JP2014171181A - Piezoelectric oscillator package and piezoelectric oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator package capable of accommodating a piezoelectric vibration piece differing in size and having formed therein a pillow part used for a piezoelectric vibration piece of each size, and a piezoelectric oscillator.SOLUTION: A piezoelectric oscillator package (130) allows a first piezoelectric vibration piece (110a) having a first length in a prescribed direction or a second piezoelectric vibration piece having a second length shorter than the first length in a prescribed direction to be disposed inside a cavity (131) whichever is selected. The piezoelectric oscillator package (130) also allows an integrated circuit element (120) for controlling the first piezoelectric vibration piece or the second piezoelectric vibration piece to be placed in it, and is provided with a first placement part (133) in which the integrated circuit element is placed, a second placement part (134a) in which the first piezoelectric vibration piece or the second piezoelectric vibration piece is placed, and a first pillow part (136) for easing the mechanical shock of flexion of the first piezoelectric vibration piece, the second placement part serving as a second pillow part for easing the mechanical shock of flexion of the second piezoelectric vibration piece.

Description

  The present invention relates to a piezoelectric oscillator package and a piezoelectric oscillator capable of selecting and placing piezoelectric vibrating pieces having different sizes.

  A piezoelectric vibrating piece that vibrates when a voltage is applied to an excitation electrode is known. Such a piezoelectric vibrating piece is placed in a ceramic package together with an integrated circuit element, and a piezoelectric oscillator is formed by connecting a connection electrode formed in the ceramic package and an extraction electrode extracted from the excitation electrode. The The size of the outer shape of the piezoelectric vibrating piece differs depending on the vibration frequency. When the piezoelectric vibrating piece having such a different size is placed on a ceramic package of a predetermined size, the piezoelectric vibrating piece having a large size is used. Then, there is a possibility that the excitation electrode and the connection electrode are electrically connected to cause a short circuit. Further, since the piezoelectric vibrating piece must have a size that allows the extraction electrode and the connection electrode to be electrically connected, the allowable range of the piezoelectric vibrating piece is small. Furthermore, when using a piezoelectric vibrating piece in which the extraction electrode is formed on one side and the other side is a free end, the piezoelectric vibrating piece is prevented from inclining and coming into contact with an integrated circuit element or the like to cause a short circuit or the like. It is necessary to form a pillow portion for suppressing the tilt of the vibrating piece on the free end side in the ceramic package. Therefore, according to the size of the piezoelectric vibrating piece, the size of the ceramic package or the formation position and size of the connection electrode formed in the ceramic package and connected to the lead electrode of the piezoelectric vibrating piece are adjusted to the size of the piezoelectric vibrating piece. Needed to change.

  On the other hand, Patent Document 1 discloses a piezoelectric device that can cope with different sizes of quartz crystal plates in a ceramic package of a predetermined size. Japanese Patent Application Laid-Open No. H10-228561 discloses that a quartz crystal plate having different sizes can be stably placed on a ceramic package by supporting the quartz plate using an auxiliary support plate.

JP 2005-260727 A

  However, in Patent Document 1, the use of a new part increases the cost, and labor is required for installing the auxiliary support plate. Further, when a small piezoelectric vibrating piece is placed in a package, the pillow portion cannot be used, and in the piezoelectric vibrating piece having a free end, the piezoelectric vibrating piece is inclined to contact an integrated circuit element or the like and short-circuit. The possibility remained.

  Accordingly, the present invention provides a piezoelectric oscillator package and a piezoelectric oscillator in which piezoelectric vibrating pieces of different sizes can be accommodated and a pillow portion used for each size of the piezoelectric vibrating piece is formed.

  A package for a piezoelectric oscillator according to a first aspect includes a first piezoelectric element having a first length in a predetermined direction in a cavity and a pair of extraction electrodes and a pair of extraction electrodes respectively extracted from the pair of excitation electrodes to one side. A second piezoelectric vibrating piece including a vibrating piece, a pair of excitation electrodes having a second length shorter than the first length in a predetermined direction, and a pair of extraction electrodes respectively drawn from the pair of excitation electrodes to one side; A package for a piezoelectric oscillator having a long side and a short side on which an integrated circuit element for controlling the first piezoelectric vibrating piece or the second piezoelectric vibrating piece can be placed. It is. In this piezoelectric oscillator package, the first mounting portion on which the integrated circuit element is mounted and formed on the bottom surface of the cavity, and the first piezoelectric vibrating piece or the second piezoelectric vibrating piece are mounted, and the position is more than the bottom surface. The first pillow formed on the other side of the cavity, which is higher and has a second mounting portion formed on one side of the cavity and the impact of the deflection of the first piezoelectric vibrating piece, is higher than the bottom surface And the second mounting portion serves as a second pillow portion for alleviating the deflection impact of the second piezoelectric vibrating piece.

