JP2014101539A - Production method of vapor deposition mask - Google Patents
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- JP2014101539A JP2014101539A JP2012253232A JP2012253232A JP2014101539A JP 2014101539 A JP2014101539 A JP 2014101539A JP 2012253232 A JP2012253232 A JP 2012253232A JP 2012253232 A JP2012253232 A JP 2012253232A JP 2014101539 A JP2014101539 A JP 2014101539A
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000010408 film Substances 0.000 claims abstract description 29
- 239000010409 thin film Substances 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 230000001678 irradiating effect Effects 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 description 8
- 239000002131 composite material Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Abstract
Description
本発明は、薄膜パターンに対応して複数の開口パターンをレーザ加工した樹脂製フィルムを薄板状の磁性金属部材で支持した複合型の蒸着マスクの製造方法に関し、特に開口パターンのレーザ加工時間を短縮し得る蒸着マスクの製造方法に係るものである。 The present invention relates to a method for manufacturing a composite deposition mask in which a resin film obtained by laser processing a plurality of aperture patterns corresponding to a thin film pattern is supported by a thin plate-like magnetic metal member, and in particular, shortens the laser processing time of the aperture pattern. The present invention relates to a method for manufacturing an evaporation mask that can be used.
従来の蒸着マスクの製造方法は、複数の貫通開口を有する第１レジストパターンを金属板上に形成し、上記第１レジストパターンの貫通開口を介してエッチング処理を行なって上記金属板に貫通する複数の開口パターンを形成した後、上記第１レジストパターンを除去し、上記複数の開口パターンの各々の周りの所定幅の金属縁部を各々が露出せしめる複数の第２貫通開口を有する第２レジストパターンを上記金属板上に形成し、上記第２レジストパターンの第２貫通開口を介してエッチング処理を行なって上記複数の貫通開口の各々の周りのマスク本体部と該マスク本体部の周囲に位置するマスク本体部の厚さより大なる厚さを有する周縁部とを形成した後、上記第２レジストパターンを除去するものとなっていた（例えば、特許文献１参照）。 In the conventional method for manufacturing a vapor deposition mask, a first resist pattern having a plurality of through openings is formed on a metal plate, and etching is performed through the through openings of the first resist pattern to penetrate the metal plate. After the first opening pattern is formed, the first resist pattern is removed, and a second resist pattern having a plurality of second through-openings each exposing a metal edge of a predetermined width around each of the plurality of opening patterns Is formed on the metal plate, and is etched through the second through-openings of the second resist pattern to be positioned around the mask main-body portions and the mask main-body portions around each of the plurality of through-openings. The second resist pattern is removed after forming a peripheral portion having a thickness larger than the thickness of the mask body (see, for example, Patent Document 1). ).
しかし、このような従来の蒸着マスクの製造方法においては、金属板をエッチング処理して該金属板に貫通する複数の開口パターンを形成しているので、高精細な開口パターンを精度よく形成することができなかった。特に、一辺の長さが数１０ｃｍ以上の大面積の例えば有機ＥＬ表示パネル用の蒸着マスクの場合、エッチングむらの発生によりマスク全面の開口パターンを均一に形成することができなかった。 However, in such a conventional vapor deposition mask manufacturing method, a metal plate is etched to form a plurality of opening patterns penetrating the metal plate, so that a high-definition opening pattern can be accurately formed. I could not. In particular, in the case of a deposition mask for, for example, an organic EL display panel having a large area with a side length of several tens of centimeters or more, an opening pattern on the entire mask surface cannot be formed uniformly due to the occurrence of etching unevenness.
そこで、出願人は、薄膜パターンに対応して複数の貫通孔を形成した磁性金属部材に、上記薄膜パターンに対応して貫通する複数の開口パターンを形成した樹脂製フィルムを密接させた構成の複合型の蒸着マスクを提案している。 Therefore, the applicant has a composite structure in which a resin film having a plurality of opening patterns penetrating the thin film pattern is in close contact with a magnetic metal member having a plurality of through holes corresponding to the thin film pattern. A type of evaporation mask is proposed.
上記複合型の蒸着マスクは、厚みが１０μｍ〜３０μｍ程度の薄い樹脂製フィルムに開口パターンをレーザ加工して形成するものであり、高精細な開口パターンを精度よく形成することができると共に、上述のような大面積の蒸着マスクもマスク全面に亘って均一に開口パターンを形成することができるという特徴を有している。 The composite deposition mask is formed by laser-processing an opening pattern on a thin resin film having a thickness of about 10 μm to 30 μm, and can form a high-definition opening pattern with high accuracy, as described above. Such a large-area vapor deposition mask has a feature that an opening pattern can be uniformly formed over the entire surface of the mask.
