JP2012118219A - Liquid crystal device, manufacturing method of liquid crystal device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal device capable of sufficiently hardening a sealing member while suppressing deterioration of liquid crystal caused by light hardening the sealing member, and further to provide a manufacturing method of the liquid crystal device.SOLUTION: A liquid crystal device comprises: a pair of substrates 10 and 20 holding a liquid crystal layer 50 therebetween and being disposed opposite to each other; a frame-shaped seal member having an injection port for liquid crystal constituting the liquid crystal layer 50 and surrounding the liquid crystal layer 50 held between the pair of substrates; a sealing member 54 made of photocurable resin for sealing the injection port; and a light shielding member 60 disposed at a position opposite to the sealing member 54 of at least one substrate 20 of the pair of substrates 10 and 20. The substrate 20 provided with the light shielding member 60 has a light transmissivity for transmitting light, which hardens the sealing member 54. A light transmittance of the light shielding member 60 for transmitting the light disposed at the position opposite to the sealing member 54 is gradually decreased as closer to the liquid crystal layer 50.

Description

  The present invention relates to a liquid crystal device, a method for manufacturing a liquid crystal device, and an electronic apparatus.

  Conventionally, a vacuum injection method has been widely used as a method of manufacturing a liquid crystal device. In the vacuum injection method, first, a frame-like seal member having a liquid crystal injection port is drawn on one of a pair of substrates, and the pair of substrates are bonded to each other. Next, the end face on the liquid crystal inlet side of the pair of substrates is immersed in the liquid crystal stored in the container in vacuum, the liquid crystal is injected into a region surrounded by the pair of substrates and the seal member, and the liquid crystal inlet is sealed. Seal with. By such a process, a liquid crystal device in a vacuum injection method is manufactured.

  The sealing operation of the liquid crystal injection port is performed by using an ultraviolet curable resin as a sealing member and irradiating the sealing member with ultraviolet rays to cure. Irradiation of ultraviolet rays is performed by providing a light shielding mask on the outside of the substrate, but the liquid crystal may be irradiated with ultraviolet rays that wrap around from the edge of the light shielding mask. When the liquid crystal is irradiated with ultraviolet rays, the liquid crystal deteriorates, and image sticking or display unevenness occurs. Therefore, in the manufacturing method of the liquid crystal display device of Patent Document 1, a specific wavelength region of ultraviolet rays necessary for curing the resin portion is relatively well transmitted to one of the pair of substrates, and the other wavelength region (the liquid crystal region) A band-pass filter that cuts off the wavelength region of ultraviolet rays that causes deterioration is formed, and the resin portion is cured by irradiating ultraviolet rays from the outside of the substrate on which the band-pass filter is formed.

JP-A-10-221700

  In the method of manufacturing a liquid crystal display device disclosed in Patent Document 1, deterioration of liquid crystal due to ultraviolet irradiation is suppressed by arranging a part of the resin portion so as to overlap the band pass filter. Here, in the part which overlaps the band pass filter of the resin part, the transmittance | permeability of an ultraviolet-ray changes a lot. For example, if the thickness of the bandpass filter is increased to reduce the ultraviolet transmittance, the deterioration of the liquid crystal can be suppressed, but the resin portion is not sufficiently cured. On the other hand, if the thickness of the bandpass filter is reduced and the transmittance of ultraviolet rays is increased, the resin portion can be sufficiently cured, but it becomes difficult to suppress deterioration of the liquid crystal.

  The present invention has been made in view of such circumstances, and a liquid crystal device and a liquid crystal device capable of suppressing deterioration of liquid crystal due to light for curing the sealing member and sufficiently curing the sealing member It aims at providing the manufacturing method of. It is another object of the present invention to provide an electronic device that includes the liquid crystal device and has high display quality and excellent reliability.

  In order to solve the above-described problems, a liquid crystal device of the present invention includes a pair of substrates disposed to face each other with a liquid crystal layer interposed therebetween, and a liquid crystal injection port constituting the liquid crystal layer, and the liquid crystal device is interposed between the pair of substrates. A frame-shaped sealing member surrounding the sandwiched liquid crystal layer, a sealing member made of a photocurable resin that seals the injection port, and the sealing member of at least one of the pair of substrates facing the sealing member A light-shielding member disposed at a position where the light-shielding member is disposed, and the substrate on which the light-shielding member is disposed has a light-transmitting property that transmits light that cures the sealing member, and faces the sealing member. The light-shielding member arranged at a position has a light transmittance that transmits the light gradually decreasing as it approaches the liquid crystal layer.

  According to this liquid crystal device, the light transmittance at which the light shielding member transmits the light that cures the sealing member gradually decreases as it approaches the liquid crystal layer. Therefore, the light that passes through the light shielding member and enters the sealing member The amount gradually decreases as the liquid crystal layer is approached. Therefore, it is possible to sufficiently cure the sealing member by increasing the amount of light incident on the portion of the sealing member remote from the liquid crystal while reducing the amount of light incident on the portion of the sealing member close to the liquid crystal. . Therefore, it is possible to provide a liquid crystal device capable of suppressing deterioration of the liquid crystal due to light for curing the sealing member and sufficiently curing the sealing member.

  In the liquid crystal device, the light-shielding member whose light transmittance is gradually reduced interferes with both a position facing the sealing member and a position facing the liquid crystal layer adjacent to the sealing member. It may be provided in the area of the range.

  According to this liquid crystal device, even if the sealing member and the light shielding member are slightly displaced due to a manufacturing error, the sealing member can be reliably irradiated with light. Therefore, the sealing member can be cured more reliably.

  In the liquid crystal device, the light shielding member whose light transmittance is gradually reduced does not overlap an end portion of the sealing member opposite to the liquid crystal layer when viewed from the normal direction of the upper surface of the substrate. It may be arranged as follows.

  According to this liquid crystal device, the amount of light incident on the portion of the sealing member close to the liquid crystal layer is reduced, and light is incident on the end of the sealing member opposite to the liquid crystal layer without the light shielding member. be able to. Therefore, while suppressing deterioration of a liquid crystal, the amount of light which injects into the edge part on the opposite side to the liquid-crystal layer of a sealing member can be enlarged, and a sealing member can be hardened more reliably.

  In the liquid crystal device, the light-shielding member whose light transmittance is gradually reduced interferes with both a position facing the sealing member and a position facing the sealing member adjacent to the sealing member. It may be provided in the area of the range.

  According to this liquid crystal device, even if the sealing member and the light shielding member are slightly displaced due to a manufacturing error, the sealing member can be reliably irradiated with light. Therefore, the sealing member can be cured more reliably.

  In the liquid crystal device, the light blocking member may be configured such that a plurality of openings are formed in a metal film, and the density of the plurality of openings gradually decreases as the liquid crystal layer is approached.

  According to this liquid crystal device, since the density of the plurality of openings in the metal film gradually decreases as it approaches the liquid crystal layer, the amount of light that passes through the light shielding member and enters the sealing member gradually increases as it approaches the liquid crystal layer. Becomes smaller. Therefore, the amount of light incident on the portion of the sealing member near the liquid crystal layer is reduced, while the amount of light incident on the portion of the sealing member far from the liquid crystal layer is increased to sufficiently cure the sealing member. Can do.

  In the liquid crystal device, the light shielding member is made of a metal film, and is configured such that the thickness of the metal film gradually increases as it approaches the liquid crystal layer, whereby the light transmittance approaches the liquid crystal layer. It may be gradually smaller according to.

