JP6122928B2 - Rotation limiting device and substrate transfer device including the same - Google Patents

Rotation limiting device and substrate transfer device including the same Download PDF

Info

Publication number
JP6122928B2
JP6122928B2 JP2015199366A JP2015199366A JP6122928B2 JP 6122928 B2 JP6122928 B2 JP 6122928B2 JP 2015199366 A JP2015199366 A JP 2015199366A JP 2015199366 A JP2015199366 A JP 2015199366A JP 6122928 B2 JP6122928 B2 JP 6122928B2
Authority
JP
Japan
Prior art keywords
restricting member
unit
substrate
rotation
restricting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015199366A
Other languages
Japanese (ja)
Other versions
JP2016074080A (en
Inventor
ヒュン キム テ
ヒュン キム テ
ヒュン キム サン
ヒュン キム サン
ウック キム ジョン
ウック キム ジョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HD Hyundai Heavy Industries Co Ltd
Original Assignee
Hyundai Heavy Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Heavy Industries Co Ltd filed Critical Hyundai Heavy Industries Co Ltd
Publication of JP2016074080A publication Critical patent/JP2016074080A/en
Application granted granted Critical
Publication of JP6122928B2 publication Critical patent/JP6122928B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
    • B25J9/1664—Programme controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G61/00—Use of pick-up or transfer devices or of manipulators for stacking or de-stacking articles not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Description

本発明は、基板を移送するための基板移送装置に関するものである。   The present invention relates to a substrate transfer apparatus for transferring a substrate.

ディスプレイ装置、太陽電池、半導体素子など（以下、‘電子部品’という）はさまざまな工程を経て製造される。このような製造工程は、前記電子部品を製造するための基板（Ｓｕｂｓｔｒａｔｅ）を用いてなされる。例えば、前記製造工程は基板上に導電体、半導体、誘電体などの薄膜を蒸着するための蒸着工程、蒸着された薄膜を所定パターンに形成するためのエッチング工程などを含むことができる。このような製造工程は該当工程を遂行する工程チャンバでなされる。基板移送装置は、前記工程チャンバの間に基板を移送するためのものである。   Display devices, solar cells, semiconductor elements, etc. (hereinafter referred to as “electronic components”) are manufactured through various processes. Such a manufacturing process is performed using a substrate (Substrate) for manufacturing the electronic component. For example, the manufacturing process may include a deposition process for depositing a thin film such as a conductor, a semiconductor, or a dielectric on the substrate, an etching process for forming the deposited thin film in a predetermined pattern, and the like. Such a manufacturing process is performed in a process chamber for performing the corresponding process. The substrate transfer device is for transferring a substrate between the process chambers.

図１は、従来技術に係る基板移送装置を示す概略的な斜視図である。   FIG. 1 is a schematic perspective view illustrating a substrate transfer apparatus according to the prior art.

図１を参考すると、従来技術に係る基板移送装置１は、基板Ｓを支持する移送アーム１０、前記移送アーム１０を昇降させるための昇降部２０、前記移送アーム１０を回転させるための旋回部３０、及び前記旋回部３０の回転範囲を制限するための制限部４０を含む。   Referring to FIG. 1, a substrate transfer apparatus 1 according to the related art includes a transfer arm 10 that supports a substrate S, an elevating unit 20 that moves the transfer arm 10 up and down, and a swivel unit 30 that rotates the transfer arm 10. And a limiting unit 40 for limiting the rotation range of the swivel unit 30.

前記移送アーム１０は、前記基板Ｓを支持した状態で水平方向に移動するにつれて前記基板１０を移送させる。前記移送アーム１０は、前記基板１０を支持する支持ハンド１１、前記支持ハンド１１を水平方向に移送するためのアームユニット１２、及び一側に前記アームユニット１２が結合され、他側に前記昇降部２０が結合されるアームベース１３を含む。   The transfer arm 10 transfers the substrate 10 as it moves in the horizontal direction while supporting the substrate S. The transfer arm 10 includes a support hand 11 for supporting the substrate 10, an arm unit 12 for transferring the support hand 11 in the horizontal direction, and the arm unit 12 on one side, and the lift unit on the other side. 20 includes an arm base 13 to which 20 is coupled.

前記昇降部２０は、前記移送アーム１０を上下方向に移動させる。前記昇降部２０は前記アームベース１３を昇降させることによって、前記アームベース１３に結合される前記支持ハンド１１、及び前記アームユニット１２を昇降させる。前記昇降部２０は、前記旋回部３０に結合される第１昇降ユニット２１、及び一側が前記第１昇降ユニット２１と結合され、他側が前記移送アーム１０と結合される第２昇降ユニット２２を含む。   The elevating unit 20 moves the transfer arm 10 in the vertical direction. The elevating unit 20 elevates and lowers the support base 11 and the arm unit 12 coupled to the arm base 13 by elevating and lowering the arm base 13. The elevating unit 20 includes a first elevating unit 21 coupled to the turning unit 30 and a second elevating unit 22 coupled on one side to the first elevating unit 21 and on the other side to the transfer arm 10. .

前記旋回部３０は、前記昇降部２０を回転させる。前記旋回部３０は、旋回軸３１を中心に前記昇降部２０を回転させることによって、前記移送アーム１０に支持された前記基板Ｓを回転させる。   The turning unit 30 rotates the lifting unit 20. The revolving unit 30 rotates the substrate S supported by the transfer arm 10 by rotating the elevating unit 20 around a revolving shaft 31.

前記制限部４０は、前記旋回部３０の回転範囲を制限する。前記制限部４０は、前記旋回部３０に結合される第１制限部材４１と、前記旋回部３０の回転範囲を制限するために前記旋回部３０が結合される走行フレーム５０に結合される第２制限部材４２を含む。   The limiting unit 40 limits the rotation range of the turning unit 30. The restricting portion 40 is coupled to a first restricting member 41 coupled to the turning portion 30 and a traveling frame 50 to which the turning portion 30 is coupled in order to restrict a rotation range of the turning portion 30. A limiting member 42 is included.

前記第１制限部材４１は、前記旋回部３０に結合される。前記旋回部３０が回転する場合、前記第１制限部材４１は前記旋回部３０の回転範囲が制限されるように前記第２制限部材４２と接する。   The first limiting member 41 is coupled to the turning unit 30. When the turning unit 30 rotates, the first limiting member 41 contacts the second limiting member 42 so that the rotation range of the turning unit 30 is limited.

