JP2014125671A - Vapor deposition mask, and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vapor deposition mask improved in an opening pattern shape and location accuracy.SOLUTION: A vapor deposition mask includes: a resin film 2 in which an opening pattern 6 with the same dimensions as that of a thin film pattern to be deposited on a substrate is formed; and a thin-plate type magnetic metal member 1 through which a through hole 4 is provided, of which size includes the opening pattern 6. The vapor deposition mask has a structure in which the resin film 2 and the thin-plate type film 2 contact tightly. A dummy through hole 5 is provided in a region of the magnetic metal member 1, other than the an evaporation effective region which includes the through hole 4. A dummy opening pattern 7 is provided to control deformation of the opening pattern 6 and the through hole 4, the deformation being caused by difference in thermal expansion between the film 2 and the magnetic metal member 1.

Description

  The present invention relates to a vapor deposition mask having a structure in which a resin film provided with an opening pattern is supported by a thin plate-shaped magnetic metal member, and particularly relates to a vapor deposition mask capable of improving the shape and positional accuracy of the opening pattern and a method for manufacturing the same. is there.

  A conventional vapor deposition mask has a plurality of opening patterns formed on a metal plate, a mask main body around each of the plurality of opening patterns, and a thickness of the mask main body located around the mask main body. And a peripheral portion having a large thickness (see, for example, Patent Document 1).

JP 2001-237072 A

  However, since such a conventional vapor deposition mask forms a plurality of opening patterns penetrating through the metal plate by etching the metal plate, a high-definition opening pattern cannot be accurately formed. . In particular, in the case of a deposition mask for, for example, an organic EL display panel having a large area with a side length of several tens of centimeters or more, an opening pattern on the entire mask surface cannot be formed uniformly due to the occurrence of etching unevenness.

  In view of this, the applicant applied a thin film-like magnetic film having a resin film in which an opening pattern having the same shape and dimension as the thin film pattern deposited on the substrate and a through hole containing the opening pattern were formed. A composite deposition mask having a structure in which a metal member is in close contact is proposed.

  The composite deposition mask is formed by laser-processing an opening pattern on a thin resin film having a thickness of about 10 μm to 30 μm, and can form a high-definition opening pattern with high accuracy, as described above. Such a large-area vapor deposition mask has a feature that an opening pattern can be formed uniformly over the entire mask.

  However, in the composite deposition mask, a magnetic metal member having a small thermal expansion coefficient such as Invar or Invar alloy and a member having a relatively large thermal expansion coefficient such as a resin film are brought into close contact with each other at room temperature or higher. Later, when the aperture pattern was laser processed, the aperture pattern and the through hole were sometimes deformed due to the difference in thermal expansion between the two members.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a vapor deposition mask capable of addressing such problems and improving the shape and position accuracy of an opening pattern and a method for manufacturing the same.

  In order to achieve the above object, a vapor deposition mask according to a first aspect of the present invention comprises a resin film in which an opening pattern having the same shape and dimension as a thin film pattern deposited on a substrate is formed, and the opening pattern A vapor deposition mask having a structure in which a thin plate-like magnetic metal member having a through-hole having a size to enclose a thin film is in close contact with the magnetic metal member outside the vapor deposition effective region enclosing the through-hole. A hole is provided, and the opening in the dummy through hole is provided with a dummy opening pattern for controlling the opening pattern generated by the difference in thermal expansion between the film and the magnetic metal member and the deformation of the through hole. It is provided.

  According to a second aspect of the present invention, there is provided a vapor deposition mask manufacturing method including a resin film formed with an opening pattern having the same shape and dimension as a thin film pattern deposited on a substrate, and the opening pattern. A method of manufacturing a vapor deposition mask having a structure in which a thin plate-like magnetic metal member having a through-hole of a size is in close contact, wherein a through-hole is provided in an effective area for vapor deposition, and dummy penetration is performed outside the effective area A first step of forming a mask member having a structure in which a resinous film is in close contact with one surface of a thin plate-like magnetic metal member provided with a hole, and the opening pattern is formed by penetrating the film in the through hole And a third step of forming the dummy opening pattern by penetrating the film in the dummy through hole.

