JP7306096B2 - Piezoelectric device and method for manufacturing piezoelectric device - Google Patents

Description

The present invention relates to a piezoelectric device and its manufacturing method, and more particularly to a piezoelectric device capable of sharing a package and its manufacturing method.

A surface-mounted piezoelectric oscillator, which is a piezoelectric device, for example, a temperature compensated crystal oscillator (TCXO) is provided in a base (container) made of an insulating material, as shown in Patent Document 1. It has a structure in which a crystal piece, which is a piezoelectric vibrating piece, is accommodated in the upper concave portion of the upper and lower concave portions, and an integrated circuit element (IC) is accommodated in the lower concave portion. The external connection terminals for surface mounting are formed on the upper surface of the frame surrounding the lower concave portion in which the integrated circuit element is accommodated, that is, on the four corners of the outer bottom surface of the temperature-compensated crystal oscillator.

The external connection terminals at the four corners of the outer bottom surface of this temperature-compensated crystal oscillator are electrically connected to the integrated circuit element housed in the recess on the lower side. connected to the device.

On the other hand, in a surface-mounted piezoelectric vibrator, for example, a crystal vibrator with a built-in temperature sensor, as disclosed in Patent Document 2, a piezoelectric vibrating piece is placed in a first concave space of an element mounting member corresponding to the base. A thermistor element is mounted in the second recessed space, and external connection terminals for surface mounting are formed on the bottom surface of the element mounting member, that is, at the four corners of the outer bottom surface of the piezoelectric vibrator.

A piezoelectric vibrating piece and a thermistor element are connected to external connection terminals at four corners of the outer bottom surface of the piezoelectric vibrator.

JP 2016-208192 A Japanese Patent No. 5101651

As described above, in the temperature-compensated crystal oscillator, which is a piezoelectric oscillator, the external connection terminals at the four corners of the outer bottom surface of the base are connected to the integrated circuit element, and the crystal blank is not directly connected. On the other hand, in a crystal oscillator incorporating a temperature sensor, which is a piezoelectric oscillator, a crystal blank is directly connected to external connection terminals on the outer bottom surface of the base.

As described above, the piezoelectric oscillator and the piezoelectric vibrator have different connection modes of the external connection terminals on the base, and therefore cannot share the base.

Therefore, it is necessary to prepare and manufacture bases respectively corresponding to the piezoelectric oscillator and the piezoelectric vibrator, which increases management costs and manufacturing costs.

SUMMARY OF THE INVENTION It is an object of the present invention to reduce the cost of a piezoelectric device by making it possible to share a base.

In order to achieve the above object, the present invention is configured as follows.

(1) The piezoelectric device of the present invention is an insulative device having at least one housing recess in which a piezoelectric vibrating piece is housed and at least one type of electronic component selected from at least two types of electronic components can be housed. comprising a base and a lid that hermetically seals the opening of the storage recess of the base;
A pair of piezoelectric vibrating reed mounting electrodes on which the stored piezoelectric vibrating reed is mounted and one type of electronic component selected from the two types of electronic components can be mounted on the inner surface of the storage recess. a plurality of electrodes for mounting electronic components are formed,
first and second electronic component mounting electrodes among the plurality of electronic component mounting electrodes are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes, respectively;
The outer bottom surface of the base is provided with a plurality of external connection terminals for surface mounting which are electrically connected to the remaining plurality of electronic component mounting electrodes other than the first and second electronic component mounting electrodes. and
First and second connection members are added between the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes among the plurality of remaining electronic component mounting electrodes. can be electrically connected to each other by providing
An electronic component of the other type selected from the two types of electronic components can be mounted on the plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes.

According to the piezoelectric device of the present invention, the first and second electronic component mounting electrodes electrically connected to the pair of piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reed is mounted, and the external connection for surface mounting. The third and fourth electronic component mounting electrodes electrically connected to the terminals can be electrically connected by additionally providing first and second connection members respectively therebetween. That is, the pair of electrodes for mounting the piezoelectric vibrating reed and the external connection terminal can be directly connected by additionally providing the first and second connection members, respectively.

Therefore, the first and second electronic component mounting electrodes electrically connected to the pair of piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reed is mounted without additionally providing the first and second connection members. and the first to fourth electronic component mounting electrodes are electrically separated from the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals for surface mounting. By mounting an electronic component of one type selected from two types of electronic components, such as an integrated circuit element including an oscillator circuit connected to a piezoelectric vibrating reed, on a plurality of electronic component mounting electrodes including , a piezoelectric oscillator, or the like.

In addition, first and second connection members are additionally provided, respectively, and the first and second electronic component mounting electrodes are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reeds are mounted. and the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals for surface mounting. It is possible to configure a piezoelectric vibrator by mounting it on a device. Further, a plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes are electrically connected to external connection terminals, and are selected from two types of electronic component. Since one type of electronic component can be mounted, by mounting the other type of electronic component, for example, a temperature sensor element or the like, a piezoelectric vibrator or the like with a built-in temperature sensor can be constructed.