前記第２制限部材４２は、前記走行フレーム５０に結合される。前記第２制限部材４２は、前記旋回軸３１が時計方向または時計反回り方向に回転するにつれて前記第１制限部材４１の移動を制限することによって、前記旋回部３０の回転範囲を制限する。   The second restricting member 42 is coupled to the traveling frame 50. The second restricting member 42 restricts the rotation range of the turning unit 30 by restricting the movement of the first restricting member 41 as the turning shaft 31 rotates clockwise or counterclockwise.

ここで、従来技術に係る基板移送装置１は、前記第２制限部材４２により前記第１制限部材４１の移動経路が制限されるにつれて前記旋回部３０の回転範囲が制限される。これによって、従来技術に係る基板移送装置１は前記第２制限部材４２の厚さにより前記旋回部３０が回転できない範囲（Ｒ）が形成される。したがって、従来技術に係る基板移送装置１は前記第２制限部材４２の厚さによって前記旋回部３０の回転範囲が狭くなることによって、前記旋回部３０の活動領域が制限されるので、前記基板Ｓを移送する作業の効率性を低下させる問題がある。   Here, in the substrate transfer apparatus 1 according to the related art, the rotation range of the turning unit 30 is limited as the movement path of the first limiting member 41 is limited by the second limiting member 42. Accordingly, the substrate transfer apparatus 1 according to the related art forms a range (R) in which the turning unit 30 cannot rotate due to the thickness of the second restriction member 42. Accordingly, the substrate transfer apparatus 1 according to the related art limits the active area of the swivel unit 30 by narrowing the rotation range of the swivel unit 30 due to the thickness of the second restricting member 42, so that the substrate S There is a problem of lowering the efficiency of the work of transferring.

本発明は前述したような問題点を解決するために案出したものであって、第２制限部材の厚さにより旋回軸が回転できない範囲が形成されることを防止することができる回転制限装置及びこれを含む基板移送装置を提供するためのものである。   The present invention has been devised to solve the above-described problems, and is capable of preventing a range in which the turning shaft cannot rotate from being formed by the thickness of the second limiting member. And a substrate transfer apparatus including the same.

前述したような課題を解決するために、本発明は以下のような構成を含むことができる。   In order to solve the above-described problems, the present invention can include the following configurations.

本発明に係る基板移送装置用回転制限装置は、基板を支持するための移送アームに連結され、旋回軸を中心に回転して前記移送アームを回転させる旋回部に結合される第１制限部材；前記旋回部が回転可能に結合される走行ベースに回転可能に結合され、前記第１制限部材の回転によって前記第１制限部材に接触して前記第１制限部材の回転を制限する第２制限部材；及び前記第２制限部材の位置を制御する移動部材；を含み、かつ前記第２制限部材は、前記第１制限部材が回転して前記第２制限部材と接触すれば共に回転し、前記移動部材は、前記第２制限部材が前記第１制限部材の接触によって回転時に前記第２制限部材の回転範囲が制限されるように前記第２制限部材の位置を制御して前記旋回部の１回転を保障しながら前記旋回部の連続回転を防止することを特徴とする。   A rotation limiting device for a substrate transfer apparatus according to the present invention is connected to a transfer arm for supporting a substrate, and is connected to a turning portion that rotates about a turning shaft to rotate the transfer arm; A second restricting member that is rotatably coupled to a travel base that is rotatably coupled to the swivel unit and that contacts the first restricting member by the rotation of the first restricting member and restricts the rotation of the first restricting member. And a moving member for controlling the position of the second restricting member; and the second restricting member rotates together when the first restricting member rotates and contacts the second restricting member, and the movement The member controls the position of the second restricting member so that the rotation range of the second restricting member is restricted when the second restricting member is rotated by the contact of the first restricting member, and makes one rotation of the swivel unit. Of the swivel part while ensuring Characterized in that to prevent continued rotation.

本発明に係る基板移送装置用回転制限装置によれば、前記移動部材は前記第２制限部材が前記第１制限部材との接触によって第１方向に回転して前記走行ベースに接触する第１位置、及び前記第２制限部材が前記第１制限部材との接触によって前記第１方向と反対になる第２方向に回転して前記走行ベースに接触する第２位置の間に前記第２制限部材が位置するように前記第２制限部材の位置を制御することを特徴とする。   According to the rotation limiting device for a substrate transfer apparatus according to the present invention, the moving member has a first position where the second limiting member rotates in a first direction by contact with the first limiting member and contacts the travel base. And the second limiting member is rotated between a second position where the second limiting member rotates in a second direction opposite to the first direction by contact with the first limiting member and contacts the travel base. The position of the second restricting member is controlled so as to be positioned.

本発明に係る基板移送装置用回転制限装置によれば、前記移動部材は前記第２制限部材を前記第２方向に移動させるために前記第２制限部材側に気体を噴射する第１噴射機構；及び前記第２制限部材を前記第１方向に移動させるために前記第２制限部材側に気体を噴射する第２噴射機構を含み、前記第１噴射機構及び前記第２噴射機構に基づいて前記第２制限部材が前記第１位置及び前記第２位置の間に位置するように前記第２制限部材を制御することを特徴とする。   According to the rotation restricting device for a substrate transfer apparatus according to the present invention, the moving member injects a gas toward the second restricting member in order to move the second restricting member in the second direction; And a second injection mechanism for injecting gas to the second restriction member side in order to move the second restriction member in the first direction, and based on the first injection mechanism and the second injection mechanism, The second restriction member is controlled such that the second restriction member is positioned between the first position and the second position.

本発明に係る基板移送装置用回転制限装置によれば、前記移動部材は前記第２制限部材に前記第２方向に弾性力を提供する第１弾性部材；及び前記第２制限部材に前記第１方向に弾性力を提供する第２弾性部材を含み、前記第１弾性部材及び前記第２弾性部材に基づいて前記第２制限部材が前記第１位置及び前記第２位置の間に位置するように前記第２制限部材を制御することを特徴とする。   According to the rotation limiting device for a substrate transfer apparatus according to the present invention, the moving member provides the second limiting member with an elastic force in the second direction; and the first limiting member with the first limiting member. A second elastic member that provides elastic force in a direction, and the second restricting member is located between the first position and the second position based on the first elastic member and the second elastic member. The second limiting member is controlled.

本発明に係る基板移送装置は、基板を移送させるための移送アーム；前記移送アームが位置する高さが変更されるように前記移送アームを昇降させるための昇降部；前記移送アームが向かう方向が変更されるように前記昇降部を回転させる旋回部；及び前記旋回部の回転を制限するための請求項１乃至請求項４のうち、いずれか１つの回転制限装置を含むことを特徴とする。   A substrate transfer apparatus according to the present invention includes: a transfer arm for transferring a substrate; a lifting unit for raising and lowering the transfer arm so that a height at which the transfer arm is positioned; and a direction in which the transfer arm is directed A rotation unit that rotates the elevating unit so as to be changed; and a rotation limiting device according to any one of claims 1 to 4 for limiting the rotation of the rotation unit.