  According to the present invention, it is possible to control the deformation of the opening pattern and the through hole based on the difference in thermal expansion between the magnetic metal member and the film by forming the dummy opening pattern outside the effective area of vapor deposition. Therefore, the shape and position accuracy of the opening pattern can be improved.

It is a figure which shows embodiment of the vapor deposition mask by this invention, (a) is a top view, (b) is the OO line cross-sectional view of (a). It is a flowchart explaining the manufacturing method of the vapor deposition mask by this invention. It is process drawing which shows the formation step of the member for masks in the manufacturing method of the vapor deposition mask by this invention in a cross section. It is process drawing which shows the flame | frame joining step in the manufacturing method of the vapor deposition mask by this invention in a cross section. It is process drawing which shows the opening pattern formation step in the manufacturing method of the vapor deposition mask by this invention in a cross section. It is process drawing which shows the dummy opening pattern formation stage in the manufacturing method of the vapor deposition mask by this invention in a cross section. It is explanatory drawing shown about the deformation | transformation control of the opening pattern and through-hole in the manufacturing method of the vapor deposition mask by this invention.

  Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. 1A and 1B are views showing an embodiment of a vapor deposition mask according to the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line OO in FIG. This vapor deposition mask has a structure in which a resin film provided with an opening pattern is supported by a thin magnetic metal member, and includes a magnetic metal member 1, a resin film 2, and a frame 3. Yes.

The magnetic metal member 1 is in the form of a thin plate (sheet) made of a magnetic metal material such as nickel, nickel alloy, invar or invar alloy having a thickness of about 30 μm to 50 μm. A plurality of through-holes 4 having a size including a plurality of thin film patterns arranged in a line, for example, a plurality of thin film patterns arranged in a line, are arranged at the same pitch as the horizontal arrangement pitch of the plurality of thin film patterns. It is provided side by side. In the following description, the case where the magnetic metal member 1 is an invar or an invar alloy having a thermal expansion coefficient of 1 × 10 ⁻⁶ / ° C. or less will be described.

  In addition, a dummy through hole 5 is provided in the magnetic metal member 1 outside the effective region of vapor deposition including the plurality of through holes 4. Specifically, the dummy through-holes 5 are provided on both sides in the arrangement direction of the plurality of through-holes 4. In this case, among the plurality of through holes 4 provided in the magnetic metal member 1 with a constant arrangement pitch, the through holes 4 located outside the effective region of vapor deposition may be used as the dummy through holes 5.

  A film 2 is provided in close contact with one surface of the magnetic metal member 1. This film 2 is a resin film that transmits visible light such as polyimide or polyethylene terephthalate (PET) having a thickness of about 10 μm to 30 μm, and corresponds to a thin film pattern in the through hole 4 of the magnetic metal member 1. An opening pattern 6 having the same shape and dimension as the thin film pattern is formed at the position. Further, the film 2 in the dummy through hole 5 has at least one dummy for controlling the deformation of the opening pattern 6 and the through hole 4 generated due to the difference in thermal expansion between the film 2 and the magnetic metal member 1. An opening pattern 7 is provided. FIG. 1 shows a case where one dummy opening pattern 7 is provided as an example. Further, in order to control the deformation of the opening pattern 6 in the Y direction that intersects the arrangement direction of the plurality of through holes 4 (the X direction in FIG. 1), the dummy opening pattern 7 is parallel to the X direction outside the effective deposition area in the Y direction. May be provided.

  A frame-like frame 3 is provided by joining one end surface 3 a to the peripheral edge of the magnetic metal member 1. The frame 3 supports the magnetic metal member 1 in a stretched manner, and is provided with nickel or a nickel alloy provided with openings 8 having a size including the plurality of through holes 4 and dummy through holes 5 of the magnetic metal member 1. , Invar or Invar alloy. The frame 3 is preferably formed of the same magnetic material as that of the magnetic metal member 1 in order to suppress the generation of thermal stress during vapor deposition and prevent deformation of the vapor deposition mask.

