200918271 九、發明說明： 【發明所屬之技術領域】 發明領域 本發明係有關於—種用以檢測裝設於切削半導體晶圓 5等晶圓之切削裝置之切削刀具狀態的切削刀具檢測機構。 【先前技術:j 發明背景 在半導體裝置製程中，以於略呈圓板形之半導體晶圓 表面排列成格子狀，稱為切割道之分割預定線劃分複數個 10區域，於此劃分之區域形成IC、LSI等裝置。藉將半導體晶 圓沿切割道切斷，分割形成有裝置之區域，製造各半導晶 片。又，藉將於基板表面層積氮化鎵系化合物半導體等之 光農置晶圓亦沿切割道切斷，可分別成各發光二極體、雷 射二極體等光學裝置，而廣泛地利用於電器。 15 '上述半導體晶圓或光學裝置晶圓等沿切割道之切斷通 常以稱為切割機(dicer)之切削裝置進行。此切削裝置具有用 以檢測因磨損而直徑減少之切削刀具之環狀切削刀片之更 換時期及環狀切削刀片之缺口的切削刀具檢測機構。 上述切削刀具之檢測機構具有供切削刀具之環狀切削 2〇刀片進入之刀具進入部、與該刀具進入部相對配設之發光 體及受光體。此切削刀具檢測機構係受光體接收發光體發 出之先，轉換成對應於受光體所接收之光之光量的電壓， 藉此，檢測位於發光體與受光體間之刀具進入部之切削刀 具之環狀切削刀片狀態（參照專利文獻[)。 200918271 【專利文獻1】曰本實用新型註冊公報第511370號 【發明内容3 發明揭示 發明欲解決之課題 5 上述發光體及受光體係捆紮複數個細光纖而構成。如 此，捆紮複數個細光纖而構成之發光體發出直徑約1mm之 圓形光。另一方面，切削刀具之環狀切削刀片突出1〜2mm， 當磨損突出之50〜70%左右時，便為更換時間。然而，使用 發出圓形光之發光體，要正確檢測切削刀具之環狀切削刀 10 片之磨損，乃使用以發光體及受光體之直徑為中心，60% (0.6mm)之範圍。因而，要檢測切削刀具之環狀切削刀片之 使用範圍（〇. 5〜1 m m )，需將發光體及受光體階段性地調節成 切削刀具之徑方向。 本發明即是鑑於上述事實而發明者，其主要技術課題 15 在於提供在不將發光體及受光體階段性地調節成切削刀具 之徑方向下，可檢測切削刀具之環狀切削刀片之使用範圍 之切削刀具檢測機構。 用以欲解決課題之手段 為解決上述主要之技術課題，根據本發明，提供一種 20 切削裝置之切削刀具檢測機構，其包含有配設於切削刀具 之旋轉軸方向之一側，且該切削刀具具有用以切削保持於 保持被加工物之夾盤之被加工物之環狀切削刀片的發光機 構；及於切削刀具之旋轉軸方向之另一側與該發光機構相 對配設，且接收以該發光機構照射之光之受光機構。該發 200918271 光機構並列配設有將具截面圓形之發光面之複數光纖分別 於該切削刀具之徑方向相鄰配設成直列之第1發光體群及 第2發光體群，並且構成該第1發光體群之複數光纖之發光 面與構成該第2發光體群之複數光纖之發光面相互偏移一 5 個半徑量而配設。該受光機構並列配設有將具有與構成該 發光機構之複數光纖直徑相同之直徑，且具截面圓形之受 光面之複數光纖分別於該切削刀具之徑方向相鄰配設成直 列之第1受光體群及第2受光體群，構成該第1受光體群之複 數光纖之受光面與構成該第2受光體群之複數光纖之受光 10 面相互偏移一個半徑量而配設，該第1受光體群與該第2受 光體群分別與該第1發光體群及該第2發光體群相對配設。 發明效果 本發明之切削刀具檢測機構由於發光機構並列配設將 具截面圓形之發光面之複數光纖分別於該切削刀具之徑方 15 向相鄰配設成直列之第1發光體群及第2發光體群，並且構 成該第1發光體群之複數光纖之發光面與構成該第2發光體 群之複數光纖之發光面相互偏移一個半徑量而配設，故可 進行切削刀具之圓環狀切削刀片之可使用範圍之檢測。因 而，更換切削刀片之際，當調整發光機構及受光機構之位 20 置時，便不需調整發光機構及受光機構之位置至切削刀具 之圓環狀切削刀片達使用界限。 【實施方式3 用以實施發明之最佳形態 以下，參照附加圖式，就依本發明構成之切削裝置之 200918271 切削刀具檢測機構之較佳實施形態更詳細說明。 第1圖顯示裝設有依本發明構成之切削刀具檢測機構 之切削裝置之立體圖。第1圖所示之切削裝置1具有略呈長 方體狀之裝置殼體2。保持被加工物之夾盤3以可於為切削 5 進給方向之箭號X顯示之方向移動之狀態配設於此裝置殼 體2内。夾盤3具有吸附夾頭支撐台31、配設於該吸附夾頭 支撐台31之吸附夾頭32，藉使圖中未示之吸引機構作動， 將被加工物吸引保持於該吸附夾頭32上面之保持面上。夾 盤3構造成可以圖中未示之旋轉機構旋轉。此外，於夾盤31 10 配設用以固定藉由切割膠帶支撐作為被加工物之晶圓之環 狀框架的夾33。如此構成之夾盤3以圖中未示之切削進給機 構於以箭號X顯示之切削進給方向移動。 第1圖所示之切削裝置1具有作為切削機構之心軸單元 4。心軸單元4以圖中未示之分度進給機構，於第1圖中以箭 15 號Y顯示之分度進給方向移動，同時，以圖中未示之切入進 給機構，於第1圖中以箭號z顯示之切入進給方向移動。此 心轴單元4具有裝設於圖中未示之移動基台，於為分度方 向，且箭號Y顯示之方向及為切入方向，且以箭號Z顯示之 方向移動調整之心軸殼體41、旋轉自如地支撐於該心軸殼 20 體41之旋轉心轴42、裝設於該旋轉心轴42之前端部之切削 刀具43。如第2圖所示，切削刀具43由以鋁形成之圓盤狀基 台431、於該基台431之外周部側面以鍍鎳將鑽石磨粒固 定，厚度形成15〜30μηι之圓環狀切割刀片432。 參照第2圖，繼續說明，於上述心軸殼體41之前端部安 200918271 裝覆蓋切削刀具43之上半部之刀具蓋44。在圖中所示之實 把形悲中’刀具蓋44由裝設於心軸殼體41之第1蓋構件 441、裝β又於a亥苐1蓋構件441之第2蓋構件442構成。於第1 蓋構件441之側面設有陰螺孔4413及2個定位銷糾化，於第2 5蓋構件442，於與上述陰螺孔441a對應之位置設有插通孔 442a。又，於第2盍構件442之與第1蓋構件441相對之面形 成甘欠合上述2個疋位銷441 b之圖中未示之2個凹部。如此構 成之第1蓋構件441與第2蓋構件442藉將形成於第2蓋構件 442之圖中未示之2個凹部嵌合於設置於第1蓋構件441之2 10個定位銷441b而定位。然後，將鎖固螺栓443插通第2蓋構 件442之插通孔442a，與設置於第1蓋構件441之陰螺孔441a 螺合’藉此’將第2蓋構件442裝設於第1蓋構件441。 於構成上述刀具蓋44之第1蓋構件441及第2蓋構件442 配設切削水供給管451、452。於此切削水供給管451、452 15 之下端連接分別配設於切削刀具43之圓環狀切削刀片432 兩側，朝圓環狀切削刀片432之兩側面噴射切削水之切削水 供給噴嘴461、462。此外，上述切削水供給管451、452連 接於圖中未示之切削水供給機構。 於構成圖中所示之實施形態之心軸單元4之刀具蓋44 20 之第1蓋構件441配設用以檢測上述切削刀具43之圓環狀切 削刀具432之磨損或缺口之切削刀具檢測機構5。參照第2圖 至第4圖，就此切削刀具檢測機構5作說明。圖中所示之實 施形態之切削刀具檢測機構5具有以鎖固螺栓51安裝於上 述第1蓋構件441之安裝構件52、如第3圖所示，可於上下方 9 200918271 向滑動地配設於該安襄構件η之支樓構件Μ、相對配設於 /支撐構件53之下端部之發光機構6及受光機構7。如第$圖 所示、，於安裝構件52形成具有對應於上述支擇構件53之厚 度之溝寬，下方開放，於上下方向形成之引導溝52卜支樓 5構件53以可於上下方向滑動之狀態配設於此弓丨導溝切。 上述支樓構件S3以不鑛鋼或紹等金屬材料，形成具有 對應於上述引導溝521之溝寬之厚度之板狀，於其下部形成 供環狀切削刀片432進入之刀具進入凹部53卜於該刀具進 入凹部531之兩侧設置發光體安裝部532及受光體安裝部 ίο 533。如此構成之支樓構件Η以可於形成於安裝構件η之引 導溝521之上下方向滑動之狀態配設，以裝設於安裝構件52 之調整螺絲54於上下方向移動調節。 如第4圖所示，上述發光機構6由使發光面朝向上述刀 具進入凹部531而配設於支撐構件53之發光體安裝部532之 15第1發光體群61及第2發光體群62、使光發射至該第丨發光體 群61及第2發光體群62之光源63構成。第1發光體群61及第2 發光體群62係將載面呈圓形之複數光纖60之發光面60於上 述切削刀具43之徑方向相鄰配設成直列。如此，複數光纖 60於切削刀具43之徑方向配設成直列之第1發光體群61及 20第2發光體群62相鄰ϋ列配設。構成第1發光體群61之複數 光纖60與構成第2發光體群62之複數光纖60相互位移一個 半徑量而相鄰配設。因而’在圖中所示之實施形態中，第1 發光體群61在第4圖中以該光纖60之半徑量位於第2發光體 群62上方。此外，在圖中所示之實施形態中’第1發光體群 200918271 61及第2發光體群62係配設直徑0.25〜0.027之光纖8〜i2條直 列而構成。如此構成之第1發光體群61及第2發光體群62之 發光面60a側之端面以接著劑固定，裝設於支撐構件53之發 光體安裝部532。上述光源63由發光二極體(led)構成，以 5 控制機構8控制。 接著，參照第4圖，就上述受光機構7作說明。 受光機構7由使受光面朝向上述刀具進入凹部κι而配 a又於支擇構件53之受光體安裝部533之第1受光體群71及第 2受光體群72、轉換成對應於以該第丨受光體群71及第2受光 10體群72接收之光之光量之電壓的光電轉換器73構成。第1受 光體群71及弟2受光體群72係截面圓形之複數光纖之受 光面70A於上述切削刀具43之徑方向相鄰配設成直列。如 此，複數光纖70於切削刀具43之徑方向配設成直列之第1受 光體群71及第2受光體群72相鄰並列配設。構成第1受光體 15群71之複數光纖70與構成第2受光體群72之複數光纖70相 互偏移一個半徑量而相鄰配設。因而，在圖中所示之實施 形態中，第1受光體群71在第4圖中以該光纖7〇之半徑量位 於第2受光體群72上方。此外，在圖中所示之實施形態中， 第1文光體群71及第2受光體群72與第1發光體群61及第2發 2〇光體群62同樣地係配設直徑0.25〜〇·〇27之光纖8〜12條直列 而構成。如此構成之第1受光體群71及第2受光體群72之受 光面70a側之端面以接著劑固定，裂設於支撐構件53之受光 體安裝部533 ’受光光面側70a側與上述發光機構6之第丨發 光體群61及第2發光體群62相對配.設。上述光電轉換器73將 200918271 以第1受光體群71及第2受光體群72接收之光之光量轉換成 電壓值，送至控制機構8。 構成如以上構成之切削刀具檢測機構5之發光機構6之 第1發光體群61與第2發光體群62及構成受光機構7之第1受 5 光體群71與第2受光體群72如第3圖所示，定位於切削刀具 43之圓環狀切削刀片432之兩侧。如第4圖所示，以上述調 整螺絲54調整支撐第1發光體群61與第2發光體群62及第1 受光體群71與第2受光體群之支撐構件53之上下方向之位 置，以使構成發光機構6之第2發光體群62之最上端之光纖 10 60與構成受光機構7之第2受光體群72之光纖70之直徑部附 近定位於切削刀具43之圓環狀切削刀片432之外周緣。如此 定位之第1發光體群61與第2發光體群62及第1受光體群71 與第2受光體群72覆蓋切削刀具43之圓環狀切削刀片432之 至少可使用範圍。