本発明によれば、次のような効果を得ることができる。   According to the present invention, the following effects can be obtained.

本発明は、第２制限部材が走行フレームに移動可能に結合されることによって、第２制限部材の厚さにより旋回部が回転できない範囲が形成されることを防止し、旋回部が連続回転できないように回転を制限できるので、これによって基板を移送する作業の効率性を向上させることができる。   According to the present invention, the second restricting member is movably coupled to the traveling frame, thereby preventing the swivel portion from being rotated due to the thickness of the second restricting member and preventing the swivel portion from continuously rotating. Thus, the rotation can be limited as described above, whereby the efficiency of the work of transferring the substrate can be improved.

従来技術に係る基板移送装置を示す概略的な斜視図である。It is a schematic perspective view which shows the board | substrate transfer apparatus which concerns on a prior art. 本発明に係る基板移送装置を示す概略的な斜視図である。1 is a schematic perspective view showing a substrate transfer apparatus according to the present invention. 図２の基板移送装置における回転制限装置を説明するためにＡ部分を拡大した第１制限部材が回転する形態の拡大図である。It is an enlarged view of the form which the 1st limiting member which expanded A part in order to demonstrate the rotation limiting device in the board | substrate transfer apparatus of FIG. 2 rotates. 図２の基板移送装置における回転制限装置を説明するためにＡ部分を拡大した第１制限部材が他の方向に回転する形態の拡大図である。It is an enlarged view of the form which the 1st limiting member which expanded A part in order to demonstrate the rotation limiting device in the board | substrate transfer apparatus of FIG. 2 rotates to another direction. 図２の基板移送装置における回転制限装置の変形例を示すためにＡ部分を拡大した拡大図である。It is the enlarged view to which A part was expanded in order to show the modification of the rotation limiting device in the board | substrate transfer apparatus of FIG.

本明細書で各図面の構成要素に参照番号を付加するに当たって、同一な構成要素に限ってはたとえ他の図面上に表示されてもできる限り同一な番号を与えていることに留意すべきである。   It should be noted that, in the present specification, reference numerals are given to the components of each drawing so that the same components are given the same numbers as much as possible even if they are displayed on other drawings. is there.

一方、本明細書で叙述される用語の意味は、次の通り理解されるべきである。
単数の表現は文脈上明白に異なるように定義しない限り、複数の表現を含むと理解されなければならず、“第１”、“第２”などの用語は１つの構成要素を他の構成要素から区別するためのものであって、これら用語により権利範囲が限定されてはならない。 On the other hand, the meaning of the terms described in the present specification should be understood as follows.
Unless the singular expression is defined to be distinctly different from the context, the term “first”, “second”, etc. shall be understood to include a plurality of expressions; These terms are not intended to limit the scope of rights.

“含む”または“有する”などの用語は、１つまたはその以上の他の特徴や数字、段階、動作、構成要素、部分品、またはこれらを組み合わせたものの存在または付加可能性を予め排除しないものと理解されるべきである。   Terms such as “include” or “have” do not pre-exclude the presence or additionality of one or more other features or numbers, steps, actions, components, parts, or combinations thereof. Should be understood.

“少なくとも１つ”の用語は１つ以上の関連項目から提示可能な全ての組合を含むものと理解されるべきである。例えば、“第１項目、第２項目、及び第３項目のうちの少なくとも１つ”の意味は、第１項目、第２項目、または第３項目の各々だけでなく、第１項目、第２項目、及び第３項目のうち、２つ以上から提示できる全ての項目の組合を意味する。   The term “at least one” should be understood to include all combinations that can be presented from one or more related items. For example, the meaning of “at least one of the first item, the second item, and the third item” is not limited to each of the first item, the second item, or the third item. Of items and third items, it means a combination of all items that can be presented from two or more.

以下、本発明に係る基板移送装置の好ましい実施形態を添付した図面を参照して詳細に説明する。本発明に係る基板移送装置用回転制限装置は、本発明に係る基板移送装置に含まれるので、本発明に係る基板移送装置の好ましい実施形態を説明しながら共に説明する。   Hereinafter, preferred embodiments of a substrate transfer apparatus according to the present invention will be described in detail with reference to the accompanying drawings. Since the rotation limiting device for a substrate transfer apparatus according to the present invention is included in the substrate transfer apparatus according to the present invention, it will be described together with a preferred embodiment of the substrate transfer apparatus according to the present invention.

図１は従来技術に係る基板移送装置を示す概略的な斜視図であり、図２は本発明に係る基板移送装置を示す概略的な斜視図であり、図３は図２の基板移送装置における回転制限装置を説明するためにＡ部分を拡大した第１制限部材が回転する形態の拡大図であり、図４は図２の基板移送装置における回転制限装置を説明するためにＡ部分を拡大した第１制限部材が他の方向に回転する形態の拡大図である。   1 is a schematic perspective view showing a substrate transfer apparatus according to the prior art, FIG. 2 is a schematic perspective view showing a substrate transfer apparatus according to the present invention, and FIG. 3 is a schematic view of the substrate transfer apparatus shown in FIG. FIG. 4 is an enlarged view of a form in which a first restricting member having an enlarged A portion for explaining the rotation restricting device rotates, and FIG. 4 is an enlarged view of the A portion for explaining the rotation restricting device in the substrate transfer apparatus of FIG. It is an enlarged view of the form which a 1st restricting member rotates in another direction.

図２乃至図４を参考すると、本発明に係る基板移送装置１００は基板１１０を移送するためのものである。前記基板１１０は、ディスプレイ装置、太陽電池、半導体素子などの電子部品を製造するためのものである。例えば、本発明に係る基板移送装置１００は、前記基板１１０に対する蒸着工程、エッチング工程などの製造工程を遂行する工程チャンバの間に前記基板１１０を移送することができる。   Referring to FIGS. 2 to 4, the substrate transfer apparatus 100 according to the present invention is for transferring the substrate 110. The substrate 110 is for manufacturing electronic components such as a display device, a solar cell, and a semiconductor element. For example, the substrate transfer apparatus 100 according to the present invention can transfer the substrate 110 between process chambers that perform manufacturing processes such as a deposition process and an etching process on the substrate 110.