Next, the manufacturing method of the vapor deposition mask comprised in this way is demonstrated.
FIG. 2 is a flowchart illustrating a method for manufacturing a vapor deposition mask according to the present invention. This vapor deposition mask manufacturing method is to form the opening pattern 6 penetrating through a predetermined position of the resinous film 2 by laser processing. The frame 3 is joined to the step S1 for forming the mask member 12. Step S2, Step S3 for forming the opening pattern 6 and Step S4 for forming the dummy opening pattern 7 are included.

  The step S1 has a structure in which the magnetic metal member 1 provided with the through-hole 4 penetrating through the opening pattern 6 and the dummy through-hole 5 large enough to contain the dummy opening pattern 7 on one surface of the film 2 is in close contact. This is a step of forming the mask member 12. Hereinafter, this will be described in detail with reference to FIG.

  First, as shown in FIG. 3A, a magnetic metal sheet 9 made of invar or an invar alloy and having a thickness of about 30 μm to 50 μm is cut out according to the surface area of the substrate to be deposited, and the magnetic metal A resin liquid such as polyimide is applied to one surface 9a of the sheet 9 and cured at a temperature of about 200 ° C. to 300 ° C. to form a film 2 that transmits visible light having a thickness of about 10 μm to 30 μm.

  Next, as shown in FIG. 3B, a resist is applied on the other surface 9b of the magnetic metal sheet 9, for example, by spraying, and then dried to form a resist film. Next, the resist is formed using a photomask. The film is exposed and developed, and a plurality of openings having a size including the opening pattern 6 and the dummy opening pattern 7 at positions corresponding to the plurality of opening patterns 6 and the dummy opening pattern 7 formed in steps S3 and S4 described later. A resist mask 11 having 10 is formed.

  Subsequently, as shown in FIG. 3C, the magnetic metal sheet 9 is wet-etched using the resist mask 11 to remove the portion of the magnetic metal sheet 9 corresponding to the opening 10 of the resist mask. 4 and the dummy through hole 5 are provided to form the magnetic metal member 1, and then the resist mask 11 is removed by dissolving it in an organic solvent, for example. Thereby, the mask member 12 in which the magnetic metal member 1 and the resin film 2 are brought into close contact with each other is formed. The etching solution for etching the magnetic metal sheet 9 is appropriately selected according to the material of the magnetic metal sheet 9 to be used, and a known technique can be applied.

  Further, when the magnetic metal sheet 9 is etched to form the through holes 4 and the dummy through holes 5, a substrate-side alignment mark provided in advance on the substrate at a predetermined position outside the formation region of the plurality of through holes 4 A mask-side alignment mark (not shown) for alignment with the mask may be formed at the same time. In this case, when the resist mask 11 is formed, an alignment mark opening may be provided at a position corresponding to the mask side alignment mark.

  The above step S2 is used for masking one end surface 3a of the frame-like frame 3 made of invar or invar alloy provided with openings 8 having a size including the plurality of through holes 4 and dummy through holes 5 of the magnetic metal member 1. In this step, the member 12 is stretched and the peripheral edge portion of the magnetic metal member 1 is joined to the one end surface 3 a of the frame 3. Hereinafter, this will be described in detail with reference to FIG.

  First, as shown in FIG. 4A, for example, a KrF 248 nm excimer laser or a third harmonic or a fourth harmonic of a YAG laser is used for the portion of the film 2 corresponding to the peripheral edge of the magnetic metal member 1. Then, the laser beam L having a wavelength of 400 nm or less is irradiated to ablate and remove the portion of the film 2.

  Next, as shown in FIG. 4B, the mask member 12 is tensioned so as not to bend the mask member 12 in the side parallel to the surface of the mask member 12 (in the direction of the arrow). It is positioned above the frame 3 in the hung state.

