JP2013160975A - Liquid crystal device, manufacturing method of the same and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal device capable of efficiently trapping impurities in liquid crystal, and further to provide a manufacturing method of the liquid crystal device and an electronic apparatus.SOLUTION: A liquid crystal device 100 includes: a first seal section 41 for bonding a pair of substrates disposed opposite to each other with a predetermined gap therebetween; a first injection port 42 provided on the first seal section 41 for injecting liquid crystal between the pair of substrates bonded; a second seal section 43 that is disposed more inward than the first seal section 41, has a second injection port 44 communicating with a pixel region E at side portion sides other than a side portion where the first injection port 42 of the first seal section 41 is provided and constitutes a roundabout approach 45 of the liquid crystal between the first seal section 41 and the second seal section 43; and inorganic alignment films individually provided at liquid crystal layer 50 sides of the pair of substrates. In at least one of the pair of substrates, the inorganic alignment film of the roundabout approach 45 has more portions in which alignment treatment directions oriented towards a direction against an approach direction of the liquid crystal in the roundabout approach 45 than those of the inorganic alignment film in the pixel region E.

Description

  The present invention relates to a liquid crystal device, a method for manufacturing the liquid crystal device, and an electronic apparatus including the liquid crystal device.

  The liquid crystal device includes a liquid crystal layer sandwiched between a pair of substrates. When impurities are mixed in the liquid crystal layer in the manufacturing process of the liquid crystal device, there are problems related to reliability such as initial display defects due to the impurities and difficulty in ensuring display quality over a long period of time such as burn-in. There was a risk of it occurring.

  In order to reduce the contamination of the liquid crystal layer due to such impurities, Patent Documents 1 to 3 provide a dedicated inflow path for injecting liquid crystal between a pair of substrates, and the impurity in the alignment film of the inflow path A method is disclosed in which impurities are trapped to make it difficult for impurities to reach the display region.

JP-A-1-237620 JP-A-6-175142 JP 2002-350882 A

However, for example, when the liquid crystal device is downsized, it becomes difficult to provide a sufficient dedicated inflow path, and there is a problem that impurities cannot be efficiently trapped in the alignment film in the inflow path.
In addition, when the polyimide-based organic alignment film shown in the above-mentioned patent document is used as an alignment film for trapping impurities, the organic alignment film is easily deteriorated by light from outside light or a lighting device, and the organic alignment film is deteriorated. As a result, the impurities once trapped may diffuse into the display region, resulting in a reduction in display quality.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A liquid crystal device according to this application example includes a pair of substrates, a first seal portion that bonds the pair of substrates opposed to each other at a predetermined interval, and the pair of bonded substrates A first injection port provided in the first seal portion for injecting liquid crystal into the first seal portion, and a side disposed inside the first seal portion and provided with the first injection port of the first seal portion A second seal portion having a second inlet that communicates with the pixel region on the side of the side other than the portion, and forming a detour approach path for the liquid crystal between the first seal portion and the pair of substrates. An inorganic alignment film provided on each of the liquid crystal sides, and in at least one of the pair of substrates, the inorganic alignment film in the bypass approach path is more detoured than the inorganic alignment film in the pixel region. Resistant to the liquid crystal entering direction in the path And having many parts alignment direction is oriented in the direction that.

According to this configuration, the inorganic alignment film in the bypass approach path has more portions in which the alignment processing direction is directed in a direction against the liquid crystal entry direction than in the pixel region. Therefore, when the liquid crystal entry speed is reduced and the liquid crystal contains impurities compared to the case where the first seal portion and the second seal portion simply constitute the liquid crystal bypass approach route. In this case, the impurities can be efficiently trapped in the inorganic alignment film.
In addition, since the inorganic alignment film is less likely to be deteriorated by the irradiated light as compared with the case where an organic alignment film such as polyimide is used, the impurities once trapped can be prevented from diffusing by the light irradiation.
Therefore, it is difficult for impurities to diffuse into the pixel region, an initial display defect due to the impurities can be reduced, and a liquid crystal device having excellent light resistance and high reliability can be provided.
Note that the impurities referred to here refer to inorganic substances such as metals, organic substances such as resins, mixtures thereof, or ionic substances that are not originally included in the liquid crystal itself.

Application Example 2 In the liquid crystal device according to the application example described above, in each of the pair of substrates, the inorganic alignment film in the bypass approach path resists an entrance direction of the liquid crystal in the bypass approach path. It is preferable to have a portion in which the orientation processing direction is oriented in the direction.
According to this configuration, since the approach speed reduction process of the liquid crystal in the bypass approach path is performed on each of the inorganic alignment films of the pair of substrates, impurities are trapped more efficiently in the bypass approach path.

Application Example 3 In the liquid crystal device according to the application example described above, the inorganic alignment film in the bypass approach path has a portion in which the alignment treatment direction is opposite to the liquid crystal entrance direction in the bypass approach path. It is preferable.
According to this configuration, the approach speed of the liquid crystal in the bypass approach path is likely to decrease, and impurities are trapped more efficiently.

Application Example 4 In the liquid crystal device according to the application example, the pixel region is substantially rectangular in plan view, and the first injection port and the second injection port are portions along the long side of the pixel region. It is preferable that the alignment treatment direction of the inorganic alignment film in a portion along the short side of the pixel region in the detour approach path is opposite to the liquid crystal entrance direction.
According to this configuration, the liquid crystal entering from the first injection port wraps around the portion along the long side of the pixel region, and then the alignment treatment direction of the inorganic alignment film is directed in the opposite direction to the liquid crystal entering direction. Enter the detour approach route on the short side. Therefore, compared with the case where the first injection port exists in the portion along the short side of the pixel region, the liquid crystal entry speed is reached before entering the portion where the alignment treatment direction is opposite to the liquid crystal entrance direction. Can be reduced. That is, impurities are trapped more efficiently.

Application Example 5 In the liquid crystal device according to the application example, one of the pair of substrates includes a plurality of pixel electrodes arranged in the pixel region and a transistor provided corresponding to each pixel electrode. Preferably, the one substrate has a portion in which the alignment treatment direction of the inorganic alignment film in the bypass approach path is in a direction opposite to the liquid crystal entrance direction in the bypass approach path.
According to this configuration, the wiring connected to the pixel circuit is disposed in the peripheral portion of the pixel region of the one substrate on which the pixel circuit such as the pixel electrode and the transistor is formed, and the surface state thereof tends to be uneven. Therefore, irregularities are also generated on the surface of the inorganic alignment film formed on the surface having irregularities, and the substantial surface area of the inorganic alignment film in the bypass approach path is increased, so that impurities are effectively trapped.

Application Example 6 In the liquid crystal device according to the application example, the inorganic alignment film is obtained by depositing an inorganic material by a vapor deposition method, and the inorganic alignment film in the pixel region is formed on at least one of the pair of substrates. The film forming direction of the material is different from the film forming direction of the inorganic material in the detour approach path.
According to this configuration, it is possible to reduce the approach speed of the liquid crystal in the detour approach path compared to the pixel area.

Application Example 7 In the liquid crystal device according to the application example, the inorganic alignment film is an aggregate of columnar crystals obtained by crystallizing an inorganic material on a substrate by a vapor deposition method, The inorganic alignment film of the bypass approach path in at least one of the substrates is characterized in that the growth direction of the columnar crystals is in a direction opposite to the entrance direction of the liquid crystal.
According to this configuration, it is possible to further reduce the approach speed of the liquid crystal in the bypass approach path compared to the pixel area.