  In the first aspect, the piezoelectric oscillator package according to the second aspect can be placed so that the direction in which the long side extends and the direction of the first length overlap with each other in the first aspect. The piece can be placed so that the direction in which the short side extends and the direction of the second length overlap.

  According to a third aspect of the piezoelectric oscillator package, in the second aspect, the first mounting electrode electrically connected to the first piezoelectric vibrating piece or the pair of lead electrodes of the second piezoelectric vibrating piece on the second mounting portion; A second connection electrode is formed, and the first connection electrode is formed to overlap the second connection electrode in both the direction in which the long side extends and the direction in which the short side extends.

  In the piezoelectric oscillator package of the fourth aspect, in the third aspect, the second placement portion is formed at both ends on one side of the cavity. A first connection electrode is formed on one second mounting portion. A first connection electrode is formed on one side of the cavity of the other second mounting portion, and a second connection electrode is formed on the other side of the cavity of the other second mounting portion.

  A piezoelectric oscillator according to a fifth aspect includes the piezoelectric oscillator package according to the first to fourth aspects, the first piezoelectric vibrating piece or the second piezoelectric vibrating piece, an integrated circuit element, and a lid for sealing the cavity.

  A piezoelectric oscillator of a sixth aspect includes a piezoelectric oscillator package of the third to fourth aspects, a first piezoelectric vibrating piece or a second piezoelectric vibrating piece, an integrated circuit element, and a lid for sealing the cavity, The excitation electrode of the first piezoelectric vibrating piece or the second piezoelectric vibrating piece does not overlap the first connection electrode and the second connection electrode in the vertical direction.

  According to the present invention, it is possible to provide a piezoelectric oscillator package and a piezoelectric oscillator in which different sizes of piezoelectric vibrating reeds can be accommodated and a pillow portion used for each size of the piezoelectric vibrating reed is formed.

1 is an exploded perspective view of a piezoelectric oscillator 100. FIG. FIG. 3A is a schematic plan view of the integrated circuit element 120. FIG. FIG. 6B is a plan view of the piezoelectric oscillator package 130. FIG. 6A is a plan view of the first layer 130a of the piezoelectric oscillator package 130. FIG. FIG. 6B is a plan view of the second layer 130b of the piezoelectric oscillator package 130. FIG. FIG. 6C is a plan view of the third layer 130 c of the piezoelectric oscillator package 130. FIG. 6A is a plan view of the first piezoelectric vibrating piece 110a. FIG. 6B is a plan view of the piezoelectric oscillator package 130 on which the first piezoelectric vibrating piece 110a is placed. It is AA sectional drawing of FIG. (A) is a top view of the 2nd piezoelectric vibrating piece 110b. FIG. 6B is a plan view of the piezoelectric oscillator package 130 on which the second piezoelectric vibrating piece 110b is placed. (C) is sectional drawing of the piezoelectric oscillator 100 containing the BB sectional drawing of FIG.6 (b). (A) is a top view of the package 230 for piezoelectric oscillators. FIG. 6B is a plan view of the piezoelectric oscillator package 330.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the scope of the present invention is not limited to these forms unless otherwise specified in the following description.

(First embodiment)
<Configuration of Piezoelectric Oscillator 100>
FIG. 1 is an exploded perspective view of the piezoelectric oscillator 100. The piezoelectric oscillator 100 is a surface mount type piezoelectric oscillator, and is used by being mounted on a printed circuit board or the like. The piezoelectric oscillator 100 shown in FIG. 1 is mainly formed by a first piezoelectric vibrating piece 110a, an integrated circuit element 120, a piezoelectric oscillator package 130, and a lid plate 140. As the first piezoelectric vibrating piece 110a, for example, an AT-cut quartz vibrating piece can be used. The AT-cut quartz crystal resonator element has a principal surface (YZ plane) inclined with respect to the Y axis of the crystal axis (XYZ) by 35 degrees 15 minutes from the Z axis in the Y axis direction around the X axis. In the following description, the new axes tilted with respect to the axial direction of the AT-cut quartz crystal vibrating piece are used as the Y ′ axis and the Z ′ axis. In the case of representing a package for a piezoelectric oscillator, the direction in which the long side extends is described as the X-axis direction, the direction in which the short side extends is defined as the Z′-axis direction, and the height direction is described as the Y′-axis direction. That is, the X axis direction, the Y ′ axis direction, and the Z ′ axis direction are perpendicular to each other.