  According to this liquid crystal device, since the thickness of the metal film gradually increases as it approaches the liquid crystal layer, the amount of light that passes through the light shielding member and enters the sealing member gradually decreases as it approaches the liquid crystal layer. Therefore, the amount of light incident on the portion of the sealing member near the liquid crystal layer is reduced, while the amount of light incident on the portion of the sealing member far from the liquid crystal layer is increased to sufficiently cure the sealing member. Can do.

  In the liquid crystal device, the sealing member may be arranged such that an end portion on the side opposite to the liquid crystal layer is exposed from an edge of the one substrate when viewed from the normal direction of the upper surface of the substrate. .

  According to this liquid crystal device, the amount of light incident on the portion of the sealing member close to the liquid crystal layer is reduced, and light is incident on the end of the sealing member opposite to the liquid crystal layer without passing through the substrate. Can do. Therefore, while suppressing deterioration of a liquid crystal, the amount of light which injects into the edge part on the opposite side to the liquid-crystal layer of a sealing member can be enlarged, and a sealing member can be hardened more reliably.

  In the liquid crystal device, the photocurable resin may be an ultraviolet curable resin.

  It is known that the ultraviolet curable resin has a high adhesive strength and an excellent productivity that cures in seconds. Therefore, since the photocurable resin is an ultraviolet curable resin, the sealing member can be reliably cured in a short time.

  The method for manufacturing a liquid crystal device according to the present invention is a method for manufacturing a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates, and the liquid crystal layer is formed on one or the other of the pair of substrates. A step of forming a frame-shaped sealing member as viewed from the normal direction of the upper surface of the substrate having a liquid crystal inlet, and the one substrate and the other substrate are opposed to each other with the sealing member interposed therebetween. A step of bonding, a step of injecting the liquid crystal from the injection port into a region surrounded by the pair of substrates and the sealing member, and sealing the injection port with a sealing member made of a photocurable resin; At least one of the pair of substrates has a light transmittance that transmits the light in the liquid crystal layer at a position facing the sealing member of a substrate that transmits light that cures the sealing member. Shielding that gradually decreases as it approaches Disposing a member, characterized in that it and a step of irradiating the light toward the sealing member from the outside of the substrate on which the light blocking member is disposed through said light blocking member.

  According to this manufacturing method, the light shielding member that gradually decreases as the light transmittance for transmitting the light for curing the sealing member approaches the liquid crystal layer is disposed, so that the light is transmitted through the light shielding member and enters the sealing member. The amount of light gradually decreases as it approaches the liquid crystal layer. Therefore, the amount of light incident on the portion of the sealing member near the liquid crystal layer is reduced, while the amount of light incident on the portion of the sealing member far from the liquid crystal layer is increased to sufficiently cure the sealing member. Can do. Therefore, deterioration of the liquid crystal due to light for curing the sealing member can be suppressed, and the sealing member can be sufficiently cured.

  In the method for manufacturing the liquid crystal device, the light shielding member may be configured such that a plurality of openings are formed in a metal film, and the density of the plurality of openings gradually decreases as the liquid crystal layer is approached. Good.

  According to this manufacturing method, since the density of the plurality of openings in the metal film gradually decreases as it approaches the liquid crystal layer, the amount of light that passes through the light shielding member and enters the sealing member gradually increases as it approaches the liquid crystal layer. Becomes smaller. Therefore, the amount of light incident on the portion of the sealing member near the liquid crystal layer is reduced, while the amount of light incident on the portion of the sealing member far from the liquid crystal layer is increased to sufficiently cure the sealing member. Can do.

  In the method for manufacturing the liquid crystal device, the light shielding member is made of a metal film, and the thickness of the metal film gradually increases as the thickness of the metal film approaches the liquid crystal layer. It may gradually become smaller as it approaches the layer.

  According to this manufacturing method, since the thickness of the metal film gradually increases as it approaches the liquid crystal layer, the amount of light that passes through the light shielding member and enters the sealing member gradually decreases as it approaches the liquid crystal layer. Therefore, the amount of light incident on the portion of the sealing member near the liquid crystal layer is reduced, while the amount of light incident on the portion of the sealing member far from the liquid crystal layer is increased to sufficiently cure the sealing member. Can do.

  In the method for manufacturing the liquid crystal device, the light shielding member may be formed integrally with at least one of the pair of substrates.

  According to this manufacturing method, the light shielding member can be formed integrally with the substrate in the manufacturing process of the liquid crystal device. Therefore, manufacturing efficiency is improved.

  In the method of manufacturing the liquid crystal device, the method includes a step of arranging a light shielding mask in which an opening that transmits the light is formed, and an area of the region where the opening of the light shielding mask and the light shielding member overlap with each other is The size of the light shielding member may be smaller than the area of the member, and the light transmittance of the light shielding member may gradually decrease in the region as the light transmittance approaches the liquid crystal layer.

  According to this manufacturing method, the alignment deviation of the light shielding mask can be allowed. For example, consider a case where the light shielding member is irradiated with light for curing the sealing member via a light shielding mask. If the light shielding mask is not disposed at the target position, the target portion that is shielded by the light shielding mask changes. If the arrangement position of the light shielding mask is greatly deviated from the target position, a portion to be shielded by the light shielding mask may be exposed without being covered by the light shielding mask. According to this configuration, since the area of the region where the opening of the light shielding mask and the light shielding member overlap is smaller than the area of the light shielding member, the light shielding member allows the misalignment of the light shielding mask and leaks light. This can be suppressed.

  In the method for manufacturing a liquid crystal device, the light shielding member may be disposed separately from and in close proximity to at least one of the pair of substrates.

  According to this manufacturing method, the light shielding member can be a separate component from the liquid crystal device. Therefore, the configuration of the liquid crystal device is simplified.

  The method for manufacturing the liquid crystal device may include a step of arranging a light shielding mask having an opening through which the light is transmitted, and the light shielding member may be disposed in the opening of the light shielding mask.

  According to this manufacturing method, the light shielding member can be a part of the light shielding mask. Therefore, the configuration of the liquid crystal device is simplified.

  An electronic apparatus according to the present invention includes the above-described liquid crystal device.

  According to this electronic apparatus, since the liquid crystal device described above is provided, an electronic apparatus with high display quality and excellent reliability can be provided.

It is a schematic diagram which shows schematic structure of the liquid crystal device which concerns on this invention. It is a schematic diagram which shows schematic structure of the light shielding member which concerns on 1st Embodiment. It is a perspective view which shows schematic structure of the light shielding mask which concerns on the same embodiment. It is a figure which shows the positional relationship of the light shielding member and light shielding mask which concern on the embodiment. It is a figure which shows the relationship between the light irradiation position with respect to the light shielding member and light shielding mask which concern on the embodiment, and light transmittance. 4 is a flowchart showing a manufacturing process of the liquid crystal device according to the embodiment. It is a schematic diagram which shows schematic structure of the light shielding member which concerns on 2nd Embodiment. It is a perspective view which shows schematic structure of the light shielding mask which concerns on 3rd Embodiment. It is a figure which shows the arrangement | positioning state of the light shielding mask which concerns on the same embodiment. It is a figure which shows the relationship between the irradiation position of the light with respect to the light shielding mask which concerns on the same embodiment, and light transmittance. It is a schematic diagram which shows an example of a projector as an electronic device.

