JP2014154629A5 - - Google Patents
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- Publication number
- JP2014154629A5 JP2014154629A5 JP2013021328A JP2013021328A JP2014154629A5 JP 2014154629 A5 JP2014154629 A5 JP 2014154629A5 JP 2013021328 A JP2013021328 A JP 2013021328A JP 2013021328 A JP2013021328 A JP 2013021328A JP 2014154629 A5 JP2014154629 A5 JP 2014154629A5
- Authority
- JP
- Japan
- Prior art keywords
- translucent
- optical
- semiconductor
- optical element
- optical member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 claims description 55
- 239000004065 semiconductor Substances 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 3
- 241001648319 Toronia toru Species 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013021328A JP6104624B2 (ja) | 2013-02-06 | 2013-02-06 | 半導体デバイスの製造方法および半導体デバイス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013021328A JP6104624B2 (ja) | 2013-02-06 | 2013-02-06 | 半導体デバイスの製造方法および半導体デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014154629A JP2014154629A (ja) | 2014-08-25 |
| JP2014154629A5 true JP2014154629A5 (cg-RX-API-DMAC10.html) | 2016-06-02 |
| JP6104624B2 JP6104624B2 (ja) | 2017-03-29 |
Family
ID=51576218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013021328A Active JP6104624B2 (ja) | 2013-02-06 | 2013-02-06 | 半導体デバイスの製造方法および半導体デバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6104624B2 (cg-RX-API-DMAC10.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2017208724A1 (ja) * | 2016-05-30 | 2019-03-22 | ミツミ電機株式会社 | 光学モジュール、モジュール及びその製造方法 |
| CN107482089A (zh) * | 2017-08-08 | 2017-12-15 | 湘能华磊光电股份有限公司 | 一种高亮度led芯片及其制备方法 |
| JP7410782B2 (ja) * | 2020-04-03 | 2024-01-10 | 京セラ株式会社 | 電磁波検出装置および検出モジュール |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002198470A (ja) * | 2000-12-05 | 2002-07-12 | Greatek Electronics Inc | Icパッケージング構造 |
| JP4720629B2 (ja) * | 2006-06-07 | 2011-07-13 | 株式会社デンソー | 回転センサ装置 |
| JP2009049290A (ja) * | 2007-08-22 | 2009-03-05 | Fujifilm Corp | 撮像装置及びその製造方法 |
| JP5017472B1 (ja) * | 2011-03-16 | 2012-09-05 | 株式会社東芝 | 電子機器 |
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2013
- 2013-02-06 JP JP2013021328A patent/JP6104624B2/ja active Active