JP2014107292A - Chip interval maintenance device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To maintain the interval between chips, divided by expanding an expanded sheet stuck to a workpiece, reliably regardless of the type of the expanded sheet.SOLUTION: A wafer 1 mounted on a table 31 with an expanded sheet 11 interposed therebetween is divided into a plurality of chips 3A, by expanding the expanded sheet 11 with expansion means 30. Subsequently, expansion of the expanded sheet 11 is released, a raised portion 11b is formed by raising a surplus part of the expanded sheet 11, and then the interval between the chips 3A is maintained by crimping the raised portion 11b with crimp means 70. In such a device for maintaining the interval between chips 3A, both sides of the crimp means 70 in the expanded sheet 11 is pushed up by a support bar 80 disposed on an outer peripheral table 73 in crimping the raised portion 11b, so as to support the raised portion 11b thus forming and crimping the raised portion 11b reliably.

Description

  The present invention expands an interval between chips in a state in which a plate-like workpiece attached to the expanded sheet is divided into a plurality of chips by expanding the expanded sheet attached to the annular frame. The present invention relates to a chip interval maintaining device that maintains a state as it is.

  In the semiconductor device manufacturing process, a large number of rectangular areas are defined on the surface of a disk-shaped semiconductor wafer by grid-like division lines, electronic circuits such as IC and LSI are formed on the surface of these rectangular areas, and then the back surface After performing necessary processing such as polishing after grinding, the wafer is divided into individual rectangular regions along the planned division lines to obtain a large number of semiconductor chips. The semiconductor chip thus obtained has a film adhesive for die bonding called DAF (Die Attach Film) having a thickness of, for example, about several μm to 100 μm formed of an epoxy resin or the like on the back surface. The DAF is bonded to the die bonding frame that supports the semiconductor chip by heating through the DAF.

  On the other hand, as a method of dividing the plate-like workpiece such as the semiconductor wafer, in addition to cutting with a full cut along the planned division line of the workpiece, division with reduced strength along the planned division line There has also been adopted a method in which an external force is applied to a workpiece after the starting point is formed to cleave the workpiece. Examples of the division starting point include grooves formed by cutting with a cutting blade or irradiating a laser beam. In recent years, a method has been proposed in which a modified layer is formed by irradiating the inside of a workpiece with a transparent laser beam, and the workpiece is divided starting from this modified layer (patent). Reference 1).

  In the dividing method described in Patent Literature 1, an expanded sheet attached to an annular frame can be attached to a workpiece on which a division starting point is formed, and the workpiece can be supported via the annular frame. The expanded sheet is expanded to apply an external force to the workpiece and divide it into a large number of chips. The expanded sheet is expanded by moving the annular frame and the workpiece so as to be relatively spaced apart in a direction perpendicular to the surface of the workpiece, and a space is formed between the divided individual chips. It becomes a state.

  Here, if the expanded sheet in the annular frame remains expanded, the expanded sheet is slack, that is, an excess portion is generated, so that adjacent chips come into contact with each other during handling, and the chip is damaged such as chipped. May occur. Therefore, in the dividing method described in Patent Document 1, the surplus portion of the expanded sheet is substantially reduced by heating and contracting the region between the outer peripheral edge of the workpiece in the expanded sheet and the inner peripheral edge of the annular frame. The distance between the chips is maintained by removing them.

JP 2005-142365 A

  However, depending on the type of the expanded sheet, there is a case where the sheet does not contract sufficiently even when heated and the interval between chips cannot be maintained. If a sufficient space is not formed between the chips, the chips may come into contact with each other and be damaged during handling as described above.

  The present invention has been made in view of the above circumstances, and its main problem is to maintain a chip interval that can maintain an interval between chips formed by dividing a workpiece regardless of the type of the expanded sheet. To provide an apparatus.

  The chip interval maintaining apparatus of the present invention is a chip interval maintaining apparatus that maintains an expanded interval between a plurality of chips formed by dividing a workpiece attached to an expanded sheet and mounted on an annular frame. A table having a support surface for supporting the workpiece and supporting a plurality of chips formed by dividing the workpiece via an expanded sheet so as to be capable of sucking and holding, and an annular frame fixed on the outer periphery of the table A frame fixing means having a fixing surface, an expansion means for forming an interval between the plurality of chips by expanding the expanded sheet, and the expansion sheet is expanded by the expansion means so that the interval between the chips is increased. A plurality of formed chips are sucked and held by the table via the expanded sheet, and the expansion by the expansion means is released. A crimping means for sandwiching and crimping a raised portion in which an excess of the expanded sheet is raised between the outer periphery of the workpiece and the inner periphery of the annular frame, and the table includes the support surface at an outer peripheral edge. A plurality of support bars are provided at predetermined intervals in the circumferential direction so as to protrude upward and push up the expanded sheet on both sides of the pressure-bonding means.

