JP2014153483A - Display device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display device and an electronic apparatus, capable of suppressing the occurrence of defective sealing.SOLUTION: The display device comprises: a TFT substrate 161; a counter substrate 162 arranged opposite to the TFT substrate 161; a liquid crystal 164 interposed between the TFT substrate 161 and the counter substrate 162; and a light-blocking layer 200 formed on a main surface of the counter substrate 162. The TFT substrate 161 and the counter substrate 162 each include through holes H penetrating therethrough. The light-blocking layer 200 is a region having a light-blocking material on the main surface, and surrounds a light-blocking material non-forming region containing no light-blocking material, on an inner wall of the light-blocking material. The inner wall of the light-blocking material is located outside the holes of the counter substrate 162.

Description

  The present technology relates to a display device including a liquid crystal. The present technology also relates to an electronic device including a display device including a liquid crystal.

  In recent years, in display devices provided in electronic devices such as watches and vehicle meters, an analog display means having a pointer rotated by a drive means via a rotating shaft and a liquid crystal panel are provided from the viewpoint of improving a sense of quality. A combination of liquid crystal display means is employed. In such a display device, a through hole is formed in the liquid crystal panel, and the rotation shaft is passed through the through hole.

  In Patent Document 1, a first substrate, a second substrate disposed to face the first substrate, and a liquid crystal are disposed between the first substrate and the second substrate. A first seal member; and a second seal member disposed in a region surrounded by the first seal member, wherein the first substrate, the second substrate, and the second seal member The liquid crystal panel provided with the through-hole which penetrates is described. According to the technique described in Patent Document 1, it is possible to suppress damage during manufacture or use.

JP 2010-139657 A

  Patent Document 1 describes that a through hole is formed by a drill, a laser, or the like. However, when forming a through hole with a drill, it is necessary to first drill a hole smaller than the diameter of the desired through hole with a small diameter drill, and then increase the small hole to a through hole with the desired diameter with a large diameter drill. Therefore, there are many processes, the manufacturing cost increases, and the manufacturing time becomes long. Further, when the through hole is formed by a drill, fine particles are generated, which may affect the manufacturing quality.

  Further, when the through hole is formed by a laser, the vicinity of the laser irradiation is heated, and the sealing member for sealing the liquid crystal is deteriorated by the influence of heat, which may cause a sealing failure of the liquid crystal. In this regard, Patent Document 1 does not consider this point.

  The present technology has been made in view of such a problem, and an object of the present technology is to provide a display device capable of suppressing a sealing failure and an electronic apparatus including the display device.

  A display device according to the present disclosure is inserted between a first substrate, a second substrate disposed to face the first substrate, and the first substrate and the second substrate. A liquid crystal and a light shielding layer disposed on a first surface of the second substrate on the first substrate side, and a through-hole penetrating the first substrate and the second substrate is formed. The light-shielding layer is a region having a light-shielding material on the first surface, and an inner wall of the light-shielding material surrounds a light-shielding material non-formation region without the light-shielding material, and the inner wall is formed on the second substrate. Outside the through hole.

  An electronic apparatus according to the present disclosure includes the display device and a control device that supplies an input signal to the display device.

  In the display device and the electronic apparatus according to the present disclosure, sealing failure can be suppressed.

  According to the display device and the electronic apparatus according to the present disclosure, it is possible to suppress deterioration of the seal member that seals the liquid crystal due to the influence of heat by suppressing heating in the vicinity of the laser irradiation. Thereby, sealing failure can be suppressed.

FIG. 1 is a block diagram illustrating a system configuration example of a display device according to the present embodiment. FIG. 2 is a circuit diagram showing a drive circuit for driving the pixels of the display device according to the present embodiment. FIG. 3 is a schematic configuration diagram of the meter unit according to the present embodiment. FIG. 4 is a diagram schematically showing a cross section of a liquid crystal panel portion of the liquid crystal display device provided in the meter unit shown in FIG. FIG. 5 is a plan view of a liquid crystal panel provided in the liquid crystal display device shown in FIG. 6 is a cross-sectional view of the liquid crystal panel shown in FIG. FIG. 7A is a cross-sectional view of the vicinity of the through hole of the liquid crystal panel. FIG. 7-2 is a plan view of the vicinity of the through hole of the counter substrate of FIG. FIG. 7C is a bottom view of the vicinity of the through hole of the counter substrate in FIG. FIG. 8 is a plan view of the vicinity of the through hole of the liquid crystal panel. FIG. 9 is a cross-sectional view of a portion where a through hole of the bonded substrate is to be formed. FIG. 10 is a cross-sectional view illustrating a state in which a counter substrate of a bonded substrate is irradiated with laser light. FIG. 11 is a cross-sectional view showing the positional relationship among the laser oscillator, the counter substrate, and the black matrix.

A mode (embodiment) for carrying out the present disclosure will be described in detail with reference to the drawings. The present disclosure is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the constituent elements described below can be appropriately combined. The description will be given in the following order.
<1. Configuration of display device>
<1-1. Example of system configuration of display device>
<2. Application example (electronic equipment)>
<2-1. Configuration of electronic equipment>
Example in which display device according to above-described embodiment is applied to electronic device <2-2. Manufacturing method of liquid crystal panel>
<3. Configuration of the present disclosure>

<1. Configuration of display device>
FIG. 1 is a block diagram illustrating a system configuration example of a display device according to the present embodiment. The display device 1 corresponds to a specific example of “display device” of the present disclosure.