この場合、上記開口パターンは、該開口パターンの面積と同じ照射面積を有するように整形されたレーザ光をフィルムに照射して形成されている。しかしながら、上述のような大面積の例えば有機ＥＬ表示パネル用の蒸着マスクの場合、表示パネルの各ピクセルに対応して複数の開口パターンを形成する必要があり、レーザ加工に長時間を有していた。 In this case, the opening pattern is formed by irradiating the film with laser light shaped to have the same irradiation area as the opening pattern. However, in the case of a vapor deposition mask for, for example, an organic EL display panel having a large area as described above, it is necessary to form a plurality of opening patterns corresponding to each pixel of the display panel, and laser processing takes a long time. It was.
そこで、本発明は、このような問題点に対処し、開口パターンのレーザ加工時間を短縮し得る蒸着マスクの製造方法を提供することを目的とする。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for manufacturing a vapor deposition mask capable of addressing such problems and shortening the laser processing time of the opening pattern.
上記目的を達成するために、本発明による蒸着マスクの製造方法は、蒸着形成しようとする複数の薄膜パターンに対応した位置に該薄膜パターンよりも形状寸法の大きい複数の貫通孔を設けた磁性金属部材と樹脂製のフィルムとを密接させたマスク用部材を形成した後、前記各貫通孔内の前記フィルム部分にレーザ光を照射し、前記薄膜パターンに対応した位置に該薄膜パターンと形状寸法の同じ開口パターンをレーザ加工する蒸着マスクの製造方法であって、前記開口パターンのレーザ加工は、形成しようとする前記開口パターンの各辺に沿って該開口パターンよりも幅の狭いストライプ状のレーザ光を照射して行うものである。 In order to achieve the above object, a method of manufacturing a vapor deposition mask according to the present invention provides a magnetic metal having a plurality of through holes having a shape dimension larger than that of the thin film pattern at a position corresponding to the plurality of thin film patterns to be vapor deposited. After forming the mask member in which the member and the resin film are brought into close contact with each other, the film portion in each of the through holes is irradiated with laser light, and the thin film pattern and the shape dimension of the film portion are positioned at a position corresponding to the thin film pattern. A method of manufacturing a vapor deposition mask in which the same opening pattern is laser-processed, and the laser processing of the opening pattern includes a striped laser beam having a narrower width than the opening pattern along each side of the opening pattern to be formed. Is performed.
本発明によれば、複数の開口パターンの同一の辺を同時にレーザ加工することができ、複数の開口パターンを一つずつレーザ加工する場合に比べて開口パターンのレーザ加工時間を短縮することができる。したがって、１辺の長さが数１０ｃｍ以上の大面積の蒸着マスクも短時間に容易に製造することができ、製造コストを低減することができる。 According to the present invention, the same side of a plurality of opening patterns can be laser processed at the same time, and the laser processing time of the opening pattern can be shortened compared to the case of laser processing a plurality of opening patterns one by one. . Therefore, a large-area vapor deposition mask having a side length of several tens of centimeters or more can be easily manufactured in a short time, and the manufacturing cost can be reduced.
以下、本発明の実施形態を添付図面に基づいて詳細に説明する。図１は本発明による蒸着マスクの製造方法の実施形態を示すフローチャートである。この蒸着マスクの製造方法は、薄膜パターンに対応して複数の開口パターンをレーザ加工した樹脂製フィルムを薄板状の磁性金属部材で支持した複合型の蒸着マスクを製造するもので、マスク用部材を形成する第１ステップＳ１と、フィルムをレーザ加工して開口パターンを形成する第２ステップＳ２と、を含んでいる。 Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a flowchart showing an embodiment of a method for manufacturing a vapor deposition mask according to the present invention. This vapor deposition mask manufacturing method manufactures a composite type vapor deposition mask in which a resin film obtained by laser processing a plurality of opening patterns corresponding to a thin film pattern is supported by a thin plate-like magnetic metal member. A first step S1 to be formed and a second step S2 to form an opening pattern by laser processing of the film are included.
