JP2009163931A - Device and method for manufacturing display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display panel manufacturing device which can coat ink (organic solution) uniformly and can suppress deterioration of display quality and reliability due to residual ink, and to provide a manufacturing method of a display panel. <P>SOLUTION: An ink injection mechanism part of a display panel manufacturing device is provided with a nozzle head 11 which injects ink of liquid state while scanning in a main scanning direction (Xm direction), a pump section 12 and a pump control part 13 to supply a prescribed amount of ink to the nozzle head 11, an injection control part 16 to control the amount of ink (injection quantity) injected from the nozzle head 11, a head scanning part 15 which is provided with a guide rail 115 for scanning the nozzle head 11 to a panel board PSB in the main scanning direction, and a shutter plate 17 which is arranged between the nozzle head 11 and the panel board PSB and has a slit ST provided in the main scanning direction. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a display panel manufacturing apparatus and a display panel manufacturing method, and in particular, a manufacturing apparatus for manufacturing a display panel in which a plurality of light emitting elements having a light emitting functional layer formed by applying a liquid material is arranged, and The present invention relates to a method for manufacturing a display panel.

  2. Description of the Related Art Recently, a display panel (light emitting element type display panel) in which light emitting elements such as organic electroluminescence elements (hereinafter abbreviated as “organic EL elements”) are two-dimensionally arranged as display devices for electronic devices such as mobile phones and portable music players. ) Is known. In particular, a light-emitting element type display panel to which an active matrix driving method is applied has a faster display response speed and less viewing angle dependency than a widely used liquid crystal display device. In addition to being able to reduce the display quality and display quality, it does not require a backlight or light guide plate unlike a liquid crystal display device, so it has an extremely advantageous feature that it can be made thinner and lighter. Yes.

  As is well known, an organic EL element which is an example of the above-described light emitting element is schematically, for example, an anode (anode) electrode, an organic EL layer (light emitting functional layer), and a cathode (cathode) on one side of a glass substrate or the like. An electrode structure is formed by sequentially laminating electrodes, and injected into the organic EL layer by applying a positive voltage to the anode electrode and a negative voltage to the cathode electrode so as to exceed the light emission threshold. Light (excitation light) is emitted based on the energy generated when holes and electrons recombine.

  Here, as a method for forming a hole transport layer, a light-emitting layer, and an electron transport layer to be an organic EL layer, depending on an organic material (a hole transport material, a light-emitting material, an electron transport material), a vapor deposition method or a coating method is used. Etc. are known. Specifically, in the case of an organic EL element using a low molecular organic material, a vapor deposition method is generally applied. In this method, when a low molecular organic film is selectively formed only on the anode electrode in the light emitting element formation region or the pixel formation region, the low molecular material is prevented from being deposited on the region other than the anode electrode. In some cases, a low-molecular material adheres to the surface of the mask, resulting in a large material loss during manufacturing and an inefficient manufacturing process. Yes.

On the other hand, in the case of an organic EL element using a polymer organic material, an inkjet method, a nozzle coating method, or the like is applied as a wet film forming method (coating method). In these methods, since the organic material solution can be selectively applied only to the anode electrode or a specific region including the anode electrode, the organic EL can be satisfactorily performed with an efficient manufacturing process with little material loss. This has the advantage that a thin film of a layer (a hole transport layer or an electron transport light emitting layer) can be formed.
A manufacturing method and an apparatus for manufacturing an organic EL element (display panel) to which such a coating method is applied are described in detail in, for example, Patent Document 1.

JP 2002-75640 A (page 3 to page 5, FIGS. 3 to 7)

  Among the coating methods described above, in the nozzle coating method, an ink (organic solution) in which an organic material for forming a light emitting layer or a charge transport layer (a hole transport layer or an electron transport layer) is dissolved in a solvent is used for the nozzle. Since it can be applied by being discharged from the (discharge port) continuously at a constant flow rate, it has a feature that a uniform application state can be realized as compared with the ink jet method.

  However, in the nozzle coating method, the ink tends to remain around the nozzle as compared with the ink jet method, and the number of times the nozzle reciprocates on the substrate increases because application is performed with a small number of nozzles as compared with the ink jet method. Has the disadvantages. Therefore, when this ink is dried and solidified, it will be scattered as dust and fall on the surface of the substrate to adhere to it, and residual ink is removed with a blower etc. after the coating process to prevent such dust scattering and dropping. When trying to do so, if undried ink falls on the surface of the substrate, it causes dark spots and the like, and there is a problem that the display quality and reliability of the display panel may be lowered.

  Accordingly, in view of the above-described problems, the present invention can uniformly apply ink (organic solution), and can suppress display quality and reliability deterioration due to residual ink and a display panel manufacturing apparatus. It aims at providing the manufacturing method of a panel.

  According to a first aspect of the present invention, in a display panel manufacturing apparatus in which a plurality of display pixels are arranged on a substrate, a nozzle that discharges and applies a material liquid to each formation region of the display pixels set on the substrate When the material liquid is ejected to a certain position in the plurality of display pixel formation regions, the material liquid discharge portion provided with the plurality of display pixel formation regions, And a shielding portion that shields at least a part other than the certain position.