  Application Example 8 A method for manufacturing a liquid crystal device according to this application example is the first inorganic alignment film in which the first inorganic alignment film is formed in at least the pixel region on the side facing the liquid crystal layer of one of the pair of substrates. A forming step, a second inorganic alignment film forming step of forming a second inorganic alignment film in at least the pixel region on the side facing the liquid crystal layer of the other substrate of the pair of substrates, and any of the pair of substrates On the other hand, a step of forming a first seal portion having a first inlet, and a portion inside the first seal portion, other than a side portion provided with the first inlet of the first seal portion. Forming a second seal part having a second injection port communicating with the pixel region on the side of the liquid crystal and forming a detour approach path for the liquid crystal with the first seal part; and The first seal portion is arranged by opposingly arranging the substrates at a predetermined interval. A step of bonding with the second seal portion, and a liquid crystal injection step of injecting liquid crystal into the gap between the pair of substrates from the first injection port via the bypass approach path using a vacuum injection method. In at least one of the first inorganic alignment film formation step and the second inorganic alignment film formation step, the direction in which the alignment processing direction opposes the liquid crystal entering direction in the bypass approach path is more than the pixel region. A third inorganic alignment film forming step of forming a third inorganic alignment film in the bypass approach path is included so as to increase.

  According to this method, compared with the case where the first inorganic alignment film or the second inorganic alignment film is formed in the bypass approach path, the liquid crystal entrance speed in the bypass approach path is reduced by forming the third inorganic alignment film. be able to. Therefore, when impurities are included in the liquid crystal, the impurities can be efficiently trapped in the third inorganic alignment film. Therefore, it is difficult to diffuse impurities in the pixel region, the initial display defect due to the impurities is reduced, and a highly reliable liquid crystal device including an inorganic alignment film having excellent light resistance as compared with the organic alignment film. Can be manufactured.

Application Example 9 In the method for manufacturing a liquid crystal device according to the application example, it is preferable that the first inorganic alignment film or the second inorganic alignment film is formed after the third inorganic alignment film is formed.
According to this method, even if a part of the third inorganic alignment film is formed in the pixel region, the first inorganic alignment film or the second inorganic alignment film is subsequently formed. Can be realized reliably.

Application Example 10 In the method of manufacturing a liquid crystal device according to the application example, the liquid crystal injecting step is performed in a state where the pair of substrates are held substantially horizontally, and the third inorganic alignment film forming step is performed in the pair. Of these substrates, it is preferable to be performed on the substrate located on the lower side in the liquid crystal injection step.
According to this method, in addition to the effect of the third inorganic alignment film, the action of gravity can be effectively used to reduce the speed of liquid crystal entering in the bypass approach path.

Application Example 11 In the method for manufacturing a liquid crystal device according to the application example described above, the substrate on which the third inorganic alignment film forming step is performed corresponds to a plurality of pixel electrodes arranged in the pixel region and the pixel electrodes. And a transistor.
According to this method, the wiring connected to the pixel circuit is formed in the peripheral portion of the pixel region of the substrate on which the pixel circuit such as the pixel electrode and the transistor is formed, and the surface state is likely to be uneven. Accordingly, the surface of the third inorganic alignment film formed on the surface having the unevenness is also uneven, and the substantial surface area of the third inorganic alignment film in the bypass approach path is increased, thereby effectively trapping impurities. it can.

Application Example 12 In the method for manufacturing a liquid crystal device according to the application example, the third inorganic alignment film is an aggregate of columnar crystals obtained by crystallizing an inorganic material on a substrate using a vapor phase growth method. The third inorganic alignment film forming step is characterized in that the third inorganic alignment film is formed so that the columnar crystal grows in a direction against the liquid crystal entering direction.
According to this method, compared with the pixel region in which the first inorganic alignment film or the second inorganic alignment film is formed, it is possible to further reduce the liquid entry speed in the detour approach path in which the third inorganic alignment film is formed. it can.

Application Example 13 An electronic apparatus according to this application example includes the liquid crystal device according to the application example described above.
According to this configuration, it is possible to provide an electronic apparatus including a liquid crystal device that has excellent light resistance and high reliability while reducing initial display defects due to impurities.

(A) is a schematic plan view which shows the structure of the liquid crystal device of 1st Embodiment, (b) is a schematic sectional drawing in alignment with the H-H 'line | wire of the liquid crystal device shown to (a). (A) And (b) is a schematic plan view which shows the alignment process direction of the inorganic alignment film in the liquid crystal device of 1st Embodiment. The schematic sectional drawing which shows the orientation state of the inorganic alignment film and liquid crystal molecule in a pixel area. The schematic sectional drawing which shows the orientation state of the inorganic oriented film in a detour approach path | route. 6 is a flowchart showing a method for manufacturing a liquid crystal device. Schematic which shows the structure of an oblique vapor deposition apparatus. (A) And (b) is a schematic plan view which shows the inorganic alignment film formation process by the side of an element substrate. (A) And (b) is the schematic explaining a bonding process and a liquid-crystal injection | pouring and sealing process. (A) is a schematic plan view which shows the structure of a mother board | substrate, (b) is a schematic sectional drawing in alignment with the J-J 'line of (a). The schematic plan view which shows the structure of the liquid crystal device of 2nd Embodiment. (A) And (b) is a schematic plan view which shows the alignment process direction of the inorganic alignment film in the liquid crystal device of 2nd Embodiment. Schematic which shows the structure of the projection type display apparatus as an electronic device. The schematic sectional drawing which shows the growth direction of the column of the inorganic alignment film in the detour approach path | route of the modification 1.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. Note that the drawings to be used are appropriately enlarged or reduced so that the part to be described can be recognized.

  In the following embodiments, for example, when “on the substrate” is described, the substrate is disposed so as to be in contact with the substrate, or is disposed on the substrate via another component, or the substrate. It is assumed that a part is arranged so as to be in contact with each other and a part is arranged via another component.

(First embodiment)
In this embodiment, an active matrix liquid crystal device including a thin film transistor (TFT) as a pixel switching element will be described as an example. This liquid crystal device can be suitably used as, for example, a light modulation element (liquid crystal light valve) of a projection type display device (liquid crystal projector) described later.

<Liquid crystal device>
First, the liquid crystal device of this embodiment will be described with reference to FIGS. 1A is a schematic plan view illustrating the configuration of the liquid crystal device according to the first embodiment, FIG. 1B is a schematic cross-sectional view taken along the line HH ′ of the liquid crystal device illustrated in FIG. (A) And (b) is a schematic plan view which shows the alignment process direction of the inorganic alignment film in the liquid crystal device of 1st Embodiment, FIG. 3 is a schematic sectional drawing which shows the alignment state of the inorganic alignment film and a liquid crystal molecule in a pixel area | region, FIG. 4 is a schematic cross-sectional view showing the alignment state of the inorganic alignment film in the detour approach path.

  As shown in FIGS. 1A and 1B, a liquid crystal device 100 according to the present embodiment includes an element substrate 10 and a counter substrate 20 that are disposed to face each other, and a liquid crystal layer 50 that is sandwiched between the pair of substrates. . The element substrate 10 and the counter substrate 20 are made of, for example, a transparent quartz substrate or glass substrate.

