for a magnetic disk, the intervening surface and the side wall surface of the glass substrate, which is a base plate, are brush-polished using, for example, a slurry containing cerium oxide abrasive grains (free abrasive grains) as abrasive grains. It is polished by. Such a polishing example is described in paragraph 0034 of Patent Document 1 below, for example.

特開2012−203922号公報JP2012-203922A

特許文献1に記載されるような従来の端面研磨では、側壁面及び介在面を同時に研磨するが、介在面は側壁面に比べて研磨ブラシから遠い位置にあり、しかも、介在面は傾斜面であるので、側壁面と介在面を同時に研磨すると、介在面に研磨残しが存在する場合があった。   In the conventional end surface polishing as described in Patent Document 1, the side wall surface and the intervening surface are simultaneously polished, but the intervening surface is farther from the polishing brush than the side wall surface, and the intervening surface is an inclined surface. Therefore, when the side wall surface and the intervening surface are polished at the same time, there may be a polishing residue on the intervening surface.

そこで、本発明は、磁気ディスク用ガラス基板の製造するとき、介在面の研磨残しが無いようにガラス板の端面研磨を行うことができる磁気ディスク用ガラス基板の製造方法を提供することを目的とする。   Accordingly, an object of the present invention is to provide a method for producing a glass substrate for a magnetic disk capable of polishing an end face of a glass plate so that there is no residual polishing of the intervening surface when producing a glass substrate for a magnetic disk. To do.

本願発明者は、介在面と側壁面を同時に研磨する従来の端面研磨法では、介在面の研磨残しがあることを見出した。そこで、この研磨残しを抑制するために鋭意検討した結果、下記内容の本願発明に至っている。   The inventor of the present application has found that there is a polishing residue on the interposition surface in the conventional end surface polishing method in which the interposition surface and the sidewall surface are simultaneously polished. Therefore, as a result of intensive studies to suppress this polishing residue, the present invention having the following contents has been achieved.

本発明の一態様は、中心に円孔を有する円盤状のガラス基板の端面に、研磨ブラシを押し当てて研磨する端面研磨処理を含む磁気ディスク用ガラス基板の製造方法であって、前記ガラス基板の端面は、側壁面と、前記主表面と前記側壁面との間に介在する介在面と、を有し、前記端面研磨処理は、前記研磨ブラシと前記ガラス基板の端面との間に遊離砥粒を含む研磨液を供給して前記研磨ブラシと前記ガラス基板とを相対的に移動させることにより研磨を行う処理であり、前記端面研磨処理は、前記側壁面の研磨を行う第1処理と、前記第1処理後に前記側壁面と前記介在面の研磨を同時に行う第2処理と、を含む磁気ディスク用ガラス基板の製造方法である。   One aspect of the present invention is a method for manufacturing a glass substrate for a magnetic disk, including an end surface polishing process in which a polishing brush is pressed against an end surface of a disk-shaped glass substrate having a circular hole in the center, the surface being polished. The end surface of the substrate has a side wall surface and an intervening surface interposed between the main surface and the side wall surface, and the end surface polishing treatment is performed between the polishing brush and the end surface of the glass substrate. A polishing process is performed by supplying a polishing liquid containing grains and relatively moving the polishing brush and the glass substrate, and the end surface polishing process is a first process for polishing the side wall surface; A method for manufacturing a glass substrate for a magnetic disk, comprising: a second process for simultaneously polishing the side wall surface and the interposition surface after the first process.

このとき、前記第1処理は、前記側壁面の表面粗さRzが0.15μm以下になるように研磨し、前記第2処理は、前記介在面の表面粗さRzが0.15μm以下になるように研磨する、ことが好ましい。   At this time, the first treatment is polished so that the surface roughness Rz of the side wall surface is 0.15 μm or less, and the second treatment is that the surface roughness Rz of the interposition surface is 0.15 μm or less. It is preferable to polish as described above.

また、前記第1処理及び前記第2処理で用いる前記研磨ブラシのブラシ毛の長さは同じである、ことが好ましい。   Moreover, it is preferable that the length of the bristle of the said polishing brush used by the said 1st process and the said 2nd process is the same.

前記第1処理及び前記第2処理では、研磨中、前記研磨ブラシを前記ガラス基板の厚さ方向に移動させる、ことが好ましい。   In the first process and the second process, it is preferable that the polishing brush is moved in the thickness direction of the glass substrate during polishing.

前記第2処理では、前記研磨ブラシの位置を、前記第1処理における前記研磨ブラシの位置に比べて、前記介在面に近い位置に移動して研磨を行う、ことが好ましい。   In the second process, it is preferable to perform polishing by moving the position of the polishing brush to a position closer to the intervening surface than the position of the polishing brush in the first process.

上述の磁気ディスク用ガラス基板の製造方法では、介在面の研磨残しが無いようにガラス板の端面研磨を行うことができる。   In the method for manufacturing a glass substrate for a magnetic disk described above, the end face of the glass plate can be polished so that there is no residual polishing of the intervening surface.

(a),(b)は、円盤形状のガラス基板の内周端面、外周端面のそれぞれを、研磨ブラシを用いて研磨する状態を示す図である。(A), (b) is a figure which shows the state which grind | polishes each of the inner peripheral end surface and outer peripheral end surface of a disk-shaped glass substrate using a polishing brush. ガラス基板の研磨を、拡大して説明する図である。It is a figure which expands and demonstrates grinding | polishing of a glass substrate. 本実施形態における磁気ディスク用ガラス基板の製造方法で行う端面研磨処理における、研磨ブラシの中心軸から側壁面までの距離Lの時間的変化の一例を示す図である。It is a figure which shows an example of the time change of the distance L from the center axis | shaft of a grinding | polishing brush to a side wall surface in the end surface grinding | polishing process performed with the manufacturing method of the glass substrate for magnetic discs in this embodiment. (a)は、磁気ディスク用ガラス基板の製造方法で行う端面研磨処理における、研磨ブラシの中心軸から側壁面までの距離Lの時間的変化の比較例を示す図であり、(b)は、(a)に示す方法で得られるガラス基板の断面形状の一例を示す図である。(A) is a figure which shows the comparative example of the time change of the distance L from the central axis of a grinding | polishing brush to a side wall surface in the end surface grinding | polishing process performed with the manufacturing method of the glass substrate for magnetic discs, (b) It is a figure which shows an example of the cross-sectional shape of the glass substrate obtained by the method shown to (a).

以下、本発明の磁気ディスク用ガラス基板の製造方法について詳細に説明する。なお、本発明において、磁気ディスク用ガラス基板とは、本発明にかかる端面研磨処理が施されたものを意味する。具体的には、例えば、本発明にかかる磁気ディスク用ガラス基板とは、端面研磨処理が施された直後のものであってもよく、また、端面研磨処理を行った後、主表面研磨加工、化学強化加工等の後加工が施され、磁性膜等が成膜される前の状態のものであってもよい。   Hereinafter, the manufacturing method of the glass substrate for magnetic disks of this invention is demonstrated in detail. In addition, in this invention, the glass substrate for magnetic discs means what performed the end surface grinding | polishing process concerning this invention. Specifically, for example, the glass substrate for a magnetic disk according to the present invention may be one immediately after the end surface polishing treatment is performed, or after performing the end surface polishing treatment, It may be in a state before post-processing such as chemical strengthening processing and before the magnetic film or the like is formed.

