JP2014155967A - Marking tool and marking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a marking tool capable of easily applying markings to an annular support surface configuring a blade mount, and a marking method.SOLUTION: A marking tool 6, which is used when markings are applied to an annular support surface of a stationary flange configuring a blade mount 5, includes a rotary support hole that has an inside diameter equal to a diameter of a cylindrical boss part 52 configuring the blade mount, and a plate 61 that is provided in a position corresponding to a radius of the annular support surface from the center of the rotary support hole and that comprises a marker pen insertion hole 612 subject to insertion of a pen point of a marker pen 10.

Description

  The present invention relates to a marking jig and a marking method for marking an annular support surface constituting a blade mount that sandwiches a cutting blade of a cutting device.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. The semiconductor wafer thus formed is cut along the streets to divide the region where the device is formed to manufacture individual semiconductor devices. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of a sapphire substrate are also divided into individual optical devices such as light emitting diodes and laser diodes by cutting along the streets, and are widely used in electrical equipment. ing.

  Cutting along the streets of the semiconductor wafer and the optical device wafer described above is usually performed by a cutting device called a dicer. This cutting apparatus includes a chuck table that holds a workpiece such as a semiconductor wafer, and a cutting means that includes a cutting blade that cuts the workpiece held on the chuck table. The cutting means includes a fixed flange having an annular support surface that is attached to the rotary spindle and supports the back portion of the cutting blade, and a fitting hole that is formed to protrude laterally from the central portion of the fixed flange and is formed at the center of the cutting blade. A blade mount having a cylindrical boss portion that fits into the blade mount, and formed on the outer peripheral surface of the boss portion constituting the blade mount, screwed into a male screw, and clamped and fixed by the fixing flange. And a clamping nut. In the cutting means of the cutting apparatus configured as described above, if the annular support surface constituting the blade mount is damaged by the attachment / detachment of the cutting blade and the surface accuracy is lowered, the cutting accuracy is deteriorated due to blurring when the cutting blade rotates. To do. For this reason, the annular support surface constituting the blade mount is periodically ground and flattened. (For example, refer to Patent Document 1.)

JP-A-8-339977

In the above-described flattening operation for grinding the annular support surface constituting the blade mount, the annular support surface is marked with magic ink to confirm whether or not the annular support surface has been properly ground. It is judged that the grinding is properly performed when the support surface is ground and the marking is removed from the annular support surface.
However, since the annular support surface constituting the blade mount has a width of only about 3 mm in the diameter direction, there is a problem that it is difficult to mark with the magic ink.

  The present invention has been made in view of the above-described facts, and a main technical problem thereof is to provide a marking jig and a marking method capable of easily marking an annular support surface constituting a blade mount.

In order to solve the above main technical problem, according to the present invention, there is provided a chuck table for holding a workpiece, and a cutting means having a cutting blade for cutting the workpiece held on the chuck table. The cutting means is formed at the center of the cutting blade, formed with a fixed flange having an annular support surface attached to the rotary spindle and supporting the back portion of the cutting blade, and projecting laterally from the central portion of the fixed flange. A blade mount having a cylindrical boss portion into which the fitting hole fits, and a cutting blade screwed into a male screw formed on the outer peripheral surface of the boss portion constituting the blade mount by the fixing flange In a cutting apparatus having a clamping nut for clamping, used for marking on the annular support surface of the fixing flange constituting the blade mount A Kingu jig,
A rotation support hole having an inner diameter equal to the diameter of the columnar boss constituting the blade mount, and a pen tip of a marker pen provided at a position corresponding to the radius of the annular support surface from the center of the rotation support hole Consists of a plate with a marker pen insertion hole,
A marking jig is provided.

  A plurality of marker pen insertion holes provided in the plate are provided corresponding to the radius of the annular support surface.

