JP2012033308A - Organic el element manufacturing method and manufacturing apparatus, and substrate for organic el element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an organic EL element and a manufacturing apparatus thereof, which can manufacture the organic EL element at low cost, and prevent ink from soaking into a non-coating region even in the case of using a bending mask.SOLUTION: An organic EL element manufacturing method comprises the steps of: preparing a substrate 1 having coating regions 18 and non-coating regions 19 with through-holes 12 provided in the non-coating regions 19; preparing a mask plate 2 having openings 28 for coating the coating regions 18 with coating liquid and non-openings 29 for avoiding coating the non-coating regions 19 with the coating liquid; decompression-sucking the substrate 1 to a stage 3; putting the mask plate 2 on the substrate 1, and decompression-sucking the mask plate 2 to the substrate 1 through the through-holes 12 that the substrate 1 has; and coating the inside of the openings 28 that the mask plate 2 has with coating liquid for an organic EL layer by a nozzle coating method.

Description

  The present invention relates to a method and apparatus for manufacturing an organic EL element, and a substrate for an organic EL element used for them. More specifically, the invention (manufacturing method, manufacturing apparatus, substrate) that solves the problem of ink entering between the mask and the substrate that partitions the coating region when the constituent material of the organic EL element is applied by the nozzle coating method About.

  An organic EL (electroluminescence) element is composed of a large number of pixels formed by forming a light emitting layer in a predetermined pattern. As a patterning method of such a light emitting layer, (1) a method of forming a light emitting layer of a predetermined pattern by vacuum vapor deposition of a light emitting material through a mask, (2) an ink jet method or a nozzle coating of a light emitting material dissolved in an organic solvent A method of forming a light emitting layer of a predetermined pattern by applying to a predetermined site by a coating method using a dispenser or a screen printing method, and (3) irradiating ultraviolet rays in a predetermined pattern after applying a light emitting material over the entire surface There is a method of destroying and removing a specific portion of the light emitting layer.

  Among these, the inkjet method and the nozzle coating method have high utilization efficiency of coating materials and are advantageous in terms of manufacturing cost, and thus various studies have been made for practical use. In particular, the nozzle coating method has been actively studied because of its simpler mechanism than the ink jet method and the wide range of applicable ink properties (for example, Patent Document 1).

  However, in the nozzle coating method, since ink is continuously pushed out from the nozzle by a syringe pump or the like, intermittent discharge control cannot be performed unlike the ink jet method, and ink is discharged to an area where film formation is unnecessary. There are drawbacks. Wiping off ink adhering to an area where film formation is unnecessary causes problems such as generation of dust, and a solvent contained in the ink to wipe off adversely affects the organic EL element.

  In order to solve such a problem, it has been proposed to selectively apply ink to an application region by covering an area where film formation is unnecessary with a masking member. For example, it has been proposed to use a mask plate having an opening only in the application region as a masking member, or to use a masking tape attached to a non-application region as a masking member (Patent Document 2).

JP 2001-297876 A JP 2006-216414 A

  However, the means using the masking tape as a masking member has a problem that the bonding process for accurately sticking to a predetermined part is complicated and the manufacturing cost increases. Furthermore, there is also a problem that the adhesive material included in the masking tape tends to cause contamination. Further, the means using the mask plate as a masking member often causes the mask plate to bend, and ink enters the gap formed between the mask plate and the substrate due to capillary action, and the non-coated area is contaminated with ink. There is a problem that it ends up.

  The present invention has been made in order to solve the above-described problems, and the object of the present invention is to allow ink to soak into the non-application area even when a mask that can be manufactured at a low cost and has a deflection is used. It is providing the manufacturing method and manufacturing apparatus of the organic EL element which can prevent. Another object of the present invention is to provide an organic EL element substrate preferably used in such a production method and production apparatus.

  An organic EL element manufacturing method according to the present invention for solving the above-described problems is an organic EL element in which an organic EL layer coating liquid is applied to a predetermined coating region on a substrate by a nozzle coating method to form an organic EL layer. A method of preparing a substrate having a coating region and a non-coating region, and having a through hole in the non-coating region, an opening for applying a coating solution to the coating region, and A step of preparing a mask plate having a non-opening for not applying a coating solution to a non-coating region; a step of sucking the substrate under reduced pressure on the stage; and placing the mask plate on the substrate, the substrate having The method includes: a step of sucking the mask plate through the through hole under reduced pressure; and a step of applying an organic EL layer coating solution by a nozzle coating method in an opening of the mask plate. .

  According to the present invention, after the substrate is vacuum-suctioned to the stage, the mask plate is placed on the substrate and the mask plate is vacuum-suctioned onto the substrate through the through hole provided in the substrate. Adhere to the top. As a result, even when the mask plate is warped, the gap generated between the mask plate and the substrate can be eliminated as much as possible, and ink enters due to capillary action and the non-coated area is contaminated with ink. Can be prevented. In addition, since the conventional masking tape is not used, it is possible to suppress an increase in manufacturing cost due to a simple process. In this invention, the vacuum suction of the mask plate is performed through the through hole provided in the non-application area of the substrate, and the non-opening portion of the mask plate is placed on the non-application area provided with the through hole. The non-opening is sucked under reduced pressure. As a result, the mask plate comes into close contact with the substrate.