  The element substrate 10 as one substrate in the present invention is larger than the counter substrate 20 as the other substrate, and both substrates are a first seal portion 41 and a first seal portion 41 arranged along the outer edge of the counter substrate 20. The liquid crystal layer 50 is configured by adhering via a second seal portion 43 disposed on the inner side and having a negative dielectric anisotropy sealed in the gap. For the first seal portion 41 and the second seal portion 43, for example, an adhesive such as a thermosetting or ultraviolet curable epoxy resin is employed. The first seal portion 41 and the second seal portion 43 are mixed with a spacer (not shown) for keeping the distance between the pair of substrates constant.

  A pixel region E in which a plurality of pixels P are arranged is provided inside the second seal portion 43. Further, a parting portion 21 is provided between the first seal portion 41 and the pixel region E so as to surround the pixel region E. The parting portion 21 is made of, for example, a light shielding metal or metal oxide. The pixel region E may include dummy pixels arranged so as to surround the plurality of pixels P in addition to the plurality of pixels P contributing to display. Although not shown in FIG. 1, a light shielding portion (black matrix; BM) that divides a plurality of pixels P in a plane in the pixel region E is provided on the counter substrate 20.

  A data line driving circuit 101 is provided between the element substrate 10 and the first seal portion 41 along the first side portion. In addition, an inspection circuit 103 is provided between the first seal portion 41 and the second seal portion 43 along the second side portion facing the first side portion. Further, the scanning line driving circuit 102 is provided between the first seal portion 41 and the second seal portion 43 along the third and fourth sides that are orthogonal to the first side and face each other. . Between the first seal portion 41 and the second seal portion 43 on the second side, a plurality of wirings 105 that connect the two scanning line driving circuits 102 are provided.

  Wirings connected to the data line driving circuit 101 and the scanning line driving circuit 102 are connected to a plurality of external connection terminals 104 arranged along the first side. In the following description, the direction along the first side is defined as the X direction, and the direction along the third side is defined as the Y direction. The arrangement of the inspection circuit 103 is not limited to this, and the inspection circuit 103 may be provided between the first seal portion 41 and the second seal portion 43 between the data line driving circuit 101 and the pixel region E.

  As shown in FIG. 1B, a light-transmitting pixel made of a transparent conductive film such as ITO (Indium Tin Oxide) provided for each pixel P on the surface of the element substrate 10 on the liquid crystal layer 50 side. An electrode 15 and a thin film transistor (hereinafter referred to as TFT) 30 as a switching element, a signal wiring, and an inorganic alignment film 18 covering these are formed. In addition, a light shielding structure is employed that prevents light from entering the semiconductor layer in the TFT 30 to make the switching operation unstable. The element substrate 10 as a substrate in the present invention includes at least a base material 10a, a pixel electrode 15, a TFT 30, a signal wiring, and an inorganic alignment film 18 formed on the base material 10a.

  The counter substrate 20 disposed to face the element substrate 10 includes at least a base material 20a, a parting part 21 formed on the base material 20a, a planarization layer 22 formed so as to cover the part, and a planarization layer. A common electrode 23 provided so as to cover 22, and an inorganic alignment film 24 covering the common electrode 23.

  The parting part 21 surrounds the pixel region E as shown in FIG. 1A and is provided at a position overlapping the scanning line driving circuit 102 and the inspection circuit 103 in plan view. Thus, the light incident on the peripheral circuit including these drive circuits from the counter substrate 20 side is shielded, and the peripheral circuit is prevented from malfunctioning due to the light. Further, unnecessary stray light is shielded from entering the pixel region E to ensure high contrast in the display of the pixel region E.

  The planarization layer 22 is made of an inorganic material such as silicon oxide, for example, and is provided so as to cover the parting portion 21 with light transmittance. As a method for forming such a planarizing layer 22, for example, a method of forming a film using a plasma CVD method or the like can be given.

  The common electrode 23 is made of, for example, a transparent conductive film such as ITO (Indium Tin Oxide), covers the planarization layer 22, and as shown in FIG. 1 (a), the vertical conduction portions 106 provided at the four corners of the counter substrate 20. Thus, the wiring is electrically connected to the wiring on the element substrate 10 side.

  The inorganic alignment film 18 covering the pixel electrode 15 and the inorganic alignment film 24 covering the common electrode 23 are formed by depositing an inorganic material such as SiOx (silicon oxide) using a vapor phase growth method (evaporation method, sputtering method, etc.). The liquid crystal molecules having negative dielectric anisotropy obtained in the above are aligned substantially perpendicularly to the film surface.

  Such a liquid crystal device 100 is a transmission type, and adopts an optical design of a normally white mode in which the pixel P is brightly displayed when not driven and a normally black mode in which the pixel P is darkly displayed when not driven. Polarizing elements are arranged and used according to the optical design on the light incident side and the light exit side, respectively. In this embodiment, a normally black mode is employed.

As described above, the liquid crystal device 100 according to the present embodiment employs a double seal structure in which a pair of substrates are bonded by the first seal portion 41 and the second seal portion 43. A first inlet 42 is provided on the long side portion of the outer first seal portion 41 along the data line driving circuit 101. A second injection port 44 is provided on the long side portion of the inner second seal portion 43 along the inspection circuit 103. The first seal portion 41 and the second seal portion 43 constitute a liquid crystal bypass approach path 45 surrounding the pixel region E. As will be described in detail later, a liquid crystal (liquid crystal molecule) having negative dielectric anisotropy is injected from the first injection port 42 by using a vacuum injection method, and passes from the second injection port 44 to the pixel region via a detour entry path 45. E is filled. The first inlet 42 is sealed with a sealing material 108 made of, for example, an ultraviolet curable acrylic resin.
Further, when impurities are contained in the liquid crystal, the impurities can be effectively trapped by the inorganic alignment films 18 and 24 in the pixel region E so that the impurities can be efficiently trapped by the inorganic alignment film in the bypass approach path 45 when the liquid crystal is injected. The alignment state of the inorganic alignment film in the approach path 45 is varied.
The “impurity” refers to an inorganic substance such as a metal that is not originally included in the liquid crystal itself, an organic substance such as a resin, a mixture thereof, or an ionic substance thereof. It refers to what is contained in the previous liquid crystal.

  2A and 2B are schematic plan views showing the alignment treatment direction of the inorganic alignment film in the liquid crystal device of the first embodiment. Specifically, as shown in FIG. 2A, on the element substrate 10 side, the inorganic alignment film 18 as the first inorganic alignment film in the present invention is formed in the first region E1 that is slightly larger than the pixel region E. Has been. The alignment treatment direction of the inorganic alignment film 18 is a direction indicated by a solid line arrow from the upper right to the lower left of the rectangular base material 10a. An angle θa formed by the Y direction and the alignment processing direction is approximately 45 degrees. The alignment treatment direction substantially matches the orientation in the film forming direction when the inorganic alignment film 18 is formed.

  An inorganic alignment film 19 as a third inorganic alignment film in the present invention is formed in a second region E2 that is a peripheral region surrounding the first region E1. The alignment treatment direction of the inorganic alignment film 19 is a direction indicated by a solid line arrow extending upward from below the base material 10a along the Y direction.

  As shown in FIG. 2B, on the counter substrate 20 side, an inorganic alignment film 24 as a second inorganic alignment film in the present invention is formed in a third region E3 that is slightly larger than the pixel region E. The alignment treatment direction of the inorganic alignment film 24 is a direction indicated by a dashed arrow from the lower left to the upper right of the rectangular base material 20a. An angle θa formed by the Y direction and the alignment processing direction is approximately 45 degrees, similarly to the element substrate 10 side. The alignment treatment direction substantially matches the orientation in the film formation direction when the inorganic alignment film 24 is formed.