In addition, according to the present invention, it comprises a chuck table for holding a workpiece, and a cutting means having a cutting blade for cutting the workpiece held on the chuck table, the cutting means comprising: A fixed flange having an annular support surface that is attached to the rotary spindle and supports the back portion of the cutting blade and a fitting hole that is formed to protrude laterally from the central portion of the fixed flange and formed in the center of the cutting blade are fitted. A blade mount having a cylindrical boss portion, and a clamping nut that is screwed into a male screw formed on the outer peripheral surface of the boss portion constituting the blade mount and clamps and fixes the cutting blade by the fixing flange; A marking method for marking on the annular support surface of the fixed flange constituting the blade mount,
A rotation support hole having an inner diameter equal to the diameter of the columnar boss constituting the blade mount, and a pen tip of a marker pen provided at a position corresponding to the radius of the annular support surface from the center of the rotation support hole Using a marking jig made of a plate having a marker pen insertion hole, the rotation support hole of the marking jig is rotatably fitted to the boss portion constituting the blade mount, and the marker pen insertion hole With the pen tip of the marker pen inserted and in contact with the annular support surface, marking is performed on the annular support surface by rotating the marking jig and the blade mount relatively.
A marking method is provided.

  In the present invention, a rotation support hole having an inner diameter equal to the diameter of a cylindrical boss portion constituting a blade mount for mounting a cutting blade for cutting a workpiece, and an annular support from the center of the rotation support hole Using a marking jig made of a plate provided with a marker pen insertion hole for inserting a pen tip of a marker pen provided at a position corresponding to the radius of the surface, the rotation support hole of the marking jig is a boss part constituting the blade mount It is rotatably supported by rotating the marking jig and blade mount relative to each other while the marker pen pen tip is inserted into the marker pen insertion hole and in contact with the annular support surface. Since the marking is performed on the surface, it is possible to easily and reliably mark the annular support surface of the fixed flange constituting the blade mount.

The perspective view of the cutting device with which the marking jig | tool and marking method by this invention are implemented. The perspective view which decomposes | disassembles and shows the structural member of the spindle unit as a cutting means with which the cutting apparatus shown in FIG. 1 is equipped. The perspective view which decomposes | disassembles and shows the structural member of other embodiment of the spindle unit as a cutting means with which the cutting apparatus shown in FIG. 1 is equipped. The perspective view which shows the blade mount which comprises the marking jig and spindle unit comprised according to this invention. Explanatory drawing of the marking method by this invention. The perspective view of the blade mount which comprises the spindle unit with which the marking method by this invention was implemented.

  Hereinafter, preferred embodiments of a marking jig and a marking method constituted according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 shows a perspective view of a cutting apparatus in which a marking jig and a marking method according to the present invention are implemented. The cutting device shown in FIG. 1 includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction (X-axis direction). The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 3 is provided with a clamp 33 for fixing an annular frame that supports a wafer, which will be described later, as a work piece via a dicing tape. The chuck table 3 configured as described above can be moved in a cutting feed direction (X-axis direction) indicated by an arrow X by a cutting feed means (not shown).

  The cutting apparatus shown in FIG. 1 includes a spindle unit 4 as cutting means. The spindle unit 4 is disposed along an index feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the cutting feed direction (X-axis direction). The spindle unit 4 is moved in the index feed direction (Y-axis direction) by an index feed means (not shown), and is moved in the cut feed direction (Z-axis direction) indicated by an arrow Z in FIG. It is like that. The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in an indexing direction (Y-axis direction) and a cutting direction (Z-axis direction), and is rotatably supported by the spindle housing 41. A rotary spindle 42 and a cutting blade 43 attached to the front end of the rotary spindle 42 are provided. The rotary spindle 42 is configured to be rotated by a servo motor (not shown). The structure in which the cutting blade 43 is attached to the front end portion of the rotary spindle 42 will be described in detail later.

  The cutting apparatus in the illustrated embodiment includes an image pickup means 7 for picking up an image of the surface of the workpiece held on the chuck table 3 and detecting a region to be cut by the cutting blade 43. The imaging means 7 is composed of optical means such as a microscope and a CCD camera. In addition, the cutting apparatus includes a display unit 8 that displays an image captured by the imaging unit 7.

