JP2014152339A - Sample holder - Google Patents

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JP2014152339A
JP2014152339A JP2013020088A JP2013020088A JP2014152339A JP 2014152339 A JP2014152339 A JP 2014152339A JP 2013020088 A JP2013020088 A JP 2013020088A JP 2013020088 A JP2013020088 A JP 2013020088A JP 2014152339 A JP2014152339 A JP 2014152339A
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substrate
sample holder
mounting surface
substrate support
shaft portion
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Daisuke Imai
大輔 今井
Masayasu Suzuki
正康 鈴木
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Shimadzu Corp
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Shimadzu Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a sample holder in which substrate holding members may be mounted on a mounting surface stably when the substrate holding members are mounted and removed repeatedly.SOLUTION: A sample holder stored in a plasma treatment apparatus has a plurality of substrate holding members comprising: a substrate plate having a mounting surface extended vertically for mounting the substrate to be treated; annular shanks structured so that cylindrical cavities are formed in their respective interior; an outer shell part consisting of a head part having a cross sectional area larger than those of the shanks; and a core part of columnar shape disposed in close contact with the inner walls of the shanks of the outer shell part, in which a part of the shanks are embedded in the mounting surface and the substrate is supported by the shanks at gaps between the head parts of the substrate holding members and the mounting surface.

Description

本発明は、処理対象の基板を搭載してプラズマ処理装置に格納されるサンプルホルダに関する。   The present invention relates to a sample holder on which a substrate to be processed is mounted and stored in a plasma processing apparatus.

半導体装置の製造工程において、高精度のプロセス制御が容易であるという利点から、成膜、エッチング、アッシングなどの処理にプラズマ処理装置が用いられている。例えば成膜装置として、平行平板を構成するカソード電極とアノード電極間にプラズマを形成して成膜処理を行うプラズマ化学気相成長(CVD)成膜装置が知られている。   In the manufacturing process of a semiconductor device, a plasma processing apparatus is used for processes such as film formation, etching, and ashing because of high-precision process control. For example, as a film forming apparatus, a plasma chemical vapor deposition (CVD) film forming apparatus is known in which a plasma is formed between a cathode electrode and an anode electrode constituting parallel plates to perform a film forming process.

プラズマCVD成膜装置の基板処理方法は、基板を1枚ずつ処理する枚葉式と複数の基板を同時に処理するバッチ式に大別される。太陽電池は基板サイズが125mm〜156mm程度と小さく、また、基板1枚当たりにかけられるコストが小さいために単位時間当たりの処理基板枚数を多くする必要がある。このため、太陽電池用の成膜装置ではバッチ式が用いられることが多い。特に、処理効率を向上させるために、基板を垂直に装着するサンプルホルダを用いて、同時に処理できる基板の数を増やすことが有効である(例えば、特許文献1参照。)。   The substrate processing method of the plasma CVD film forming apparatus is roughly classified into a single wafer type that processes substrates one by one and a batch type that processes a plurality of substrates simultaneously. The solar cell has a small substrate size of about 125 mm to 156 mm, and the cost applied to each substrate is small, so that it is necessary to increase the number of substrates processed per unit time. For this reason, a batch type is often used in a film forming apparatus for a solar cell. In particular, in order to improve the processing efficiency, it is effective to increase the number of substrates that can be processed at the same time using a sample holder on which the substrates are mounted vertically (see, for example, Patent Document 1).

特開2002−75884号公報JP 2002-75884 A

サンプルホルダに基板を垂直に装着するために、例えば、サンプルホルダの基板を搭載する面にピン穴を形成し、このピン穴に圧入した金属ピンを基板支持具とする方法を用いることができる。しかし、サンプルホルダは定期的に洗浄する必要があり、例えばフッ酸洗浄時などに毎回サンプルホルダから金属ピンを取り外す必要があった。このような金属ピンの圧入と取り外しを繰り返すことによってサンプルホルダのピン穴が広がり、金属ピンが搭載面に密着せず、容易に外れてしまうという問題があった。   In order to mount the substrate vertically on the sample holder, for example, a method of forming a pin hole on the surface of the sample holder on which the substrate is mounted and using a metal pin press-fitted into the pin hole as a substrate support can be used. However, it is necessary to periodically clean the sample holder. For example, it is necessary to remove the metal pin from the sample holder every time the hydrofluoric acid is washed. By repeating such press-fitting and removing of the metal pin, the pin hole of the sample holder widens, and there is a problem that the metal pin does not adhere to the mounting surface and easily comes off.