In the fourth region E4, which is a peripheral region surrounding the third region E3, an inorganic alignment film 25 as a third inorganic alignment film in the present invention is formed. The alignment treatment direction of the inorganic alignment film 25 is a direction indicated by a broken-line arrow that extends upward from below the base material 20a along the Y direction.
2B shows the alignment treatment direction of the inorganic alignment films 24 and 25 when the counter substrate 20 is viewed from the side opposite to the liquid crystal layer 50. FIG.

  The inorganic alignment film 18 on the element substrate 10 side and the inorganic alignment film 24 on the counter substrate 20 side have alignment processing directions reversed by 180 degrees from each other, and are called uniaxial vertical alignment processing. Each orientation processing direction is not limited to the above-described direction. For example, the alignment treatment directions of the inorganic alignment film 18 and the inorganic alignment film 24 may be interchanged. In addition, as an alignment process direction from the upper left to the lower right or from the lower right to the upper left of the substrate, an angle θa formed by the alignment process direction and the Y direction may be 45 degrees.

  FIG. 3 shows the alignment state of the liquid crystal molecules LC in the inorganic alignment films 18 and 24 and the liquid crystal layer 50 in the pixel region E. As shown in FIG. 3, the inorganic alignment film 18 covering the pixel electrode 15 of the element substrate 10 is an aggregate of columnar crystals 18a of silicon oxide obtained by, for example, oblique deposition of silicon oxide. The angle θb formed by the normal line of the substrate 10a and the film forming direction indicated by the solid line arrow is approximately 45 degrees. The angle θc formed by the direction in which the columnar crystal 18a grows from the surface of the substrate 10a and the normal line is not necessarily the same as the angle θb, and in this case, it is approximately 20 degrees. The liquid crystal molecules LC having negative dielectric anisotropy on the film surface of the inorganic alignment film 18 have a pretilt in which the major axis is inclined toward the film forming direction and are substantially vertically aligned. The pretilt angle θp formed by the normal of the substrate 10a and the long axis of the liquid crystal molecules LC is about 4 degrees. In other words, the growth angle θc of the columnar crystal 18a with respect to the base material 10a, that is, the angle θb during film formation is controlled so that the pretilt angle θp of the liquid crystal molecules LC is about 4 degrees.

  Similarly, the inorganic alignment film 24 covering the common electrode 23 on the counter substrate 20 side is an aggregate of columnar crystal bodies 24a of silicon oxide obtained by, for example, oblique deposition of silicon oxide. An angle θb formed by the normal line of the base material 20a and the film forming direction indicated by the dashed arrow is approximately 45 degrees. The liquid crystal molecules LC are substantially vertically aligned with a pretilt on the film forming direction side with respect to the film surface (columnar crystal 24a) of the inorganic alignment film 24. The growth directions of the columnar crystals 18a and 24a are parallel to each other in a sectional view and do not intersect. Hereinafter, the columnar crystal will be described as a column.

A structure in which the liquid crystal layer 50 is sandwiched between a pair of substrates having the inorganic alignment films 18 and 24 is referred to as a liquid crystal panel 110. Polarizing elements 81 and 82 are disposed and used on the light incident side and the light emitting side of the liquid crystal panel 110, respectively.
The predetermined direction of the pretilt of the liquid crystal molecules LC viewed from the normal direction of the substrate 10a (or the substrate 20a) is oblique in the inorganic alignment films 18 and 24 as shown in FIGS. This is the same as the planar film formation direction of vapor deposition. The predetermined direction of the uniaxial vertical alignment process is appropriately set based on the optical design conditions of the liquid crystal device 100. In the present embodiment, the predetermined direction intersects at an angle of 45 ° with respect to the transmission axis or absorption axis of the polarizing elements 81 and 82 arranged in the light incident direction and the light emitting direction. Thus, the maximum contrast is obtained when the liquid crystal layer 50 is driven by applying a predetermined potential between the pixel electrode 15 and the common electrode 23.

  On the other hand, in the state of the inorganic alignment films 19 and 25 in the bypass approach path 45, as shown in FIG. 4, the growth directions of the columns 19a and 25a intersect each other in a sectional view. Accordingly, in the detour approach path 45 of the liquid crystal along the short side of the liquid crystal device 100, the liquid crystal is injected (entered) in the direction indicated by the arrow in FIG. 4, and therefore the growth direction of the columns 19a and 25a. The direction in which the liquid crystal enters is opposite (the direction in which the injection resistance of the liquid crystal increases). That is, the columns 19a and 25a are inclined in the direction opposite to the liquid crystal entering direction. In the detour approach path 45 of the liquid crystal along the long side of the liquid crystal device 100, the liquid crystal enters in the normal direction with respect to the paper surface of FIG. Therefore, the approach speed of the liquid crystal on the short side of the bypass approach path 45 is slower than that on the long side. Further, by making the alignment processing directions in the pixel region E and the detour approach path 45 different from those in the case where the inorganic alignment films 18 and 24 are formed in a region including the detour approach path 45 in a plane, the detour approach is performed. The approach speed of the liquid crystal in the path 45 can be decreased. By slowing down (decreasing) the entrance speed of the liquid crystal, if the liquid crystal contains impurities, the impurities are sufficiently trapped in the inorganic alignment films 19 and 25 and the impurities diffuse into the pixel region E. Can be suppressed.

  From the viewpoint of reducing the approach speed of the liquid crystal in the bypass approach path 45, a portion in which the alignment treatment direction of the inorganic alignment films 19 and 25 in the bypass approach path 45 faces the direction opposite to the entrance direction of the liquid crystal is the pixel region E. Preferably more than As shown in FIG. 2, it is more preferable to have a portion facing in the opposite direction to the liquid crystal entering direction.

  In addition, as shown in FIG. 4, it is preferable to form the inorganic alignment films 19 and 25 so that the growth direction of the columns 19a and 25a opposes the liquid crystal ingress direction.

  Further, the detour approach path 45 constituted by the first seal portion 41 and the second seal portion 43 is a scanning line provided on the element substrate 10 as shown in FIG. 1A or 2A. It includes a region in which a peripheral circuit such as a drive circuit 102, an inspection circuit 103, or a wiring for electrically connecting them is formed. The region where the peripheral circuit is provided is a region that does not contribute to display, and is more uneven than the pixel region E on the surface of the element substrate 10. Therefore, although not shown in FIG. 4, the surface of the inorganic alignment film 19 on the liquid crystal layer 50 side in the bypass approach path 45 is larger than the surface of the inorganic alignment film 18 of FIG. Since the substantial surface area of the inorganic alignment film 19 is increased, the trapping ability for impurities is increased. In particular, the short side of the bypass approach path 45 includes regions where the scanning line driving circuits 102 are respectively formed, and the alignment processing direction is opposite to the liquid crystal entrance direction, so that it is compared with the long side. Improves impurity trapping capability.

<Method for manufacturing liquid crystal device>
Next, a method for manufacturing the liquid crystal device 100 of the present embodiment will be described with reference to FIGS. The pixel electrode 15, the TFT 30, the data line driving circuit 101, the scanning line driving circuit 102, the inspection circuit 103, the signal wiring, and the like on the element substrate 10 can be formed using a known method. Similarly, the parting part 21, the planarization layer 22, and the common electrode 23 in the counter substrate 20 can also be formed using a known method. Here, a method for forming the inorganic alignment films 18, 19, 24, and 25, which is a characteristic part of the present invention, will be described.