  The display device 1 is a transmissive or transflective liquid crystal display device, and includes a display panel 2 and a driver IC 3. A flexible printed circuit (FPC) (not shown) transmits an external signal to the driver IC 3 or driving power for driving the driver IC 3. The display panel 2 includes a translucent insulating substrate, for example, a glass substrate 11, a display area portion 21 that is provided on the surface of the glass substrate 11, and includes a large number of pixels including liquid crystal cells arranged in a matrix (matrix), and a horizontal A driver (horizontal drive circuit) 23 and a vertical driver (vertical drive circuit) 22 are provided. The glass substrate 11 includes a first substrate on which a large number of pixel circuits including active elements (for example, transistors) are arranged and formed in a matrix, and a second substrate that is arranged to face the first substrate with a predetermined gap. And the substrate. The gap between the first substrate and the second substrate is held at a predetermined gap by photo spacers arranged and formed at various locations on the first substrate. Then, liquid crystal is sealed between the first substrate and the second substrate.

<1-1. Example of system configuration of display device>
The display panel 2 includes a display area unit 21, a driver IC 3 having functions of an interface (I / F) and a timing generator, a vertical driver 22, and a horizontal driver 23 on a glass substrate 11.

The display area unit 21 has a matrix (matrix) structure in which pixels Vpix including a liquid crystal layer are arranged in M rows × N columns that constitute one pixel on the display. In this specification, a row refers to a pixel row having N pixels Vpix arranged in one direction. A column refers to a pixel column having M pixels Vpix arranged in a direction orthogonal to the direction in which rows are arranged. The values of M and N are determined according to the vertical display resolution and the horizontal display resolution. In the display area unit 21, scanning lines 24 ₁ , 24 ₂ , 24 ₃ ... 24 _M are wired for each row with respect to the arrangement of M rows and N columns of the pixels Vpix, and the signal lines 25 ₁ , 25 ₂ for each column. , 25 ₃ ... 25 _N are wired. Hereinafter, in the present embodiment, the scanning lines 24 ₁ , 24 ₂ , 24 ₃ ... 24 _M are represented as the scanning lines 24 and the signal lines 25 ₁ , 25 ₂ , 25 _{3. N} may be represented as a signal line 25. Further, in the present embodiment, arbitrary _three scanning lines of the scanning lines 24 ₁ , 24 ₂ , 24 ₃ ... 24 _M are scanned lines 24 _m , 24 _{m + 1} , 24 _{m + 2} (where m is m ≦ M −2), and any _three signal lines 25 ₁ , 25 ₂ , 25 ₃ ... 25 _N are signal lines 25 _n , 25 _{n + 1} , 25 _{n + 2} (where n Is a natural number satisfying n ≦ N−2.

  A master clock, a horizontal synchronization signal, and a vertical synchronization signal, which are external signals, are input to the display device 1 from the outside, and are supplied to the driver IC 3. The driver IC 3 converts the level of the master clock, horizontal synchronization signal, and vertical synchronization signal of the voltage amplitude of the external power source into the voltage amplitude of the internal power source necessary for driving the liquid crystal, and generates the master clock, horizontal synchronization signal, and vertical synchronization signal. To do. The driver IC 3 supplies the generated master clock, horizontal synchronization signal, and vertical synchronization signal to the vertical driver 22 and the horizontal driver 23, respectively. The driver IC 3 generates a common potential (counter electrode potential) VCOM that is commonly applied to each pixel with respect to the drive electrode for each pixel Vpix, and supplies the common potential to the display area unit 21.

The vertical driver 22 sequentially samples and latches display data output from the driver IC 3 in one horizontal period in synchronization with the vertical clock pulse. The vertical driver 22 sequentially outputs the latched digital data for one line as a vertical scanning pulse, and applies the pixel Vpix to the scanning lines 24 _m , 24 _{m + 1} , 24 _{m + 2.} Select sequentially with. The vertical driver 22 is, for example, digitally sequentially from the upper side of the display area 21 of the scanning lines 24 _m , 24 _{m + 1} , 24 _{m + 2.} Output data. Further, the vertical driver 22 digitally sequentially scans the scanning lines 24 _m , 24 _{m + 1} , 24 _{m + 2} ... From the lower side of the display area 21, the lower side of the vertical scanning, the upper side of the display area unit 21, and the upper side of the vertical scanning. Data can also be output.

  For example, 6-bit R (red), G (green), and B (blue) digital video data Vsig is supplied to the horizontal driver 23. The horizontal driver 23 writes display data via the signal line 25 to each pixel Vpix in the row selected by the vertical scanning by the vertical driver 22 for each pixel, for every plurality of pixels, or for all the pixels at once. .

  In the display device 1, there is a possibility that the specific resistance (resistance value specific to the substance) of the liquid crystal may be deteriorated by continuously applying the DC voltage having the same polarity to the liquid crystal element. The display device 1 employs a driving method in which the polarity of the video signal is inverted at a predetermined cycle with reference to the common potential of the driving signal in order to prevent deterioration of the specific resistance (substance specific to the substance) of the liquid crystal.