  In the cassette mounting area 9a of the apparatus housing 2, a cassette mounting table 9 for mounting a cassette for storing a workpiece is disposed. This cassette mounting table 9 is configured to be movable in the vertical direction by a lifting means (not shown). On the cassette mounting table 9, a cassette 11 for storing a semiconductor wafer W as a workpiece is placed. The semiconductor wafer W accommodated in the cassette 11 has a grid-like street formed on the surface thereof, and devices such as ICs and LSIs are formed in a plurality of rectangular areas partitioned by the grid-like street. The semiconductor wafer W formed in this manner is accommodated in the cassette 11 with the back surface adhered to the front surface of the dicing tape T mounted on the annular support frame F.

  Further, the cutting device in the illustrated embodiment is a semiconductor wafer W (supported on an annular support frame F via a dicing tape T) accommodated in a cassette 11 placed on a cassette placement table 9. ) To the temporary placement table 12, the first conveyance means 14 for conveying the semiconductor wafer W carried to the temporary placement table 12 onto the chuck table 3, and cutting on the chuck table 3. A cleaning means 15 for cleaning the processed semiconductor wafer W and a second transfer means 16 for transferring the semiconductor wafer W cut on the chuck table 3 to the cleaning means 15 are provided.

Next, a structure in which the cutting blade 43 is attached to the front end portion of the rotary spindle 42 will be described with reference to FIG.
The cutting blade 43 shown in FIG. 2 is a so-called hub blade comprising an annular base 431 formed of aluminum and an annular cutting edge 432 attached to the outer peripheral side surface of the annular base 431. . The annular base 431 is provided with a fitting hole 431a that fits in a boss portion of a blade mount, which will be described later, in the center, and a blade mounting portion 431b on the outer peripheral side. An annular cutting edge 432 is mounted on the blade mounting portion 431b. The annular cutting edge 432 is formed to have a thickness of about 20 μm by fixing diamond abrasive grains having a particle size of about 3 μm by electroforming, for example.

  The cutting blade 43 configured as described above is attached to the blade mount 5 attached to the rotary spindle 42 rotatably supported by the spindle housing 41 of the spindle unit 4. The cutting blade 43 is clamped and fixed by the blade mount 5 and the clamping nut 55.

  The blade mount 5 attached to the rotary spindle 42 is made of stainless steel in the illustrated embodiment, and has a fixed flange 51 and a cylindrical boss formed to protrude sideways from the center of the fixed flange 51. Part 52. An annular support surface 511 for supporting the back surface of the annular base 431 constituting the cutting blade 43 is provided on the outer peripheral side surface of the fixed flange 51 on the boss portion 52 side. The annular support surface 511 has a width in the diameter direction of about 3 mm. The cylindrical boss portion 52 has a diameter corresponding to that of the fitting hole 431a provided in the annular base 431 constituting the cutting blade 43, and is clamped at the tip portion on the outer peripheral surface. A male screw 521 into which the nut 55 is screwed is formed.

  The blade mount 5 in the illustrated embodiment is configured as described above, and the fitting hole 431a provided in the annular base 431 constituting the cutting blade 43 is fitted into the cylindrical boss portion 52, The annular base 431 is sandwiched between the annular support surface 511 of the fixing flange 51 of the blade mount 5 and the sandwiching nut 55 by screwing the sandwiching nut 55 into the male screw 521 formed on the cylindrical boss portion 52. And fix.

Next, another embodiment of a structure in which a cutting blade 43 is attached to the front end portion of the rotary spindle 42 will be described with reference to FIG.
The cutting blade 430 shown in FIG. 3 is a washer blade that is formed in a circular shape by binding abrasive grains made of diamond or the like with a binder. As this washer blade, a resinoid blade in which abrasive grains are kneaded into a resin bond material and molded into a ring and fired, a metal blade in which abrasive grains are kneaded into a metal bond material and molded into a ring, and fired, aluminum, etc. An electroformed blade in which abrasive grains are bonded to the side surface of the base formed by metal plating such as nickel is used.

