JP2014161815A - Coating device and coating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coating device capable of coating uniformly a board with coating liquid, even when the board is in the bent state.SOLUTION: An electrospray device 100 (coating device) includes a nozzle 1 for coating a board 5 in the bent and deformed state with coating liquid. The nozzle 1 is constituted so as to perform a coating operation by moving relatively to the board 5 so that a locus along the bent and deformed shape of the board has mutually an approximately equal interval h1 to the board 5.

Description

  The present invention relates to a coating apparatus and a coating method, and more particularly to a coating apparatus and a coating method for coating a substrate with a coating liquid.

  2. Description of the Related Art Conventionally, a coating apparatus that coats a substrate with a coating liquid is known (see, for example, Patent Document 1).

  Patent Document 1 discloses an electrospray apparatus (coating apparatus) that includes a nozzle that applies a coating liquid to a substrate. In this electrospray apparatus, the substrate is disposed above the nozzle, and the coating liquid is sprayed upward (substrate side) from the nozzle by a potential difference (electric field) between the voltage applied to the coating liquid and the substrate side. And configured to be applied onto the substrate.

JP 2012-135704 A

  However, the electrospray device described in Patent Document 1 has a disadvantage that the distance between the substrate and the nozzle changes depending on the application position when the substrate disposed above the nozzle is bent downward by its own weight. For this reason, there is a problem that it is difficult to uniformly apply the coating liquid to the substrate.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to uniformly apply a coating solution to a substrate even when the substrate is bent. It is to provide a coating apparatus and a coating method.

  In order to achieve the above object, a coating apparatus according to a first aspect of the present invention includes a nozzle that applies a coating liquid to a substrate in a deformed state, and the nozzle follows a trajectory along the deformed shape of the substrate. The coating operation is performed by moving relative to the substrate so that the distance from the substrate is substantially equal to each other.

  In the coating apparatus according to the first aspect, as described above, the nozzle is moved relative to the substrate so that the distance between the nozzle and the substrate is substantially equal to each other along a trajectory along the deformed shape of the substrate. By configuring so that the coating operation is performed, even when the substrate is bent, the nozzle is relatively positioned with respect to the substrate while keeping the distance between the coating position where the coating liquid is applied to the substrate and the nozzle constant. Since the coating operation can be performed by moving, the coating liquid can be uniformly applied to the substrate.

  In the coating apparatus according to the first aspect described above, preferably, the nozzle is relatively positioned with respect to the substrate while changing the angle so that the nozzle is substantially perpendicular to the substrate along a trajectory along the deformed shape of the substrate. Is configured to move. If comprised in this way, not only the distance of the nozzle with respect to a board | substrate will be kept constant, but a nozzle is made relatively with respect to a board | substrate, keeping the angle of the nozzle with respect to the surface of the application | coating position where a coating liquid is apply | coated to a board | substrate substantially perpendicular | vertical. Since the coating operation can be performed by moving the coating liquid, the coating liquid can be more effectively and uniformly applied to the substrate.

  In the coating apparatus according to the first aspect, it is preferable that the suction stage further includes a suction stage that sucks the surface of the substrate opposite to the side to which the coating liquid is applied and maintains the substrate in a predetermined bending deformation shape. The nozzle is configured to perform a coating operation by moving relative to the suction stage along a trajectory along the bending deformation shape of the substrate in a state where the substrate is sucked by the suction portion of the suction stage. . With this configuration, the substrate can be adsorbed on the surface of the adsorption part of the adsorption stage and the coating operation can be performed while maintaining the bending shape of the substrate, so that the trajectory along the maintained bending deformation shape of the substrate can be obtained. The nozzle can be easily moved relative to the suction stage. As a result, the application operation can be performed while the distance between the application position where the application liquid is applied to the substrate and the nozzle can be easily kept constant, so that the application liquid can be easily and uniformly applied to the substrate.

  In this case, preferably, the surface of the suction portion of the suction stage has a bent shape corresponding to a predetermined bent deformation shape of the substrate, and the nozzle is bent in a state where the substrate is sucked to the suction portion of the suction stage. It moves so as to move relative to the suction stage along a trajectory along the line and perform the coating operation. If comprised in this way, since the board | substrate can be easily maintained by the surface of the adsorption | suction part of an adsorption | suction stage in a predetermined bending deformation shape, a nozzle is adsorbed by the locus | trajectory along the bending shape of the adsorption | suction part of an adsorption | suction stage. By moving relative to the stage, the distance between the nozzle and the application position where the application liquid is applied to the substrate can be easily kept constant.