  According to the present invention, the expansion sheet is expanded by the expansion means to divide the workpiece into chips, and then the expansion by the expansion means is released, so that between the outer periphery of the workpiece and the inner periphery of the annular frame. Since a raised portion is formed in which the excess portion of the expanded sheet is raised, the excess portion of the expanded sheet is substantially removed by sandwiching and pressing the raised portion with a pressure bonding means. Since the surplus raised portions are pressure-bonded, the surplus can be removed even in an expanded sheet that is difficult to shrink by heating, and the spacing between chips can be maintained.

  Also, when the bulging part of the expanded sheet is crimped by the crimping means, the bulging part is crushed or displaced from the position where the crimping means is crimped by pushing the expanded sheet up with the support bars on both sides of the crimping means to support the bulging part. This can reduce the risk of occurrence of poor crimping.

  According to the present invention, it is possible to provide a chip interval maintaining device that can maintain an interval between chips formed by dividing a workpiece regardless of the type of the expanded sheet.

1A is a perspective view and FIG. 2B is a cross-sectional view of a semiconductor wafer (workpiece) that is divided and maintained by a chip interval maintaining device according to an embodiment of the present invention. It is a perspective view of the chip | tip space | interval maintenance apparatus of one Embodiment. It is a side view of the chip | tip space | interval maintenance apparatus of one Embodiment. It is a top view of the table and outer periphery table which the chip | tip space | interval maintenance apparatus of one Embodiment comprises. (A) AA arrow sectional drawing of FIG. 4, (b) BB arrow sectional drawing of FIG. It is a top view of the support body in which the crimping | compression-bonding means and heating means of the chip | tip space | interval maintenance apparatus of one Embodiment were provided. It is a perspective view of the pressure bonding means which the chip | tip space | interval maintenance apparatus of one Embodiment comprises. It is a sectional side view showing the placement step of processing operation by the chip interval maintenance device of one embodiment. It is a sectional side view which shows the frame fixing step of the processing operation. It is a sectional side view which shows the division | segmentation step of the processing operation. It is a sectional side view which shows the protruding part formation step of the processing operation. It is a sectional side view which shows the crimping | compression-bonding step of the processing operation. It is a sectional side view which shows the hardening step of the processing operation. It is a sectional side view which shows the heating shrinkage | contraction step of the processing operation. It is a sectional side view which shows the support bar which the chip | tip space | interval maintenance apparatus of one Embodiment comprises. It is a side view which shows the effect | action of the support bar.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
Reference numeral 1 in FIG. 1 indicates a device wafer (workpiece) on which division processing is performed in one embodiment, and FIG. 2 performs division processing on the wafer 1 and maintains an interval between divided chips. The chip | tip space | interval maintenance apparatus 20 of one Embodiment is shown.

[1] Wafer A wafer 1 shown in FIG. 1 is a disk-shaped semiconductor wafer having a thickness of, for example, about several hundred μm. A plurality of rectangular areas 3 are set on the wafer 1 by grid-like division lines 2, and an electronic circuit made of, for example, IC or LSI is formed on the surface 1 a side of the rectangular areas 3.

  An expanded sheet 11 attached to the annular frame 10 is attached to the back surface 1b of the wafer 1, and the wafer 1 is in a state where the surface 1a side is exposed. The annular frame 10 is made of a metal plate having rigidity such as stainless steel, and the wafer 1 is handled via the annular frame 10 and the expanded sheet 11.

  The expanded sheet 11 is one in which an adhesive layer is formed on one side of a base material that has elasticity at room temperature and contracts when heated to a predetermined temperature (for example, about 70 ° C.) or higher. . Examples of the substrate include synthetic resin sheets such as polyvinyl chloride, polypropylene, polyethylene, and polyolefin. The wafer 1 and the annular frame 10 are attached to a single-sided adhesive layer. The wafer 1 is disposed concentrically with respect to the circular inner peripheral edge 10 a of the annular frame 10, and the annular region 11 a of the expanded sheet 11 is disposed between the outer peripheral edge 1 c of the wafer 1 and the inner peripheral edge 10 a of the annular frame 10. Is formed.