  In the method of manufacturing an organic EL element according to the present invention, the stage includes a substrate vacuum suction mechanism for vacuum suction of the substrate and a mask plate vacuum suction mechanism for vacuum suction of the mask plate, and vacuum suction of the substrate. When this is done, the substrate vacuum suction mechanism is operated, and when the mask plate is vacuum suctioned, both the substrate vacuum suction mechanism and the mask plate vacuum suction mechanism are operated.

  According to the present invention, the substrate vacuum suction mechanism is operated when vacuum suctioning the substrate, and both the substrate vacuum suction mechanism and the mask plate vacuum suction mechanism are operated when vacuum masking is performed. The substrate and the mask plate can be sucked under reduced pressure without performing idle suction.

  In the method for manufacturing an organic EL element according to the present invention, the substrate has a plurality of application regions arranged in a plan view with a non-application region interposed therebetween, and the through-holes are formed in all the non-application regions. It is provided at intervals.

  According to the present invention, even for a substrate in which a plurality of application regions are arranged in plan view with a non-application region interposed therebetween, the through holes are provided in all non-application regions at a predetermined interval, thereby providing a mask. Even when the plate is bent, the gap between the mask plate and the substrate can be eliminated as much as possible, and ink can be prevented from entering due to capillarity and contamination of the non-coated area with ink. Can do.

  In the method for manufacturing an organic EL element according to the present invention, the through hole is formed by laser processing.

  According to this invention, a desired through-hole can be accurately opened by laser processing.

  In order to solve the above problems, an organic EL element manufacturing apparatus according to the present invention forms an organic EL layer by applying an organic EL layer coating liquid to a predetermined coating region on a substrate by a nozzle coating method. The manufacturing apparatus according to claim 1, wherein the substrate having a coating region and a non-coating region and having a through hole in the non-coating region is sucked under reduced pressure, and an opening for applying a coating liquid to the coating region A stage on which a mask plate having a non-opening for not applying a coating solution to a non-application region is placed on the substrate, and the mask plate is vacuum-suctioned onto the substrate through a through-hole of the substrate; A nozzle coating device for coating the organic EL layer coating liquid in the opening of the mask plate by a nozzle coating method, the stage having a substrate vacuum suction mechanism for vacuum suction of the substrate, and the mask Vacuum the plate A vacuum suction mechanism for the mask plate, and when the vacuum suction is performed on the substrate, the vacuum suction mechanism for the substrate is operated, and when the vacuum suction is performed on the mask plate, the vacuum suction mechanism on the substrate and the vacuum suction mechanism on the mask plate are provided. It has the operating mechanism which operates both.

  According to the present invention, the substrate is provided with a stage for suctioning the substrate to the stage under reduced pressure, and suctioning the mask plate onto the substrate through a through-hole provided in the substrate, and the stage suctions the substrate under reduced pressure. A substrate decompression suction mechanism is activated when the mask plate is decompressed, and an operation mechanism is provided that activates both the substrate decompression suction mechanism and the mask plate decompression suction mechanism when the mask plate is decompressed. The plate can be brought into close contact with the substrate, and the substrate and the mask plate can be sucked under reduced pressure without empty suction. According to such a manufacturing apparatus, even when the mask plate is bent, a gap generated between the mask plate and the substrate can be eliminated as much as possible. Can prevent contamination.

  The organic EL element substrate according to the present invention for solving the above problems is an organic EL element substrate used in the organic EL element manufacturing method according to the present invention or the organic EL element manufacturing apparatus according to the present invention. And a non-application region in which through-holes are provided at predetermined intervals, and the application region is provided with at least a conductive electrode and an insulating partition. It is characterized by being.

  According to the present invention, there is a coating region in which no through hole is provided, and a non-application region in which the through hole is provided at a predetermined interval, and the conductive electrode and the insulating partition wall are at least in the coating region. By using such a substrate, the substrate and the mask plate placed on the substrate can be sucked and brought into close contact with each other using the through hole. As a result, even when the mask plate placed on the substrate is bent, the gap between the mask plate and the substrate can be eliminated as much as possible. Can prevent contamination.

  According to the method of manufacturing an organic EL element according to the present invention, the mask plate can be brought into close contact with the substrate, so that even if the mask plate is bent, it occurs between the mask plate and the substrate. It is possible to eliminate the gap as much as possible, and as a result, it is possible to prevent the ink from entering due to the capillary phenomenon and contaminating the non-application area with the ink. In addition, since the conventional masking tape is not used, it is possible to suppress an increase in manufacturing cost due to a simple process.

  According to the organic EL element manufacturing apparatus of the present invention, the mask plate can be brought into close contact with the substrate, and the substrate and the mask plate can be sucked under reduced pressure without performing idle suction. Even if this occurs, the gap formed between the mask plate and the substrate can be eliminated as much as possible, and as a result, it is possible to prevent the ink from entering due to capillary action and contaminating the non-application area with the ink. Can do.