因而，更換切削刀具43時，如上述，以 15 調整螺絲54調整支撐第1發光體群61與第2發光體群62及第 1受光體群71與第2受光體群72之支撐構件53之上下方向之 位置時，不需調整第1發光體群61與第2發光體群62及第1受 光體群71與第2受光體群72之位置至切削刀具43之圓環狀 切削刀片432達使用限界為止。 20 圖中所示之實施形態之切削刀具檢測機構5如以上構 成，以下，就其作用作說明。 在切削刀具43旋轉之狀態下，控制機構8將發光機構6 之光源63及受光機構7之光電轉換器73賦與勢能(ON)。結 果，光從發光機構6之第1發光體群61及第2發光體群62朝受 12 200918271 光機構7之第^受光體群B及第2受光體群γ2照射。缺後，將 第！受光體群71及第2受光體群72所接收之光傳送至光電轉 換器73，光電轉換器73將對應於第i受光體利及第2受光 體群72所接收之光之光量之電壓信號輸出至控制機構8。第 5 1受光體群71及第2受光體群72接收之光之光量在切削刀具 43之圓環狀切削刀片432未磨損之狀態下少，隨著磨損而增 大因而，以切削刀具43進行切削時，輸入光電轉換器 所輪出之電壓信號之控制機構8與使用界限一同顯示於顯 示機構，同時，於到達使用界限時，輸出警報信號。又， 1〇以切削刀具43進行切削時，切削刀具43之圓環狀切削刀片 432之一部份產生缺口時，如第6圖所示，光電轉換器7間歇 性地輸出具有峰值之電壓信號。輸入有此電壓信號之控制 機構8顯示於後述之顯示機構。如此，藉將光電轉換器π輸 出之電壓信號顯示於後述之顯示機構，作業員可確認切削 15刀具43之圓環狀切削刀片432到達使用界限及切削刀具43 之圓環狀切削刀片432產生缺口。 回至第1圖，繼續說明，切削裝置丨具有拍攝保持於上 述失盤3上之被加工物之表面，檢測應以上述切削刀具切 削之區域之拍攝機構11。此拍攝機構n由顯微鏡或ccd照 20相機等光學機構構成。切削裝置1具有顯示以拍攝機構丨"白 攝之影像及上述控制機構8之判定結果等之顯示機構12。 於上述裝置级體2之£盒載置區域.13a配設載置用以收 容被加工物之匣盒之匣盒載置台13。此匣盒載置台13構造 成可以圖中未示之升降機構於上下方向移動。於匣盒載置 13 200918271 台13上載置收容作為被加工物之半導體晶圓10之匣盒14。 收容於匣盒14之半導體晶圓1 〇於表面形成格子狀切割道， 於以此格子狀切割道劃分之複數個矩形區域形成IC、LSI 等裝置。如此形成之半導體晶圓10以裡面貼附於裝設在環 5 狀支撐架F之切割膠帶表面之狀態收容於匣盒14。 圖中所示之實施形態之切削裝置具有將收容於載置在 ®盒載置台13上之匣盒14之半導體晶圓1〇(藉由切割膠帶 支擇於環狀框架F之狀態）搬出至暫時置放台15之搬出搬入 機構16、將搬出至暫時置放台15之半導體晶圓10搬送至上 10 述夾盤3上之第1搬送機構17、用以洗淨在夾盤3上業經切削 加工之半導體晶圓之洗淨機構18、將在夾盤3業經切削加 工之半導體晶圓搬送至洗淨機構18之第2搬送機構19。 接著，就使用上述切削裝置1，沿預定切割道切斷半導 體晶圓10之切削作業作說明。 15 收容於載置在匣盒載置台13之匣盒14之預定位置之半 導體晶圓10(藉由切割膠帶Τ支撐於環狀框架F之狀態）藉匣 盒栽置台13以圖中未示之升降機構上下移動，定位於搬出 裝置。接著，搬出搬入機構16進退作動，將定位於搬出位 置之半導體晶圓10搬出至暫時置放台15。將搬出至暫時置 放σ 15之半導體晶圓10以第1搬送機構17之旋轉動作搬送 至上述夾盤3上。 當將半導體晶圓10載置於夾盤3上後，圖中未示之吸引 機構作動，將半導體晶圓10吸引保持至夹盤3上。又，藉由 切割膠帶Τ支撐半導體晶圓1〇支撐之環狀框架1；以上述夾33 14 200918271 固定。如此進行保持有半導體晶圓10之夹盤3料至拍 構11之正下方。當將失盤3定位於拍攝機構11之正下方 以拍攝機構11檢測形成於半導體晶圓1()之蝴道，將心 單元4於為分度方向之箭號γ方向移動調節，進行切^ 5切削刀具43之精密對位作業。 。、與BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting tool detecting mechanism for detecting a state of a cutting tool mounted on a cutting device for cutting a wafer such as a semiconductor wafer 5. [Prior Art: In the semiconductor device manufacturing process, the surface of the semiconductor wafer having a substantially circular plate shape is arranged in a lattice shape, and a predetermined dividing line called a dicing street is divided into a plurality of 10 regions, and the divided regions are formed. IC, LSI and other devices. The semiconductor wafer is cut along the dicing street, and the region where the device is formed is divided to manufacture each semiconductive wafer. In addition, a wafer for arranging a gallium nitride-based compound semiconductor or the like on the surface of the substrate is also cut along the scribe line, and can be separately formed into optical devices such as light-emitting diodes and laser diodes. Used in electrical appliances. 15' The cutting of the above-mentioned semiconductor wafer or optical device wafer or the like along the dicing street is usually performed by a cutting device called a dicer. The cutting device has a cutting tool detecting mechanism for detecting a replacement timing of the annular cutting insert of the cutting tool whose diameter is reduced by abrasion and a notch of the annular cutting insert. The detecting means for the cutting tool includes a cutter for entering the ring-shaped cutting of the cutting tool, and a light-emitting body and a light-receiving body disposed to face the tool entering portion. The cutting tool detecting mechanism converts the voltage corresponding to the amount of light received by the light receiving body before the light receiving body emits the light, thereby detecting the ring of the cutting tool located in the tool entering portion between the light emitting body and the light receiving body. Cutting blade state (refer to Patent Document [). [Patent Document 1] Japanese Laid-Open Patent Publication No. 511370. SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION The light-emitting body and the light-receiving system are bundled with a plurality of thin optical fibers. Thus, the illuminating body formed by bundling a plurality of thin optical fibers emits circular light having a diameter of about 1 mm. On the other hand, the annular cutting insert of the cutting tool protrudes by 1 to 2 mm, and when the wear is about 50 to 70%, the replacement time is obtained. However, in the case of using an illuminator that emits circular light, it is necessary to correctly detect the wear of the annular cutter 10 pieces of the cutting tool, and the range of 60% (0.6 mm) centering on the diameter of the illuminant and the light receiving body is used. Therefore, to detect the range of use of the annular cutting insert of the cutting tool (〇. 5~1 m m ), the illuminant and the light receiving body should be adjusted stepwise to the radial direction of the cutting tool. The present invention has been made in view of the above-described circumstances, and the main technical object of the invention is to provide a range of use of an