JP2013233613A - Method of mounting annular blade - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of mounting an annular blade by which a grinding amount by a perfect circle dressing after re-mounting the annular blade to a rotary spindle can be reduced.SOLUTION: A method of mounting an annular blade is provided for mounting the annular blade (72) having a mounting hole (72b) to a flange (74) which is mounted to a rotary spindle (711) and which includes a boss part (742) having an annular mounting face (743a). The method comprises: an annular blade mounting step of mounting the annular blade to the mounting face while a mark (721) formed on a surface (72a) of the annular blade is directed toward a predetermined direction; a perfect circle dressing step of performing perfect circle dressing in such a manner that an outer periphery of the annular blade becomes a perfect circle having a rotation axis of a rotary spindle as a center; and an annular blade re-mounting step of re-mounting the annular blade onto the mounting face while the mark of the annular blade is directed toward the predetermined direction after removing the annular blade from the mounting face of the flange.

Description

  The present invention relates to a mounting method for mounting an annular blade on a rotating spindle of a cutting apparatus, and more particularly to a mounting method for mounting a circularly dressed annular blade on a rotating spindle again after being removed from the rotating spindle.

  The wafer on which the device is formed on the surface is divided into chips by, for example, a cutting apparatus including a blade unit. The blade unit includes a rotary spindle that transmits the rotational force of the motor, a flange attached to one end of the rotary spindle, and an annular cutting blade (annular blade) attached to the flange. The annular blade is formed of abrasive grains such as diamond and a coupling member that bonds the abrasive grains, and is appropriately selected according to the type of wafer that is a workpiece.

  Since the annular blade is expanded by moisture absorption, the center position of the annular blade attached to the flange may slightly shift from the rotation axis of the rotary spindle. If it does so, an annular blade will shake by rotation of a rotating spindle, and there exists a possibility of producing chipping (chip) to a wafer. In order to prevent such deterioration in processing quality, a round dress is used to grind the annular blade so that the outer peripheral edge of the annular blade becomes a circle centered on the rotation axis after the annular blade is mounted (for example, , See Patent Document 1).

JP 2006-218571 A

  By the way, if the annular blade is removed after being attached to the flange and attached to the flange again, the center position of the outer peripheral edge of the annular blade will be displaced from the rotational axis of the rotary spindle, so that another perfect circular dress is required. However, when a perfect circle dress is performed each time the annular blade is mounted, the life of the annular blade is shortened due to an increase in the amount of grinding by the perfect circle dress. In addition, if the frequency of the perfect circle dress is high, the time required for the perfect circle dress increases, so that the substantial operating time of the cutting apparatus cannot be secured sufficiently.

  The present invention has been made in view of this point, and an object of the present invention is to provide a mounting method of an annular blade capable of reducing the grinding amount by a perfect circle dress after the annular blade is remounted on the rotary spindle.

  The annular blade mounting method of the present invention includes a flange having a boss portion mounted on a rotating spindle and having an annular mounting surface extending in a rotation axis direction of the rotating spindle, and the mounting surface of the boss portion on the mounting surface. An annular blade mounting method for mounting an annular blade having a mounting hole to be engaged, wherein a mark is formed at an arbitrary position on a surface of the annular blade, and the mark of the annular blade is An annular blade mounting step of mounting the annular blade on the mounting surface of the flange in a state oriented in a predetermined direction, and after the annular blade mounting step, the outer periphery of the annular blade is centered on the rotation axis of the rotary spindle A perfect circle dressing process for performing a perfect circle dress so as to be a perfect circle, and performing the perfect circle dressing process to attach the annular blade to the mounting surface of the flange An annular blade remounting step for remounting the annular blade that has been subjected to the perfect circle dressing on the mounting surface of the flange, with the mark of the annular blade oriented in the predetermined direction again It is characterized by comprising.

  According to this configuration, since the circularly dressed annular blade is remounted with the mark directed in a predetermined direction, the mounted state close to the state after being properly circularly dressed is reproduced and re-applied. The grinding amount of the annular blade in the perfect circle dress after mounting can be kept to a minimum. As a result, even if a perfect circle dress is performed each time the annular blade is mounted, it is possible to suppress a decrease in the life of the annular blade and to ensure a sufficient operating time of the cutting device.