(本実施形態に用いる研磨の概要)
本実施形態の磁気ディスク用ガラス基板の製造方法では、中心に円孔を有する円盤状のガラス基板が製造される。ガラス基板の端面は、側壁面と、主表面と側壁面との間に介在する介在面(面取面)と、を有する。本実施形態の磁気ディスク用ガラス基板の製造方法では、ガラス基板の端面に、研磨ブラシを押し当てて研磨する端面研磨処理の処理方法に特徴を備える。
また、本実施形態の磁気ディスク用ガラス基板の製造方法では、中心に円孔を有する円盤状のガラス基板の端面に、研磨ブラシを押し当てて研磨する端面研磨処理を含む磁気ディスク用ガラス基板の製造方法であって、前記ガラス基板の端面は、側壁面と、前記主表面と前記側壁面との間に介在する介在面と、を有し、前記端面研磨処理は、前記研磨ブラシと前記ガラス基板の端面との間に遊離砥粒を含む研磨液を供給して前記研磨ブラシと前記ガラス基板とを相対的に移動させることにより研磨を行う処理であり、前記端面研磨処理は、前記側壁面の研磨を行う第1処理と、前記第1処理後に、前記側壁面と前記介在面の研磨を同時に行う第2処理と、を含む構成であってもよい。
ここで、端面研磨処理は、研磨ブラシとガラス基板の端面との間に遊離砥粒を含む研磨液(スラリー)を供給して研磨ブラシとガラス基板とを相対的に移動させることにより研磨を行う。このとき、端面研磨処理は、側壁面の研磨を行う第1処理と、第1処理後に介在面と側壁面の研磨を同時に行う第2処理と、を含む。
本実施形態では、端面は、ガラス基板の外周側端面であってもよく、内周側端面であってもよい。なお、以下の説明では、中心に円孔が形成されたガラス基板を、スペーサーを介して積層された積層体の円孔部分に研磨ブラシを挿入し、研磨ブラシと積層体との少なくとも一方を回転させてガラス基板の内周側端面を研磨する内周側端面研磨について説明する。
(Outline of polishing used in this embodiment)
In the method for manufacturing a magnetic disk glass substrate according to this embodiment, a disk-shaped glass substrate having a circular hole in the center is manufactured. The end surface of the glass substrate has a side wall surface and an interposed surface (chamfered surface) interposed between the main surface and the side wall surface. The method for manufacturing a glass substrate for a magnetic disk according to the present embodiment is characterized by a processing method of an end surface polishing process in which a polishing brush is pressed against the end surface of the glass substrate for polishing.
Further, in the method for manufacturing a magnetic disk glass substrate according to this embodiment, the magnetic disk glass substrate includes an end surface polishing process in which a polishing brush is pressed against the end surface of a disk-shaped glass substrate having a circular hole in the center. It is a manufacturing method, Comprising: The end surface of the said glass substrate has a side wall surface and the interposition surface interposed between the said main surface and the said side wall surface, The said end surface grinding | polishing process is the said polishing brush and the said glass A polishing liquid containing loose abrasive grains is supplied between the end face of the substrate and the polishing brush and the glass substrate are moved relative to each other to polish the end face polishing process. And a second process of simultaneously polishing the side wall surface and the interposition surface after the first process.
Here, in the end face polishing treatment, polishing is performed by supplying a polishing liquid (slurry) containing free abrasive grains between the polishing brush and the end face of the glass substrate and relatively moving the polishing brush and the glass substrate. . At this time, the end face polishing process includes a first process for polishing the side wall surface and a second process for simultaneously polishing the interposition surface and the side wall surface after the first process.
In the present embodiment, the end surface may be the outer peripheral side end surface of the glass substrate or the inner peripheral side end surface. In the following description, a glass substrate having a circular hole formed in the center is inserted into the circular hole portion of the laminated body laminated via a spacer, and at least one of the polishing brush and the laminated body is rotated. The inner peripheral side end surface polishing for polishing the inner peripheral side end surface of the glass substrate will be described.

本実施の形態にかかる研磨処理により、側壁面の研磨を行った後、介在面の研磨を行う。したがって、従来のような介在面と側壁面の研磨を同時に行う場合に比べて、研磨ブラシから見て側壁面に比べて遠い位置にある介在面を、研磨残しが無いように研磨することができる。本実施形態において、介在面を研磨するとき、介在面と側壁面との接続部分も部分的に研磨されて接続部分の曲率は小さくなり、接続部分はなだらかな曲面形状を成す。このため、研磨処理後の第1研磨処理、化学強化処理及び第2研磨処理において上記接続部分が治具に衝突して欠けをつくることを防止できる。
また、本実施の形態にかかる端面研磨処理を行うことにより、介在面と側壁面との表面粗さ(最大高さ:Rz)の差を小さくする、具体的には、0.05μm以内とすることができる。また、本実施形態にかかる端面研磨処理を行うことにより、介在面および側壁面の表面粗さ(最大高さ:Rz)をそれぞれ0.15μm以下とすることができる。さらに、本実施形態にかかる端面研磨処理を行うことにより、介在面および側壁面の算術平均粗さ(Ra)を0.015μm以下、より好ましくは0.010μm以下とすることができる。なお、上記粗さは触針計(測長距離:板厚方向に0.25mm)を用いて測定したものである。
After the side wall surface is polished by the polishing process according to this embodiment, the intervening surface is polished. Therefore, compared to the conventional case where the intervening surface and the side wall surface are polished simultaneously, the intervening surface located far from the side wall surface when viewed from the polishing brush can be polished so that there is no residual polishing. . In this embodiment, when the interposed surface is polished, the connecting portion between the interposed surface and the side wall surface is also partially polished, the curvature of the connecting portion is reduced, and the connecting portion has a gentle curved surface shape. For this reason, it can prevent that the said connection part collides with a jig | tool and makes a chip | tip in the 1st grinding | polishing process after a grinding | polishing process, a chemical strengthening process, and a 2nd grinding | polishing process.
Further, by performing the end surface polishing treatment according to the present embodiment, the difference in surface roughness (maximum height: Rz) between the intervening surface and the side wall surface is reduced, specifically, within 0.05 μm. be able to. Further, by performing the end surface polishing treatment according to the present embodiment, the surface roughness (maximum height: Rz) of the intervening surface and the side wall surface can be set to 0.15 μm or less, respectively. Furthermore, by performing the end surface polishing treatment according to the present embodiment, the arithmetic average roughness (Ra) of the intervening surface and the side wall surface can be 0.015 μm or less, more preferably 0.010 μm or less. The roughness is measured using a stylus meter (measurement distance: 0.25 mm in the plate thickness direction).

