JP2009083072A - Cutting blade detection mechanism of cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting blade detection mechanism capable of detecting the range of use of the annular cutting edge of a cutting blade without gradually adjusting light emitters and light receiving bodies in the radial direction of the cutting blade. <P>SOLUTION: This cutting blade detection mechanism 5 of a cutting device includes a light emitting means 6 and a light receiving means 7. In the light emitting means 6, a first group of light emitters and a second group of light emitters which are so configured that the light emitting surfaces of a plurality of optical fibers are mutually adjacently arranged in series in the radial direction of the cutting blade 43 are arranged in parallel to each other, and also the plurality of optical fibers composing the first group of light emitters and the plurality of optical fibers composing the second group of light emitters are mutually offset by a part of a radius. In the light receiving means 7, a first group of light receiving bodies and a second group of light receiving bodies which are so configured that the light receiving surfaces of a plurality of optical fibers are mutually adjacently arranged in series in the radial direction of the cutting blade are arranged in parallel to each other, and also the plurality of optical fibers composing the first group of light receiving bodies and the plurality of optical fibers composing the second group of light receiving bodies are mutually offset by the part of the radius. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a cutting blade detection mechanism for detecting the state of a cutting blade provided in a cutting apparatus for cutting a wafer such as a semiconductor wafer.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor chips. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of a sapphire substrate are also divided into individual optical devices such as light emitting diodes and laser diodes by cutting along the streets, and are widely used in electrical equipment. ing.

  Cutting along the streets of the above-described semiconductor wafer, optical device wafer or the like is usually performed by a cutting device called a dicer. This cutting apparatus is provided with a cutting blade detection mechanism for detecting the replacement time of an annular cutting edge of a cutting blade whose diameter has been reduced due to wear, and chipping of the annular cutting edge.

The cutting blade detection mechanism includes a blade intrusion portion into which an annular cutting blade of the cutting blade enters, and a light emitter and a light receiver disposed to face the blade entry portion. In this cutting blade detection mechanism, the light emitted from the light emitter is received by the light receiver, and converted into a voltage corresponding to the amount of light received by the light receiver, so that the blade intrusion portion between the light emitter and the light receiver is inserted. The state of the annular cutting edge of the positioned cutting blade is detected. (For example, see Patent Document 1)
Utility Model Registration No. 51370

  The light emitter and the light receiver are configured by bundling a plurality of thin optical fibers. A light emitter configured by bundling a plurality of such thin optical fibers emits circular light having a diameter of about 1 mm. On the other hand, the annular cutting edge of the cutting blade protrudes 1 to 2 mm, and when it is worn about 50 to 70%, it is time to replace it. However, in order to accurately detect the wear of the annular cutting edge of the cutting blade using a light emitting body that emits circular light, a range of 60% (for example, 0.6 mm) centering on the diameter of the light emitting body and the light receiving body is used. Is used. Therefore, in order to detect the usage range (for example, 0.5 to 1 mm) of the annular cutting edge of the cutting blade, it is necessary to adjust the light emitter and the light receiver in the radial direction of the cutting blade step by step.

  The present invention has been made in view of the above-mentioned fact, and the main technical problem thereof is the use of an annular cutting edge of the cutting blade without adjusting the light emitter and the light receiver in the radial direction of the cutting blade step by step. An object of the present invention is to provide a cutting blade detection mechanism capable of detecting a range.

In order to solve the above-mentioned main technical problem, according to the present invention, one side in the direction of the rotation axis of a cutting blade provided with an annular cutting edge for cutting the workpiece held on the chuck table holding the workpiece. And a light receiving means disposed on the other side in the rotational axis direction of the cutting blade so as to face the light emitting means and receive the light irradiated by the light emitting means. In the cutting blade detection mechanism of
The light emitting means includes a plurality of optical fibers each having a light emitting surface having a circular cross section, and a first light emitter group and a second light emitter group, which are arranged adjacent to each other in series in the radial direction of the cutting blade. And the light emitting surfaces of the plurality of optical fibers constituting the first light emitter group and the light emitting surfaces of the plurality of optical fibers constituting the second light emitter group are offset from each other by a radius,
The light receiving means includes a plurality of optical fibers each having a circular light receiving surface having the same diameter as that of the plurality of optical fibers constituting the light emitting means and arranged adjacent to each other in series in the radial direction of the cutting blade. The first light-receiving group and the second light-receiving group are arranged in parallel, and the light-receiving surfaces of a plurality of optical fibers that form the first light-receiving group and the plurality that form the second light-receiving group. The optical receiving surfaces of the optical fibers are offset from each other by a radius, and the first light receiving group and the second light receiving group are the first light emitting group and the second light emitting group, respectively. Arranged opposite to the
A cutting blade detection mechanism for a cutting apparatus is provided.