  According to the organic EL element substrate according to the present invention, since the substrate and the mask plate placed on the substrate can be brought into close contact with each other by using the through holes, the mask plate placed on the substrate is bent. Even in such a case, it is possible to eliminate the gap generated between the mask plate and the substrate as much as possible, and as a result, it is possible to prevent the ink from entering due to the capillary phenomenon and contaminating the non-application area with the ink. .

It is the typical top view (A) and AA sectional view (B) which show an example of the substrate used with the manufacturing method of the organic EL element concerning the present invention. It is a typical top view which shows another example of the board | substrate used with the manufacturing method of the organic EL element concerning this invention. It is the typical top view (A) and BB sectional drawing (B) which show an example of the mask board used with the manufacturing method of the organic EL element which concerns on this invention. It is a typical section lineblock diagram showing an example of the decompression suction mechanism with which a manufacturing device is provided. It is a perspective view of the aspect which mounted the board | substrate and the mask board on the stage, and sucked the mask board under reduced pressure. It is a perspective view of the conventional aspect which mounts a board | substrate and a mask board on a stage, and does not vacuum-suck a mask board. It is typical sectional drawing explaining the relationship between the magnitude | size and position of the through-hole provided in the board | substrate, and the decompression suction hole provided in the stage. It is a typical section lineblock diagram showing an example of a manufacturing device of an organic EL element concerning the present invention.

  The manufacturing method and manufacturing apparatus of an organic EL element and a substrate for an organic EL element according to the present invention will be described in detail with reference to FIGS. The present invention can be modified in various ways as long as it has the technical features, and is not limited to the embodiments specifically shown below.

[Method of manufacturing organic EL element]
The method for manufacturing an organic EL element according to the present invention is a method for forming an organic EL layer by applying an organic EL layer coating solution to a predetermined coating region 18 on a substrate 1 by a nozzle coating method. Specifically, the step of preparing the substrate 1 having the application region 18 and the non-application region 19 and the through-hole 12 provided in the non-application region 19, and an opening for applying the application liquid to the application region 18 28 and a step of preparing a mask plate 2 having a non-opening 29 for not applying a coating solution to the non-application region 19, a step of suctioning the substrate 1 to the stage 3 under reduced pressure, and a step of attaching the mask plate 2 on the substrate 1. The organic EL layer coating liquid is applied by a step of vacuum-suctioning the mask plate 2 onto the substrate 1 through the through holes 12 of the substrate 1 and the nozzle coating method in the openings 28 of the mask plate 2. It is a manufacturing method of an organic EL element which has a process.

  The apparatus for manufacturing an organic EL element according to the present invention suctions the substrate 1 having a coating region 18 and a non-coating region 19, and the through-hole 12 is provided in the non-coating region 19. A mask plate 2 having an opening 28 for applying a coating solution on the substrate and a non-opening portion 29 for not applying a coating solution to the non-application region 19 is placed on the substrate 1, and a through hole of the substrate 1 is provided. A stage 3 for vacuum-suctioning the mask plate 2 onto the substrate 1 through 12 is provided. Further, a nozzle coating device 36 for coating the organic EL layer coating solution by a nozzle coating method is provided in the opening 28 of the mask plate 2. In this manufacturing apparatus, the stage 3 has a substrate vacuum suction mechanism for vacuum suction of the substrate 1 and a mask plate vacuum suction mechanism for vacuum suction of the mask plate 2. When the vacuum suction mechanism is operated and the mask plate 2 is vacuum-suctioned, an operation mechanism is provided that operates both the substrate vacuum suction mechanism and the mask plate vacuum suction mechanism.

  Hereinafter, the constituent elements of the method for producing an organic EL element according to the present invention will be sequentially described. In addition, the manufacturing apparatus of the organic EL element which concerns on this invention is also demonstrated collectively.

(Board preparation process)
As shown in FIG. 1, the substrate 1 to be prepared is usually a square or rectangular quadrilateral shape in plan view, and has a coating region 18 and a non-coating region 19. The coating region 18 is a region where a coating liquid for organic EL layer, which will be described later, is applied by a nozzle coating method, and is located inward from each side of the rectangular substrate 1 through a predetermined region (non-coating region 19). It is provided as follows. The non-application area | region 19 is an area | region which exists around the application | coating area | region 18, and is provided by predetermined width from each square (four sides).

  Although the material of the board | substrate 1 is not specifically limited, What is necessary is just used by the general organic EL element use. Examples thereof include inorganic materials such as quartz and glass, for example, polymer materials such as polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyethersulfone (PES). The thickness is not particularly limited, and may be relatively thick with rigidity or relatively thin with flexibility. The substrate 1 may be a substrate having a gas barrier property that blocks a gas such as moisture and oxygen as necessary, or may be a substrate provided with a gas barrier layer having such a gas barrier function in advance. Further, other functional layers such as a hard coat layer, a protective layer, an antistatic layer, an antifouling layer, and an antiglare layer may be provided.

