JP2014179411A5 - - Google Patents

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Publication number
JP2014179411A5
JP2014179411A5 JP2013051537A JP2013051537A JP2014179411A5 JP 2014179411 A5 JP2014179411 A5 JP 2014179411A5 JP 2013051537 A JP2013051537 A JP 2013051537A JP 2013051537 A JP2013051537 A JP 2013051537A JP 2014179411 A5 JP2014179411 A5 JP 2014179411A5
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JP
Japan
Prior art keywords
metal layer
insulating substrate
connection pad
insulating
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013051537A
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English (en)
Japanese (ja)
Other versions
JP6082284B2 (ja
JP2014179411A (ja
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Publication date
Application filed filed Critical
Priority to JP2013051537A priority Critical patent/JP6082284B2/ja
Priority claimed from JP2013051537A external-priority patent/JP6082284B2/ja
Priority to US14/202,220 priority patent/US9204544B2/en
Publication of JP2014179411A publication Critical patent/JP2014179411A/ja
Publication of JP2014179411A5 publication Critical patent/JP2014179411A5/ja
Application granted granted Critical
Publication of JP6082284B2 publication Critical patent/JP6082284B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013051537A 2013-03-14 2013-03-14 配線基板及びその製造方法 Expired - Fee Related JP6082284B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013051537A JP6082284B2 (ja) 2013-03-14 2013-03-14 配線基板及びその製造方法
US14/202,220 US9204544B2 (en) 2013-03-14 2014-03-10 Wiring substrate and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013051537A JP6082284B2 (ja) 2013-03-14 2013-03-14 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014179411A JP2014179411A (ja) 2014-09-25
JP2014179411A5 true JP2014179411A5 (enrdf_load_stackoverflow) 2016-01-21
JP6082284B2 JP6082284B2 (ja) 2017-02-15

Family

ID=51522422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013051537A Expired - Fee Related JP6082284B2 (ja) 2013-03-14 2013-03-14 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US9204544B2 (enrdf_load_stackoverflow)
JP (1) JP6082284B2 (enrdf_load_stackoverflow)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4942400A (en) * 1990-02-09 1990-07-17 General Electric Company Analog to digital converter with multilayer printed circuit mounting
JP3014503B2 (ja) * 1991-08-05 2000-02-28 日本特殊陶業株式会社 集積回路用パッケージ
JP2002289998A (ja) * 2001-03-23 2002-10-04 Citizen Watch Co Ltd 回路基板とその製造方法
US6828513B2 (en) * 2002-04-30 2004-12-07 Texas Instruments Incorporated Electrical connector pad assembly for printed circuit board
JP2004273480A (ja) * 2003-03-05 2004-09-30 Sony Corp 配線基板およびその製造方法および半導体装置
US7583513B2 (en) * 2003-09-23 2009-09-01 Intel Corporation Apparatus for providing an integrated printed circuit board registration coupon
JP4654942B2 (ja) * 2006-02-28 2011-03-23 ミネベア株式会社 面状照明装置
JP5344667B2 (ja) 2007-12-18 2013-11-20 太陽誘電株式会社 回路基板およびその製造方法並びに回路モジュール
JP5385682B2 (ja) * 2009-05-19 2014-01-08 新光電気工業株式会社 電子部品の実装構造
JP2011014612A (ja) * 2009-06-30 2011-01-20 Ibiden Co Ltd 配線基板及び配線基板の製造方法
JP2011151185A (ja) * 2010-01-21 2011-08-04 Shinko Electric Ind Co Ltd 配線基板及び半導体装置
US8870579B1 (en) * 2011-01-14 2014-10-28 Paricon Technologies Corporation Thermally and electrically enhanced elastomeric conductive materials

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