例えば、1つの研磨ブラシを用いて端面研磨処理を行う。このとき、研磨ブラシで効率よく研磨できる部分は、研磨ブラシのブラシ毛の毛先部分である。毛先部分と毛の基部との間の中間部分である腹部分は、研磨を効率よく行えない。このため、研磨を効率よく行う毛先部分が側壁面に当接してやや撓む程度の位置に研磨ブラシを固定して側壁面の研磨(第1処理)を行う。この後、研磨ブラシの位置を、毛先部分が介在面に当接してやや撓む程度の位置に移動し、固定して介在面の研磨(第2処理)を行う。つまり、第2処理では、介在面と側壁面の研磨を同時に行う。
この第2処理を行うとき、研磨ブラシは側壁面に接触するので側壁面も研磨される。しかし、第1処理によってすでに側壁面は研磨されているので、第2処理では、側壁面の表面粗さは維持した状態で研磨することがより好ましい。なお、第2処理において、側壁面がさらに表面粗さが向上するように研磨してもよいなお、介在面の研磨を行うように、研磨ブラシをガラス基板に近づけて研磨をするので、介在面の研磨残しを防止することができる。
以下、本実施形態の磁気ディスク用ガラス基板の製造方法を詳細に説明する。
For example, end polishing is performed using one polishing brush. At this time, the portion that can be efficiently polished with the polishing brush is the tip of the brush hair of the polishing brush. The abdominal part, which is an intermediate part between the hair tip part and the hair base part, cannot be polished efficiently. Therefore, the side wall surface is polished (first treatment) by fixing the polishing brush at a position where the bristle portion that efficiently polishes contacts the side wall surface and slightly bends. Thereafter, the position of the polishing brush is moved to a position where the bristle portion is in contact with the intervening surface and slightly bent, and the interpolated surface is polished (second processing). That is, in the second treatment, the interposition surface and the side wall surface are polished simultaneously.
When this second treatment is performed, the polishing brush contacts the side wall surface, so that the side wall surface is also polished. However, since the side wall surface has already been polished by the first treatment, it is more preferable that the second treatment is polished while maintaining the surface roughness of the side wall surface. In the second treatment, the side wall surface may be polished so that the surface roughness is further improved. Since the polishing brush is brought close to the glass substrate so as to polish the interposed surface, the interposed surface The polishing residue can be prevented.
Hereinafter, the manufacturing method of the glass substrate for magnetic disks of this embodiment is demonstrated in detail.

本実施形態の磁気ディスク用ガラス基板の製造方法の一例を以下説明する。
先ず、一対の主表面を有する板状の磁気ディスク用ガラス基板の素材となるガラスブランクを成形する。次に、このガラスブランクを適宜加工して、中心部分に円孔が形成され、端面(内周側端面および外周側端面の少なくとも一方)が面取り加工された円盤形状のガラス基板を作製する。この後、端面研磨処理および主表面研磨処理を行う。端面研磨処理、主表面研磨処理は、必要に応じて、複数の処理に分けて行ってもよい。また、主表面研磨処理の前にガラス基板の主表面や端面の研削処理を行ってもよい。このとき各処理の順序は適宜決定してよい。
以下、各処理について、説明する。
An example of a method for producing the magnetic disk glass substrate of the present embodiment will be described below.
First, a glass blank as a material for a plate-like glass substrate for a magnetic disk having a pair of main surfaces is formed. Next, the glass blank is appropriately processed to produce a disk-shaped glass substrate in which a circular hole is formed in the center portion and the end face (at least one of the inner peripheral end face and the outer peripheral end face) is chamfered. Thereafter, end face polishing and main surface polishing are performed. The end surface polishing process and the main surface polishing process may be performed in a plurality of processes as necessary. Moreover, you may perform the grinding process of the main surface and end surface of a glass substrate before a main surface polishing process. At this time, the order of each process may be determined as appropriate.
Hereinafter, each process will be described.

(a)ガラスブランク成形処理
ガラスブランクの成形では、例えばフロート法の他に、例えばプレス成形法を用いることもできる。さらに、ダウンドロー法、リドロー法、フュージョン法などの公知の製造方法を用いて製造することができる。これらの公知の製造方法で作られた板状ガラスに対し、適宜形状加工を行うことによって磁気ディスク用ガラス基板の元となる円板状のガラスブランクが切り出される。
(A) Glass blank forming treatment In forming the glass blank, for example, a press forming method can be used in addition to the float method. Furthermore, it can manufacture using well-known manufacturing methods, such as a downdraw method, a redraw method, and a fusion method. A disk-shaped glass blank serving as a base of the magnetic disk glass substrate is cut out by appropriately performing shape processing on the plate-shaped glass produced by these known manufacturing methods.

(b)形状加工処理
次に、形状加工処理が行われる。形状加工処理では、ガラスブランク成形処理後、公知の加工方法を用いて円孔を形成することにより、円孔があいた円盤形状のガラス基板を得る。その後、さらに面取りを実施する。これにより、ガラス基板の端面には、主表面と直交している側壁面と、側壁面と主表面を繋ぐ介在面(面取面)が形成される。
(B) Shape processing processing Next, shape processing processing is performed. In the shape processing, a disk-shaped glass substrate having a circular hole is obtained by forming a circular hole using a known processing method after the glass blank forming process. Thereafter, further chamfering is performed. Thereby, the side wall surface orthogonal to the main surface and the interposition surface (chamfering surface) connecting the side wall surface and the main surface are formed on the end surface of the glass substrate.

(c)端面研磨処理
次にガラス基板の端面研磨処理が行われる。端面研磨処理は、研磨ブラシとガラス基板の端面との間に遊離砥粒を含む研磨液を供給して研磨ブラシとガラス基板とを相対的に移動させることにより研磨を行う処理である。端面研磨では、ガラス基板の内周側端面及び外周側端面が鏡面状態になる。このとき、酸化セリウム等の微粒子を遊離砥粒として含むスラリーが用いられる。端面研磨を行うことにより、ガラス基板の端面での塵等の異物粒子が付着した汚染、ダメージあるいはキズ等の損傷の除去を行うことができる。これにより、このガラス基板を用いて磁気ディスクを製造した場合であっても、サーマルアスペリティの発生を防止することができる。また、ナトリウムおよび/またはカリウム等のコロージョンの原因となるイオン析出の発生を防止することができる観点からは、少なくとも側壁面および介在面の表面粗さ(最大高さ:Rz)が0.15μm以下となるように研磨することが好ましく、0.10μm以下となるように研磨することがより好ましい。また、上記観点においては、少なくとも側壁面の表面粗さ(Ra)が、0.015μm以下であることが好ましく0.010μm以下であることがより好ましい。なお、上記粗さは触針計(測長距離:板厚方向に0.25mm)を用いて測定したものである。端面研磨処理については、後述する。
(C) End surface polishing treatment Next, an end surface polishing treatment of the glass substrate is performed. The end surface polishing process is a process for performing polishing by supplying a polishing liquid containing loose abrasive grains between the polishing brush and the end surface of the glass substrate and relatively moving the polishing brush and the glass substrate. In the end surface polishing, the inner peripheral side end surface and the outer peripheral side end surface of the glass substrate are in a mirror state. At this time, a slurry containing fine particles such as cerium oxide as free abrasive grains is used. By performing the end surface polishing, it is possible to remove contamination such as dust, foreign matter particles such as dust on the end surface of the glass substrate, damage, or scratches. Thereby, even if it is a case where a magnetic disc is manufactured using this glass substrate, generation | occurrence | production of thermal asperity can be prevented. Further, from the viewpoint of preventing the occurrence of ion precipitation that causes corrosion such as sodium and / or potassium, at least the surface roughness (maximum height: Rz) of the side wall surface and the interposed surface is 0.15 μm or less. It is preferable to polish so as to become 0.10, more preferably 0.10 μm or less. Moreover, in the said viewpoint, it is preferable that the surface roughness (Ra) of at least a side wall surface is 0.015 micrometer or less, and it is more preferable that it is 0.010 micrometer or less. The roughness is measured using a stylus meter (measurement distance: 0.25 mm in the plate thickness direction). The end face polishing process will be described later.