  Further, as shown in FIG. 4 (c), the mask member 12 is stretched on one end surface 3a of the frame 3 in a state in which tension is applied in the side parallel to the surface, and the peripheral portion of the magnetic metal member 1 is Spot welding is performed on the frame 3.

  Step S3 is a step of irradiating the portion of the film 2 at a position corresponding to the thin film pattern in the through hole 4 with the laser light L to form an opening pattern 6 having the same shape and dimension as the thin film pattern. Hereinafter, this will be described in detail with reference to FIG.

  First, as shown in FIG. 5A, the surface of the reference substrate 14 on which the reference pattern 13 that is the irradiation target of the laser beam L is formed at the position corresponding to the thin film pattern to be formed, on which the reference pattern 13 is formed. The mask member 12 with the film 2 side down is positioned above the smooth surface 14b opposite to 13a, and the mask side provided on the mask member 12 and the substrate side alignment mark provided in advance on the reference substrate 14 The mask member 12 is aligned with the reference substrate 14 using the alignment mark.

  Next, as shown in FIG. 5B, the film 2 of the mask member 12 is brought into close contact with the smooth surface 14 b of the reference substrate 14. At this time, a liquid film is formed between the film 2 and the smooth surface 14b of the reference substrate 14 to form a meniscus of the liquid film, and the film 2 and the reference substrate 14 are brought into close contact by the adsorption force generated by the Laplace pressure. May be. In this case, due to the presence of the liquid film, it is possible to avoid the occurrence of uncut (burrs) at the edge of the opening pattern 6 on the reference substrate 14 side in the subsequent laser processing step of the opening pattern 6.

Subsequently, as shown in FIG. 5C, the reference substrate 14 and the laser irradiation apparatus are moved stepwise in the XY two-dimensional direction within a plane parallel to the surface of the reference substrate 14. aiming the reference pattern 13, the third harmonic of the irradiation area is the energy density which is formatted to be the same as the thin film pattern of ^{1J / cm 2 ~20J / cm 2} , for example excimer lasers KrF248nm or YAG laser, Or the fourth harmonic laser beam L is applied, and the film 2 is ablated to form the opening pattern 6. In this case, the opening pattern 6 may be performed by laser irradiation of a plurality of shots.

Here, the film 2, for example, polyimide, has a thermal expansion coefficient of 3 to 5 × 10 ⁻⁵ / ° C., which is one digit larger than the thermal expansion coefficient of Invar or Invar alloy of the magnetic metal member 1. Accordingly, the film 2 cured at 200 ° C. to 300 ° C. and then cooled to room temperature is subjected to tensile stress in a direction parallel to the surface due to the difference in thermal expansion coefficient. In this case, since the tensile stress acting on the film 2 is balanced in the plane when the mask member 12 is formed, the shapes and positions of the through holes 4 and the dummy through holes 5 are designed as shown in FIG. It is kept in the same state as the value.

  However, when the opening pattern 6 is formed in the film 2, the stress balance is lost and the film 2 tends to shrink. In particular, the shrinkage amount of the film 2 in the peripheral region where the opening pattern 6 is not formed is large, and the deformation amount of the through hole 4 and the opening pattern 6 is larger in the peripheral portion than in the central portion. For example, as shown in FIG. 7A, in the case of a mask member 12 in which a plurality of stripe-shaped through holes 4 elongated in the Y direction are arranged in parallel to the major axis in the X direction, FIG. As shown in FIG. 3, the amount of deformation increases as the through hole 4 and the opening pattern 6 are located outward in the X direction.

Therefore, in the method for manufacturing a vapor deposition mask of the present invention, step S4 for forming the dummy opening pattern 7 is performed.
FIG. 6 is an explanatory diagram showing the process of forming the dummy opening pattern 7 in step S4. In step S4, when all the opening patterns 6 are formed, the dummy opening pattern 7 is laser processed at a predetermined position in the left dummy through hole 5 shown in FIG. Thereafter, as shown in FIG. 5B, the dummy opening pattern 7 is laser processed at a predetermined position in the right dummy through hole 5. Thereby, the said deformation | transformation of the opening pattern 6 and the through-hole 4 is controlled.

