JP2013233618A - Method of mounting flange - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of mounting a flange capable of reducing the corrected amount of an end face of a flange after the flange with a corrected end face is re-mounted on a spindle.SOLUTION: A method of mounting a flange includes a flange mounting step of mounting a flange (74) on a tapered portion (711a) at the distal end of a spindle (711), an end face correcting step of correcting an end face (741a) of the flange, a mounting direction marking step of forming marks (711c, 743) for indicating a mounting direction at the distal end of the spindle and on the flange before or after the end face correction step, and a flange re-mounting step of re-mounting the flange with a corrected end face on the tapered portion at the distal end of the spindle, while the mark at the distal end of the spindle is aligned with the mark on the flange, after the flange with a corrected end face is removed from the spindle.

Description

  The present invention relates to a mounting method for mounting a flange to which a cutting blade is mounted so as to be in contact with an end surface to a spindle of a cutting device, and in particular, mounting for mounting a flange with a modified end surface on a spindle again after being removed from the spindle. Regarding the method.

  The wafer on which the device is formed on the surface is divided into chips by, for example, a cutting apparatus including a blade unit. The blade unit includes a spindle that transmits the rotational force of the motor, a flange that is attached to one end of the spindle, and an annular cutting blade that is attached to the flange. As this cutting blade, there is known a washer blade made only of an annularly shaped grindstone, a hub blade in which an annular grindstone is fixed to the outer periphery of a disc-shaped base portion, and the like.

  The cutting blade is brought into contact with the end face of the flange in a state of being attached to the flange. For this reason, if the angle formed between the end face of the flange and the rotation axis of the spindle deviates from 90 °, the cutting blade flutters during the rotation of the spindle and the wafer processing accuracy decreases. In order to solve this problem, a method has been proposed in which the end face of the flange mounted on the spindle is ground and the angle formed between the end face and the rotation shaft is corrected to 90 ° (see, for example, Patent Document 1).

Japanese Patent No. 3472390

  By the way, after the flange end face is corrected by the above-described method, when the flange is detached from the spindle and mounted again, the mounting state of the flange with respect to the spindle is changed and the end face needs to be corrected again. Thus, if the end face is corrected each time the flange is remounted, the life of the flange is shortened by increasing the correction amount. Further, if the frequency of correcting the end face of the flange is high, the time required for correcting the end face increases accordingly, so that the substantial operating time of the cutting device is shortened.

  The present invention has been made in view of such a point, and an object of the present invention is to provide a flange mounting method capable of reducing the correction amount of the end surface after the flange having the corrected end surface is remounted on the spindle.

  The flange mounting method according to the present invention includes a holding table that holds a workpiece, a cutting blade that cuts the workpiece held on the holding table, a spindle housing, and a spindle housing that is rotatably supported in the spindle housing. In a cutting apparatus having a spindle, and a flange that is detachably engaged with the tapered portion at the tip of the spindle and that supports the cutting blade at an end surface, the flange is attached to the tapered portion at the tip of the spindle A flange mounting step for mounting the flange on the tapered portion at the tip of the spindle, an end surface correction step for correcting the end surface of the flange after the flange mounting step, and a step after the flange mounting step. In the mounting direction to the tip of the spindle and the flange before or after the end face correction step After the mounting direction marking step for forming the mark to be shown and the mounting direction marking step after removing the flange whose end face has been corrected from the spindle, the spindle tip mark and the flange mark are aligned again. And a flange remounting step of mounting the flange whose end face has been corrected on the tapered portion at the tip of the spindle.

  According to this configuration, the flange whose end face has been corrected is reattached to the tapered portion of the spindle end with the position of the mark on the spindle tip and the mark on the flange aligned, so that the end face is appropriately corrected. The close mounting state is reproduced, and the correction amount of the end face after the remounting can be minimized. As a result, even if the end face is corrected each time the flange is mounted, it is possible to suppress a decrease in the life of the flange and to ensure a sufficient operating time of the cutting apparatus.