  The first piezoelectric vibrating piece 110a is formed in a rectangular shape. Excitation electrodes 111a are formed on the surface on the + Y′-axis side and the surface on the −Y′-axis side of the first piezoelectric vibrating piece 110a, respectively, and the + Z′-axis side and the −Z-side of the −X-axis side from each excitation electrode 111a. 'Extraction electrodes 112a are drawn out at the corners on the axis side.

  The integrated circuit element 120 is electrically connected to the first piezoelectric vibrating piece 110a to form an oscillation circuit. The integrated circuit element 120 has a plurality of terminals formed on the surface at the −Y′-axis side, and these terminals are connected to the lead electrode 112 a of the first piezoelectric vibrating piece 110 a or the external electrode 135 formed on the piezoelectric oscillator package 130. Electrically connected.

  The piezoelectric oscillator package 130 has a long side extending in the X-axis direction and a short side extending in the Z′-axis direction. In addition, external electrodes 135 are formed at the four corners of the surface on the −Y′-axis side, and cavities 131 in which the first piezoelectric vibrating piece 110a and the integrated circuit element 120 are disposed are formed on the surface on the + Y′-axis side. Has been. The integrated circuit element 120 is placed on the first placement portion 133 (see FIG. 2B) formed in the cavity 131. Further, a second mounting portion 134a and a second mounting portion 134b are formed on the + Z′-axis side and the −Z′-axis side of the cavity 131 on the −X-axis side, respectively. It mounts on the 2nd mounting part 134a and the 2nd mounting part 134b. On the + X-axis side of the cavity 131, a first pillow portion 136 that suppresses the inclination of the first piezoelectric vibrating piece 110a and reduces the impact caused by the deflection is formed. A bonding surface 132 to be bonded to the lid plate 140 is formed around the cavity 131 on the surface on the + Y′-axis side of the package 130 for the piezoelectric oscillator.

  The piezoelectric oscillator package 130 is, for example, a ceramic package using a ceramic as a base material, and is formed by superimposing three layers of a first layer 130a, a second layer 130b, and a third layer 130c. The first layer 130a forms a surface on the −Y′-axis side of the piezoelectric oscillator package 130, and the second layer 130b is disposed on the surface on the + Y′-axis side of the first layer 130a. The part 134a, the second mounting part 134b, and the first pillow part 136 are formed. The third layer 130c is disposed on the + Y′-axis side surface of the second layer 130b, and a bonding surface 132 is formed on the + Y′-axis side surface of the third layer 130c.

  The lid plate 140 is formed in a planar shape, and is bonded to the bonding surface 132 of the piezoelectric oscillator package 130 via a sealing material 141 (see FIG. 5). As a result, the lid plate 140 seals the cavity 131 of the piezoelectric oscillator package 130. The lid plate 140 is formed of a glass material that transmits laser light.

  FIG. 2A is a schematic plan view of the integrated circuit element 120. The integrated circuit element 120 has six terminals on the surface at the −Y′-axis side. In FIG. 2A, the six terminals formed on the −Y′-axis side of the integrated circuit element 120 are drawn with dotted lines. It is shown in a circle. The six terminals are formed by two piezoelectric terminals 121 and four circuit terminals 122. The piezoelectric terminal 121 is a terminal that is formed on the −X-axis side of the integrated circuit element 120 and is electrically connected to an extraction electrode of the first piezoelectric vibrating piece 110a or a second piezoelectric vibrating piece 110b described later. The circuit terminals 122 are terminals formed on the central portion of the integrated circuit element 120 and on the + X axis side and electrically connected to the external electrodes 135 of the piezoelectric oscillator package 130, respectively.

  FIG. 2B is a plan view of the piezoelectric oscillator package 130. A first mounting portion 133 on which the integrated circuit element 120 is mounted is formed on the bottom surface of the cavity 131 of the piezoelectric oscillator package 130. The first mounting portion 133 is electrically joined to the first piezoelectric electrode 137 a and the second piezoelectric electrode 137 b that are electrically joined to the piezoelectric terminal 121 of the integrated circuit element 120 and the circuit terminal 122 of the integrated circuit element 120. Circuit electrode 138 to be formed. A first pillow 136 is formed on the + X axis side of the cavity 131 of the package 130 for piezoelectric oscillator. Further, a second placement portion 134a and a second placement portion 134b are formed at the corners of the cavity 131 on the −Z ′ axis side and the −Z ′ axis side on the −X axis side, respectively. The piezoelectric oscillator package 130 has a long side extending in the X-axis direction and a short side extending in the Z′-axis direction. Below, the length of the long side of the cavity 131 of the package 130 for piezoelectric oscillators will be described as a length WX1, and the length of the short side will be described as a length WZ1.