  In the mounting method of the annular blade of the present invention, a protrusion is formed at an arbitrary position on the mounting surface of the boss portion of the flange, and the engagement is performed so that the protrusion engages with the annular blade instead of the mark. A groove is formed, and in the annular blade mounting step and the annular blade remounting step, the projection of the flange is positioned in the predetermined direction, and the engagement groove of the annular blade is engaged with the projection. In this state, the annular blade can be mounted or remounted on the mounting surface. According to this configuration, since the flange and the annular blade are engaged with each other by the protrusion, it is possible to easily reproduce the state close to the state of being properly rounded and to grind the annular blade in the round dress after remounting. The amount can be kept to a minimum.

  Further, the mounting method of the annular blade of the present invention is the mounting of the boss portion on a flange having a boss portion mounted on a rotary spindle and having an annular mounting surface extending in the rotation axis direction of the rotary spindle. An annular blade mounting method for mounting an annular blade having a mounting hole engaged with a surface, wherein a mark forming step of forming a mark at an arbitrary position of the annular blade, and after the mark forming step, An annular blade mounting step of mounting the annular blade on the mounting surface of the flange with the mark of the annular blade facing a predetermined direction, and after the annular blade mounting step, an outer periphery of the annular blade is the rotating spindle. A perfect circle dressing process for performing a perfect circle dress so as to be a perfect circle centered on the rotation axis of After the blade is removed from the mounting surface of the flange, the annular blade subjected to the perfect circle dress is again attached to the mounting surface of the flange while the mark of the annular blade is directed in the predetermined direction. And an annular blade remounting step for remounting.

  ADVANTAGE OF THE INVENTION According to this invention, the mounting method of the cyclic | annular blade which can reduce the grinding amount by the second perfect circle dress after remounting a cyclic | annular blade to a rotating spindle can be provided.

FIG. 3 is a perspective view illustrating a configuration of a cutting device used in the mounting method according to the first embodiment. It is a perspective view which shows the structure of the blade unit of a cutting device. 6 is a flowchart showing a flow of a mounting method according to the first embodiment. 6 is a schematic diagram for explaining a mounting method according to Embodiment 1. FIG. FIG. 6 is a perspective view showing a configuration of a blade unit according to Embodiment 2.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. An annular blade mounting method according to an embodiment of the present invention includes an annular blade mounting step in which an annular cutting blade (annular blade) is mounted on a rotary spindle of a cutting apparatus with a mark formed on a surface thereof directed in a predetermined direction. And a round dressing process for grinding the outer periphery of the annular blade so as to be a perfect circle centered on the rotation axis of the rotary spindle, and the removed annular blade is re-applied to the cutting device with the mark directed in a predetermined direction. An annular blade remounting step to be mounted.

  In this attachment method, the annular blade is reattached with the mark directed in a predetermined direction, so that the attachment state close to the state after properly wearing a perfect circle is reproduced, and the perfect circle dress after reattachment is reproduced. The amount of grinding of the annular blade can be kept to a minimum. As a result, even if a perfect circle dress is performed each time the annular blade is mounted, it is possible to suppress a decrease in the life of the annular blade and to ensure a sufficient operating time of the cutting device. Details of the mounting method according to the embodiment of the present invention will be described below.

(Embodiment 1)
With reference to FIG. 1, the structure of the cutting device used for the mounting method of this Embodiment is demonstrated. FIG. 1 is a perspective view showing a configuration of a cutting apparatus 1 used in the mounting method of the present embodiment. FIG. 1 also shows a wafer W to be processed by the cutting apparatus 1. The cutting device used in the mounting method of the present embodiment and the wafer to be processed by the cutting device are not limited to the cutting device 1 and the wafer W shown in FIG.

  As shown in FIG. 1, the wafer W to be processed by the cutting apparatus 1 has a substantially disk-shaped outer shape. The wafer W is supported by an annular frame F via a dicing tape T attached to the back side. The surface of the wafer W is partitioned into a plurality of regions by streets arranged in a lattice pattern, and devices are formed in each partitioned region. The wafer W is cut along each street and divided into individual chips. In addition, the processing target of the cutting apparatus 1 is not limited to a wafer.