  As driving methods for this liquid crystal display panel, driving methods such as line inversion, dot inversion, and frame inversion are known. Line inversion is a driving method in which the polarity of a video signal is inverted at a time period of 1H (H is a horizontal period) corresponding to one line (one pixel row). The dot inversion is a driving method in which the polarity of the video signal is alternately inverted for each of the upper, lower, left and right adjacent pixels. Frame inversion is a driving method that inverts video signals to be written to all pixels for each frame corresponding to one screen at the same polarity. The display device 1 can employ any of the above driving methods.

FIG. 2 is a circuit diagram showing a drive circuit for driving the pixels of the display device of this embodiment. The display area 21 includes signal lines 25 _n , 25 _{n + 1} , 25 _{n + 2} for supplying pixel signals as display data to thin film transistor (TFT) elements Tr of each pixel Vpix, and scanning lines for driving the TFT elements Tr. _{Wirings such} as 24 _m , 24 _{m + 1} , and 24 _{m + 2} are formed. The signal lines 25 _n , 25 _{n + 1} , 25 _{n + 2} extend in a plane parallel to the surface of the glass substrate 11 described above. The pixel Vpix includes a TFT element Tr and a liquid crystal LC. The TFT element Tr is composed of a thin film transistor. In this example, the TFT element Tr is composed of an n-channel MOS (Metal Oxide Semiconductor) TFT. One of the source or drain of the TFT element Tr is connected to the signal lines 25 _n , 25 _{n + 1} , 25 _{n + 2} , the gate is connected to the scanning lines 24 _m , 24 _{m + 1} , 24 _{m + 2,} and the other of the source or drain is a pixel (not shown). Connected to the electrode. The liquid crystal LC is aligned in the direction along the electric field by the electric field generated by the pixel electrode and the common electrode VCOM.

The pixel Vpix is connected to other pixels Vpix belonging to the same row of the display area unit 21 by scanning lines 24 _m , 24 _{m + 1} , and 24 _{m + 2} . The scanning lines 24 _m , 24 _{m + 1} , and 24 _{m + 2} are connected to the vertical driver 22, and a vertical scanning pulse Vgate of a scanning signal is supplied from the vertical driver 22. The pixel Vpix is connected to other pixels Vpix belonging to the same column of the display area unit 21 by signal lines 25 _n , 25 _{n + 1} , and 25 _{n + 2} . The signal lines 25 _n , 25 _{n + 1} , 25 _{n + 2} are connected to the horizontal driver 23, and pixel signals are supplied from the horizontal driver 23. The common electrode VCOM is connected to the driver IC 3 in FIG. 1, and a drive signal is supplied from the driver IC 3.

The vertical driver 22 shown in FIG. 1 applies a vertical scanning pulse to the gate of the TFT element Tr of the pixel Vpix via the scanning lines 24 _m , 24 _{m + 1} and 24 _{m + 2} shown in FIG. One row (one horizontal line) of the pixels Vpix formed in a matrix is sequentially selected as a display drive target. The horizontal driver 23 shown in FIG. 1 supplies the pixel signal to each pixel Vpix including one horizontal line sequentially selected by the vertical driver 22 via the signal lines 25 _n , 25 _{n + 1} , and 25 _{n + 2} shown in FIG. To do. In these pixels Vpix, the supplied pixel signal is held in the pixel Vpix during the selection period, and the period other than the selection period is also displayed until the next frame.

As described above, in the display device 1, one horizontal line is sequentially selected by driving the vertical driver 22 to sequentially scan the scanning lines 24 _m , 24 _{m + 1} , and 24 _{m + 2} . In the display device 1, the horizontal driver 23 supplies a pixel signal to the pixels Vpix belonging to one horizontal line, so that display is performed for each horizontal line.

  The display area unit 21 has a color filter. The color filter includes a lattice-shaped black matrix 76a and an opening 76b corresponding to the pixel Vpix. The opening 76b includes, for example, a color region colored in three colors of red (R), green (G), and blue (B). The color filter may be a combination of other colors as long as it is colored in a different color. Generally, in the color filter, the luminance of the green (G) color region is higher than the luminance of the red (R) color region and the blue (B) color region. The color filter may be omitted, and in this case, it becomes white. Alternatively, the color filter may be white by using a light transmissive resin.

The black matrix 76a is formed so as to cover the outer periphery of the pixel Vpix as shown in FIG. That is, the black matrix 76a has a lattice shape by being arranged at the boundary between the two-dimensionally arranged pixels Vpix and the pixels Vpix. Thereby, it is possible to prevent light from leaking from the gaps between the pixels Vpix, and to suppress a reduction in contrast. The black matrix 76a is formed of a material having a high light absorption rate, for example, metal chromium (Cr), chromium oxide (CrO ₂ ), resin, or the like. Thus, the black matrix 76a is a light shielding layer that suppresses light transmission. The opening 76b is an opening formed in the lattice shape of the black matrix 76a, and is arranged corresponding to the pixel Vpix.

  The opening 76b includes, for example, a color region colored in three colors of red (R), green (G), and blue (B). The color filter periodically arranges color regions of color filters colored in, for example, three colors of red (R), green (G), and blue (B) in the opening 76b, and each pixel Vpix shown in FIG. Are regularly associated with three color regions of R, G, and B.

  The display area 21 is arranged in a region where the scanning lines 24 and the signal lines 25 overlap with the black matrix 76a of the color filter when viewed from the direction orthogonal to the front. That is, the scanning line 24 and the signal line 25 are hidden behind the black matrix 76a when viewed from the direction orthogonal to the front. Further, in the display area portion 21, a region where the black matrix 76a is not disposed becomes an opening 76b.