  A first connection electrode 139a is formed on the −X axis side of the second mounting portion 134a and the second mounting portion 134b of the package 130 for the piezoelectric oscillator, and on the + X axis side of the second mounting portion 134a. Two connection electrodes 139b are formed. The first connection electrode 139a and the second connection electrode 139b on the second placement part 134a are not electrically connected to each other but are insulated. A first piezoelectric electrode 137 a is formed on the −Z′-axis side on the −X-axis side of the first placement unit 133. The first piezoelectric electrode 137a is electrically connected to the first connection electrode 139a formed on the second placement portion 134a and the first connection electrode 139a formed on the second placement portion 134b, respectively. A second piezoelectric electrode 137b is formed on the + Z′-axis side on the −X-axis side of the first placement unit 133. The second piezoelectric electrode 137b is electrically connected to the second connection electrode 139b formed on the second placement portion 134a. In addition, a circuit electrode 138 is formed on the central portion of the first placement portion 133 and on the + X axis side. In FIG. 2B, the position where the integrated circuit element 120 is placed is indicated by a dotted line 120a.

  FIG. 3A is a plan view of the first layer 130 a of the piezoelectric oscillator package 130. In FIG. 3A, the first placement portion 133 and the region where the second layer 130b (see FIG. 3B) is placed are separated by a dotted line 131a. The second layer 130b is placed outside the dotted line 131a, and the first placement part 133 is inside the dotted line 131a. External electrodes 135 are formed at the four corners of the -Y'-axis side surface of the first layer 130a. The four circuit electrodes 138 formed on the surface of the first layer 130a on the + Y′-axis side are each drawn out to the outside of the dotted line 131a by the first wiring electrode 163 and penetrate the first layer 130a. Are electrically connected to the external electrodes 135 respectively. In addition, the first piezoelectric electrode 137a and the second piezoelectric electrode 137b are drawn to the outside of the dotted line 131a, and the first piezoelectric electrode 137a and the second piezoelectric electrode 137b pass through the second layer 130b and pass through the second through electrode 162 (see FIG. 3B). The connection electrode 139a and the second connection electrode 139b are electrically connected. A second wiring electrode 164 extends from the first piezoelectric electrode 137a and the second piezoelectric electrode 137b, is connected to the first wiring electrode 163 inside the dotted line 131a, and is connected to the external electrode 135 via the first wiring electrode 163. Is electrically connected.

  3B is a plan view of the second layer 130b of the piezoelectric oscillator package 130. FIG. The second layer 130b forms a first pillow portion 136, a second placement portion 134a, and a second placement portion 134b in the cavity 131. In the second layer 130b, a through hole 142 penetrating the second layer 130b is formed in the central region, and the through hole 142 forms a part of the cavity 131. A first connection electrode 139a and a second connection electrode 139b are formed on the second mounting portion 134a and the second mounting portion 134b, and the first piezoelectric electrode 137a and the second piezoelectric electrode are interposed via the second through electrode 162, respectively. It is electrically connected to the electrode 137b. In FIG. 3B, the third layer 130c is disposed outside the dotted line 131b.

  FIG. 3C is a plan view of the third layer 130 c of the piezoelectric oscillator package 130. The surface on the + Y′-axis side of the third layer 130 c becomes the bonding surface 132. The third layer 130 c has a through hole 143 that penetrates the third layer 130 c in the center region, and the through hole 143 forms part of the cavity 131.

  FIG. 4A is a plan view of the first piezoelectric vibrating piece 110a. The first piezoelectric vibrating piece 110a is formed in a rectangular shape, and has a long side extending in the X-axis direction and a short side extending in the Z′-axis direction. The long side is formed to the length WX2, the short side is formed to the length WZ2, the length WX2 is shorter than the length WX1, and the length WZ2 is shorter than the length WZ1. Excitation electrodes 111a are respectively formed in the central regions of the main surfaces of the first piezoelectric vibrating piece 110a on the + Y′-axis side and the −Y′-axis side. From each excitation electrode 111a, the extraction electrode 112a extends in the −X-axis direction. Has been pulled out. An extraction electrode 112a extracted from the excitation electrode 111a formed on the main surface on the + Y′-axis side is extracted to a corner on the + Z′-axis side on the −X-axis side, and further −Y ′ via a side surface on the + Z′-axis side. It is pulled out to the surface on the shaft side. In addition, the extraction electrode 112a extracted from the excitation electrode 111a (not shown) formed on the main surface on the −Y′-axis side is extracted to the −Z′-axis side corner on the −X-axis side, It is pulled out to the surface on the + Y ′ axis side through the side surface on the Z ′ axis side.