(d)第1研磨処理
次に、ガラス基板の主表面に第1研磨処理が施される。具体的には、ガラス基板を、両面研磨装置に装着される保持部材(キャリア)に設けられた保持孔内に保持しながらガラス基板の両側の主表面の研磨が行われる。なお、表面粗さについてさらに低減したり、より精密な調整を行うために、第1研磨処理を複数の研磨処理に分けて実施してもよい。
(D) First polishing treatment Next, a first polishing treatment is performed on the main surface of the glass substrate. Specifically, the main surfaces on both sides of the glass substrate are polished while holding the glass substrate in a holding hole provided in a holding member (carrier) attached to the double-side polishing apparatus. In addition, in order to further reduce the surface roughness or perform more precise adjustment, the first polishing process may be divided into a plurality of polishing processes.

(e)化学強化処理
ガラス基板は適宜化学強化することができる。化学強化液として、例えば硝酸カリウム,硝酸ナトリウム、またはそれらの混合物を加熱して得られる溶融液を用いることができる。そして、ガラス基板を化学強化液に浸漬することによって、ガラス基板の表層にあるガラス組成中のリチウムイオンやナトリウムイオンが、それぞれ化学強化液中のイオン半径が相対的に大きいナトリウムイオンやカリウムイオンにそれぞれ置換されることで表層部分に圧縮応力層が形成され、ガラス基板が強化される。
化学強化処理を行うタイミングは、適宜決定することができるが、化学強化処理の後に研磨処理を行うようにすると、表面の平滑化とともに化学強化処理によってガラス基板の表面に固着した異物を取り除くことができるので特に好ましい。
(E) Chemical strengthening treatment The glass substrate can be appropriately chemically strengthened. As the chemical strengthening liquid, for example, a molten liquid obtained by heating potassium nitrate, sodium nitrate, or a mixture thereof can be used. Then, by immersing the glass substrate in the chemical strengthening solution, lithium ions and sodium ions in the glass composition on the surface of the glass substrate are converted into sodium ions and potassium ions having relatively large ion radii in the chemical strengthening solution, respectively. By replacing each, a compressive stress layer is formed in the surface layer portion, and the glass substrate is strengthened.
The timing of performing the chemical strengthening treatment can be determined as appropriate. However, if the polishing treatment is performed after the chemical strengthening treatment, the foreign matter fixed to the surface of the glass substrate by the chemical strengthening treatment can be removed together with the smoothing of the surface. This is particularly preferable because it can be performed.

(f)第2研磨(最終研磨)処理
次に、化学強化処理後のガラス基板に第2研磨処理が施される。第2研磨においても、第1研磨に用いる両面研磨装置と同様の構成を有する両面研磨装置が用いられる。第2研磨の後、ガラス基板は洗浄され、磁気ディスク用ガラス基板が作製される。
(F) Second Polishing (Final Polishing) Process Next, a second polishing process is performed on the glass substrate after the chemical strengthening process. Also in the second polishing, a double-side polishing apparatus having the same configuration as the double-side polishing apparatus used for the first polishing is used. After the second polishing, the glass substrate is washed to produce a magnetic disk glass substrate.

(端面研磨処理)
ここで本発明にかかる端面研磨処理についてより詳細に説明する。端面研磨処理は、側壁面の研磨を行う第1処理と、この第1処理後に、側壁面の表面粗さを維持した状態で、介在面の研磨を行う第2処理と、を含む。第1処理及び第2処理では、多数積層されたガラス基板の端面と研磨ブラシとの間に遊離砥粒を含む研磨液を供給する。研磨液の供給手段としては、シャワーによる吹き付け、あるいは複数の研磨液供給ノズルより研磨液を噴出する態様が挙げられる。また、研磨液中にガラス基板の積層体と研磨ブラシを浸し、研磨液中で端面研磨をしてもよい。
遊離砥粒としては、酸化セリウム、酸化鉄、酸化マグネシウム、酸化ジルコニウム、酸化マンガン等の研磨剤を用いることができるが、特に、加工速度が速い観点では、酸化セリウムを用いるのが好ましい。研磨液の温度は、例えば25℃〜40℃程度が好ましい。また、研磨液をガラス基板の積層体に対して噴きかけて供給する場合、供給時点での温度と、ガラス基板の積層体と研磨ブラシとの間に供給された端面が研磨された後の研磨液の温度との差、換言すると、研磨装置へ供給される時点での研磨液の温度と、研磨装置から排出される研磨液の温度との差は、5度以下が好ましく、3度以下がより好ましく、1度以下が特に好ましい。上記条件で端面研磨を行うことで、積層体を構成している個々のガラス基板間の端面品質(表面あらさ)のバラツキを低減させることができる。
(End face polishing treatment)
Here, the end surface polishing treatment according to the present invention will be described in more detail. The end surface polishing process includes a first process for polishing the side wall surface and a second process for polishing the intervening surface in a state where the surface roughness of the side wall surface is maintained after the first process. In the first process and the second process, a polishing liquid containing loose abrasive grains is supplied between the end surface of the glass substrate laminated in large numbers and the polishing brush. Examples of the means for supplying the polishing liquid include spraying with a shower or a mode in which the polishing liquid is ejected from a plurality of polishing liquid supply nozzles. Further, the laminated body of the glass substrate and the polishing brush may be immersed in the polishing liquid, and end face polishing may be performed in the polishing liquid.
Abrasives such as cerium oxide, iron oxide, magnesium oxide, zirconium oxide, and manganese oxide can be used as the free abrasive grains. In particular, cerium oxide is preferably used from the viewpoint of high processing speed. The temperature of the polishing liquid is preferably about 25 ° C. to 40 ° C., for example. In addition, when the polishing liquid is supplied by spraying onto the glass substrate laminate, the polishing is performed after the temperature at the time of supply and the end surface supplied between the glass substrate laminate and the polishing brush are polished. The difference between the temperature of the liquid and, in other words, the difference between the temperature of the polishing liquid when supplied to the polishing apparatus and the temperature of the polishing liquid discharged from the polishing apparatus is preferably 5 degrees or less, preferably 3 degrees or less. More preferred is 1 degree or less. By performing end face polishing under the above conditions, variations in end face quality (surface roughness) between individual glass substrates constituting the laminate can be reduced.

図1(a)は、円盤形状のガラス基板10の内周端面を、研磨ブラシ12を用いて研磨する状態を示す図である。図2は、ガラス基板の研磨を、拡大して説明する図である。図2では、符号10aは介在面を、符号10bは側壁面を示している。端面研磨処理を行う場合、複数のガラス基板を、介在部材14(スペーサー)を挟んで積層し、積層して得られたガラス基板の積層体を研磨ブラシ12で纏めて研磨する。研磨ブラシ12は、中心軸12aと、中心軸12aから径方向外側に直線状に延びる、密に植毛したブラシ毛12bとを含むものであってもよく、また、中心軸12aに対してブラシ毛12bを螺旋状に巻きつけたものであってもよい。   FIG. 1A is a diagram showing a state in which the inner peripheral end surface of the disk-shaped glass substrate 10 is polished using a polishing brush 12. FIG. 2 is an enlarged view for explaining the polishing of the glass substrate. In FIG. 2, the code | symbol 10a has shown the interposition surface, and the code | symbol 10b has shown the side wall surface. When the end surface polishing treatment is performed, a plurality of glass substrates are stacked with the intervening member 14 (spacer) interposed therebetween, and the stacked body of the glass substrates obtained by stacking is polished together with the polishing brush 12. The polishing brush 12 may include a central shaft 12a and brush hairs 12b that are closely planted and extend linearly outward from the central shaft 12a. 12b may be spirally wound.

