JP2014174169A5 - - Google Patents

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Publication number
JP2014174169A5
JP2014174169A5 JP2014042269A JP2014042269A JP2014174169A5 JP 2014174169 A5 JP2014174169 A5 JP 2014174169A5 JP 2014042269 A JP2014042269 A JP 2014042269A JP 2014042269 A JP2014042269 A JP 2014042269A JP 2014174169 A5 JP2014174169 A5 JP 2014174169A5
Authority
JP
Japan
Prior art keywords
diaphragm
circular substrate
pressure transducer
protrusion
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014042269A
Other languages
English (en)
Japanese (ja)
Other versions
JP6203082B2 (ja
JP2014174169A (ja
Filing date
Publication date
Priority claimed from US13/788,255 external-priority patent/US9146164B2/en
Application filed filed Critical
Publication of JP2014174169A publication Critical patent/JP2014174169A/ja
Publication of JP2014174169A5 publication Critical patent/JP2014174169A5/ja
Application granted granted Critical
Publication of JP6203082B2 publication Critical patent/JP6203082B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014042269A 2013-03-07 2014-03-05 自己整合特徴を有する圧力トランスデューサ基板 Expired - Fee Related JP6203082B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/788,255 2013-03-07
US13/788,255 US9146164B2 (en) 2013-03-07 2013-03-07 Pressure transducer substrate with self alignment feature

Publications (3)

Publication Number Publication Date
JP2014174169A JP2014174169A (ja) 2014-09-22
JP2014174169A5 true JP2014174169A5 (OSRAM) 2017-03-30
JP6203082B2 JP6203082B2 (ja) 2017-09-27

Family

ID=50231072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014042269A Expired - Fee Related JP6203082B2 (ja) 2013-03-07 2014-03-05 自己整合特徴を有する圧力トランスデューサ基板

Country Status (5)

Country Link
US (1) US9146164B2 (OSRAM)
EP (2) EP2781902A1 (OSRAM)
JP (1) JP6203082B2 (OSRAM)
KR (1) KR102038156B1 (OSRAM)
CN (1) CN104034475B (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016095284A (ja) * 2014-11-17 2016-05-26 セイコーエプソン株式会社 電子デバイス、物理量センサー、圧力センサー、高度計、電子機器および移動体
EP3671161B1 (de) * 2018-12-21 2025-01-29 Exentis Knowledge GmbH Formkörper sowie verfahren zur herstellung eines formkörpers
EP3671160B1 (de) 2018-12-21 2024-07-31 Exentis Knowledge GmbH Formkörper sowie verfahren zur herstellung eines formkörpers
EP3671159B1 (de) 2018-12-21 2022-12-21 Exentis Knowledge GmbH Körper hergestellt durch additives herstellungsverfahren und verfahren zur herstellung des körpers
EP3671162B1 (de) * 2018-12-21 2024-01-31 Exentis Knowledge GmbH Formkörper sowie verfahren zur herstellung eines formkörpers
CN209326840U (zh) 2018-12-27 2019-08-30 热敏碟公司 压力传感器及压力变送器
TWI705236B (zh) * 2019-06-28 2020-09-21 欽瑞工業股份有限公司 膜片式壓力錶之組裝結構

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GB971521A (en) * 1962-06-27 1964-09-30 James Robertson Greer Improvements in pressure transducers
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JPS59134034U (ja) * 1983-02-25 1984-09-07 三洋電機株式会社 圧力センサ
EP0381775B1 (en) * 1988-07-26 1994-11-23 Hitachi Construction Machinery Co., Ltd. Pressure sensor
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US5448444A (en) * 1994-01-28 1995-09-05 United Technologies Corporation Capacitive pressure sensor having a reduced area dielectric spacer
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JP2812309B2 (ja) * 1996-07-23 1998-10-22 日本電気株式会社 板状振動体及び板状振動体を用いた送波器
US5880371A (en) * 1997-01-27 1999-03-09 Texas Instruments Incorporated Pressure transducer apparatus and method for making
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ATE485685T1 (de) * 2006-06-08 2010-11-15 Nxp Bv Akustische vorrichtung und deren herstellungsverfahren
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US7383737B1 (en) * 2007-03-29 2008-06-10 Delphi Technologies, Inc Capacitive pressure sensor
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US9278849B2 (en) * 2012-06-15 2016-03-08 The Boeing Company Micro-sensor package and associated method of assembling the same

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