  Also, the flange mounting method of the present invention includes a holding table for holding a workpiece, a cutting blade for cutting the workpiece held on the holding table, a spindle housing, and a rotatable inside the spindle housing. A cutting apparatus comprising: a supported spindle; and a flange that is detachably attached to the tapered portion of the spindle tip and that supports the cutting blade on an end surface thereof, wherein the flange is disposed on the tapered portion of the spindle tip. A mounting method for mounting, wherein a first mark and a second mark are formed at an arbitrary position of the spindle tip, and an arbitrary position of the flange, and the first mark and the flange of the spindle tip The flange is attached to the tapered portion at the tip of the spindle in a state where the positions of the second marks are aligned. Flange mounting step, after the flange mounting step, an end surface correction step of correcting the end surface of the flange, and after removing the flange subjected to end surface correction from the tip of the spindle, A flange remounting step of mounting the flange subjected to the end face correction on the tapered portion of the spindle tip in a state where the positions of the first mark and the second mark of the flange are aligned. To do.

  ADVANTAGE OF THE INVENTION According to this invention, the mounting method of the flange which can reduce the correction amount of the end surface after remounting the flange with which the end surface was corrected to a spindle can be provided.

FIG. 3 is a perspective view illustrating a configuration of a cutting device used in the mounting method according to the first embodiment. It is a perspective view which shows the structure of the blade unit of a cutting device. 6 is a flowchart showing a flow of a mounting method according to the first embodiment. 6 is a schematic diagram for explaining a mounting method according to Embodiment 1. FIG. 6 is a perspective view showing a blade unit used in the mounting method according to Embodiment 2. FIG.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

(Embodiment 1)
The mounting method according to the present embodiment (flange mounting method) includes a flange mounting step of mounting a flange with which a cutting blade abuts on a spindle, an end surface correcting step of correcting the end surface of the flange, and an end surface correcting step. Before (or before), the marking process (mounting direction marking process) in which marks indicating the mounting direction are formed on the spindle and the flange, and after removing the flange from the spindle, the position of the spindle mark and the position of the flange mark are aligned. And a flange remounting step for remounting the flange to the spindle in a state where

  In this mounting method, the flange is remounted on the spindle with the position of the mark on the spindle and the position of the mark on the flange aligned, so that the mounting state close to the state where the end face has been appropriately corrected is reproduced, The amount of correction of the end face after remounting can be kept to a minimum. As a result, even if the end face is corrected each time the flange is mounted, it is possible to suppress a decrease in the life of the flange and to ensure a sufficient operating time of the cutting apparatus. Hereinafter, details of the mounting method according to the present embodiment will be described.

  With reference to FIG. 1, the structure of the cutting device used for the mounting method of this Embodiment is demonstrated. FIG. 1 is a perspective view showing a configuration of a cutting apparatus 1 used in the mounting method of the present embodiment. FIG. 1 also shows a wafer (workpiece) W to be processed by the cutting apparatus 1. The cutting device used in the mounting method of the present embodiment and the wafer to be processed by the cutting device are not limited to the cutting device 1 and the wafer W shown in FIG.

  The wafer W to be processed by the cutting apparatus 1 has a substantially disk-like outer shape. The wafer W is supported by an annular frame F via a dicing tape T attached to the back side. The surface of the wafer W is partitioned into a plurality of regions by streets arranged in a lattice pattern, and devices are formed in each partitioned region. The wafer W is cut along each street and divided into individual chips. In addition, the processing target of the cutting apparatus 1 is not limited to a wafer.

  The cutting apparatus 1 has a base 2 having a substantially flat top surface. The base 2 includes a base 21 having a substantially rectangular parallelepiped shape, and a projecting portion 22 projecting forward at some corners. An internal space is formed in the protruding portion 22, and the cassette elevator 3 is provided in the internal space so as to be movable up and down. On the upper surface of the cassette elevator 3, a cassette 31 for storing the wafer W is placed. The cassette 31 includes a plurality of storage portions 32 that store one wafer W at a time in the height direction (Z-axis direction).