  In the configuration including the suction stage, the nozzle is preferably configured to move relative to the suction stage by moving the suction stage at least in the horizontal direction and the vertical direction with respect to the nozzle. According to this structure, the distance between the application position where the application liquid is applied to the substrate and the nozzle can be easily maintained constant while the nozzle is fixed by moving the suction stage in the horizontal direction and the vertical direction. Application | coating operation | movement can be performed.

  In the configuration including the suction stage, preferably, the suction stage moves in the rotation direction in addition to the horizontal direction and the vertical direction with respect to the nozzle, so that the nozzle moves relative to the suction stage. Has been. If comprised in this way, in the state which fixed the nozzle, application | coating operation | movement can be performed, keeping the angle of the nozzle with respect to the surface of the application | coating position where a coating liquid is apply | coated to a board | substrate easily.

  A coating method according to a second aspect of the present invention includes a step of supporting a substrate in a bent and deformed state, and a step of applying a coating liquid to the substrate in a bent and deformed state by a nozzle, and the coating solution is applied by the nozzle. The step includes a step of performing a coating operation by moving the nozzle relative to the substrate so that the distance between the substrate and the nozzle is substantially equal to each other along a trajectory along the deformed shape of the substrate.

  In the coating method according to the second aspect, as described above, the nozzle is moved relative to the substrate so that the distance between the substrate and the nozzle becomes substantially equal to each other along the trajectory along the deformed shape of the substrate. By providing a step for performing the coating operation, even when the substrate is bent, the nozzle is relatively positioned with respect to the substrate while keeping the distance between the coating position where the coating liquid is applied to the substrate and the nozzle constant. Since the coating operation can be performed by moving the coating liquid, a coating method capable of uniformly coating the coating liquid on the substrate can be provided.

  According to the present invention, as described above, even when the substrate is bent, the coating liquid can be uniformly applied to the substrate.

1 is a perspective view of an electrospray device according to an embodiment of the present invention. It is a top view of the electrospray apparatus by one Embodiment of this invention. 1 is a side view of an electrospray device according to an embodiment of the present invention. It is a figure for demonstrating the movement of the nozzle of the electrospray apparatus by one Embodiment of this invention. It is a figure for demonstrating the movement of the adsorption | suction stage of the electrospray apparatus by the 1st modification of one Embodiment of this invention. It is a figure for demonstrating the movement of the adsorption | suction stage of the electrospray apparatus by the 2nd modification of one Embodiment of this invention. It is a figure for demonstrating the movement of the nozzle of the electrospray apparatus by the 3rd modification of one Embodiment of this invention.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Embodiments of the invention will be described below with reference to the drawings.

  With reference to FIGS. 1-4, the structure of the electrospray apparatus 100 by this embodiment is demonstrated. The electrospray apparatus 100 is an example of the “coating apparatus” in the present invention.

  As shown in FIGS. 1 and 2, the electrospray apparatus 100 includes a nozzle 1, a suction stage 2, a mask 3 disposed between the nozzle 1 and the suction stage 2, and the mask 3 in the direction indicated by the arrow Z <b> 1 and the arrow. And an elevating unit 4 elevating in the Z2 direction. At the time of application, a substrate 5 made of glass or the like is disposed between the suction stage 2 and the mask 3. Then, a thin film is formed on the substrate 5 by spraying the coating liquid from the nozzle 1 to the substrate 5 placed on the suction stage 2 through the mask 3.

  The nozzle 1 is configured to apply a coating liquid to the substrate 5 in a state of being bent and deformed. Specifically, the nozzle 1 is sprayed upward in a state where a predetermined voltage is applied to a coating liquid (for example, PEDOT / PSS (poly (3,4-ethylenedioxythiophene) poly (styrenesulfonate)) which is a conductive polymer) ( A thin film (not shown) is configured to be deposited on the flexurally deformed substrate 5 located in the direction of the arrow Z1) Specifically, the nozzle 1 is configured to be filled with a coating liquid. An electrode (not shown) is provided in the nozzle 1. A voltage is applied to the coating solution by this electrode.

  The nozzle 1 is disposed below the mask 3 (in the direction of arrow Z2). The nozzle 1 is configured to be movable in the X direction and the Y direction. Specifically, as shown in FIG. 2, the nozzle 1 is arranged to have an opening on the head 11 (in the Z1 direction). The head 11 is configured to be movable in the Y direction along the head support portion 12 extending in the Y direction. The head support portion 12 is configured to be movable in the X direction along a pair of fixed rail portions 13 provided on the base 101 and extending in the X direction. Thereby, the nozzle 1 is configured to be able to move on the base 101 in the XY plane (in the horizontal plane).