  In the cutting blade detection mechanism according to the present invention, the first light-emitting body group and the second light-emitting body group constituting the light-emitting means and the first light-receiving body group and the second light-receiving body group constituting the light-receiving means have cross sections, respectively. A first light emitter group and a second light emitter group in which a plurality of circular optical fibers are arranged adjacent to each other in series in the radial direction of the cutting blade are arranged in parallel, and the first light emitter group is Since the plurality of optical fibers constituting the plurality and the plurality of optical fibers constituting the second light emitter group are arranged offset from each other by a radius, it is possible to detect the usable range of the annular cutting edge of the cutting blade. . Therefore, if the positions of the light emitting means and the light receiving means are adjusted when the cutting blade is replaced, it is not necessary to adjust the positions of the light emitting means and the light receiving means until the annular cutting edge of the cutting blade reaches the use limit. .

  Hereinafter, a preferred embodiment of a cutting blade detection mechanism of a cutting device configured according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a cutting apparatus equipped with a cutting blade detection mechanism constructed according to the present invention. A cutting device 1 shown in FIG. 1 includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 31 is provided with a clamp 33 for fixing an annular frame that supports a wafer, which will be described later, as a workpiece through a dicing tape. The chuck table 3 configured as described above can be moved in a cutting feed direction indicated by an arrow X by a cutting feed means (not shown).

  A cutting apparatus 1 shown in FIG. 1 includes a spindle unit 4 as cutting means. The spindle unit 4 is moved in an index feed direction indicated by an arrow Y in FIG. 1 by an index feed means (not shown), and is moved in a cut feed direction indicated by an arrow Z in FIG. 1 by a notch feed means (not shown). ing. The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in a direction indicated by an arrow Y that is an indexing direction and a direction indicated by an arrow Z that is a cutting direction, and the spindle housing 41 is freely rotatable. And a cutting blade 43 attached to the front end of the rotating spindle 42. For example, as shown in FIG. 2, the cutting blade 43 has a disk-shaped base 431 formed of aluminum, and diamond abrasive grains are hardened by nickel plating on the outer peripheral side surface of the base 431 to a thickness of 15 to 30 μm. It consists of a formed annular cutting edge 432.

  Continuing with reference to FIG. 2, a blade cover 44 covering the upper half of the cutting blade 43 is attached to the front end of the spindle housing 41. The blade cover 44 includes a first cover member 441 mounted on the spindle housing 41 and a second cover member 442 mounted on the first cover member 441 in the illustrated embodiment. A female screw hole 441a and two positioning pins 441b are provided in the side surface of the first cover member 441, and an insertion hole 442a is provided in a position corresponding to the female screw hole 441a in the second cover member 442. It has been. Further, on the surface of the second cover member 442 facing the first cover member 441, two recesses (not shown) into which the two positioning pins 441b are fitted are formed. The first cover member 441 and the second cover member 442 configured in this way are provided with two recesses (not shown) formed in the second cover member 442 provided in the first cover member 441. The positioning is performed by fitting to the positioning pin 441b. Then, the fastening bolt 443 is inserted into the insertion hole 442a of the second cover member 442, and is screwed into the female screw hole 441a provided in the first cover member 441, whereby the second cover member 442 is engaged with the first cover member 442. The cover member 441 is attached.

  Cutting water supply pipes 451 and 452 are disposed on the first cover member 441 and the second cover member 442 constituting the blade cover 44, respectively. Cutting water that is disposed on both sides of the annular cutting edge 432 of the cutting blade 43 and sprays cutting water toward both side surfaces of the annular cutting edge 432 at the lower ends of the cutting water supply pipes 451 and 452. Supply nozzles 461 and 462 are connected. The cutting water supply pipes 451 and 452 are connected to a cutting water supply means (not shown).