  Embodiments of the present invention will be described below with reference to the drawings. This embodiment shows one aspect of the present invention, and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each structure easy to understand, an actual structure and a scale, a number, and the like in each structure are different.

(First embodiment)
FIG. 1 is a schematic diagram illustrating a schematic configuration of the liquid crystal device 100. FIG. 1A is a plan view of the liquid crystal device 100, and FIG. 1B is a cross-sectional view taken along the line HH ′ of FIG. In the present embodiment, a liquid crystal device in a VA (Vertical Alignment) mode will be described as an example.

  The liquid crystal device 100 includes an element substrate 10 and a counter substrate 20. The element substrate 10 and the counter substrate 20 are bonded together via a sealing member 52 having a substantially rectangular frame shape in plan view. The seal member 52 is formed with an injection port 55 (liquid crystal injection port) for injecting liquid crystal, and the injection port 55 is sealed with a sealing member 54.

  The sealing member 54 is made of a photocurable resin such as an ultraviolet curable resin. In the present embodiment, an ultraviolet curable resin is used as a forming material of the sealing member 54. A liquid crystal layer 50 is sealed in a region surrounded by the sealing member 52 and the sealing member 54. A frame 53 having a rectangular frame shape in plan view is formed along the inner peripheral side of the sealing member 52 and the sealing member 54, and a region inside the frame 53 is a display region 11. The counter substrate 20 has a light transmission property that transmits light (ultraviolet rays) for curing the sealing member 54. A light shielding member 60 is disposed at a position facing the sealing member 54 of the counter substrate 20. The light shielding member 60 gradually decreases as the light transmittance for transmitting light approaches the liquid crystal layer 50.

  A plurality of pixels 12 are provided in a matrix in the display area 11. The pixel 12 constitutes the minimum display unit of the display area 11. A data line driving circuit 101 and an external circuit mounting terminal 102 are formed along one side (the lower side in the drawing) of the element substrate 10 in a region outside the seal member 52, and two sides adjacent to the one side are formed. A scanning line driving circuit 104 is formed along each of them to form a peripheral circuit.

  On the remaining one side (illustrated upper side) of the element substrate 10, a plurality of wirings 105 are provided to connect between the scanning line driving circuits 104 on both sides of the display area 11. In addition, an inter-substrate conductive material 106 for providing electrical continuity between the element substrate 10 and the counter substrate 20 is disposed at each corner of the counter substrate 20.

  A plurality of pixel electrodes 9 are arranged on the element substrate 10 on the liquid crystal layer 50 side. The pixel electrode 9 is provided for each pixel 12. The element substrate 10 is provided with a plurality of switching elements (not shown). The switching element is formed of, for example, a thin film transistor, and is provided for each pixel 12. The source region of the switching element is electrically connected to the data line driving circuit 101 via a data line (not shown). The gate electrode of the switching element is electrically connected to the scanning line driving circuit 104 via a scanning line (not shown). The drain region of the switching element is electrically connected to the pixel electrode 9.

  A first alignment film 16 is formed on the pixel electrode 9. A frame 53 and a light shielding film (not shown) are formed on the counter substrate 20 on the liquid crystal layer 50 side. A common electrode 21 that covers the entire surface of the display region 11 is formed on the frame 53 and a light shielding film (not shown). A second alignment film 22 is formed on the common electrode 21. The alignment state of the liquid crystal layer 50 in a state where no electric field is applied to the liquid crystal layer 50 is controlled by the first alignment film 16 and the second alignment film 22.

  The liquid crystal device 100 is configured as a reflective liquid crystal device. The pixel electrode 9 is configured as a reflective electrode made of a highly reflective metal material such as aluminum (Al) or silver (Ag). The common electrode 21 is configured as a transparent electrode made of a transparent conductive material such as indium tin oxide (hereinafter referred to as ITO).

  An image signal of an image to be displayed is supplied from the outside of the liquid crystal device 100 via the external circuit mounting terminal 102. The data line driving circuit 101 outputs a driving voltage waveform for driving the liquid crystal layer 50 to the switching element based on the image data indicating the gradation value for each pixel included in the image signal. The scanning line driving circuit 104 applies a voltage to the gate electrode of the switching element based on data indicating the display timing of the pixel included in the image signal, and controls on / off of the switching element.

  When the switching element is turned on, the above driving voltage waveform is supplied to the pixel electrode 9 and a voltage is applied to the pixel electrode 9. For example, the potential of the common electrode 21 is held at a common potential common to the plurality of pixels 12. A voltage corresponding to the potential difference between the pixel electrode 9 and the common electrode 21 is applied to the liquid crystal layer 50. The alignment state of the liquid crystal layer 50 is changed by the electric field generated by this voltage. The light incident on the liquid crystal layer 50 changes its polarization state for each pixel 12 according to the alignment state of the liquid crystal layer 50. By passing the light emitted from the liquid crystal layer 50 through a polarizing plate (not shown), light having a gradation value corresponding to the image data is emitted from the polarizing plate. In this way, an image corresponding to the image data can be displayed.

  FIG. 2 is a schematic diagram illustrating a schematic configuration of the light shielding member according to the first embodiment. 2A is a plan view of the light shielding member, and FIG. 2B is a cross-sectional view of the light shielding member.

  As shown in FIG. 2A, the light shielding member 60 is a light shielding film in which a plurality of openings 62 are formed in a metal film 61. The metal film 61 is a film made of a metal material such as aluminum (Al) or chromium (Cr), for example. In the light shielding member 60, the diameters of the openings 62 are substantially the same. The density of the plurality of openings 62 gradually decreases as the liquid crystal layer 50 is approached. Thereby, the light shielding member 60 gradually decreases in light transmittance (UV transmittance) that transmits light (UV) for curing the sealing member 54 as it approaches the liquid crystal layer 50.

  As shown in FIG. 2 (b), the thickness of the light shielding member 60 is uniform throughout. The thickness of the light shielding member 60 is the same for a portion near the liquid crystal layer 50 and a portion far from the liquid crystal layer 50.

FIG. 3 is a perspective view illustrating a schematic configuration of the light shielding mask 70 according to the first embodiment, which is used in the method of manufacturing the liquid crystal device.
As shown in FIG. 3, the light shielding mask 70 has a rectangular shape in plan view, and an opening 72 that transmits UV for curing the sealing member 54 is formed in a part of the light shielding plate 71 serving as the light shielding mask body. It has a configuration. For example, the light shielding plate 71 is formed by forming a film made of a metal material such as Al or Cr on a glass substrate. The position where the opening 72 is formed corresponds to the position of the light shielding member 60 disposed at a position facing the sealing member 54 of the counter substrate 20.

  FIG. 4 is a diagram illustrating a positional relationship between the light shielding member 60 and the light shielding mask 70 according to the first embodiment. In FIG. 4, for the sake of convenience, the opening 72 of the light shielding mask 70 is shown, and the illustration of the light shielding plate 71 of the light shielding mask body is omitted.

  As shown in FIG. 4, the light shielding member 60 has a rectangular shape in plan view, and is disposed at a position facing the sealing member 54 of the counter substrate 20. The light shielding member 60 is formed on the surface of the counter substrate 20 on the liquid crystal layer 50 side. In the present embodiment, the light shielding member 60 is formed integrally with the counter substrate 20 (see FIG. 5).