ガラス基板10の積層体は、それぞれのガラス基板10の相対位置が変化しないように保持具で保持されている。そして、保持具は、図示されない駆動モータの回転軸に接続されている。したがってガラス基板10の積層体は、駆動モータの回転に従って回転する。また、研磨ブラシ12の中心軸12aは、図示されない積層体を回転させる駆動モータとは別の駆動モータの回転軸に接続されている。したがって、研磨ブラシ12aは、この駆動モータの回転に従って回転する。こうして、ガラス基板10と研磨ブラシ12との間の相対的な移動によってガラス基板10の端面が研磨される。ガラス基板10の積層体の回転方向と研磨ブラシ12の回転方向は同じであってもよいし、異なってもよい。
ここで、第1処理は、側壁面を研磨する。第1処理は、側壁面の表面粗さの算術平均粗さRa(JIS B 0601:2001)が0.015μmm以下になるように研磨することが好ましく、0.010μm以下になるようにすることがより好ましい。また、第1処理は、側壁面の表面粗さ(最大高さ:Rz)が0.15μm以下となるように研磨することが好ましく、0.10μm以下となるように研磨することがより好ましい。
第2処理は、第1処理後の側壁面の表面粗さ、例えばRaを維持しつつ、介在面の表面粗さの算術平均粗さRaが0.015μm以下になるように研磨することが好ましく、0.010μm以下になるようにすることがより好ましい。また、第2処理は、第1処理後の側壁面の表面粗さ、例えばRzを維持しつつ、介在面の表面粗さ(最大高さ:Rz)が0.15μm以下となるように研磨することが好ましく、0.10μm以下となるように研磨することがより好ましい。
なお、上記側壁面の表面粗さは触針計(測長距離:板厚方向に0.25mm)を用いて測定したものである。一方介在面の表面粗さについても上記触針計(測長距離:円周方向に0.25mm)を用いて測定したものである。
第1処理では、研磨ブラシ12の毛先が側壁面に当接するように位置決めして研磨を行う。なお、毛先がやや撓む程度の位置に研磨ブラシ12を位置決めしてもよい。
The laminated body of the glass substrate 10 is hold | maintained with the holder so that the relative position of each glass substrate 10 may not change. And the holder is connected to the rotating shaft of the drive motor which is not illustrated. Therefore, the laminated body of the glass substrate 10 rotates according to rotation of a drive motor. Further, the central shaft 12a of the polishing brush 12 is connected to a rotation shaft of a drive motor different from the drive motor that rotates a laminate (not shown). Therefore, the polishing brush 12a rotates according to the rotation of the drive motor. In this way, the end surface of the glass substrate 10 is polished by the relative movement between the glass substrate 10 and the polishing brush 12. The rotation direction of the laminated body of the glass substrate 10 and the rotation direction of the polishing brush 12 may be the same or different.
Here, the first treatment polishes the side wall surface. In the first treatment, polishing is preferably performed so that the arithmetic mean roughness Ra (JIS B 0601: 2001) of the surface roughness of the side wall surface is 0.015 μm or less, and 0.010 μm or less. More preferred. In the first treatment, polishing is preferably performed so that the surface roughness (maximum height: Rz) of the side wall surface is 0.15 μm or less, and more preferably 0.10 μm or less.
The second treatment is preferably polished so that the arithmetic mean roughness Ra of the surface roughness of the interposition surface is 0.015 μm or less while maintaining the surface roughness of the side wall surface after the first treatment, for example, Ra. More preferably, the thickness is 0.010 μm or less. In the second treatment, the surface roughness (maximum height: Rz) of the intervening surface is polished to 0.15 μm or less while maintaining the surface roughness of the side wall surface after the first treatment, for example, Rz. Preferably, polishing is performed so that the thickness is 0.10 μm or less.
The surface roughness of the side wall surface was measured using a stylus meter (measurement distance: 0.25 mm in the plate thickness direction). On the other hand, the surface roughness of the intervening surface was also measured using the stylus meter (measurement distance: 0.25 mm in the circumferential direction).
In the first treatment, polishing is performed by positioning so that the tip of the polishing brush 12 contacts the side wall surface. Note that the polishing brush 12 may be positioned at a position where the bristles are slightly bent.

第2処理では、研磨ブラシ12の位置を、第1処理における研磨ブラシ12の位置に比べて、介在面に近い位置に移動して研磨を行う。このとき、研磨ブラシ12の毛先が介在面に当接するように位置決めして研磨を行う。なお、毛先がやや撓む程度の位置に研磨ブラシ12を位置決めしてもよい。   In the second process, polishing is performed by moving the position of the polishing brush 12 to a position closer to the intervening surface as compared with the position of the polishing brush 12 in the first process. At this time, the polishing is performed by positioning so that the tip of the polishing brush 12 contacts the intervening surface. Note that the polishing brush 12 may be positioned at a position where the bristles are slightly bent.

図3は、端面研磨処理における、研磨ブラシ12の中心軸12aから側壁面までの距離Lの時間的変化の一例を示す図である。
まず、端面研磨処理では、研磨ブラシ12の距離Lを距離L1に固定して時間0から時間T1まで研磨する。この距離L1は、研磨ブラシ12の毛先が側壁面に当接する距離である。したがって、距離Lを距離L1に固定して時間T1まで研磨する処理が第1処理である。次に、研磨ブラシ12の距離Lを距離L1から距離L2に移動し固定して時間T1から時間T2まで研磨する。この距離L2は、研磨ブラシ12の毛先が介在面に当接する距離である。したがって、距離Lを距離L2(距離L1>距離L2)に固定して時間T2まで研磨する処理が第2処理である。このときの研磨時間T1と研磨時間(T2−T1)は、ガラス基板10の介在面と側壁面との表面粗さ(Rz)がそれぞれ0.15μm以下となり、かつ、介在面と側壁面との表面粗さ(Rz)の差が小さくなる、具体的には、上記差が0.05μm以内となるように適宜設定すればよい。
なお、上記の説明では、距離L2と距離L1とをそれぞれ固定して研磨する構成を説明したが、ガラス基板10の介在面と側壁面との表面粗さ(最大高さ:Rz)がそれぞれ0.15μm以下となり、かつ、介在面と側壁面との表面粗さ(Rz)の差が0.05μm以内となるように、距離L2から距離L1までの間を時間経過とともに連続的または断続的に移動させて研磨する構成としてもよい。
これにより、このガラス基板10を用いて磁気ディスクとした際に、介在面および側壁面からの発塵を抑制することができる。
FIG. 3 is a diagram illustrating an example of a temporal change in the distance L from the central axis 12a of the polishing brush 12 to the side wall surface in the end surface polishing process.
First, in the end surface polishing treatment, the distance L of the polishing brush 12 is fixed to the distance L 1 and polishing is performed from time 0 to time T 1 . This distance L 1 is a distance at which the tip of the polishing brush 12 contacts the side wall surface. Therefore, the first process is a process in which the distance L is fixed to the distance L 1 and the polishing is performed until the time T 1 . Next, the distance L of the polishing brush 12 is moved from the distance L 1 to the distance L 2 and fixed, and polishing is performed from time T 1 to time T 2 . This distance L 2 is, bristle tips of the polishing brush 12 is the distance in contact with the intervening surface. Accordingly, the second process is a process in which the distance L is fixed to the distance L 2 (distance L 1 > distance L 2 ) and the polishing is performed until the time T 2 . The polishing time T 1 and the polishing time (T 2 -T 1 ) at this time are such that the surface roughness (Rz) between the interposed surface and the side wall surface of the glass substrate 10 is 0.15 μm or less, and the interposed surface and side What is necessary is just to set suitably so that the difference of the surface roughness (Rz) with a wall surface may become small, specifically, the said difference will be less than 0.05 micrometer.
In the above description, the structure in which the distance L 2 and the distance L 1 are fixed and polished is described, but the surface roughness (maximum height: Rz) between the interposition surface and the side wall surface of the glass substrate 10 is described. each becomes 0.15μm or less, and, as the difference in surface roughness between the intervening surface and the side wall surface (Rz) is within 0.05 .mu.m, continuously over time between the distance L 2 to a distance L 1 Or it is good also as a structure which moves by grinding | polishing intermittently.
Thereby, when this glass substrate 10 is used as a magnetic disk, dust generation from the intervening surface and the side wall surface can be suppressed.