上記問題点に鑑み、基板支持具の取り付けと取り外しを繰り返しても、基板支持具が搭載面に安定して装着されるサンプルホルダを提供することを目的とする。   In view of the above problems, an object of the present invention is to provide a sample holder in which a substrate support can be stably mounted on a mounting surface even when the substrate support is repeatedly attached and detached.

本発明の一態様によれば、プラズマ処理装置に格納されるサンプルホルダであって、(イ)処理対象の基板を搭載する搭載面が垂直方向に延伸する基板プレートと、(ロ)内部に円筒形状の空洞を形成するようにそれぞれ環状に構成された軸部分とその軸部分よりも断面積の広い頭部からなる外殻部、及び外殻部の軸部分の内壁に密着して配置された円柱形状の芯部からなり、搭載面に軸部分の一部が埋め込まれた複数の基板支持具とを備え、基板支持具の頭部と搭載面との隙間で軸部分に支持されて基板が配置されるサンプルホルダが提供される。   According to one aspect of the present invention, there is provided a sample holder stored in a plasma processing apparatus, wherein (a) a substrate plate on which a substrate to be processed is mounted extends in a vertical direction, and (b) a cylinder inside. A shaft portion configured in an annular shape so as to form a hollow shape, an outer shell portion composed of a head having a wider cross-sectional area than the shaft portion, and an inner wall of the shaft portion of the outer shell portion are arranged in close contact with each other A plurality of substrate supports, each of which has a cylindrical core portion and a portion of the shaft portion embedded in the mounting surface, and the substrate is supported by the shaft portion with a gap between the head of the substrate support and the mounting surface. A sample holder to be placed is provided.

本発明によれば、基板支持具の取り付けと取り外しを繰り返しても、基板支持具が搭載面に安定して装着されるサンプルホルダを提供できる。   ADVANTAGE OF THE INVENTION According to this invention, even if it repeats attachment and removal of a board | substrate support tool, the sample holder with which a board | substrate support tool is stably mounted | worn can be provided.

本発明の実施形態に係るサンプルホルダの構成を示す模式的な断面図である。It is typical sectional drawing which shows the structure of the sample holder which concerns on embodiment of this invention. 本発明の実施形態に係るサンプルホルダの構成を示す模式的な平面図である。It is a typical top view showing composition of a sample holder concerning an embodiment of the present invention. 本発明の実施形態に係るサンプルホルダに基板を搭載した例を示す模式図である。It is a schematic diagram which shows the example which mounted the board | substrate in the sample holder which concerns on embodiment of this invention. 本発明の実施形態に係るサンプルホルダの基板支持具を説明するための模式図である。It is a mimetic diagram for explaining a substrate support of a sample holder concerning an embodiment of the present invention. 本発明の実施形態に係るサンプルホルダに基板支持具を取り付ける方法を説明するための模式図である(その1)。It is a schematic diagram for demonstrating the method to attach a board | substrate support tool to the sample holder which concerns on embodiment of this invention (the 1). 本発明の実施形態に係るサンプルホルダに基板支持具を取り付ける方法を説明するための模式図である(その2)。It is a schematic diagram for demonstrating the method to attach a board | substrate support tool to the sample holder which concerns on embodiment of this invention (the 2). 本発明の実施形態に係るサンプルホルダに基板支持具を取り付ける方法を説明するための模式図である(その3)。It is a schematic diagram for demonstrating the method to attach a board | substrate support tool to the sample holder which concerns on embodiment of this invention (the 3). 本発明の実施形態に係るサンプルホルダの基板支持具の構成を示す断面図である。It is sectional drawing which shows the structure of the substrate support tool of the sample holder which concerns on embodiment of this invention. 本発明の実施形態に係るサンプルホルダの他の例を示す模式図である。It is a schematic diagram which shows the other example of the sample holder which concerns on embodiment of this invention.