  The light-shielding member 60 whose light transmittance is gradually reduced is in a region in a range between the position facing the sealing member 54 and the position facing the liquid crystal layer 50 adjacent to the sealing member 54. Is provided. The formation part of the light shielding member 60 whose light transmittance is gradually reduced includes the formation part of the sealing member 54 and the part of the liquid crystal layer 50 adjacent thereto. That is, the light shielding member 60 whose light transmittance is gradually reduced is formed beyond the portion where the sealing member 54 is formed to the portion of the liquid crystal layer 50 adjacent thereto. In other words, the light shielding member 60 in the counter substrate 20 is viewed from the normal direction of the upper surface of the substrate (plan view), and the liquid crystal layer 50 and the sealing member 54 are sandwiched between the liquid crystal layer 50 and the sealing member 54. It is formed across both. The area of the portion where the light shielding member 60 straddles the sealing member 54 and the area of the portion where the light shielding member 60 straddles the liquid crystal layer 50 are substantially the same size. The area of the portion where the light shielding member 60 straddles the sealing member 54 and the area of the portion where the light shielding member 60 straddles the liquid crystal layer 50 are, for example, the degree of curing of the sealing member 54 due to UV irradiation, the degree of deterioration of the liquid crystal layer 50, and the like. Can be arbitrarily changed.

  The light shielding member 60 is formed on the counter substrate 20 so as not to overlap the end of the sealing member 54 opposite to the liquid crystal layer 50 when viewed from the normal direction of the upper surface of the substrate (plan view). Therefore, the portion of the sealing member 54 opposite to the liquid crystal layer 50 is exposed from the light shielding member 60. Further, the sealing member 54 is formed so that the end portion on the opposite side to the liquid crystal layer 50 is exposed from the end edge of the counter substrate 20.

  The light-shielding member 60 whose light transmittance is gradually reduced is in a region in a range between the position facing the sealing member 54 and the position facing the sealing member 52 adjacent to the sealing member 54. Is provided. The formation part of the light shielding member 60 whose light transmittance is gradually reduced includes the formation part of the sealing member 54 and the formation part of the seal member 52 adjacent thereto. That is, the light shielding member 60 whose light transmittance is gradually reduced is formed beyond the formation portion of the sealing member 54 and to the formation portion of the seal member 52 adjacent thereto. In other words, the light shielding member 60 in the counter substrate 20 is viewed from the normal direction of the upper surface of the substrate (plan view), and the sealing member 52 and the sealing member 54 are sandwiched between the boundary portions of the sealing member 52 and the sealing member 54. It is formed across both. The area of the portion where the light shielding member 60 straddles the sealing member 54 and the area of the portion where the light shielding member 60 straddles the sealing member 52 can be arbitrarily changed in consideration of a dimensional error in manufacturing the sealing member 54, for example. It is.

  The opening 72 of the light shielding mask 70 is disposed so as to overlap a position facing the light shielding member 60 formed on the counter substrate 20. The area of the area where the opening 72 of the light shielding mask 70 and the light shielding member 60 overlap is smaller than the area of the light shielding member 60. In the light shielding member 60, in the region where the opening 72 of the light shielding mask 70 and the light shielding member 60 overlap, the light transmittance that transmits light for curing the sealing member 54 gradually decreases as the liquid crystal layer 50 is approached.

  FIG. 5 is a diagram illustrating the relationship between the light (UV) irradiation position and the light transmittance on the light shielding member and the light shielding mask according to the first embodiment. In FIG. 5, the cross section of the portion where the light shielding member 60 is formed in the liquid crystal device 100 (the portion where the opening 72 of the light shielding mask 70 is located) is shown at the top, and the light shielding mask alone (light shielding) in order from the top below. The relationship between the position where light (UV) is transmitted through the opening 72) of the mask 70 and the light transmittance (UV transmittance), the relationship between the position where UV is transmitted through the light shielding member and the UV transmittance, the light shielding mask 70 and The relationship between the position where UV passes through the light shielding member 60 and the UV transmittance is illustrated. In each relationship diagram, the horizontal axis represents the position where UV is transmitted, and the vertical axis represents the UV transmittance.

  As shown in FIG. 5, when UV is irradiated from above the light shielding mask 70, the UV passes through the opening 72 of the light shielding mask 70. A part of the light that has passed through the opening 72 of the light shielding mask 70 passes through the counter substrate 20 and irradiates the sealing member 54 and the portion of the liquid crystal layer 50 near the sealing member 54 through the light shielding member 60. Is done. The remaining part of the light is applied to the portion of the sealing member 54 exposed from the edge of the counter substrate 20.

  When UV is transmitted through the light shielding mask alone (the opening 72 of the light shielding mask 70), since the UV passes through the opening 72 as it is, the UV transmittance is the same in the entire position where the UV is transmitted.

  When UV passes through the light shielding member alone, the UV transmittance gradually decreases as the position where UV passes through the light shielding member 60 approaches the liquid crystal layer 50. The relationship between the position where UV passes through the light shielding member 60 and the UV transmittance at this position is a linear relationship.

  Thereby, a part of the light that has passed through the opening 72 of the light shielding mask 70 is irradiated onto the sealing member 54 without leakage. In addition, the light intensity is attenuated by the light-shielding member 60, although this part of the light is applied to the portion of the liquid crystal layer 50 near the sealing member 54. The remaining part of the light is irradiated to the portion of the sealing member 54 exposed from the edge of the counter substrate 20 without omission.

(Manufacturing method of liquid crystal device)
FIG. 6 is a flowchart of the manufacturing process of the liquid crystal device according to the first embodiment.
First, a switching element and wiring are formed on a glass substrate, and further, a pixel electrode 9 and an alignment film 16 are formed to produce an element substrate 10 (see FIG. 1B) (step S1 in FIG. 6). On the other hand, the light-shielding film, the counter electrode, and the alignment film are formed on the glass substrate to produce the counter substrate 20 (step S2 in FIG. 6).

  Next, a material for forming the seal member 52 (hereinafter sometimes simply referred to as a seal material) is applied in a frame shape to the peripheral portion of the element substrate 10 (step S3 in FIG. 6). At this time, the forming material of the sealing member 52 is formed so as to have a liquid crystal injection port 55 at a part of the substantially center of one side (see FIG. 1A). The injection port 55 is provided so as to have a size (injection port width) that allows liquid crystal to be smoothly injected into a region surrounded by the seal member 52. As a method for applying the sealing material, for example, a dispensing method or a screen printing method can be used.

  On the other hand, a light shielding member 60 (see FIG. 2) in which a plurality of openings 62 are formed in the metal film 61 is formed at a position facing the sealing member 54 of the counter substrate 20 (step in FIG. 6). S4). That is, the light shielding member 60 is formed integrally with the counter substrate 20 in advance. The light shielding member 60 is formed so that the density of the plurality of openings 62 gradually decreases as the liquid crystal layer 50 is approached.

  As a method for forming the light shielding member 60, for example, first, a metal film 61 such as Al or Cr is formed on the counter substrate 20 by vapor deposition, and then a plurality of openings are formed in the metal film 61 formed on the counter substrate 20. There is a method in which a mask having an opening pattern corresponding to the arrangement pattern of the portions 62 is arranged, and then an etching process is performed. In addition, first, a mask having a dot pattern corresponding to the arrangement pattern of the plurality of openings 62 is disposed on the counter substrate 20, and then a metal material such as Al or Cr is deposited on the mask of the counter substrate 20 by vapor deposition. There is a method of forming.