  The application region 18 shown in FIG. 1 is an example of a passive matrix organic EL element pattern. As shown in FIG. 1, at least the insulating partition wall 13 and the conductive electrode 14 are provided in the coating region 18. Specifically, in the coating region 18, an insulating line partition wall 13 provided in a predetermined pattern extending in the Y direction, and a conductive electrode 14 provided between adjacent line partition walls 13 and 13 and extending in the Y direction. And an insulating pixel partition wall 15 provided on the electrode 14 and provided at a predetermined interval in the Y direction. The “Y direction” is the direction in which the partition wall 13 extends, the “X direction” is the direction orthogonal to the partition wall 13, and the “Z direction” is the normal direction of the substrate surface S 1. (Stacking direction).

  Examples of the insulating partition wall 13 include a partition wall made of novolac resin, polyimide, acrylate, or the like. Examples of the conductive electrode 14 include an electrode made of a simple metal, an alloy, a conductive metal oxide (a transparent conductive film made of ITO or IZO), a conductive inorganic compound, a conductive polymer, or the like. Further, as the insulating pixel partition wall 15, a partition wall made of novolac resin, polyimide, acrylate, or the like can be used.

  In the nozzle application process described later, the nozzle reciprocates linearly in the Y direction, and the application liquid is continuously applied between the adjacent line partition walls 13 and 13. For example, in FIG. 1A, when the nozzle moves from the lower end of the coating region 18 toward the upper end between the leftmost line partition walls and reaches the upper end of the coating region 18, the stage 3 shifts in the X direction, and the nozzle Moves from the upper end to the lower end between the second line partitions from the left side. This application area | region 18 is an area | region where the coating liquid for organic EL layers is apply | coated by repeating such moving operation | movement. Although FIG. 1 illustrates a passive matrix pattern, the same applies to an active matrix pattern.

  As shown in FIG. 1, the non-application area 19 is a peripheral area of the application area 18 and is provided with a predetermined width on each side of the rectangle. The width from each side may be the same or different. The dimension of the width is not particularly limited.

  A through-hole 12 is provided in the non-application area 19. The through-hole 12 is usually a circular hole having a predetermined diameter, but may be a deformed circle such as an ellipse or a shape other than a circle such as a triangle or a quadrangle. In the case of the circular through hole 12, a diameter of 0.02 to 1 mm is preferable. The formation location of the through-hole 12 is not particularly limited, but is preferably provided regularly at a predetermined interval in the longitudinal direction (longer side direction) of the non-application region 19. Moreover, in the short direction (short side direction) of the non-application area | region 19, it is preferable to be provided in the intermediate position of the width | variety. For example, in the example of FIG. 1, the through-hole 12 is provided at each corner portion of a quadrangle, and one through hole 12 is provided at an intermediate position between the corner portions. Two or more intermediate positions may be provided at equal intervals. The number of such through-holes 12 is preferably set arbitrarily according to the bending and rigidity of the mask plate 2 provided thereon. For example, when the mask plate 2 having a large deflection is used, it is preferable to increase the number of the through holes 12 so that the mask plate 12 adheres to the substrate 1 without bending. On the other hand, when using the mask plate 2 with small deflection, the number of the through holes 12 may be reduced as long as the mask plate 12 adheres to the substrate 1 without bending.

  The through hole 12 can be formed by various means, but laser processing, particularly preferably by laser processing, can be performed regardless of whether the substrate 1 is a glass substrate or a plastic substrate. The through-hole 12 formed by laser processing can open a highly accurate hole in a uniform shape in the depth direction. Moreover, the diameter of the through-hole 12 can be arbitrarily controlled by controlling the output and diameter of the laser beam. In the present application, the diameter of the through hole 12 is preferably in the range of about 0.02 to 1 mm.

  FIG. 2 is a plan view showing another example of the substrate 51. The substrate 51 has a plurality of application regions 18 arranged in a plan view with the non-application region 19 in between. The through holes 12 are provided at the corners of all the non-application areas 19 and two are provided at predetermined intervals between the corners. This substrate 51 is a substrate for taking multiple organic EL elements, and is finally cut at the non-application area 19 and used as individual organic EL elements. In this way, the through holes 12 are provided in all the non-application areas 19 at predetermined intervals even for the substrate 51 in which the plurality of application areas 18 are arranged in plan view with the non-application areas 19 interposed therebetween. Thus, even when the mask plate 2 is bent, the gap generated between the mask plate 2 and the substrate 1 can be eliminated as much as possible, the ink enters due to capillary action, and the non-application area 19 is made of ink. It can be prevented from being contaminated.

(Mask plate preparation process)
As shown in FIG. 3, the mask plate 2 to be prepared has an opening 28 for applying the coating liquid to the coating area 18 and a non-opening 29 for not applying the coating liquid to the non-application area 19. ing. The opening 28 is provided in a size corresponding to the application region 18 of the substrate 1 (that is, the same size), has a slight clearance, and has a size that matches the application region 18 as much as possible. preferable. Further, the non-opening portion 29 is also preferably provided in a size corresponding to the non-application area 19 of the substrate 1 (that is, the same size). By placing the mask plate 2 having the opening 28 and the non-opening 29 having such a size on the substrate 1, as shown in FIG. 4, the non-application area 19 of the substrate 1 is changed to the non-opening of the mask plate 2. 29 covers. At this time, since the mask plate 2 is sucked into the substrate 1 under reduced pressure through the through-holes 12 of the substrate 1, the gap between the mask plate 2 and the substrate 1 can be eliminated or minimized. As a result, the coating liquid applied thereafter can be prevented from entering the gap.