According to a second aspect of the present invention, in the display panel manufacturing apparatus according to the first aspect, the shielding portion is provided with a slit formed corresponding to a movement range of the nozzle.
According to a third aspect of the present invention, in the display panel manufacturing apparatus according to the second aspect, the shielding portion is disposed in a space between the nozzle and the substrate, and the material liquid discharged from the nozzle is It is applied to the display pixel formation region through a slit.
According to a fourth aspect of the present invention, in the display panel manufacturing apparatus according to the second to third aspects, the shielding portion is disposed in the vicinity of the nozzle and at a position substantially equivalent to the lower surface of the nozzle, and the slit Is set to a width wider than the outer dimension of the nozzle.
According to a fifth aspect of the present invention, in the display panel manufacturing apparatus according to any one of the second to fourth aspects, the shielding portion has a shape in which an end portion of the slit is bent. .
A sixth aspect of the present invention is the display panel manufacturing apparatus according to any one of the second to fourth aspects, wherein the shielding portion has a shape in which an end portion of the slit is curved. .
According to a seventh aspect of the present invention, in the display panel manufacturing apparatus according to any one of the first to sixth aspects, the shielding portion is provided with an adhesive member at least on an upper surface.
According to an eighth aspect of the present invention, in the display panel manufacturing apparatus according to any one of the first to seventh aspects, a predetermined voltage is applied to the shielding portion.
A ninth aspect of the present invention is the display panel manufacturing apparatus according to any one of the first to eighth aspects, wherein the nozzle is scanned in a first direction relative to the substrate, and the substrate is The scanning is performed in a second direction orthogonal to the first direction.

According to a tenth aspect of the present invention, in a method for manufacturing a display panel in which a plurality of display pixels are arranged on a substrate, a material liquid discharge portion provided with a nozzle for discharging a material liquid, and the nozzle is the plurality of display pixels. A shielding portion that shields at least a part of the plurality of display pixel formation regions other than the certain position when the material liquid is discharged to a certain position in the formation region. The material liquid discharge unit discharges and applies the material liquid to each formation region of the display pixel set on the substrate.
According to an eleventh aspect of the present invention, in the method for manufacturing a display panel according to the tenth aspect, the shielding portion is provided with a slit formed corresponding to a moving range of the nozzle.

  According to the display panel manufacturing apparatus of the present invention, ink (organic solution) can be uniformly applied when a thin film is formed on a substrate, and display quality and reliability are reduced due to ink remaining in the nozzle. Can be suppressed.

Hereinafter, a display panel manufacturing apparatus according to the present invention will be described in detail with reference to embodiments.
<First Embodiment>
<Display panel manufacturing equipment>
FIG. 1 is a schematic configuration diagram showing a first embodiment of a display panel manufacturing apparatus according to the present invention.
The display panel manufacturing apparatus (nozzle coating film forming apparatus) according to the first embodiment is broadly classified as being different from a device that discontinuously discharges a plurality of liquid droplets such as an ink jet. Ink discharge mechanism (material liquid discharge portion) having a function of continuously flowing the liquid flow of the ink serving as the carrier transport layer and the light emitting layer while scanning in the direction, and the nozzle head provided in the ink discharge mechanism portion A substrate that controls the nozzle head to move in a two-dimensional coordinate direction relative to the panel substrate by moving the panel substrate in a direction perpendicular to the scanning direction (a direction orthogonal to the plane of the panel substrate). And a movable mechanism portion.

  Here, in the display panel manufactured by the display panel manufacturing apparatus according to the present embodiment, when an organic EL element is provided as a light emitting element in each display pixel arranged on the panel substrate, a hole transport layer (carrier) As a hole transport material for forming a transport layer), for example, polyethylenedioxythiophene PEDOT which is a conductive polymer and polystyrene sulfonate PSS (hereinafter abbreviated as “PEDOT / PSS”) which is a dopant, Electron transport to form strongly acidic aqueous ink (material liquid) dissolved or dispersed in an aqueous solvent such as ethanol or ethylene glycol, or an electron transporting light emitting layer that also serves as an electron transporting layer (carrier transporting layer) and light emitting layer As a light-emitting material, for example, a conjugated polymer such as a polyphenylene vinylene polymer or a polyfluorene polymer is used. Torarin discharges tetramethyl benzene, mesitylene, xylenes, aromatic water-based ink or organic solvent-based ink dissolved or dispersed in an organic solvent such as toluene (material liquid).

Hereinafter, each mechanism part is demonstrated concretely.
(Ink ejection mechanism)
For example, as shown in FIG. 1, the ink ejection mechanism unit includes a nozzle head (nozzle) 11 that ejects the ink, a pump unit 12 that supplies the ink to the nozzle head 11, and a nozzle in the pump unit 12. The pump control unit 13 that controls the supply state such as the supply amount and supply timing of ink to the head 11, the ink tank 14 that stores ink, and the amount (discharge amount) of ink discharged from the nozzle head 11 are controlled. The discharge control unit 16 and the nozzle head 11 are arranged in a specific direction (main scanning direction; indicated by a double arrow Xm in the figure) with respect to a panel substrate PSB placed on a substrate movable mechanism unit (substrate stage 21) described later. Head scanning unit 15 provided with guide rails 115 for scanning in the direction 1), and a panel placed on the nozzle head 11 and the substrate stage 21. Disposed between the plate PSB, and a shutter plate (shielding portions) 17 which slits ST it is provided in correspondence with the scanning direction (main scanning direction) of the nozzle head 11 is provided with.