このように、第1処理及び第2処理で用いる研磨ブラシ12は同じブラシを用いるので、ブラシ毛の長さは位置によらず同じ長さである。したがって、長いブラシ毛と短いブラシ毛を有する研磨ブラシを用いた場合のように、長いブラシ毛が早く摩耗することはないので、長期間安定し研磨ブラシを使用することができる。また、介在面の研磨及び側壁面の研磨を場所に拠らず均一かつ効率よく研磨するために、研磨ブラシ12をガラス基板10の厚さ方向に移動させることが好ましい。このような研磨ブラシ12の移動により、ブラシ毛の長さが同じである研磨ブラシ12を用いることで、均一かつ効率のよい研磨が可能になる。毛の長いブラシ毛と毛の短いブラシ毛を有する研磨ブラシを用いた場合、ブラシ毛の長短により、均一かつ効率よく研磨することはできない。長いブラシ毛がガラス基板の端面に当接する場合、短いブラシ毛は端面に当接しない。短いブラシ毛の端面を当接させる場合、長いブラシ毛の中間部分である腹部分が当接するので、側壁面に線状のキズを形成し易い。この点で、ブラシ毛の長さがいずれの位置においても同じである研磨ブラシを用いることが好ましい。   Thus, since the same brush is used for the polishing brush 12 used in the first process and the second process, the length of the bristle is the same regardless of the position. Therefore, unlike the case of using a polishing brush having long brush hairs and short brush hairs, long brush hairs do not wear quickly, so that the polishing brush can be used stably for a long period of time. Further, it is preferable to move the polishing brush 12 in the thickness direction of the glass substrate 10 in order to polish the intervening surface and the side wall surface uniformly and efficiently regardless of the location. By such movement of the polishing brush 12, uniform and efficient polishing is possible by using the polishing brush 12 having the same bristle length. When a polishing brush having long bristles and short bristles is used, it cannot be uniformly and efficiently polished due to the length of the bristles. When long brush bristles contact the end surface of the glass substrate, short brush hairs do not contact the end surface. When the end surfaces of the short brush hairs are brought into contact with each other, the abdominal portion that is an intermediate portion of the long brush hairs comes into contact with each other, so that a linear scratch is easily formed on the side wall surface. In this regard, it is preferable to use a polishing brush having the same bristle length at any position.

また、介在面を、ガラス基板10の主表面と接続する最も窪んだ部分に位置する介在面であるディープ介在面(第1面)と、このディープ介在面に比べて側壁面に近く、側壁面に接続する、奥行きの浅い部分に位置する介在面であるシャロウ介在面(第2面)とに分けたとき、第2処理は、シャロウ介在面を主として研磨する第3処理と、第3処理後に、研磨ブラシ12の位置を、第3処理における研磨ブラシ12の位置に比べて、介在面に近い位置に移動してディープ介在面を主として研磨する第4処理と、を含んでもよい。すなわち、シャロウ介在面を研磨した後、ディープ介在面を研磨することにより、より確実に介在面の研磨残しを抑制することができる。   Moreover, the interposition surface is closer to the side wall surface than the deep interposition surface (first surface), which is the interposition surface located in the most recessed portion connected to the main surface of the glass substrate 10, and the side wall surface. The second process includes a third process for mainly polishing the shallow intervening surface, and a third process after the third process. The fourth process of moving the position of the polishing brush 12 to a position closer to the intervening surface as compared with the position of the polishing brush 12 in the third process to mainly polish the deep intervening surface may be included. That is, by polishing the shallow intervening surface after polishing the shallow intervening surface, it is possible to more reliably suppress the polishing residue of the intervening surface.

なお、上記の説明では、ガラス基板10の内周側端面を研磨する構成について説明したが、図1(b)に示すように、研磨ブラシを用いて外周側端面を研磨する構成についても本発明を適用することができる。
また、上記の説明では、研磨ブラシとガラス基板10の積層体の相対距離を変化させてガラス基板10の側壁面および介在面の両方を研磨する構成について説明したが、介在面および側壁面の表面粗さを良好にし、かつ、介在面の研磨残しがないように研磨する方法としては、上記以外の方法を用いてもよい。
例えば、外周側端面の研磨において、側壁面を主として研磨する第1処理と、介在面を主として研磨する第2処理とで、研磨砥粒の砥粒径を変化させてもよい。具体的には、側壁面を研磨する際には、第2処理と比べて砥粒径の大きなスラリーを用い、このスラリーを側壁面に供給して研磨し、介在面を研磨する際には、第1処理と比べて砥粒径の小さなスラリーを用いて、このスラリーを介在面に供給して研磨するようにしてもよい。
また、研磨ブラシとガラス基板10の積層体の相対距離を変化させる構成に加えて、第1処理と第2処理とでガラス基板と研磨ブラシとの相対速度(回転数)を変えてもよい。例えば、第2処理を第1処理に比べて高速で回転させ、第1処理を第2処理に比べて低速で回転するようにして側壁面および介在面を研磨してもよい。
In the above description, the configuration for polishing the inner peripheral side end surface of the glass substrate 10 has been described. However, as shown in FIG. 1B, the configuration for polishing the outer peripheral side end surface using a polishing brush is also disclosed. Can be applied.
In the above description, the configuration in which the relative distance between the polishing brush and the laminate of the glass substrate 10 is changed to polish both the side wall surface and the interposed surface of the glass substrate 10 has been described. A method other than the above may be used as a method for polishing so as to improve the roughness and not leave any polishing residue on the intervening surface.
For example, in the polishing of the outer peripheral side end face, the abrasive grain size of the polishing abrasive grains may be changed between a first process in which the side wall surface is mainly polished and a second process in which the intervening surface is mainly polished. Specifically, when polishing the side wall surface, using a slurry having a larger abrasive particle size than the second treatment, supplying this slurry to the side wall surface for polishing, and polishing the intervening surface, A slurry having a smaller abrasive particle size than that in the first treatment may be used, and this slurry may be supplied to the intervening surface for polishing.
Moreover, in addition to the structure which changes the relative distance of the laminated body of a grinding | polishing brush and the glass substrate 10, you may change the relative speed (rotation speed) of a glass substrate and a grinding | polishing brush by a 1st process and a 2nd process. For example, the side wall surface and the interposed surface may be polished by rotating the second process at a higher speed than the first process and rotating the first process at a lower speed than the second process.