  A temporary placement mechanism 4 is provided on the upper surface of the base 21 at a position adjacent to the cassette elevator 3. The temporary placement mechanism 4 includes a drawer portion 41 and a pair of rails 42. The lead-out part 41 is configured to be movable in the first direction (Y-axis direction), and the wafer W positioned at the same height as the lead-out part 41 is pulled out to the rail 42 side by the vertical movement of the cassette elevator 3. The rails 42 have a substantially L-shaped cross-sectional shape, and are configured to be separated from each other in a second direction (X-axis direction) perpendicular to the first direction. The wafer W is pulled out to a predetermined position on the rail 42 by the leading portion 41 and is sandwiched in the second direction by the close proximity of the pair of rails 42. Thereby, the wafer W is aligned in the X-axis direction and the Y-axis direction.

  An opening extending in the X-axis direction is formed at a position adjacent to the temporary placement mechanism 4 of the base portion 21. The opening is covered by the table moving base 5 and the waterproof cover 51. Below the waterproof cover 51, an X-axis moving mechanism (not shown) is provided that can move the table moving base 5 in the X-axis direction. The X-axis movement mechanism includes a pair of guide rails parallel to the X-axis direction, an X-axis ball screw between the guide rails, and an X-axis pulse motor (not shown) that rotationally drives the X-axis ball screw. The table moving base 5 is connected to the X-axis ball screw via a nut portion (not shown), and is moved along the guide rail by the rotation of the X-axis ball screw.

  A chuck table (holding table) 52 is provided on the table moving base 5. The chuck table 52 is formed in a disk shape, and an adsorption surface 53 made of a porous ceramic material is provided at the center of the upper surface. The wafer W is held at a predetermined position on the chuck table 52 by sucking the wafer W from the back surface side on the suction surface 53. The chuck table 52 is supported by a rotation mechanism (not shown) so as to be rotatable (θ rotation) around the Z axis on the table moving base 5. The wafer W aligned in the X-axis direction and the Y-axis direction by the temporary placement mechanism 4 is transferred to the chuck table 52 by a transfer mechanism (not shown).

  A table base 6 is disposed at a position adjacent to the table moving base 5 in the Y-axis direction. The table base 6 is provided with a Y-axis moving mechanism 61. The Y-axis moving mechanism 61 includes a pair of guide rails 62 parallel to the Y-axis direction, a Y-axis ball screw (not shown) between the guide rails 62, and a Y-axis pulse motor 63 that rotationally drives the Y-axis ball screw. A Y-axis table 64 is supported on the upper surface of the table base 6. The Y-axis table 64 includes a base portion 64a that is in contact with the table base 6 and a wall portion 64b that is erected with respect to the base portion 64a. The Y-axis table 64 is connected to the Y-axis ball screw via a nut portion (not shown) provided in the base portion 64a, and is moved along the guide rail 62 by the rotation of the Y-axis ball screw.

  A Z-axis moving mechanism 65 is provided on the wall portion 64 b of the Y-axis table 64. The Z-axis moving mechanism 65 is disposed on the front surface of the wall portion 64b and is parallel to the Z-axis direction. The Z-axis moving mechanism 65 is connected to the Z-axis ball screw 67 between the guide rails 66 and the Z-axis ball screw 67. A pulse motor 68 is provided. A Z-axis table 69 is supported on the front surface of the wall portion 64b. The Z-axis table 69 includes a base portion 69a that contacts the wall portion 64b, and a wall portion 69b that protrudes forward (Y-axis direction) at the end of the base portion 69a. The Z-axis table 69 is connected to the Z-axis ball screw 67 via a nut portion provided on the base 69a, and is moved along the guide rail 66 by the rotation of the Z-axis ball screw 67.

  The blade unit 7 is supported on the wall 69 b of the Z-axis table 69 at a position above the chuck table 52. The blade unit 7 includes a spindle unit 71 and a cutting blade 72 that is detachably attached to one end side of the spindle unit 71. A motor 73 is connected to the other end side of the spindle unit 71 so that a cutting blade 72 attached to one end side of the spindle unit 71 can be rotated. The wafer W is cut by rotating the cutting blade 72 and cutting it into the wafer W. The blade unit 7 is provided with an imaging unit 8 adjacent to the cutting blade 72.