Thus, a piezoelectric oscillator or the like can be configured using a base not additionally provided with the first and second connection members, while a base additionally provided with the first and second connection members can be used. can be used to configure a piezoelectric vibrator, a piezoelectric vibrator with a built-in temperature sensor, or the like. That is, since the base can be shared by the piezoelectric oscillator and the piezoelectric vibrator, the cost of the piezoelectric device can be reduced.

(2) In a preferred embodiment of the present invention, the first and second connecting members are made of at least one of solder, jumper wire, and zero ohm resistor.

According to this embodiment, the first and second connection members, which are solder, jumper wires, and zero-ohm resistors, are additionally provided, respectively, and are electrically connected to the piezoelectric vibrating reed mounting electrodes. 2. By electrically connecting the electronic component mounting electrodes and the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals, a piezoelectric vibrator, a piezoelectric vibrator with a built-in temperature sensor, etc. can be configured.

(3) In another embodiment of the present invention, the one type of electronic component selected from the two types of electronic components is an integrated circuit device, and the other type of electronic component is a temperature sensor. element.

According to this embodiment, a piezoelectric device such as a piezoelectric oscillator incorporating an integrated circuit element or a piezoelectric device such as a piezoelectric vibrator incorporating a temperature sensor can be constructed.

(4) In one embodiment of the present invention, the first and second connection members are not provided, and the plurality of electronic component mounting electrodes are selected from the two types of electronic components. One type of electronic component is mounted.

According to this embodiment, the first and second connecting members are not provided. Therefore, the first and second connecting members are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reed is mounted. The second electronic component mounting electrode and the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals for surface mounting are not electrically connected. That is, the piezoelectric vibrating piece and the external connection terminal are not electrically connected, and one type of electronic component selected from two types of electronic components is mounted on the plurality of electronic component mounting electrodes. Therefore, by using the electronic component as an integrated circuit element including an oscillation circuit connected to the piezoelectric vibrating reed, a piezoelectric oscillator or the like can be configured.

(5) In another embodiment of the present invention, the first and second connection members are additionally provided, respectively, so that the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes are provided. electronic component mounting electrodes are electrically connected to each other, and one of the two types of electronic components is connected to the remaining plurality of electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes. The selected other type of electronic component is mounted.

According to this embodiment, the first and second electronic component mounting electrodes electrically connected to the piezoelectric vibrating reed mounting electrodes are the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals. It is electrically connected to the component-mounting electrodes through the first and second connection members that are additionally provided. That is, the piezoelectric vibrating reed mounting electrodes are directly connected to the external connection terminals, and the rest of the plurality of electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes are used for two types of electronic component mounting electrodes. Since the other type of electronic component selected from the above is mounted, a piezoelectric vibrator with a built-in temperature sensor can be configured by using the electronic component as, for example, a temperature sensor element.

(6) In still another aspect of the present invention, the first and second connection members are additionally provided, respectively, so that the first and second electronic component mounting electrodes and the third and fourth The electronic component mounting electrodes are electrically connected to each other, and none of the electronic component mounting electrodes are mounted on the plurality of electronic component mounting electrodes.

According to this embodiment, the piezoelectric vibrating reed mounting electrode on which the piezoelectric vibrating reed is mounted is directly connected to the external connection terminal via the additionally provided first and second connecting members. Since none of the types of electronic components are mounted on the plurality of electronic component mounting electrodes, a piezoelectric vibrator is formed.

(7) In a preferred embodiment of the present invention, the base includes a substrate portion, a first frame portion formed on the outer peripheral portion of one main surface side of the substrate portion, and the other main surface side of the substrate portion. and a second frame portion formed on the outer peripheral portion of the housing portion, and the substrate portion and the first frame portion constitute a first housing recess portion for housing the piezoelectric vibrating reed as the housing recess portion. In addition, the substrate portion and the second frame portion constitute a second storage recess capable of storing the electronic component, and the opening of the first storage recess is airtightly sealed by the lid. The pair of piezoelectric vibrating reed mounting electrodes are formed on the inner surface of the first housing recess, and the plurality of electronic component mounting electrodes are formed on the inner surface of the second housing recess.

According to this embodiment, the base has a substantially H-shaped cross-section with storage recesses on both sides, so that the piezoelectric vibrating reed and the electronic component can be stored in separate storage spaces.

(8) In another embodiment of the present invention, the substrate portion has a rectangular shape in plan view, and the external connection terminals for surface mounting are formed along an outer peripheral portion of the substrate portion which has a rectangular shape in plan view. provided at the four corners of the end surface of the second frame portion.

According to this embodiment, the external connection terminals are provided at the four corners of the second frame portion which is rectangular in plan view, so that it can be applied to a piezoelectric device having a general arrangement of external connection terminals, and has high versatility. becomes.

(9) In still another embodiment of the present invention, the other type of electrons is projected onto the second housing recess by projecting the piezoelectric vibrating reed housed in the first housing recess. A temperature sensor element as a part is housed and arranged.