[実験例]
本実施形態の効果を確認するために、3つの異なる研磨方法(実施例、従来例、比較例)によりガラス基板の端面研磨を行った。
端面研磨対象のガラス基板には、外径65mm、厚さ0.8mmの円盤形状のガラス基板を用いた。ガラス基板は、100枚を積層して積層体としたものを端面研磨することを1バッチとし、10バッチの間、上記研磨ブラシを変更することなく端面研磨を行った。後述する実施例、従来例、比較例では、回転軸からの長さが同じであるブラシ毛で構成された研磨ブラシを用いた。遊離砥粒としては、酸化セリウムを用いた。ガラス基板の積層体は、遊離砥粒を含んだスラリーの液中に浸した。研磨ブラシの回転速方向と、ガラス基板の回転方向とが互いに逆方向になるように回転させて端面研磨を行った。
[Experimental example]
In order to confirm the effect of this embodiment, the end surface of the glass substrate was polished by three different polishing methods (Example, Conventional example, Comparative example).
A disk-shaped glass substrate having an outer diameter of 65 mm and a thickness of 0.8 mm was used as the glass substrate to be polished. One batch of glass substrates was laminated by laminating 100 sheets to make a laminated body, and edge polishing was performed for 10 batches without changing the polishing brush. In the examples, conventional examples, and comparative examples described later, polishing brushes composed of brush hairs having the same length from the rotating shaft were used. Cerium oxide was used as the loose abrasive. The laminated body of the glass substrate was immersed in the slurry liquid containing free abrasive grains. End face polishing was performed by rotating the polishing brush so that the rotation speed direction and the rotation direction of the glass substrate were opposite to each other.

実施例では、図3に示すように、同じ長さのブラシ毛を有する研磨ブラシの回転軸とガラス基板との距離が変化するように端面研磨を行った。一方、従来例では、同じ長さのブラシ毛を有する研磨ブラシを用いて、研磨ブラシの回転軸とガラス基板との距離を一定に保ったまま、介在面と側壁面を同時に研磨した。なお、実施例、従来例について、それぞれ同じ時間となるように端面研磨を行った。
そして、実施例、従来例の研磨で得られた1バッチ100枚で10バッチ連続して端面研磨を行ったガラス基板の側壁面を顕微鏡観察により、介在面の研磨残しがあるか否かを調べた。研磨残しの有無は、顕微鏡観察において、介在面の表面凹凸が部分的に急激に大きくなる領域があるか否かにより判断した。
その結果、実施例の研磨で得られたガラス基板では、研磨残しが100枚中1枚もなかった。すなわち、研磨残しは1%未満であった。一方、従来例の研磨で得られたガラス基板では、研磨残しが100枚中5枚見つかった。すなわち、研磨残しは5%であった。
In the example, as shown in FIG. 3, end face polishing was performed so that the distance between the rotating shaft of the polishing brush having the same length of bristles and the glass substrate was changed. On the other hand, in the conventional example, using the polishing brush having the same length of bristle, the interposition surface and the side wall surface were simultaneously polished while keeping the distance between the rotating shaft of the polishing brush and the glass substrate constant. In addition, about the Example and the prior art example, the end surface grinding | polishing was performed so that it might become the same time, respectively.
Then, the side wall surface of the glass substrate that has been subjected to end surface polishing for 10 batches of 100 batches obtained by polishing of Examples and Conventional Examples is examined by microscopic observation to determine whether there is any residual polishing of the intervening surface. It was. Presence or absence of polishing residue was determined based on whether or not there was a region in which the surface irregularities of the intervening surface partly abruptly increased in the microscopic observation.
As a result, in the glass substrate obtained by the polishing of the example, there was no polishing residue out of 100 sheets. That is, the polishing residue was less than 1%. On the other hand, in the glass substrate obtained by the conventional polishing, 5 of the 100 unpolished residues were found. That is, the polishing residue was 5%.

さらに、実施例及び従来例の研磨で得られたガラス基板の介在面と側壁面との表面粗さ(Ra,Rz)を求めるとともに、1枚のガラス基板における介在面と側壁面との表面粗さ(Rz)の差および、10バッチ間での表面品質のバラツキを評価した。
実施例のガラス基板の場合には、介在面と側壁面との表面粗さ(Rz)の差を求めたところ、0.05μm以内であったが、従来例のガラス基板の場合、0.05μmを超えたものが見つかった。さらに、バッチ間のバラツキを調べたところ、従来例は、介在面および側壁面の表面粗さのバラツキが大きかった。
Further, the surface roughness (Ra, Rz) between the interposition surface and the side wall surface of the glass substrate obtained by the polishing of the example and the conventional example is obtained, and the surface roughness between the interposition surface and the side wall surface in one glass substrate is obtained. The difference in thickness (Rz) and the variation in surface quality between 10 batches were evaluated.
In the case of the glass substrate of the example, the difference in surface roughness (Rz) between the intervening surface and the side wall surface was determined to be within 0.05 μm, but in the case of the glass substrate of the conventional example, 0.05 μm Something beyond was found. Furthermore, when the variation between batches was examined, in the conventional example, the variation in the surface roughness of the interposition surface and the side wall surface was large.

さらに、比較例として、図4(a)に示すように、研磨ブラシの回転軸とガラス基板との距離Lが変化するように端面研磨を行った。すなわち、先に介在面を主に研磨した後、側壁面を主に研磨した。比較例において、介在面及び側壁面の研磨の順番を変えた以外は、実施例と同様の研削条件で行った。
実施例及び比較例の研磨により得られたガラス基板10枚の介在面と側壁面の接続部分の曲率半径を接続部分の断面を撮像して、接続部分の曲率半径を調べた。
その結果、実施例の研磨により得られたガラス基板の上記接続部分の曲率半径は、比較例の研磨により得られたガラス基板の上記接続部分の曲率半径に比べて大きかった。これより、比較例の研磨により得られたガラス基板は、第1研磨処理、化学強化処理及び第2研磨処理中にガラス基板の端面が外部の治具と衝突して、図4(b)に示すように介在面と側壁面の接続部分が部分的に欠損したガラス基板100となる虞が高い。これに対して、実施例の研磨により得られたガラス基板では、介在面と側壁面の接続部分の曲率半径が大きいので、接続部分が部分的に欠損し難い。
これより、本実施形態の効果は明らかである。
Further, as a comparative example, as shown in FIG. 4A, end face polishing was performed so that the distance L between the rotating shaft of the polishing brush and the glass substrate was changed. That is, after interpolating the surface first, the side wall surface was mainly polished. In the comparative example, the grinding conditions were the same as in the example except that the order of polishing the intervening surface and the side wall surface was changed.
The curvature radius of the connection portion between the intervening surface and the side wall surface of the 10 glass substrates obtained by polishing of the example and the comparative example was imaged from the cross section of the connection portion, and the curvature radius of the connection portion was examined.
As a result, the radius of curvature of the connecting portion of the glass substrate obtained by polishing of the example was larger than the radius of curvature of the connecting portion of the glass substrate obtained by polishing of the comparative example. As a result, the glass substrate obtained by the polishing of the comparative example has the end face of the glass substrate colliding with an external jig during the first polishing process, the chemical strengthening process, and the second polishing process, and FIG. As shown, there is a high risk of becoming a glass substrate 100 in which the connection portion between the interposition surface and the side wall surface is partially lost. On the other hand, in the glass substrate obtained by the polishing of the example, since the radius of curvature of the connecting portion between the interposition surface and the side wall surface is large, the connecting portion is hardly lost.
From this, the effect of this embodiment is clear.