  FIG. 5 is a flowchart showing a method for manufacturing the liquid crystal device. As shown in FIG. 5, in the method for manufacturing the liquid crystal device 100 of the present embodiment, on the element substrate 10 side, the pixel electrode forming step (step S1), the third inorganic alignment film forming step (step S2), and the first It has an inorganic alignment film formation process (step S3) and a seal formation process (step S4). On the counter substrate 20 side, a common electrode forming process (step S5), a fourth inorganic alignment film forming process (step S6), and a second inorganic alignment film forming process (step S7) are included. In addition, the step of bonding the element substrate 10 and the counter substrate 20 (step S8), and the liquid crystal injection / sealing for injecting and sealing the liquid crystal using the vacuum injection method between the bonded element substrate 10 and the counter substrate 20 are performed. And a sealing step (step S9).

  As described above, the step of forming the pixel electrode 15 and the common electrode 23 (step S1 and step S5) is a known method of forming a transparent conductive film such as ITO and patterning it into a desired shape by photolithography. Can be applied.

In the step of forming the first to fourth inorganic alignment films (steps S2, S3, S6, S7), a method of forming an inorganic material such as silicon oxide using a vapor phase growth method can be employed.
FIG. 6 is a schematic diagram showing the configuration of the oblique deposition apparatus. In the oblique vapor deposition method which is one of the vapor phase growth methods, for example, an oblique vapor deposition apparatus 300 as shown in FIG. 6 is used.

  The oblique vapor deposition apparatus 300 includes a chamber 301 capable of reducing the pressure inside, and a vapor deposition source 302 provided at the bottom of the chamber 301. In the vapor deposition source 302, an inorganic material such as silicon oxide constituting the inorganic alignment film is mounted as, for example, a pellet, which is heated and evaporated under reduced pressure. A plurality of workpieces W can be arranged above the vapor deposition source 302 of the chamber 301. Specifically, the workpiece W is disposed in the chamber 301 such that the deposition surface of the workpiece W is inclined with respect to a normal line toward the deposition source 302. The angle formed by the perpendicular line toward the vapor deposition source 302 and the normal line of the vapor deposition surface is called the elevation angle. Of course, the plane orientation angle θa (45 degrees; see FIGS. 2A and 2B) in the vapor deposition direction and the angle θb of the vapor deposition direction with respect to the deposition surface (45 degrees; see FIGS. 3 and 4). The work W is arranged with the above elevation angle set. In the present embodiment, the angle θb in the vapor deposition direction and the elevation angle are set to be the same.

  The inorganic material evaporated from the vapor deposition source 302 reaches the workpiece W and crystallizes. By performing such oblique deposition for a predetermined time, an inorganic material crystal grows into a columnar crystal (column), and an inorganic alignment film that is an aggregate of columns is formed.

  Since the workpiece W is tilted by giving a predetermined elevation angle θb to the perpendicular of the vapor deposition source 302, the angle θb in the vapor deposition direction with respect to the vapor deposition surface depends on the size of the work W, but the distance from the vapor deposition source 302 increases. Get smaller. In other words, the angle θb in the vapor deposition direction with respect to the workpiece W is not necessarily constant. In order to make the angle θb in the vapor deposition direction constant, for example, a shield plate (not shown) having a slit-like opening disposed so as to face the vapor deposition surface of the workpiece W is provided, and the vapor comes from the vapor deposition source 302. Means are taken to increase the beam parallelism of the film components.

7A and 7B are schematic plan views showing an inorganic alignment film forming step on the element substrate side.
In the third inorganic alignment film forming step (step S2) of FIG. 5, as shown in FIG. 7A, the entire surface of the substrate 10a on which the pixel circuit configuration including the pixel electrode 15 and the TFT 30 is formed is formed. Thus, an inorganic alignment film 19 as a third inorganic alignment film is formed. The inorganic alignment film 19 is formed so that the film thickness is 50 nm to 100 nm. The planar orientation of the oblique deposition is a direction from the bottom to the top along the Y direction of the base material 10a. The angle θb in the vapor deposition direction with respect to the substrate 10a is 45 degrees as described above. Thereby, the inorganic alignment film 19 which is an aggregate | assembly of the column 19a is formed in the element substrate 10 side (refer FIG. 4).

  Next, in the first inorganic alignment film formation step (step S3) in FIG. 5, a deposition mask having an opening corresponding to the first region E1 is predetermined for the base material 10a on which the inorganic alignment film 19 is formed. The inorganic alignment film 18 as the first inorganic alignment film is formed by being stacked in the chamber 301 of the oblique deposition apparatus 300. The inorganic alignment film 18 is formed so that the film thickness is 50 nm to 100 nm. The planar orientation of the oblique deposition is an orientation treatment direction in which the angle formed with the Y direction of the base material 10a is θa and goes from the upper right to the lower left. The angle θb in the vapor deposition direction with respect to the substrate 10a is 45 degrees as described above. Thereby, the inorganic alignment film 18 that is an aggregate of the columns 18a is formed on the element substrate 10 side (see FIG. 3). That is, in the first region E1, the inorganic alignment film 18 is formed by being stacked on the inorganic alignment film 19 formed previously.

  In the fourth inorganic alignment film forming step (step S6) in FIG. 5, the inorganic alignment film 25 as the fourth inorganic alignment film is formed on the counter substrate 20 side in the same manner as the element substrate 10 side. That is, the inorganic alignment film 25 is formed over the entire surface of the base material 20a on which the common electrode 23 is formed. The planar orientation of the oblique deposition is a direction from the lower side to the upper side along the Y direction of the base material 20a (see FIG. 2B). The angle θb in the vapor deposition direction with respect to the substrate 20a is 45 degrees as described above. Thereby, the inorganic alignment film 25 that is an aggregate of the columns 25a is formed on the counter substrate 20 side (see FIG. 4). In addition, the place which the 4th inorganic alignment film said here means is synonymous with the 3rd inorganic alignment film in this invention. In order to explain the steps separately, a fourth inorganic alignment film was used.

  Next, in the second inorganic alignment film formation step (step S7) in FIG. 5, a deposition mask having an opening corresponding to the third region E3 is predetermined for the base material 20a on which the inorganic alignment film 25 is formed. The inorganic alignment film 24 is formed as a second inorganic alignment film by being set in the chamber 301 of the oblique deposition apparatus 300. The planar orientation of the oblique deposition is an orientation treatment direction in which the angle formed with the Y direction of the base material 20a is θa and goes from the lower left to the lower right (see FIG. 2). The angle θb in the vapor deposition direction with respect to the substrate 20a is 45 degrees as described above. Thereby, the inorganic alignment film 24 which is an aggregate | assembly of the column 24a is formed in the counter substrate 20 side (refer FIG. 3). That is, in the third region E3, the inorganic alignment film 24 is formed by being laminated on the inorganic alignment film 25 formed previously. The film thicknesses of the inorganic alignment films 24 and 25 are also 50 nm to 100 nm, respectively.