annular cutting insert capable of detecting a cutting tool without gradually adjusting the illuminant and the light receiving body in the radial direction of the cutting tool. Cutting tool detection mechanism. Means for Solving the Problem In order to solve the above-mentioned main technical problems, according to the present invention, a cutting tool detecting mechanism for a 20-cutting device includes one side disposed in a direction of a rotating shaft of a cutting tool, and the cutting tool is provided An illuminating mechanism having an annular cutting insert for cutting a workpiece held by a chuck holding the workpiece; and the other side of the cutting tool in the direction of the rotation axis is disposed opposite to the illuminating mechanism, and is received by the illuminating mechanism a light receiving mechanism that illuminates the light by the illuminating mechanism. And the first light-emitting body group and the second light-emitting body group in which the plurality of optical fibers having the circular light-emitting surface are arranged adjacent to each other in the radial direction of the cutting tool, and the second light-emitting body group is arranged in parallel The light-emitting surface of the plurality of optical fibers of the first illuminant group and the light-emitting surface of the plurality of optical fibers constituting the second illuminant group are offset from each other by a radius of five. The light-receiving means is arranged in parallel with the plurality of optical fibers having the same diameter as the plurality of optical fibers constituting the light-emitting means and having a light-receiving surface having a circular cross section, which are arranged adjacent to each other in the radial direction of the cutting tool. The light-receiving body group and the second light-receiving body group are disposed such that the light-receiving surface of the plurality of optical fibers constituting the first light-receiving body group and the light-receiving surface 10 of the plurality of optical fibers constituting the second light-receiving body group are offset by one radial amount. The photoreceptor group and the second photoreceptor group are disposed to face the first illuminant group and the second illuminant group, respectively. Advantageous Effects of Invention According to the cutting tool detecting mechanism of the present invention, the plurality of optical fibers each having a circular light emitting surface are arranged in parallel in the radial direction of the cutting tool, and the first luminous body group and the first The illuminant group is arranged such that the light-emitting surface of the plurality of optical fibers constituting the first illuminant group and the light-emitting surface of the plurality of optical fibers constituting the second illuminant group are offset by one radius, thereby enabling the cutting tool to be rounded The detection of the usable range of the annular cutting insert. Therefore, when the cutting insert is replaced, when the position of the light-emitting mechanism and the light-receiving mechanism is adjusted, it is not necessary to adjust the position of the light-emitting mechanism and the light-receiving mechanism to the limit of use of the annular cutting insert of the cutting tool. [Embodiment 3] BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a preferred embodiment of a cutting tool detecting mechanism of a cutting apparatus according to the present invention will be described in more detail with reference to the additional drawings. Fig. 1 is a perspective view showing a cutting device equipped with a cutting tool detecting mechanism constructed in accordance with the present invention. The cutting device 1 shown in Fig. 1 has a device housing 2 having a substantially rectangular parallelepiped shape. The chuck 3 for holding the workpiece is disposed in the casing 2 in a state in which it can be moved in the direction indicated by the arrow X of the cutting feed direction. The chuck 3 has an adsorption chuck support table 31 and an adsorption chuck 32 disposed on the adsorption chuck support table 31. The suction mechanism is not shown, and the workpiece is sucked and held by the suction chuck 32. The upper surface is maintained. The chuck 3 is configured to be rotatable by a rotating mechanism not shown. Further, a clip 33 for fixing a ring-shaped frame which supports a wafer as a workpiece by a dicing tape is disposed on the chuck 31 10 . The chuck 3 thus constructed is moved by a cutting feed mechanism (not shown) in the cutting feed direction indicated by an arrow X. The cutting device 1 shown in Fig. 1 has a spindle unit 4 as a cutting mechanism. The spindle unit 4 is moved by the indexing feed mechanism (not shown), and is moved in the indexing feed direction indicated by