  A control unit (not shown) of the cutting apparatus 1 controls the X-axis movement mechanism and the Y-axis movement mechanism 61 based on the captured image captured by the imaging unit 8, and the cutting blade 72 of the blade unit 8 is moved to the street of the wafer W. Align to. The wafer W aligned with the cutting blade 72 is cut by the rotated cutting blade 72 while spraying cutting water. The cut wafer W is picked up by a transfer means (not shown) and moved to the cleaning / drying mechanism 9 provided on the upper surface of the base 21.

  The cleaning / drying mechanism 9 includes a spinner table 91 that holds the substrate W in a cylindrical space formed on the base 2. The cleaning / drying mechanism 9 includes a cleaning liquid injection mechanism and a gas injection mechanism (both not shown). A rotation mechanism (not shown) is provided below the spinner table 91. The rotation mechanism has a spinner table motor (not shown) that applies a rotational force to the spinner table 91, and can rotate the spinner table 91 at a predetermined speed. When the substrate W is held on the spinner table 91, the spinner table 91 is rotated in the cylindrical space. In this state, the substrate W is cleaned by spraying the cleaning liquid from the cleaning liquid spray mechanism. The cleaned substrate W is dried by the air ejected from the gas ejection mechanism.

  Next, the blade unit 7 of the cutting apparatus 1 will be described in detail with reference to FIG. FIG. 2 is a perspective view showing the configuration of the blade unit 7 of the cutting apparatus 1. As described above, the blade unit 7 includes the spindle unit 71 and the cutting blade 72. The spindle unit 71 includes a spindle shaft (spindle) 711 that constitutes a rotation shaft, and a spindle housing 712 that supports the spindle shaft 711.

  The spindle unit 71 is an air spindle, for example, and supports the spindle shaft 711 in a floating state by an air layer of compressed air. A tip portion (tapered portion) 711 a configured in a tapered shape in the spindle shaft 711 protrudes forward from the spindle housing 712 so that a flange 74 to which the cutting blade 72 is attached can be attached. A screw hole 711 b is provided in the tip end portion 711 a of the spindle shaft 711.

  The flange 74 has a flange portion 741 that extends outward in the radial direction and a boss portion 742 that protrudes forward from the flange portion 741. On the back surface side of the flange 74, a fitting hole (not shown) into which the tip end portion 711a of the spindle shaft 711 can be fitted is provided. The flange 74 is fixed to the spindle shaft 711 by tightening the screw 76 in the screw hole 711b in a state where the tip end portion 711a of the spindle shaft 711 is fitted in the fitting hole of the flange 74.

  The flange portion 741 of the flange 74 has an end surface 741a with which the back surface side of the cutting blade 72 abuts at the outer peripheral portion. The end surface 741a is formed in an annular shape when viewed from the rotation axis direction of the spindle shaft 711. The boss portion 742 is configured in a substantially cylindrical shape, and a screw portion 742a into which a ring-shaped fixing nut 75 is tightened is provided on the outer peripheral portion.

  The cutting blade 72 is, for example, an annular grindstone in which a disc-shaped base portion 721 having an engagement hole 721a with which a boss portion 742 of a flange 74 is engaged at the center, and abrasive grains made of diamond or the like are coupled with a binding material. Part 722. The grindstone portion 722 is fixed to the outer peripheral portion of the base portion 721, and has a thin plate shape extending radially outward from the base portion 721. The base 721 has a substantially flat surface 721b and a back surface (not shown). In mounting the cutting blade 72, the boss portion 742 is engaged with the engagement hole 721a, and the back surface of the base portion 721 is brought into contact with the end surface 741a of the flange portion 741.

  The cutting blade 72 is formed so that the outer diameter of the grindstone portion 722 is sufficiently larger than the outer diameter of the flange portion 741. For this reason, when the cutting blade 72 is mounted on the flange 74, the grindstone portion 722 protrudes radially outward from the outer peripheral edge of the flange portion 741. The wafer W is cut by rotating the cutting blade 72 and bringing the grindstone portion 722 protruding from the flange portion 741 into contact with the wafer W.