<2. Application example>
Next, a case where the display device according to the present embodiment is applied to a meter unit disposed in an automobile instrument panel will be described as an example.

<2-1. Configuration of electronic equipment>
FIG. 3 is a schematic configuration diagram of the meter unit according to the present embodiment. FIG. 4 is a diagram schematically showing a cross section of a liquid crystal panel portion of the liquid crystal display device provided in the meter unit shown in FIG. A meter unit (electronic device) 100 shown in FIG. 3 includes a plurality of liquid crystal display devices 110 such as a fuel gauge, a water temperature gauge, a speedometer, and a tachometer. The plurality of liquid crystal display devices 110 are all covered with a single exterior panel 120.

  As shown in FIG. 4, each liquid crystal display device 110 has a configuration in which a display device 130 as a liquid crystal display means and a movement mechanism 150 as an analog display means are combined with each other. As shown in FIG. 4, the display device 130 includes a liquid crystal panel 160, a backlight 180 provided on the back side of the liquid crystal panel 160, and a frame 190 that houses the liquid crystal panel 160 and the backlight 180. In the present embodiment, liquid crystal panel 160 is configured as a liquid crystal panel using TFT elements as drive elements.

  FIG. 5 is a plan view of a liquid crystal panel provided in the liquid crystal display device shown in FIG. 6 is a cross-sectional view of the liquid crystal panel shown in FIG. As shown in FIGS. 5 and 6, the liquid crystal panel 160 includes a TFT substrate (first substrate) 161 and a counter substrate (second substrate) 162. A liquid crystal region 165 in which the liquid crystal 164 is sealed is formed between the TFT substrate 161 and the counter substrate 162.

  A TFT element, a pixel electrode, a common electrode, an alignment film, etc. (not shown) are provided on the main surface 161a of the TFT substrate 161 so as to be laminated. A polarizing plate 163 is disposed on the back surface 161 b of the TFT substrate 161. Further, the TFT substrate 161 is provided with a driving IC 171 for driving liquid crystal and a flexible printed circuit (FPC) 172. On the main surface 162a of the counter substrate 162, a color filter, an alignment film, and the like (not shown) are provided so as to be laminated. A polarizing plate 163 is disposed on the back surface 162 b of the counter substrate 162.

  A main seal 166 for sealing the liquid crystal 164 is formed between the TFT substrate 161 and the counter substrate 162 on either the main surface 161 a of the TFT substrate 161 or the main surface 162 a of the counter substrate 162. . Furthermore, a through-hole seal 169 that seals the liquid crystal 164 is formed between the TFT substrate 161 and the counter substrate 162 on either the main surface 161 a of the TFT substrate 161 or the main surface 162 a of the counter substrate 162. Yes.

  The liquid crystal panel 160 has a structure in which the TFT substrate 161 and the counter substrate 162 are bonded together with the main surface 161a and the main surface 162a facing each other. In the liquid crystal panel 160, a liquid crystal region 165 is formed by a main seal 166 serving as a first seal member sealing the liquid crystal 164 between the TFT substrate 161 and the counter substrate 162. In the liquid crystal panel 160, a through-hole seal 169 that is a second seal member is formed in the liquid crystal region 165.

  Here, as shown in FIGS. 4 to 6, the liquid crystal panel 160 is provided with a through hole H penetrating from the TFT substrate 161 to the counter substrate 162. The through hole H is provided so as to penetrate through the through hole seal 169. The through hole H is formed such that the diameter of the inner wall 167 of the hole of the TFT substrate 161 and the diameter of the inner wall 168 of the hole of the counter substrate 162 are smaller than the inner diameter of the through hole seal 169.

  As a result, as shown in FIG. 6, the liquid crystal panel 160 has a structure in which the through-hole seal 169 supports the periphery of the through-hole H in each of the inner wall 167 of the hole of the TFT substrate 161 and the inner wall 168 of the hole of the counter substrate 162. It has become.

  Referring to FIG. 4 again, the backlight 180 has a structure in which a prism sheet 181, a diffusion plate 182, a light source unit 183, and a reflection plate 184 are laminated. The backlight 180 is disposed on the back side of the liquid crystal panel 160 and irradiates the display area of the liquid crystal panel 160 with light. The backlight 180 is provided with a backlight through hole 186. Here, each of the prism sheet 181, the diffusion plate 182, the light source unit 183, and the reflection plate 184 is provided with a through hole 186 a in advance. The prism sheet 181, the diffusion plate 182, the light source unit 183, and the reflection plate 184 are combined with each other so as to be stacked, so that the through holes provided in the prism sheet 181, the diffusion plate 182, the light source unit 183, and the reflection plate 184, respectively. As a result, the backlight through hole 186 is formed. As described above, by providing the through holes 186a in advance in each of the prism sheet 181, the diffusion plate 182, the light source means 183, and the reflection plate 184, it is possible to suppress an increase in man-hours when assembling the backlight 180. It becomes possible.

  In the present embodiment, the light source means 183 includes an LED 183a as a light source and a light guide plate 183b that guides light emitted from the LED 183a.

  As shown in FIG. 4, the frame 190 has an outer peripheral wall 191 and is formed in a cylindrical shape whose front surface is open. A through hole 190 a is provided on the bottom surface of the frame 190. The display device 130 is formed by housing the liquid crystal panel 160 and the backlight 180 in the outer peripheral wall 191 of the frame 190. In the display device 130, the through hole H of the liquid crystal panel 160, the backlight through hole 186 of the backlight 180, and the through hole 190a of the frame 190 are continuous.