  Next, the element substrate 10 and the counter substrate 20 are bonded together with a sealing material (step S5 in FIG. 6). At this time, rough positioning is performed by using an alignment mark (not shown) formed in advance on the element substrate 10 and the counter substrate 20 so that the deviation of the relative position between the element substrate 10 and the counter substrate 20 is within an allowable range.

  Next, the element substrate 10 and the counter substrate 20 are pressurized to crush the sealing material. After the cell gap between the element substrate 10 and the counter substrate 20 is set to a predetermined interval, the relative position between the element substrate 10 and the counter substrate 20 is accurately determined by precision alignment. Then, the sealing material is cured by irradiating UV with a UV lamp. Alternatively, the sealing material is cured by heating (step S6 in FIG. 6). As a result, the pair of substrates 10 and 20 are bonded together via the seal member 52.

  Next, liquid crystal is injected from the injection port 55 into the region surrounded by the seal member 52 between the pair of bonded substrates 10 and 20 by using a vacuum injection method, and the injection port 55 is made of an ultraviolet curable resin or the like. It seals with the sealing member 54 which consists of this photocurable resin (step S7 in FIG. 6). The sealing member 54 is formed with a width larger than the inlet width along the direction in which the seal member 52 extends (the left-right direction shown in FIG. 1) so as to securely seal the inlet 55. Moreover, the sealing member 54 is formed so that a part protrudes outside the outline of the pair of substrates 10 and 20 bonded together. As a method for applying the forming material of the sealing member 54 (hereinafter sometimes simply referred to as a sealing material), for example, a dispensing method can be used.

  Next, UV is irradiated from the outside of the counter substrate 20 toward the sealing material through the light shielding member 60 (step S6 in FIG. 6). Specifically, a light shielding mask 70 (see FIG. 3) is arranged outside the counter substrate 20, and UV (wavelength of about 365 nm) is irradiated from the outside of the light shielding mask 70 by a UV lamp, and sealed through the light shielding member 60. Harden the stop material. As a result, the liquid crystal inlet 55 is sealed by the sealing member 54. Next, as necessary, the pair of substrates 10 and 20 sealed with liquid crystal is washed.

  Through the above steps, the liquid crystal device 100 in which the sealing member 54 is sufficiently cured is obtained.

  According to the liquid crystal device 100 of the present embodiment, the UV transmittance of the light shielding member 60 that transmits the UV that cures the sealing member 54 gradually decreases as it approaches the liquid crystal layer 50. Thus, the amount of UV incident on the sealing member 54 gradually decreases as the liquid crystal layer 50 is approached. Therefore, while reducing the amount of light incident on the portion of the sealing member 54 close to the liquid crystal layer 50, the amount of light incident on the portion of the sealing member 54 far from the liquid crystal layer 50 is increased to increase the amount of light incident on the sealing member 54. It can be cured sufficiently. Therefore, it is possible to provide the liquid crystal device 100 that can suppress deterioration of the liquid crystal due to light that cures the sealing member 54 and can sufficiently cure the sealing member 54.

  Further, according to this configuration, since the light shielding member 60 is disposed across both the liquid crystal layer 50 and the sealing member 54 with the boundary portion between the liquid crystal layer 50 and the sealing member 54 interposed therebetween, the light shielding member 60 is sealed due to a manufacturing error. Even if the positions of the member 54 and the light shielding member 60 are slightly displaced, the sealing member 54 can be reliably irradiated with light. Therefore, the sealing member 54 can be hardened more reliably.

  Further, according to this configuration, since the light shielding member 60 is disposed so as not to overlap the end of the sealing member 54 on the side opposite to the liquid crystal layer 50, the light shielding member 60 is incident on the portion of the sealing member 54 close to the liquid crystal layer 50. It is possible to make light incident on the end of the sealing member 54 on the side opposite to the liquid crystal layer 50 without passing through the light shielding member, while reducing the amount of light to be transmitted. Therefore, it is possible to suppress the deterioration of the liquid crystal and increase the amount of light incident on the end of the sealing member 54 opposite to the liquid crystal layer 50 to cure the sealing member 54 more reliably.

  Further, according to this configuration, since the light shielding member 60 is disposed across both the sealing member 52 and the sealing member 54 with the boundary between the sealing member 52 and the sealing member 54 interposed therebetween, the light shielding member 60 is sealed due to a manufacturing error. Even if the positions of the stop member 54 and the light shielding member 60 are slightly shifted, the sealing member 54 can be reliably irradiated with light. Therefore, the sealing member 54 can be hardened more reliably.

  Further, according to this configuration, the light shielding member 60 is configured by forming a plurality of openings 62 in the metal film 61, and the density of the plurality of openings 62 gradually decreases as the liquid crystal layer 50 is approached. The amount of light that passes through the light shielding member 60 and enters the sealing member 54 gradually decreases as the liquid crystal layer 50 is approached. Therefore, while reducing the amount of light incident on the portion of the sealing member 54 close to the liquid crystal layer 50, the amount of light incident on the portion of the sealing member 54 far from the liquid crystal layer 50 is increased to increase the amount of light incident on the sealing member 54. It can be cured sufficiently.

  Further, according to this configuration, since the end of the sealing member 54 opposite to the liquid crystal layer 50 is disposed so as to be exposed from the edge of the counter substrate 20, a portion close to the liquid crystal layer 50 of the sealing member 54 The light can be incident on the end of the sealing member 54 on the side opposite to the liquid crystal layer 50 without using the counter substrate 20 while reducing the amount of light incident on the liquid crystal layer 50. Therefore, it is possible to suppress the deterioration of the liquid crystal and increase the amount of light incident on the end of the sealing member 54 opposite to the liquid crystal layer 50 to cure the sealing member 54 more reliably.

  Further, according to this configuration, an ultraviolet curable resin is used as the photocurable resin. It is known that the ultraviolet curable resin has a high adhesive strength and an excellent productivity that cures in seconds. Therefore, since the photocurable resin is an ultraviolet curable resin, the sealing member 54 can be reliably cured in a short time.

  According to the manufacturing method of the liquid crystal device of the present embodiment, the light shielding member 60 is disposed on the counter substrate 20 that gradually decreases as the UV transmittance that transmits UV that cures the sealing member 54 approaches the liquid crystal layer 50. Therefore, the amount of light that passes through the light shielding member 60 and enters the sealing member 54 gradually decreases as the liquid crystal layer 50 is approached. For this reason, the amount of light incident on the portion of the sealing member 54 near the liquid crystal layer 50 is reduced, while the amount of light incident on the portion of the sealing member 54 far from the liquid crystal layer 50 is increased, so that the sealing member is sufficient. Can be cured. Accordingly, it is possible to suppress deterioration of the liquid crystal due to light that cures the sealing member 54 and to sufficiently cure the sealing member 54.

  Further, according to this manufacturing method, the light shielding member 60 is formed by forming the plurality of openings 62 in the metal film 61, and gradually as the density of the plurality of openings 62 in the metal film 61 approaches the liquid crystal layer 50. Therefore, the amount of light that passes through the light blocking member 60 and enters the sealing member 54 gradually decreases as the liquid crystal layer 50 is approached. Therefore, while reducing the amount of light incident on the portion of the sealing member 54 close to the liquid crystal layer 50, the amount of light incident on the portion of the sealing member 54 far from the liquid crystal layer 50 is increased to increase the amount of light incident on the sealing member 54. It can be cured sufficiently.