図面を参照して、本発明の実施形態を説明する。以下の図面の記載において、同一又は類似の部分には同一又は類似の符号を付している。ただし、図面は模式的なものであることに留意すべきである。又、以下に示す実施形態は、この発明の技術的思想を具体化するための装置や方法を例示するものであって、この発明の実施形態は、構成部品の構造、配置などを下記のものに特定するものでない。この発明の実施形態は、特許請求の範囲において、種々の変更を加えることができる。   Embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic. Further, the embodiment described below exemplifies an apparatus and a method for embodying the technical idea of the present invention, and the embodiment of the present invention has the following structure and arrangement of components. It is not something specific. The embodiment of the present invention can be variously modified within the scope of the claims.

本発明の実施形態に係るサンプルホルダ10は、プラズマ処理装置に格納されるサンプルホルダであって、図1に示すように、処理対象の基板を搭載する搭載面110が垂直方向に延伸する基板プレート11と、搭載面110に配置された基板支持具20とを備える。基板支持具20は、内部に円筒形の空洞を形成するようにそれぞれ環状に構成された軸部分211と、軸部分211よりも断面積の広い頭部212からなる外殻部21、及び外殻部21の軸部分211の内壁に密着して配置された円柱形状の芯部22からなる。図1に示したように、搭載面110に軸部分の一部が埋め込まれている。   A sample holder 10 according to an embodiment of the present invention is a sample holder stored in a plasma processing apparatus, and a substrate plate on which a mounting surface 110 on which a substrate to be processed is mounted extends vertically as shown in FIG. 11 and a substrate support 20 disposed on the mounting surface 110. The substrate support 20 includes a shaft portion 211 formed in an annular shape so as to form a cylindrical cavity therein, an outer shell portion 21 including a head portion 212 having a cross-sectional area wider than that of the shaft portion 211, and an outer shell. It consists of a cylindrical core part 22 arranged in close contact with the inner wall of the shaft part 211 of the part 21. As shown in FIG. 1, a part of the shaft portion is embedded in the mounting surface 110.

詳細は後述するが、軸部分211内部の空洞に押し込まれた芯部22によって軸部分211の内壁に外側に向けて圧力がかかる。このため、軸部分211の外壁が基板プレート11に押しつけられることになり、基板支持具20は搭載面110から簡単にははずれない。   Although details will be described later, pressure is applied to the inner wall of the shaft portion 211 outward by the core portion 22 pushed into the cavity inside the shaft portion 211. For this reason, the outer wall of the shaft portion 211 is pressed against the substrate plate 11, and the substrate support 20 cannot be easily detached from the mounting surface 110.

図2に示すように、複数の基板支持具20が搭載面110に配置されている。図2に示した例では、矩形領域で定義された搭載位置111に配置される基板に対して、下部端面及び左右部端面それぞれに相当する位置に基板支持具20が配置されている。これにより、基板の下辺部、右辺部及び左辺部が基板支持具20によってそれぞれ支持されて、基板が搭載面110上に固定される。なお、基板支持具20の個数は3個に限られることは無く、基板が安定して搭載面110上に配置されるように、基板支持具20の個数や配置箇所は任意に設定できる。   As shown in FIG. 2, a plurality of substrate supports 20 are arranged on the mounting surface 110. In the example illustrated in FIG. 2, the substrate support 20 is disposed at positions corresponding to the lower end surface and the left and right end surfaces with respect to the substrate disposed at the mounting position 111 defined by the rectangular area. As a result, the lower side, the right side, and the left side of the substrate are respectively supported by the substrate support 20 and the substrate is fixed on the mounting surface 110. Note that the number of substrate supports 20 is not limited to three, and the number and location of the substrate supports 20 can be arbitrarily set so that the substrate is stably disposed on the mounting surface 110.

図3に示すように、基板支持具20の頭部212と搭載面110との隙間で軸部分211に支持されて、基板1が搭載面110上で固定される。このため、搭載面110上で露出する軸部分211の長さtは、基板1の厚みと同等と設定される。   As shown in FIG. 3, the substrate 1 is fixed on the mounting surface 110 by being supported by the shaft portion 211 through a gap between the head 212 of the substrate support 20 and the mounting surface 110. For this reason, the length t of the shaft portion 211 exposed on the mounting surface 110 is set to be equal to the thickness of the substrate 1.