  The cutting apparatus 1 has a base 2 having a substantially flat top surface. The base 2 includes a base 21 having a substantially rectangular parallelepiped shape, and a projecting portion 22 projecting forward at some corners. An internal space is formed in the protruding portion 22, and the cassette elevator 3 is provided in the internal space so as to be movable up and down. On the upper surface of the cassette elevator 3, a cassette 31 for storing the wafer W is placed. The cassette 31 includes a plurality of storage portions 32 that store one wafer W at a time in the height direction (Z-axis direction).

  A temporary placement mechanism 4 is provided on the upper surface of the base 21 at a position adjacent to the cassette elevator 3. The temporary placement mechanism 4 includes a drawer portion 41 and a pair of rails 42. The lead-out part 41 is configured to be movable in the first direction (Y-axis direction), and the wafer W positioned at the same height as the lead-out part 41 is pulled out to the rail 42 side by the vertical movement of the cassette elevator 3. The rails 42 have a substantially L-shaped cross-sectional shape, and are configured to be separated from each other in a second direction (X-axis direction) perpendicular to the first direction. The wafer W is pulled out to a predetermined position on the rail 42 by the leading portion 41 and is sandwiched in the second direction by the close proximity of the pair of rails 42. Thereby, the wafer W is aligned in the X-axis direction and the Y-axis direction.

  An opening extending in the X-axis direction is formed at a position adjacent to the temporary placement mechanism 4 of the base portion 21. The opening is covered by the table moving base 5 and the waterproof cover 51. Below the waterproof cover 51, an X-axis moving mechanism (not shown) is provided that can move the table moving base 5 in the X-axis direction. The X-axis movement mechanism includes a pair of guide rails parallel to the X-axis direction, an X-axis ball screw between the guide rails, and an X-axis pulse motor (not shown) that rotationally drives the X-axis ball screw. The table moving base 5 is connected to the X-axis ball screw via a nut portion (not shown), and is moved along the guide rail by the rotation of the X-axis ball screw.

  A chuck table 52 is provided on the table moving base 5. The chuck table 52 is formed in a disk shape, and an adsorption surface 53 made of a porous ceramic material is provided at the center of the upper surface. The wafer W is held at a predetermined position on the chuck table 52 by sucking the wafer W from the back surface side on the suction surface 53. The chuck table 52 is supported by a rotation mechanism (not shown) so as to be rotatable (θ rotation) around the Z axis on the table moving base 5. The wafer W aligned in the X-axis direction and the Y-axis direction by the temporary placement mechanism 4 is transferred to the chuck table 52 by a transfer mechanism (not shown).

  A table base 6 is disposed at a position adjacent to the table moving base 5 in the Y-axis direction. The table base 6 is provided with a Y-axis moving mechanism 61. The Y-axis moving mechanism 61 includes a pair of guide rails 62 parallel to the Y-axis direction, a Y-axis ball screw (not shown) between the guide rails 62, and a Y-axis pulse motor 63 that rotationally drives the Y-axis ball screw. A Y-axis table 64 is supported on the upper surface of the table base 6. The Y-axis table 64 includes a base portion 64a that is in contact with the table base 6 and a wall portion 64b that is erected with respect to the base portion 64a. The Y-axis table 64 is connected to the Y-axis ball screw via a nut portion (not shown) provided in the base portion 64a, and is moved along the guide rail 62 by the rotation of the Y-axis ball screw.

  A Z-axis moving mechanism 65 is provided on the wall portion 64 b of the Y-axis table 64. The Z-axis moving mechanism 65 is disposed on the front surface of the wall portion 64b and is parallel to the Z-axis direction. The Z-axis moving mechanism 65 is connected to the Z-axis ball screw 67 between the guide rails 66 and the Z-axis ball screw 67. A pulse motor 68 is provided. A Z-axis table 69 is supported on the front surface of the wall portion 64b. The Z-axis table 69 includes a base portion 69a that contacts the wall portion 64b, and a wall portion 69b that protrudes forward (Y-axis direction) at the end of the base portion 69a. The Z-axis table 69 is connected to the Z-axis ball screw 67 via a nut portion provided on the base 69a, and is moved along the guide rail 66 by the rotation of the Z-axis ball screw 67.

