JP2014075537A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device formed by alternately arranging two or more semiconductor modules and cooling units via grease, and configured to have excellent assemblability between members, to effectively prevent drop of the grease, and to ensure long-term heat dissipation performance.SOLUTION: A semiconductor device 100 is formed by alternately arranging two or more semiconductor modules 10 and cooling units 20 having wide-width surfaces standing and facing each other, via heat-dissipating grease 30. When the wide-width surfaces 2a of the two facing semiconductor modules 10 are standing, protrusions 4B to be engaged with each other are provided in lower positions of the wide-width surfaces 2a, at least. Upper and lower protrusions of the adjacent semiconductor modules 10 are fixed to form a fixation part 6. On the fixation part 6, the cooling unit 20 is arranged via the grease 30.

Description

  The present invention relates to a semiconductor device in which two or more semiconductor modules and two or more coolers are alternately arranged.

  A semiconductor element such as an IGBT (Insulated Gate Bipolar Transistor) is housed in a sealing resin body to form a thin semiconductor module (also called a power card), and the left and right or upper and lower wide surfaces of the semiconductor module are respectively provided. A semiconductor device having a configuration that can be cooled by a unique cooler is generally used. Although there are a wide variety of semiconductor device configurations, a semiconductor device that is equipped with a power card and can cool both sides of the heat generation accompanying the narrowing of the mounting space of the semiconductor device and the increase in output is currently attracting attention. This is one of the semiconductor devices having the structure described above.

  Here, a conventional semiconductor device having the above configuration will be described with reference to FIG. 4A is a perspective view of a semiconductor module (power card), and FIG. 4B is a side view of a semiconductor device configured by alternately arranging two or more power cards and two or more coolers. .

  As shown in FIG. 4a, the semiconductor element S is sealed with a sealing resin body P to form a flat surface, and a terminal T connected to the semiconductor element S by a bonding wire (not shown) is projected. In general, a power card PC is configured. The wide surface W of the power card PC is erected in, for example, the vertical direction (Z direction), and in a posture in which two or more power cards PC are erected, it is also planar via the grease G between the two power card PCs. By disposing the cooler C having an area smaller than that of the power card PC, the semiconductor device D configured as shown in FIG. 4B is configured.

  In the semiconductor device D having such a configuration, the environment of the grease G deteriorates as the semiconductor device D is used, or when the semiconductor device D is mounted on a vehicle or the like, repeated vibration of the vehicle acts on the grease G. As shown by 4b, the grease G hangs down (X direction), the grease G between the power card PC and the cooler C decreases, and heat is dissipated from the power card PC to the cooler C via the grease G. There is concern about the deterioration of sex.

  Therefore, with respect to the semiconductor device having the configuration shown in the drawing, development of a semiconductor device having a configuration capable of preventing the grease from dripping with the service and preventing the heat dissipation of the semiconductor device from deteriorating has been urgently developed.

  Here, Patent Document 1 discloses a semiconductor module mounting structure in which one semiconductor module is sandwiched between two upper and lower heat absorbing members, and thermally conductive grease is interposed between the semiconductor module and the heat absorbing member. .

  Although many examples are shown in the mounting structure disclosed in Patent Document 1, each example has a configuration in which one semiconductor module is sandwiched between two upper and lower heat absorbing members, and leakage of grease is prevented. Since the structure to be prevented is formed by both the semiconductor module and the heat absorbing member, the structure becomes complicated and the assembly work is likely to increase. Further, when both the semiconductor module and the heat absorbing member have a multilayer structure of two or more (a form in which the horizontal multilayer structure shown in FIG. 4 is rotated by 90 degrees), the configuration disclosed in Patent Document 1 will be applied. Then, since both the semiconductor module and the heat absorbing member form a mutual positioning and grease leakage prevention structure, it takes much more time to assemble each member. Therefore, applying the mounting structure disclosed in Patent Document 1 to solve the above-described problem of the conventional semiconductor device shown in FIG. 4 does not lead to an effective solution.

JP 2012-4358 A

  The present invention has been made in view of the problems described above, and relates to a semiconductor device in which two or more semiconductor modules and a cooler are alternately arranged via grease, and has a good assembly property between members. An object of the present invention is to provide a semiconductor device in which dripping of grease is effectively suppressed and heat dissipation over a long period can be guaranteed.

  In order to achieve the above object, a semiconductor device according to the present invention has two or more semiconductor modules and a cooler facing each other in a posture in which their respective wide surfaces are erected, and are alternately arranged via heat-dissipating grease. In the semiconductor device, the area of the wide surface of the semiconductor module is larger than the area of the wide surface of the cooling body, and in a posture in which the wide surfaces of the two opposing semiconductor modules are erected, at least one of the wide surfaces The lower position and at least the lower position corresponding to the other wide surface are provided with protrusions that engage with each other, or at least one lower position is provided with protrusions, and the other has this protrusion. A groove that engages with the protrusion is provided, and at least the lower protrusions of the adjacent semiconductor modules are fixed to each other, or the protrusion and the concave protrusion at the lower position are fixed to form a fixing portion. Is In which the cooler through the grease onto the fixed portion is disposed.