  The nozzle 1 is configured to be moved in the vertical direction (Z direction) by an elevating mechanism (not shown) of the head 11. Further, as shown in FIG. 4, the nozzle 1 is configured to be tiltable with respect to the vertical direction in the YZ plane by a tilt mechanism (not shown) of the head 11.

  The adsorption stage 2 has at least a surface made of a conductive material and is electrically grounded. Further, in the present embodiment, the suction stage 2 has a suction portion 2 a that sucks the surface of the substrate 5 opposite to the side to which the coating liquid is applied (arrow Z1 direction side). The adsorbing part 2a is configured to adsorb and maintain the substrate 5 made of glass or the like in a bent state so as to have a bending deformation amount d1. That is, the surface of the suction part 2 a of the suction stage 2 has a bending shape corresponding to the bending deformation amount d 1 of the substrate 5. As shown in FIG. 3, the bending deformation amount d1 means a state where the central portion of the substrate 5 is bent downward by a distance d1 from a horizontal state where the substrate 5 is not bent. The suction part 2a is the surface of the suction stage 2 on the arrow Z2 direction side.

  Moreover, as shown in FIG. 3, the surface of the adsorption | suction part 2a is formed in the catenary curve shape (curve shape formed when it hangs with both ends, such as a rope). Further, the surface of the suction portion 2a of the suction stage 2 has a downwardly convex D shape (a shape in which both ends on the Y direction side are warped in the direction of the arrow Z1 with an axis along the X direction as a center). That is, the surface of the suction part 2 a of the suction stage 2 has a bent shape corresponding to the predetermined bent deformation shape of the substrate 5.

  In addition, as shown in FIG. 1, the substrate 5 is placed (sucked) on the lower surface (suction part 2 a) of the suction stage 2. Then, by applying a potential difference between the nozzle 1 and the suction stage 2, the coating liquid ejected from the nozzle 1 flies toward the suction stage 2. Thus, it is not necessary to apply the substrate 5 while directly grounding it, so that application to the non-conductive substrate 5 is also possible.

  As shown in FIG. 2, the suction stage 2 is supported by a pair of support shafts 21 at both ends on the Y direction side. The pair of support shafts 21 are disposed at substantially the center in the X direction of the suction stage 2. Further, the suction stage 2 is configured to be rotatable around a pair of support shafts 21. Thus, after the substrate 5 is attached to the suction stage 2 with the suction portion 2a of the suction stage 2 facing upward (Z1 direction side), the suction stage 2 is rotated by 180 degrees to suck the suction stage 2 It is possible to apply the coating liquid with the portion 2a facing downward (Z2 direction side).

  Here, in this embodiment, as shown in FIG. 4, the nozzle 1 moves with respect to the substrate 5 so that the distance h <b> 1 between the nozzle 5 and the substrate 5 is substantially equal to each other along a trajectory along the deformed shape of the substrate 5. Thus, the coating operation is performed. Specifically, the nozzle 1 moves to the suction stage 2 along a trajectory along the bending deformation shape of the substrate 5 in a state where the substrate 5 is sucked to the suction portion 2a of the suction stage 2 and performs a coating operation. It is configured as follows. That is, the nozzle 1 is configured to move up and down in the Z direction (vertical direction) so as to follow the bending deformation shape of the substrate 5 when moving in the Y direction. The nozzle 1 is configured to move relative to the substrate 5 while changing the angle so that the nozzle 1 is substantially perpendicular to the substrate 5 along a trajectory along the deformed shape of the substrate 5.

  Further, in the present embodiment, the nozzle 1 moves with respect to the suction stage 2 along the trajectory along the bending shape of the suction portion 2a in a state where the substrate 5 is sucked to the suction portion 2a of the suction stage 2 and performs a coating operation. Is configured to do.

  The mask 3 is made of a resin excellent in chemical resistance, processing accuracy, dimensional stability, insulation resistance, rigidity, and the like. For example, the mask 3 is made of PTFE (Polytetrafluoroethylene), PP (Polypropylene), HDPE (High-density polyethylene), PET (Polyethylene terephthalate), EPOXY, glass epoxy, ABS (APE). (Polyoxymethylene).

  The mask 3 is disposed in the vicinity of the substrate 5 (adhered to the lower side of the substrate 5). The mask 3 is formed with a plurality of openings (not shown) having a predetermined opening pattern in plan view (viewed from the Z direction).