  The blade unit 7 is supported on the wall 69 b of the Z-axis table 69 at a position above the chuck table 52. The blade unit 7 includes a spindle unit 71 and an annular blade 72 that is detachably attached to one end side of the spindle unit 71. A motor 73 is connected to the other end side of the spindle unit 71 so that an annular blade 72 mounted on one end side of the spindle unit 71 can be rotated. The wafer W is cut by rotating the annular blade 72 and cutting it into the wafer W. The blade unit 7 is provided with an imaging unit 8 adjacent to the annular blade 72.

  A control unit (not shown) of the cutting apparatus 1 controls the X-axis moving mechanism and the Y-axis moving mechanism 61 based on the captured image captured by the imaging unit 8, and the annular blade 72 of the blade unit 8 is moved to the street of the wafer W. Align to. The wafer W aligned with the annular blade 72 is cut by the rotated annular blade 72 while spraying cutting water. The cut wafer W is picked up by a transfer means (not shown) and moved to the cleaning / drying mechanism 9 provided on the upper surface of the base 21.

  The cleaning / drying mechanism 9 includes a spinner table 91 that holds the substrate W in a cylindrical space formed on the base 2. The cleaning / drying mechanism 9 includes a cleaning liquid injection mechanism and a gas injection mechanism (both not shown). A rotation mechanism (not shown) is provided below the spinner table 91. The rotation mechanism has a spinner table motor (not shown) that applies a rotational force to the spinner table 91, and can rotate the spinner table 91 at a predetermined speed. When the substrate W is held on the spinner table 91, the spinner table 91 is rotated in the cylindrical space. In this state, the substrate W is cleaned by spraying the cleaning liquid from the cleaning liquid spray mechanism. The cleaned substrate W is dried by the air ejected from the gas ejection mechanism.

  Next, the blade unit 7 of the cutting apparatus 1 will be described in detail with reference to FIG. FIG. 2 is a perspective view showing the configuration of the blade unit 7 of the cutting apparatus 1. As described above, the blade unit 7 includes the spindle unit 71 and the annular blade 72. The spindle unit 71 includes a rotating spindle (spindle shaft) 711 that constitutes a rotation axis, and a spindle housing 712 that supports the rotating spindle 711.

  The spindle unit 71 is, for example, an air spindle, and supports the rotating spindle 711 in a floating state by an air layer of compressed air. A tip end portion of the rotary spindle 711 protrudes forward from the spindle housing 712 so that a mount flange (flange) 74 to which the annular blade 72 is attached can be attached. A screw hole 711 a is provided at the tip of the rotary spindle 711.

  The mount flange 74 has a flange portion 741 that extends outward in the radial direction and a boss portion 742 that protrudes forward from the flange portion 741. On the back side of the mount flange 74, a fitting hole (not shown) into which the tip of the rotary spindle 711 can be fitted is provided. If the screw 77 is tightened into the screw hole 711 a in a state where the tip end of the rotary spindle 711 is fitted in the fitting hole of the mount flange 74, the mount flange 74 is fixed to the rotary spindle 711.

  The flange portion 741 of the mount flange 74 has an abutting surface 741 a against which the back surface of the annular blade 72 abuts. The boss portion 742 includes a base end portion 743 having a large-diameter columnar shape and a cylindrical portion 744 having a small-diameter cylindrical shape. A mounting surface 743 a to which the annular blade 72 is mounted is provided on the outer periphery of the base end portion 743. The mounting surface 743a is formed to extend in the rotation axis direction of the rotary spindle 711. The mounting surface 743a is formed to have an annular shape when viewed from the direction of the rotation axis of the rotary spindle 711. A screw portion 744 a into which a ring-shaped fixing nut 76 is tightened is provided on the outer periphery of the cylindrical portion 744.

  The annular blade 72 is an annular washer blade in which, for example, abrasive grains made of diamond or the like are bonded together with a bonding material, and has a circular mounting hole 72b fitted into the base end portion 743 at the center. The annular blade 72 is attached to the mount flange 74 by engaging the attachment surface 743a of the base end portion 743 with the attachment hole 72b. A circular mark 721 indicating the mounting direction (mounting position, mounting angle) of the annular blade 72 is formed on the surface 72 a of the annular blade 72. The mark 721 is formed, for example, by applying paint at an arbitrary position on the surface 72a of the annular blade 72.

  The annular blade 72 is formed so that the outer diameter of the annular blade 72 is larger than the outer diameter of the flange portion 741. For this reason, when the annular blade 72 is attached to the mount flange 74, the outer peripheral portion of the annular blade 72 projects outward in the radial direction from the outer peripheral edge of the flange portion 741. The wafer W is cut by rotating the annular blade 72 and bringing the annular blade 72 protruding from the flange portion 741 into contact with the wafer W.