  FIG. 4B is a plan view of the piezoelectric oscillator package 130 on which the first piezoelectric vibrating piece 110a is placed. In the first piezoelectric vibrating piece 110a, the extraction electrode 112a is conductively bonded to the second connection electrode 139b formed on the second placement portion 134a and the first connection electrode 139a formed on the second placement portion 134b. By being bonded via the agent 150 (see FIG. 5), the piezoelectric oscillator package 130 is disposed. In the piezoelectric oscillator package 130, when the first piezoelectric vibrating piece 110a is disposed, the second wiring electrode 164 is formed so that it can be seen when viewed from the + Y′-axis side of the piezoelectric oscillator package 130. Yes.

  In the piezoelectric oscillator 100, the integrated circuit element 120 and the first piezoelectric vibrating piece 110 a are arranged in the piezoelectric oscillator package 130, and the cavity 131 is sealed by the lid plate 140, so that the vibration frequency of the first piezoelectric vibrating piece 110 a has the external electrode 135. Measured through. If the vibration frequency of the first piezoelectric vibrating piece 110a is within a predetermined range, the second wiring electrode 164 (the region indicated by the dotted line 164a in FIG. 4B) is irradiated with laser light via the lid plate 140. Thus, the second wiring electrode 164 is cut. When the vibration frequency of the first piezoelectric vibrating piece 110a is not within the predetermined range, the second wiring electrode 164 is cut by the laser light after the vibration frequency is adjusted.

  5 is a cross-sectional view taken along the line AA in FIG. The first mounting portion 133 of the piezoelectric oscillator package 130 has the first piezoelectric electrode 137a (see FIG. 2B), the second piezoelectric electrode 137b, and the circuit electrode 138 with the piezoelectric terminal 121 and the circuit terminal 122 as metal bumps. The integrated circuit element 120 is placed by being bonded via the connector 151. Further, in the second placement portion 134a and the second placement portion 134b (see FIG. 2B), the extraction electrode 112a is provided with the first connection electrode 139a (see FIG. 2B) via the conductive adhesive 150. ) And the second connection electrode 139b, the first piezoelectric vibrating piece 110a is placed. The cavity 131 is sealed by bonding the lid plate 140 to the bonding surface 132 via the sealing material 141.

  In the piezoelectric oscillator 100, the second mounting part 134 a, the second mounting part 134 b, and the first pillow part 136 are formed higher in the + Y′-axis direction than the upper part of the integrated circuit element 120. The first pillow portion 136 and the + X-axis side end portion of the first piezoelectric vibrating piece 110a overlap in the Y′-axis direction. Therefore, even when the first piezoelectric vibrating piece 110a bends and the + X-axis side end which is the free end of the first piezoelectric vibrating piece 110a is lowered to the −Y′-axis side, the + X-axis side end of the first piezoelectric vibrating piece 110a The portion stops on the upper surface of the first pillow portion 136, thereby suppressing the inclination of the first piezoelectric vibrating piece 110a, and the first piezoelectric vibrating piece 110a is prevented from coming into contact with the integrated circuit element 120 and short-circuiting. In addition, the first pillow portion 136 prevents the first piezoelectric vibrating piece 110a from being bent and violently colliding with a part of the piezoelectric oscillator package 130 and being damaged.

  FIG. 6A is a plan view of the second piezoelectric vibrating piece 110b. The second piezoelectric vibrating piece 110b is formed in a rectangular shape, and has a long side extending in the X-axis direction with a length WX3 and a extending length in the Z′-axis direction with a length WZ3. And a short side. The length WX3 is longer than the length WZ3 and shorter than the length WX2 of the first piezoelectric vibrating piece 110a and the length WZ1 of the cavity 131. Similarly to the first piezoelectric vibrating piece 110a, excitation electrodes 111b are formed on the surfaces on the + Y′-axis side and the −Y′-axis side, respectively, and an extraction electrode 112b is extracted from each excitation electrode 111b to the −X-axis side. Yes.