  Moreover, as shown in FIGS. 1-3, the raising / lowering part 4 is formed in plate shape so that the both ends of the Y direction side of the mask 3 may be supported from the downward direction. A pair of lifting parts 4 are arranged on both sides in the Y direction. The mask 3 is brought into close contact with the lower side of the substrate 5 by raising the elevating unit 4 to the suction stage 2 side (Z1 direction side) while the vicinity of the end in the Y direction of the mask 3 is supported by the elevating unit 4. Are arranged as follows.

  Next, the effect of this embodiment will be described.

  In the present embodiment, as described above, the nozzle 1 is moved relative to the substrate 5 so that the distance h1 between the nozzle 5 and the substrate 5 is substantially equal to each other along a trajectory along the deformed shape of the substrate 5. By performing the application operation, even when the substrate 5 is in a bent state, the distance between the application position where the application liquid is applied to the substrate 5 and the nozzle 1 is kept constant with respect to the substrate 5. In addition, since the coating operation can be performed by moving the nozzle 1, the coating solution can be uniformly applied to the substrate 5.

  Further, in the present embodiment, as described above, the nozzle 1 is changed with respect to the substrate 5 while changing the angle so that the nozzle 1 is substantially perpendicular to the substrate 5 along a locus along the deformed shape of the substrate 5. It is configured to move relatively. Thereby, not only the distance of the nozzle 1 with respect to the substrate 5 is kept constant, but also the angle of the nozzle 1 with respect to the surface of the application position where the coating liquid is applied to the substrate 5 is kept substantially perpendicular to the substrate 5. Since the application operation can be performed by moving the nozzle 1, the application liquid can be more effectively and uniformly applied to the substrate 5.

  Further, in the present embodiment, as described above, the nozzle 1 is moved relative to the suction stage 2 along the trajectory along the bending deformation shape of the substrate 5 in a state where the substrate 5 is sucked to the suction portion 2a of the suction stage 2. The coating operation is performed by relatively moving. Accordingly, the application operation can be performed while adsorbing the substrate 5 to the surface of the adsorption part 2a of the adsorption stage 2 and maintaining the bending shape of the substrate 5, so that the locus along the bent deformation shape of the substrate 5 is maintained. Thus, the nozzle 1 can be easily moved relative to the suction stage 2. As a result, since the coating operation can be performed while the distance between the coating position where the coating liquid is applied to the substrate 5 and the nozzle 1 can be easily kept constant, the coating liquid can be easily and uniformly applied to the substrate 5. it can.

  Further, in the present embodiment, as described above, the nozzle 1 is moved relative to the suction stage 2 along a trajectory along a bent shape in a state where the substrate 5 is sucked to the suction portion 2a of the suction stage 2. Thus, the coating operation is performed. Thereby, the substrate 5 can be easily maintained in a predetermined bending deformation shape by the surface of the suction portion 2a of the suction stage 2, so that the nozzle 1 moves along the locus of the suction portion 2a of the suction stage 2. Thus, the distance between the nozzle 1 and the application position where the application liquid is applied to the substrate 5 can be easily kept constant by moving the nozzle 1 relative to the suction stage 2.

  The embodiments and examples disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments and examples but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the said embodiment, although the coating device of this invention was shown with the form of the electrospray apparatus, this invention is not limited to this. The present invention may be applied to a coating apparatus other than an electrospray apparatus as long as it is an apparatus that applies a coating solution to a substrate.

  In the above-described embodiment, an example of a configuration in which the nozzle is moved relative to the substrate so that the distance between the nozzle and the substrate is substantially equal along a trajectory along the deformed shape of the substrate is shown. Is not limited to this. In the present invention, for example, the suction stage 2 is at least in the horizontal direction (Y direction) and the vertical direction (Z direction) with respect to the nozzle 1 as in the electrospray apparatus 100a (coating apparatus) according to the first modification shown in FIG. The nozzle 1 may be configured to move relatively with respect to the suction stage 2 by moving to the position. For example, the suction stage 2 is moved by the distance Ya in the horizontal direction (Y direction) and the distance Za in the vertical direction (Z direction) so that the distance h1 between the nozzle 1 and the substrate 5 is constant by the drive mechanism 22a. Also good. In this case, the angle of the nozzle 1 may be changed so as to be substantially perpendicular to the surface of the substrate 5 that has been bent and deformed.