  The first cover member 441 constituting the blade cover 44 of the spindle unit 4 in the illustrated embodiment has a cutting blade detection mechanism 5 for detecting wear or chipping of the annular cutting edge 432 of the cutting blade 43. It is arranged. The cutting blade detection mechanism 5 will be described with reference to FIGS. The cutting blade detection mechanism 5 in the illustrated embodiment is provided with an attachment member 52 attached to the first cover member 441 by a fastening bolt 51 and slidable in the vertical direction on the attachment member 52 as shown in FIG. And a light emitting means 6 and a light receiving means 7 disposed opposite to each other at the lower end of the support member 53. As shown in FIG. 3, the mounting member 52 is formed with a guide groove 521 having a groove width corresponding to the thickness of the support member 53 and having a lower opening and a vertical direction. A support member 53 is slidably disposed in the guide groove 521 in the vertical direction.

  The support member 53 is formed in a plate shape having a thickness corresponding to the groove width of the guide groove 521 by a metal material such as stainless steel or aluminum, and an annular cutting edge 432 of the cutting blade 43 enters the lower part thereof. A blade entry recess 531 is formed, and a light emitter attachment portion 532 and a light receiver attachment portion 533 are provided on both sides of the blade entry recess 531. The support member 53 configured in this manner is disposed so as to be slidable in the vertical direction of the guide groove 521 formed in the mounting member 52, and is moved and adjusted in the vertical direction by an adjustment screw 54 mounted on the mounting member 52. It has become so.

  As shown in FIG. 4, the light-emitting means 6 includes a first light-emitting body group 61 and a second light-emitting body that are disposed on the light-emitting body mounting portion 532 of the support member 53 so that the light-emitting surface faces the blade entry recess 531. The group 62 includes a light source 63 that emits light to the first light emitter group 61 and the second light emitter group 62. Each of the first luminous body group 61 and the second luminous body group 62 includes a plurality of optical fibers 60 each having a circular cross section, and a light emitting surface 60a thereof disposed adjacent to each other in series in the radial direction of the cutting blade 43. Yes. Thus, the first light emitter group 61 and the second light emitter group 62 in which the plurality of optical fibers 60 are arranged in series in the radial direction of the cutting blade 43 are arranged adjacent to each other in parallel. The plurality of optical fibers 60 constituting the first light emitter group 61 and the plurality of optical fibers 60 constituting the second light emitter group 62 are arranged adjacent to each other with a radius offset. Accordingly, in the illustrated embodiment, the first light emitter group 61 is located above the second light emitter group 62 in the upper portion in FIG. 4 by the radius of the optical fiber 60. The first light emitter group 61 and the second light emitter group 62 are configured by arranging 8 to 12 optical fibers having a diameter of 0.25 to 0.27 in series in the illustrated embodiment. ing. The first light emitter group 61 and the second light emitter group 62 configured as described above are attached to the light emitter attachment portion 532 of the support member 53 with the end on the light emitting surface 60a side fixed by, for example, an adhesive. . The light source 63 is composed of a light emitting diode (LED), for example, and is controlled by the control means 8.

Next, the light receiving means 7 will be described with reference to FIG.
The light receiving means 7 includes a first light receiving body group 71 and a second light receiving body group 72 which are disposed on the light receiving body mounting portion 533 of the support member 53 with the light receiving surface facing the blade intrusion recess portion 531, and the first light receiving body group 72. And a photoelectric converter 73 for converting the voltage into a voltage corresponding to the amount of light received by the second light receiving group 71 and the second light receiving group 72. The first photoreceptor group 71 and the second photoreceptor group 72 have a plurality of optical fibers 70 each having a circular cross section, and their light receiving surfaces 70a are arranged adjacent to each other in series in the radial direction of the cutting blade 43. Yes. As described above, the first light receiving group 71 and the second light receiving group 72 in which the plurality of optical fibers 70 are arranged in series in the radial direction of the cutting blade 43 are arranged adjacent to each other in parallel. The plurality of optical fibers 70 constituting the first light receiving body group 71 and the plurality of optical fibers 70 constituting the second light receiving body group 72 are arranged adjacent to each other while being offset from each other by a radius. Accordingly, in the illustrated embodiment, the first light receiving group 71 is positioned above the second light receiving group 72 in FIG. 4 by the radius of the optical fiber 70. In the illustrated embodiment, the first light receiving group 71 and the second light receiving group 72 have a diameter of 0.25 as in the first light emitting group 61 and the second light emitting group 62, respectively. 8 to 12 optical fibers of ˜0.27 are arranged in series. The first light receiving group 71 and the second light receiving group 72 configured in this manner are mounted on the light receiving member mounting portion 533 of the support member 53 with the end on the light receiving surface 70a side fixed by, for example, an adhesive, The light receiving surface 70a side is disposed to face the first light emitter group 61 and the second light emitter group 62 of the light emitting means 6, respectively. The photoelectric converter 73 converts the amount of light received by the first light receiver group 71 and the second light receiver group 72 into a voltage value and sends it to the control means 8.