  The cutting blade 430 configured as described above is attached to the blade mount 5 attached to the rotary spindle 42 rotatably supported by the spindle housing 41. That is, after the annular cutting blade 430 is fitted to the cylindrical boss portion 52 constituting the blade mount 5 and the fitting hole 561 provided in the clamping member 56 is fitted, the clamping nut 55 is moved to the cylindrical boss. The cutting blade 430 is clamped by the annular support surface 511 of the fixing flange 51 of the blade mount 5 and the clamping member 56 by being screwed into the male screw 521 formed in the portion 52.

  Since the cutting blade 43 and the cutting blade 430 described above are replaced relatively frequently, the annular support surface 511 of the fixing flange 51 constituting the blade mount 5 is damaged by the attachment / detachment of the cutting blade, and the surface accuracy is lowered. This causes blurring when rotating, and cutting accuracy deteriorates. For this reason, as described above, the annular support surface 511 of the fixed flange 51 constituting the blade mount 5 is periodically ground and flattened. At this time, the annular support surface 511 is marked with magic ink. However, since the annular support surface 511 has a diametrical width of only about 3 mm, it is difficult to mark with the magic ink. Therefore, in the present invention, when marking is performed on the annular support surface 511 of the fixed flange 51 constituting the blade mount 5, the marking jig shown in FIG. 4 is used.

  The marking jig 6 shown in FIG. 4 includes an annular plate 61 formed of synthetic resin. The annular plate 61 forms the rotation mount hole 611 having an inner diameter equal to the diameter of the cylindrical boss portion 52 constituting the blade mount 5 at the center, and the blade mount 5 from the center of the rotation support hole 611. A marker pen insertion hole 612 is provided at a position corresponding to the radius of the annular support surface 511 of the fixing flange 51 to be inserted and into which the pen tip of the marker pen is inserted. The marker pen insertion hole 612 has a diameter slightly larger than the width of the annular support surface 511 in the diameter direction. Note that a plurality of marker pen insertion holes 612 are provided at different radial positions from the center of the rotation support hole 611 in the annular plate 61 constituting the marking jig 6 shown in FIG. The plurality of marker pen insertion holes 612 are provided in this way when, for example, the cutting blade 430 made of the washer blade is attached to the blade mount 5, the outer periphery of the annular support surface 511 on the outer periphery of the cutting blade 430 depends on the type of workpiece. This is because a plurality of blade mounts 5 having different outer diameters of the fixing flange 51 are prepared because the protruding amounts from the peripheral edge are different.

Next, a marking method for marking the annular support surface 511 of the fixing flange 51 constituting the blade mount 5 using the marking jig 6 will be described with reference to FIGS.
First, the rotation support hole 611 of the annular plate 61 constituting the marking jig 6 is rotatably fitted to the boss portion 52 constituting the blade mount 5. And the marker pen insertion hole 612 provided in the position corresponding to the radius of the annular support surface 511 (refer FIG. 2, FIG. 3) of the fixing flange 51 in the some marker pen insertion hole 612 provided in the annular plate 61. FIG. With the pen tip 101 of the marker pen 10 inserted into contact with the annular support surface 511, the marking jig 6 is rotated once on the boss portion 52 in the direction indicated by the arrow 6a. Note that the pen tip 101 of the marker pen 10 has a diameter corresponding to the diameter of the marker pen insertion hole 612, and when inserted into the marker pen insertion hole 612, a large gap may not be formed between the pen tip 101 and the inner peripheral surface. desirable. As a result, the marking 100 can be easily and reliably applied to the annular support surface 511 of the fixing flange 51 constituting the blade mount 5.