  The material of the mask plate 2 is not particularly limited, and examples thereof include various stainless steels and various plastic plates. In particular, stainless steel is preferable from the viewpoint of reuse by cleaning, drying, and the like. The thickness of the mask plate 2 is not particularly limited, but usually a relatively thin stainless steel plate having a thickness of about 50 to 200 μm is preferably used. The mask plate 2 can be obtained by subjecting a thin stainless steel plate purchased in a roll-wound state to a wet etching process and opening an opening 28 having a predetermined size.

  In addition, although the hole corresponding to the through-hole 12 provided in the board | substrate 1 is not provided in the non-opening part 29 of the mask board 2, the other mark and hole may be provided. These marks and holes are used as alignment marks for placing the mask plate 2 at predetermined positions on the substrate 1.

  FIG. 3C shows an example of a mask plate 2 ′ provided with a liquid repellent film 22. The liquid repellent film 22 preferably has liquid repellency with respect to the organic EL layer coating liquid described below. When the mask plate 2 ′ provided with such a liquid repellent film 22 is placed on the substrate 1 and sucked under reduced pressure, and the substrate 1 and the mask plate 2 are brought into close contact with each other, Even when the coating solution is about to penetrate between the substrate 1 and the mask plate 2 by capillary action, the penetration can be prevented.

  The type of the liquid repellent film 22 can be arbitrarily selected depending on the type of the coating liquid for the organic EL layer, but is usually preferably a fluorine-based film formed of a fluorine-based compound. Specifically, fluorine compounds such as PTFE, PFA, FEP, and ETFE are preferably used. The thickness of the liquid repellent film 22 is not particularly limited, but is usually about 1 to 3 μm. Such a liquid repellent film 22 is preferably provided on the entire surface of the mask plate 2 as shown in FIG. 3C, but at least the inner peripheral surface of the non-opening 29, that is, the coating region of the substrate 1. What is necessary is just to be provided in the inner edge of 18th side.

(Substrate vacuum suction process and mask plate vacuum suction device)
The prepared substrate 1 is vacuum-sucked to a predetermined position on the stage 3 (substrate vacuum suction step). Thereafter, the mask plate 2 is vacuum-sucked onto the substrate 1 fixed to the stage 3 by vacuum suction (mask plate vacuum suction step). FIG. 4 is a cross-sectional configuration diagram showing a state after the substrate decompression suction process and the mask plate decompression suction process. The substrate 1 and the mask plate 2 are stacked in close contact on the stage 3.

  As shown in FIG. 4, the stage 3 includes a substrate vacuum suction mechanism (41, 43, 45) for vacuum suction of the substrate 1, and a mask plate vacuum suction mechanism (42, 44, 46) for vacuum suction of the mask plate 2. have.

  The substrate vacuum suction mechanism (41, 43, 45) includes at least a substrate vacuum suction device 41, a substrate vacuum suction hole 43, and a vacuum suction line 45. The substrate 1 positioned and placed on the stage 3 is brought into close contact with the stage 3 by the operation of the substrate vacuum suction mechanism. Specifically, the substrate vacuum suction device 41 is operated to decompress the inside of the substrate vacuum suction hole 43 and the vacuum suction line 45. In the stage 3, the substrate vacuum suction hole 43 is provided below the coating region 18 of the substrate 1.

  The mask plate vacuum suction mechanism (42, 44, 46) comprises at least a mask plate vacuum suction device 42, a mask plate vacuum suction hole 44, and a vacuum suction line 46. The mask plate 2 positioned and placed on the substrate 1 is brought into close contact with the substrate 1 by the operation of the mask plate vacuum suction mechanism. Specifically, the mask plate vacuum suction device 42 is operated to decompress the inside of the mask plate vacuum suction hole 44 and the vacuum suction line 46. In the stage 3, the mask plate vacuum suction hole 44 is provided under the non-application area 19 of the substrate 1, that is, under the non-application area 19 in which the through-hole 12 is provided. When the mask plate 2 is vacuumed, the substrate vacuum suction mechanism needs to be operated together.

  As described above, when the substrate 1 is vacuum-sucked, the substrate vacuum suction mechanism is operated, and when the mask plate 2 is vacuum-suctioned, both the substrate vacuum suction mechanism and the mask plate vacuum suction mechanism are operated. With such an operation mode, the substrate 1 and the mask plate 2 can be sucked under reduced pressure without performing idle suction. Note that the mask plate vacuum suction mechanism (42, 44, 46) may be operated at the same time that the substrate 1 is vacuum-sucked and no adverse effect due to idle suction or the like occurs.