arrow No. 15 in FIG. 1 at the same time, and is cut into the feeding mechanism, not shown. In the figure, it is moved in the feed direction indicated by the arrow z. The mandrel unit 4 has a moving base that is mounted on a moving base, not shown, in the direction of the indexing, and the direction indicated by the arrow Y is the cutting direction, and is adjusted in the direction indicated by the arrow Z. The body 41 is rotatably supported by the rotating mandrel 42 of the mandrel housing 20 and the cutting tool 43 attached to the front end of the rotating mandrel 42. As shown in Fig. 2, the cutting tool 43 is made of a disk-shaped base 431 made of aluminum, and the diamond abrasive grains are fixed by nickel plating on the outer peripheral side surface of the base 431, and the thickness is formed into an annular shape of 15 to 30 μm. Blade 432. Referring to Fig. 2, the description will be continued. The tool cover 44 covering the upper half of the cutting tool 43 is attached to the front end portion of the mandrel housing 41. The tool cover 44 is composed of a first cover member 441 attached to the spindle housing 41, and a second cover member 442 having a β cover member 441. The female screw hole 4413 and the two positioning pins are provided on the side surface of the first cover member 441, and the second cover member 442 is provided with an insertion hole 442a at a position corresponding to the female screw hole 441a. Further, in the surface of the second weir member 442 facing the first cover member 441, two recesses not shown in the figure are formed in a manner that is less than the two clamp pins 441b. The first cover member 441 and the second cover member 442 are formed by fitting two recesses (not shown) formed in the second cover member 442 to the locating pins 441b provided in the first cover member 441. Positioning. Then, the locking bolt 443 is inserted into the insertion hole 442a of the second cover member 442, and is screwed into the female screw hole 441a provided in the first cover member 441. Thus, the second cover member 442 is attached to the first cover member 442. Cover member 441. The cutting water supply pipes 451 and 452 are disposed in the first cover member 441 and the second cover member 442 that constitute the cutter cover 44. The lower end of the cutting water supply pipes 451 and 452 15 are connected to both sides of the annular cutting insert 432 of the cutting tool 43, and the cutting water supply nozzle 461 for cutting water is sprayed toward both sides of the annular cutting insert 432. 462. Further, the above-described cutting water supply pipes 451 and 452 are connected to a cutting water supply mechanism (not shown). The first cover member 441 of the cutter cover 44 20 constituting the spindle unit 4 of the embodiment shown in the drawing is provided with a cutting tool detecting mechanism for detecting wear or a notch of the annular cutting tool 432 of the cutting tool 43. 5. The cutting tool detecting mechanism 5 will be described with reference to Figs. 2 to 4 . The cutting tool detecting mechanism 5 of the embodiment shown in the figure has a mounting member 52 attached to the first cover member 441 by a locking bolt 51, and as shown in Fig. 3, is slidably disposed at the upper and lower sides 9 200918271 The branch member 于 of the ampoule member η, and the light-emitting mechanism 6 and the light-receiving mechanism 7 disposed opposite to the lower end portion of the support member 53. As shown in Fig. $, the mounting member 52 is formed with a groove width corresponding to the thickness of the above-mentioned supporting member 53, and the lower side is opened, and the guiding groove 52 formed in the vertical direction is slidable in the up and down direction. The state is arranged in this bow and guide groove. The above-mentioned branch member S3 is formed into a plate shape having a thickness corresponding to the groove width of the guide groove 521 by a metal material such as non-mineral steel or the like, and a cutter entering the concave portion 53 for forming the annular cutting blade 432 is formed at a lower portion thereof. The illuminator mounting portion 532 and the light receiver mounting portion ί 533 are provided on both sides of the cutter entering the concave portion 531. The branch member constituting the above-described structure is disposed in a state of being slidable in the downward direction of the guide groove 521 formed in the attachment member η, and the adjustment screw 54 attached to the attachment member 52 is moved and adjusted in the vertical direction. As shown in FIG. 4, the light-emitting means 6 is disposed in the first illuminant group 61 and the second illuminant group 62 of the illuminant mounting portion 532 of the support member 53 so that the light-emitting surface faces the cutter entering the