  Further, according to this manufacturing method, the light shielding member 60 can be formed integrally with the counter substrate 20 in the manufacturing process of the liquid crystal device. Therefore, manufacturing efficiency is improved.

  Moreover, according to this manufacturing method, the alignment shift | offset | difference of the light shielding mask 70 can be accept | permitted. For example, consider a case where the light shielding member 60 is irradiated with light for curing the sealing member 54 via the light shielding mask 70. If the light shielding mask 70 is not arranged at the target position, the target portion that is shielded by the light shielding mask 70 changes. When the arrangement position of the light shielding mask 70 is largely deviated from the target position, a portion to be shielded by the light shielding mask 70 may be exposed without being covered by the light shielding mask 70. According to this configuration, since the area of the region where the opening 72 of the light shielding mask 70 and the light shielding member 60 overlap is not larger than the area of the light shielding member 60, the light shielding member 60 allows misalignment of the light shielding mask 70. And it can suppress that leak light arises.

  In the liquid crystal device 100 of the present embodiment, the light shielding member 60 is formed on the counter substrate 20, but is not limited thereto. For example, the light shielding member 60 may be formed on the element substrate 10. In this case, as the element substrate 10, a substrate having a light transmission property that transmits light for curing the sealing member 54 is used. Further, the light shielding member 60 may be formed on both the element substrate 10 and the counter substrate 20. That is, the light shielding member 60 may be disposed at a position facing the sealing member 54 of at least one of the pair of substrates 10 and 20.

  In the liquid crystal device 100 of the present embodiment, the light shielding member 60 is formed on the surface of the counter substrate 20 on the liquid crystal layer 50 side (inner side), but is not limited thereto. For example, the light shielding member 60 may be formed on the surface (opposite side) opposite to the liquid crystal layer 50 side of the counter substrate 20, or may be formed inside the counter substrate 20. That is, the light shielding member 60 may be disposed at a position facing the sealing member 54 of at least one of the pair of substrates 10 and 20.

  Further, in the liquid crystal device 100 of the present embodiment, the ultraviolet curable resin is used as the forming material of the sealing member 54, but the invention is not limited thereto. For example, as the forming material of the sealing member 54, a resin curable by radiation such as an electron beam or a resin curable by visible light can be used. In this case, the sealing material can be cured by irradiating the sealing material with an electron beam or visible light, respectively.

  Further, in the liquid crystal device 100 of the present embodiment, the relationship between the position where the UV passes through the light shielding member 60 and the UV transmittance at the position is a linear relationship, but is not limited thereto. For example, the relationship between the position where the UV is transmitted through the light shielding member 60 and the UV transmittance at the position is such that the position where the UV is transmitted approaches the liquid crystal layer 50 so that the UV transmittance is gradually reduced. It may be. As an example of the correlation, when the position where the UV is transmitted is far from the liquid crystal layer 50, the UV transmittance is gradually decreased, and when the position where the UV is transmitted is close to the liquid crystal layer 50, the UV transmittance is steeply decreased. The relationship becomes.

  Further, in the method of manufacturing the liquid crystal device according to the present embodiment, the light shielding member 60 in which the plurality of openings 62 are formed in the metal film 61 at the position facing the sealing member 54 of the counter substrate 20 is connected to the element substrate 10. Although it forms before bonding with the opposing board | substrate 20, it is not restricted to this. For example, the light shielding member 60 may be formed at a position facing the sealing member 54 of the counter substrate 20 after the element substrate 10 and the counter substrate 20 are bonded together.

(Second Embodiment)
FIG. 7 is a schematic diagram showing a schematic configuration of a light shielding member corresponding to FIG. 2 and constituting a liquid crystal device (not shown) according to the second embodiment of the present invention. FIG. 7A is a plan view of the light shielding member, and FIG. 7B is a cross-sectional view of the light shielding member. In FIG. 7B, the symbol T is the thickness of the light shielding member.

  As shown in FIG. 7, the light shielding member 160 of the liquid crystal device according to the present embodiment is configured such that an opening is not formed and the thickness T gradually increases as the liquid crystal layer 50 is approached. This is different from the light shielding member 60 of the liquid crystal device 100 according to the first embodiment described above. That is, the light transmittance of the light shielding member 160 according to the present embodiment is controlled by changing the film thickness T. Since the other points are the same as the configuration of the liquid crystal device 100 described above, the same elements as those in FIG.

  As shown in FIG. 7A, the light shielding member 160 has a rectangular shape in plan view, and is disposed at a position facing the sealing member 54 of the counter substrate 20. The light shielding member 160 is formed integrally with the counter substrate 20 (see FIG. 5).

  The light shielding member 160 is a metal film made of a metal material such as Al or chromium Cr, for example. The light shielding member 160 is configured so that the thickness T of the metal film gradually increases as it approaches the liquid crystal layer 50. As a result, the light shielding member 160 gradually decreases as the ultraviolet light transmittance (UV transmittance) that transmits ultraviolet light (UV) that cures the sealing member 54 approaches the liquid crystal layer 50.

  As shown in FIG. 7B, the thickness T of the light shielding member 160 is different between a portion near the liquid crystal layer 50 and a portion far from the liquid crystal layer 50. The light shielding member 160 is formed such that the upper surface is inclined obliquely with respect to the upper surface of the counter substrate 20. The relationship between the position where UV passes through the light shielding member 160 (the distance between the light shielding member 160 and the liquid crystal layer 50) and the thickness T of the light shielding member 160 at this position is a linear relationship. The portion of the light shielding member 160 that is farthest from the liquid crystal layer 50 is thick enough to transmit UV as it is.

  As a method for forming the light shielding member 160, for example, a metal thin film (first film) such as Al or Cr is first formed on the counter substrate 20 by vapor deposition, and then a metal thin film formed on the counter substrate 20 is formed. A mask is arranged on a part of the metal thin film (first film), and a metal thin film (second film) is formed on the exposed part of the metal thin film (first film) by vapor deposition. There is a method of laminating and forming. In addition, first, a metal film having a predetermined thickness is formed on the counter substrate 20 by vapor deposition. Next, a mask is disposed on the upper surface of the metal film formed on the counter substrate 20, and then the mask is disposed on the liquid crystal layer. There is a method of performing an etching process by changing the etching rate to a portion exposed from the mask of the metal film while shifting toward the side. There is also a method of forming a metal film by mechanical cutting.

  According to the liquid crystal device and the manufacturing method of the liquid crystal device of the present embodiment, the thickness of the light shielding member 160 gradually increases as it approaches the liquid crystal layer, and thus the amount of light that passes through the light shielding member 160 and enters the sealing member 54 Gradually decreases as the liquid crystal layer 50 is approached. Therefore, while reducing the amount of light incident on the portion of the sealing member 54 close to the liquid crystal layer 50, the amount of light incident on the portion of the sealing member 54 far from the liquid crystal layer 50 is increased to increase the amount of light incident on the sealing member 54. It can be cured sufficiently.

  In the liquid crystal device according to the present embodiment, the thickness of the light shielding member 160 gradually increases as it approaches the liquid crystal layer. However, the present invention is not limited to this. For example, a plurality of openings may be formed in the light shielding member 160. The density of the plurality of openings is formed so as to gradually decrease as the liquid crystal layer 50 is approached. Accordingly, the amount of light transmitted through the light shielding member can be freely changed according to the position by adjusting both the thickness of the light shielding member and the density of the plurality of openings.