本発明に係る基板移送装置１００は、前記基板１１０を移送させるための移送アーム１２０、前記移送アーム１２０が位置する高さが変更されるように前記移送アームを昇降させるための昇降部１３０、前記移送アーム１２０が向かう方向が変更されるように前記昇降部１３０を回転させる旋回部１４０、及び前記旋回部１４０が連続回転できないように回転を制限するための回転制限装置２００を含む。   The substrate transfer apparatus 100 according to the present invention includes a transfer arm 120 for transferring the substrate 110, an elevating unit 130 for raising and lowering the transfer arm so that a height at which the transfer arm 120 is positioned, A turning unit 140 that rotates the elevating unit 130 so that the direction in which the transfer arm 120 heads is changed, and a rotation limiting device 200 that restricts the rotation so that the turning unit 140 cannot continuously rotate.

前記移送アーム１２０は、前記基板１１０を移送させるために前記基板１１０の下面を支持する。前記昇降部１３０は、前記基板１１０が配置された位置に前記移送アーム１２０を昇降させる。前記旋回部１４０は、前記移送アーム１２０が前記基板１１０が配置された方向に向けるように前記移送アーム１２０を回転させる。前記回転制限装置２００は、前記旋回部１４０の連続回転を制限するために前記旋回部１３０が結合される走行ベース１５０に移動可能に結合される。これによって、本発明に係る基板移送装置１００は前記回転制限装置２００が前記走行フレーム１５０に移動可能に結合されることによって、前記回転制限装置２００の厚さにより前記旋回部１４０が回転できない範囲が形成されることを防止することができる。したがって、本発明に係る基板移送装置１００は、前記旋回部１４０が回転できない範囲が形成されることを防止することによって、前記基板１１０を移送させる作業において、前記旋回部１４０が回転できない範囲に前記基板１１０を移送することができるので、前記基板１１０を移送させる作業の効率性を向上させることができる。   The transfer arm 120 supports a lower surface of the substrate 110 to transfer the substrate 110. The elevating unit 130 elevates the transfer arm 120 to a position where the substrate 110 is disposed. The swivel unit 140 rotates the transfer arm 120 so that the transfer arm 120 faces the direction in which the substrate 110 is disposed. The rotation limiting device 200 is movably coupled to a traveling base 150 to which the swivel unit 130 is coupled to restrict continuous rotation of the swivel unit 140. Accordingly, the substrate transfer apparatus 100 according to the present invention has a range in which the turning unit 140 cannot rotate due to the thickness of the rotation limiting device 200 when the rotation limiting device 200 is movably coupled to the traveling frame 150. It can be prevented from being formed. Therefore, the substrate transfer apparatus 100 according to the present invention prevents the swivel unit 140 from rotating in the range in which the swivel unit 140 cannot rotate in the operation of transferring the substrate 110 by preventing the swivel unit 140 from rotating. Since the substrate 110 can be transferred, the efficiency of the operation of transferring the substrate 110 can be improved.

以下、前記移送アーム１２０、前記昇降部１３０、前記旋回部１４０、及び前記回転制限装置２００に関して添付した図面を参照して具体的に説明する。   Hereinafter, the transfer arm 120, the elevating unit 130, the turning unit 140, and the rotation limiting device 200 will be described in detail with reference to the accompanying drawings.

図２乃至図４を参考すると、前記移送アーム１２０は前記基板１１０を移送させる。前記移送アーム１２０は、前記昇降部１３０に回転可能に結合される。前記移送アーム１２０は駆動部（図示せず）により折れたり広がったりすることによって、前記基板１１０を前記昇降部１３０の昇降経路と垂直な方向に移送させることができる。前記移送アーム１２０は、前記基板１１０を支持するための支持ハンド１２１、前記支持ハンド１２１を移動させるためのアームユニット１２２、及び前記アームユニット１２２が結合されるアームベース１２３を含む。   2 to 4, the transfer arm 120 transfers the substrate 110. The transfer arm 120 is rotatably coupled to the elevating unit 130. The transfer arm 120 may be bent or expanded by a driving unit (not shown) to transfer the substrate 110 in a direction perpendicular to the lifting path of the lifting unit 130. The transfer arm 120 includes a support hand 121 for supporting the substrate 110, an arm unit 122 for moving the support hand 121, and an arm base 123 to which the arm unit 122 is coupled.

前記支持ハンド１２１は、前記基板１１０の下面に接触することによって、前記基板１１０を支持することができる。前記支持ハンド１２１は、前記アームユニット１２２に回転可能に結合される。   The support hand 121 can support the substrate 110 by contacting the lower surface of the substrate 110. The support hand 121 is rotatably coupled to the arm unit 122.

前記アームユニット１２２は、前記支持ハンド１２１を移動させる。前記アームユニット１２２は、前記アームベース１２３に回転可能に結合される。前記アームユニット１２２が折れるか、または広がるように回転されることによって、前記支持ハンド１２１は前記基板１１０側に移動するか、または前記基板１１０から遠ざかる方向に移動する。   The arm unit 122 moves the support hand 121. The arm unit 122 is rotatably coupled to the arm base 123. When the arm unit 122 is bent or rotated so as to spread, the support hand 121 moves toward the substrate 110 or moves away from the substrate 110.

前記アームベース１２３は、前記昇降部１３０に結合される。前記アームベース１２３には前記アームユニット１２２が回転可能に結合される。前記アームベース１２３は、前記昇降部１３０により昇降できる。前記支持ハンド１２１及び前記アームユニット１２２は、前記アームベース１２３が前記昇降部１３０により昇降されるにつれて共に昇降できる。これによって、前記昇降部１３０は前記支持ハンド１２１が垂直方向に位置する高さを調節することができる。   The arm base 123 is coupled to the elevating unit 130. The arm unit 122 is rotatably coupled to the arm base 123. The arm base 123 can be moved up and down by the lifting unit 130. The support hand 121 and the arm unit 122 can move up and down together as the arm base 123 is moved up and down by the lifting unit 130. Accordingly, the elevating unit 130 can adjust the height at which the support hand 121 is positioned in the vertical direction.

前記昇降部１３０は、前記移送アーム１２０が位置する高さが変更されるように前記移送アーム１２０を昇降させる。前記昇降部１３０が前記移送アーム１２０を昇降させることによって、前記移送アーム１２０に支持された前記基板１１０を前記昇降部１３０の昇降経路に沿って移動させることができる。前記昇降部１３０は、前記旋回部１４０に結合できる。   The elevating unit 130 raises and lowers the transfer arm 120 so that the height at which the transfer arm 120 is located is changed. The lifting unit 130 moves the transfer arm 120 up and down, so that the substrate 110 supported by the transfer arm 120 can be moved along the lifting path of the lifting unit 130. The elevating unit 130 may be coupled to the turning unit 140.