  As shown in FIG. 1B, a modified layer 4 is formed in advance inside the wafer 1 along the planned division line 2. The modified layer 4 is formed by irradiating the inside of the wafer 1 with a pulse laser beam having a predetermined wavelength having transparency with a converging point aligned. The modified layer 4 has a lower strength than other portions of the wafer 1 and serves as a starting point for division.

  In the present embodiment, the division starting point along the division line 2 of the wafer 1 is the modified layer 4, but the division starting point is not limited to the modified layer 4, and cutting with a cutting blade or irradiation with a laser beam is possible. The groove | channel etc. which were formed in this way may be sufficient.

  Next, the chip interval maintaining apparatus 20 shown in FIG. 2 and the process of dividing the wafer 1 using the chip interval maintaining apparatus 20 and maintaining the distance between chips will be described.

[2] Chip Spacing Maintaining Device (1) Configuration The chip spacing maintaining device 20 shown in FIG. 2 has a support surface 331 that is a circular horizontal upper surface, and a table 31 that sucks and holds the wafer 1 on the support surface 331. A frame fixing means 40 for fixing the annular frame 10 in the horizontal state on the outer periphery of the table 31; and expanding the expanded sheet 11 to apply an external force to the wafer 1 to divide the wafer 1 into each rectangular area 3; An expansion means 30 that is divided into a plurality of chips and forms an interval between the chips, a crimping means 70 that sandwiches and crimps a raised portion in which an excess of the expanded expanded sheet 11 is raised, and an outer peripheral edge of the table 31 And a plurality of support bars 80 that push up the expanded sheet 11 on both sides of the crimping means 70 to support the raised portion when the raised portion is crimped. .

  As shown in FIGS. 3 to 5, the table 31 has a disk-shaped heater 39 and a disk-shaped disk made of a porous material at the center of the upper surface of a disk-shaped frame body 32 made of a solid material such as stainless steel. The upper surface of the upper suction part 33 forms a support surface 331 for supporting the wafer 1. The support surface 331 has substantially the same diameter as the wafer 1, and the wafer 1 is placed concentrically on the support surface 331 via the expanded sheet 11. The support surface 331 of the suction part 33 and the upper surface of the frame 32 are configured to be flush with each other.

  At the bottom of the frame 32 and the center of the heater 39, a suction passage 321 that communicates with the suction portion 33 and opens to the lower surface is formed. As shown in FIG. 3, a suction source 34 including a vacuum pump that sucks air is connected to the opening of the suction passage 321 through a pipe 341. When the suction source 34 is operated, the inside of the suction unit 33 becomes negative pressure, and the wafer 1 placed on the suction unit 33 is sucked and held by the support surface 331 via the expand sheet 11.

  The table 31 is driven up and down by a table cylinder 35. The table cylinder 35 has a configuration in which a plurality of piston rods 352 extend upward from the cylinder body 351, and the table 31 is fixed to the upper end of the piston rod 352. As the piston rod 352 expands and contracts by the cylinder body 351, the table 31 moves up and down.

  An annular outer peripheral table 37 surrounding the table 31 is disposed around the table 31. The outer peripheral table 37 can be moved up and down separately from the table 31, and the inner peripheral surface of the outer peripheral table 37 and the outer peripheral surface of the frame body 32 of the table 31 slide so that the table 31 and the outer peripheral table 37 are separated. Relative movement is possible in the vertical direction.

  As shown in FIGS. 4 and 5, a plurality of recesses 371 that open to the upper surface and the outer peripheral surface are formed on the outer peripheral edge of the outer peripheral table 37 at equal intervals in the circumferential direction and close to each other. Yes. In these recesses 371, rollers 372 or support bars 80 are provided.

  As shown in FIG. 5A, the roller 372 is rotatably supported via a rotation shaft 373 extending in the tangential direction of the outer peripheral edge of the outer peripheral table 37. The rollers 372 are accommodated in the recesses 371 so that the outer peripheral surfaces thereof slightly protrude from the upper surface and the outer peripheral surface of the outer peripheral table 37.