concave portion 531. The light source 63 that emits light to the second illuminant group 61 and the second illuminant group 62 is configured. The first illuminant group 61 and the second illuminant group 62 are arranged in a line in the radial direction of the cutting tool 43 in which the light-emitting surface 60 of the plurality of optical fibers 60 having a circular circular shape is arranged in series. In this manner, the plurality of optical fibers 60 are arranged in a line in the radial direction of the cutting tool 43, and the second illuminant group 61 and the second illuminant group 62 are arranged adjacent to each other. The plurality of optical fibers 60 constituting the first illuminant group 61 and the plurality of optical fibers 60 constituting the second illuminant group 62 are displaced by a radial amount and arranged adjacent to each other. Therefore, in the embodiment shown in the drawing, the first illuminant group 61 is located above the second illuminant group 62 with the radius of the optical fiber 60 in Fig. 4 . Further, in the embodiment shown in the drawing, the first illuminant group 200918271 61 and the second illuminant group 62 are arranged in a line in which optical fibers 8 to i2 having a diameter of 0.25 to 0.027 are arranged in series. The end faces on the light-emitting surface 60a side of the first illuminant group 61 and the second illuminant group 62 thus configured are fixed by an adhesive and attached to the light-emitting body mounting portion 532 of the support member 53. The light source 63 is composed of a light emitting diode (LED) and is controlled by a control unit 8. Next, the light receiving means 7 will be described with reference to Fig. 4. The light-receiving mechanism 7 converts the first light-receiving body group 71 and the second light-receiving body group 72, which are disposed in the light-receiving body attaching portion 533 of the supporting member 53, with the light-receiving surface facing the tool into the concave portion κ, and is converted to correspond to the first The photoelectric converter 73 that controls the voltage of the amount of light received by the light receiving group 71 and the second light receiving unit group 72 is formed. The light-receiving surface 70A of the plurality of optical fibers in which the first light-receiving group 71 and the second light-receiving group 72 are circular in cross section are arranged adjacent to each other in the radial direction of the cutting tool 43. As a result, the first optical fiber group 71 and the second light receiving body group 72, which are arranged in the radial direction of the cutting tool 43, are arranged adjacent to each other in parallel. The plurality of optical fibers 70 constituting the first light-receiving body 15 group 71 and the plurality of optical fibers 70 constituting the second light-receiving body group 72 are offset from each other by one radial amount. Therefore, in the embodiment shown in the drawing, the first light-receiving body group 71 is positioned above the second light-receiving body group 72 by the radius of the optical fiber 7〇 in Fig. 4 . Further, in the embodiment shown in the drawing, the first group of the light body group 71 and the second light-receiving body group 72 are provided with a diameter of 0.25 in the same manner as the first group of the second group of the phosphors 61 and the second group of the second group of the phosphors 62. ~ 〇 · 〇 27 of the optical fiber 8 ~ 12 inline and composed. The end faces on the light-receiving surface 70a side of the first light-receiving body group 71 and the second light-receiving body group 72 are fixed by an adhesive, and are disposed on the light-receiving surface side 70a side of the support member 53 and the above-mentioned light-emitting surface side 70a. The illuminant group 61 and the second illuminant group 62 of the mechanism 6 are arranged to face each other. The photoelectric converter 73 converts the amount of light received by the first light-receiving body group 71 and the second light-receiving body group 72 into a voltage value in 200918271, and sends it to the control unit 8. The first luminous body group 61 and the second luminous body group 62 of the light-emitting mechanism 6 of the cutting tool detecting mechanism 5 configured as described above, and the first light-receiving body group 71 and the second light-receiving body group 72 constituting the light-receiving mechanism 7 are as As shown in Fig. 3, it is positioned on both sides of the annular cutting insert 432 of the cutting tool 43. As shown in FIG. 4, the position of the support member 53 supporting the first illuminant group 61 and the second illuminant group 62, and the first photoreceptor group 71 and the second photoreceptor group is adjusted in the vertical direction by the adjustment screw 