  FIG. 1A is a structural view of the nozzle head 11 and the substrate stage 21 as viewed from above, and the substrate stage 21 is scanned by the head scanning unit 15 described above by the single-axis robot 22 (see FIG. Xm direction) can be moved to an arbitrary position in a direction (sub-scanning direction; indicated by a double arrow Ym in the drawing, second direction). FIG. 1B is a control system configuration diagram in which the nozzle head 11 and the substrate stage 21 are seen from the side. As shown in FIG. 1B, the nozzle head 11 moves in the main scanning direction (Xm direction) and in addition to the main scanning direction and the sub-scanning direction (Ym direction), that is, the substrate stage 21. It may be controlled so as to be movable up and down at an arbitrary position in the direction perpendicular to the substrate mounting surface (panel substrate plane) (Zm direction; indicated by a double arrow Zm in the figure).

(Nozzle head)
FIG. 2 is a main part configuration diagram showing a specific example of a nozzle head applied to the display panel manufacturing apparatus according to the present embodiment, and FIG. 2A is a perspective view showing one configuration example of the nozzle head. FIG. 2B is a bottom view showing the surface (nozzle plate) on which the discharge ports are provided in the nozzle head according to this configuration example.

  For example, as shown in FIG. 1, the nozzle head 11 applied to the present embodiment is located above the substrate mounting surface side of the substrate stage 21 and the moving direction of the substrate stage 21 (sub-scanning direction; FIG. 1). While scanning in the main scanning direction (Xm direction) orthogonal to (Ym direction in (a)), liquid-flow ink is ejected and continuously applied to the panel substrate PSB.

  For example, as shown in FIGS. 2A and 2B, the nozzle head 11 has a hollow housing structure, and is provided on an ink storage unit 111 that stores ink, an upper surface side of the ink storage unit 111, and the like. And an injection port 112 for injecting ink supplied from a pump unit 12 to be described later into the ink storage unit 111 and a lower part of the ink storage unit 111 for discharging the ink injected into the ink storage unit 111. Connected to a guide rail 115 and a control wiring 114 connected to a discharge control unit 16 that outputs a control signal so that a predetermined amount of ink is discharged from the discharge port PH. And a support member (not shown) for moving in the main scanning direction (Xm direction).

  Here, the injection port 112 provided in the nozzle head 11 is connected to a delivery port of the pump unit 12 described later using a tube (or piping), and is discharged from the discharge port PH calculated by the discharge control unit 16. The pump control unit 13 appropriately drives the pump unit 12 based on the amount, so that ink is injected from the ink tank 14 and the ink storage unit 111 is always filled. The nozzle head 11 includes, for example, a piezoelectric element such as a piezo element, or a heating resistor element that heats, vaporizes, and expands ink to discharge the ink, and discharges the ink from the discharge port PH according to a control signal input via the control wiring 114. A predetermined amount of ink is ejected toward the panel substrate PSB on the substrate stage 21.

  As will be described later, the ejected ink causes the nozzle head 11 to move (scan) relative to the substrate stage 21 along the guide rail 115 extending in the main scanning direction (Xm direction), and The substrate stage 21 is relatively moved (scanned) at a predetermined pitch (predetermined interval) in the sub-scanning direction (Ym direction) orthogonal to the main scanning direction (Xm direction) of the nozzle head 11. As a result, the nozzle head 11 has moved relative to the panel substrate PSB in the XY 2-axis direction (two-dimensional coordinate direction), and a predetermined region (light emitting element formation region or A predetermined amount of ink is applied to the pixel formation region.

  In the nozzle head 11 shown in FIGS. 2 (a) and 2 (b), the case where the only ejection port PH is provided in the nozzle plate 113 below the ink reservoir 111 has been described. Without being limited thereto, for example, a plurality of ejection ports PH at a predetermined interval (for example, a pitch between adjacent light emitting elements or display pixels) in a direction orthogonal to the main scanning direction (Xm direction) of the nozzle head 11. May be provided on the nozzle plate 113.

  In addition, the nozzle head 11 can adjust the clearance between the discharge port PH and the panel substrate PSB (or the substrate stage 21) (the vertical separation distance with respect to the panel substrate PSB). 1 (b), a mechanism is provided that can move in the vertical direction (double arrow Zm) with respect to the mounting surface (panel substrate plane) of the substrate stage 21 as shown in FIG. It may be a thing.

(Shutter plate)
FIG. 3 is a main part configuration diagram showing a specific example of a shutter plate applied to the display panel manufacturing apparatus according to the present embodiment. FIG. 3A shows a nozzle head, a substrate stage, a slit of the shutter plate, and the like. FIG. 3B is a schematic view of the positional relationship between the nozzle head, the substrate stage, and the shutter plate from the side (that is, the line IIIA-IIIA in FIG. 3A). (In this specification, “III” is used as a symbol corresponding to the Roman numeral “3” shown in FIG. 3A for convenience.)

  For example, as shown in FIGS. 3A and 3B, the shutter plate 17 includes a single or a plurality of slits ST that are formed to extend at least in the main scanning direction (Xm direction) of the nozzle head 11. It is formed of a flat plate. Further, the shutter plate 17 according to this configuration example is a space between the lower surface of the nozzle head 11 (nozzle plate 113) and the panel substrate PSB on the substrate stage 21, and the positional relationship is fixed to each other. The slit ST is fixed in a predetermined position with respect to the guide rail 115 of the head scanning unit 15 and the uniaxial robot 22 of the substrate moving mechanism unit, and is arranged in parallel to the substrate stage 21 (panel substrate plane). ing.