  As shown in FIG. 5, the substrate 1 and the mask plate 2 sucked under reduced pressure are brought into close contact with each other on the stage 3 so that no gap is generated between the substrate 1 and the mask plate 2. As a result, the coating liquid for organic EL layer applied thereafter does not enter the gap. FIG. 6 shows a conventional mode when the mask plate 2 is placed on the substrate 1 ′ not provided with a through hole, and a gap is generated between the substrate 1 ′ and the mask plate 2.

  FIG. 7 is a schematic cross-sectional view illustrating the relationship between the size and position of the through hole 12 provided in the substrate 1 and the mask plate vacuum suction hole 44 provided in the stage 3. 7A shows an example in which the hole diameter d of the through hole 12 is smaller than the hole diameter D of the vacuum suction hole 44 for the mask plate. FIG. 7B shows the hole diameter d of the through hole 12 for the mask plate. FIG. 7C shows an example in which the diameter of the vacuum suction hole 44 is larger than the hole diameter D. FIG. 7C shows a case where the position of the through hole 12 and the position of the vacuum suction hole 44 for the mask plate are shifted. It is a case where it has the duplication area | region D1. In any of these three modes, the mask plate 2 can be sucked under reduced pressure on the substrate 1 with good adhesion.

  As shown in FIG. 8, the stage 3 can be moved by a slide device 4 and a fine turning device 5, and is moved in the X direction, the Y direction, and the Z direction by these devices 4, 5. The Y direction is mainly the direction in which the nozzle 31 reciprocates with the linear motion guide 35, but the stage 3 can also be moved in the Y direction by the slide device 4. The X direction is a direction in which the first row is applied by the nozzle 31 and then moved to apply the next row, and the stage 3 can be moved in the X direction by the slide device 4. The Z direction is a vertical axis, and the stage 3 can be swiveled at a predetermined angle with respect to the vertical axis by the fine turning device 5. In addition, the apparatus provided with such a slide device 4 and the fine movement turning device 5 is provided with a control unit (not shown) for controlling them, and the slide device 4 and the fine movement turning device 5 are operated by an operation signal from the control unit. Can be operated.

(Coating process of coating liquid for organic EL layer)
In the coating process of the coating liquid for organic EL layer, as shown in FIG. 4, the organic EL layer is formed by the nozzle coating method in the opening 28 of the mask plate 2 in a state where the mask plate 2 is provided in close contact with the substrate 1. Apply the layer coating solution. More specifically, a line partition wall 13 provided on the substrate 1 extends in the Y direction in the opening 2. An organic EL layer coating solution is applied by a nozzle coating method between the line partition walls 13 extending in the Y direction.

  The nozzle coating method is performed by a nozzle coating device 36 illustrated in FIG. This nozzle coating device 36 has a nozzle unit 33 in which three nozzles 31 are mounted on a nozzle mounting jig 32, and the nozzle unit 33 is configured to reciprocate in the Y direction by a linear motion guide 35. A coating liquid supply tube 34 is connected to each nozzle 31, and the coating liquid is supplied to each nozzle 31. In addition, the coating liquid supply control to the nozzle 31 and the reciprocating motion control of the nozzle unit 33 are performed by a control unit (not shown).

  In the example of FIG. 8, the nozzle unit 33 is configured by three nozzles 31, but the number of nozzles 31 is not limited to three, and even if there is one, three or more. May be. A nozzle unit 33 having a plurality of nozzles 31 is preferable because a coating solution can be applied between a plurality of line partition walls by a single application operation. In particular, when three full-color organic EL layers of RGB are provided, the three light emitting layer coating liquids for RGB colors can be simultaneously applied to each of them by setting a multiple of 3, such as three or six. It is convenient because it can be applied to the line.

  As the organic EL layer coating solution, the light emitting layer, hole injection layer, hole transport layer, hole injection transport layer, electron injection layer, electron transport layer, electron injection transport layer, hole block constituting the organic EL layer Of the layers and the electron blocking layer, the present invention can be applied to those that can be formed by a coating method. For example, it can be preferably applied to a hole injection layer, a hole transport layer, a light emitting layer, and the like. The electron injection layer, the electron transport layer, the electron injection transport layer, the hole block layer, and the electron block layer can be applied as long as they can be formed by a coating method. The coating solution for each of these layers is not particularly limited and can be arbitrarily selected from known various materials.

  Each of these coating liquids is applied, and another layer (vacuum deposition method, sputtering method, CVD method, etc.) is formed as necessary to form an organic EL layer. In addition, after comprising an organic EL layer with each of these layers, a 2nd electrode is provided on it. The second electrode can be a single metal, an alloy, a conductive metal oxide (transparent conductive film), a conductive inorganic compound, a conductive polymer, or the like, similar to the electrode 14 described above. And it comprises so that an organic EL layer may be pinched | interposed between the electrode (1st electrode) 14 provided on the board | substrate 1, and a 2nd electrode, and an organic EL element is produced. The light emitting layer can emit light by holes and electrons respectively supplied from both electrodes.