54. The annular cutting insert positioned on the cutting tool 43 in the vicinity of the diameter portion of the optical fiber 10 60 constituting the uppermost end of the second luminous body group 62 of the light-emitting mechanism 6 and the optical fiber 70 constituting the second light-receiving body group 72 of the light-receiving mechanism 7 432 outside the perimeter. The first illuminant group 61 and the second illuminant group 62 and the first illuminant group 71 and the second photoreceptor group 72 thus positioned cover at least the usable range of the annular cutting insert 432 of the cutting tool 43. Therefore, when the cutting tool 43 is replaced, the first illuminant group 61 and the second illuminant group 62, and the support members 53 of the first light receiver group 71 and the second light receiver group 72 are adjusted by the 15 adjusting screws 54 as described above. When the position is in the up-and-down direction, it is not necessary to adjust the positions of the first illuminant group 61 and the second illuminant group 62, and the first and second photoreceptor groups 71 and 72 to the annular cutting blade 432 of the cutting tool 43. Use the limit. The cutting tool detecting mechanism 5 of the embodiment shown in the drawings is constructed as above, and the operation thereof will be described below. In a state where the cutting tool 43 is rotated, the control unit 8 applies the potential energy (ON) to the light source 63 of the light-emitting mechanism 6 and the photoelectric converter 73 of the light-receiving mechanism 7. As a result, the light is irradiated from the first illuminant group 61 and the second illuminant group 62 of the light-emitting means 6 toward the second light-receiving body group B and the second light-receiving body group γ2 of the optical mechanism 7 of the 12, 2009, 271. After the absence, will be the first! The light received by the light-receiving group 71 and the second light-receiving group 72 is transmitted to the photoelectric converter 73, and the photoelectric converter 73 corresponds to the voltage signal of the light amount of the light received by the ith light-receiving body and the second light-receiving body group 72. Output to the control mechanism 8. The amount of light received by the fifth light-receiving body group 71 and the second light-receiving body group 72 is small in a state where the annular cutting blade 432 of the cutting tool 43 is not worn, and is increased by wear, and thus is performed by the cutting tool 43. At the time of cutting, the control means 8 for inputting the voltage signal rotated by the photoelectric converter is displayed on the display means together with the use limit, and at the same time, when the limit of use is reached, an alarm signal is output. Further, when one of the annular cutting inserts 432 of the cutting tool 43 is notched when cutting by the cutting tool 43, as shown in Fig. 6, the photoelectric converter 7 intermittently outputs a voltage signal having a peak value. . The control unit 8 that inputs this voltage signal is displayed on a display mechanism to be described later. As described above, by displaying the voltage signal output from the photoelectric converter π in a display mechanism to be described later, the operator can confirm that the annular cutting insert 432 of the cutting tool 14 reaches the use limit and the annular cutting insert 432 of the cutting tool 43 is notched. . Returning to Fig. 1, the cutting device 丨 continues to have a photographing mechanism 11 that detects the surface of the workpiece held on the above-described lost disc 3 and detects the area to be cut by the cutting tool. This photographing mechanism n is constituted by an optical mechanism such as a microscope or a ccd camera. The cutting device 1 has a display mechanism 12 that displays an image of the photographing mechanism, a white image, a determination result of the above-described control unit 8, and the like. A cassette mounting table 13 on which a cassette for receiving a workpiece is placed is disposed in the cassette mounting area .13a of the apparatus body 2 described above. The cassette mounting table 13 is constructed to be movable in the up and down direction by a lifting mechanism not shown. The cassette 13 is mounted on the stage 13 of the semiconductor wafer 10 as a workpiece. The semiconductor wafer 1 accommodated in the cassette 14 forms a lattice-shaped dicing street on the surface thereof, and forms a device such as an IC or an LSI in a plurality of rectangular regions divided by the lattice-shaped dicing streets. The semiconductor wafer 10 thus formed is housed in the cassette 14 in a state of being attached to the surface of the dicing tape attached to the ring-shaped support frame F. The cutting device of the embodiment shown in the drawing has a