According to this embodiment, the temperature sensor element as the electronic component is arranged in the projection area obtained by projecting the piezoelectric vibrating piece housed in the first housing recess onto the second housing recess. can be accurately and quickly detected by the temperature sensor element.

(10) The method of manufacturing a piezoelectric device according to the present invention has at least one housing recess in which the piezoelectric vibrating piece is housed and in which one type of electronic component selected from at least two types of electronic components can be housed. A method for manufacturing a piezoelectric device comprising an insulating base and a lid for hermetically sealing an opening of a storage recess of the base, comprising:
comprising a first step of pre-preparing the base;
The base includes a pair of piezoelectric vibrating reed mounting electrodes on which the stored piezoelectric vibrating reed is mounted, and one type of electronic component selected from the two types of electronic components. are formed with a plurality of electrodes for mounting electronic components that can be mounted,
first and second electronic component mounting electrodes among the plurality of electronic component mounting electrodes are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes, respectively;
The outer bottom surface of the base is provided with a plurality of external connection terminals for surface mounting which are electrically connected to the remaining plurality of electronic component mounting electrodes other than the first and second electronic component mounting electrodes. and
the other type of electronic component selected from the two types of electronic components can be mounted on the plurality of remaining electronic component mounting electrodes of the base;
a second step of mounting the piezoelectric vibrating piece on the base prepared in the first step;
An electronic component capable of being mounted with the first and second electronic component mounting electrodes and the other type of electronic component among the plurality of remaining electronic component mounting electrodes. First and second connection members are additionally provided between the third and fourth electronic component mounting electrodes other than the mounting electrodes, respectively, so that the first and second electronic component mounting electrodes and the third electronic component mounting electrodes are connected to each other. 3, and a third step of electrically connecting the fourth electrode for mounting electronic components to each other.

According to the piezoelectric device manufacturing method of the present invention, in the base prepared in the first step, the first and second electrodes electrically connected to the pair of piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reeds are mounted. The electronic component mounting electrodes are not electrically connected to the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals for surface mounting. That is, the pair of electrodes for mounting the piezoelectric vibrating reed is not directly connected to the external connection terminal.

Between the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes, first and second connection members are additionally provided, respectively. By performing a third step of electrically connecting the electronic component mounting electrodes and the third and fourth electronic component mounting electrodes, respectively, as required, the piezoelectric vibrating piece mounting electrodes and the external connection terminals and can be electrically connected.

Therefore, by performing the third step, a piezoelectric vibrator or the like can be manufactured using the base in which the piezoelectric vibrating reed mounting electrodes and the external connection terminals are electrically connected. By not doing so, a piezoelectric oscillator or the like can be manufactured using a base in which the electrodes for mounting the piezoelectric vibrating reed and the external connection terminals are not electrically connected.

In this way, a piezoelectric vibrator or a piezoelectric oscillator can be manufactured depending on whether or not the third step is performed, so that the base can be shared by both the piezoelectric vibrator and the piezoelectric oscillator. The cost of piezoelectric devices can be reduced.

(11) In a preferred embodiment of the present invention, the one type of electronic component selected from the two types of electronic components is applied to the plurality of electronic component mounting electrodes of the base without performing the third step. A fourth step of mounting electronic components is included.

According to this aspect, without performing the third step, the first and second electronic component mounting electrodes electrically connected to the pair of piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reed is mounted; In a state in which the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals for surface mounting are not electrically connected, two types of electrons are applied to the plurality of electronic component mounting electrodes. Since one type of electronic component selected from the components is mounted, the electronic component is, for example, an integrated circuit element including an oscillator circuit connected to the piezoelectric vibrating reed, thereby manufacturing a piezoelectric oscillator or the like. can do.

(12) In another embodiment of the present invention, the third step is performed to apply the second electrode to the remaining plurality of electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes of the base. A fourth step of mounting the other type of electronic component selected from among the types of electronic components is included.

According to this embodiment, the third step is performed to electrically connect the first and second electronic component mounting electrodes electrically connected to the piezoelectric vibrating reed mounting electrodes to the external connection terminals. are electrically connected to the third and fourth electronic component mounting electrodes provided through the additionally provided first and second connection members, respectively. That is, the piezoelectric vibrating reed mounting electrodes are directly connected to the external connection terminals, and the rest of the plurality of electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes are used for two types of electronic component mounting electrodes. Since the other type of electronic component selected from the above is mounted, by using the electronic component as, for example, a temperature sensor element or the like, a piezoelectric vibrator or the like with a built-in temperature sensor can be manufactured.

According to the present invention, a piezoelectric oscillator or the like can be configured using a base that is not additionally provided with the first and second connection members, while the first and second connection members are additionally provided. A piezoelectric vibrator, a piezoelectric vibrator with a built-in temperature sensor, or the like can be configured using the base. That is, since the base can be shared by the piezoelectric oscillator and the piezoelectric vibrator, the cost of the piezoelectric device can be reduced.