  FIG. 6B is a plan view of the piezoelectric oscillator package 130 on which the second piezoelectric vibrating piece 110b is placed. The coordinates shown in FIG. 6B are the coordinates of the piezoelectric oscillator package 130. Therefore, in the coordinates of the second piezoelectric vibrating piece 110b in FIG. 6B, the −Z′-axis direction of the coordinates shown in FIG. 6B corresponds to the + X-axis direction of the second piezoelectric vibrating piece 110b. The + X-axis direction of the coordinates shown in (b) corresponds to the + Z′-axis direction. The lead electrode 112b of the second piezoelectric vibrating piece 110b is joined to the first connection electrode 139a and the second connection electrode 139b formed on the second placement portion 134a via the conductive adhesive 150, respectively.

  FIG. 6C is a cross-sectional view of the piezoelectric oscillator 100 including the BB cross-sectional view of FIG. The free end of the second piezoelectric vibrating piece 110b overlaps with the second mounting portion 134b in the Y′-axis direction. Accordingly, when the second piezoelectric vibrating piece 110b is placed on the piezoelectric oscillator package 130, the second placing portion 134b becomes a pillow portion (hereinafter referred to as a second pillow portion) for the second piezoelectric vibrating piece 110b. The impact caused by the deflection of the second piezoelectric vibrating piece 110b is reduced. That is, the second mounting portion 134b serving as the second pillow portion plays a role of suppressing an impact applied to the second piezoelectric vibrating piece 110b when the second piezoelectric vibrating piece 110b is greatly shaken. Further, in the arrangement of the second piezoelectric vibrating piece 110b, it is preferable that the excitation electrode 111b of the second piezoelectric vibrating piece 110b does not overlap the first mounting electrode 139a in the Y′-axis direction. This is because, when they overlap, there is a risk that the excitation electrode 111b and the first mounting electrode 139a come into contact with each other to cause a short circuit.

  As described above, the piezoelectric oscillator package 130 can select and place the first piezoelectric vibrating piece 110a or the second piezoelectric vibrating piece 110b. This is because the piezoelectric oscillator package 130 is formed so that the first connection electrode 139a and the second connection electrode 139b overlap in both the X-axis direction and the Z′-axis direction. There are two arrangement methods: an arrangement method in which the direction in which the long side of the piezoelectric vibrating piece extends is the X-axis direction (see FIG. 4B) and an arrangement method in which the Z′-axis direction is arranged (see FIG. 6B). This is because it becomes a kind. In addition, the first pillow portion 136 is formed on the first piezoelectric vibrating piece 110a, and the second pillow portion (second mounting portion 134b) is formed on the second piezoelectric vibrating piece 110b. Short circuit in the cavity 131 of the oscillator 100 and breakage of the piezoelectric vibrating piece are prevented.

(Second Embodiment)
The piezoelectric oscillator package can be formed in various shapes for mounting two types of piezoelectric vibrating pieces. Hereinafter, as a modification of the piezoelectric oscillator package 130, a piezoelectric vibrating piece package 230 and a piezoelectric vibrating piece package 330 for mounting two types of piezoelectric vibrating pieces will be described. In the following description, the same parts as those of the piezoelectric oscillator package 130 are denoted by the same reference numerals as those of the piezoelectric oscillator package 130, and the description thereof is omitted.

<Configuration of Package 230 for Piezoelectric Oscillator>
FIG. 7A is a plan view of the piezoelectric oscillator package 230. In the piezoelectric oscillator package 230, a second mounting portion 234 having the same height as the first pillow portion 136 is formed along the side of the cavity 131 on the −X axis side. A first connection electrode 270 is formed on the −Z′-axis side of the second placement portion 234, and a second connection electrode 271 is formed on the + Z′-axis side of the second placement portion 234. In addition, no electrode is formed in the central region of the second placement portion 234.

  The first connection electrode 270 includes a region 270a formed at the end of the second mounting portion 234 on the −Z ′ axis side, and a −X axis in a central region where no electrode is formed from the −X axis side of the region 270a. A region 270c that bypasses the side and extends in the + Z′-axis direction, and a region 270b that is connected to the region 270c and is formed on the + Z′-axis side of the central region where no electrode is formed. The second connection electrode 271 includes a region 271a formed at the end of the second mounting portion 234 on the + Z′-axis side, and the + X-axis side of the second mounting portion 234 from the region 271a to the −Z′-axis direction. And a region 271b extending in the direction.