semiconductor wafer 1 (which is in a state of being cut by the dicing tape to the annular frame F) carried out by the cassette 14 placed on the cassette mounting table 13 The loading/unloading mechanism 16 of the temporary placement table 15 transports the semiconductor wafer 10 carried out to the temporary placement table 15 to the first transfer mechanism 17 of the upper chuck 3, and is cleaned on the chuck 3 for cutting. The processed semiconductor wafer cleaning mechanism 18 transports the semiconductor wafer that has been subjected to the cutting process in the chuck 3 to the second transfer mechanism 19 of the cleaning mechanism 18. Next, a cutting operation for cutting the semiconductor wafer 10 along a predetermined dicing line using the above-described cutting device 1 will be described. 15 The semiconductor wafer 10 (the state supported by the dicing tape Τ in the annular frame F) is placed in a predetermined position of the cassette 14 placed on the cassette mounting table 13 by the cassette arranging table 13 (not shown) The lifting mechanism moves up and down and is positioned at the unloading device. Then, the carry-in/out mechanism 16 moves forward and backward, and the semiconductor wafer 10 positioned at the carry-out position is carried out to the temporary placement table 15. The semiconductor wafer 10 that has been carried out to the temporary placement σ 15 is transferred to the chuck 3 by the rotation operation of the first transfer mechanism 17. When the semiconductor wafer 10 is placed on the chuck 3, a suction mechanism (not shown) is actuated to attract and hold the semiconductor wafer 10 to the chuck 3. Further, the annular frame 1 supported by the semiconductor wafer 1 is supported by a dicing tape ;; and is fixed by the above-mentioned clip 33 14 200918271. Thus, the chuck 3 holding the semiconductor wafer 10 is directly under the frame 11. When the lost disc 3 is positioned directly below the photographing mechanism 11 and the photographing mechanism 11 detects the butterfly formed on the semiconductor wafer 1 (), the core unit 4 is moved and adjusted in the direction of the arrow γ in the indexing direction, and is cut. 5 Precision alignment of the cutting tool 43. . ,versus
之後，將夾盤3移動至切削刀具43下方之切削加工 域，使切削刀具43於預定方向旋轉，同時，於箭歌顯示: 方向切入進給預定量，切削刀具43之最下端定位於到達士 割膠帶τ之位置。然後，將韻保料半導體晶圓1〇之^ 10 3以狀之切削進給速度於切削進給方向以箭號X 方向移動。結果，保持於夾盤3上之半導體晶圓10以切削刀 具43沿預定切割道切斷(切削步驟）。執行此切削步驟時，從 切削水供給噴嘴462朝切削刀具43之側面喷射切削水。 如以上進行’將半導體晶圓1〇沿預定切割道切斷後， 15使夹盤3於第！圖中箭號丫顯示之方向以切割道之間隔分度 進給，執行上述切削步驟。沿於半導體晶圓1〇之預定方向 延伸之所有切割道執行切削步驟後，使夹盤3〇旋轉9〇度， 沿於與半導體晶圓10之預定方向垂直相交之方向延伸之切 割道執行切肖，丨步驟’藉此’切舰半導體晶_成格子狀 20之所有切割道，分割成各裝置。此外，所分割之各裝置肉 切割膠帶T之作用而不致散落’可維持切於環狀框架p 晶圓之狀態。 如上述，沿半導體晶圓10之切割道，切削步驟結束後’ 保持有半導體晶圓10之夾盤3返回最初吸引保持半導體晶 15 200918271 圓10之位置。然後，解除半導體晶圓10之吸引保持。接著， 將半導體晶圓10以第2搬送機構19搬送至洗淨機構18。搬送 至洗淨機構18之半導體晶圓在此洗淨。如此進行而洗淨之 半導體晶圓10於乾燥後，以第1搬送機構17搬送至暫時置放 5 台15。將半導體晶圓10以搬出搬入機構16收納於匣盒14之 預定位置。 執行上述切削步驟時，上述切削刀具檢測機構5亦作 動，如上述，藉將光電轉換器73輸出之電壓信號顯示於顯 示機構12，可確認切削刀具4 3之圓環狀切削刀片4 3 2之磨損 10 狀況及圓環狀切削刀片432缺口之產生。 L圖式簡單說明3 第1圖係裝設有依本發明構成之切削刀具檢測機構之 切削裝置之立體圖。 第2圖係裝設於第1圖所示之切削裝置之心軸單元之主 15 要部份立體圖。 第3圖係顯示裝設於第1圖所示之切削裝置之切削刀片 與依本發明構成之切削刀具檢測機構之關係之說明圖。 第4圖係顯示構成第3圖所示之切削刀具檢測機構之發 光機構之第1發光體群及第2發光體群與切削刀具之圓環狀 20 切削刀片之關係以及第1受光體群及第2受光體群與切削刀 具之圓環狀切削刀片之關係的說明圖。 第5圖係構成第3圖所示之切削刀具檢測機構之光電轉 換器隨切削刀具之圓環狀切削刀片之磨損而輸出之電壓信 號之說明圖。 16 200918271 第6圖係顯示構成第3圖所示之切削刀具檢測機構之光 電轉換器隨切削刀具之圓環狀切削刀片產生之缺口而輸出 之電壓信號之說明圖。 【主要元件符號說明】 1...切削裝置 32...吸附夾頭 2...裝置殼體 41...心轴殼體 3...夾盤 42...旋轉心轴 4...心軸單元 43...切削刀具 5...切削刀具檢測機構 44...刀具蓋 6...發光機構 51...鎖固螺栓 7...受光機構 52...安裝構件 8...控制機構 53...支撐構件 10…半導體晶圓 54...調整螺絲 11...拍攝機構 60…光纖 12…顯示機構 60a...發光面 13...匣盒載置台 61...第1發光體群 13a...匣盒載置區域 62...第2發光體群 14...匣盒 63...光源 15...暫時置放台 70...光纖 16...搬出搬入機構 _70a...受光面 17...第1搬送機構 71...第1受光體群 18...洗淨機構 72...第2受光體群 19...第2搬送機構 73...光電轉換器 31...吸附夾頭支撐台 431...基台 17 200918271 432.. 441.. 441a. 441b. 442.. 442a. 451.. 452.. 461.. 切削刀片 462...切削水供給喷嘴 第1蓋構件 531...刀具進入凹部 ..陰螺孔 532...發光體安裝部 ..定位銷 533...受光體安裝部 第2蓋構件 F...環狀框架 ..插通孔 T...切削膠帶 切削水供給管 X...方向 切削水供給管 Y...方向 切削水供給喷嘴 Z...方向 18Thereafter, the chuck 3 is moved to the cutting field below the cutting tool 43, so that the cutting tool 43 is rotated in a predetermined direction, and at the same time, the arrow song shows: the direction is cut into the feed predetermined amount, and the lowermost end of the cutting tool 43 is positioned at the arrival Cut the position of the tape τ. Then, the cutting feed rate of the semiconductor wafer is moved in the direction of the arrow X in the cutting feed direction. As a result, the semiconductor wafer 10 held on the chuck 3 is cut by the cutting tool 43 along a predetermined scribe line (cutting step). When this cutting step is performed, cutting water is sprayed from the cutting water supply nozzle 462 toward the side of the cutting tool 43. As described above, after the semiconductor wafer 1 is cut along a predetermined scribe line, 15 the chuck 