  As shown in FIG. 4, the movement mechanism 150 includes a motor 151 as a driving unit and a pointer 153 that is rotated by a motor 151 via a rotation shaft 152.

  The liquid crystal display device 110 is formed by combining the display device 130 and the movement mechanism 150 with each other. The motor 151 of the movement mechanism 150 is disposed on the back side of the frame 190 that houses the liquid crystal panel 160 and the backlight 180. Then, the rotation shaft 152 of the movement mechanism 150 is inserted into the through hole H of the liquid crystal panel 160, the backlight through hole 186 of the backlight 180, and the through hole 190a of the frame 190. Thereby, the pointer 153 of the movement mechanism 150 is disposed on the display surface side of the liquid crystal panel 160. As shown in FIG. 3, in the liquid crystal display device 110, scale display, warning display, and the like can be displayed on the display surface of the liquid crystal panel 160, and the pointer 153 of the movement mechanism 150 is displayed on the display surface side of the liquid crystal panel 160. Can be rotated.

  As described above, in the liquid crystal display device 110, the rotation shaft 152 of the movement mechanism 150 is inserted into the through hole H of the liquid crystal panel 160. Here, as described above, the liquid crystal panel 160 has a structure in which the through hole seal 169 supports the periphery of the inner wall 167 of the hole of the TFT substrate 161 and the inner wall 168 of the hole of the counter substrate 162.

  In addition, the liquid crystal display device 110 includes a backlight 180 provided on the back side of the liquid crystal panel 160. The motor 151 of the movement mechanism 150 is disposed on the back side of the backlight 180, and the rotating shaft 152 of the movement mechanism 150 is inserted into the backlight through hole 186 that penetrates the backlight 180. Therefore, according to the liquid crystal display device 110, a display device can be realized with a simple configuration.

FIG. 7A is a cross-sectional view of the vicinity of the through hole of the liquid crystal panel. FIG. 7-2 is a plan view of a portion in the vicinity of the through hole of the counter substrate (view of the counter substrate from the direction from the counter substrate toward the TFT substrate). FIG. 7C is a bottom view (a view of the counter substrate viewed from the direction from the TFT substrate toward the counter substrate) of the vicinity of the through hole of the counter substrate. FIG. 8 is a plan view of the vicinity of the through hole of the liquid crystal panel. The light shielding layer 200 is an area (light shielding material forming area) where the same light shielding material as the black matrix 76a is present, for example. The light shielding material forming region of the light shielding layer 200 surrounds a region where there is no light shielding material (light shielding material non-formation region). The light shielding layer 200 may not be the same light shielding material as the black matrix 76a as long as it is made of a material having a high light absorption rate, for example, metal chromium (Cr), chromium oxide (CrO ₂ ), resin, or the like. Good. The light shielding layer 200 has an inner wall 200a (an outer edge of the light shielding material non-forming region) that is an inner edge of the light shielding layer 200 at the boundary between the light shielding material forming region and the light shielding material non-forming region inside the light shielding material forming region. is there.

  As shown in FIG. 7A, the diameter of the inner wall 167 of the hole of the TFT substrate 161 and the diameter of the inner wall 168 of the hole of the counter substrate 162 are smaller than the diameter of the inner wall 169a of the through-hole seal 169. 7-2 and 7-3, the through hole H, the inner wall 168 of the counter substrate 162, the inner wall 169a of the through hole seal 169, and the inner wall 200a of the light shielding layer 200 are concentric. 7C, when the counter substrate 162 is viewed from the direction from the TFT substrate 161 toward the counter substrate 162, the inner wall 200a of the light shielding layer 200 is covered with the through-hole seal 169.

  Further, as shown in FIGS. 7A and 8B, the light shielding layer 200 has a shape in which a hole is provided near the center, and the hole of the light shielding layer 200 is a light shielding material non-formation region, and the liquid crystal panel 160. It is provided so as to surround the through hole H. In the light shielding material non-formation region, not only the light shielding material of the light shielding layer 200 but the material other than the light shielding material may exist. As shown in FIG. 7A, the inner diameter of the inner wall 200a of the light shielding layer 200 (the outer edge of the light shielding material non-forming region) is larger than the diameter of the inner wall 169a of the through-hole seal 169. The light shielding layer 200 is blocked from the outside by a through-hole seal 169. The diameter of the inner wall 200 a of the light shielding layer 200 is larger than the diameter of the inner wall 169 a of the through-hole seal 169. As described above, the light shielding layer 200 is a region where the light shielding material is present, and the inner wall 200a of the light shielding material surrounds the light shielding material non-formation region without the light shielding material. The inner diameter of the inner wall 200 a is larger than the inner diameter of the inner wall 168 of the counter substrate 162. For this reason, the inner wall 200a is located outside the inner wall 168. The above-described inner wall 200a is circular, but is not limited thereto, and may be a polygon, an ellipse, or the like as long as it is outside the inner wall 168.

  Thereby, the light shielding layer 200 can be protected from the outside air, and deterioration of the light shielding layer 200 due to the outside air can be suppressed.