図4に、基板支持具20を搭載面110に取り付けるための装着具200の構造を示す。装着具200は、芯部22が先端に配置されたシャフト220が、軸部分211と頭部212からなる外殻部21の内部空洞に挿入された構造である。シャフト220は、芯部22、くびれ部221及び引き出し部222が連結された構造であり、基板支持具20を搭載面110に取り付ける前の状態では、外殻部21の内部空洞には引き出し部222が配置されている。芯部22の直径d1よりも引き出し部222の直径d2の方が細く、くびれ部221は引き出し部222よりも更に細く形成されている。より具体的には、引き出し部222の直径d2は外殻部21の内部空洞の直径よりも細く、芯部22の直径d1は外殻部21の内部空洞の直径よりもやや太い。以下に、基板支持具20を搭載面110に取り付ける方法の例を説明する。   FIG. 4 shows the structure of a mounting tool 200 for attaching the substrate support 20 to the mounting surface 110. The mounting tool 200 has a structure in which a shaft 220 having a core portion 22 disposed at the tip is inserted into an internal cavity of the outer shell portion 21 including a shaft portion 211 and a head portion 212. The shaft 220 has a structure in which the core portion 22, the constricted portion 221, and the lead-out portion 222 are connected, and the lead-out portion 222 is provided in the internal cavity of the outer shell portion 21 before the substrate support 20 is attached to the mounting surface 110. Is arranged. The diameter d2 of the lead-out portion 222 is thinner than the diameter d1 of the core portion 22, and the constricted portion 221 is formed to be thinner than the lead-out portion 222. More specifically, the diameter d2 of the lead-out portion 222 is smaller than the diameter of the internal cavity of the outer shell portion 21, and the diameter d1 of the core portion 22 is slightly thicker than the diameter of the internal cavity of the outer shell portion 21. Below, the example of the method of attaching the board | substrate support tool 20 to the mounting surface 110 is demonstrated.

まず、図5に示すように、搭載面110に開口部を有する貫通孔100を基板プレート11に形成する。貫通孔100の直径は、基板支持具20の軸部分211の直径と同等程度に設定される。   First, as shown in FIG. 5, a through hole 100 having an opening on the mounting surface 110 is formed in the substrate plate 11. The diameter of the through hole 100 is set to be approximately equal to the diameter of the shaft portion 211 of the substrate support 20.

次いで、図6に示すように、芯部22が基板プレート11の反対側の面に突き出すように、搭載面110側から装着具200を基板プレート11に形成した貫通孔100に挿入する。貫通孔100の直径が軸部分211の直径と同等程度であるため、装着具200は安定した姿勢で搭載面110上で保持され、装着具200のシャフト220は搭載面110の面法線方向に延伸する。このとき、軸部分211の先端は貫通孔100内に位置する。なお、頭部212と搭載面110間で露出する軸部分211の長さtが基板1の厚みと同等になるように、外殻部21の位置を設定する。   Next, as shown in FIG. 6, the mounting tool 200 is inserted into the through hole 100 formed in the substrate plate 11 from the mounting surface 110 side so that the core portion 22 protrudes from the surface on the opposite side of the substrate plate 11. Since the diameter of the through hole 100 is approximately equal to the diameter of the shaft portion 211, the mounting tool 200 is held on the mounting surface 110 in a stable posture, and the shaft 220 of the mounting tool 200 is in the surface normal direction of the mounting surface 110. Stretch. At this time, the tip of the shaft portion 211 is located in the through hole 100. The position of the outer shell portion 21 is set so that the length t of the shaft portion 211 exposed between the head portion 212 and the mounting surface 110 is equal to the thickness of the substrate 1.

そして、外殻部21の位置が変化しないようにして、引き出し部222を図6の矢印の方向、即ち、搭載面110の面法線方向に引っ張る。このとき、図7に示すように、芯部22が軸部分211の内部に留まるようにシャフト220を移動させる。その後、くびれ部221でシャフト220を切断することにより、図1に示したように、基板支持具20が搭載面110に取り付けられる。   Then, the drawer portion 222 is pulled in the direction of the arrow in FIG. 6, that is, the surface normal direction of the mounting surface 110 without changing the position of the outer shell portion 21. At this time, as shown in FIG. 7, the shaft 220 is moved so that the core portion 22 stays inside the shaft portion 211. Thereafter, by cutting the shaft 220 at the constricted portion 221, the substrate support 20 is attached to the mounting surface 110 as shown in FIG.