  An annular fixed flange 75 is attached to the cylindrical portion 744 in a state where the annular blade 72 is attached to the mount flange 74. The fixing flange 75 has an engagement hole 75 a corresponding to the cylindrical portion 744. The fixing flange 75 is attached to the cylindrical portion 744 by fitting the cylindrical portion 744 into the engagement hole 75a. When the fixing flange 75 is attached to the cylindrical portion 744, a ring-shaped fixing nut 76 is tightened to the screw portion 744a.

  When the fixing nut 76 is tightened into the screw portion 744a, the fixing flange 75 is pressed in the direction of the mount flange 74. As a result, the annular blade 72 is sandwiched and fixed between the mount flange 74 and the fixed flange 75. That is, the front surface 72a of the annular blade 72 is brought into contact with the rear surface of the fixed flange 75, and the rear surface of the annular blade 72 is brought into contact with the contact surface 741a of the flange portion 741, so that the annular blade 72 is held at a predetermined position. .

  Next, with reference to FIG.3 and FIG.4, the detail of the mounting method of this Embodiment is demonstrated. FIG. 3 is a flowchart showing the flow of the mounting method of the present embodiment. FIG. 4 is a schematic diagram for explaining a mounting method according to the present embodiment.

  First, in the annular blade attaching step (step ST1), the annular blade 72 having the mark 721 formed on the surface 72a is attached to the mount flange 74 so that the mark 721 faces a predetermined direction. That is, the mounting hole 72b of the annular blade 72 is fitted into the base end portion 743 so that the mark 721 is positioned at a predetermined position (predetermined angle). Thereby, the inner periphery of the mounting hole 72b is brought into contact with the mounting surface 743a of the base end portion 743. As shown in FIG. 4A, in the present embodiment, the annular blade 72 is mounted so that the mark 721 faces upward (positioned upward). However, the direction (position, angle) of the mark 721 is not limited to this.

  Thereafter, the fixing flange 75 is attached to the cylindrical portion 744, and the fixing nut 76 is tightened to the screw portion 744a (see FIG. 2). As a result, the annular blade 72 is sandwiched and fixed between the mount flange 74 and the fixed flange 75 with the mark 721 facing upward, and is rotated together with the rotary spindle 711.

  The annular blade 72 is expanded by absorbing moisture in the surrounding atmosphere. For this reason, at the time of mounting on the mount flange 74, the mounting hole 72b of the annular blade 72 may be somewhat larger (about several μm) than at the time of manufacture. In this case, as shown in FIG. 4A, since the inner diameter of the mounting hole 72b is larger than the outer diameter of the base end portion 743, the center position O2 of the annular blade 72 is set to the rotating spindle 711 (in FIG. It shifts downward from the rotation axis O1 (not shown, see FIG. 2).

  When the rotary spindle 711 is rotated in such a state, the annular blade 72 may be vibrated in a direction perpendicular to the rotation axis O1, and the wafer W may be chipped (chipped). Therefore, after the annular blade 72 is mounted, a perfect circle dressing step (step ST2) is performed in which the outer periphery of the annular blade 72 is rounded so that the outer periphery of the annular blade 72 becomes a perfect circle centered on the rotation axis O1. The perfect circle dress is performed by rotating the annular blade 72 and cutting it into the perfect circle dress board. By cutting the round dress board, the outer periphery of the annular blade 72 is ground, and as shown in FIG. 4B, the center position O2 of the annular blade 72 and the rotational axis O1 of the rotary spindle 711 are matched. Thereby, the vibration in the direction orthogonal to the rotation axis O1 of the annular blade 72 is reduced, and the deterioration of the processing quality is suppressed. After the perfect circle dress, the dressing of the annular blade 72 is performed.