  The support bar 80 has a thin bar shape and has an upper end formed in a hemispherical shape. As shown in FIG. The cylinder 81 is provided so as to expand and contract in the vertical direction. A cover 375 that covers the recess 371 is fixed to the recess 371 in which the support bar 80 is disposed. The cover 375 has a shape surrounding the support bar 80, and the upper surface thereof is set at the same height as the upper end of the roller 372, and the corner portion extending from the upper surface to the outer peripheral surface is formed in an R shape.

  In this embodiment, the plurality of rollers 372 and the support bar 80 are disposed in the recess 371 so that two rollers 372 are arranged between the support bars 80 as shown in FIG. A number is formed from which the state of the array is obtained.

  As described above, the outer peripheral table 37 in which the plurality of rollers 372 and the support bars 80 are evenly arranged in the circumferential direction on the outer peripheral edge is driven up and down by the plurality of outer peripheral table cylinders 38 shown in FIGS. The outer peripheral table cylinder 38 has a configuration in which a plurality of piston rods 382 extend upward from the cylinder body 381, and the outer peripheral table 37 is fixed to the upper end of the piston rod 382. As the piston rod 382 expands and contracts in synchronization with the cylinder body 381, the outer peripheral table 37 moves up and down. The outer peripheral table 37 is moved up and down synchronously mainly in a state where the upper surface coincides with the table 31. The table 31 and the outer peripheral table 37 constitute the expansion means 30.

  As shown in FIGS. 2 and 3, the frame fixing means 40 includes a pair of upper and lower horizontal pressing plates 41 and a mounting plate 45. In the center of the plates 41 and 45 formed in a square shape, circular openings 411 and 451 having a size through which the outer peripheral table 37 can pass are formed concentrically with each other. The diameters of these openings 411 and 451 are set to about the inner diameter of the annular frame 10.

  The holding plate 41 is in a fixed state. On the other hand, the mounting plate 45 is driven up and down by a mounting plate cylinder 46. The mounting plate cylinder 46 has a configuration in which a plurality of piston rods 462 extend upward from the cylinder body 461, and the mounting plate 45 is fixed to the upper end of the piston rod 462. As the piston rod 462 expands and contracts in synchronization with the cylinder body 461, the mounting plate 45 moves up and down. The cylinders 35, 38, and 46 are fluid pressure cylinders using air pressure or hydraulic pressure.

  The holding plate 41 and the mounting plate 45 have such a size that the annular frame 10 can be sandwiched between them, and the annular frame 10 is mounted on the fixed surface 452 on the upper surface of the mounting plate 45. When the mounting plate 45 is raised by the plate cylinder 46, the fixing surface 412 on the lower surface of the pressing plate 41 comes into contact with the upper surface of the annular frame 10, and the annular frame 10 is sandwiched and fixed by these plates 41 and 45. The

  As shown in FIG. 2, a disk-like support body 50 is rotatable above a fixed presser plate 41 via a rotary shaft 51 that extends in the vertical direction and is arranged coaxially with the table 31. And it is supported so that it can be raised and lowered. The rotary shaft 51 is rotationally driven and driven up and down by a rotary drive means and an elevator means (not shown), and a support body 50 is coaxially fixed to the lower end of the rotary shaft 51. The support 50 rotates and moves up and down with the rotating shaft 51.

  A plurality of the crimping means 70 are provided on the lower surface of the outer peripheral portion of the support 50. In this case, two crimping means 70 are provided, and are disposed at positions 180 ° apart from each other as shown in FIG. Further, as shown in FIG. 3, these crimping means 70 are disposed above the outer peripheral table 37 and inside the holding plate 41.

  As shown in FIG. 3 and FIG. 7, the crimping means 70 has a clamping part 73 including a first clamping part 71 on the outer peripheral side and a second clamping part 72 on the inner peripheral side. The first clamping part 71 and the second clamping part 72 are inclined downward by a first clamping part cylinder (moving means) 75 and a second clamping part cylinder (moving means) 76 fixed to the support 50, respectively. It is supported so that it can be extended and contracted, and can be separated from and connected to each other by its expansion and contraction operation. Each of the cylinders 75 and 76 is a fluid pressure cylinder using air pressure or hydraulic pressure.