  According to the semiconductor device of the present invention, in the case where two or more semiconductor modules each made of a power card having a wide surface and a cooler are provided with the respective wide surfaces standing and alternately arranged via grease, leakage of grease Preventive measures are provided on the wide surface of the opposing semiconductor module. Preventing grease from leaking while improving the workability and assembly of components by taking measures to prevent grease leakage only in the semiconductor module. It is possible to guarantee the sex.

  Since two or more semiconductor modules and coolers are alternately arranged, for example, two semiconductor modules are provided in a vertical direction with their respective wide surfaces standing vertically between two opposing semiconductor modules. An embodiment in which a single cooler is interposed in a gap between the semiconductor device in a posture in which grease is applied to the wide surface of the cooler or the like, and 10 semiconductor modules are vertically opposed to each wide surface. An embodiment in which a cooler interposes grease in a posture in which grease is applied to the wide surface of the cooler, etc., can be given in a total of nine gaps formed between two semiconductor modules.

  The wide surface of the cooler is set to be smaller than the wide surface of the semiconductor module, so that the cooler can be disposed between the protrusions or recesses provided at least below the wide surface of the semiconductor module. ing.

  Here, the “wide surface” means an opposing surface having the widest area in the form in which the semiconductor module or the cooler generally has a planar rectangular parallelepiped shape, and the other four surfaces have a width. Is narrow, and thus the area is relatively small. In addition to flat (thin) rectangular parallelepipeds (hexahedrons), semiconductor modules and coolers can be applied in various shapes such as other prisms, planar cylinders, and ellipsoids. It is.

  The two or more semiconductor modules and the cooler are arranged in the horizontal direction in a posture in which the respective wide surfaces are erected vertically, for example, and are assembled to each other. There is also a form in which the semiconductor device assembled in this manner is used in a posture in which the semiconductor device is rotated by 90 degrees, that is, in a state where the semiconductor module and the cooler are stacked in the vertical direction.

  A form in which ridges are provided at both corresponding positions under the two wide surfaces of the semiconductor module, a form in which ridges are provided at both the corresponding positions under the two wide surfaces as well as the corresponding positions above the two wide surfaces. There is a form in which a protrusion is provided at a position above one wide surface and a recess is provided at a position below. For example, on each of the opposing wide surfaces of two semiconductor modules sandwiching a cooler, protrusions protrude from the upper and lower sides of both wide surfaces, and both protrusions are simply abutted and fixed or engaged. Alternatively, a fixing portion is formed at least at a lower position by bonding, and a cooler is disposed together with grease on the fixing portion formed at least at the lower position. In this specification, “fixed” refers to a form in which the ridges are simply abutted, a form in which the ends of the ridges are engaged or a protrusion and a recess are engaged, and the protrusions are bonded to each other. Or a shape in which a protrusion on one wide surface is bonded to the other wide surface.

  A long ridge protrudes from a position below one of the opposing wide surfaces, and a concave ridge into which the tip of this ridge enters is provided at a corresponding lower position on the other wide surface. The form etc. in which a fixing | fixed part is formed by a concave line engaging may be sufficient. Further, in a form in which long ridges protrude from not only the position below one of the wide surfaces but also from the position above, the ridges in which the tips of these ridges enter the corresponding upper and lower positions of the other wide surface. Are provided, and the upper and lower fixed portions are formed by engaging both the protrusions and the recesses.

  Even in a semiconductor device having any type of fixing portion, grease can be prevented from dripping downward at least at the lower fixing portion, and heat dissipation of the semiconductor device can be ensured over a long period of time. it can.

  In addition to the form in which the fixed part exists only at the position below the wide surface, the form in which the fixed part exists at the upper and lower positions, and the fixed part on the left and right in addition to the upper and lower. For example, there can be mentioned a mode in which grease can be prevented from leaking not only from the lower side but also from the left and right at the rectangular frame-shaped fixing part.

  According to the semiconductor device of the present invention, since the protrusions and recesses constituting the fixing structure (and the grease leakage prevention structure) are provided only in the semiconductor module that sandwiches the grease and the cooler, the semiconductor module and cooling that are particularly assembled. When the cardinal number of the vessel is increased, the good assemblability (high production efficiency) becomes remarkable.

  As can be understood from the above description, according to the semiconductor device of the present invention, the fixing portion component (protrusion or recess) that prevents leakage of grease by fixing both to the semiconductor module sandwiching the grease or the cooler. ) (A configuration that is not provided in a cooler other than a semiconductor module) provides good assembly of the semiconductor module including the positioning of the cooler provided with grease between the semiconductor modules, and high leakage prevention of the grease. The semiconductor device is provided.