  If the annular blade 72 is removed and remounted on the mount flange 74 after the above-described perfect circle dressing process, the center position O2 of the annular blade 72 may be greatly deviated from the rotational axis O1 of the rotary spindle 711. For example, consider a case where the circular blade 72 (see FIG. 4B) dressed in a perfect circle as described above is attached to the mount flange 74 so that the mark 721 faces downward as shown in FIG. 4C. With the annular blade 72 mounted so that the mark 721 faces upward, the center position O2 of the annular blade 72 is moved relatively upward from the state shown in FIG. 4A so as to coincide with the rotational axis O1. It is a perfect circle dress. For this reason, when the annular blade 72 is mounted so that the mark 721 faces downward, the center position O2 of the annular blade 72 is largely shifted downward from the rotation axis O1 of the rotary spindle 711 as shown in FIG. 4C.

  In order to suppress the deterioration of the processing quality due to the deviation, the perfect circle dress as described above may be performed again. However, if the center position O2 greatly deviates from the rotation axis O1, the grinding amount by the perfect circle dress increases. The life of the annular blade 72 is shortened. In particular, if the attachment / detachment frequency of the annular blade 72 is high, the frequency of the perfect circle dress increases accordingly, so that the life of the annular blade 72 is remarkably shortened. Moreover, when the frequency of the perfect circle dress is high, the total time of the perfect circle dress increases, and the substantial operating time of the cutting apparatus 1 is shortened.

  Therefore, in the mounting method of the present embodiment, in the annular blade remounting step (step ST3), the annular blade 72 is mounted so that the mark 721 faces upward (see FIG. 4B). In this way, the mounting state when the perfect circle dress is performed by mounting the annular blade 72 so that the direction (position, angle) of the mark 721 is the same as the blade when the perfect circle dress is performed. A wearing state close to is realized. That is, it is possible to minimize the grinding amount of the annular blade 72 in the perfect circle dressing process after remounting. Or, the perfect circle dressing process after remounting can be omitted.

  As described above, according to the mounting method of the present embodiment, the annular blade 72 is mounted again with the mark 721 facing the predetermined direction, so that the mounted state is close to the state after being properly dressed in a perfect circle. Is reproduced, and the grinding amount of the annular blade 72 in the perfect circle dress after remounting can be minimized. As a result, even if a perfect circle dress is performed each time the annular blade 72 is mounted, it is possible to suppress a decrease in the life of the annular blade 72 and to ensure a sufficient operating time of the cutting apparatus 1.

  In the present embodiment, an example in which the annular blade 72 having the mark 721 formed in advance on the surface 72a is described, but the present invention is not limited to this. For example, an annular blade on which no mark is formed may be used, and a mark forming process for forming a mark may be performed before or after the annular blade mounting process.

(Embodiment 2)
In the present embodiment, a mounting method performed using a blade unit having a configuration different from that of the first embodiment will be described. FIG. 5 is a perspective view showing the configuration of the blade unit 7 of the present embodiment. In FIG. 5, the same components as those in FIG. In FIG. 5, for convenience of explanation, a part of the configuration of the blade unit 7 is omitted.

  In the blade unit 7 of the present embodiment, the base end portion 743 of the mount flange 74 has a protrusion 745 that protrudes radially outward from the mounting surface 743a. Further, the annular blade 72 has an engagement groove 722 that is engaged with the protrusion 745 of the base end portion 743. Since the blade unit 7 is configured such that the protrusion 745 of the mount flange 74 and the engagement groove 722 of the annular blade 72 are engaged, the mounting position of the annular blade 72 with respect to the mount flange 74 is always constant. .

  In the mounting method of the present embodiment, first, in the annular blade mounting step, the annular blade 72 is mounted on the mount flange 74 with the projections 745 facing a predetermined direction. That is, the mounting hole 72b of the annular blade 72 is engaged with the base end portion 743 with the projection 745 positioned at a predetermined position (predetermined angle). After mounting the annular blade 72, a perfect circle dressing process is performed.

  In the annular blade remounting step, the annular blade 72 is remounted on the mount flange 74 with the protrusion 745 facing a predetermined direction. That is, the annular blade 72 is reattached in a state where the direction (position, angle) of the projection 745 of the mount flange 74 is the same as that in the annular blade attachment step. As a result, the influence of gravity applied to the annular blade 72 is equal between the annular blade mounting step and the annular blade remounting step, so that a mounting state close to the mounting state by the annular blade mounting step can be realized by the annular blade remounting step.