FIG. 1 is a schematic cross-sectional view of a temperature-compensated crystal oscillator according to one embodiment of the present invention. FIG. 2 is a plan view of the temperature-compensated crystal oscillator of FIG. 1 with the lid removed. 3 is a bottom view of the temperature compensated crystal oscillator of FIG. 1. FIG. FIG. 4 is a bottom view of the temperature-compensated crystal oscillator of FIG. 1 before mounting an IC chip. FIG. 5 is a plan view of an IC chip. FIG. 6 is a schematic cross-sectional view of a crystal oscillator with a built-in temperature sensor according to one embodiment of the present invention. FIG. 7 is a bottom view of the crystal oscillator incorporating the temperature sensor of FIG. FIG. 8 is a bottom view of the crystal oscillator with a built-in temperature sensor in FIG. 6 before the thermistor is mounted.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

In the piezoelectric device according to the present invention, the base can be shared by the piezoelectric oscillator and the piezoelectric vibrator. In this embodiment, a temperature compensated crystal oscillator (TCXO) as a piezoelectric oscillator and a crystal oscillator incorporating a temperature sensor as a piezoelectric oscillator share a base.

First, the temperature compensated crystal oscillator will be explained. FIG. 1 is a cross-sectional view showing a schematic configuration of a temperature-compensated crystal oscillator 1 as a piezoelectric device according to one embodiment of the present invention, and FIG. 3 is a bottom view of the temperature compensated crystal oscillator 1, and FIG. 4 is a bottom view of the temperature compensated crystal oscillator 1 before the IC chip 11 is mounted.

The package 2 of the temperature compensated crystal oscillator 1 of this embodiment consists of a base 5 having first and second storage recesses 3 and 4 on the top and bottom, and a seam ring 6 interposed between the base 5 and the first storage recess 3 . A lid 7 as a lid is joined to the opening and hermetically seals the first storage recess 3 . The package 2 has a substantially rectangular parallelepiped shape and is rectangular in plan view.

A crystal vibrating piece 8 as a piezoelectric vibrating piece is housed in the first housing recess 3 which is recessed on the upper side of the base 5 . In the second storage recess 4 which is recessed on the lower side of the base 5, one selected from two types of electronic components corresponding respectively to the temperature compensated crystal oscillator 1 and the crystal oscillator with a built-in temperature sensor, which will be described later. A variety of electronic components can be stored. In this example, an IC chip 11 as an integrated circuit element, which is one type of electronic component corresponding to the temperature compensated crystal oscillator 1, is accommodated.

The base 5 is made of an insulating material, and includes a substrate portion 5a having a rectangular flat plate shape in a plan view, and a substrate portion 5a protruding upward along the outer peripheral portion of one main surface side (upper side in FIG. 1) of the substrate portion 5a. A first frame portion 5b having a rectangular frame shape in a plan view and a second frame having a rectangular frame shape in a plan view projected downward along the outer peripheral portion of the other main surface side (lower side in FIG. 1) of the substrate portion 5a. It has a portion 5c and has a substantially H-shaped cross section.

The substrate portion 5a and the first frame portion 5b on the upper side constitute the first recessed portion 3 for storing the crystal vibrating piece 8, and the IC chip 11 is formed by the substrate portion 5a and the second frame portion 5c on the lower side. A second storage recess 4 in which is stored is configured.

In this way, the crystal vibrating piece 8 and the IC chip 11 are housed in the first and second housing recesses 3 and 4, which are separate spaces, respectively. It has the effect of being able to make it less susceptible to noise that occurs.

The base 5 is made of a ceramic material such as alumina, and is formed by laminating ceramic green sheets and integrally firing them.

The first housing recess 3 is substantially rectangular in plan view, and on one end side of its inner bottom surface (the left side in FIGS. 1 and 2) are provided excitation electrodes 8a, 8a ( In FIG. 2, only the surface side is shown), and a pair of crystal vibrating piece mounting electrodes 3a, 3a electrically connected to each other are formed in parallel.

One end of the crystal vibrating piece 8 connected to the excitation electrodes 8a, 8a of the crystal vibrating piece 8 is conductively bonded to and mounted on the pair of crystal vibrating piece mounting electrodes 3a, 3a via a conductive adhesive 10. FIG.

The second storage recess 4 of the base 5 of this embodiment is configured as follows so that the base 5 can be shared by the temperature-compensated crystal oscillator 1 and a crystal oscillator incorporating a temperature sensor, which will be described later. .

As shown in FIGS. 3 and 4, the second storage recess 4 is substantially rectangular in plan view. On the inner bottom surface of the second housing recess 4 is one type of electronic component selected from the two types of electronic components shown in FIG. A plurality of first to sixth electronic component mounting electrodes 4a to 4f, six in this example, are formed so that an IC chip 11 as an integrated circuit element can be mounted. The first to sixth electronic component mounting electrodes 4a to 4f correspond to the first to sixth electrode pads 11a to 11f of the IC chip 11, respectively.