図２は本発明の製造方法によって製造される複合型の蒸着マスクを示す図であり、（ａ）は平面図、（ｂ）は（ａ）のＯ−Ｏ線断面矢視図である。
この複合型の蒸着マスクは、基板に形成される複数の薄膜パターンに対応した位置に該薄膜パターンよりも形状寸法の大きい複数の貫通孔１を形成した磁性金属部材２と、複数の薄膜パターンに対応した位置に該薄膜パターンと形状寸法の同じ貫通する複数の開口パターン３を形成した可視光を透過する樹脂製フィルム４とを、開口パターン３が上記貫通孔１内に位置するように互いに密接した構造を有している。貫通孔１及び開口パターン３は、ストライプ状の細長い形状を有するものであってもよいが、ここでは、同図に示すように、リブ５によって分離されて一列に並んだ複数の矩形状の貫通孔１が一定の配列ピッチで複数列配置されており、各貫通孔１内に上記開口パターン３が形成されたものについて説明する。
2A and 2B are diagrams showing a composite-type vapor deposition mask manufactured by the manufacturing method of the present invention. FIG. 2A is a plan view, and FIG. 2B is a cross-sectional view taken along the line OO in FIG.
This composite type vapor deposition mask includes a magnetic metal member 2 in which a plurality of through holes 1 having a shape and dimension larger than that of the thin film pattern are formed at positions corresponding to the plurality of thin film patterns formed on the substrate, and a plurality of thin film patterns. A resin film 4 that transmits visible light and has a plurality of aperture patterns 3 penetrating in the same position as the thin film pattern is placed in close contact with each other so that the aperture pattern 3 is located in the through hole 1. It has the structure. The through-hole 1 and the opening pattern 3 may have a striped elongated shape, but here, as shown in the figure, a plurality of rectangular through-holes separated by ribs 5 and arranged in a line. A description will be given of a case where the holes 1 are arranged in a plurality of rows at a constant arrangement pitch and the opening pattern 3 is formed in each through-hole 1.
より詳細には、例えば１辺の長さが１ｍ以上の大面積の有機ＥＬ表示パネル用の蒸着マスクであり、例えば赤（Ｒ）対応のアノード電極に対応した位置に上記貫通孔１及び開口パターン３が形成されたものである。以下、このような複合型の蒸着マスクの製造方法をステップ毎に説明する。 More specifically, for example, it is a vapor deposition mask for a large area organic EL display panel having a side length of 1 m or more. For example, the through hole 1 and the opening pattern are arranged at positions corresponding to the anode electrode corresponding to red (R). 3 is formed. Hereinafter, a method for manufacturing such a composite deposition mask will be described step by step.
上記第１ステップＳ１は、蒸着形成しようとする複数の薄膜パターンに対応した位置に該薄膜パターンよりも形状寸法の大きい複数の貫通孔１を設けた磁性金属部材２と樹脂製のフィルム４とを密接させてマスク用部材を形成する工程である。 In the first step S1, the magnetic metal member 2 and the resin film 4 provided with a plurality of through holes 1 having a shape and dimension larger than that of the thin film pattern at positions corresponding to the plurality of thin film patterns to be formed by vapor deposition. This is a step of forming a mask member in close contact.
詳細には、図３（ａ）に示すように、厚みが約３０μｍ〜約５０μｍのニッケル、ニッケル合金、インバー又はインバー合金等の材料からなる磁性金属シート６の一面６ａに例えばポリイミド又はポリエチレンテレフタレート（ＰＥＴ）等の樹脂液を塗布して乾燥させ、厚みが約１０μｍ〜約３０μｍの可視光を透過する樹脂製のフィルム４を形成する。 More specifically, as shown in FIG. 3A, for example, polyimide or polyethylene terephthalate (polyimide or polyethylene terephthalate) is formed on one surface 6a of a magnetic metal sheet 6 made of a material such as nickel, nickel alloy, invar or invar alloy having a thickness of about 30 μm to about 50 μm. A resin liquid such as PET) is applied and dried to form a resin film 4 having a thickness of about 10 μm to about 30 μm and transmitting visible light.
次に、図３（ｂ）に示すように、磁性金属シート６の他面６ｂにレジストを例えばスプレー塗布した後、これを乾燥させてレジストフィルムを形成し、次に、フォトマスクを使用してレジストフィルムを露光・現像して複数の薄膜パターンに対応した位置に該薄膜パターンよりも形状寸法の大きい複数の貫通開口７を設けたレジストマスク８を形成する。 Next, as shown in FIG. 3B, a resist is applied on the other surface 6b of the magnetic metal sheet 6 by spraying, for example, and then dried to form a resist film, and then using a photomask. The resist film is exposed and developed to form a resist mask 8 provided with a plurality of through openings 7 having a shape dimension larger than that of the thin film pattern at a position corresponding to the plurality of thin film patterns.