  With the cutting blade 72 attached to the flange 74, a ring-shaped fixing nut 75 is tightened to the boss portion 742. A screw hole 75 a corresponding to the screw part 742 a of the boss part 742 is provided in the center of the fixing nut 75. When the fixing nut 75 is tightened into the boss portion 742, the cutting blade 72 is sandwiched and fixed by the flange 74 and the fixing nut 75. Specifically, the front surface 721b of the base portion 721 is in contact with the back surface of the fixing nut 75, and the back surface of the base portion 721 is in contact with the contact surface 741a of the flange portion 741, so that the cutting blade 72 is held at a predetermined position. The

  Next, with reference to FIG.3 and FIG.4, the detail of the mounting method of this Embodiment is demonstrated. FIG. 3 is a flowchart showing the flow of the mounting method of the present embodiment. FIG. 4 is a schematic diagram for explaining a mounting method according to the present embodiment.

  First, in the flange mounting step (step ST1), the flange 74 is mounted on the tip portion 711a of the spindle shaft 711. That is, the front end portion 711a of the spindle shaft 711 is fitted into the fitting hole on the back surface of the flange 74, and the screw 76 is tightened into the screw hole 711b (see FIG. 2). As a result, the flange 74 is fixed to the tip portion 711 a of the spindle shaft 711 and is rotated together with the spindle shaft 711.

  In a state where the flange 74 is mounted on the spindle shaft 711, as shown in FIG. 4A, the angle formed between the end surface 741a and the rotation axis O1 of the spindle shaft 711 may be shifted from 90 °. This deviation is caused by a manufacturing error of the spindle shaft 711 and the flange 74, an inclination of the rotation axis O1 of the spindle shaft 711, and the like. When the cutting blade 72 is attached to the flange 74 in this state, the angle formed by the cutting blade 72 and the rotation axis O1 also deviates from 90 °. As a result, when the spindle shaft 711 is rotated, the outer peripheral portion of the cutting blade 72 flutters, and the processing accuracy of the wafer W decreases.

  Therefore, after the flange mounting step, an end surface correction step (step ST2) for correcting the end surface 741a of the flange 74 is performed. As shown in FIG. 4B, the end face 741a is corrected (end face correction) by bringing a grinding tip (polishing tip) C into contact with the end face 741a while the flange 74 is rotated. Thereby, the end surface 741a is ground with a grinding amount corresponding to the mounting state of the flange 74 (inclination of the end surface 741a with respect to the rotation axis O1).

  Specifically, first, the grinding chip C is sucked and held on the chuck table 52 (see FIG. 1) so that the tip portion of the grinding chip C and the end surface 741a of the flange 74 are sufficiently close to each other. Next, the flange 74 attached to the spindle shaft 711 is rotated by the motor 73 (see FIG. 1). Then, the flange 74 is moved toward the grinding tip C by the Y-axis moving mechanism 61 (see FIG. 1), and the tip portion of the grinding tip C is brought into contact with the rotated end surface 741a. At this time, the grinding tip C is repeatedly reciprocated in the X-axis direction by the X-axis moving mechanism. By this end face correcting step, the angle formed between the end face 741a and the rotation axis O1 is corrected to 90 °.

  After the end face 741a is corrected, the cutting blade 72 is attached to the flange 74. That is, the boss portion 742 of the flange 74 is engaged with the engagement hole 721a of the cutting blade 72, and the back surface of the base portion 721 is brought into contact with the end surface 741a of the flange portion 741 (see FIG. 2). Further, a ring-shaped fixing nut 75 is fastened to the boss portion 742, and the cutting blade 72 is sandwiched and fixed by the flange 74 and the fixing nut 75 (see FIG. 2). Since the angle between the end surface 741a and the rotation axis O1 is corrected to 90 ° by the above-described end surface correction, the angle between the cutting blade 72 and the rotation axis O1 is also 90 °. As a result, the fluctuation of the cutting blade 72 due to the rotation is reduced, and a reduction in machining accuracy is suppressed.

  By the way, when the flange 74 is removed after the above-described end face correcting step and mounted again on the tip portion 711a of the spindle shaft 711, the mounting state of the flange 74 with respect to the tip portion 711a is changed. If it does so, the angle which end face 741a and rotation axis O1 make will shift from 90 degrees, and end face 741a may have to be sharply ground by end face correction after reattachment.