This IC chip 11 has an oscillating circuit unit connected to the crystal unit 1, a temperature detecting unit for detecting temperature, and a temperature compensating circuit unit for compensating temperature based on the detected temperature, all integrated into one chip. is an integrated circuit element of

This IC chip 11 includes first and second electrode pads 11a and 11b (Xtal, Xtal) for crystal, a third electrode pad 11c (VAFC) for AFC (Auto Frequency Control) voltage input, It has a fourth electrode pad 11d (CSOUT) for oscillation output, a fifth electrode pad 11e (VSS) for ground, and a sixth electrode pad 11f (VDD) for power supply.

As shown in FIGS. 3 and 4, third, first and fifth electronic component mounting electrodes 4c, 4a and 4e are formed along the upper long side toward the inner bottom surface of the second housing recess 4. , sixth, second and fourth electronic component mounting electrodes 4f, 4b and 4d are formed along the lower long side toward the inner bottom surface of the second housing recess 4. As shown in FIG. In this example, the third, first and fifth electronic component mounting electrodes 4c, 4a and 4e are rectangular wiring patterns extending downward, and the sixth, second and fourth electronic component mounting electrodes 4c, 4a and 4e are rectangular wiring patterns extending downward. The electrodes 4f, 4b, and 4d are rectangular wiring patterns extending upward. Note that the number of electronic component mounting electrodes is formed according to the electrode pads of the mounted IC chip, so six or more may be configured according to the additional function of the IC chip.

Further, in the second storage recess 4, a thermistor as a temperature sensor element, which is the electronic component of the other type selected from the above two types of electronic components, is mounted at the right end of the upper long side. 5 The electronic component mounting electrode 4e extends longer than the first and third electronic component mounting electrodes 4a and 4c toward the lower side, that is, toward the opposing long side. The sixth electronic component mounting electrode 4f extends longer than the second and fourth electronic component mounting electrodes 4b and 4d, that is, toward the opposing long sides. As a result, as shown in FIG. 7 which will be described later, the thermistor 9 can be mounted by joining the external terminals 9a, 9a at both ends thereof to the fifth and sixth electronic component mounting electrodes 4e, 4f by soldering or the like. It has become.

The first and second electronic component mounting electrodes 4a and 4b at the centers of the upper and lower long sides of the second housing recess 4 are connected to the pair of crystal resonator plate mounting electrodes 4a and 4b via wiring inside the base 5. are electrically connected to the electrodes 3a, 3a. That is, the first and second electronic component mounting electrodes 4a and 4b are electrically connected to the excitation electrodes 8a and 8a of the crystal vibrating piece 8 housed in the first housing recess 3, respectively.

On the lower end surface of the second frame portion 5c of the base 5, that is, on the four corners of the outer bottom surface of the base 5, there are provided surface mounting 4s for mounting the temperature compensated crystal oscillator 1 on an external circuit board or the like. First to fourth external connection terminals 15a to 15d are formed.

Among the first to sixth electronic component mounting electrodes 4a to 4f formed on the inner bottom surface of the second housing recess 4, they are electrically connected to a pair of crystal vibrating piece mounting electrodes 3a, 3a, respectively. The remaining third to sixth electronic component mounting electrodes 4c to 4f other than the first and second electronic component mounting electrodes 4a and 4b are close to the four corners of the inner bottom surface, and are connected to the wiring inside the base 5. are electrically connected to the first to fourth external connection terminals 15a to 15d, respectively.

The first to sixth electrode pads 11a to 11f of the IC chip 11 are joined to the first to sixth electronic component mounting electrodes 4a to 4f of the second housing recess 4 of the base 5 by metal bumps or solder, respectively. and mounted.

Specifically, the first and second electrode pads 11a and 11b (Xtal, Xtal) for crystal of the IC chip 11 are electrically connected to the electrodes 3a and 3a for mounting the crystal vibrating piece. 2 are electrically connected to the electronic component mounting electrodes 4a and 4b, respectively.

Also, the third electrode pad 11c (VAFC) for AFC voltage input of the IC chip 11 is connected to the third electronic component mounting electrode 4c electrically connected to the first external connection terminal 15a on the outer bottom surface of the base 5. An electrically connected fourth electrode pad 11d (CSOUT) for oscillation output of the IC chip 11 is electrically connected to the fourth electronic component mounting electrode 4d electrically connected to the second external connection terminal 15b. The fifth electrode pad 11e (VSS) for grounding the IC chip 11 is electrically connected to the fifth electronic component mounting electrode 4e electrically connected to the third external connection terminal 15c, and the IC A chip power supply sixth electrode pad 11f (VDD) is electrically connected to the sixth electronic component mounting electrode 4f electrically connected to the fourth external connection terminal 15d.

Therefore, the first external connection terminal 15a on the outer bottom surface of the base 5 serves as an AFC voltage input terminal (VAFC), the second external connection terminal 15b serves as an oscillation output terminal (OUTPUT), and a third external connection terminal. 15c serves as a ground terminal (GND), and the fourth external connection terminal 15d serves as a power supply terminal (Vcc).