Although the present invention has been described based on the illustrated embodiment, the present invention is not limited to the embodiment, and various modifications are possible within the scope of the gist of the present invention. For example, in the above-described embodiment, an example in which the marking jig 6 is configured by the annular plate 61 has been described. However, the marking jig 6 may have any shape as long as the marking jig 6 includes the rotation support hole 611 and the marker pen insertion hole 612. These plates may also be used.
In the above-described embodiment, the marking is performed with the pen tip 101 of the marker pen 10 inserted into the marker pen insertion hole 612 provided in the plate 61 constituting the marking jig 6 and brought into contact with the annular support surface 511. Although the example in which the jig 6 is rotated once on the boss portion 52 is shown, the marking jig 6 and the blade mount 5 may be rotated relatively, and the pen tip 101 of the marker pen 10 is inserted into the marker pen insertion hole 612. The blade mount 5 may be rotated while holding the marking jig 6 in a state of being inserted and brought into contact with the annular support surface 511.

2: Device housing 3: Chuck table 4: Spindle unit 42: Rotary spindle 43: Cutting blade 430: Cutting blade 431: Annular base 432: Annular cutting edge 5: Blade mount 51: Fixed flange 511: Annular support surface 52: Boss portion 55: Holding nut 56: Holding member 6: Marking jig 61: Circular plate 611: Rotation support hole 612: Marker pen insertion hole 7: Imaging means 8: Display means 9: Cassette mounting table 10: Marker pen 11: Cassette 12: Temporary table 13: Unloading / carrying means 14: First conveying means 15: Cleaning means 16: Second conveying means W: Semiconductor wafer F: Annular support frame T: Dicing tape

Claims (3)

A chuck table for holding a workpiece; and a cutting means having a cutting blade for cutting the workpiece held on the chuck table. The cutting means is attached to a rotary spindle and is attached to the cutting blade. A fixed flange having an annular support surface for supporting the back portion, and a columnar boss portion that protrudes laterally from the central portion of the fixed flange and that is fitted with a fitting hole formed in the center of the cutting blade. A cutting device comprising: a blade mount; and a clamping nut that is screwed into a male screw formed on an outer peripheral surface of a boss portion constituting the blade mount and clamps and fixes the cutting blade with the fixing flange. A marking jig used for marking on the annular support surface of the fixed flange constituting the blade mount,
A rotation support hole having an inner diameter equal to the diameter of the columnar boss constituting the blade mount, and a pen tip of a marker pen provided at a position corresponding to the radius of the annular support surface from the center of the rotation support hole Consists of a plate with a marker pen insertion hole,
A marking jig characterized by that.   The marking jig according to claim 1, wherein a plurality of marker pen insertion holes provided in the plate are provided corresponding to the radius of the annular support surface. A chuck table for holding a workpiece; and a cutting means having a cutting blade for cutting the workpiece held on the chuck table. The cutting means is attached to a rotary spindle and is attached to the cutting blade. A fixed flange having an annular support surface for supporting the back portion, and a columnar boss portion that protrudes laterally from the central portion of the fixed flange and that is fitted with a fitting hole formed in the center of the cutting blade. A cutting device comprising: a blade mount; and a clamping nut that is screwed into a male screw formed on an outer peripheral surface of a boss portion constituting the blade mount and clamps and fixes the cutting blade with the fixing flange. A marking method for marking on the annular support surface of the fixed flange constituting the blade mount,
A rotation support hole having an inner diameter equal to the diameter of the columnar boss constituting the blade mount, and a pen tip of a marker pen provided at a position corresponding to the radius of the annular support surface from the center of the rotation support hole Using a marking jig made of a plate having a marker pen insertion hole, the rotation support hole of the marking jig is rotatably fitted to the boss portion constituting the blade mount, and the marker pen insertion hole With the pen tip of the marker pen inserted and in contact with the annular support surface, marking is performed on the annular support surface by rotating the marking jig and the blade mount relatively.
A marking method characterized by that.

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