続いて、図３（ｃ）に示すように、上記レジストマスク８を使用して磁性金属シート６をウェットエッチングし、レジストマスク８の貫通開口７に対応した部分の磁性金属シート６を除去して貫通孔１を形成する。これにより、磁性金属部材２と樹脂製のフィルム４とを密接させたマスク用部材９が形成される。なお、磁性金属シート６をエッチングするためのエッチング液は、使用する磁性金属シート６の材料に応じて適宜選択され、公知の技術を適用することができる。 Subsequently, as shown in FIG. 3C, the magnetic metal sheet 6 is wet-etched using the resist mask 8, and a portion of the magnetic metal sheet 6 corresponding to the through opening 7 of the resist mask 8 is removed. The through hole 1 is formed. Thereby, the mask member 9 in which the magnetic metal member 2 and the resin film 4 are brought into close contact with each other is formed. In addition, the etching liquid for etching the magnetic metal sheet 6 is appropriately selected according to the material of the magnetic metal sheet 6 to be used, and a known technique can be applied.
上記第２ステップＳ２は、各貫通孔１内のフィルム４部分にレーザ光Ｌを照射し、薄膜パターンに対応した位置に該薄膜パターンと形状寸法の同じ開口パターン３をレーザ加工する工程である。ここで使用するレーザは、波長が４００ｎｍ以下の、例えばＫｒＦ２４８ｎｍのエキシマレーザである。 The second step S2 is a step of irradiating the film 4 in each through hole 1 with laser light L and laser processing the opening pattern 3 having the same shape and dimension as the thin film pattern at a position corresponding to the thin film pattern. The laser used here is an excimer laser having a wavelength of 400 nm or less, for example, KrF248 nm.
詳細には、図４（ａ）に示すように、開口パターン３のレーザ加工は、形成しようとする開口パターン３の各辺に沿って該開口パターン３の幅よりも幅の狭いストライプ状のレーザ光Ｌをフィルム４に照射して行う。この場合、先ず、一列に並んだ複数の貫通孔１の列の中心軸に対して平行にストライプ状のレーザ光Ｌを同図に矢印で示す方向にステップ移動しながら、開口パターン３の上記中心軸に平行な対辺に対応する部分をレーザ加工してスリット１０を形成する。 Specifically, as shown in FIG. 4A, the laser processing of the opening pattern 3 is performed by a striped laser whose width is narrower than the width of the opening pattern 3 along each side of the opening pattern 3 to be formed. This is performed by irradiating the film 4 with light L. In this case, first, the center of the opening pattern 3 is moved while stepwise moving the stripe-shaped laser light L in the direction indicated by the arrow in parallel with the central axis of the row of the plurality of through-holes 1 arranged in a row. The slit 10 is formed by laser processing a portion corresponding to the opposite side parallel to the axis.
次いで、マスク用部材９を９０度回転して、図４（ｂ）に示すように、リブ５の幅よりも幅広のストライプ状のレーザ光Ｌをリブ５に沿って同図に矢印で示す方向にステップ移動しながらリブ５上に照射し、該リブ５の両側にはみ出したレーザ光Ｌの漏れ光によりフィルム４をレーザ加工する。これにより、開口パターン３に対応した部分のフィルム４が切り落とされて除去され、フィルム４に開口パターン３が形成される。 Next, the mask member 9 is rotated by 90 degrees, and as shown in FIG. 4B, the striped laser light L wider than the width of the rib 5 is directed along the rib 5 in the direction indicated by the arrow in FIG. The film 4 is laser-processed by the leakage light of the laser beam L that is irradiated onto the rib 5 while moving stepwise to the both sides of the rib 5. Thereby, the film 4 corresponding to the opening pattern 3 is cut off and removed, and the opening pattern 3 is formed on the film 4.