  Thereafter, a sealing material may be provided as necessary so as to cover the organic EL element, or a transparent substrate may be provided via the sealing material. In this case, the sealing material can include an epoxy resin. Further, as the transparent substrate, among the above-described substrate 1, particularly highly transparent glass, polyethersulfone (PES), polyethylene terephthalate (PET), or the like can be used.

  As described above, according to the method and apparatus for manufacturing an organic EL element according to the present invention, after the substrate 1 is sucked to the stage 3 under reduced pressure, the mask plate 2 is placed on the substrate 1 and provided on the substrate 1. Since the mask plate 2 is sucked under reduced pressure onto the substrate 1 through the through-holes 12, the mask plate 2 comes into close contact with the substrate 1. As a result, even when the mask plate 2 is warped, the gap formed between the mask plate 2 and the substrate 1 can be eliminated as much as possible, and ink enters due to capillary action, so that the non-application area is made of ink. It can be prevented from being contaminated. In addition, since the conventional masking tape is not used, it is possible to suppress an increase in manufacturing cost due to a simple process.

  Hereinafter, the present invention will be described in more detail with reference to examples. The scope of the present invention is not limited to the following examples.

  As shown in FIG. 1B, an insulating line partition wall 13 formed in a predetermined pattern, a conductive electrode 14 provided between the line partition walls 13 and 13, and a predetermined pattern on the electrode 14 are provided. A glass substrate 1 having a thickness of 0.7 mm having an insulating pixel partition wall 15 was prepared. The electrode 14 is formed of an ITO film, and as shown in FIG. 2, the substrate 1 is in a form in which application regions 18 corresponding to a plurality of panels are multifaceted. A through hole 12 having a hole diameter of 0.1 mm is formed in the substrate 1. The through hole 12 is formed in the non-application area 19 of the substrate 1 by laser processing.

  The substrate 1 thus prepared was placed on a stage 3 having a substrate vacuum suction mechanism through positioning means using alignment marks. Simultaneously with the mounting, only the substrate vacuum suction mechanism (41, 43, 45) of the mode shown in FIG.

  Next, a mask plate 2 made of a stainless steel plate having a thickness of 0.1 mm was prepared. In the mask plate 2, a portion corresponding to the application region 18 of the substrate 1 is an opening portion 28, and a portion corresponding to the non-application region 19 is a non-opening portion 29. The mask plate 1 was placed on the substrate 1 through positioning means using alignment marks. Simultaneously with the placement, the substrate decompression suction mechanism (41, 43, 45) and the mask plate decompression suction mechanism (42, 44, 46) of the embodiment shown in FIG. The mask plate 2 was brought into close contact by suction under reduced pressure. As shown in FIGS. 4 and 5, the mask plate 2 was in close contact with the substrate 1 without a gap.

  Next, a hole injection layer coating solution is applied to the stripe electrode 14 in the opening 18 formed by the pixel partition wall 15 and separated by the line partition wall 13 along the line of the line partition wall 13 by a nozzle coating method. It was applied with. Application of the hole injection layer coating solution was performed on the coating region 18 using a nozzle coating device 36 shown in FIG. As the coating solution for the hole injection layer, a solution in which a molybdenum hexacarbonyl complex, which is a metal complex compound, was converted into an ink with ethyl benzoate was used. Thereafter, only the mask plate vacuum suction mechanism (42, 44, 46) is released, only the mask plate 2 is removed from the substrate 1, and the substrate 1 after the coating liquid for hole injection layer is applied to the substrate 200 in the atmosphere. Heated at 60 ° C. for 60 minutes. As a result, the solvent in the coating solution was volatilized, and a hole injection layer having a thickness of 15 nm was formed on the electrode 14.

  Next, after the mask plate 1 is again positioned on the substrate 1 and installed, a hole transport layer coating solution is applied onto the hole injection layer along the line of the line partition wall 13 by a nozzle coating method. did. The coating solution for the hole transport layer was also applied to the coating region 18 using the nozzle coating device 36 shown in FIG. As the coating solution for the hole transport layer, poly [(9,9-dioctylfluorenyl-2,7-diyl) -co- (4,4 ′-(N- (4 -Sec-butylphenyl)) diphenylamine)] (TFB) and a low-molecular compound 2-methyl-9,10bis (naphthalen-2-yl) anthracene (MADN) dissolved in ethyl benzoate It was. Thereafter, similarly to the above, only the mask plate vacuum suction mechanism (42, 44, 46) is released, only the mask plate 2 is removed from the substrate 1, and the substrate 1 after the coating liquid for hole transport layer is applied to the atmosphere. Under heating at 200 ° C. for 1 minute, after waiting for the solvent to evaporate, it was heated in a glove box at 200 ° C. for 1 hour. Thereby, a hole transport layer having a thickness of 30 nm was formed on the hole injection layer.