  The region 270a of the first connection electrode 270 and the region 271a of the second connection electrode 271 are arranged so as to overlap in the Z′-axis direction. Therefore, the extraction electrode 112a of the first piezoelectric vibrating piece 110a (see FIG. 4A) is joined to the region 270a and the region 271a via the conductive adhesive 150, respectively, so that the first piezoelectric element is attached to the piezoelectric oscillator package 230. The vibrating piece 110a can be placed (see the dotted line 110a). At this time, the first pillow portion 136 prevents the first piezoelectric vibrating piece 110a from being short-circuited or damaged.

  The region 270b of the first connection electrode 270 and the region 271b of the second connection electrode 271 are arranged so as to overlap in the X-axis direction. Therefore, the extraction electrode 112b of the second piezoelectric vibrating piece 110b (see FIG. 6A) is joined to the region 270b and the region 271b through the conductive adhesive 150, respectively, so that the second piezoelectric element is attached to the piezoelectric oscillator package 230. The vibration piece 110b can be placed (see the dotted line 110b). At this time, the excitation electrode 111b of the second piezoelectric vibrating piece 110b overlaps with the central region where the electrode is not formed in the Y′-axis direction, and the central region where the electrode which is a part of the second mounting portion 234 is not formed. The second pillow portion prevents the second piezoelectric vibrating piece 110b from being short-circuited or damaged.

<Configuration of Package 330 for Piezoelectric Oscillator>
FIG. 7B is a plan view of the piezoelectric oscillator package 330. A second mounting portion 234 is formed in the piezoelectric oscillator package 330, a first connection electrode 370 is formed on the −Z′-axis side of the second mounting portion 234, and the second mounting portion 234 is formed. A second connection electrode 271 is formed on the + Z′-axis side. In addition, no electrode is formed in the central region of the second placement portion 234.

  The first connection electrode 370 includes a region 370a formed at an end on the −Z′-axis side of the second mounting portion 234, and a region 370b protruding in the + Z′-axis direction from the −X-axis side of the region 370a. It is configured. The second connection electrode 371 includes a region 371a formed at the end of the second mounting portion 234 on the + Z′-axis side, and a −Z′-axis side from the region 371a to the −X-axis side of the second mounting portion 234. And a region 371b protruding in the direction.

  The region 370a of the first connection electrode 370 and the region 371a of the second connection electrode 271 are arranged so as to overlap in the Z′-axis direction. Therefore, the extraction electrode 112a of the first piezoelectric vibrating piece 110a (see FIG. 4A) is joined to the region 370a and the region 371a via the conductive adhesive 150, respectively, so that the first piezoelectric element is attached to the piezoelectric oscillator package 330. The vibrating piece 110a can be placed (see the dotted line 110a). At this time, the first pillow portion 136 prevents the first piezoelectric vibrating piece 110a from being short-circuited or damaged.

  The region 370b of the first connection electrode 370 and the region 371b of the second connection electrode 371 are arranged so as to overlap in the Z′-axis direction. Therefore, the lead electrodes 112c (not shown) of the third piezoelectric vibrating piece 110c having the same shape as the second piezoelectric vibrating piece 110b and having a smaller size than the second piezoelectric vibrating piece 110b are respectively connected via the conductive adhesive 150. Thus, the second piezoelectric vibrating piece 110b can be placed on the piezoelectric oscillator package 330 by joining the region 370b and the region 371b (see the dotted line 110c). At this time, the excitation electrode 111c (not shown) and the free end of the third piezoelectric vibrating piece 110c overlap with the central region where no electrode is formed in the Y′-axis direction, and the electrode which is a part of the second mounting portion 234 A center region that is not formed serves as a second pillow portion to prevent short-circuiting or breakage of the third piezoelectric vibrating piece 110c.

  In the piezoelectric oscillator package 330, the electrode spacing between the region 370 a of the first connection electrode 370 and the region 371 a of the second connection electrode 271, the region 370 b of the first connection electrode 370 and the region 371 b of the second connection electrode 371 is set. Two types of piezoelectric vibrating reeds can be placed by two different combinations. Moreover, the 2nd pillow part is formed using the area | region in which the electrode between the area | region 370b and the area | region 371b is not formed.

  As described above, the optimal embodiment of the present invention has been described in detail. However, as will be apparent to those skilled in the art, the present invention can be implemented with various modifications and variations within the technical scope thereof.