  As described above, the blade unit 7 according to the present embodiment is configured such that the protrusion 745 of the mount flange 74 and the engagement groove of the annular blade 72 are engaged with each other. The mounting position is always constant. For this reason, for example, even when an inexperienced operator reattaches the annular blade 72, it is possible to easily reproduce a mounting state close to a properly circularly dressed state, and the subsequent grinding of the annular blade 72 in the perfect circular dress The amount can be kept to a minimum.

  Note that the direction (position, angle) of the protrusion 745 may be controlled in any way. For example, the stop position (stop angle) of the rotary spindle 711 may be controlled by a program so that the directions of the protrusions 745 are always the same in the annular blade mounting step and the annular blade remounting step. Of course, the direction of the protrusion 745 may be manually adjusted.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above embodiment, a circular mark is formed on the surface of the annular blade, but the shape of the mark is not limited to this. For example, various figures such as a triangle, a quadrangle, and an arrow may be formed as a mark. The size of the mark is also arbitrary. Similarly, the shape and size of the protrusion and the engagement groove are not particularly limited.

  Further, the material of the annular blade used in the mounting method of the above embodiment is not particularly limited. As the annular blade, for example, an electroformed blade in which abrasive grains made of diamond or the like are bonded by metal plating such as nickel, a resin blade in which abrasive grains made of diamond or the like are bonded by resin bond, and abrasive grains made of diamond or the like are bonded by metal There are metal blades and the like that are baked and hardened, and any of them may be used.

  In addition, the configurations, methods, and the like according to the above-described embodiments can be changed as appropriate without departing from the scope of the object of the present invention.

  The present invention is useful when a circularly dressed annular blade is removed from a rotating spindle and remounted.

1 Cutting device 7 Blade unit 71 Spindle unit 72 Annular blade 72a Surface 72b Mounting hole 73 Motor 74 Mount flange (flange)
75 Fixing flange 75a Engaging hole 76 Fixing nut 77 Screw 711 Rotating spindle 711a Screw hole 712 Spindle housing 721 Mark 722 Engaging groove 741 Flange part 741a Abutting surface 742 Boss part 743 Base end part 743a Mounting surface 744 Cylindrical part 744a Screw Part 745 Projection O1 Rotation axis O2 Center position

Claims (3)

An annular blade having a mounting hole engaged with the mounting surface of the boss portion on a flange having a boss portion mounted on the rotating spindle and having an annular mounting surface extending in the rotation axis direction of the rotating spindle An annular blade mounting method for mounting
A mark is formed at an arbitrary position on the surface of the annular blade,
An annular blade mounting step of mounting the annular blade on the mounting surface of the flange in a state where the mark of the annular blade is directed in a predetermined direction;
After the annular blade mounting step, a perfect circle dressing step of performing a perfect circle dress so that the outer periphery of the annular blade becomes a perfect circle centered on the rotation axis of the rotary spindle;
After performing the perfect circle dressing step and removing the annular blade from the mounting surface of the flange, the annular blade is subjected to the perfect circle dress again with the mark of the annular blade facing the predetermined direction. And an annular blade remounting step of remounting the flange onto the mounting surface of the flange. The mounting surface of the boss portion of the flange is formed with a protrusion at an arbitrary position, and the annular blade is formed with an engagement groove for engaging the protrusion instead of the mark,
In the annular blade mounting step and the annular blade remounting step, the projection of the flange is positioned in the predetermined direction, and the mounting is performed with the engagement groove of the annular blade engaged with the projection. The mounting method of the annular blade according to claim 1, wherein the annular blade is mounted or remounted on a surface. An annular blade having a mounting hole engaged with the mounting surface of the boss portion on a flange having a boss portion mounted on the rotating spindle and having an annular mounting surface extending in the rotation axis direction of the rotating spindle An annular blade mounting method for mounting
A mark forming step of forming a mark at an arbitrary position of the annular blade;
After the mark forming step, an annular blade mounting step of mounting the annular blade on the mounting surface of the flange in a state where the mark of the annular blade faces a predetermined direction;
After the annular blade mounting step, a perfect circle dressing step of performing a perfect circle dress so that the outer periphery of the annular blade becomes a perfect circle centered on the rotation axis of the rotary spindle;
After performing the perfect circle dressing step and removing the annular blade from the mounting surface of the flange, the annular blade is subjected to the perfect circle dress again with the mark of the annular blade facing the predetermined direction. And an annular blade remounting step of remounting the flange onto the mounting surface of the flange.

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