  The first light-emitting body group 61 and the second light-emitting body group 62 that constitute the light-emitting means 6 of the cutting blade detection mechanism 5 configured as described above, and the first light-receiving body group 71 and the second light-emitting means 7 that constitute the light-receiving means 7. The two photoreceptor groups 72 are positioned on both sides of the annular cutting edge 432 of the cutting blade 43 as shown in FIG. Then, as shown in FIG. 4, the uppermost optical fiber 60 of the second light emitter group 62 constituting the light emitting means 6 and the diameter portion of the optical fiber 70 of the second light receiver group 72 constituting the light receiving means 7 are cut. The first light-emitting body group 61, the second light-emitting body group 62, the first light-receiving body group 71, and the second light-receiving are adjusted by the adjusting screw 54 so as to be positioned at the outer peripheral edge of the annular cutting edge 432 of the blade 43. The vertical position of the support member 53 that supports the body group 72 is adjusted. The first light emitter group 61, the second light emitter group 62, the first light receiver group 71, and the second light receiver group 72 positioned in this way are formed in the annular cutting edge 432 of the cutting blade 43. At least the usable range is covered. Therefore, when the cutting blade 43 is replaced, the first light emitter group 61, the second light emitter group 62, the first light receiver group 71, and the second light receiver group 72 are adjusted by the adjusting screw 54 as described above. By adjusting the vertical position of the support member 53 that supports the first light emitter group 61, the second light emitter group 62, and the second light emitter group 62 until the annular cutting edge 432 of the cutting blade 43 reaches the use limit. There is no need to adjust the positions of the first photoreceptor group 71 and the second photoreceptor group 72.

The cutting blade detection mechanism 5 in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
In a state where the cutting blade 43 is rotating, the control unit 8 energizes (ON) the light source 63 of the light emitting unit 6 and the photoelectric converter 73 of the light receiving unit 7. As a result, light is emitted from the first light emitter group 61 and the second light emitter group 62 of the light emitter 6 toward the first light receiver group 71 and the second light receiver group 72 of the light receiver 7. . Then, the light received by the first light receiver group 71 and the second light receiver group 72 is transmitted to the photoelectric converter 73, and the photoelectric converter 73 receives the first light receiver group 71 and the second light receiver group 72. Outputs a voltage signal corresponding to the amount of the received light to the control means 8. The amount of light received by the first photoreceptor group 71 and the second photoreceptor group 72 is small when the annular cutting edge 432 of the cutting blade 43 is not worn, and increases as it wears. Therefore, when cutting is performed by the cutting blade 43, the photoelectric converter 73 outputs a voltage signal as shown in FIG. 5 as time elapses. The control means 8 to which the voltage signal output from the photoelectric converter 73 is input is displayed on the display means described later together with the use limit, and an alarm signal is output when the use limit is reached. Further, when a part of the annular cutting edge 432 of the cutting blade 43 is chipped while being cut by the cutting blade 43, the photoelectric converter 73 is intermittently formed as shown in FIG. A voltage signal having a peak value is output. The control means 8 having received this voltage signal displays it on the display means described later. Thus, by displaying the voltage signal output from the photoelectric converter 73 on the display means described later, the operator has reached the use limit of the annular cutting edge 432 of the cutting blade 43 and the circle of the cutting blade 43. It can be confirmed that a chip has occurred in the annular cutting edge 432.