  That is, the nozzle head 11 continuously moves in the main scanning direction (Xm direction) along the guide rail 115 in which the positional relationship with the shutter plate 17 is fixed, so that the ink ejected from the ejection port PH is discharged. It is applied in the main scanning direction (Xm direction) of the panel substrate PSB through the slit ST. Further, the substrate stage 21 moves at a predetermined pitch in the sub-scanning direction (Ym direction) along the single-axis robot 22 whose positional relationship with the shutter plate 17 is fixed, so that the ink passes through the slits ST. It is sequentially applied in the sub-scanning direction (Ym direction) of the panel substrate PSB.

(Pump part)
The pump unit 12 takes in the ink stored in the ink tank 14 based on the drive signal output from the pump control unit 13 and sends it to the nozzle head 11, so that the ink storage unit 111 is filled with ink. Hold in the (filled) state.

(Discharge control unit)
The ejection control unit 16 generates a control signal for controlling the amount of ink (ejection amount) ejected by the nozzle head 11 to a predetermined region of the panel substrate PSB based on the result of analysis of image information data by an image processing unit 24 described later. While outputting via the control wiring 114, the discharge amount data is outputted to the pump control unit 13.

(Substrate moving mechanism)
For example, as shown in FIG. 1, the substrate moving mechanism unit includes a substrate stage 21 on which the panel substrate PSB is placed and fixed, and the substrate stage 21 with respect to the main scanning direction (Xm direction) of the nozzle head 11 described above. With the uniaxial robot 22 moving in the orthogonal sub-scanning direction (Ym direction; second direction), the nozzle head 11 and the substrate stage 21 set at predetermined reference positions, the nozzle head 11 is positioned on the substrate stage 21. An alignment (positioning) camera 23 that detects the placement position of the panel substrate PSB, an image processing unit 24 that analyzes an image captured by the alignment camera 23, and the nozzle head 11 and And a robot control unit 25 that adjusts the relative positional relationship between the substrate stages 21.

  Here, although not shown, the substrate stage 21 includes a vacuum suction mechanism and a mechanical fixing mechanism for fixing the placed panel substrate PSB at a predetermined position. Further, the substrate stage 21 is arranged in addition to the one-axis moving direction in the sub-scanning direction (Ym direction) in order to align the initial ejection position of the nozzle head 11 with respect to the panel substrate PSB, as shown in FIG. As shown in FIG. 2, the structure is capable of fine adjustment movement in the rotation direction (θ direction) in which the placement surface is rotated about the center of gravity of the placement surface of the substrate stage 21 as an axis. In place of such a moving structure for rotating the substrate stage 21, the guide rail 115 for scanning and moving the nozzle head 11 is rotated in a plane parallel to the substrate stage 21 (panel substrate plane), thereby the nozzle head. 11 initial discharge positions may be adjusted. Further, the alignment camera 23 for detecting the alignment mark formed in advance on the panel substrate PSB has a guide rail 115 (that is, main scanning of the nozzle head 11) of the head scanning unit 15 whose positional relationship is fixed. And fixed to a predetermined position with respect to the single-axis robot 22 (that is, the sub-scan of the substrate stage 21) of the substrate moving mechanism.

<Method for manufacturing display panel>
Next, a display panel manufacturing method to which the display panel manufacturing apparatus (nozzle coat film forming apparatus) as described above is applied will be described.
First, a display panel manufactured by applying the display panel manufacturing apparatus according to the present embodiment will be described.

(Display panel)
FIG. 4 is a main part schematic diagram illustrating an example of a pixel array of a display panel manufactured by the display device manufacturing method according to the present embodiment. 4A is a plan view of the display panel, and FIG. 4B is an IVB-IVB line of the display panel in FIG. 4A (in this specification, in FIG. 4A). FIG. 4 is a schematic cross-sectional view showing a cross section along “IV” as a symbol corresponding to the Roman numeral “4” shown in FIG. In the plan view shown in FIG. 4A, for the convenience of explanation, each display pixel (color pixel) when viewed from one surface side (organic EL element formation side) of the display panel (panel substrate PSB). For the sake of clarity, only the arrangement relationship between the pixel electrodes provided on the pixel electrodes and the partition walls (banks) that define the display pixel formation regions (pixel formation regions) is shown. Shown with hatching.

  As shown in FIG. 4A, the display panel 30 manufactured by the manufacturing apparatus (nozzle coat film forming apparatus) according to the present embodiment has red on one surface side of a panel substrate PSB made of an insulating substrate such as glass. The color pixels PXr, PXg, and PXb composed of three colors (R), green (G), and blue (B) are set as one set, and the set is sequentially and repeatedly arranged in the row direction (the left-right direction in the drawing) and the column direction A plurality of color pixels PXr, PXg, and PXb of the same color are arranged in the vertical direction of the drawing. Here, one display pixel PIX is formed by combining the adjacent RGB color pixels PXr, PXg, and PXb.

  Further, as shown in FIGS. 4A and 4B, the display panel 30 protrudes from one surface side of the panel substrate PSB and is provided with a barrier or bank-like planar pattern (bank). 31, among the plurality of display pixels PIX (color pixels PXr, PXg, PXb) two-dimensionally arranged on one surface side of the panel substrate PSB, the same array arranged in the column direction (vertical direction in the drawing) of FIG. A region (each color pixel region) including a pixel formation region of a plurality of color pixels PXr or PXg and PXb of the color is defined.