In this way, the crystal vibrating piece 8 is mounted on the crystal vibrating piece mounting electrodes 3a, 3a on the inner bottom surface of the first housing recess 3 of the base 5, and the first to second electrodes of the second housing recess 4 of the base 5 are mounted. 6 By mounting an IC chip 11 on the electronic component mounting electrodes 4a to 4f and hermetically sealing the first housing recess 3 with a lid 7, the surface mount type temperature compensated crystal shown in FIG. An oscillator 1 can be constructed.

Next, the temperature-compensated crystal oscillator 1 and the crystal oscillator with a built-in temperature sensor, which shares the package 2, will be described.

FIG. 6 is a cross-sectional view showing a schematic configuration of a crystal oscillator 21 with a built-in temperature sensor as a piezoelectric device according to one embodiment of the present invention, and FIG. 7 is a bottom view of the crystal oscillator 21 with a built-in temperature sensor. FIG. 8 is a bottom view of the temperature sensor built-in crystal oscillator 21 before the thermistor 9 is mounted.

6 to 8, portions that are the same as or correspond to those of the temperature-compensated crystal oscillator 1 are given the same or corresponding reference numerals.

A crystal vibrating piece 8 is mounted in the first housing recess 3 of the base ₅₁ of the crystal vibrator 21 with a built-in temperature sensor, as in the case of the temperature compensated crystal oscillator 1 .

A thermistor 9 as a temperature sensor element is mounted in the second housing recess _4-1 of the base _5-1 .

Since the thermistor 9 is mounted on the fifth and _sixth electronic component mounting electrodes 4e and 4f on the inner bottom surface of the second housing recess 41 as described above, the thermistor 9 is mounted in the first housing recess 3 The crystal vibrating piece 8 which is rectangular in plan view and stored in the second storage recess 4 is located in a rectangular projected area. Thereby, the thermistor 9 can detect the temperature of the crystal vibrating piece 8 accurately and quickly.

The fifth and sixth electronic component mounting electrodes 4e and 4f on which the thermistor 9 is mounted are electrically connected to the third and fourth external connection terminals 15c and 15d on the outer bottom surface of the base ₅₁ , respectively, as described above. It is connected to the.

Therefore, in the crystal oscillator 21 with a built-in temperature sensor, the third and fourth external connection terminals 15c, 15d are thermistor terminals (TH, TH).

In the crystal resonator 21 with a built-in temperature sensor, the first and second electronic component mounting electrodes 4a are electrically connected to the pair of crystal resonator plate mounting electrodes 3a, 3a on which the crystal resonator plate 8 is mounted. , 4b must be connected to the first and second external connection terminals 15a and 15b via the third and fourth electronic component mounting electrodes 4c and 4d, respectively. That is, it is necessary to electrically connect the excitation electrodes 8a, 8a of the crystal vibrating piece 8 to the first and second external connection terminals 15a, 15b.

For this reason, in the crystal oscillator 21 with a built-in temperature sensor of the present embodiment, in the second housing recess 4 shown in FIG. As shown in FIG. 8, solder as a first connecting member 13 is additionally provided between the first electronic component mounting electrode 4a and the third electronic component mounting electrode 4c. It is electrically connected to the mounting electrode 4c.

Similarly, solder is additionally provided as a second connection member 14 between the second electronic component mounting electrode 4b and the adjacent fourth electronic component mounting electrode 4d, thereby The electrode 4b for mounting the fourth electronic component and the electrode 4d for mounting the fourth electronic component are electrically connected.

In this way, the first and second connection members 13 additionally provided with the first and second electronic component mounting electrodes 4a and 4b and the third and fourth electronic component mounting electrodes 4c and 4d are respectively provided therebetween. , 14 are electrically connected to each other.

As a result, the first and second crystal vibrating piece mounting electrodes 3a and 3a and the third and fourth electronic component mounting electrodes 4c and 4d electrically connected to the first and second electronic component mounting electrodes are connected. are electrically connected to the first and second external connection terminals 15a and 15b, respectively. Therefore, the first and second external connection terminals 15a and 15b become crystal terminals (Xtal, Xtal).

In this way, the first and second connection members 13 additionally provided with the first and second electronic component mounting electrodes 4a and 4b and the third and fourth electronic component mounting electrodes 4c and 4d are respectively provided therebetween. , 14, respectively, thermistor 9 is mounted on the fifth and sixth electronic component mounting electrodes 4e and 4f, and the first housing recess 3 is mounted on the lid 7, as shown in FIG. By hermetically sealing with , the crystal oscillator 21 with a built-in surface-mounted temperature sensor shown in FIG. 6 can be formed.

Therefore, the first and second electronic component mounting electrodes 4a and 4b and the third and fourth electronic component mounting electrodes 4c and 4d of the second housing recess 4 of the base 5 of the temperature compensated crystal oscillator 1 are By additionally providing the first and second connection members 13 and 14 between them, it is possible to share the base ₅₁ of the crystal resonator 21 with a built-in temperature sensor.

Thus, a conventional example of preparing a base corresponding to a temperature-compensated crystal oscillator and a base corresponding to a crystal oscillator with a built-in temperature sensor and manufacturing a temperature-compensated crystal oscillator and a crystal oscillator with a built-in temperature sensor, respectively Management costs and manufacturing costs can be reduced compared to .