この場合、図５に拡大平面図で示すように、上記貫通孔１の四つの隅角部に、該貫通孔１の内側に向けて、上記リブ５の両側にはみ出したレーザ光Ｌのはみ出し量ｄよりも大きいはみ出し量のコーナカバー１１を設けておけば、図６（ａ）に示すようにレーザ光Ｌをリブ５上に照射しても、リブ５の両側にはみ出したレーザ光Ｌは、貫通孔１の隅角部においてはコーナカバー１１によって遮られてコーナカバー１１の下側のフィルム４を加工しない。また、図５に示すように、リブ５の長軸に沿った方向におけるコーナカバー１１の先端位置１１ａがリブ５に交差するレーザ光Ｌの照射位置１２内にあるときには、図６（ｂ）に示すように、開口パターン３の各辺に相当するフィルム４の部分がレーザ加工されて開口パターン３が形成される。 In this case, as shown in an enlarged plan view in FIG. 5, the amount of protrusion of the laser light L that protrudes on both sides of the rib 5 toward the inside of the through hole 1 at the four corners of the through hole 1. If the corner cover 11 having a protrusion amount larger than d is provided, even if the laser beam L is irradiated onto the rib 5 as shown in FIG. The corners of the through holes 1 are blocked by the corner cover 11 and the film 4 below the corner cover 11 is not processed. Further, as shown in FIG. 5, when the tip position 11 a of the corner cover 11 in the direction along the major axis of the rib 5 is within the irradiation position 12 of the laser beam L that intersects the rib 5, FIG. As shown, the film pattern 4 corresponding to each side of the aperture pattern 3 is laser processed to form the aperture pattern 3.
なお、上記コーナカバー１１がないときには、図７（ａ）に示すように、リブ５上に照射されリブ５の両側にはみ出したレーザ光Ｌによりフィルム４がレーザ加工され、同図（ｂ）に示すように貫通孔１の隅角部のフィルム４も除去されて切除部１３が形成される。 When the corner cover 11 is not provided, as shown in FIG. 7A, the film 4 is laser-processed by the laser light L irradiated onto the rib 5 and protruded on both sides of the rib 5, and FIG. As shown, the film 4 at the corners of the through hole 1 is also removed to form a cut portion 13.
ここで、本発明による蒸着マスクの製造方法において、開口パターン３のレーザ加工時間が短縮できることを、図８を参照して説明する。ここでは、説明を簡単にするために、例えば正方形の貫通孔１を５×５のマトリクス状に有するマスク用部材９に開口パターン３を形成する場合について述べる。また、使用するレーザ光Ｌは、短軸方向の幅が開口パターン３の幅の１／５であるストライプ状を成したものであるとする。 Here, it will be described with reference to FIG. 8 that the laser processing time of the opening pattern 3 can be shortened in the vapor deposition mask manufacturing method according to the present invention. Here, in order to simplify the description, for example, a case where the opening pattern 3 is formed in the mask member 9 having the square through holes 1 in a 5 × 5 matrix will be described. Further, it is assumed that the laser light L to be used has a stripe shape whose width in the minor axis direction is 1/5 of the width of the opening pattern 3.
本発明によれば、開口パターン３の面積と同じ照射面積を有するレーザ光Ｌを照射して１つの開口パターン３を形成するのに要する同じ時間内に、５つの開口パターン３の１辺分を同時に加工することができる。 According to the present invention, one side of the five opening patterns 3 is formed within the same time required to form one opening pattern 3 by irradiating the laser beam L having the same irradiation area as the area of the opening pattern 3. It can be processed at the same time.
したがって、本発明によれば、開口パターン３の図８に示す縦方向に平行な辺の加工回数は１０回となり、横方向に平行な辺の加工回数は、リブ５上に照射されるレーザ光Ｌにより加工されるため６回となる。それ故、全ての開口パターン３を形成するためには、１６回のレーザ加工を行うことになる。 Therefore, according to the present invention, the number of processing of the side parallel to the vertical direction shown in FIG. 8 of the opening pattern 3 is 10 times, and the number of processing of the side parallel to the horizontal direction is the laser beam irradiated on the rib 5. Since it is processed by L, it is 6 times. Therefore, in order to form all the opening patterns 3, the laser processing is performed 16 times.
一方、開口パターン３の面積と同じ照射面積を有するレーザ光Ｌにより開口パターン３を一つずつレーザ加工する場合には、全ての開口パターン３を形成するのに２５回のレーザ加工を行う必要がある。このように、照射光の幅を絞ったストライプ状のレーザ光Ｌにより開口パターン３の各辺をレーザ加工する本発明によれば、開口パターン３を一つずつ加工するやり方に比べてレーザ加工時間が短縮される。 On the other hand, in the case of laser processing the aperture patterns 3 one by one with the laser beam L having the same irradiation area as the aperture pattern 3, it is necessary to perform 25 times of laser processing to form all the aperture patterns 3. is there. As described above, according to the present invention in which each side of the opening pattern 3 is laser-processed by the striped laser light L with the narrowed irradiation light width, the laser processing time is compared with the method of processing the opening pattern 3 one by one. Is shortened.