It is a perspective view of an embodiment of a semiconductor module constituting a semiconductor device of the present invention. It is a side view of an embodiment of a semiconductor device of the present invention. (A), (b) is the figure which showed other embodiment of the semiconductor module with the side view of the assembly | attachment attitude | position. (A) is a perspective view of embodiment of the semiconductor module which comprises the conventional semiconductor device, (b) is a side view of the conventional semiconductor device.

  Hereinafter, embodiments of a semiconductor device of the present invention will be described with reference to the drawings. The illustrated example is a form in which ridges or recesses are provided on the upper and lower sides of the wide surface of the semiconductor module made of a power card, but for example, it further includes left and right ridges continuous with the upper and lower ridges. The strips are assembled to form a frame-shaped fixing portion, and the grease and the cooler are completely closed by this frame-shaped fixing portion, or formed from protrusions and recesses only under the wide surface. Needless to say, the fixing portion may have a form other than the illustrated example, such as a form in which the fixing part exists.

(Embodiments of semiconductor module and semiconductor device)
FIG. 1 is a perspective view of an embodiment of a semiconductor module constituting the semiconductor device of the present invention, and FIG. 2 is a side view of the embodiment of the semiconductor device of the present invention.

  A semiconductor module 10 shown in FIG. 1 is also referred to as a power card. A planar semiconductor element 1 is sealed with a sealing resin body 2 formed into a flat rectangular parallelepiped, and terminals 3 communicating with the outside are connected to the sealing resin body 2. The terminal 3 and the semiconductor element 1 are connected by a bonding wire (not shown) or the like to constitute the whole.

  A power card is a device that is applied to a PCU (Power Control Unit) such as an HV vehicle. By adopting a structure that cools both sides as in the illustrated example, the temperature rise of the semiconductor device 100 is effectively suppressed. As a result, the power supply can be increased.

  Here, the semiconductor element 1 is configured by soldering an element such as an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Field Effect Transistor) to a substrate such as a copper lead frame. As described above, since the semiconductor module 10 is cooled on both sides, the dimensions (chip size) can be reduced, and the entire apparatus can be reduced in size.

  The sealing resin body 2 is molded from a resin material containing a heat-dissipating inorganic filler such as silica, alumina, boron nitride, silicon nitride, or silicon carbide in a matrix resin such as epoxy resin or polyimide.

  As shown in the figure, the flat rectangular parallelepiped semiconductor module 10 has two wide surfaces 2a facing each other, and has protrusions 4A and 4B extending in the horizontal direction at the upper and lower positions of the respective wide surfaces 2a. Yes.

  The two or more semiconductor modules 10 constituting the semiconductor device are used (for example, installed in a vehicle) with the wide surface 2a erected as shown in FIG.

  In the semiconductor device 100, as shown in FIG. 2, the upper protrusions 4A and 4A and the lower protrusions 4B and 4B are engaged with each other in a state where the plurality of semiconductor modules 10 have their wide surfaces 2a upright. The upper and lower fixing portions 5 and 6 are formed by being bonded or the like. In addition, although illustration is abbreviate | omitted, in the form which protrusions engage and form a fixing | fixed part, the form which the front-end | tip of a protrusion is exhibiting the step form so that engagement is mutually possible, the front-end | tip of one protrusion There are various forms of engagement between the protrusions, such as a protrusion having a protrusion, a groove at the tip of the other protrusion, and both being fitted.

  And in forming this fixing | fixed part 5 and 6, the cooler 20 by which the grease 30 and 30 were apply | coated etc. to the wide surface is arrange | positioned between the upper and lower protrusions 4A and 4B, and then the protrusions 4A and 4A, The semiconductor device 100 is manufactured by assembling the lower protrusions 4B and 4B to form the fixing portions 5 and 6.

  Here, the cooler 20 includes a heat sink and a device in which a cooling reflux channel such as a meandering channel is formed. In the latter form, in addition to water and ammonia, an ethylene glycol antifreeze is mixed. Thus, a fluorinated carbon-based refrigerant such as water or fluorinate, or a refrigerant such as methanol, alcohol, or acetone is circulated to cool the heat released from the semiconductor module 10.

  The wide surface (not shown) of the cooler 30 is smaller than the wide surface 2a of the semiconductor module 10, and is designed so that the cooler 30 can be disposed between the protrusions 4A and 4B provided above and below.

  The manufactured semiconductor device 100 is in a state in which the wide surface 2a of each semiconductor module 10 is erected as shown in FIG. 2 (in a state where it is erected in an oblique direction in addition to a state where it is erected in the vertical direction as in the illustrated example) For example, it is disposed at an appropriate position on the vehicle body.