The temperature-compensated crystal oscillator 1 and the crystal oscillator 21 with a built-in temperature sensor, which share the base 5 as described above, can be manufactured by the following procedure.

That is, a method of manufacturing a piezoelectric device according to one embodiment of the present invention includes first to third steps.

In the first step, the base 5 shown in FIGS. 1 to 4 is prepared in advance.

In the second step, the crystal vibrating piece 8 is mounted in the first housing recess 3 of the base 5 prepared in the first step.

The third step is a step that is performed as necessary. In this third step, the first and second electronic component mounting electrodes 4a and 4b on the inner bottom surface of the second housing recess 4 of the base 5, Solders as first and second connecting members 13 and 14 are additionally provided between the third and fourth electronic component mounting electrodes 4c and 4d, respectively, so that the first and second electronic component mounting electrodes 4a , 4b are electrically connected to the third and fourth electronic component mounting electrodes 4c and 4d, respectively.

Therefore, in manufacturing the crystal oscillator 21 with a built-in temperature sensor, which requires that the electrodes 3a, 3a for mounting the crystal vibrating piece are electrically connected to the first and second external connection terminals 15a, 15b, this third carry out the process. That is, in manufacturing the crystal resonator 21 with a built-in temperature sensor, the first and second electronic component mounting electrodes 4a and 4b electrically connected to the pair of crystal resonator plate mounting electrodes 3a and 3a, and the first , third and fourth electronic component mounting electrodes 4c and 4d electrically connected to second external connection terminals 15a and 15b, and first and second connection members 13 and 14 are additionally provided, respectively. Connect electrically.

On the other hand, the third step is not performed in manufacturing the temperature-compensated crystal oscillator 1 in which the first to sixth electronic component mounting electrodes 4a to 4f must be electrically separated.

After that, in the case of manufacturing the crystal oscillator 21 with a built-in temperature sensor, as a fourth step, the inner bottom surface of the second housing recess 4 of the base 5, other than the third and fourth electronic component mounting electrodes 4c and 4d, is removed. A thermistor 9 is mounted on the fifth and sixth electronic component mounting electrodes 4e and 4f.

Furthermore, the opening of the first housing portion 3 in which the crystal vibrating piece 8 is mounted is airtightly sealed with the lid 7 to obtain the crystal vibrator 21 with a built-in temperature sensor.

When manufacturing the temperature-compensated crystal oscillator 1, the first to sixth electronic component mounting electrodes 4a to 4a of the second housing recess 4 of the base 5 can be manufactured as a fourth step without performing the third step. An IC chip 11 is mounted on 4f.

Further, the opening of the first housing recess 3 in which the crystal vibrating piece 8 is mounted is airtightly sealed with the lid 7 to obtain the temperature compensated crystal oscillator 1 .

The order in which the second step, the third step, and the fourth step are performed is not limited to the above. 14 may be added to perform a third step of electrically connecting the first and second electronic component mounting electrodes 4a and 4b and the third and fourth electronic component mounting electrodes 4c and 4d, respectively, A fourth step of mounting the IC chip 11 may be performed before the second step.

[Other embodiments]
The present invention can also be implemented in the following forms.

(1) In the above embodiment, the base has a substantially H-shaped cross section with the first and second storage recesses on both main surface sides of the substrate portion, but the storage recesses are provided only on one main surface side. A crystal vibrating piece and an electronic component such as a thermistor may be housed and mounted in this housing recess.

(2) In the above embodiment, the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes are additionally provided between the first and second connecting members, respectively. Although they are electrically connected by solder, the first and second connection members are not limited to solder, but may be jumper wires, zero-ohm resistors, or the like, or may be combined.

(3) In the above embodiments, a thermistor is used as the temperature sensor element, but other temperature sensor elements such as diodes may be used.

(4) In the above embodiment, the temperature sensor element is mounted in the second housing recess to form a crystal oscillator with a built-in temperature sensor. good.

(5) In the above embodiments, the present invention is applied to a temperature-compensated crystal oscillator, but it may be applied to a voltage-controlled crystal oscillator or crystal oscillator other than a temperature-compensated crystal oscillator.

(6) In the above embodiments, the present invention is applied to crystal resonators and crystal oscillators, but the present invention is not limited to crystals, and is applicable to piezoelectric devices such as piezoelectric resonators and piezoelectric oscillators using various piezoelectric materials. It is possible.

