JP2014145127A5 - - Google Patents
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- Publication number
- JP2014145127A5 JP2014145127A5 JP2013016171A JP2013016171A JP2014145127A5 JP 2014145127 A5 JP2014145127 A5 JP 2014145127A5 JP 2013016171 A JP2013016171 A JP 2013016171A JP 2013016171 A JP2013016171 A JP 2013016171A JP 2014145127 A5 JP2014145127 A5 JP 2014145127A5
- Authority
- JP
- Japan
- Prior art keywords
- tungsten
- dispersed
- base material
- fine particles
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 8
- 229910052721 tungsten Inorganic materials 0.000 description 8
- 239000010937 tungsten Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 4
- 229910001930 tungsten oxide Inorganic materials 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013016171A JP6045927B2 (ja) | 2013-01-30 | 2013-01-30 | めっき液及びめっき材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013016171A JP6045927B2 (ja) | 2013-01-30 | 2013-01-30 | めっき液及びめっき材 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014145127A JP2014145127A (ja) | 2014-08-14 |
JP2014145127A5 true JP2014145127A5 (enrdf_load_stackoverflow) | 2015-12-10 |
JP6045927B2 JP6045927B2 (ja) | 2016-12-14 |
Family
ID=51425597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013016171A Active JP6045927B2 (ja) | 2013-01-30 | 2013-01-30 | めっき液及びめっき材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6045927B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6361477B2 (ja) * | 2014-11-19 | 2018-07-25 | 株式会社オートネットワーク技術研究所 | コネクタ用端子 |
KR102787695B1 (ko) * | 2019-05-02 | 2025-03-27 | 주식회사 엘지화학 | 역전류 보호체의 제조방법 |
CN118099892B (zh) * | 2024-04-24 | 2024-06-25 | 珠海聚能精密工业有限公司 | 一种耐腐蚀铜端子及其加工工艺 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0920996A (ja) * | 1995-07-03 | 1997-01-21 | Kawasaki Steel Corp | 加工後耐食性に優れた電気めっき鋼板の製造方法 |
JP3913118B2 (ja) * | 2002-06-13 | 2007-05-09 | 忠正 藤村 | 超微粒ダイヤモンド粒子を分散した金属薄膜層、該薄膜層を有する金属材料、及びそれらの製造方法 |
US20060290000A1 (en) * | 2005-06-28 | 2006-12-28 | Wojciech Worwag | Composite metal layer formed using metal nanocrystalline particles in an electroplating bath |
JP4719646B2 (ja) * | 2006-08-25 | 2011-07-06 | 日精樹脂工業株式会社 | 複合めっき製品の製造方法 |
JP4163728B2 (ja) * | 2006-10-02 | 2008-10-08 | エス・イー・エス株式会社 | 電気めっき方法 |
JP2009052116A (ja) * | 2007-08-29 | 2009-03-12 | Univ Kanagawa | 塩素発生用電極 |
JP2012036436A (ja) * | 2010-08-05 | 2012-02-23 | Mitsubishi Materials Corp | Sn合金めっき付き導電材及びその製造方法 |
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2013
- 2013-01-30 JP JP2013016171A patent/JP6045927B2/ja active Active
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