以上、本発明の磁気ディスク用ガラス基板の製造方法について詳細に説明したが、本発明は上記実施形態及び実施例に限定されず、本発明の主旨を逸脱しない範囲において、種々の改良や変更をしてもよいのはもちろんである。   As mentioned above, although the manufacturing method of the glass substrate for magnetic discs of this invention was demonstrated in detail, this invention is not limited to the said embodiment and Example, In the range which does not deviate from the main point of this invention, various improvement and a change are carried out. Of course.

10、100 ガラス基板
10a 介在面
10b 側壁面
12 研磨ブラシ
12a 中心軸
12b ブラシ毛
14 介在部材
DESCRIPTION OF SYMBOLS 10, 100 Glass substrate 10a Interposition surface 10b Side wall surface 12 Polishing brush 12a Central axis 12b Brush hair 14 Interposition member

Claims (5)

中心に円孔を有する円盤状のガラス基板の端面に、研磨ブラシを押し当てて研磨する端面研磨処理を含む磁気ディスク用ガラス基板の製造方法であって、
前記ガラス基板の端面は、側壁面と、前記主表面と前記側壁面との間に介在する介在面と、を有し、
前記端面研磨処理は、前記研磨ブラシと前記ガラス基板の端面との間に遊離砥粒を含む研磨液を供給して前記研磨ブラシと前記ガラス基板とを相対的に移動させることにより研磨を行う処理であり、
前記端面研磨処理は、前記側壁面の研磨を行う第1処理と、
前記第1処理後に、前記側壁面と前記介在面の研磨を同時に行う第2処理と、を含むことを特徴とする磁気ディスク用ガラス基板の製造方法。
A method of manufacturing a glass substrate for a magnetic disk, including an end surface polishing process in which a polishing brush is pressed against an end surface of a disk-shaped glass substrate having a circular hole at the center,
The end surface of the glass substrate has a side wall surface, and an interposition surface interposed between the main surface and the side wall surface,
In the end surface polishing process, a polishing liquid containing loose abrasive grains is supplied between the polishing brush and the end surface of the glass substrate, and polishing is performed by relatively moving the polishing brush and the glass substrate. And
The end surface polishing process includes a first process for polishing the side wall surface;
A method of manufacturing a glass substrate for a magnetic disk, comprising: a second process for simultaneously polishing the side wall surface and the interposition surface after the first process.
前記第1処理は、前記側壁面の表面粗さRzが0.15μm以下になるように研磨し、
前記第2処理は、前記側壁面の表面粗さを維持しつつ、前記介在面の表面粗さRzが0.15μm以下になるように研磨する、請求項1に記載の磁気ディスク用ガラス基板の製造方法。
The first treatment is performed so that the surface roughness Rz of the side wall surface is 0.15 μm or less,
2. The glass substrate for a magnetic disk according to claim 1, wherein the second treatment is performed such that the surface roughness Rz of the interposition surface is 0.15 μm or less while maintaining the surface roughness of the side wall surface. Production method.
前記第1処理及び前記第2処理で用いる前記研磨ブラシのブラシ毛の長さは同じである、請求項1または2に記載の磁気ディスク用ガラス基板の製造方法。   The method for manufacturing a glass substrate for a magnetic disk according to claim 1 or 2, wherein the length of the bristles of the polishing brush used in the first process and the second process is the same. 前記第1処理及び前記第2処理では、研磨中、前記研磨ブラシを前記ガラス基板の厚さ方向に移動させる、請求項1〜3のいずれか1項に記載の磁気ディスク用ガラス基板の製造方法。   4. The method for manufacturing a glass substrate for a magnetic disk according to claim 1, wherein, in the first treatment and the second treatment, the polishing brush is moved in a thickness direction of the glass substrate during polishing. 5. . 前記第2処理では、前記研磨ブラシの位置を、前記第1処理における前記研磨ブラシの位置に比べて、前記介在面に近い位置に移動して研磨を行う、請求項1〜4のいずれか1項に記載の磁気ディスク用ガラス基板の製造方法。

5. The polishing according to claim 1, wherein the polishing is performed by moving the position of the polishing brush closer to the interposed surface than the position of the polishing brush in the first process. The manufacturing method of the glass substrate for magnetic discs as described in a term.

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100031A (en) * 2000-09-26 2002-04-05 Hoya Corp Glass substrate for magnetic recording medium and magnetic recording medium
JP2003506814A (en) * 1999-08-04 2003-02-18 コマッグ・インコーポレイテッド Method of manufacturing magnetic disk composed of glass substrate
JP2008200800A (en) * 2007-02-20 2008-09-04 Showa Denko Kk Polishing method for disc-like substrate and grinding device
JP2008273777A (en) * 2007-04-27 2008-11-13 Konica Minolta Opto Inc Method for polishing glass substrate for magnetic recording medium, glass substrate for magnetic recording medium, and polishing device for glass substrate for magnetic recording medium
JP2012074108A (en) * 2010-09-29 2012-04-12 Showa Denko Kk Manufacturing method of disk-like substrate, and spacer
WO2012090568A1 (en) * 2010-12-28 2012-07-05 コニカミノルタオプト株式会社 Method for manufacturing glass substrate for information recording medium, and information recording medium
JP2012142051A (en) * 2010-12-28 2012-07-26 Konica Minolta Advanced Layers Inc Manufacturing method of glass substrate for magnetic recording medium

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003506814A (en) * 1999-08-04 2003-02-18 コマッグ・インコーポレイテッド Method of manufacturing magnetic disk composed of glass substrate
JP2002100031A (en) * 2000-09-26 2002-04-05 Hoya Corp Glass substrate for magnetic recording medium and magnetic recording medium
JP2008200800A (en) * 2007-02-20 2008-09-04 Showa Denko Kk Polishing method for disc-like substrate and grinding device
JP2008273777A (en) * 2007-04-27 2008-11-13 Konica Minolta Opto Inc Method for polishing glass substrate for magnetic recording medium, glass substrate for magnetic recording medium, and polishing device for glass substrate for magnetic recording medium
JP2012074108A (en) * 2010-09-29 2012-04-12 Showa Denko Kk Manufacturing method of disk-like substrate, and spacer
WO2012090568A1 (en) * 2010-12-28 2012-07-05 コニカミノルタオプト株式会社 Method for manufacturing glass substrate for information recording medium, and information recording medium
JP2012142051A (en) * 2010-12-28 2012-07-26 Konica Minolta Advanced Layers Inc Manufacturing method of glass substrate for magnetic recording medium

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