前記旋回部１４０は、前記移送アーム１２０が向かう方向が変更されるように前記昇降部１３０を回転させる。前記旋回部１４０が前記旋回軸１４１を中心に回転するにつれて前記昇降部１３０及び前記移送アーム１２０が前記旋回軸１４１を中心に共に回転することができる。例えば、前記旋回部１４０は前記支持ハンド１２１が前記搬入工程及び前記搬出工程を遂行する工程チャンバ、またはカセットに向かうように前記アームベース１２３を回転させることができる。   The swivel unit 140 rotates the elevating unit 130 so that the direction in which the transfer arm 120 is directed is changed. As the swivel unit 140 rotates about the swivel shaft 141, the elevating unit 130 and the transfer arm 120 can rotate together about the swivel shaft 141. For example, the swivel unit 140 may rotate the arm base 123 so that the support hand 121 is directed to a process chamber or cassette in which the carrying-in process and the carrying-out process are performed.

前記回転制限装置２００は、前記旋回部１４０が連続回転できないように回転を制限する。前記回転制限装置２００は、前記旋回部１４０が一方向のみに回転することを防止することによって、前記移送アーム１２０、前記昇降部１３０、及び前記旋回部１４０に動力を伝達するためのケーブル（図示せず）が前記旋回部１４０に巻かれることを防止することができる。前記回転制限装置２００は、前記旋回部１４０に結合される第１制限部材２１０、前記走行ベース１５０に回転可能に結合される第２制限部材２２０、及び前記第２制限部材２２０を移動させるための移動部材２３０を含む。   The rotation limiting device 200 limits the rotation so that the turning unit 140 cannot continuously rotate. The rotation limiting device 200 is a cable for transmitting power to the transfer arm 120, the elevating unit 130, and the turning unit 140 by preventing the turning unit 140 from rotating in only one direction (see FIG. (Not shown) can be prevented from being wound around the revolving part 140. The rotation restricting device 200 moves the first restricting member 210 coupled to the turning unit 140, the second restricting member 220 rotatably coupled to the traveling base 150, and the second restricting member 220. A moving member 230 is included.

前記第１制限部材２１０は、前記基板１１０を支持するための前記移送アーム１２０が向かう方向を変更するために前記旋回軸１４１を中心に回転する旋回部１４０に結合される。前記旋回部１４０が回転するにつれて前記第１制限部材２１０が前記第２制限部材２２０に接することによって、前記旋回部１４０が連続回転できないように回転を制限することができる。   The first restricting member 210 is coupled to a turning unit 140 that rotates about the turning shaft 141 to change a direction in which the transfer arm 120 for supporting the substrate 110 is directed. As the swivel unit 140 rotates, the first restricting member 210 contacts the second restricting member 220 so that the swivel unit 140 can be restricted from rotating so that the swivel unit 140 cannot continuously rotate.

前記第２制限部材２２０は、前記旋回部１４０が回転可能に結合される前記走行ベース１５０に回転可能に結合される。前記第２制限部材２２０は、前記第１制限部材２１０が第１方向に回転するにつれて前記走行ベース１５０に接触する第１位置に移動できる。また、前記第２制限部材２２０は前記第１制限部材２１０が第１方向と反対になる第２方向に回転するにつれて前記走行ベース１５０に接触する第２位置に移動できる。例えば、前記第１方向は時計方向、前記第２方向は時計反回り方向でありうる。   The second restricting member 220 is rotatably coupled to the traveling base 150 to which the turning unit 140 is rotatably coupled. The second restricting member 220 can move to a first position that contacts the traveling base 150 as the first restricting member 210 rotates in the first direction. The second restricting member 220 can move to a second position where the second restricting member 220 contacts the traveling base 150 as the first restricting member 210 rotates in a second direction opposite to the first direction. For example, the first direction may be clockwise and the second direction may be counterclockwise.

前記移動部材２３０は、前記第２制限部材２２０が前記第１位置及び前記第２位置の間に位置するように前記第２制限部材２２０を移動させる。例えば、前記第２制限部材２２０が前記第１位置に位置する場合、前記移動部材２３０は前記第２制限部材２２０が前記第２位置に向かう方向に移動されるようにする。前記第２制限部材２２０が前記第２位置に位置する場合、前記移動部材２３０は前記第２制限部材２２０が前記第１位置に向かう方向に移動されるようにする。これによって、前記移動部材２３０は前記第２制限部材２２０が前記第１位置及び前記第２位置の間に位置するようにすることができる。   The moving member 230 moves the second restricting member 220 such that the second restricting member 220 is positioned between the first position and the second position. For example, when the second restricting member 220 is located at the first position, the moving member 230 causes the second restricting member 220 to be moved in a direction toward the second position. When the second restricting member 220 is located at the second position, the moving member 230 causes the second restricting member 220 to be moved in a direction toward the first position. Accordingly, the moving member 230 can cause the second restricting member 220 to be positioned between the first position and the second position.

したがって、本発明に係る基板移送装置１００は前記第２制限部材２２０が前記走行フレーム１５０に回転可能に結合されることによって、前記第２制限部材２２０の厚さだけ前記旋回部１４０の回転範囲が狭くなることを防止することができる。   Accordingly, in the substrate transfer apparatus 100 according to the present invention, the rotation range of the swivel unit 140 is increased by the thickness of the second restriction member 220 when the second restriction member 220 is rotatably coupled to the traveling frame 150. Narrowing can be prevented.

即ち、前記第１制限部材２１０が旋回軸１４１を中心に第１方向及び第２方向に回転時、前記第２制限部材２２０の位置に到達して接触すれば、前記移動部材２３０により第２制限部材２２０が第１位置及び第２位置の間に位置して第１制限部材２１０が移動部材２３０に係止されるようにすることによって、第２制限部材２２０が第１制限部材２１０の接触によって回転時に第２制限部材２２０の回転範囲を制限して旋回部１４０の１回転を保障しながら旋回部１４０の連続回転を防止できるようになる。   That is, when the first restricting member 210 rotates in the first direction and the second direction around the pivot axis 141 and reaches and contacts the position of the second restricting member 220, the moving member 230 causes the second restricting member The member 220 is positioned between the first position and the second position so that the first restricting member 210 is locked to the moving member 230, so that the second restricting member 220 is brought into contact with the first restricting member 210. During rotation, the rotation range of the second restricting member 220 is limited to ensure one rotation of the swivel unit 140 and prevent the swivel unit 140 from rotating continuously.