  Further, in the liquid crystal device of the present embodiment, the relationship between the position where the UV passes through the light shielding member 160 and the thickness T of the light shielding member 160 at this position is a linear relationship, but is not limited thereto. For example, the light shielding member 160 may have a relationship (step relationship) in which the thickness of the light shielding member 160 increases stepwise as it approaches the liquid crystal layer.

(Third embodiment)
FIG. 8 is a perspective view showing a schematic configuration of a light shielding mask according to the third embodiment of the present invention, which is used in the method for manufacturing a liquid crystal device. As shown in FIG. 8, the light shielding member 173 according to this embodiment has the light shielding member 173 formed in the opening 172 of the light shielding mask body, in that the light shielding member 173 is disposed separately from the counter substrate 20. This is different from the light shielding member 60 of the liquid crystal device 100 according to the first embodiment described above. That is, the liquid crystal device according to the present embodiment is configured such that the light shielding member 173 is disposed in the opening 172 of the light shielding mask 170 used in the method for manufacturing the liquid crystal device, and the light shielding member 173 is not formed on the counter substrate 20. Since the other points are the same as the configuration of the liquid crystal device 100 described above, the same elements as those in FIG.

  As shown in FIG. 8, the light shielding mask 170 has a rectangular shape in plan view, and an opening 172 that transmits UV for curing the sealing member 54 is formed in a part of the light shielding plate 171 serving as the light shielding mask body. A light shielding member 173 is disposed in the opening 172. As the light shielding member 173, any of the light shielding members 60 and 160 described above can be applied. The light shielding plate 171 is formed, for example, by forming a film made of a metal material such as Al or Cr on a glass substrate. A position where the opening 172 is formed (a position where the light shielding member 173 is provided) is a position facing the sealing member 54 of the counter substrate 20.

FIG. 9 is a diagram illustrating an arrangement state of light shielding masks according to the third embodiment.
In FIG. 9, for the sake of convenience, the light shielding member 173 constituting the light shielding mask is shown, and the illustration of the light shielding plate 171 of the light shielding mask main body is omitted.

  As shown in FIG. 9, the light shielding member 173 is disposed so as to overlap a position facing the sealing member 54 of the counter substrate 20. In the present embodiment, the light shielding member 173 is disposed separately from and in close proximity to the counter substrate 20 (see FIG. 10).

  FIG. 10 is a diagram corresponding to FIG. 5 and showing the relationship between the light irradiation position and the light transmittance on the light shielding mask (light shielding member) 170 according to the third embodiment. FIG. 10 shows a process of curing the sealing material by irradiating UV from the outside of the light shielding mask 170 after arranging the light shielding mask 170 in the manufacturing process of the liquid crystal device. In FIG. 10, the cross section of the portion of the light shielding member 170 where the light shielding member 173 is formed (the portion where the opening 172 of the light shielding mask 170 is located) is shown upward, and the position where UV passes through the light shielding member 173 below. And the UV transmittance are illustrated. In this relationship diagram, the horizontal axis is the position where UV is transmitted, and the vertical axis is the UV transmittance.

  As shown in FIG. 10, when UV is irradiated from above the light shielding mask 170 in the step of curing the sealing material in the manufacturing process of the liquid crystal device, the UV is shielded from the light shielding member 173 disposed in the opening 172 of the light shielding mask 170. Pass through. A part of the light transmitted through the light shielding member 173 passes through the counter substrate 20 and is applied to the sealing member 54 and the portion of the liquid crystal layer 50 close to the sealing member 54. The remaining part of the light is applied to the portion of the sealing member 54 exposed from the edge of the counter substrate 20.

  When UV passes through the light blocking member 173, the UV transmittance gradually decreases as the position where the UV passes through the light blocking member 173 approaches the liquid crystal layer 50. The relationship between the position where UV passes through the light shielding member 173 and the UV transmittance at the position is a linear relationship.

  Thereby, a part of the light transmitted through the light shielding member 173 is irradiated to the sealing member 54 without omission. In addition, the light intensity is attenuated by the light-shielding member 173, although a part of the light is irradiated on the portion of the liquid crystal layer 50 near the sealing member 54. The remaining part of the light is irradiated to the portion of the sealing member 54 exposed from the edge of the counter substrate 20 without omission.

  According to the liquid crystal device manufacturing method of the present embodiment, the light shielding member 173 can be a separate component from the liquid crystal device. Further, the light shielding member 173 can be a part of the light shielding mask 170. Therefore, the configuration of the liquid crystal device is simplified.

(Electronics)
FIG. 11 is a schematic diagram illustrating an example of a projector as an electronic apparatus including the liquid crystal device according to the invention.
As shown in FIG. 11, the projector 800 includes a light source 810, dichroic mirrors 813 and 814, reflection mirrors 815, 816 and 817, an incident lens 818, a relay lens 819, an exit lens 820, light modulators 822, 823 and 824, a cross. A dichroic prism 825 and a projection lens 826 are provided.

  The light source 810 includes a lamp 811 such as a metal halide and a reflector 812 that reflects the light of the lamp. As the light source 810, besides a metal halide, an ultrahigh pressure mercury lamp, a flash mercury lamp, a high pressure mercury lamp, a deep UV lamp, a xenon lamp, a xenon flash lamp, or the like can be used.

  The dichroic mirror 813 transmits red light contained in white light from the light source 810 and reflects blue light and green light. The transmitted red light is reflected by the reflection mirror 817 and is incident on the light modulation unit 822 for red light. Of the blue light and green light reflected by the dichroic mirror 813, green light is reflected by the dichroic mirror 814 and is incident on the green light light modulation unit 823. The blue light is transmitted through the dichroic mirror 814, and the blue light is transmitted through the relay optical system 821 including the incident lens 818, the relay lens 819, and the emission lens 820 provided to prevent light loss due to a long optical path. Is incident on.

  In the light modulators 822 to 824, an incident side polarization element 840 and an emission side polarization element part 850 are arranged on both sides of the liquid crystal light valve 830. The liquid crystal light valve 830 uses the above-described liquid crystal device of the present invention. The incident side polarizing element 840 and the exit side polarizing element unit 850 are arranged so that their transmission axes are orthogonal to each other (crossed Nicols arrangement).

  The incident side polarization element 840 is a reflection type polarization element, and reflects light in a vibration direction orthogonal to the transmission axis.

  On the other hand, the exit-side polarizing element unit 850 includes a first polarizing element (pre-polarizing plate, pre-polarizer) 852 and a second polarizing element 854. As the first polarizing element 852, a polarizing element with high heat resistance is used. The second polarizing element 854 is a polarizing element using an organic material as a forming material. The exit side polarization element section 850 is an absorption type polarization element that absorbs light in the polarization direction orthogonal to the transmission axis.

  The three color lights modulated by the respective light modulation units 822 to 824 are incident on the cross dichroic prism 825. The cross dichroic prism 825 is formed by bonding four right-angle prisms. A dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are formed in an X shape at the interface. Yes. These dielectric multilayer films combine the three color lights to form light representing a color image. The synthesized light is projected onto a screen 827 by a projection lens 826 that is a projection optical system, and an image is enlarged and displayed.

  Since the projector 800 having the above-described configuration includes the above-described liquid crystal device of the present invention in the liquid crystal light valve 830, the projector 800 with high display quality and excellent reliability can be provided.