  Referring back to FIG. 1, the description will be continued. The cutting device 1 captures an image of the surface of the workpiece held on the chuck table 3 and detects an area to be cut by the cutting blade 43. It has. The imaging means 11 is composed of optical means such as a microscope and a CCD camera. Further, the cutting apparatus 1 includes a display unit 12 that displays an image captured by the imaging unit 11, a determination result by the control unit 8, and the like.

  In the cassette mounting area 13a of the apparatus housing 2, a cassette mounting table 13 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 13 is configured to be movable in the vertical direction by lifting means (not shown). On the cassette mounting table 13, a cassette 14 that houses the semiconductor wafer 10 as a workpiece is placed. The semiconductor wafer 10 accommodated in the cassette 14 has a grid-like street formed on the surface, and devices such as ICs and LSIs are formed in a plurality of rectangular regions partitioned by the grid-like street. The semiconductor wafer 10 thus formed is accommodated in the cassette 14 with the back surface adhered to the front surface of the dicing tape T mounted on the annular support frame F.

  Further, the cutting device in the illustrated embodiment is a semiconductor wafer 10 accommodated in a cassette 14 placed on a cassette placement table 13 (a state in which the wafer is supported on an annular frame F via a dicing tape T). The unloading / loading means 16 for unloading the semiconductor wafer 10 to the temporary table 15, the first transport means 17 for transporting the semiconductor wafer 10 unloaded to the temporary table 15 onto the chuck table 3, and cutting on the chuck table 3. A cleaning means 18 for cleaning the semiconductor wafer 10 is provided, and a second transport means 19 for transporting the semiconductor wafer 10 cut on the chuck table 3 to the cleaning means 18 is provided.

Next, a cutting operation for cutting the semiconductor wafer 10 along a predetermined street using the above-described cutting apparatus 1 will be described.
The semiconductor wafer 10 (supported by the annular frame F via the dicing tape T) accommodated in a predetermined position of the cassette 14 placed on the cassette placing table 13 is moved by the lifting means (not shown). The placement table 13 is positioned at the carry-out position by moving up and down. Next, the carry-out / carry-in means 16 moves forward and backward to carry the semiconductor wafer 10 positioned at the carry-out position onto the temporary placement table 15. The semiconductor wafer 10 transported to the temporary placement table 15 is transported onto the chuck table 3 by the turning motion of the first transport means 17.

  When the semiconductor wafer 10 is placed on the chuck table 3, suction means (not shown) is operated to suck and hold the semiconductor wafer 10 on the chuck table 3. An annular frame F that supports the semiconductor wafer 10 via the dicing tape T is fixed by the clamp 33. In this way, the chuck table 3 holding the semiconductor wafer 10 is moved to a position directly below the imaging means 11. When the chuck table 3 is positioned immediately below the image pickup means 11, the street formed on the semiconductor wafer 10 is detected by the image pickup means 11, and the spindle unit 4 is moved and adjusted in the arrow Y direction as the indexing direction to cut the street and cut. A precision alignment operation with the blade 43 is performed.

  Thereafter, the chuck table 3 is moved to a cutting region below the cutting blade 43, the cutting blade 43 is rotated in a predetermined direction, and a predetermined amount is cut and fed in the direction indicated by the arrow Z. Position it at the position where it reaches the dicing tape T. Then, the chuck table 3 holding the semiconductor wafer 10 by suction is moved at a predetermined cutting feed speed in a direction indicated by an arrow X which is a cutting feed direction. As a result, the semiconductor wafer 10 held on the chuck table 3 is cut along a predetermined street by the cutting blade 43 (cutting process). When performing this cutting process, cutting water is sprayed from the cutting water supply nozzle 462 toward the side surface of the cutting blade 43.

  When the semiconductor wafer 10 is cut along a predetermined street as described above, the chuck table 3 is indexed and fed in the direction indicated by the arrow Y in FIG. 1 to perform the above cutting process. When the cutting process is performed along all the streets extending in the predetermined direction of the semiconductor wafer 10, the chuck table 3 is rotated 90 degrees to extend in a direction orthogonal to the predetermined direction of the semiconductor wafer 10. By performing the cutting process along the streets, all the streets formed in a lattice shape on the semiconductor wafer 10 are cut and divided into individual devices. The divided individual devices are not separated by the action of the dicing tape T, and the state of the wafer supported by the annular frame F is maintained.