これによって、本発明に係る基板移送装置１００は前記第２制限部材２２０の厚さだけ前記旋回部１４０の回転範囲が増えるようになるので、前記基板１１０を移送する作業の効率性を向上させることができる。   Accordingly, the substrate transfer apparatus 100 according to the present invention increases the rotation range of the swivel unit 140 by the thickness of the second restriction member 220, thereby improving the efficiency of the operation of transferring the substrate 110. Can do.

前記移動部材２３０は、前記第２制限部材２２０に第２方向に弾性力を提供する第１弾性部材２３１及び前記第２制限部材２２０に第１方向に弾性力を提供する第２弾性部材２３２を含む。   The moving member 230 includes a first elastic member 231 that provides elastic force in the second direction to the second restricting member 220 and a second elastic member 232 that provides elastic force in the first direction to the second restricting member 220. Including.

前記第１弾性部材２３１は、前記第２制限部材２２０が前記第１位置から前記第２位置に移動されるように前記第２制限部材２２０に前記第２方向に弾性力を提供する。前記第１弾性部材２３１は、前記走行ベース１５０で前記第１位置に結合される。例えば、前記第１制限部材２１０により前記第２制限部材２２０が前記第１位置に移動される場合、前記第２制限部材２２０は前記第１弾性部材２３１の弾性力により前記第１位置から前記第２位置に移動できる。   The first elastic member 231 provides an elastic force in the second direction to the second restricting member 220 such that the second restricting member 220 is moved from the first position to the second position. The first elastic member 231 is coupled to the first position at the traveling base 150. For example, when the second restriction member 220 is moved to the first position by the first restriction member 210, the second restriction member 220 is moved from the first position by the elastic force of the first elastic member 231. Can move to 2 positions.

前記第２弾性部材２３２は、前記第２制限部材２２０が前記第２位置から前記第１位置に移動されるように前記第２制限部材２２０に前記第１方向に弾性力を提供する。前記第２弾性部材２３２は、前記走行ベース１５０で前記第２位置に結合される。例えば、前記第１制限部材２１０により前記第２制限部材２２０が前記第２位置に移動される場合、前記第２制限部材２２０は前記第２弾性部材２３２の弾性力により前記第２位置から前記第１位置に移動できる。ここで、前記第１弾性部材２３１及び前記第２弾性部材２３２はテンションスプリングでありうる。   The second elastic member 232 provides an elastic force to the second restricting member 220 in the first direction so that the second restricting member 220 is moved from the second position to the first position. The second elastic member 232 is coupled to the second position at the traveling base 150. For example, when the second restricting member 220 is moved to the second position by the first restricting member 210, the second restricting member 220 is moved from the second position by the elastic force of the second elastic member 232. Can move to one position. Here, the first elastic member 231 and the second elastic member 232 may be tension springs.

これによって、本発明に係る基板移送装置１００は前記第２制限部材２２０が前記第１位置と前記第２位置との間に位置するように前記第１弾性部材２３１及び前記第２弾性部材２３２が前記第２制限部材２２０を移動させることによって、前記第２制限部材２２０の厚さだけ前記旋回部１４０の回転範囲が狭くなることを防止することができる。したがって、本発明に係る基板移送装置１００は前記旋回部１４０の回転範囲が狭くなることを防止することができるので、前記工程チャンバの間に前記基板１１０を移送させる作業に効率性をさらに向上させることができる。   Accordingly, in the substrate transfer apparatus 100 according to the present invention, the first elastic member 231 and the second elastic member 232 are arranged such that the second restriction member 220 is positioned between the first position and the second position. By moving the second restricting member 220, it is possible to prevent the rotation range of the turning unit 140 from being narrowed by the thickness of the second restricting member 220. Therefore, since the substrate transfer apparatus 100 according to the present invention can prevent the rotation range of the swivel unit 140 from being narrowed, the efficiency of the operation of transferring the substrate 110 between the process chambers can be further improved. be able to.

以下、本発明に係る基板移送装置１００において、前記回転制限装置２００の変形例に関して添付した図面を参照して詳細に説明する。   Hereinafter, in the substrate transfer apparatus 100 according to the present invention, a modification example of the rotation limiting apparatus 200 will be described in detail with reference to the accompanying drawings.

図５は、図２の基板移送装置における回転制限装置の変形例を示すためにＡ部分を拡大した拡大図である。   FIG. 5 is an enlarged view of a portion A in order to show a modification of the rotation limiting device in the substrate transfer apparatus of FIG.

本発明の変形例に係る回転制限装置２００は、前記旋回部１４０に結合される第１制限部材２１０、前記走行ベース１５０に回転可能に結合される第２制限部材２２０、及び前記第２制限部材２２０を移動させるための移動部材２３０を含む。   The rotation restricting device 200 according to the modification of the present invention includes a first restricting member 210 coupled to the turning unit 140, a second restricting member 220 rotatably coupled to the traveling base 150, and the second restricting member. A moving member 230 for moving 220 is included.

説明する前に、前記第１制限部材２１０、前記第２制限部材２２０は前述した実施形態と同一な構成であるので、本実施形態では詳細な説明を省略する。   Before the description, the first restricting member 210 and the second restricting member 220 have the same configuration as that of the above-described embodiment, and thus detailed description thereof is omitted in this embodiment.

本発明に係る基板移送装置１００の変形例において、前記移動部材２３０は前記第２制限部材２２０と接触しない状態で前記第２制限部材２２０を前記第１位置と前記第２位置との間に移動させることができる。このために、前記移動部材２３０は前記第２制限部材２２０を前記第１位置から前記第２位置に向かう第２方向に移動させるための第１噴射機構２３３、及び前記第２制限部材２２０を前記第２位置から前記第１位置に向かう第１方向に移動させるための第２噴射機構２３４を含む。   In a modification of the substrate transfer apparatus 100 according to the present invention, the moving member 230 moves the second restricting member 220 between the first position and the second position in a state where the moving member 230 is not in contact with the second restricting member 220. Can be made. Therefore, the moving member 230 moves the first restricting mechanism 233 for moving the second restricting member 220 in the second direction from the first position toward the second position, and the second restricting member 220. A second injection mechanism 234 for moving in a first direction from the second position toward the first position is included.