  As shown in FIG. 7, the first clamping portion cylinder 75 has a configuration in which a plurality of piston rods 752 extend obliquely downward from the cylinder body 751, and the first clamping portion 71 is fixed to the lower end of the piston rod 752. ing. The second sandwiching portion cylinder 76 has the same configuration, and a plurality of piston rods 762 extend obliquely downward from the cylinder body 761, and the second sandwiching portion 72 is fixed to the lower end of the piston rod 762.

  The first clamping unit 71 and the second clamping unit 72 have rectangular opposing surfaces 711 and 721 that face each other, and are disposed so that the space between the opposing surfaces 711 and 721 is positioned above the outer peripheral table 37. ing. Each of the facing surfaces 711 and 721 extends in the tangential direction of the table 31 and the outer peripheral table 37, and among these facing surfaces, a plate-shaped crimping heater (heating) is formed at the lower end portion of the facing surface 711 of the first clamping portion 71. Means) 713 is attached, and a plate-like heat insulating material 723 is attached to the lower end portion of the facing surface 721 of the second sandwiching portion 72.

  The surface of the crimping heater 713 on the first clamping unit 71 side and the surface of the heat insulating material 723 on the second clamping unit 72 side constitute a first clamping surface 712 and a second clamping surface 722 that face each other in parallel. The first clamping part 71 and the second clamping part 72 have a contact position where the piston rods 752 and 762 of the cylinders 75 and 76 extend and the first clamping surface 712 and the second clamping surface 722 come into contact with each other. 752 and 762 degenerate and move to the retreat position where the retreat from the corresponding contact position.

  On the second clamping surface 722 of the heat insulating material 723 on the second clamping unit 72 side, a plurality of ejection ports 729 for ejecting the cooling fluid are formed at intervals in the longitudinal direction. A cooling fluid such as cooled air is ejected from the ejection port 729, and a pipe (not shown) that connects the ejection port 729 to a cooling fluid supply source is connected to the second clamping unit 72. ing.

  As shown in FIGS. 2 and 6, a shrinkage heater 60 that dissipates heat downward is disposed between the crimping means 70 on the lower surface of the lower surface outer peripheral portion of the support 50. The shrinking heater 60 is disposed on the same circumference as the crimping means 70 and at a position 90 ° away from the crimping means 70. Therefore, on the lower surface of the outer peripheral portion of the lower surface of the support body 50, the crimping means 70 and the shrinking heater 60 are positioned and fixed at positions separated by 90 ° in the circumferential angle.

(2) Operation The above is the configuration of the chip interval maintaining apparatus 20 according to the embodiment. Next, operations for dividing the wafer 1 by the apparatus 20 and maintaining the interval between the divided chips will be described in order.

(2-1) Placement Step First, as shown in FIG. 8, the table 31, the outer peripheral table 37, and the placement plate 45 are positioned at a height where the upper surfaces are substantially coincident with each other on the same horizontal plane. In the illustrated example, the outer peripheral table 37 is positioned slightly below the table 31 and the mounting plate 45 so that the upper ends of the rollers 372 are substantially at the same height as the upper surfaces of the table 31 and the mounting plate 45. This is not limited. Further, the support bar 80 is lowered to a position where it does not protrude upward from the cover 375 as shown in FIG.

  Then, the annular frame 10 is placed on the upper surface of the placement plate 45 with the surface on which the expanded sheet 11 is adhered facing down, and the wafer 1 is supported on the support surface 331 of the table 31 via the expanded sheet 11. Placed on.

(2-2) Ring Frame Fixing Step As shown in FIG. 9, the mounting plate 45 is raised and the ring frame 10 is sandwiched and fixed between the upper and lower plates 41 and 45.

(2-3) Dividing Step The heater 39 is operated to heat the expanded sheet 11 in contact with the support surface 331 via the suction part 33 to a predetermined temperature, and from this state, the table 31 and the outer periphery as shown in FIG. The table 37 is raised synchronously to push up the wafer 1. Thereby, the expand sheet 11 is expanded radially outward. The expanded sheet 11 is heated and thus has increased flexibility and is easily expanded. With the expansion of the expand sheet 11, an external force that is pulled outward in the radial direction is applied to the wafer 1, and the wafer 1 is cleaved along the scheduled division line 2 starting from the modified layer 4. That is, the wafer 1 is divided into each rectangular area 3 and divided into a plurality of chips 3A. A space is formed between the chips 3 </ b> A by expanding the expanded sheet 11.