  In the pixel formation region of each color pixel PXr or PXg, PXb, the pixel electrode (for example, anode electrode) 32 and the color pixel region including each pixel electrode 32 are manufactured according to the above-described embodiment. The organic EL layer 33 (for example, the hole transport layer 33a and the electron transporting light emitting layer 33b) formed by the device (nozzle coat film forming device) is commonly opposed to each pixel electrode 32 through the organic EL layer 33. Thus, the counter electrode (for example, cathode electrode) 34 formed by a single electrode layer (solid electrode) is provided, and each organic EL element is formed. In FIG. 4B, 35 is a protective insulating film or a sealing resin layer, and 36 is a sealing substrate.

(Display panel deposition method)
5 and 6 are process cross-sectional views illustrating an example of a display device manufacturing method (display panel film forming method) to which the manufacturing apparatus (nozzle coat film forming device) according to the present embodiment is applied. Here, a color display panel including the display pixel PIX including the three color pixels PXr, PXg, and PXb of red (R), green (G), and blue (B) shown in FIG. 4 is manufactured. In the case of applying the ink to each color pixel, the description of the display panel manufacturing apparatus (FIGS. 1 to 3) described above is appropriately referred to.

First, as shown in FIG. 5A, each display pixel PIX (color pixel) set on one surface side (upper surface side in the drawing) of a panel substrate PSB made of a glass substrate or the like, as shown in FIG. PXr, PXg, PXb) formation region (pixel formation region) Apx, at least the surface of the uppermost layer is made of tin-doped indium oxide (Indium Thin
After forming a pixel electrode (for example, an anode electrode) 32 made of a transparent electrode material such as Oxide (ITO) or zinc-doped indium oxide, as shown in FIG. 5B, an adjacent display pixel (pixel formation region Apx) A partition wall (bank) 31 made of an insulating resin material or the like is formed in the boundary region. Here, the partition wall 31 is formed to have, for example, a planar shape (see FIG. 4A) from which the upper surface of the pixel electrode 32 is exposed.

  Next, after the panel substrate PSB on which the pixel electrode 32 and the partition wall 31 are formed is washed with pure water or alcohol, the pixel electrode exposed to each pixel formation region Apx by performing, for example, oxygen plasma treatment or UV ozone treatment. 32 is made lyophilic with respect to organic solutions (inks) HLF and ELF applied when forming at least an organic EL layer 33 (for example, a hole transport layer 33a and an electron transporting light emitting layer 33b) to be described later. It is lyophilic so as to have (lyophilic treatment).

  Next, the panel substrate PSB is taken out by immersing it in, for example, a fluorine-based (fluorine compound) liquid repellent treatment solution, then washed with alcohol or pure water and dried to form a liquid repellent thin film (coating) on the surface of the partition wall 31. May be formed (liquid repellency treatment). Here, when, for example, fluorinated alkylamine or the like is applied as the liquid repellent treatment solution, it does not react with the oxide film or the nitride film, so the surface of the metal oxide such as ITO on the surface of the pixel electrode 32 exposed in the pixel formation region Apx. No lyophobic thin film is formed on the film, and the lyophilic property imparted by the above-described lyophilic treatment (oxygen plasma treatment or UV ozone treatment) is maintained.

  “Liquid repellency” used in the present embodiment refers to an organic solution HLF containing a hole transporting material to be a hole transporting layer 33a described later and an electron transporting light emitting material to be an electron transporting light emitting layer 33b. When the contact angle is measured by dropping a droplet of the organic solution ELF contained or the organic solvent used in these solutions onto an insulating substrate or the like, the contact angle is 50 ° or more. Stipulate. Further, “lyophilicity” to be described later with respect to “liquid repellency” is defined in the present embodiment as a state where the contact angle is 40 ° or less.

  In the present embodiment, the case where a conductive layer made of a single-layer electrode material is applied as the pixel electrode 32 formed in each pixel formation region Apx is illustrated, but the present invention is not limited to this. For example, the display panel 30 has a top emission type light emitting structure that emits light emitted from the organic EL layer 33 to be described later to one side of the panel substrate PSB (upper side of the drawing in FIG. 4B). If there is a reflective metal layer made of a reflective metal film having light reflection characteristics such as aluminum (Al), chromium (Cr), silver (Ag), palladium silver (AgPd) based alloy, etc. Further, an electrode structure in which a conductive metal oxide layer (having light transmission characteristics) made of a transparent electrode material such as ITO is laminated on the upper layer side may be used.

  Further, in the present embodiment, for the sake of illustration, a structure in which only the pixel electrode 32 is formed in each pixel formation region Apx is shown. However, an organic EL layer 33 (described later) is connected to each pixel electrode 32. A drive control element that controls a light emission drive current supplied to the organic EL element) may be provided on the lower layer side of each pixel electrode 32 via a planarizing film. The display panel 30 may be a passive drive type that does not include a drive control element.

  Next, by applying the above-described display panel manufacturing apparatus (see FIGS. 1 to 3), as shown in FIG. 5C, the discharge port of the nozzle head 11A (having the same configuration as the nozzle head 11 described above) An organic solution (material liquid; the above-described ink) which is an aqueous dispersion obtained by adding a hole transport material (for example, PEDOT / PSS described above) from PH to an aqueous solvent (for example, water 99 to 80 wt%, ethanol 1 to 20 wt%). (Corresponding) HLF is discharged in the form of a predetermined amount of liquid set by the discharge control unit 16 described above, and the nozzle head is applied to a plurality of pixel formation regions Apx arranged in the column direction of the panel substrate PSB. 11A is applied along the guide rail 115 while scanning in the row direction which is the main scanning direction (the direction perpendicular to the paper surface; corresponding to the Xm direction in the above-described embodiment).