As shown in FIG. 8, the scanning lines 24 _m , 24 _{m + 1} , 24 _{m + 2} and the signal lines 25 _n , 25 _{n + 1} , 25 _{n + 2} are parallel to the vicinity of the through hole H of the liquid crystal panel 160 and the periphery of the through hole H. It arrange | positions so that the through-hole H may be detoured.

<2-2. Manufacturing method of liquid crystal panel>
Next, a method for manufacturing a liquid crystal panel according to an embodiment of the present disclosure will be described. First, a TFT element, a pixel electrode, a common electrode, an alignment film, and the like are stacked on the main surface 161a of the TFT substrate 161. Next, a rubbing process for aligning the liquid crystal is performed on the alignment film on the main surface 161 a of the TFT substrate 161. Next, a conductive material application process for applying a conductive material for electrically connecting the TFT substrate 161 and the counter substrate 162 to the TFT substrate 161 is performed.

  On the other hand, a color filter, a black matrix, an alignment film, and the like are stacked on the main surface 162a of the counter substrate 162. Next, a rubbing process is performed on the counter substrate 162 in the same manner as the TFT substrate 161. Next, a main seal forming process for forming the main seal 166 is performed on the counter substrate 162. The main seal 166 is formed by applying a sealing agent on the main surface 162a of the counter substrate 162 so as to surround a region to be a liquid crystal region 165 enclosing liquid crystal when the liquid crystal panel 160 is formed. The sealant is applied by a dispenser drawing technique or the like.

  Next, a through-hole seal forming process for forming a through-hole seal 169 that seals the liquid crystal 164 is performed on the counter substrate 162. The through-hole seal 169 is formed by applying a sealing agent on the main surface 162a of the counter substrate 162 so as to form an annular shape surrounding a position where the through-hole H is to be formed in a through-hole forming process described later. At that time, the through-hole seal 169 is formed so as to cover the inner wall 200 a of the light shielding layer 200. The sealant is applied by a dispenser drawing technique or the like.

  Here, as the sealant that forms the main seal 166 and the through-hole seal 169, a thermosetting material that is thermally cured by heating, photocurability that is photocured by irradiation with ultraviolet rays, visible light, and the like, and A material having both thermosetting properties can be used. In addition, the sealant that forms the main seal 166 and the through-hole seal 169 includes a spacer that regulates the distance between the TFT substrate 161 and the counter substrate 162 when the TFT substrate 161 and the counter substrate 162 are bonded to each other. It doesn't matter. In this case, for example, a 4 μm silica sphere can be used as the spacer.

  Next, a baking process for heating the counter substrate 162 is performed. In the baking process, the counter substrate 162 is heated for a heating time of 30 minutes or less with the heating temperature in the range of 30 ° C. to 200 ° C. By performing the bake treatment, the viscosity of the main seal 166 and the through-hole seal 169 can be increased to an appropriate viscosity, and volatile components that affect the liquid crystal 164 can be volatilized.

  Next, a liquid crystal dropping process is performed on the counter substrate 162. In the liquid crystal dropping process, an appropriate amount of liquid crystal 164 is dropped on the inner area of each main seal 166 by a dispensing method or the like with the main surface 162a of the counter substrate 162 facing upward.

  Next, a bonding process is performed in which the TFT substrate 161 and the counter substrate 162 are bonded to each other. In the bonding process, the TFT substrate 161 and the counter substrate 162 are bonded in a vacuum atmosphere or a reduced pressure atmosphere with the main surface 161a and the main surface 162a facing each other. Then, the TFT substrate 161 and the counter substrate 162 are bonded to each other, whereby a bonded substrate 170 is formed. In addition, although the example which forms the bonded substrate board 170 in which the liquid crystal 164 was inserted using the liquid crystal dropping method (One Drop Filling: ODF) was described above, it is not limited to this. As an example of forming the bonded substrate 170 in which the liquid crystal 164 is inserted, a liquid crystal injection method in which liquid crystal is injected in a vacuum atmosphere after the sealant is cured may be used.

  FIG. 9 is a cross-sectional view of a portion where a through hole of the bonded substrate is to be formed. As shown in FIG. 9, the diameter of the cylindrical cut line L <b> 1 that is intended to open a through hole in the bonded substrate 170 is smaller than the diameter of the inner wall 169 a of the through hole seal 169.

  Thereby, when the TFT substrate 161 and the counter substrate 162 are cut along the cut line L1, it is possible to prevent the through-hole seal 169 from being damaged, and to prevent poor sealing of the liquid crystal 164.

  Further, the light shielding layer 200 surrounds a light shielding material non-formation region where the light shielding material is not formed around a portion where through holes are to be formed in the TFT substrate 161 and the counter substrate 162. The light shielding layer 200 is disposed so that the diameter of the inner wall 200 a is larger than the diameter of the inner wall 169 a of the through-hole seal 169. That is, the diameter of the inner wall 200a of the light shielding layer 200 (the outer edge of the light shielding material non-formation region) is larger than the diameter of the cut line L1. The space 201 surrounded by the TFT substrate 161, the counter substrate 162, and the through-hole seal 169 is a vacuum atmosphere or a reduced pressure atmosphere because the bonding process is performed in a vacuum atmosphere or a reduced pressure atmosphere.

  In the bonded substrate 170, the liquid crystal 164 is sealed between the TFT substrate 161 and the counter substrate 162 by the main seal 166. In the bonded substrate 170, a through-hole seal 169 is formed in the liquid crystal region 165.