  Thus, when the amount of correction for end face correction increases, the life of the flange 74 is shortened accordingly. In particular, if the attachment / detachment frequency of the flange 74 is high, the frequency of end face correction is also high, so the life of the flange 74 is significantly shortened. Moreover, when the frequency of end face correction is high, the total time for end face correction also increases, and the substantial operating time of the cutting device 1 is shortened.

  Therefore, in the mounting method of the present embodiment, in the marking step (step ST3) after the end face correction step, a mark (first mark) 711c is formed on the tip portion 711a of the spindle shaft 711, and the mark ( 2nd mark) 743 is formed. Specifically, the mark 711c and the mark 743 are formed so that their positions (directions and angles) are aligned. Thereby, in the subsequent flange remounting process, it is possible to easily reproduce the mounting state close to the mounting state in the flange mounting process in which the end face is appropriately corrected. Note that the mark 711c and the mark 743 can be formed by, for example, applying paint to the tip end portion 711a and the flange 74.

  In the flange remounting process (step ST4) after the flange 74 is removed, the flange 74 is mounted on the tip 711a of the spindle shaft 711 so that the positions (directions and angles) of the mark 711c and the mark 743 are aligned. As a result, the mounting state close to the mounting state of the flange mounting step with the appropriate end surface corrected is reproduced, so that the correction amount of the end surface 741a in the end surface correcting step after remounting can be minimized.

  Here, for example, as shown in FIG. 4C, the flange 74 (FIG. 4B) whose end face has been corrected as described above is rotated by 180 ° around the rotation axis O1 with respect to the tip end portion 711a of the spindle shaft 711. Consider the case of attaching with The end surface 741a of the flange 74 is modified in a state where the flange 74 is mounted on the spindle shaft 711 so that the mark 711c and the mark 743 are aligned. For this reason, when the flange 74 is mounted as shown in FIG. 4C, the angle formed between the end surface 741a and the rotation axis O1 is greatly shifted from 90 °, and the correction amount of the end surface 741a in the end surface correction process after remounting is extremely large. It gets bigger.

  On the other hand, in the mounting method of the present embodiment, the flange 74 whose end face has been corrected is mounted again so that the positions of the marks 711c and the mark 743 are aligned. This can be realized by the remounting process. That is, since the mounting state close to the state where the end surface is appropriately corrected is reproduced, the amount of grinding of the end surface 741a in the end surface correcting step after remounting can be minimized.

  As described above, according to the mounting method of the present embodiment, the flange 74 whose end surface 741a is corrected is the positions of the mark 711c of the tip end (tapered portion) 711a of the spindle shaft (spindle) 711 and the mark 743 of the flange 74. Since it is remounted on the tip (tapered portion) of the spindle shaft in an aligned state, the mounted state close to the state where the end surface 741a is appropriately corrected is reproduced, and the correction amount of the end surface 741a after remounting is minimized. Can be limited. As a result, even if the end face 741a is corrected each time the flange 74 is attached, the life of the flange 74 can be prevented from being reduced and the operating time of the cutting apparatus 1 can be sufficiently secured.

  In this embodiment, the marking process for forming the mark 711c and the mark 743 is performed after the end face correction process. However, this marking process may be performed before the end face correction process.

(Embodiment 2)
In the present embodiment, a mounting method different from that of the first embodiment will be described. The mounting method of the present embodiment is common to the mounting method of the first embodiment in many respects. For this reason, the detailed description about a common point is abbreviate | omitted. FIG. 5 is a perspective view showing the configuration of the blade unit 7 used in the mounting method of the present embodiment. In FIG. 5, the same components as those in FIG. In FIG. 5, for convenience of explanation, a part of the configuration of the blade unit 7 is omitted.

  In the mounting method according to the present embodiment, as shown in FIG. 5, a mark (first mark) 711 c and a mark (second mark) 743 are formed in advance on the tip 711 a and the flange 74 of the spindle shaft 711. The blade unit 7 is used. Note that the positions where the marks 711c and the marks 743 are formed are not particularly limited. For example, the mark 743 may be formed at a visible position other than the end face 741 a of the flange 74.