  When the expanded sheet 11 is expanded, the annular region 11a expands outward while strongly abutting the outer peripheral edge portion of the outer peripheral table 37. Since the rollers 372 are disposed on the outer peripheral edge, the expanded sheet 11 is expanded. Following this, the roller 372 rolls, whereby the expanded sheet 11 is not damaged and is expanded smoothly. The expanded sheet 11 also contacts the corners of the cover 375 between the rollers 372 of the outer peripheral table 37. Since the corners are formed in an R shape, the expanded sheet 11 slides on the cover 375. Will not be damaged.

(2-4) Raised portion forming step When the wafer 1 is divided into a plurality of chips 3A, the operation of the heater 39 is stopped, and the suction source 34 is operated to bring each chip 3A together with the expand sheet 11 onto the support surface 331 of the table 31. Hold by suction. As a result, the chip 3A is fixed to the support surface 331 with the distance between the chips 3A being maintained. From this state, the table 31 and the outer peripheral table 37 are synchronously lowered to the height at the placement step.

  By this operation, the distance between the outer peripheral edge 1c of the wafer 1 divided into chips 3A and the inner peripheral edge 10a of the annular frame 10 is shortened, so that the expanded state of the annular region 11a of the expanded sheet 11 is released. Then, as shown in FIG. 11, the surplus portion is generated in the annular region 11a of the expand sheet 11, and the surplus portion rises upward and is formed in the raised portion 11b overlapping each other. The raised portion 11b is formed in an annular shape along the outer peripheral edge of the wafer 1 above the outer peripheral table 37, and the crimping means 70 is positioned above the raised portion 11b.

  When the raised portion 11b is formed, all the support bars 80 are subsequently extended. Then, as shown in FIGS. 15 and 16, the expanded sheet 11 is pushed up from the lower side by the support bar 80, and the support bar 80 is inserted from the lower side inside the overlapping portion of the expanded sheet 11 forming the raised portion 11 b. It becomes. Thereby, the raised part 11b is kept in the raised state. The raising of the support bar 80 may be performed simultaneously with the formation of the raised portion 11b, and in this case, the raised portion 11b is reliably projected upward.

(2-5) Crimping Step Preheating (for example, about 50 ° C.) of the crimping heater 713 on the first clamping part 71 side of each crimping means 70 is performed in advance, and the first clamping part 71 of each crimping means 70 and the first clamping part 71 The two clamping parts 72 are separated and the clamping part 73 is opened. Then, the support body 50 is rotated around the rotation shaft 51, and the two crimping means 70 are positioned between a pair of adjacent support bars 80, as viewed from above, and this state is maintained and rotated. By lowering the shaft 51, the crimping means 70 is lowered together with the support body 50, and the raised portion 11b is positioned between the first clamping portion 71 and the second clamping portion 72 as shown in FIG.

  An interval between a pair of adjacent support bars 80 is set so that the crimping means 70 can enter between the support bars 80, and the support bar 80 includes both of the two crimping means 70 supported by the support body 50. However, it is arrange | positioned in the position which can enter between a pair of adjacent support bars 80. FIG. Therefore, the expanded sheet 11 is pushed up by the support bar 80 on both sides of the lowered crimping means 70, and the raised portion 11 b enters between the first sandwiching portion 71 and the second sandwiching portion 72.

  Next, the crimping heater 713 is heated to a predetermined temperature (for example, about 130 to 140 ° C.), and as shown in FIG. 12, the first clamping unit 71 and the second clamping unit 72 are brought close to each other, and the clamping unit 73 is closed. The raised portion 11 b is sandwiched between the first clamping surface 712 and the second clamping surface 722, and the raised portion 11 b on which the expanded sheet 11 is superimposed is crimped while being heated by the crimping heater 713. In the crimping step, in order to prevent the heated expanded sheet 11 from being welded to the outer peripheral table 37, the operation of lowering the outer peripheral table 37 and separating it from the expanded sheet 11 is surely performed.

  Since the outer surface side of the raised portion 11b of the expanded sheet 11 is an adhesive layer, the first clamping surface 712 and the second clamping surface 722 are in contact with the adhesive layer. Therefore, it is preferable that the first clamping surface 712 and the second clamping surface 722 are not attached to the adhesive layer and can be easily peeled off. For this purpose, for example, the first clamping surface 712 and the second clamping surface 722 are coated so as to be easily peeled off from the adhesive layer (for example, Tafram coating, “Taphram” is a trademark), or fine irregularities are formed. Good.