  More specifically, as shown in FIG. 7C, a stripe-shaped dummy opening pattern 7 parallel to the long axis of the dummy through hole 5 is formed in the film 2 in the dummy through hole 5. As a result, the central region effective for vapor deposition of the mask member 12 is released from the force of the film 2 located in the peripheral region, and the plurality of through-holes 4 and the opening pattern 6 located in the central region are released. Deformation is suppressed. Therefore, the formation and position of the through holes 4 and the opening patterns 6 can be adjusted by forming the dummy opening patterns 7 as described above. In this case, the deformation can be controlled by appropriately controlling at least one of the area (stripe length), position, and number of the dummy opening patterns 7. The area (stripe length), position, and number of the dummy opening patterns 7 can be determined by experiment or theoretical analysis. In this way, the vapor deposition mask according to the present invention shown in FIG. 1 is completed.

  In the above description, the case where the frame 3 is joined to the magnetic metal member 1 to support the mask has been described, but the frame 3 may be omitted.

  In the above description, the vapor deposition mask of the unit has been described. However, the present invention is not limited to this, and can be applied to a vapor deposition mask for forming a plurality of panels on a large area substrate. it can. In this case, it is preferable to arrange a vapor deposition mask of a unit according to the present invention corresponding to each panel multi-faced on the substrate.

DESCRIPTION OF SYMBOLS 1 ... Magnetic metal member 2 ... Film 3 ... Frame 4 ... Through-hole 5 ... Dummy through-hole 6 ... Opening pattern 7 ... Dummy opening pattern

Claims (8)

A thin plate-like magnetic metal member having a resin film formed with an opening pattern having the same shape and dimension as the thin film pattern deposited on the substrate, and a through-hole having a size including the opening pattern Is a vapor deposition mask with a structure closely in contact with,
A dummy through hole is provided in a portion of the magnetic metal member outside the vapor deposition effective region including the through hole, and the film in the dummy through hole has a thermal expansion difference between the film and the magnetic metal member. A vapor deposition mask comprising a dummy opening pattern for controlling the generated opening pattern and deformation of the through hole.   2. The vapor deposition according to claim 1, wherein the magnetic metal member is provided with a plurality of the through holes arranged side by side, and the dummy through holes are provided on both sides in the arrangement direction of the plurality of through holes. mask.   The vapor deposition mask according to claim 1, wherein at least one dummy opening pattern is provided in the dummy through hole.   4. The magnetic metal member according to claim 1, wherein the magnetic metal member is joined to one end surface of a frame-like frame having an opening having a size including the through hole and the dummy through hole. Deposition mask. A thin plate-like magnetic metal member having a resin film formed with an opening pattern having the same shape and dimension as the thin film pattern deposited on the substrate, and a through-hole having a size including the opening pattern And a method of manufacturing a vapor deposition mask having a structure in close contact with
A mask member having a structure in which a through-hole is provided in an effective area for vapor deposition and a resinous film is in close contact with one surface of a thin plate-like magnetic metal member provided with a dummy through-hole outside the effective area is formed. One step,
A second step of forming the opening pattern by penetrating the film in the through hole;
A third step of forming the dummy opening pattern by penetrating the film in the dummy through hole;
A method of manufacturing a vapor deposition mask, comprising:   Controlling at least one of the area, number, and position of the dummy opening pattern to control deformation of the opening pattern and the through hole caused by a difference in thermal expansion between the film and the magnetic metal member. The method of manufacturing a vapor deposition mask according to claim 5.   The method for manufacturing a vapor deposition mask according to claim 5 or 6, wherein the dummy through holes are provided on both sides in the arrangement direction of the plurality of through holes provided side by side on the magnetic metal member.   Between the first stage and the second stage, the magnetic metal member of the mask member is disposed on one end surface of a frame-like frame having an opening having a size including the through hole and the dummy through hole. The method for manufacturing a vapor deposition mask according to any one of claims 5 to 7, further comprising a step of bonding.