  For example, in the above-described embodiment, the case where the piezoelectric vibrating piece is an AT-cut crystal vibrating piece has been described. However, the present invention can be similarly applied to a BT-cut quartz vibrating piece that vibrates in the thickness-slip mode. Furthermore, the piezoelectric vibrating piece can be basically applied not only to a quartz material but also to a bonding material including lithium tantalate, lithium niobate, or piezoelectric ceramic. In the above embodiment, the piezoelectric oscillator package in which the second wiring electrode 164 is formed has been described. However, the second wiring electrode 164 may not be formed. At this time, the lid plate 140 may not be formed of a material that transmits laser light.

DESCRIPTION OF SYMBOLS 100 ... Piezoelectric oscillator 110a ... 1st piezoelectric vibrating piece 110b ... 2nd piezoelectric vibrating piece 110c ... 3rd piezoelectric vibrating piece 111a, 111b ... Excitation electrode 112a, 112b ... Extraction electrode 120 ... Integrated circuit element 121 ... Piezoelectric terminal 122 ... Circuit terminal 130, 230, 330 ... Piezoelectric oscillator package 130a ... 1st layer 130b ... 2nd layer 130c ... 3rd layer 131 ... Cavity 132 ... Joining surface 133 ... 1st mounting part 134a, 134b ... 2nd mounting part 135 ... External electrode 136 ... 1st pillow part 137a ... 1st piezoelectric electrode 137b ... 2nd piezoelectric electrode 138 ... Circuit electrode 139a, 270, 370 ... 1st connection electrode 139b, 271, 371 ... 2nd connection electrode 140 ... Lid board 141 ... Sealing material 142, 143 ... Through hole 150 ... Conductive adhesion 151 ... metal bump 161 ... first through electrode 162 ... second through electrode 163 ... first wiring electrode 164 ... second wiring electrode

Claims (6)

A first piezoelectric vibrating piece having a first length in a predetermined direction in the cavity and including a pair of excitation electrodes and a pair of extraction electrodes each drawn from the pair of excitation electrodes to one side; and One of a pair of excitation electrodes having a second length shorter than the first length and a second piezoelectric vibrating piece including a pair of extraction electrodes drawn to one side from the pair of excitation electrodes is selected. A package for a piezoelectric oscillator having a long side and a short side, on which an integrated circuit element for controlling the first piezoelectric vibrating piece or the second piezoelectric vibrating piece can be placed,
A first mounting portion on which the integrated circuit element is mounted and formed on a bottom surface of the cavity;
A second mounting portion on which the first piezoelectric vibrating piece or the second piezoelectric vibrating piece is mounted, the position is higher than the bottom surface, and is formed on one side of the cavity;
A first pillow portion that relaxes the impact of deflection of the first piezoelectric vibrating piece, has a position higher than the bottom surface, and is formed on the other side of the cavity;
The package for a piezoelectric oscillator, wherein the second mounting portion serves as a second pillow portion for alleviating the impact of bending of the second piezoelectric vibrating piece.   The first piezoelectric vibrating piece is placed so that a direction in which the long side extends and a direction in the first length overlap each other, and the second piezoelectric vibrating piece has a direction in which the short side extends and the second length. The package for a piezoelectric oscillator according to claim 1, wherein the package is placed so as to overlap with a direction.   A first connection electrode and a second connection electrode that are electrically connected to the first piezoelectric vibrating piece or the pair of extraction electrodes of the second piezoelectric vibrating piece are formed on the second mounting portion, 3. The piezoelectric oscillator package according to claim 2, wherein the connection electrode is formed so as to overlap the second connection electrode in both a direction in which the long side extends and a direction in which the short side extends.   The second mounting portion is formed at both ends of one side of the cavity, the first connection electrode is formed on one of the second mounting portions, and the cavity of the other second mounting portion. 4. The piezoelectric oscillator according to claim 3, wherein the first connection electrode is formed on one side of the second mounting electrode, and the second connection electrode is formed on the other side of the cavity of the other second mounting portion. For package. A package for a piezoelectric oscillator according to any one of claims 1 to 4,
The first piezoelectric vibrating piece or the second piezoelectric vibrating piece;
The integrated circuit element;
A lid for sealing the cavity;
A piezoelectric oscillator comprising: A package for a piezoelectric oscillator according to claim 3 or claim 4,
The first piezoelectric vibrating piece or the second piezoelectric vibrating piece;
The integrated circuit element;
A lid for sealing the cavity,
The piezoelectric oscillator in which the excitation electrode of the first piezoelectric vibrating piece or the second piezoelectric vibrating piece does not overlap the first connection electrode and the second connection electrode in the vertical direction.

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