  Next, a seal curing process is performed on the bonded substrate 170 to cure the main seal 166 and the through-hole seal 169. In the seal curing process, depending on the sealant that forms the main seal 166 and the through-hole seal 169, a photo-curing process by ultraviolet irradiation and a heat-curing process by heating are appropriately combined. When the thermosetting process is performed, the thermosetting process is a main heating (baking) process, and the baking process described above is a preheating (pre-baking) process.

  Next, a through hole forming process is performed on the bonded substrate 170. In the through-hole forming process, the through-hole is formed by irradiating the bonded substrate 170 with laser light.

  FIG. 10 is a cross-sectional view illustrating a state in which a counter substrate of a bonded substrate is irradiated with laser light. In the through hole forming process, as shown in FIG. 10, the laser beam B emitted from the laser oscillator 210 is moved so that the focal point of the laser beam B moves on a spiral line L2 having a cylindrical cut line L1 as an envelope. Then, the counter substrate 162 is irradiated.

  As the laser beam B, for example, a green laser beam having a wavelength of 532 μm can be used. Further, when irradiating the counter substrate 162 with the laser beam B, the focal point of the laser beam B is set to a certain point on the spiral line L2, a minute crack is generated at that point, and then the focal point of the laser beam B is spiraled. It is preferable to repeat the movement on the line L2 by an amount corresponding to the width of the crack. Thus, by moving the focal point of the laser beam B on the spiral line L2, the counter substrate 162 can be cut along the cut line L1 by continuously forming minute cracks on the spiral line L2.

  Here, when the counter substrate 162 is irradiated with the laser light B, if the light shielding material of the light shielding layer 200 exists near the cut line L1, the light shielding layer 200 absorbs the laser light B and generates heat. However, this heat may deteriorate the through-hole seal 169 and cause a sealing failure of the liquid crystal 164. Therefore, in the present embodiment, as shown in FIG. 9, the diameter of the inner wall 200a of the light shielding layer 200 is larger than the diameter of the cut line L1. Thereby, it can suppress that the light shielding layer 200 absorbs the laser beam B and generates heat, suppresses deterioration of the through-hole seal 169, and suppresses occurrence of poor sealing of the liquid crystal 164.

  In addition, after the TFT substrate 161 and the counter substrate 162 are cut by the laser beam B along the cut line L1, the inner walls of the holes of the TFT substrate 161 and the counter substrate 162 may be prepared using a member such as a drill.

  Next, the distance between the inner wall 200a of the light shielding layer 200 and the cut line L1 will be described. FIG. 11 is a cross-sectional view showing the positional relationship among the laser oscillator, the counter substrate, and the black matrix. As shown in FIG. 11, the distance between the laser oscillator 210 and the counter substrate 162 is A, the thickness of the counter substrate 162 is B, and the diameter of the cut line L1 is C. The point where the back surface 162b of the counter substrate 162 and the cut line L1 intersect is D, and the angle formed by the line L3 connecting the point D and the exit of the laser oscillator 210 and the cut line L1, that is, the incident angle is i. And When the laser beam emitted from the emission port of the laser oscillator 210 is incident on the counter substrate 162 along the line L3, the laser beam is refracted by the counter substrate 162, but the angle between the refracted light and the cut line L1, that is, the refraction angle is r. E is the point where the refracted light intersects the main surface 162a of the counter substrate 162. Further, the distance between the point E and the cut line L1 is assumed to be x.

  At this time, the following equation (1) holds from the law of refraction.

  In equation (1), the numerator “1.458” on the right side is the absolute refractive index of glass, and the denominator “1.000” on the right side is the absolute refractive index of air.

Here, it is assumed that the distance A is 70 mm. Assuming that the diameter C of the cut line L1 is 7 mm, the radius of the cut line L1 is 3.5 mm. Therefore, the following equation (2) is established.
tan i = 3.5 / 70 (2)

From equation (2), the value of i is as shown in equation (3) below.
i = 3 ° (3)

When formula (1) is transformed, the following formula (4) is obtained.
sin r = sin i / 1.458 (4)

Substituting equation (3) into equation (4) and solving for the refraction angle r yields the following equation (5).
r = 2 ° (5)

Here, assuming that the thickness B of the counter substrate 162 is 1 mm, the following equation (6) is established.
tan2 ° = x / 1 (6)

When equation (6) is solved for x, the following equation (7) is obtained.
x = 0.0035 (mm) (7)

  Accordingly, the distance x between the inner wall 200a of the light shielding layer 200 and the cut line L1 is preferably 0.0035 mm or more. That is, the inner wall 200a of the light shielding layer 200 is a point where the laser light incident on the intersection D between the cut line L1 for cutting the counter substrate 162 and the back surface 162b of the counter substrate 162 is refracted and emitted from the main surface 162a of the counter substrate 162. It is preferable that it is farther from the cut line L1 than E. The inner wall 200a of the light-shielding layer 200 that suppresses the transmission of light has a refraction angle of the laser beam that is equal to the thickness B of the counter substrate 162 from the point D where the back surface 162b of the counter substrate 162 intersects the through hole H formed by the cut line L1. The refracted light calculated by r is farther from the through hole H than the point E where the refracted light calculated from the main surface 162a of the counter substrate 162 is emitted.