  Next, after the mask plate 1 is again aligned and placed on the substrate 1 as described above, the light emitting layer coating liquid is applied on the hole transport layer along the line of the line partition wall 13 by a nozzle coating method. Applied. The light emitting layer coating solution was also applied to the coating region 18 using a nozzle coating device 36 shown in FIG. As the coating solution for the light emitting layer, 1-tert-butyl-perylene (TBP) was contained as a light emitting dopant, and 2-methyl-9,10bis (naphthalen-2-yl) anthracene (MADN) was contained as a host. An ethyl benzoate solution was used. Thereafter, similarly to the above, only the mask plate vacuum suction mechanism (42, 44, 46) is released, only the mask plate 2 is removed from the substrate 1, and the substrate 1 after the light emitting layer coating liquid is applied in the atmosphere. After heating at 200 ° C. for 1 minute and waiting for the solvent to evaporate, it was heated in a glove box at 130 ° C. for 1 hour. As a result, a light emitting layer having a thickness of 40 nm was formed on the hole transport layer.

  Next, Alq3 was formed to a thickness of 20 nm as an electron transport layer and LiF was formed to a thickness of 0.5 nm as an electron transport layer so as to cover the light-emitting layer, and each was stacked by vacuum heating evaporation.

  Next, using a vapor deposition mask having an opening set to be orthogonal to the pattern of the electrode 14 made of an ITO film, a 250 nm-thick Al film is formed by vacuum heating vapor deposition, and then as a sealing material An epoxy resin was applied, a glass substrate was placed thereon, and the epoxy resin was cured by irradiating with ultraviolet rays for sealing.

  In this way, the organic EL element was able to be produced without the various coating liquids for organic EL layers soaking into the non-coated area 19 of the substrate 1.

DESCRIPTION OF SYMBOLS 1,1 'board | substrate 2,2' mask board 3 stage 4 slide apparatus 5 fine movement turning apparatus 11 base material 12 through-hole 13 line partition 14 electrode 15 pixel partition 18 application area 19 non-application area 21 mask base material 22 liquid repellent film 28 Opening 29 Non-opening 31 Nozzle 32 Nozzle mounting jig 33 Nozzle unit 34 Coating liquid supply tube 35 Linear motion guide 36 Nozzle coating device 41 Substrate vacuum suction device 42 Mask vacuum suction device 43 Substrate vacuum suction hole 44 Mask plate Decompression suction hole 45 Decompression suction line of substrate 46 Decompression suction line of mask plate 51 Substrate S1 Surface of mask plate side S2 Surface of stage side d Diameter of through hole D Diameter of decompression suction hole for mask plate D1 For through hole and mask plate Overlap area with vacuum suction hole

Claims (6)

An organic EL element manufacturing method for forming an organic EL layer by applying an organic EL layer coating liquid to a predetermined coating region on a substrate by a nozzle coating method,
Preparing a substrate having a coating region and a non-coating region, and having a through hole in the non-coating region;
Preparing a mask plate having an opening for applying a coating liquid to the application area and a non-opening for not applying a coating liquid to the non-application area;
Suctioning the substrate to the stage under reduced pressure;
Placing the mask plate on the substrate, and suctioning the mask plate onto the substrate through a through hole of the substrate; and
Applying an organic EL layer coating solution by a nozzle coating method in the opening of the mask plate;
The manufacturing method of the organic EL element characterized by having.   The stage includes a substrate vacuum suction mechanism for vacuum suction of the substrate and a mask plate vacuum suction mechanism for vacuum suction of the mask plate, and operates the substrate vacuum suction mechanism when vacuum suctioning the substrate. The method for producing an organic EL element according to claim 1, wherein when the mask plate is vacuum-suctioned, both the substrate vacuum suction mechanism and the mask plate vacuum suction mechanism are operated.   The substrate has a plurality of application areas arranged in a plan view with a non-application area in between, and the through holes are provided at predetermined intervals in all the non-application areas. The manufacturing method of the organic EL element of description.   The manufacturing method of the organic EL element of any one of Claims 1-3 which forms the said through-hole by laser processing. An organic EL element manufacturing apparatus that forms an organic EL layer by applying an organic EL layer coating liquid to a predetermined coating region on a substrate by a nozzle coating method,
A substrate having a coating area and a non-coating area, and having a through-hole provided in the non-coating area is sucked under reduced pressure, and an opening for applying the coating liquid to the coating area and the coating liquid is applied to the non-coating area. A stage for placing a mask plate having a non-opening portion not to be applied on the substrate, and vacuum-sucking the mask plate onto the substrate through a through hole of the substrate;
A nozzle coating device for coating the organic EL layer coating liquid in the opening of the mask plate by a nozzle coating method;
The stage includes a substrate vacuum suction mechanism for vacuum suction of the substrate and a mask plate vacuum suction mechanism for vacuum suction of the mask plate, and operates the substrate vacuum suction mechanism when vacuum suctioning the substrate. An apparatus for manufacturing an organic EL element, comprising an operating mechanism that operates both the substrate vacuum suction mechanism and the mask plate vacuum suction mechanism when vacuum suctioning the mask plate. An organic EL element substrate used in the method for manufacturing an organic EL element according to any one of claims 1 to 4 or the organic EL element manufacturing apparatus according to claim 5,
It has a coating area in which no through-hole is provided and a non-application area in which through-holes are provided at predetermined intervals, and at least a conductive electrode and an insulating partition are provided in the coating area. An organic EL element substrate characterized by the above.

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