  Next, in the seal formation step (step S4) in FIG. 5, the first seal portion 41 and the second seal portion 43 are formed on the element substrate 10 side on which the inorganic alignment films 18 and 19 are formed. The 1st seal | sticker part 41 is formed in the position which overlaps with the outer edge of the opposing board | substrate 20 bonded later. The second seal portion 43 is formed on the second region E2 side along the boundary between the first region E1 and the second region E2. Or it forms in the position which overlaps with the boundary of the 1st field E1 and the 2nd field E2. As a method for forming the first seal portion 41 and the second seal portion 43, a printing method using a screen or the like, a quantitative discharge method (dispenser method) for drawing a seal pattern while discharging a seal member from a nozzle, or the like can be adopted. The quantitative discharge method (dispenser method) is more preferable in that defects such as poor alignment due to the screen or the like coming into contact with the inorganic alignment films 18 and 19 do not occur. Note that the first seal portion 41 and the second seal portion 43 may be formed on the counter substrate 20 side. Or you may form the 1st seal | sticker part 41 and the 2nd seal | sticker part 43 with respect to a respectively different board | substrate.

  FIGS. 8A and 8B are schematic views for explaining a bonding process and a liquid crystal injection / sealing process. Next, in the bonding step (step S8) in FIG. 5, as shown in FIGS. 8A and 8B, the element substrate 10 and the counter substrate on which the first seal portion 41 and the second seal portion 43 are formed. 20 are arranged opposite to each other at a predetermined position, and bonded together. Since the first seal portion 41 and the second seal portion 43 include a spacer (not shown), for example, if the other substrate of the pair of substrates is pressed against one of the substrates and is crimped, the element substrate 10 is opposed. The substrate 20 can be bonded at a desired interval.

Next, in the liquid crystal injection / sealing step (step S <b> 9) in FIG. 5, first, liquid crystal is injected into the gap between the bonded element substrate 10 and the counter substrate 20. Specifically, the gap is set to a substantially vacuum state by setting the pair of bonded substrates in the chamber so that the element substrate 10 is positioned below and reducing the pressure. Then, as shown in FIGS. 8A and 8B, the liquid crystal 50 a is dropped onto the terminal portion 10 b of the element substrate 10 that protrudes from the counter substrate 20. A predetermined amount of the liquid crystal 50 a is dropped so as to block the first inlet 42 of the first seal portion 41. Then, the inside of the chamber is opened to the atmosphere from a reduced pressure state. Then, due to the pressure difference between the gap and the atmosphere, the liquid crystal 50 a enters the detour entry path 45 from the first inlet 42 and fills the pixel region E from the second inlet 44 of the second seal portion 43.
In the first to fourth inorganic alignment film forming steps, the inorganic alignment films 18, 19, 24, and 25 are formed so that the alignment processing directions in the pixel area E and the detour approach path 45 are different. The approach speed of the liquid crystal 50a in the detour approach path 45 becomes slow. While the liquid crystal 50a enters the bypass approach path 45, the impurities contained in the liquid crystal 50a are sufficiently trapped by the inorganic alignment film 19 on the element substrate 10 side and the inorganic alignment film 25 on the counter substrate 20 side (FIG. 4). Accordingly, the pixel region E is filled with the liquid crystal 50a that hardly contains impurities.
Liquid crystal injection is continued until the pixel region E is sufficiently filled with the liquid crystal 50a, and then the first injection port 42 is sealed with the sealing material 108 (see FIG. 1A). Thereby, the liquid crystal panel 110 is completed.

FIG. 9A is a schematic plan view showing the configuration of the mother substrate, and FIG. 9B is a schematic cross-sectional view taken along the line JJ ′ of FIG. 9A and 9B show the mother substrate after the element substrate 10 and the counter substrate 20 are bonded together.
As shown in FIGS. 9A and 9B, the manufacturing method of the liquid crystal device 100 as described above is actually performed using a mother substrate 10W on which a plurality of element substrates 10 are attached.
The mother substrate 10W of the present embodiment is a wafer-like element substrate, for example, a quartz substrate or a glass substrate, in a matrix shape in the X direction along the orientation flat partly cut and the Y direction orthogonal to the X direction. 10 is imposed and the process proceeds.
The inorganic alignment films 18 and 19 on the element substrate 10 side are formed using the mother substrate 10W. On the other hand, formation of the inorganic alignment films 24 and 25 on the counter substrate 20 side includes a method in which a plurality of counter substrates 20 are adsorbed and fixed on a support and set in the oblique deposition apparatus 300. Similarly to the element substrate 10, the inorganic alignment films 24 and 25 are formed in a state of being impressed on the mother substrate, and then divided into individual counter substrates 20, and then the element substrate 10 imposed on the mother substrate 10 </ b> W and the individual substrates 10. The method of sticking together is mentioned.
As described above, in the liquid crystal injection / sealing process (step S9), the mother substrate 10W is arranged in the chamber so as to be downward, and the liquid crystal is dropped between the plurality of counter substrates 20 arranged in the Y direction. become.

The effects of the liquid crystal device 100 and the manufacturing method thereof according to the present embodiment are as follows.
(1) Compared with the pixel region E, the inorganic alignment films 19 and 25 in the detour approach path 45 have a portion in which the alignment processing direction is applied in a direction that opposes the approach direction when liquid crystal is injected. In particular, on the short side of the detour entry path 45, the alignment treatment direction is opposite to the liquid crystal entry direction (the growth direction of the columns 19a and 25a is opposite to the liquid crystal entry direction). Compared to the case where the inorganic alignment films 18 and 24 are formed in the detour approach path 45 as in the pixel region E, the liquid crystal entry speed in the detour approach path 45 is reduced, and impurities in the liquid crystal are removed from the inorganic alignment films 19 and 25. Can be trapped efficiently. Further, since impurities are trapped in the inorganic alignment films 19 and 25, compared with the case where they are trapped in the organic alignment film, deterioration due to irradiated light is prevented and excellent light resistance is achieved. That is, it is possible to provide the liquid crystal device 100 having a high reliability and a manufacturing method thereof while reducing initial display defects due to impurities.
(2) The bypass approach path 45 is configured by arranging the first seal part 41 and the second seal part 43 on the element substrate 10 side with the scanning line driving circuit 102 and the inspection circuit 103 interposed therebetween. Accordingly, the unevenness on the base material 10a due to these peripheral circuits is reflected in the inorganic alignment film 19, and the substantial surface area of the inorganic alignment film 19 is increased, so that the trapping ability of impurities can be improved.
(3) In the method of manufacturing the liquid crystal device 100, the method of changing the alignment processing direction of the pixel region E and the detour approach path 45 is to form a vapor deposition mask after first forming the inorganic alignment films 19 and 25 on the detour approach path 45 side. Is used to selectively form the inorganic alignment films 18 and 24 on the pixel region E side. Therefore, compared with the case where the inorganic alignment films 18 and 24 on the pixel region E side are formed first, the inorganic alignment films 19 and 25 having different alignment treatment directions are not selectively formed. , 25 can be prevented from protruding. That is, a stable alignment state of the liquid crystal molecules LC can be realized in the pixel region E.
(4) In the method for manufacturing the liquid crystal device 100, the liquid crystal is injected in the chamber by placing the liquid crystal panel 110 substantially horizontally with the element substrate 10 facing downward, so that the inorganic alignment film 19 having a substantial surface area is formed. Impurities can be effectively trapped.

(Second Embodiment)
<Other liquid crystal device and manufacturing method thereof>
Next, another liquid crystal device and a method for manufacturing the same according to the present invention will be described with reference to FIGS. FIG. 10 is a schematic plan view showing the configuration of the liquid crystal device of the second embodiment, and FIGS. 11A and 11B are schematic plan views showing the alignment treatment direction of the inorganic alignment film in the liquid crystal device of the second embodiment. . In the liquid crystal device according to the second embodiment, the positions of the first inlet 42 and the second inlet 44 and the alignment processing direction in the bypass approach path 45 are different from those in the first embodiment. In addition, the same code | symbol is attached | subjected to the same structure as 1st Embodiment, and detailed description is abbreviate | omitted.