(2-6) Curing Step After the crimping by heating is finished, the clamping unit 73 is opened as shown in FIG. 13, and then the cooled air is ejected from the ejection port 729 on the second clamping unit 72 side. The raised portion 11b is cooled and hardened. Thereby, the crimping | compression-bonding of the protruding part 11b by the crimping | compression-bonding means 70 is completed.

  The protruding portion 11b is crimped at two locations corresponding to the two crimping means 70 (two locations spaced apart by 180 ° in the circumferential direction angle), and when the crimping at that position is completed, the clamping portion 73 is opened and then the crimping means 70 is opened. Then, the support 50 is rotated at a predetermined angle and stopped at the crimping position between the support bars 80 to be crimped next. Subsequently, the crimping operation is repeated as described above, and a plurality of raised portions 11b of the expanded sheet 11 are Crimp the points. In this case, as shown in FIG. 4, the space between the support bars 80 is arranged at 10 locations, and the pressure bonding means 70 is two, so that the pressure bonding operation can be performed at most five times.

  When all of the pressure bonding step and the curing step are completed, the suction holding of the wafer 1 divided into chips 3A on the table 31 is released, and the mounting plate 45 is lowered to return to the mounting step state of FIG. Then, the wafer 1 can be unloaded by handling the annular frame 10. In the expanded expand sheet 11, by pressing the plurality of raised portions 11b formed in the annular region 11a, the tension inside the annular frame 10 is maintained, and thus the interval between the chips 3A is maintained, The chips 3A do not contact each other.

(3) Operational Effects According to the above embodiment, after dividing the wafer 1 into the plurality of chips 3A, the table 31 and the outer peripheral table 37 are lowered while the wafer 1 is sucked and held on the table 31. When the expansion is released, a raised portion 11b in which the excess portion of the expanded sheet 11 is raised in the annular region 11a between the outer peripheral edge 1c of the wafer 1 and the inner peripheral edge 10a of the annular frame 10 is formed. And the excess part is removed by crimping | bonding the several location of the protruding part 11b, and the tension | tensile_strength of the expand sheet 11 in the cyclic | annular flame | frame 10 is maintained. This makes it possible to maintain the spacing between the chips 3A. As a result, the chips 3A do not contact each other during handling, and the risk of damage to the chips 3A is reduced.

  Further, when the raised portion 11b of the expanded sheet 11 is crimped by the crimping means 70, the expanded sheet 11 is pushed up by the support bars 80 on both sides of the crimping means 70 to support the raised portion 11b. There is a reduced possibility that a bonding failure will occur due to the 70 being displaced from the position to be bonded, thereby further preventing damage to the chip 3A.

1 ... wafer (workpiece)
3A ... Chip 10 ... annular frame 11 ... expanded sheet 11b ... protruding portion 20 ... tip interval maintaining device 30 ... expansion means 31 ... table 331 ... support surface 40 ... frame fixing means 451, 452 ... fixing surface 70 ... crimping means 71 ... first 1st clamping part 712 ... 1st clamping surface 72 ... 2nd clamping part 722 ... 2nd clamping surface 725 ... spout 73 ... clamping part 75 ... cylinder for 1st clamping parts (moving means)
76 ... second clamping part cylinder (moving means)
80 ... Support bar

Claims (1)

A chip interval maintaining device that maintains an expanded interval between a plurality of chips formed by dividing a workpiece attached to an expandable sheet and attached to an annular frame,
A table having a support surface for supporting the workpiece, and supporting the plurality of chips formed by dividing the workpiece via the expanded sheet so as to be sucked and held;
Frame fixing means having a fixing surface for fixing the annular frame on the outer periphery of the table;
Expansion means for forming an interval between the plurality of chips by expanding the expand sheet;
The expanding sheet is expanded by the expanding means, and a plurality of the chips formed at intervals between the chips are sucked and held by the table via the expanding sheet, and the expansion by the expanding means is released to be processed. A crimping means for sandwiching and crimping a raised portion where an excess of the expanded sheet is raised between the outer periphery of the object and the inner periphery of the annular frame;
With
The table is provided with a plurality of support bars that protrude upward from the support surface at the outer peripheral edge, push up the expand sheet on both sides of the crimping means, and support the raised portions at predetermined intervals in the circumferential direction. A device for maintaining a gap between chips.

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