  After the semiconductor device 100 is put into service, the grease 30 interposed between the semiconductor modules 10 and 10 may drop down due to environmental degradation or repeated vibrations received from the vehicle, thereby deteriorating the heat dissipation of the device. However, in the semiconductor device 100 shown in the figure, the fixing portion 6 formed by the protrusions 4B and 4B extending from the semiconductor modules 10 and 10 facing the lower side of the grease 30 is present. This is a grease leakage prevention measure, and since the heat radiation area when the heat from the semiconductor module 10 is radiated to the cooler 20 via the grease 30 is maintained, the heat radiation performance of the device over a long period can be guaranteed.

  Further, since the upper and lower fixing parts 5 and 6 are formed only by the protrusions 4A and 4B provided on the semiconductor module 10, that is, the fixing parts are not formed by both the semiconductor module and the cooler. The positioning of the semiconductor modules 10 and 10 is precise and easy when the fixing portion is formed, and the fixing operation itself is easy. This significantly appears in the effect of shortening the manufacturing time when the semiconductor device 100 is manufactured by assembling a large number of semiconductor modules 10 as in the illustrated example.

(Another embodiment of the semiconductor module)
3a and 3b are diagrams showing another embodiment of the semiconductor module in a side view of the assembly posture.

  A semiconductor module 10A shown in FIG. 3a has upper and lower concave stripes 7A and 7B on one wide surface 2a, and upper and lower protrusions 4A'4B 'that are longer than the semiconductor module 10 on the other wide surface 2a. I have it. As shown in the drawing, the upper and lower protrusions 4A'4B 'of the other semiconductor module 10A are fitted into the upper and lower recesses 7A and 7B of one semiconductor module 10A to form the upper and lower fixing portions 5A and 6A. , 6A are provided with a grease and a cooler (not shown).

  On the other hand, the semiconductor module 10B shown in FIG. 3b has an upper groove 7A and a lower protrusion 4B ″ on one wide surface 2a, and an upper protrusion 4A ′ and a lower groove on the other wide surface 2a. As shown in the figure, the protrusion 4A 'of the other semiconductor module 10B is fitted into the recess 7A of one semiconductor module 10B to form an upper fixing portion 5A, and the other semiconductor module 10B is formed. The protrusion 4B ″ of one semiconductor module 10B is fitted into the recess 7B to form the lower fixing portion 6B.

  Thus, in any form, leakage of grease downward is prevented by the lower fixing portions 6A and 6B, and the heat dissipation of the device over a long period can be ensured. In addition, as with the semiconductor module 10, the fixing portions 5A, 6A, and 6B can be easily formed.

  Further, although not shown, in the semiconductor device shown in FIGS. 1 and 2, the upper fixing portion 5 is eliminated, only the lower fixing portion 6 is provided, and grease 30 is applied on the lower fixing portion 6. In addition, the semiconductor device in which the cooler 20 is disposed may be used, and also in this form, it is possible to prevent the grease from leaking downward in the lower fixing portion.

  The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and there are design changes and the like without departing from the gist of the present invention. They are also included in the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor element, 2 ... Sealing resin body, 2a ... Wide surface, 3 ... Terminal, 4A, 4A ', 4B, 4B', 4B "... Projection, 7A, 7B ... Concave, 5, 5A, 6, 6A, 6B ... fixed part, 10, 10A, 10B ... semiconductor module, 20 ... cooler, 30 ... grease, 100 ... semiconductor device

Claims (2)

A semiconductor device in which two or more semiconductor modules and a cooler are opposed to each other in a posture in which each wide surface is erected, and are alternately arranged via heat-dissipating grease,
The area of the wide surface of the semiconductor module is larger than the area of the wide surface of the cooling body,
In a posture in which the wide surfaces of the two opposing semiconductor modules are erected, protrusions that engage with each other are provided at least at a position below one of the wide surfaces and at least a corresponding position on the other wide surface. Or, at least one of the positions below is provided with a protrusion, and the other is provided with a recess that engages with this protrusion,
At least the lower ridges of the adjacent semiconductor modules are fixed to each other, or the lower ridges and the concave ridges are fixed to form a fixed part, and cooling is performed on the fixed part via grease. A semiconductor device in which a container is disposed. The ridges or ridges are provided not only at the position below the wide surface but also at the upper position, and the ridges or ridges are also formed at the left and right positions of the wide surface so as to be continuous with the upper and lower ridges or grooves. Provided,
When semiconductor modules are assembled together, the ridges at the top and bottom positions, or the ridges and the recesses are fixed, and the ridges at the left and right positions, or the ridges and the recesses are fixed. The semiconductor device according to claim 1, wherein a fixing portion having a frame shape is formed, and the cooler and the grease are completely closed by the fixing portion.

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