  As shown in FIG. 10, the liquid crystal device 210 of the present embodiment has a double seal structure in which a liquid crystal bypass approach path 45 is configured by the first seal portion 41 and the second seal portion 43. A first inlet 42 is open on the short side of the first seal portion 41 along the Y direction. A second injection port 44 is opened in the second seal portion 43 on the short side facing the short side on which the first injection port 42 is provided. The liquid crystal enters from the first injection port 42, and fills the pixel region E from the second injection port 44 through the detour entry path 45. The first inlet 42 is sealed with a sealing material 108.

  As shown in FIG. 11A, the inorganic alignment film 18 is formed in the first region E1 that is slightly larger than the pixel region E on the element substrate 10 side. The alignment treatment direction of the inorganic alignment film 18 is a direction indicated by a solid line arrow from the upper right to the lower left of the rectangular base material 10a. An angle θa formed by the Y direction and the alignment processing direction is approximately 45 degrees. The alignment treatment direction substantially matches the orientation in the film forming direction when the inorganic alignment film 18 is formed.

  An inorganic alignment film 19 is formed in a second region E2 that is a peripheral region surrounding the first region E1. The alignment treatment direction of the inorganic alignment film 19 is a direction indicated by a solid arrow from the left to the right of the substrate 10a along the X direction.

  As shown in FIG. 11B, the inorganic alignment film 24 is formed in the third region E3 that is slightly larger than the pixel region E on the counter substrate 20 side. The alignment treatment direction of the inorganic alignment film 24 is a direction indicated by a dashed arrow from the lower left to the upper right of the rectangular base material 20a. An angle θa formed by the Y direction and the alignment processing direction is approximately 45 degrees, similarly to the element substrate 10 side. The alignment treatment direction substantially matches the orientation in the film formation direction when the inorganic alignment film 24 is formed.

An inorganic alignment film 25 is formed in a fourth region E4 that is a peripheral region surrounding the third region E3. The alignment treatment direction of the inorganic alignment film 25 is a direction indicated by a dashed arrow from the left to the right of the substrate 20a along the X direction.
FIG. 11B shows the alignment treatment direction of the inorganic alignment films 24 and 25 when the counter substrate 20 is viewed from the side opposite to the liquid crystal layer 50. Moreover, the formation methods of the inorganic alignment films 18 and 19 in the element substrate 10 and the inorganic alignment films 24 and 25 in the counter substrate 20 are the same as those in the first embodiment.

The effect of this embodiment has the following effects in addition to the effects (2) to (4) of the first embodiment.
(5) Compared with the pixel region E, the inorganic alignment films 19 and 25 in the detour approach path 45 have more portions where the alignment treatment direction is applied in a direction against the approach direction when liquid crystal is injected. In particular, on the long side of the bypass approach path 45, the alignment treatment direction is opposite to the liquid crystal entrance direction (the columns 19a and 25a are inclined in the direction opposite to the liquid crystal entrance direction). Therefore, as compared with the first embodiment, the length of the portion where the impurities in the liquid crystal can be efficiently trapped in the inorganic alignment films 19 and 25 can be increased. Further, since impurities are trapped in the inorganic alignment films 19 and 25, compared with the case where they are trapped in the organic alignment film, deterioration due to irradiated light is prevented and excellent light resistance is achieved. That is, it is possible to provide a liquid crystal device 210 having high reliability and a method for manufacturing the same while reducing initial display defects due to impurities.

(Third embodiment)
<Electronic equipment>
Next, the electronic apparatus of this embodiment will be described with reference to FIG. FIG. 12 is a schematic diagram illustrating a configuration of a projection display device as an electronic apparatus.

  As shown in FIG. 12, a projection display apparatus 1000 as an electronic apparatus according to this embodiment includes a polarization illumination apparatus 1100 arranged along the system optical axis L, and two dichroic mirrors 1104 and 1105 as light separation elements. Three reflection mirrors 1106, 1107, 1108, five relay lenses 1201, 1202, 1203, 1204, 1205, three transmissive liquid crystal light valves 1210, 1220, 1230 as light modulation means, and a light combining element As a cross dichroic prism 1206 and a projection lens 1207.

  The polarized light illumination device 1100 is generally configured by a lamp unit 1101 as a light source composed of a white light source such as an ultra-high pressure mercury lamp or a halogen lamp, an integrator lens 1102, and a polarization conversion element 1103.

  The dichroic mirror 1104 reflects red light (R) and transmits green light (G) and blue light (B) among the polarized light beams emitted from the polarization illumination device 1100. Another dichroic mirror 1105 reflects the green light (G) transmitted through the dichroic mirror 1104 and transmits the blue light (B).

The red light (R) reflected by the dichroic mirror 1104 is reflected by the reflection mirror 1106 and then enters the liquid crystal light valve 1210 via the relay lens 1205.
Green light (G) reflected by the dichroic mirror 1105 enters the liquid crystal light valve 1220 via the relay lens 1204.
The blue light (B) transmitted through the dichroic mirror 1105 is incident on the liquid crystal light valve 1230 via a light guide system including three relay lenses 1201, 1202, 1203 and two reflection mirrors 1107, 1108.

  The liquid crystal light valves 1210, 1220, and 1230 are disposed to face the incident surfaces of the cross dichroic prism 1206 for each color light. The color light incident on the liquid crystal light valves 1210, 1220, and 1230 is modulated based on video information (video signal) and emitted toward the cross dichroic prism 1206. In this prism, four right-angle prisms are bonded together, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are formed in a cross shape on the inner surface thereof. The three color lights are synthesized by these dielectric multilayer films, and the light representing the color image is synthesized. The synthesized light is projected on the screen 1300 by the projection lens 1207 which is a projection optical system, and the image is enlarged and displayed.

  The liquid crystal light valve 1210 is obtained by applying the liquid crystal device 100 or the liquid crystal device 210 described above. The liquid crystal device 100 (or the liquid crystal device 210) is arranged with a gap between a pair of polarizing elements arranged in crossed Nicols on the incident side and the emission side of colored light. The same applies to the other liquid crystal light valves 1220 and 1230.

  According to such a projection type display device 1000, as the liquid crystal light valves 1210, 1220, 1230, the liquid crystal device trapped in the bypass approach path 45 so that impurities contained in the liquid crystal do not diffuse into the pixel region E during the manufacturing process. Since 100 (or the liquid crystal device 210) is used, excellent display quality and high light resistance are realized.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or concept of the invention that can be read from the claims and the entire specification. A method for manufacturing a liquid crystal device and an electronic apparatus to which the liquid crystal device is applied are also included in the technical scope of the present invention. Various modifications other than the above embodiment are conceivable. Hereinafter, a modification will be described.