実際には、開口パターン３の開口幅は約１００μｍであり、ストライプ状のレーザ光Ｌの線幅は約１０μｍである。したがって、約１０個分の開口パターン３の１辺が同時に加工される。この場合、大面積の基板用の蒸着マスクの製造においては、ストライプ状のレーザ光Ｌを、形成しようとする開口パターン３の各辺に沿ってステップ移動しながらレーザ加工することになる。 Actually, the opening width of the opening pattern 3 is about 100 μm, and the line width of the striped laser beam L is about 10 μm. Therefore, one side of about ten opening patterns 3 is processed simultaneously. In this case, in the manufacture of a vapor deposition mask for a large-area substrate, the laser processing is performed while the stripe-shaped laser beam L is moved stepwise along each side of the opening pattern 3 to be formed.
なお、以上の説明においては、開口パターン３のリブ５に平行な辺のレーザ加工をリブ５の幅よりも幅広のレーザ光Ｌをリブ５上に照射し、リブ５の両側にはみ出した漏れ光により行なう場合について述べたが、本発明はこれに限られず、リブ５上ではなくリブ５に平行な各辺を狙ってレーザ光Ｌを照射し、各辺を個別にレーザ加工してもよい。また、複数列配置された開口パターン３の列間の幅が開口パターン３の幅よりも狭いときには、開口パターン３の列間の磁性金属部材２上にレーザ光Ｌを照射し、該磁性金属部材２の両側にはみ出した漏れ光により開口パターン３の対応する辺をレーザ加工してもよい。 In the above description, the laser beam L of the side parallel to the rib 5 of the opening pattern 3 is irradiated on the rib 5 with the laser beam L wider than the width of the rib 5, and the leaked light that protrudes on both sides of the rib 5. However, the present invention is not limited to this, and the laser beam L may be irradiated on each side parallel to the rib 5 instead of on the rib 5, and each side may be laser processed individually. Further, when the width between the rows of the opening patterns 3 arranged in a plurality of rows is narrower than the width of the opening pattern 3, the magnetic metal member 2 between the rows of the opening pattern 3 is irradiated with the laser light L, and the magnetic metal member The corresponding sides of the opening pattern 3 may be laser-processed by leaking light that protrudes on both sides of 2.
１…貫通孔
２…磁性金属部材
３…開口パターン
４…フィルム
５…リブ
１１…コーナカバー
Ｌ…レーザ光
DESCRIPTION OF SYMBOLS 1 ... Through-hole 2 ... Magnetic metal member 3 ... Opening pattern 4 ... Film 5 ... Rib 11 ... Corner cover L ... Laser beam
Claims (4)
前記開口パターンのレーザ加工は、形成しようとする前記開口パターンの各辺に沿って該開口パターンよりも幅の狭いストライプ状のレーザ光を照射して行うことを特徴とする蒸着マスクの製造方法。 After forming a mask member in which a magnetic metal member provided with a plurality of through-holes having a shape dimension larger than that of the thin film pattern and a resin film are in close contact with a plurality of thin film patterns to be formed by vapor deposition , A method of manufacturing a vapor deposition mask in which the film portion in each through-hole is irradiated with laser light, and an opening pattern having the same shape and dimension as the thin film pattern is laser processed at a position corresponding to the thin film pattern,
The method of manufacturing a vapor deposition mask, wherein the laser processing of the opening pattern is performed by irradiating a striped laser beam having a narrower width than the opening pattern along each side of the opening pattern to be formed.
The four corners of each through-hole are provided with corner covers that protrude toward the inside of the through-hole and protrude beyond the both sides of the rib more than the protruding amount of the laser beam. The manufacturing method of the vapor deposition mask of Claim 3 to do.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10381602B2 (en) | 2015-10-12 | 2019-08-13 | Samsung Display Co., Ltd. | Deposition apparatus and method of manufacturing organic light-emitting diode display apparatus using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10381602B2 (en) | 2015-10-12 | 2019-08-13 | Samsung Display Co., Ltd. | Deposition apparatus and method of manufacturing organic light-emitting diode display apparatus using the same |
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