前記第１噴射機構２３３は、前記走行ベース１５０の一側に結合される。前記第１噴射機構２３３は前記第２方向に気体を噴射させることによって前記第１位置に位置した前記第２制限部材２２０を前記第２方向に移動させることができる。これによって、前記第１噴射機構２３３は前記第１位置に位置した前記第２制限部材２２０が前記第１位置と前記第２位置との間に位置するように前記第２制限部材２２０を移動させることができる。前記第１噴射機構２３３には、前記第２制限部材２２０を前記第２方向に移動させるための気体を噴射する第１噴射ホール２３３ａが形成される。図示してはいないが、前記第１噴射ホール２３３ａは前記第２制限部材２２０を移動させるための気体を供給するための気体供給部と連結できる。   The first injection mechanism 233 is coupled to one side of the traveling base 150. The first injection mechanism 233 can move the second restricting member 220 located at the first position in the second direction by injecting gas in the second direction. Accordingly, the first injection mechanism 233 moves the second restriction member 220 so that the second restriction member 220 located at the first position is located between the first position and the second position. be able to. The first injection mechanism 233 is formed with a first injection hole 233a for injecting a gas for moving the second restricting member 220 in the second direction. Although not shown, the first injection hole 233a may be connected to a gas supply unit for supplying a gas for moving the second restricting member 220.

前記第２噴射機構２３４は、前記走行ベース１５０の他側に結合される。前記第２噴射機構２３４は、前記第１方向に気体を噴射させることによって前記第２位置に位置した前記第２制限部材２２０を前記第１方向に移動させることができる。したがって、前記第２噴射機構２３４は前記第２位置した前記第２制限部材２２０が前記第１位置と前記第２位置との間に位置するように前記第２制限部材２２０を移動させることができる。前記第２噴射機構２３４には前記第２制限部材２２０を前記第１方向に移動させるための気体を噴射する第２噴射ホール２３４ａが形成される。図示してはいないが、前記第２噴射ホール２３４ａは前記第２制限部材２２０を移動させるための気体を供給するための気体供給部と連結できる。   The second injection mechanism 234 is coupled to the other side of the travel base 150. The second injection mechanism 234 can move the second restricting member 220 located at the second position in the first direction by injecting gas in the first direction. Accordingly, the second injection mechanism 234 can move the second restricting member 220 so that the second restricting member 220 located at the second position is located between the first position and the second position. . The second injection mechanism 234 is formed with a second injection hole 234a for injecting a gas for moving the second restricting member 220 in the first direction. Although not shown, the second injection hole 234a can be connected to a gas supply unit for supplying a gas for moving the second restricting member 220.

したがって、本発明に係る基板移送装置１００は前記第２制限部材２２０を前記第１位置と前記第２位置との間に移動させる場合、前記移動部材２３０が前記第２制限部材２２０と接触しない状態で前記第２制限部材２２０を移動させることができる。これによって、本発明に係る基板移送装置１００は前記移動部材２３０が前記第２制限部材２２０と接した状態で前記第２制限部材２２０を移動させる場合と比較すると、前記移動部材２３０と前記第２制限部材２２０とが接することによるホコリの発生を防止することができる。   Accordingly, when the substrate transfer apparatus 100 according to the present invention moves the second restricting member 220 between the first position and the second position, the moving member 230 does not contact the second restricting member 220. Thus, the second restricting member 220 can be moved. Accordingly, the substrate transfer apparatus 100 according to the present invention has the moving member 230 and the second moving member 230 in comparison with the case where the moving member 230 moves the second restricting member 220 while being in contact with the second restricting member 220. Generation of dust due to contact with the limiting member 220 can be prevented.

以上、説明した本発明は前述した実施形態及び添付した図面に限定されるものでなく、本発明の技術的思想を逸脱しない範囲内で種々の置換、変形、及び変更が可能であるということが本発明が属する技術分野で通常の知識を有する者に当たって明らかである。   The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes can be made without departing from the technical idea of the present invention. It will be apparent to those skilled in the art to which the present invention pertains.

１００ 基板移送装置
１１０ 基板
１２０ 移送アーム
１２１ 支持ハンド
１２２ アームユニット
１２３ アームベース
１３０ 昇降部
１４０ 旋回部
１４１ 旋回軸
１５０ 走行ベース
２００ 回転制限装置
２１０ 第１制限部材
２２０ 第２制限部材
２３０ 移動部材
２３１ 第１弾性部材
２３２ 第２弾性部材
２３３ 第１噴射機構
２３３ａ 第１噴射ホール
２３４ 第２噴射機構
２３４ａ 第２噴射ホール。 DESCRIPTION OF SYMBOLS 100 Substrate transfer apparatus 110 Substrate 120 Transfer arm 121 Support hand 122 Arm unit 123 Arm base 130 Lifting part 140 Turning part 141 Turning axis 150 Traveling base 200 Rotation restricting device 210 First restricting member 220 Second restricting member 230 Moving member 231 First Elastic member 232 Second elastic member 233 First injection mechanism 233a First injection hole 234 Second injection mechanism 234a Second injection hole.

Claims (2)