(Modification 1) The growth direction of the columns 19a and 25a of the inorganic alignment films 19 and 25 in the detour approach path 45 of the liquid crystal is not limited to this. FIG. 13 is a schematic cross-sectional view showing the growth direction of the column of the inorganic alignment film in the alternative approach path of the first modification.
Even if one of the element substrate 10 and the counter substrate 20 has a different alignment processing direction (or column growth direction) of the inorganic alignment film in the pixel region E and the bypass approach path 45, the liquid crystal enters the bypass entrance path 45. It is possible to reduce the speed. Specifically, as shown in FIG. 13, for example, the inorganic alignment film 19 on the side of the element substrate 10 formed in a region including the peripheral circuit in the bypass approach path 45 has a growth direction of the column 19a as in the above embodiment. It is formed to resist the liquid crystal entering direction. On the other hand, the counter substrate 20 that is individually bonded to the element substrate 10 facing the mother substrate 10 </ b> W may form the inorganic alignment film 24 across the pixel region E and the detour entry path 45. Impurities in the liquid crystal can be efficiently trapped in the inorganic alignment films 19 and 24 without making the manufacturing process of the liquid crystal device so complicated.

  (Modification 2) The alignment treatment direction (deposition direction during film formation) of the inorganic alignment films 19 and 25 in the detour approach path 45 of the above embodiment is the X direction or Y direction along the sides of the base materials 10a and 20a. It is not limited to the direction. In other words, it is not necessarily limited to having a portion in the opposite direction with respect to the entering direction of the liquid crystal 50a. There may be a portion deviated from the opposite direction due to variations in orientation during the formation of the inorganic alignment films 19 and 25.

  (Modification 3) The liquid crystal device to which the detour approach path 45 of the above embodiment can be applied is not limited to the transmission type. The present invention can also be applied to a reflective or transflective liquid crystal device including a pixel electrode 15 having light reflectivity.

  (Modification 4) The electronic apparatus to which the liquid crystal device 100 can be applied is not limited to the projection display device 1000 of the above embodiment. For example, projection type HUD (head-up display), direct-view type HMD (head-mounted display), electronic book, personal computer, digital still camera, LCD TV, viewfinder type or monitor direct-view type video recorder, car navigation It can be suitably used as a display unit of an information terminal device such as a system, electronic notebook, or POS.

  DESCRIPTION OF SYMBOLS 10 ... Element board | substrate as one board | substrate, 15 ... Pixel electrode, 18 ... Inorganic alignment film as 1st inorganic alignment film, 18a ... Columnar crystal body (column), 19 ... Inorganic alignment film as 3rd inorganic alignment film, 19a ... columnar crystal (column), 20 ... counter substrate as the other substrate, 24 ... inorganic alignment film as the second inorganic alignment film, 24a ... columnar crystal (column), 25 ... inorganic alignment film, 25a ... columnar Crystal body (column), 30... Thin film transistor (TFT) as a transistor, 41... 1st seal portion, 42... 1st injection port, 43 ... 2nd seal portion, 44 ... 2nd injection port, 45. 50 ... liquid crystal layer, 50a ... liquid crystal, 100, 210 ... liquid crystal device, 1000 ... projection type display device as an electronic device, E ... pixel region, LC ... liquid crystal molecule.

Claims (13)

A pair of substrates;
A first seal portion for bonding the pair of substrates opposed to each other at a predetermined interval;
A first inlet provided in the first seal portion for injecting liquid crystal between the pair of bonded substrates;
The liquid crystal having a second injection port that is disposed inside the first seal portion and communicates with a pixel region on a side of the first seal portion other than the side provided with the first injection port. A second seal portion that constitutes a detour approach path of the first seal portion,
An inorganic alignment film provided on the liquid crystal side of the pair of substrates,
In at least one of the pair of substrates, the inorganic alignment film in the bypass approach path is aligned in a direction that opposes the liquid crystal entrance direction in the bypass approach path, rather than the inorganic alignment film in the pixel region. A liquid crystal device having a large number of portions facing in a direction.   In each of the pair of substrates, the inorganic alignment film in the bypass approach path has a portion in which an alignment treatment direction is directed in a direction against the liquid crystal entrance direction in the bypass approach path. The liquid crystal device according to claim 1.   3. The liquid crystal according to claim 1, wherein the inorganic alignment film of the detour approach path has a portion in which an orientation processing direction is opposite to an approach direction of the liquid crystal in the detour approach path. apparatus. The pixel region is substantially rectangular in plan view, and the first injection port and the second injection port are provided in a portion along a long side of the pixel region,
The alignment processing direction of the inorganic alignment film in a portion along the short side of the pixel region in the detour approach path is directed in a direction opposite to the approach direction of the liquid crystal. LCD device. One of the pair of substrates includes a plurality of pixel electrodes arranged in the pixel region, and transistors provided corresponding to the pixel electrodes,
2. The one substrate has a portion in which an orientation processing direction of the inorganic alignment film in the bypass approach path is in a direction opposite to an entrance direction of the liquid crystal in the bypass approach path. 5. The liquid crystal device according to any one of items 4 to 4. The inorganic alignment film is obtained by depositing an inorganic material by a vapor deposition method,
6. The film formation direction of the inorganic material in the pixel region and the film formation direction of the inorganic material in the detour approach path are different from each other in at least one of the pair of substrates. The liquid crystal device according to one item. The inorganic alignment film is an aggregate of columnar crystals obtained by crystallizing an inorganic material on a substrate by a vapor phase growth method,
2. The inorganic alignment film of the bypass approach path in at least one of the pair of substrates is characterized in that a growth direction of the columnar crystal body is in a direction opposite to an entrance direction of the liquid crystal. The liquid crystal device according to claim 1. A first inorganic alignment film forming step of forming a first inorganic alignment film in at least the pixel region on the side facing the liquid crystal layer of one of the pair of substrates;
A second inorganic alignment film forming step of forming a second inorganic alignment film in at least the pixel region on the side facing the liquid crystal layer of the other substrate of the pair of substrates;
Forming a first seal portion having a first inlet on either one of the pair of substrates;
A second injection port that communicates with the pixel region on the side of the first seal portion on the side of the first seal portion other than the side provided with the first injection port; Forming a second seal portion that constitutes a detour approach path of liquid crystal with the first seal portion;
Arranging the pair of substrates facing each other at a predetermined interval, and bonding the first seal portion and the second seal portion;
A liquid crystal injection step of injecting liquid crystal into the gap between the pair of substrates from the first injection port via the bypass approach path using a vacuum injection method,
At least one of the first inorganic alignment film formation step and the second inorganic alignment film formation step has a direction in which the alignment treatment direction opposes the liquid crystal entering direction in the detour approach path more than the pixel region. As described above, the method for manufacturing a liquid crystal device includes a third inorganic alignment film forming step of forming a third inorganic alignment film in the bypass approach path.   The method of manufacturing a liquid crystal device according to claim 8, wherein the first inorganic alignment film or the second inorganic alignment film is formed after the third inorganic alignment film is formed. The liquid crystal injection step is performed in a state where the pair of substrates is held substantially horizontally,
10. The method of manufacturing a liquid crystal device according to claim 8, wherein the third inorganic alignment film formation step is performed on a substrate located on a lower side in the liquid crystal injection step among the pair of substrates. .   11. The substrate according to claim 8, wherein the substrate on which the third inorganic alignment film is formed includes a plurality of pixel electrodes arranged in the pixel region and a transistor corresponding to each pixel electrode. A method for manufacturing a liquid crystal device according to claim 1. The third inorganic alignment film comprises an aggregate of columnar crystals obtained by crystallizing an inorganic material on a substrate using a vapor phase growth method,
12. The method according to claim 8, wherein in the third inorganic alignment film formation step, the third inorganic alignment film is formed so that the columnar crystal grows in a direction that opposes the liquid crystal entering direction. A method for manufacturing a liquid crystal device according to claim 1.   An electronic apparatus comprising the liquid crystal device according to claim 1.

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