3 is placed at the first! In the figure, the direction indicated by the arrow 丫 is indexed at the interval of the scribe line, and the above cutting step is performed. After performing the cutting step along all of the dicing streets extending in the predetermined direction of the semiconductor wafer, the chuck 3 is rotated by 9 degrees, and the cutting is performed along the scribe line extending in a direction perpendicular to the predetermined direction of the semiconductor wafer 10. Xiao, 丨 step "by this" cut the semiconductor crystal _ into the grid 20 of all the cutting lanes, divided into devices. Further, each of the divided pieces of the meat cutting tape T does not scatter "to maintain the state of cutting into the annular frame p wafer. As described above, along the dicing street of the semiconductor wafer 10, after the cutting step is completed, the chuck 3 holding the semiconductor wafer 10 is returned to the position where the semiconductor wafer 15 200918271 is initially attracted. Then, the attraction holding of the semiconductor wafer 10 is released. Next, the semiconductor wafer 10 is transferred to the cleaning mechanism 18 by the second transfer mechanism 19. The semiconductor wafer transferred to the cleaning mechanism 18 is washed here. After the semiconductor wafer 10 thus cleaned is dried, the first transfer mechanism 17 is transported to temporarily place five units 15. The semiconductor wafer 10 is housed in a predetermined position of the cassette 14 by the carry-in/out mechanism 16. When the cutting step is performed, the cutting tool detecting mechanism 5 is also actuated. As described above, by displaying the voltage signal output from the photoelectric converter 73 on the display mechanism 12, the annular cutting insert of the cutting tool 43 can be confirmed. Wear 10 condition and generation of a notch of the annular cutting insert 432. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a cutting device equipped with a cutting tool detecting mechanism constructed in accordance with the present invention. Fig. 2 is a partial perspective view of the main part of the spindle unit of the cutting device shown in Fig. 1. Fig. 3 is an explanatory view showing the relationship between the cutting insert mounted on the cutting apparatus shown in Fig. 1 and the cutting tool detecting mechanism constructed in accordance with the present invention. Fig. 4 is a view showing the relationship between the first illuminant group and the second illuminant group constituting the illuminating mechanism of the cutting tool detecting mechanism shown in Fig. 3, and the annular 20 cutting insert of the cutting tool, and the first light receiving group and An explanatory view of the relationship between the second light-receiving body group and the annular cutting insert of the cutting tool. Fig. 5 is an explanatory view showing a voltage signal which is outputted by the photoelectric converter of the cutting tool detecting mechanism shown in Fig. 3 with the wear of the annular cutting insert of the cutting tool. 16 200918271 Fig. 6 is an explanatory view showing a voltage signal outputted by the photoelectric converter constituting the cutting tool detecting mechanism shown in Fig. 3 with a notch generated by the annular cutting insert of the cutting tool. [Description of main component symbols] 1...Cutting device 32...Adsorption chuck 2...Device housing 41...X-axis housing 3...Chuck 42...Rotating spindle 4... Mandrel unit 43...Cutting tool 5...Cutting tool detecting mechanism 44...Tool cover 6...Lighting mechanism 51...Locking bolt 7...Receiving mechanism 52...Mounting member 8 Control mechanism 53 ... support member 10 ... semiconductor wafer 54 ... adjustment screw 11 ... imaging mechanism 60 ... optical fiber 12 ... display mechanism 60 a ... light-emitting surface 13 ... cassette mounting table 61 ...the first luminous body group 13a...the cassette mounting area 62...the second luminous body group 14...the cassette 63...the light source 15...the temporary placement table 70...the optical fiber 16... carry-out mechanism _70a... light-receiving surface 17... first transport mechanism 71... first light-receiving body group 18... washing mechanism 72... second light-receiving body group 19: The second transport mechanism 73...the photoelectric converter 31...the chuck holder support table 431...the base station 17 200918271 432.. 441.. 441a. 441b. 442.. 442a. 451.. 452.. 461. Cutting blade 462... Cutting water supply nozzle First cover member 531... Tool entering concave portion.. Female screw hole 532... Luminaire mounting portion: Positioning pin 533... Body mounting portion 2nd cover member F...annular frame.. insertion hole T...cutting tape cutting water supply pipe X...direction cutting water supply pipe Y...direction cutting water supply nozzle Z.. . Direction 18