既に説明したように、芯部22の直径d1は外殻部21の内部空洞の直径よりもやや太く設定される。例えば、図8に示すように、外殻部21の内部空洞の直径が1.65mmである場合に、芯部22の直径d1が1.75mm程度、引き出し部222の直径d2が1.45mm程度に設定される。これにより、図7に示すように芯部22が外殻部21の内部空洞に押し込まれた場合に、外殻部21の内部空洞が押し広げられようにして、芯部22が内部空洞に挿入される。例えば、軸部分211の外径の直径が2.4mmから2.6mm程度まで増大する。その結果、軸部分211の外壁が貫通孔100の内壁に密着し、軸部分211が常に基板プレート11に強く圧着する状態となる。このため、基板支持具20が搭載面110から容易にはずれないサンプルホルダ10を実現できる。   As already described, the diameter d1 of the core portion 22 is set to be slightly thicker than the diameter of the internal cavity of the outer shell portion 21. For example, as shown in FIG. 8, when the diameter of the inner cavity of the outer shell portion 21 is 1.65 mm, the diameter d1 of the core portion 22 is about 1.75 mm, and the diameter d2 of the lead portion 222 is about 1.45 mm. Set to Thus, as shown in FIG. 7, when the core portion 22 is pushed into the internal cavity of the outer shell portion 21, the core portion 22 is inserted into the inner cavity so that the internal cavity of the outer shell portion 21 is expanded. Is done. For example, the diameter of the outer diameter of the shaft portion 211 increases from 2.4 mm to about 2.6 mm. As a result, the outer wall of the shaft portion 211 is in close contact with the inner wall of the through hole 100, and the shaft portion 211 is always firmly pressed against the substrate plate 11. For this reason, the sample holder 10 in which the substrate support 20 is not easily detached from the mounting surface 110 can be realized.

上記のように、サンプルホルダ10では、搭載面110に貫通孔100の開口部が形成される。しかし、貫通孔100は基板支持具20によって密閉されるため、貫通孔100の開口部に起因するホロー放電は発生しない。   As described above, in the sample holder 10, the opening of the through hole 100 is formed on the mounting surface 110. However, since the through hole 100 is sealed by the substrate support 20, no hollow discharge due to the opening of the through hole 100 is generated.

図1に示したサンプルホルダ10では、サンプルホルダの洗浄時に基板支持具20を搭載面110から取り外し、洗浄後に新たな基板支持具20を搭載面110に取り付ける場合でも、金属ピンのように圧入する必要がなく、且つ安定して基板支持具20を搭載面110に固定することができる。つまり、搭載面110に形成した穴の直径が若干広がったとしても、芯部22によって軸部分211が基板プレート11に強く圧着されるため、基板支持具20は基板1を支持できる十分な強度で搭載面110に固定される。   In the sample holder 10 shown in FIG. 1, even when the substrate support 20 is removed from the mounting surface 110 when the sample holder is cleaned, and a new substrate support 20 is attached to the mounting surface 110 after cleaning, it is press-fitted like a metal pin. There is no need and the substrate support 20 can be stably fixed to the mounting surface 110. That is, even if the diameter of the hole formed in the mounting surface 110 is slightly widened, the shaft portion 211 is strongly pressed against the substrate plate 11 by the core portion 22, so that the substrate support 20 has sufficient strength to support the substrate 1. Fixed to the mounting surface 110.

更に、搭載面110上に露出する軸部分211の長さtの管理も容易になり、組み立て性が向上する。また、基板支持具20の量産効果により、コストダウンも実現できる。   Furthermore, management of the length t of the shaft portion 211 exposed on the mounting surface 110 is facilitated, and assemblability is improved. Further, the cost reduction can be realized by the mass production effect of the substrate support 20.