  Further, for example, as in the electrospray apparatus 100b (coating apparatus) according to the second modification shown in FIG. 6, the suction stage 2 is added to the nozzle 1 in the horizontal direction (Y direction) and the vertical direction (Z direction). You may comprise so that the nozzle 1 may move relatively with respect to the adsorption | suction stage 2 by moving also to a rotation direction (A direction). For example, the suction mechanism 2 is moved by the drive mechanism 22b in the horizontal direction (Y direction), the vertical direction (Z direction), and the rotation direction (A direction) so that the distance h1 between the nozzle 1 and the substrate 5 is constant. May be. The rotation axis in the rotation direction may be a direction (X direction) perpendicular to the direction (Z direction) in which the nozzle 1 extends. That is, the rotation axis in the rotation direction may exist on the horizontal direction (XY direction). In other words, when the substrate 5 is bent in one direction (Y direction), the rotation axis in the rotation direction may be the ridge (ridgeline) direction (X direction) of the substrate 5 in the bent state.

  Moreover, in the said embodiment, although the example of the structure which has arrange | positioned and applied a mask between a board | substrate and a nozzle was shown, this invention is not limited to this. The present invention is also applicable to a configuration in which coating is performed without arranging a mask between the substrate and the nozzle.

  Moreover, in the said embodiment, although the example of the structure which arrange | positions a board | substrate above a nozzle and performed application | coating was shown, this invention is not limited to this. The present invention can also be applied to a configuration in which a substrate is disposed below or on the side of a nozzle for application. For example, like the electrospray apparatus 100c (coating apparatus) according to the third modified example shown in FIG. 7, the substrate 5a may be disposed below the nozzle 1 (Z2 direction side) for coating. In this case, the deformable substrate 5a wound around the rotating body 6a in a roll shape may be sent to the roller 6b, and the coating liquid may be applied by the nozzle 1 disposed above the roller 6b. In this case, the nozzle 1 is configured to move relative to the substrate 5a so as to perform the coating operation so that the distance h2 between the nozzle 5 and the substrate 5a becomes substantially equal to each other along a trajectory along the deformed shape of the substrate 5a. May be. At this time, the roll-shaped substrate 5a may be intermittently sent from the rotating body 6a to the rotating body 6c via the roller 6b. That is, after the substrate 5a is sent and stopped on the roller 6b by a certain length, the coating liquid is applied while moving the nozzle 1, and then the next substrate 5a is sent on the roller 6b by a certain length. A configuration in which the coating liquid is sequentially applied to the substrate 5a by repeating this may be employed.

  Moreover, although the example which arrange | positions the board | substrate which consists of glass etc. to the adsorption | suction stage was shown in the said embodiment, this invention is not limited to this. For example, a film-like substrate may be arranged on the suction stage.

DESCRIPTION OF SYMBOLS 1 Nozzle 2 Adsorption stage 2a Adsorption part 5, 5a Substrate 100, 100a, 100b, 100c Electrospray apparatus (coating apparatus)

Claims (7)

Provided with a nozzle that applies the coating liquid to the substrate in a deformed state,
The nozzle is configured to perform a coating operation by moving relative to the substrate so that the distance between the nozzle and the substrate is substantially equal to each other along a trajectory along a bent and deformed shape of the substrate. Coating device.   The nozzle is configured to move relative to the substrate while changing an angle so that the nozzle is substantially perpendicular to the substrate along a trajectory along a deformed shape of the substrate. The coating apparatus according to claim 1. A suction stage including a suction portion that sucks a surface of the substrate opposite to the side on which the coating liquid is applied and maintains the substrate in a predetermined bending deformation shape;
The nozzle is moved relative to the suction stage along a trajectory along the bending deformation shape of the substrate in a state where the substrate is sucked to the suction portion of the suction stage to perform a coating operation. The coating device according to claim 1 or 2, wherein the coating device is configured. The surface of the suction part of the suction stage has a bending shape corresponding to a predetermined bending deformation shape of the substrate,
The nozzle is configured to perform a coating operation by moving relative to the suction stage along a trajectory along the bending shape in a state where the substrate is sucked by the suction portion of the suction stage. The coating apparatus according to claim 3.   The said adsorption | suction stage is comprised so that the said nozzle may move relatively with respect to the said adsorption | suction stage by moving to a horizontal direction and a perpendicular direction at least with respect to the said nozzle. Coating device.   The said adsorption | suction stage is comprised so that the said nozzle may move relatively with respect to the said adsorption | suction stage by moving also in a rotation direction in addition to a horizontal direction and a perpendicular | vertical direction with respect to the said nozzle. The coating apparatus of any one of -5. Supporting the substrate in a deformed state;
Applying a coating solution by a nozzle to the substrate in a deformed state,
The step of applying the coating liquid by the nozzle moves the nozzle relative to the substrate so that the distance between the substrate and the nozzle is substantially equal to each other along a trajectory along the deformed shape of the substrate. A coating method including a step of performing a coating operation.

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