1 Temperature compensated crystal oscillator (piezoelectric device)
2, _{2 1} package 3 first housing recess 3a crystal resonator element mounting electrode 4, 4 ₁ second housing recess 4a to 4f first to sixth electronic component mounting electrodes 5, 5 ₁ base 7 lid )
8 crystal vibrating piece 9 thermistor (temperature sensor element)
11 IC chip (integrated circuit element)
13 First connection member 14 Second connection member 15a to 15d First to fourth external connection terminals 21 Crystal oscillator (piezoelectric device) with built-in temperature sensor

Claims (12)

An insulative base that houses a piezoelectric vibrating reed and has at least one storage recess capable of storing one type of electronic component selected from at least two types of electronic components; and an opening of the storage recess of the base. and a lid that hermetically seals the part,
A pair of piezoelectric vibrating reed mounting electrodes on which the stored piezoelectric vibrating reed is mounted and one type of electronic component selected from the two types of electronic components can be mounted on the inner surface of the storage recess. a plurality of electrodes for mounting electronic components are formed,
first and second electronic component mounting electrodes among the plurality of electronic component mounting electrodes are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes, respectively;
The outer bottom surface of the base is provided with a plurality of external connection terminals for surface mounting which are electrically connected to the remaining plurality of electronic component mounting electrodes other than the first and second electronic component mounting electrodes. and
First and second connection members are added between the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes among the plurality of remaining electronic component mounting electrodes. can be electrically connected to each other by providing
The other type of electronic component selected from the two types of electronic components can be mounted on the plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes.
A piezoelectric device characterized by: The first and second connection members are made of at least one of solder, jumper wires, and zero ohm resistors,
A piezoelectric device according to claim 1 . The one type of electronic component selected from the two types of electronic components is an integrated circuit element, and the other type of electronic component is a temperature sensor element.
The piezoelectric device according to claim 1 or 2. The first and second connection members are not provided,
The one type of electronic component selected from the two types of electronic components is mounted on the plurality of electronic component mounting electrodes.
A piezoelectric device according to any one of claims 1 to 3. The first and second connection members are additionally provided to electrically connect the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes, respectively. has been
The other type of electronic component selected from the two types of electronic components is mounted on the plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes.
A piezoelectric device according to any one of claims 1 to 3. The first and second connection members are additionally provided to electrically connect the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes, respectively. has been
None of the electronic component mounting electrodes are mounted on the plurality of electronic component mounting electrodes,
A piezoelectric device according to any one of claims 1 to 3. The base includes a substrate portion, a first frame portion formed on an outer peripheral portion on one main surface side of the substrate portion, and a second frame portion formed on an outer peripheral portion on the other main surface side of the substrate portion. As the storage recess, the substrate portion and the first frame portion constitute a first storage recess portion in which the piezoelectric vibrating piece is stored, and the substrate portion and the second frame A second storage recess that can store the electronic component is configured by the part,
The opening of the first storage recess is hermetically sealed by the lid,
the pair of piezoelectric vibrating reed mounting electrodes are formed on the inner surface of the first housing recess,
The plurality of electronic component mounting electrodes are formed on the inner surface of the second housing recess,
A piezoelectric device according to any one of claims 1 to 6. The substrate portion has a rectangular shape in plan view,
The external connection terminals for surface mounting are provided at the four corners of the end surface of the second frame formed along the outer periphery of the board having a rectangular shape in plan view,
The piezoelectric device according to claim 7. a temperature sensor element as the electronic component of the other type is housed and arranged in a projected area obtained by projecting the piezoelectric vibrating piece housed in the first housing recess onto the second housing recess;
The piezoelectric device according to claim 7 or 8. An insulative base that houses a piezoelectric vibrating reed and has at least one storage recess capable of storing one type of electronic component selected from at least two types of electronic components; and an opening of the storage recess of the base. A method for manufacturing a piezoelectric device including a lid that hermetically seals a portion,
comprising a first step of pre-preparing the base;
The base includes a pair of piezoelectric vibrating reed mounting electrodes on which the stored piezoelectric vibrating reed is mounted, and one type of electronic component selected from the two types of electronic components. are formed with a plurality of electrodes for mounting electronic components that can be mounted,
first and second electronic component mounting electrodes among the plurality of electronic component mounting electrodes are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes, respectively;
The outer bottom surface of the base is provided with a plurality of external connection terminals for surface mounting which are electrically connected to the remaining plurality of electronic component mounting electrodes other than the first and second electronic component mounting electrodes. and
the other type of electronic component selected from the two types of electronic components can be mounted on the plurality of remaining electronic component mounting electrodes of the base;
a second step of mounting the piezoelectric vibrating piece on the base prepared in the first step;
An electronic component capable of being mounted with the first and second electronic component mounting electrodes and the other type of electronic component among the plurality of remaining electronic component mounting electrodes. First and second connection members are additionally provided between the third and fourth electronic component mounting electrodes other than the mounting electrodes, respectively, so that the first and second electronic component mounting electrodes and the third electronic component mounting electrodes are connected to each other. 3, including a third step of electrically connecting the electrode for mounting the fourth electronic component, respectively,
A method of manufacturing a piezoelectric device, characterized by: A fourth step of mounting the one type of electronic component selected from the two types of electronic components on the plurality of electronic component mounting electrodes of the base without performing the third step;
A method of manufacturing a piezoelectric device according to claim 10 . By performing the third step, the other electrode selected from the two types of electronic components is applied to the remaining plurality of electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes of the base. Including a fourth step of mounting electronic components of the type of
A method of manufacturing a piezoelectric device according to claim 10 .

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