  Here, as described above, the organic solution HLF discharged in the form of a liquid flow from the discharge port PH of the nozzle head 11A reaches the surface of the panel substrate PSB via the slit ST provided in the shutter plate 17. , Spread at least on the upper surface of the pixel electrode 32. At this time, since the surface of the partition wall 31 has liquid repellency (liquid repellency treatment is performed), the liquid flow of the organic solution HLF applied to the pixel formation region Apx has landed on the partition wall 31. Even if it is repelled, it is applied only to each pixel formation region Apx having lyophilic properties.

  Next, the substrate stage 21 on which the panel substrate PSB is placed is moved by a predetermined pitch in the sub-scanning direction (the row direction and the left-right direction of the paper surface; corresponding to the Ym direction in the above-described embodiment) by the single-axis robot 22. Thus, for example, the application operation of the organic solution HLF similar to the above is performed also on the pixel forming regions Apx in adjacent columns or columns separated by a predetermined interval. Thereafter, the same organic solution HLF application operation is repeated for all the columns of the panel substrate PSB, and as shown in FIG. 5D, the hole transport layer 33a is formed on the pixel electrode 32 in each pixel formation region Apx. Form.

  Next, by applying the display panel manufacturing apparatus (see FIGS. 1 to 3) described above, as shown in FIG. 5 (e), the discharge port of the nozzle head 11B (having the same configuration as the nozzle head 11 described above) An organic solution (material solution; the above-described material) obtained by adding an organic polymer-based electron-transporting light-emitting material (for example, the above-described polyphenylene vinylene-based polymer) corresponding to a specific emission color (for example, red (R)) from PH to a solvent. ELF (corresponding to ink) is ejected in a predetermined amount of liquid flow set by the ejection control unit 16 described above, and the color of the specific color (red (R)) arranged in the column direction of the panel substrate PSB The nozzle head 11B is sequentially scanned in the column direction (direction perpendicular to the paper surface: Xm direction), which is the main scanning direction, with respect to the pixel formation region Apx of the pixel PXr, and formed on the pixel electrode 32 in the above-described process. Coated on the hole transport layer 33a was. Here, as described above, the organic solution ELF discharged in a liquid flow form the discharge port PH of the nozzle head 11B reaches the surface of the panel substrate PSB via the slit ST provided in the shutter plate 17. , Spread at least on the hole transport layer 33a. At this time, since the surface of the partition wall 31 has liquid repellency (liquid repellency treatment is performed), the liquid flow of the organic solution ELF applied to the pixel formation region Apx has landed on the partition wall 31. Even if it is repelled, it is applied only to each pixel formation region Apx having lyophilic properties.

  Next, the substrate stage 21 on which the panel substrate PSB is placed is moved in the sub-scanning direction (in the row direction and the left-right direction of the paper surface; Ym direction), for example, by three columns or multiple columns of three, The same application operation of the organic solution ELF as that described above is performed on the pixel formation region Apx of the color pixel PXr of the specific color (red (R)) in the column. Thereafter, the same application operation of the organic solution ELF is repeated for all the columns of the specific color (red (R)) of the panel substrate PSB.

  Then, as shown in FIGS. 6A and 6B, the application operation of the organic solution ELF containing the electron-transporting luminescent material corresponding to each luminescent color is performed as a green (G) color pixel. By sequentially and repeatedly executing the columns including the pixel formation regions Apx of the PXg and blue (B) color pixels PXb, as shown in FIG. 6C, the color pixels PXr, PXg, and PXb of the respective colors. An electron transporting light emitting layer 33b in which an electron transporting light emitting material corresponding to each color is fixed in a thin film is formed on the hole transporting layer 33a in the pixel formation region Apx of FIG. An organic EL layer 33 composed of 33a and an electron transporting light emitting layer 33b is formed.

  Next, as shown in FIG. 6 (d), the pixel electrode 32 is commonly opposed to each pixel formation region Apx through the organic EL layer 33 including at least the hole transport layer 33a and the electron transport light emitting layer 33b described above. After forming a counter electrode (for example, a cathode electrode) 34 made of a single electrode layer (solid electrode), a protective insulating film is formed on the panel substrate PSB including the counter electrode 34 as shown in FIG. In addition, a display panel 30 in which display pixels PIX (color pixels PXr, PXg, PXb) having organic EL elements are two-dimensionally arranged is completed by forming a sealing resin layer 35 and bonding a sealing substrate 36. To do.

  As described above, according to the present embodiment, in the formation process of the organic EL layer (for example, the hole transport layer and the electron transporting light emitting layer) of each display pixel (each color pixel), the above-described display panel manufacturing apparatus (nozzle coat forming device) is formed. When the organic solution (ink) is applied to the pixel formation region of each column using the film device, the liquid organic solution discharged from the nozzle head is disposed between the nozzle head and the panel substrate. The droplets are applied to the surface of the panel substrate through slits provided in the shutter plate. At this time, the organic solution remaining around the discharge port of the nozzle head (nozzle plate) is dried to form dust, and the dust is formed during the organic solution application operation (movement operation of the nozzle head in the main scanning direction). Even if it drops off or scatters from the nozzle head, it is placed between the nozzle head and the panel substrate, and covers the area other than the area to be coated (area exposed by the slit) so as not to be exposed. Since it can fall on the upper surface of the shutter plate and prevent it from falling onto the panel substrate surface, it is possible to suppress deterioration in display quality and reliability of the display panel due to residual ink around the nozzle head ejection openings. .