基板を支持するための移送アームに連結され、旋回軸を中心に回転して前記移送アームを回転させる旋回部に結合される第１制限部材と、
前記旋回部が回転可能に結合される走行ベースに回転可能に結合され、前記第１制限部材の回転によって前記第１制限部材に接触して前記第１制限部材の回転を制限する第２制限部材と、
前記第２制限部材の位置を制御する移動部材とを含み、かつ
前記第２制限部材は、
前記第１制限部材が回転して前記第２制限部材と接触すれば共に回転し、
前記移動部材は、
前記第２制限部材が前記第１制限部材の接触によって回転時に前記第２制限部材の回転範囲が制限されるように前記第２制限部材の位置を制御して前記旋回部の１回転を保障しながら前記旋回部の連続回転を防止し、
前記移動部材は、前記第２制限部材を第１方向に移動させるために前記第２制限部材側に気体を噴射する第１噴射機構；及び前記第２制限部材を前記第１方向とは反対の第２方向に移動させるために前記第２制限部材側に気体を噴射する第２噴射機構を含み、
前記移動部材は、前記第１噴射機構及び前記第２噴射機構に基づいて、前記第１制限部材との接触によって回転する前記第２制限部材を、前記第２制限部材が前記第１制限部材との接触によって第１方向に回転して前記走行ベースに接触する第１位置と、前記第２制限部材が前記第１制限部材との接触によって前記第１方向と反対になる第２方向に回転して前記走行ベースに接触する第２位置との間に位置するように制御することを特徴とする、基板移送装置用回転制限装置。 A first limiting member connected to a transfer arm for supporting the substrate and coupled to a turning unit that rotates about the turning axis to rotate the transfer arm;
A second restricting member that is rotatably coupled to a travel base that is rotatably coupled to the swivel unit and that contacts the first restricting member by the rotation of the first restricting member and restricts the rotation of the first restricting member. When,
A moving member that controls the position of the second restricting member, and the second restricting member includes:
If the first restricting member rotates and contacts the second restricting member, it rotates together,
The moving member is
The position of the second restricting member is controlled so that one rotation of the swivel portion is ensured so that the rotation range of the second restricting member is restricted when the second restricting member is rotated by the contact of the first restricting member. While preventing the swivel from rotating continuously ,
The moving member includes a first injection mechanism for injecting gas to the second restricting member in order to move the second restricting member in the first direction; and the second restricting member opposite to the first direction. Including a second injection mechanism for injecting gas to the second restriction member side in order to move in the second direction;
The moving member is based on the first injection mechanism and the second injection mechanism, the second restriction member rotating by contact with the first restriction member, and the second restriction member being the first restriction member. The first position that rotates in the first direction by contact with the traveling base and the second direction that rotates in the second direction that is opposite to the first direction due to contact with the first limiting member. And a rotation limiting device for a substrate transfer apparatus, wherein the rotation limiting device is controlled so as to be positioned between the second position and the second position contacting the traveling base . 基板を移送させるための移送アームと、
前記移送アームが位置する高さが変更されるように前記移送アームを昇降させるための昇降部と、
前記移送アームが向かう方向が変更されるように前記昇降部を回転させる旋回部と、
前記旋回部の回転を制限するための請求項１に記載の回転制限装置と、を含むことを特徴とする、基板移送装置。 A transfer arm for transferring the substrate;
An elevating part for raising and lowering the transfer arm so that the height at which the transfer arm is located is changed;
A revolving unit that rotates the elevating unit so that the direction in which the transfer arm is directed is changed;
A substrate transfer apparatus comprising: the rotation limiting device according to claim 1 for limiting rotation of the swivel unit.
JP2015199366A 2014-10-08 2015-10-07 Rotation limiting device and substrate transfer device including the same Active JP6122928B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140135558A KR20160042281A (en) 2014-10-08 2014-10-08 Apparatus for rotatable restricting and apparatus for transferring substrate
KR10-2014-0135558 2014-10-08

Publications (2)

Publication Number Publication Date
JP2016074080A JP2016074080A (en) 2016-05-12
JP6122928B2 true JP6122928B2 (en) 2017-04-26

Family

ID=55721888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015199366A Active JP6122928B2 (en) 2014-10-08 2015-10-07 Rotation limiting device and substrate transfer device including the same

Country Status (4)

Country Link
JP (1) JP6122928B2 (en)
KR (1) KR20160042281A (en)
CN (1) CN105514006B (en)
TW (1) TWI612606B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102252775B1 (en) * 2016-09-12 2021-05-14 현대중공업지주 주식회사 Painting Robot
CN110824849B (en) * 2018-08-09 2021-01-01 上海微电子装备（集团）股份有限公司 Screw-in and screw-out device and chip library equipment
CN113948433B (en) * 2021-10-15 2022-12-13 扬州爱迪秀自动化科技有限公司 Wafer vacuum carrying mechanical device
CN114572691B (en) * 2022-03-29 2023-05-12 安徽凤阳淮河玻璃有限公司 Kiln mouth cup feeding machine

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211586U (en) * 1985-07-05 1987-01-24
JPH04240089A (en) * 1991-01-16 1992-08-27 Fanuc Ltd Revolving trunk stopper device for industrial robot
SE469878B (en) * 1991-02-11 1993-10-04 Asea Brown Boveri Adjustable stop robot for industrial robot
JPH04261792A (en) * 1991-02-18 1992-09-17 Nachi Fujikoshi Corp Oscillating shaft action end detector for industrial robot
US6065364A (en) * 1995-09-18 2000-05-23 Kabushiki Kaisha Yaskawa Denki Stopper for use in an industrial robot
JPH10225890A (en) * 1997-02-13 1998-08-25 Shinko Electric Co Ltd Stopper device for rotation shaft
DE102009043404A1 (en) * 2009-09-29 2011-09-22 Kuka Roboter Gmbh Industrial robot with a tow stop
JP4591624B1 (en) * 2010-03-12 2010-12-01 株式会社安川電機 Industrial robot

Also Published As

Publication number Publication date
CN105514006B (en) 2018-10-16
TW201614762A (en) 2016-04-16
KR20160042281A (en) 2016-04-19
TWI612606B (en) 2018-01-21
CN105514006A (en) 2016-04-20
JP2016074080A (en) 2016-05-12

Similar Documents

Publication Publication Date Title
JP6122928B2 (en) Rotation limiting device and substrate transfer device including the same
KR102010720B1 (en) Substrate processing apparatus and substrate processing method
KR102069346B1 (en) Apparatus for depositing organic film on substrate
US20170114456A1 (en) Apparatus and method for treating a substrate
JP2015196242A (en) Substrate transfer robot driving device and substrate transfer method using the same
JP2014212321A (en) Substrate transfer device and substrate transfer method using the same
KR20160041178A (en) Apparatus for guiding transportation and apparatus for transferring substrate
JP5165718B2 (en) Substrate processing equipment
KR20150125935A (en) Substrate treatment apparatus, method for positioning mask, apparatus for forming film, and method for forming film
JP2014187314A (en) Semiconductor device manufacturing method
KR20170055141A (en) Substrate disposition apparatus and substrate disposition method
JP2019033220A (en) Substrate carrying device
JP2010195571A (en) Carrying device
JP5364156B2 (en) Holder stage
JP5425998B2 (en) Substrate holding member, substrate transfer arm, and substrate transfer device
KR102274172B1 (en) Apparatus for Transferring Substrate and Supporting Hand Device for Transferring Substrate
KR101614201B1 (en) Transfer arm and apparatus for transferring substrate
KR20150009189A (en) Apparatus for driving and apparatus for transferring substrate
KR102340633B1 (en) Apparatus for Transferring Substrate
KR101188257B1 (en) Arm for transfering a substrate and the method for loading and unloading a substrate using the same
JP2007053203A (en) Substrate processing apparatus and substrate transferring method
KR102419920B1 (en) Apparatus and Method for treating a substrate
KR101455341B1 (en) Apparatus and method for aligning substrate
KR100916004B1 (en) Wafer Transfer Apparatus For Using With Two Arms Of Robert
JP2011238841A (en) Metal film formation system

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160817

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160823

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20161122

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170120

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170307

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170403

R150 Certificate of patent or registration of utility model

Ref document number: 6122928

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250