  The present invention is applicable not only when applied to a front projection type projector that projects from the side that observes the projected image, but also when applied to a rear projection type projector that projects from the side opposite to the side that observes the projected image. can do.

  The liquid crystal device of each of the embodiments is not limited to the liquid crystal light valve of the projector, but is a high-temperature polysilicon TFT liquid crystal (HTPS), a reflective high-temperature polysilicon TFT liquid crystal (R-HTPS), LCOS (Liquid crystal on silicon), It can be used as digital signage and EVF (Electronic View Finder). Mobile phones, electronic books, personal computers, digital still cameras, television receivers, viewfinder type or monitor direct-view type video tape recorders, car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, videophones It can be suitably used as an image display means for devices including a POS terminal, a touch panel, and the like. With such a configuration, an electronic device including a display unit with high display quality and excellent reliability can be provided.

The inventor conducted experiments to verify the effects of the liquid crystal device and the method of manufacturing the liquid crystal device of the present invention. Specifically, a high-temperature and high-humidity test is performed on the liquid crystal device having the light-shielding member of the present invention (a liquid crystal device manufactured using the light-shielding member according to the present invention), and display unevenness is not visually recognized on the display unit of the liquid crystal device. It is a demonstration. Hereinafter, the experimental results will be described.
As a first example of the liquid crystal device, a liquid crystal device having the light shielding member 60 according to the first embodiment described above was used. Further, as a second example, a liquid crystal device manufactured using the light shielding member 170 according to the third embodiment described above was used.
As a comparative example of the liquid crystal device, a liquid crystal device not having the light shielding member according to the present invention (a liquid crystal device not manufactured using the light shielding member according to the present invention) was used.
The high temperature and high humidity test was performed under the conditions of a temperature of 60 ° C., a humidity of 90%, and a test time of 56 hours.
Table 1 shows the test results for these three types of liquid crystal devices.

  From Table 1, in the liquid crystal devices of the first and second examples, display unevenness was not visually recognized on the display unit. On the other hand, in the liquid crystal device of the comparative example, display unevenness was visually recognized on the display unit.

  That is, according to the liquid crystal device having the light shielding member of the present invention (the liquid crystal device manufactured using the light shielding member according to the present invention), in the curing process of the sealing material, the deterioration of the liquid crystal due to ultraviolet irradiation is suppressed, and the liquid crystal device It has been found that display unevenness can be suppressed from being visually recognized on the display unit of the apparatus.

DESCRIPTION OF SYMBOLS 10 ... Element substrate, 20 ... Opposite substrate, 50 ... Liquid crystal layer, 52 ... Sealing member, 54 ... Sealing member, 55 ... Injection port, 60, 160, 173 ... Light shielding member, 61 ... Metal film, 62 ... Opening, 70, 170 ... light shielding mask, 72 ... opening, 100 ... liquid crystal device, T ... thickness of metal film

Claims (16)

A pair of substrates disposed opposite to each other with a liquid crystal layer interposed therebetween;
A frame-shaped sealing member having a liquid crystal injection port constituting the liquid crystal layer and surrounding the liquid crystal layer sandwiched between the pair of substrates;
A sealing member made of a photocurable resin for sealing the injection port;
A light shielding member disposed at a position facing the sealing member of at least one of the pair of substrates,
The substrate on which the light shielding member is disposed has a light transmission property that transmits light for curing the sealing member,
The liquid crystal device according to claim 1, wherein the light shielding member disposed at a position facing the sealing member has a light transmittance that transmits the light gradually decreases toward the liquid crystal layer.   The light-shielding member whose light transmittance is gradually reduced is a region in a range between the position facing the sealing member and the position facing the liquid crystal layer adjacent to the sealing member. The liquid crystal device according to claim 1, wherein the liquid crystal device is provided.   The light shielding member whose light transmittance is gradually reduced is disposed so as not to overlap an end portion of the sealing member opposite to the liquid crystal layer when viewed from the normal direction of the upper surface of the substrate. The liquid crystal device according to claim 1, wherein the liquid crystal device is a liquid crystal device.   The light shielding member whose light transmittance is gradually reduced is a region in a range where both the position facing the sealing member and the position facing the sealing member adjacent to the sealing member The liquid crystal device according to claim 1, wherein the liquid crystal device is provided on the liquid crystal device.   The said light shielding member is comprised so that several opening part may be formed in a metal film, and it is comprised so that the density of these several opening part may become small gradually as it approaches the said liquid-crystal layer. 5. The liquid crystal device according to any one of 4.   The light shielding member is made of a metal film, and is configured such that the thickness of the metal film gradually increases as it approaches the liquid crystal layer, whereby the light transmittance gradually decreases as it approaches the liquid crystal layer. The liquid crystal device according to claim 1, wherein the liquid crystal device is a liquid crystal device.   The sealing member is arranged so that an end opposite to the liquid crystal layer is exposed from an edge of the one substrate when viewed from the normal direction of the upper surface of the substrate. The liquid crystal device according to any one of 1 to 6.   The liquid crystal device according to claim 1, wherein the photocurable resin is an ultraviolet curable resin. A method of manufacturing a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates,
Forming a frame-shaped sealing member as viewed from the normal direction of the upper surface of the substrate, having a liquid crystal injection port constituting the liquid crystal layer on one or the other of the pair of substrates;
Bonding the one substrate and the other substrate so that they face each other with the seal member interposed therebetween;
Injecting the liquid crystal from the injection port into a region surrounded by the pair of substrates and the sealing member, and sealing the injection port with a sealing member made of a photocurable resin;
At least one of the pair of substrates has a light transmittance that transmits the light in the liquid crystal layer at a position facing the sealing member of a substrate that transmits light that cures the sealing member. A step of arranging a light shielding member that gradually decreases as it approaches,
Irradiating the light from the outside of the substrate on which the light shielding member is disposed toward the sealing member via the light shielding member;
A method for manufacturing a liquid crystal device, comprising:   10. The light-shielding member is formed by forming a plurality of openings in a metal film, and the density of the plurality of openings is configured to gradually decrease as the liquid crystal layer is approached. A manufacturing method of the liquid crystal device according to the description.   The light shielding member is made of a metal film, and is configured such that the thickness of the metal film gradually increases as it approaches the liquid crystal layer, whereby the light transmittance gradually decreases as it approaches the liquid crystal layer. 11. The method for manufacturing a liquid crystal device according to claim 9, wherein the liquid crystal device is manufactured.   The method for manufacturing a liquid crystal device according to claim 9, wherein the light shielding member is formed integrally with at least one of the pair of substrates. A step of arranging a light shielding mask in which an opening for transmitting the light is formed;
The area of the region where the opening of the light shielding mask and the light shielding member overlap is smaller than the area of the light shielding member,
The method of manufacturing a liquid crystal device according to claim 12, wherein the light shielding member has a light transmittance that transmits the light gradually decreases in the region as it approaches the liquid crystal layer.   12. The method of manufacturing a liquid crystal device according to claim 9, wherein the light shielding member is disposed separately from and in close proximity to at least one of the pair of substrates. A step of arranging a light shielding mask in which an opening for transmitting the light is formed;
The method of manufacturing a liquid crystal device according to claim 14, wherein the light shielding member is disposed in the opening of the light shielding mask.   An electronic apparatus comprising the liquid crystal device according to claim 1.

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