  In this embodiment, as shown in FIGS. 1 and 3, the shutter plate 17 is disposed between the nozzle head 11 and the panel substrate PSB, and the liquid flow (liquid column) of the organic solution (ink) is provided. Although the slit ST having a width enough to pass is shown, the present invention is not limited to this. For example, as shown in FIG. 7, it is approximately the same as the lower surface of the nozzle head 11 (nozzle plate). The shutter plate 17 provided with a slit ST having a width wider than the outer dimension of the nozzle head 11 may be applied.

  That is, in a general nozzle coat film forming apparatus, there is a model in which the distance between the nozzle head and the panel substrate is set to 2 mm or less, for example, and the shutter plate 17 shown in the above embodiment is used as the nozzle head. It may be extremely difficult to arrange between the panel substrate. However, according to the inventor's verification, the dust formed by drying the residual ink is extremely light, and the nozzle head is scanned at a high speed of about 2 m per second, for example, and the dust that has fallen or scattered once rises. Even with the apparatus configuration as shown in FIG. 7, it has been found that it can fall on the upper surface of the shutter plate and can be prevented from dropping onto the panel substrate surface, and a certain effect can be obtained. Here, FIG. 7 is a principal part block diagram which shows the other specific example of the shutter board applied to the display panel manufacturing apparatus which concerns on this embodiment, FIG.7 (a) is a nozzle head, a substrate stage, and a shutter. FIG. 7B is a schematic view of the positional relationship with the slits of the plate from above, and FIG. 7B is an overhead view of the positional relationship between the nozzle head, the substrate stage, and the shutter plate (that is, in FIG. 7A). FIG. 8 is a schematic view taken along the line VIIC-VIIC (in this specification, “VII” is used as a symbol corresponding to the Roman numeral “7” shown in FIG. 7A for convenience)). .

<Second Embodiment>
FIG. 8 is a schematic view showing a specific example of a shutter plate applied to the second embodiment of the display panel manufacturing apparatus according to the present invention. Here, components equivalent to those in the first embodiment described above are denoted by the same reference numerals, and the description thereof is simplified.

  In the first embodiment described above, the shutter plate 17 provided with the slits ST is provided in the space between the nozzle head 11 and the panel substrate PSB, or at a height substantially the same as the lower surface of the nozzle head 11. A display panel manufacturing apparatus (nozzle coat film forming apparatus) is shown, and the configuration of the shutter plate 17 and the slit ST is not particularly limited. However, in the second embodiment, the shutter plate is dropped or scattered from the nozzle head. It has a configuration that suppresses the phenomenon that dust that has fallen on the upper surface is scattered again and falls to the surface of the panel substrate.

  Specifically, the shutter plate 17 applied to the display panel manufacturing apparatus (nozzle coat film forming apparatus) according to the second embodiment mainly has an end portion of the slit ST formed in the main scanning direction of the nozzle head 11. Along the scanning direction, for example, as shown in FIG. 8 (a), the cross section is bent and bent upward into an L shape, or as shown in FIG. 8 (b), the cross section is curved and U-shaped. It has a curved shape 17b. As a result, the dust that has fallen off or scattered from the nozzle head 11 and once dropped on the upper surface of the shutter plate 17 is prevented by the end shapes 17a and 17b, and can be prevented from scattering again. It is possible to prevent the dust from falling more reliably.

  Further, another example of the configuration of the shutter plate 17 applied to the display panel manufacturing apparatus (nozzle coat film forming apparatus) according to the second embodiment includes at least the shutter plate 17 as shown in FIG. A member 17c having adhesiveness or adsorptivity is formed on a part or the entire upper surface of the flat plate to be formed. As a result, the dust that has fallen or scattered from the nozzle head 11 and once dropped on the upper surface of the shutter plate 17 can be prevented from being scattered again by being adsorbed by the member 17c having adhesiveness or adsorption property. It is possible to more reliably prevent the dust from falling on. In FIG. 8C, the case where the adhesive member 17c is formed on the upper surface of the shutter plate 17 has been described. However, the adhesive member and the adsorptive member are similarly formed on the lower surface of the shutter plate 17. May be formed.

  Further, the configuration of the shutter plate 17 shown in FIGS. 8A to 8C is applied to the shutter plate arranged in the space between the nozzle head 11 and the panel substrate PSB as shown in FIG. Although the case has been described, as shown in FIG. 7, the present invention may be applied to a shutter plate disposed at a height substantially equal to the lower surface of the nozzle head 11.

<Third Embodiment>
FIG. 9 is a schematic configuration diagram showing a third embodiment of the display panel manufacturing apparatus according to the present invention. Here, components equivalent to those in the first embodiment described above are denoted by the same reference numerals, and the description thereof is simplified.

  As shown in FIG. 9, the display panel manufacturing apparatus (nozzle coat film forming apparatus) according to the third embodiment has a high voltage applied to the shutter plate 17 in addition to the configuration of the display panel manufacturing apparatus shown in the first embodiment. Is provided. Accordingly, dust that has fallen or scattered from the nozzle head 11 can be attracted (electrostatically attracted) to the shutter plate 17 by electrostatic attraction, and the dust once dropped on the upper surface of the shutter plate 17 is prevented from scattering again. It is possible to reliably prevent the dust from falling onto the surface of the panel substrate PSB. Furthermore, since the dust that has fallen on the surface of the panel substrate PSB can be attracted to the shutter plate 17 by electrostatic attraction, it is possible to further suppress deterioration in display quality and reliability of the display panel due to dust. The dust resulting from the dried ink is likely to be positively charged due to friction with air due to the movement of the nozzle, so it is desirable that the shutter portion be negatively charged.