  In the mounting method of the present embodiment, first, in the flange mounting step, the flange 74 is mounted on the tip 711a so that the positions (directions and angles) of the marks 711c and the marks 743 are aligned. After the mounting of the flange 74, an end face correction process is performed. However, since the mark 711c and the mark 743 are already formed in the blade unit 7 used in the present embodiment, the marking process is not performed.

  In the flange remounting process, the flange 74 is remounted on the tip 711a so that the positions (directions and angles) of the marks 711c and 743 are aligned. That is, the flange 74 is remounted in a state where the positional relationship (direction and angle) between the tip end portion 711a of the spindle shaft 711 and the flange 74 is the same as that in the blade mounting process. Thereby, the mounting state close to the state in which the end surface 741a is appropriately corrected is reproduced, and the correction amount of the end surface 741a after remounting can be minimized. As a result, even if the end face 741a is corrected each time the flange 74 is attached, the life of the flange 74 can be prevented from being reduced and the operating time of the cutting apparatus 1 can be sufficiently secured.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above embodiment, in the marking step, marks are formed on the tip of the spindle shaft and the flange so as to align the positions (directions and angles) with each other. However, the positional relationship of the formed marks is arbitrary. is there. It is sufficient that the mark is formed so that at least the same mounting state can be realized.

  Further, the shape, quantity, size, and specific formation position of the mark are not particularly limited. For example, various figures such as a circle, a triangle, a quadrangle, and an arrow can be used as a mark. In addition, the configurations, methods, and the like according to the above-described embodiments can be changed as appropriate without departing from the scope of the object of the present invention.

  The present invention is useful in removing and remounting a flange with a modified end face from the spindle.

DESCRIPTION OF SYMBOLS 1 Cutting device 7 Blade unit 71 Spindle unit 72 Cutting blade 73 Motor 74 Flange 75 Fixing nut 75a Screw hole 76 Screw 711 Spindle shaft (spindle)
711a Tip (tapered portion)
711b Screw hole 711c Mark (first mark)
712 Spindle housing 721 Base 721a Engagement hole 721b Surface 722 Grindstone 741 Flange 741a End face 742 Boss 742a Screw 743 Mark (second mark)
C Grinding tip O1 Rotating shaft

Claims (2)

A holding table for holding a workpiece, a cutting blade for cutting the workpiece held on the holding table, a spindle housing, a spindle rotatably supported in the spindle housing, and a taper at the tip of the spindle A cutting device having a flange that is detachably attached to and engages with a portion and supports the cutting blade at an end surface, wherein the flange is attached to the tapered portion at the tip of the spindle,
A flange mounting step of mounting the flange on the tapered portion of the spindle tip;
After the flange mounting step, an end surface correction step of correcting the end surface of the flange;
A mounting direction marking step for forming a mark indicating a mounting direction on the front end of the spindle and the flange after the flange mounting step and before or after the end face correction step;
After the mounting direction marking step, after removing the flange subjected to end face correction from the spindle, the flange subjected to end face correction in a state where the position of the mark on the spindle tip and the mark on the flange is aligned again. And a flange remounting step for mounting the taper on the taper portion of the spindle tip. A holding table for holding a workpiece, a cutting blade for cutting the workpiece held on the holding table, a spindle housing, a spindle rotatably supported in the spindle housing, and a taper at the tip of the spindle A cutting device having a flange that is detachably attached to and engages with a portion and supports the cutting blade at an end surface, wherein the flange is attached to the tapered portion at the tip of the spindle,
A first mark is formed at an arbitrary position of the spindle tip, and a second mark is formed at an arbitrary position of the flange;
A flange mounting step of mounting the flange on the tapered portion of the spindle tip in a state where the positions of the first mark on the spindle tip and the second mark on the flange are aligned;
After the flange mounting step, an end surface correction step of correcting the end surface of the flange;
After removing the flange whose end face has been corrected from the tip of the spindle, the end face is corrected again with the positions of the first mark on the spindle end and the second mark on the flange aligned. And a flange remounting step of mounting the flange on the tapered portion of the spindle tip.

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