  As described above, when the cutting process is completed along the street of the semiconductor wafer 10, the chuck table 3 holding the semiconductor wafer 10 is first returned to the position where the semiconductor wafer 10 is sucked and held. Then, the suction holding of the semiconductor wafer 10 is released. Next, the semiconductor wafer 10 is transferred to the cleaning unit 18 by the second transfer unit 19. The semiconductor wafer 10 conveyed to the cleaning means 18 is cleaned here. The semiconductor wafer 10 thus cleaned is transported to the temporary table 15 by the first transport means 17 after drying. Then, the semiconductor wafer 10 is stored in a predetermined position of the cassette 14 by the unloading / loading means 16.

  The cutting blade detection mechanism 5 is also in operation during the above-described cutting process, and the voltage signal output from the photoelectric converter 73 is displayed on the display unit 12 as described above. It can be confirmed that the annular cutting edge 432 is worn or that the annular cutting edge 432 is chipped.

The perspective view of the cutting device equipped with the cutting blade detection mechanism comprised according to this invention in this invention. The principal part perspective view of the spindle unit with which the cutting apparatus shown in FIG. 1 is equipped. Explanatory drawing which shows the relationship between the cutting blade with which the cutting apparatus shown in FIG. 1 is equipped, and the cutting blade detection mechanism comprised according to this invention. The relationship between the first light-receiving body group 71 and the second light-emitting body group of the light-emitting means constituting the cutting blade detection mechanism shown in FIG. 3 and the annular cutting edge of the cutting blade, and the first light-receiving body group and the second light-receiving group. Explanatory drawing which shows the relationship between this photoreceptor group and the annular cutting edge of a cutting blade. FIG. 4 is an explanatory diagram of a voltage signal output by the photoelectric converter constituting the cutting blade detection mechanism shown in FIG. 3 along with wear of the annular cutting edge of the cutting blade. FIG. 4 is an explanatory diagram of a voltage signal output by the photoelectric converter that constitutes the cutting blade detection mechanism shown in FIG.

Explanation of symbols

1: Cutting device 2: Device housing 3: Chuck table 4: Spindle unit 41: Rotating spindle 43: Cutting blade 44: Blade cover 461, 462: Cutting water supply nozzle 5: Cutting blade detection mechanism 52: Mounting member 53: Support member 6: Light emitting means 60: Optical fiber 61: First light emitting body group 62: Second light emitting body group 63: Light source 7: Light receiving means 70: Optical fiber 71: First light receiving body group 72: Second light receiving body group 73 : Photoelectric converter 8: Control means 10: Semiconductor wafer 11: Imaging means 12: Display means 13: Cassette mounting table 14: Cassette 15: Temporary placement table 16: Unloading / loading means 17: First conveying means 18: Cleaning Means 19: Second conveying means

Claims (1)

Luminescent means disposed on one side of the rotation axis direction of the cutting blade having an annular cutting edge for cutting the workpiece held on the chuck table holding the workpiece, and the rotation axis direction of the cutting blade In a cutting blade detection mechanism of a cutting apparatus, comprising: a light receiving means that is disposed on the other side of the light emitting means to face the light emitting means and receives light emitted by the light emitting means;
The light emitting means includes a plurality of optical fibers each having a light emitting surface having a circular cross section, and a first light emitter group and a second light emitter group, which are arranged adjacent to each other in series in the radial direction of the cutting blade. And the light emitting surfaces of the plurality of optical fibers constituting the first light emitter group and the light emitting surfaces of the plurality of optical fibers constituting the second light emitter group are offset from each other by a radius,
The light receiving means includes a plurality of optical fibers each having a circular light receiving surface having the same diameter as that of the plurality of optical fibers constituting the light emitting means and arranged adjacent to each other in series in the radial direction of the cutting blade. The first light-receiving group and the second light-receiving group are arranged in parallel, and the light-receiving surfaces of a plurality of optical fibers that form the first light-receiving group and the plurality that form the second light-receiving group. The optical receiving surfaces of the optical fibers are offset from each other by a radius, and the first light receiving group and the second light receiving group are the first light emitting group and the second light emitting group, respectively. Arranged opposite to the
A cutting blade detection mechanism for a cutting apparatus.

Images