  Thereby, since it can suppress that a laser beam injects into the light shielding layer 200, it suppresses that the light shielding layer 200 absorbs a laser beam and generate | occur | produces a heat | fever, suppresses deterioration of the through-hole seal | sticker 169, and liquid crystal 164 Occurrence of sealing failure can be suppressed. Since laser light can be used, the manufacturing method of this embodiment suppresses an increase in manufacturing cost and shortens manufacturing time. As a result, in the display device, defective sealing is suppressed, and the manufacturing quality is improved.

  Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above embodiments, and modifications, improvements, and the like within a scope that can achieve the object of the present disclosure are included in the present disclosure. is there.

  For example, in the above embodiment, the main seal 166 and the through-hole seal 169 are formed on the counter substrate 162. However, the main seal 166 and the through-hole seal 169 may be formed on the TFT substrate 161. Further, the main seal 166 may be formed on one of the TFT substrate 161 and the counter substrate 162, and the through-hole seal 169 may be formed on the other.

  Further, in the above-described embodiment, the case where the electronic apparatus according to the present disclosure is applied to the meter unit has been described as an example. The electronic device according to the present disclosure is not limited to the meter unit, and the electronic device according to the present disclosure may be an electronic device having a through hole such as a watch.

In addition, the present disclosure can take the following configurations.
<3. Configuration of the present disclosure>

(1)
A first substrate;
A second substrate disposed opposite the first substrate;
A liquid crystal inserted between the first substrate and the second substrate;
A light shielding layer disposed on a first surface of the second substrate on the first substrate side;
With
A through-hole penetrating the first substrate and the second substrate is formed;
The light shielding layer is a region having a light shielding material on the first surface, and an inner wall of the light shielding material surrounds a light shielding material non-formation region without the light shielding material, and the inner wall is the through hole of the second substrate. A display device on the outer side.

(2)
The inner wall of the light shielding layer has the second substrate thickness calculated from the refraction angle of the laser beam from the point where the second surface opposite to the first surface intersects the through hole. The display device according to (1), wherein the display device is further away from the through hole than a point that exits from the surface of 1.

(3)
A through-hole seal is disposed between the first substrate and the second substrate so as to surround the through-hole to seal the liquid crystal and to block between the light-shielding layer and the outside. The display device according to (1) or (2).

(4)
The display device according to (3), wherein an inner diameter of the through-hole seal is larger than inner diameters of holes of the first substrate and the second substrate.

(5)
The display device according to any one of (1) to (4), wherein the through hole is formed by being irradiated with a laser beam.

(6)
The through hole is formed by cutting the first substrate and the second substrate by irradiating a laser beam, and an inner wall of the light shielding layer is a cut line for cutting the second substrate. And the point where the laser beam incident on the intersection of the second substrate and the second surface of the second substrate is refracted and is further away from the cut line than the point where the laser beam is emitted from the first surface of the second substrate. The display device according to (5).

(7)
An electronic apparatus comprising: the display device according to any one of (1) to (6); and a control device that supplies an input signal to the display device.

DESCRIPTION OF SYMBOLS 1 Display apparatus 2 Display panel 11 Glass substrate 21 Display area part 22 Vertical driver 23 Horizontal driver 24 Scan line 25 Signal line 100 Meter unit 110 Liquid crystal display device 160 Liquid crystal panel 161 TFT substrate (1st board | substrate)
162 Counter substrate (second substrate)
169 Through-hole seal 200 Black matrix 210 Laser oscillator H Through-hole LC Liquid crystal element Tr TFT element Vpix Pixel

Claims (7)

A first substrate;
A second substrate disposed opposite the first substrate;
A liquid crystal inserted between the first substrate and the second substrate;
A light shielding layer disposed on a first surface of the second substrate on the first substrate side;
With
A through-hole penetrating the first substrate and the second substrate is formed;
The light shielding layer is a region having a light shielding material on the first surface, and an inner wall of the light shielding material surrounds a light shielding material non-formation region without the light shielding material, and the inner wall is the through hole of the second substrate. On the outside,
Display device. The inner wall of the light shielding layer has the second substrate thickness calculated from the refraction angle of the laser beam from the point where the second surface opposite to the first surface intersects the through hole. It is farther from the through hole than the point that exits from the surface of 1.
The display device according to claim 1. A through-hole seal is disposed between the first substrate and the second substrate so as to surround the through-hole to seal the liquid crystal and to block between the light-shielding layer and the outside. Prepare
The display device according to claim 1. The inner diameter of the through-hole seal is larger than the inner diameters of the holes of the first substrate and the second substrate,
The display device according to claim 3. The through hole is formed by being irradiated with a laser beam.
The display device according to claim 1. The through hole is formed by cutting the first substrate and the second substrate by irradiating a laser beam,
The inner wall of the light shielding layer is refracted by the laser beam incident on the intersection of the cut line for cutting the second substrate and the second surface of the second substrate, and the second wall of the second substrate is refracted. It is farther from the cut line than the point exiting from the surface of 1.
The display device according to claim 5. A first substrate; a second substrate disposed opposite to the first substrate; a liquid crystal interposed between the first substrate and the second substrate; and the second substrate A light shielding layer disposed on a first surface of the substrate on the first substrate side, and a through hole penetrating the first substrate and the second substrate is formed, and the light shielding layer is The first surface is a region having a light shielding material, and the inner wall of the light shielding material surrounds a light shielding material non-formation region without the light shielding material, and the inner wall is outside the through hole of the second substrate. A display device;
And a control device that supplies an input signal to the display device.

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