  In the present embodiment, the case where the display panel manufacturing apparatus shown in FIGS. 1 and 3 is provided with the high-voltage power supply 26 has been described, but the display panel manufacturing apparatus shown in FIG. 7 may be applied to the display panel manufacturing apparatus. Alternatively, a high voltage may be applied to the shutter plate 17 having the shape shown in FIG.

  In the first to third embodiments described above, the nozzle head 11 is moved in the scanning direction (Xm direction) by the head operating unit 15, and the substrate stage 21 is sub-scanned perpendicular to the scanning direction by the single-axis robot 22. Although the present invention is not limited to this, for example, the nozzle head 11 is moved in the main scanning direction (Xm direction) by the guide rail 115 and is orthogonal to the main scanning direction. When the substrate stage 21 is fixed and moved in the sub-scanning direction (Ym direction), a drive unit for moving the shutter plate 17 provided with the slit ST in the sub-scanning direction is provided. It may be provided. In this case, similarly to the robot control unit 25 described above, the drive unit of the shutter plate 17 moves the shutter plate in the sub-scanning direction (Ym direction) in synchronization with the operation of the nozzle head 11 based on the analysis result in the image processing unit 24. ) May be moved relatively at a predetermined pitch.

It is a schematic block diagram which shows 1st Embodiment of the display panel manufacturing apparatus which concerns on this invention. It is a principal part block diagram which shows the specific example of the nozzle head applied to the display panel manufacturing apparatus which concerns on 1st Embodiment. It is a principal part block diagram which shows a specific example of the shutter plate applied to the display panel manufacturing apparatus which concerns on 1st Embodiment. It is a principal part schematic diagram which shows an example of the pixel array of the display panel manufactured by the manufacturing method of the display apparatus which concerns on 1st Embodiment. It is process sectional drawing (the 1) which shows an example of the manufacturing method (film-forming method of a display panel) of the display apparatus to which the manufacturing apparatus (nozzle coat film-forming apparatus) which concerns on 1st Embodiment is applied. It is process sectional drawing (the 2) which shows an example of the manufacturing method (film-forming method of a display panel) of the display apparatus to which the manufacturing apparatus (nozzle coat film-forming apparatus) which concerns on 1st Embodiment is applied. It is a principal part block diagram which shows the other specific example of the shutter plate applied to the display panel manufacturing apparatus which concerns on 1st Embodiment. It is the schematic which shows the specific example of the shutter board | plate applied to 2nd Embodiment of the display panel manufacturing apparatus which concerns on this invention. It is a schematic block diagram which shows 3rd Embodiment of the display panel manufacturing apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Nozzle head 12 Pump part 13 Pump control part 14 Ink tank 15 Head scanning part 16 Discharge control part 17 Shutter board 21 Substrate stage 22 Single axis robot 23 Alignment camera 24 Image processing part 25 Robot control part 26 High voltage power supply 30 Display panel 113 Nozzle plate 115 Guide rail PH Discharge port ST Slit PSB Panel substrate

Claims (11)

In a display panel manufacturing apparatus in which a plurality of display pixels are arranged on a substrate,
A material liquid discharge section provided with a nozzle for discharging and applying a material liquid to each formation region of the display pixel set on the substrate;
When the nozzle discharges the material liquid to a certain position in the plurality of display pixel formation regions, at least a part of the plurality of display pixel formation regions other than the certain position is disposed. A shielding part for shielding;
An apparatus for manufacturing a display panel, comprising: The display panel manufacturing apparatus according to claim 1, wherein the shielding portion is provided with a slit formed corresponding to a movement range of the nozzle. The shielding part is disposed in a space between the nozzle and the substrate, and the material liquid discharged from the nozzle is applied to a formation region of the display pixel through the slit. Item 3. A display panel manufacturing apparatus according to Item 2. The said shielding part is arrange | positioned in the vicinity of the said nozzle, and a substantially the same position as the lower surface of the said nozzle, The said slit is set to the width | variety wider than the external dimension of the said nozzle. A display panel manufacturing apparatus according to any one of claims 2 to 3. The display panel manufacturing apparatus according to claim 2, wherein the shielding portion has a shape in which an end portion of the slit is bent. 5. The display panel manufacturing apparatus according to claim 2, wherein the shielding portion has a shape in which an end portion of the slit is curved. The display panel manufacturing apparatus according to claim 1, wherein the shielding portion is provided with an adhesive member on at least an upper surface. The display panel manufacturing apparatus according to claim 1, wherein a predetermined voltage is applied to the shielding portion. The nozzle is scanned in a first direction with respect to the substrate, and the substrate is scanned in a second direction orthogonal to the first direction. A display panel manufacturing apparatus according to claim 1. In a method for manufacturing a display panel in which a plurality of display pixels are arranged on a substrate,
A material liquid discharge section provided with a nozzle for discharging the material liquid;
When the nozzle discharges the material liquid to a certain position in the plurality of display pixel formation regions, at least a part of the plurality of display pixel formation regions other than the certain position is disposed. A shielding portion for shielding,
A method for manufacturing a display panel, wherein the material liquid discharge unit discharges and applies the material liquid to each formation region of the display pixel set on the substrate. The method of manufacturing a display panel according to claim 10, wherein the shielding portion is provided with a slit formed corresponding to a movement range of the nozzle.

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