基板支持具20を搭載面110に取り付ける作業では、貫通孔100への装着具200の取り付け、外殻部21の内部空洞への芯部22の挿入、シャフト220の切断の一連の作業などを専用のリベッターを使用して行うことができる。なお、搭載面110から基板支持具20を取り外すには、例えば3Kg程度の力で頭部212を引っ張ればよい。このような搭載面110からの基板支持具20の取り外しも、専用の工具を使用できる。このため、作業者の技術や経験に依存せずに、基板支持具20の取り付け及び取り外し作業を行うことができる。これにより、精度誤差を抑制することができる。   In the operation of attaching the substrate support 20 to the mounting surface 110, a series of operations such as attaching the mounting tool 200 to the through hole 100, inserting the core portion 22 into the inner cavity of the outer shell portion 21, and cutting the shaft 220 are dedicated. Can be done using a riveter. In order to remove the substrate support 20 from the mounting surface 110, for example, the head 212 may be pulled with a force of about 3 kg. A special tool can also be used for removing the substrate support 20 from the mounting surface 110. For this reason, the attachment and removal operations of the substrate support 20 can be performed without depending on the skill and experience of the operator. Thereby, an accuracy error can be suppressed.

基板支持具20の材料には、アルミニウム(Al)材やステンレス鋼(SUS)材などの金属材料を採用可能である。処理工程でサンプルホルダ10が高温になることなどを考慮すれば、SUS材を基板支持具20に好適に使用できる。しかし、基板支持具20の材料はSUSに限定されることは無く、処理工程の温度において変形などをしない耐熱性を有する材料であれば採用可能である。処理工程が700℃程度で行われる場合を考慮して、基板支持具20が700℃以上の耐熱性を有する材料からなることが好ましい。   A metal material such as an aluminum (Al) material or a stainless steel (SUS) material can be used as the material of the substrate support 20. In consideration of the high temperature of the sample holder 10 in the processing step, a SUS material can be suitably used for the substrate support 20. However, the material of the substrate support 20 is not limited to SUS, and any material having heat resistance that does not deform at the temperature of the processing step can be used. Considering the case where the processing step is performed at about 700 ° C., it is preferable that the substrate support 20 is made of a material having heat resistance of 700 ° C. or higher.

基板プレート11の材料には、Al材やSUS材なども採用可能であるが、成膜処理が例えば450℃以上の高温で行われる場合があることなどを考慮して、カーボン材を使用することが好ましい。或いは、導電性セラミックをサンプルホルダ10に採用してもよい。   Al material or SUS material can be used as the material of the substrate plate 11, but a carbon material should be used in consideration of the fact that the film forming process may be performed at a high temperature of, for example, 450 ° C. or higher. Is preferred. Alternatively, a conductive ceramic may be employed for the sample holder 10.

なお、図9に示すように、搭載面110の面法線方向に沿って複数の基板プレート11が並列に並べられたボートタイプのサンプルホルダ10を採用できる。基板プレート11のそれぞれの底部は固定板101によって固定されている。図9では、基板支持具20の図示を省略している。搭載面110を複数有するボートタイプのサンプルホルダ10を使用することにより、1回の成膜処理工程で処理できる基板1の枚数を増やすことができ、その結果、全体の処理時間を短縮することができる。   As shown in FIG. 9, a boat-type sample holder 10 in which a plurality of substrate plates 11 are arranged in parallel along the surface normal direction of the mounting surface 110 can be employed. Each bottom portion of the substrate plate 11 is fixed by a fixing plate 101. In FIG. 9, illustration of the substrate support 20 is omitted. By using the boat type sample holder 10 having a plurality of mounting surfaces 110, the number of substrates 1 that can be processed in one film forming process can be increased, and as a result, the overall processing time can be shortened. it can.

以上に説明したように、本発明の実施形態に係るサンプルホルダ10によれば、基板支持具20の取り付けと取り外しを繰り返しても、基板支持具20が搭載面110に安定して装着されるサンプルホルダを提供することができる。例えば、サンプルホルダ10を交換するまでの基板支持具20の取り付け及び取り外し回数は12回くらいが通常の目安とされているが、サンプルホルダ10では、取り付け及び取り外しを24回行っても、基板支持具20を搭載面110に十分な強度で取り付けることができた。   As described above, according to the sample holder 10 according to the embodiment of the present invention, the sample on which the substrate support 20 is stably attached to the mounting surface 110 even when the attachment and removal of the substrate support 20 are repeated. A holder can be provided. For example, the number of times the substrate support 20 is attached and removed until the sample holder 10 is replaced is usually 12 times. However, in the sample holder 10, the substrate support can be supported even if the attachment and removal are performed 24 times. The tool 20 could be attached to the mounting surface 110 with sufficient strength.

上記のように、本発明は実施形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかとなろう。即ち、本発明はここでは記載していない様々な実施形態等を含むことは勿論である。したがって、本発明の技術的範囲は上記の説明から妥当な特許請求の範囲に係る発明特定事項によってのみ定められるものである。   As mentioned above, although this invention was described by embodiment, it should not be understood that the description and drawing which form a part of this indication limit this invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art. That is, it goes without saying that the present invention includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

1…基板
10…サンプルホルダ
11…基板プレート
20…基板支持具
21…外殻部
22…芯部
100…貫通孔
101…固定板
110…搭載面
111…搭載位置
200…装着具
211…軸部分
212…頭部
220…シャフト
221…くびれ部
222…引き出し部
DESCRIPTION OF SYMBOLS 1 ... Substrate 10 ... Sample holder 11 ... Substrate plate 20 ... Substrate support 21 ... Outer shell part 22 ... Core part 100 ... Through-hole 101 ... Fixed plate 110 ... Mounting surface 111 ... Mounting position 200 ... Mounting tool 211 ... Shaft part 212 ... head 220 ... shaft 221 ... constriction 222 ... drawer

Claims (4)

プラズマ処理装置に格納されるサンプルホルダであって、
処理対象の基板を搭載する搭載面が垂直方向に延伸する基板プレートと、
内部に円筒形状の空洞を形成するようにそれぞれ環状に構成された軸部分と該軸部分よりも断面積の広い頭部からなる外殻部、及び前記外殻部の軸部分の内壁に密着して配置された円柱形状の芯部からなり、前記搭載面に前記軸部分の一部が埋め込まれた複数の基板支持具と
を備え、前記基板支持具の前記頭部と前記搭載面との隙間で前記軸部分に支持されて前記基板が配置されることを特徴とするサンプルホルダ。
A sample holder stored in a plasma processing apparatus,
A substrate plate on which a mounting surface for mounting a substrate to be processed extends vertically;
A shaft portion configured in an annular shape so as to form a cylindrical cavity inside, an outer shell portion comprising a head having a wider cross-sectional area than the shaft portion, and an inner wall of the shaft portion of the outer shell portion A plurality of substrate supports in which a part of the shaft portion is embedded in the mounting surface, and a gap between the head of the substrate support and the mounting surface A sample holder, wherein the substrate is arranged supported by the shaft portion.
前記基板支持具が700℃以上の耐熱性を有する材料からなることを特徴とする請求項1に記載のサンプルホルダ。   The sample holder according to claim 1, wherein the substrate support is made of a material having heat resistance of 700 ° C. or higher. 前記基板支持具がステンレス鋼であることを特徴とする請求項1に記載のサンプルホルダ。   The sample holder according to claim 1, wherein the substrate support is stainless steel. 前記搭載面を複数有することを特徴とする請求項1乃至3のいずれか1項に記載のサンプルホルダ。   The sample holder according to claim 1, wherein the sample holder has a plurality of mounting surfaces.
JP2013020088A 2013-02-05 2013-02-05 Sample holder Pending JP2014152339A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016154180A (en) * 2015-02-20 2016-08-25 株式会社島津製作所 Substrate supporter

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6337629A (en) * 1986-07-31 1988-02-18 Tokyo Electron Ltd Jig for holding wafer
JPH10199964A (en) * 1997-01-13 1998-07-31 Dainippon Screen Mfg Co Ltd Substrate rotation holding equipment and rotary substrate treating equipment
JP2004172241A (en) * 2002-11-18 2004-06-17 Sharp Corp Method and apparatus of manufacturing solar battery cell

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6337629A (en) * 1986-07-31 1988-02-18 Tokyo Electron Ltd Jig for holding wafer
JPH10199964A (en) * 1997-01-13 1998-07-31 Dainippon Screen Mfg Co Ltd Substrate rotation holding equipment and rotary substrate treating equipment
JP2004172241A (en) * 2002-11-18 2004-06-17 Sharp Corp Method and apparatus of manufacturing solar battery cell

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016154180A (en) * 2015-02-20 2016-08-25 株式会社島津製作所 Substrate supporter

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